CN103369862A - Continuous circuit boards and manufacturing method for continuous circuit boards - Google Patents
Continuous circuit boards and manufacturing method for continuous circuit boards Download PDFInfo
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- CN103369862A CN103369862A CN2012101010035A CN201210101003A CN103369862A CN 103369862 A CN103369862 A CN 103369862A CN 2012101010035 A CN2012101010035 A CN 2012101010035A CN 201210101003 A CN201210101003 A CN 201210101003A CN 103369862 A CN103369862 A CN 103369862A
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- circuit board
- board unit
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- waste area
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000002699 waste material Substances 0.000 claims abstract description 31
- 238000000034 method Methods 0.000 claims abstract description 15
- 238000012360 testing method Methods 0.000 claims abstract 5
- 230000003014 reinforcing effect Effects 0.000 claims abstract 4
- 230000002950 deficient Effects 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims 6
- 230000000295 complement effect Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 description 20
- 239000000047 product Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- -1 polyethylene naphthalenedicarboxylate Polymers 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
Abstract
本发明提供一种连片电路板的制作方法，包括：提供一第一连片电路板，其包括第一废料区及一电测不良的第一电路板单元；提供一第二连片电路板，其包括第二废料区及一电测良品的第二电路板单元，所述第二电路板单元与第一电路板单元形状相同；通过切割，在所述第一废料区上形成第一切口并通过所述第一切口移除所述第一电路板单元，在所述第二废料区上切除与所述第一切口匹配的切除部从而分离所述第二电路板单元，将所述切除部连同所述第二电路板单元设置于所述第一切口的上，并将一加强片粘结于所述切除部及所述切除部周围的第一废料区上，形成第三连片电路板。本发明还提供一种上述方法得到的连片电路板。
The present invention provides a manufacturing method of a connected circuit board, comprising: providing a first connected circuit board, which includes a first waste area and a first circuit board unit with a poor electrical test; providing a second connected circuit board , which includes a second waste area and a second circuit board unit of a good electrical test, the second circuit board unit has the same shape as the first circuit board unit; by cutting, a first cut is formed on the first waste area and remove the first circuit board unit through the first cut, cut a cutout matching the first cut on the second waste area to separate the second circuit board unit, The cutout part and the second circuit board unit are arranged on the first cutout, and a reinforcing sheet is bonded to the cutout part and the first waste area around the cutout part to form a second circuit board unit. Three-piece circuit board. The present invention also provides a continuous circuit board obtained by the above method.
Description
Technical field
The present invention relates to the circuit board making technology, relate in particular to the manufacture method of a kind of connecting sheet circuit board and connecting sheet circuit board.
Background technology
Usually, the manufacturing process of circuit board comprises: make a connecting sheet circuit board, described connecting sheet circuit board is for forming the circuit board of circuit, described connecting sheet circuit board comprises a plurality of circuit board units, garbage area and little bonding pad, circuit board unit namely after circuit board is finished one by one separately and the zone that has separately circuit function, garbage area namely needs the part removed behind the circuit board piece.Wherein, each described circuit board unit links to each other with garbage area by little bonding pad, and each described circuit board unit comprises at least one piece district, and this piece district is used for mounting part.In the piece district of each described circuit board unit print solder paste.Piece district in print solder paste mounts part.Be separated from each other by described little bonding pad being disconnected, make each the described circuit board unit that mounts behind the part, form the circuit board finished product.If in each described circuit board unit the electrical measurement defective products is arranged; then need to be on described defective products print solder paste and mount part; to save tin cream and part; but because of the position of defective products indefinite; need to cover according to the position of defective products on each connecting sheet circuit board opening with the diverse location of the steel plate of print solder paste; in addition; also needing position adjustment according to defective products on each connecting sheet circuit board to mount program when mounting part mounts; therefore aforesaid operations can greatly reduce print solder paste and mount the efficient of part; for improving printing and mounting efficient; usually can be on described defective products in the actual production also print solder paste and mount part, obviously, described defective products can not use after mounting part; therefore; caused the waste of tin cream and part, and the quantity of defective products is more, wastes larger.
Summary of the invention
In view of this, be necessary to provide a kind of and form a fairly large number of connecting sheet circuit board of non-defective unit and preparation method thereof by transplanting, the tin cream that is caused by defective products during with the minimizing piece and the waste of part.
A kind of manufacture method of connecting sheet circuit board, it may further comprise the steps:
First connecting sheet circuit board is provided, described the first connecting sheet circuit board comprises the first circuit board unit, tertiary circuit plate unit and first garbage area, described the first garbage area surrounds described first circuit board unit and tertiary circuit plate unit, border along described first circuit board unit in described the first connecting sheet circuit board is formed with a plurality of the first through holes, form first a little connection between adjacent described two the first through holes, described first circuit board unit links to each other with described the first garbage area by a plurality of described first little connections, described first circuit board unit is the electrical measurement defective products, and described tertiary circuit plate unit is the electrical measurement non-defective unit.Second connecting sheet circuit board is provided, described the second connecting sheet circuit board comprises second circuit board unit and second garbage area that surrounds described second circuit board unit, border along described second circuit board unit in described the second connecting sheet circuit board is formed with a plurality of the second through holes, form second a little connection between adjacent described two the second through holes, described second circuit board unit links to each other with described the second garbage area by a plurality of described second little connections, described second circuit board unit is the electrical measurement non-defective unit, and the shape of described second circuit board unit is identical with the shape of described first circuit board unit.In described the first garbage area corresponding each first littlely be connected to form first otch to form and corresponding interconnective the first cut portion of first little connection, two the first through holes that each described first otch is adjacent with first corresponding little connection are interconnected, thereby so that first circuit board unit, first little connection and the first cut portion separate from the first connecting sheet circuit board.In described the second garbage area corresponding each second littlely be connected to form second otch to form and corresponding interconnective the second cut portion of second little connection, two the second through holes that each described second otch is adjacent with second corresponding little connection are interconnected, thereby so that second circuit board unit, second little connection and the second cut portion are separated from the second connecting sheet circuit board, a plurality of the first otch that form in a plurality of second cut portions of formation and the first garbage area are Corresponding matching one by one.With a plurality of the second cut portion corresponding matching in a plurality of described the first otch, thereby the described second circuit board unit that will separate is arranged on the first connecting sheet circuit board that has separated behind the first circuit board unit.And a plurality of reinforced sheets identical with described a plurality of the second cut portion quantity are provided, and described a plurality of reinforced sheets are bonded in respectively described a plurality of the second cut portion and part first garbage area adjacent with the second cut portion, thus form the 3rd connecting sheet circuit board.
A kind of connecting sheet circuit board, it comprises a circuit board unit, a plurality of through holes, a plurality of little connections and a garbage area, described garbage area surrounds described circuit board unit, described a plurality of through hole is distributed between described circuit board unit and the described garbage area with being separated from each other, each little connection all is formed between two adjacent through holes, described a plurality of through hole with are connected little connection and jointly limit the shape of circuit board unit, corresponding each described little connection all is formed with an otch in described garbage area, two through holes that each described otch is adjacent with corresponding little connection are interconnected, each little connection is all extended a cut portion to the garbage area direction, the a plurality of cut portions that form are and shape complementarity corresponding with a plurality of otch that form respectively, described a plurality of cut portion and described a plurality of otch corresponding matching are together, each cut portion reaches on the part garbage area adjacent with described cut portion and is bonded with respectively a reinforced sheet, and this reinforced sheet is also bonding with described garbage area.
The manufacture method of the connecting sheet circuit board of the technical program has following advantage: be that the circuit board unit of non-defective unit is transplanted in one first connecting sheet circuit board with the electrical measurement in one second connecting sheet circuit board, make the non-defective unit circuit board unit quantity in described the first connecting sheet circuit board increase the tin cream that is caused by defective products in the time of to reduce piece and the waste of part; And described a plurality of the first otch is arranged on the garbage area, by the bonding reinforced sheet described the second cut portion and described the second cut portion described the second garbage area are on every side become one, can increase the adhesion of described the second cut portion and described the second garbage area, the circuit board unit of transplanting when preventing piece comes off.
Description of drawings
Fig. 1 is the floor map of the first connecting sheet circuit board of providing of the technical program embodiment.
Fig. 2 is the floor map of the second connecting sheet circuit board of providing of the technical program embodiment.
Fig. 3 is the floor map after the first connector among Fig. 1 removes.
Fig. 4 is the floor map after the second connector among Fig. 2 separates.
Fig. 5 is the floor map of the 3rd connecting sheet circuit board after the transplanting that provides of the technical program embodiment.
Fig. 6 is the schematic perspective view of the reinforced sheet that provides of the technical program embodiment.
Fig. 7 is the floor map of the 4th connecting sheet circuit board behind the bonding reinforced sheet that provides of the technical program embodiment.
The main element symbol description
| The first connecting |
10 |
| The first |
101 |
| The second |
102 |
| The |
103 |
| The |
104 |
| First |
105 |
| Second |
106 |
| The first through |
107 |
| The second through |
108 |
| The second connecting |
20 |
| Tertiary |
201 |
| The 4th |
202 |
| The |
203 |
| The |
204 |
| The 3rd |
205 |
| The 4th |
206 |
| Third through- |
207 |
| |
208 |
| The |
120 |
| The |
130 |
| |
131 |
| The second end | 132 |
| The first connector | 13 |
| The |
23 |
| The |
230 |
| The |
231 |
| The |
232 |
| The 3rd connecting sheet circuit board | 30 |
| Reinforced |
410 |
| |
411 |
| Adhesive- |
412 |
| The 4th connecting |
40 |
Following embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
Embodiment
The connecting sheet circuit board that the technical program is provided below in conjunction with drawings and Examples and the manufacture method of connecting sheet circuit board are described in further detail.
The manufacture method of described connecting sheet circuit board may further comprise the steps:
The first step provides first connecting sheet circuit board 10.
See also Fig. 1, Fig. 1 is the plane graph of described the first connecting sheet circuit board 10, described the first connecting sheet circuit board 10 profiles are rectangle, and it comprises a first circuit board unit 101, a second circuit board unit 102, first garbage area 103, second garbage area 104, four first little connections 105 and four second little connections 106.Described first circuit board unit 101 is square with described second circuit board unit 102 and its each limit all parallels with each limit of described the first connecting sheet circuit board 10, described first circuit board unit 101 and second circuit board unit 102 parallel arranged.Described first circuit board unit 101 is the electrical measurement non-defective unit, and described second circuit board unit 102 is the electrical measurement defective products.Described the first garbage area 103 surrounds described first circuit board unit 101, and described the second garbage area 104 surrounds described second circuit board unit 102, and described the first garbage area 103 and described the second garbage area 104 are square frame-shaped and it shares a strip limit 110.Four the first through holes 107 are arranged with the space between described first circuit board unit 101 and described the first garbage area 103, described four the first through holes 107 are all L-shaped, and center on described first circuit board unit 101 jointly to limit the shape of first circuit board unit 101, form first little connection 105 of a strip between two adjacent described the first through holes 107, described four interconnection that first little connection 105 is used between described first circuit board unit 101 and described the first garbage area 103.Four the second through holes 108 are arranged with the space between described second circuit board unit 102 and the second garbage area 104.Described four the second through holes 108 are all L-shaped, and center on described second circuit board unit 102 jointly to limit the shape of second circuit board unit 102.Form second little connection 106 of a strip between two adjacent described the second through holes 108, described four interconnection that second little connection 106 is used between described second circuit board unit 102 and described the second garbage area 104.In the present embodiment, described the first connecting sheet circuit board 10 is as the circuit board of accepting to transplant circuit board unit.
Wherein, described the first connecting sheet circuit board 10 also can be the single or multiple lift flexible circuit board, also can be individual layer, bilayer or multilayer hard circuit board.Need to prove, the quantity of circuit board unit is not limit on described the first connecting sheet circuit board 10.Only to comprise that two circuit board units give an example, in fact generally speaking the quantity of connecting sheet circuit board is more than two in the present embodiment.Only surround two circuit board units as example take two garbage areas in the present embodiment, in fact described two garbage areas also are connected, and also can be that a garbage area surrounds two circuit board units, and are continuous etc. by little connection between two circuit board units.As the circuit board of accepting to transplant circuit board unit, the number needs of electrical measurement defective products is no less than one on described the first connecting sheet circuit board 10, and electrical measurement non-defective unit quantity is quite a few in one.Preferably, the quantity of electrical measurement non-defective unit is transplanted number of times more than the quantity of electrical measurement defective products to reduce, and improves the efficient of transplanting.Described first circuit board unit 101 and second circuit board unit 102 also can be other shapes.The quantity of described little connection also can be other, as long as can will couple together between described circuit board unit and the garbage area.
Second step sees also Fig. 2, and second connecting sheet circuit board 20 is provided.The electrical connection situation that described the second connecting sheet circuit board 20 and described the first connecting sheet circuit board 10 record except electrical measurement was different, other was basic identical.
Described the second connecting sheet circuit board 20 comprises a tertiary circuit plate unit 201, one and the 4th circuit board unit 202, the 3rd garbage area 203 that surrounds described tertiary circuit plate unit 201, the 4th garbage area 204 that surrounds described the 4th circuit board unit 202, four L shaped third through-holes 207 between described tertiary circuit plate unit 201 and the 3rd garbage area 203, four L shaped fourth holes 208 between described the 4th circuit board unit 202 and the 4th garbage area 204, the 4th little connection 206 that forms between the 3rd little connection 205 that forms between adjacent two described third through-holes 207 and adjacent two the described fourth holes 208.The described the 3rd little connection 205 is connected described tertiary circuit plate unit 201 with described the 3rd garbage area 203, the described the 4th little connection 206 is connected described the 4th circuit board unit 202 with described the 4th garbage area 204, wherein, described tertiary circuit plate unit 201 is the electrical measurement defective products, and described the 4th circuit board unit 202 is the electrical measurement non-defective unit.In the present embodiment, described the second connecting sheet circuit board 20 is as the circuit board that the non-defective unit circuit board unit is provided.The shape of the 4th circuit board unit 202 is identical with the shape of second circuit board unit 102, the shape of a plurality of the 4th little connection 206 is corresponding identical with the shape of a plurality of second little connection 106, and the position of a plurality of the 4th little connection 206 is corresponding one by one with the position of a plurality of second little connection 106.
Wherein, the quantity of circuit board unit also can be for more than two on described the second connecting sheet circuit board 20, circuit board as the circuit board unit that non-defective unit is provided, electrical measurement non-defective unit quantity is no less than one on described the second connecting sheet circuit board 20, preferably, the quantity of electrical measurement defective products is more than the quantity of electrical measurement non-defective unit, makes it that necessity as the circuit board of the circuit board unit that non-defective unit is provided be arranged.Certainly, described the second connecting sheet circuit board 20 also can be different from described the first connecting sheet circuit board 10, have at least one circuit board unit identical with second circuit board unit 102 to get final product.
The 3rd step saw also Fig. 3, and described second circuit board unit 102 is separated from described the first connecting sheet circuit board 10.
Form the first otch 120 of a T font in each the second little connection 106 of described the second garbage area 104 interior correspondences, to form the first cut portion 130 with second corresponding little connection 106 interconnective T fonts.Each first cut portion 130 comprises relative first end 131 and the second end 132.First end 131 interconnects with corresponding second little connection 106, the distance D that defines between adjacent two described the second through holes 108 is the width of second little connection 106, the width of first end 131 equates with second little width of 106 of being connected, and the width of the second end 132 is greater than the width of first end 131.Two the second through holes 108 that each described first otch 120 is adjacent with the corresponding second little connection 106 are interconnected, so that the first cut portion 130 and the second garbage area 104 are separated from each other.Described four the first cut portions 130 are joined with corresponding described four second little connections 106, thereby make four described the first cut portions 130 form one first connector 13 with corresponding four second little connections 106 and described second circuit board unit 102, will described the first connector 13 from 10 separation of described the first connecting sheet circuit board.
Wherein, the mode of cutting can be laser cutting, milling cutter cutting and stamp cutting etc.The shape of described the first cut portion 130 also can be other shapes, preferably on the bearing of trend of described second little connection 106, described the first cut portion 130 and described second little size of 106 first ends 131 that link to each other that is connected are less than the size of described the first cut portion 130 away from the second end 132 of described second little connection 106, such as T font body, L shaped body, platform shape body, rosette, drops body etc.The shape complementarity of the shape of described the first otch 120 and described the first cut portion 130, the shape of corresponding described the first otch 120 also can be other shapes.
The 4th step saw also Fig. 4, and is identical with the 3rd method that goes on foot, and described the 4th circuit board unit 202 is separated from described the second connecting sheet circuit board 20.
Identical with the method in the 3rd step, same position from described the second connecting sheet circuit board 20 is partitioned into one second connector 23, described the second connector 23 comprises the second cut portion 230 of four T fonts, four the 4th little connections 206 and described the 4th circuit board unit 202, thereby described the 4th circuit board unit 202 is separated.Each second cut portion 230 is identical with the shape of corresponding the first cut portion 130, and each second cut portion 230 also comprises the 3rd relative end 231 and the 4th end 232, and described the 3rd end 231 littlely is connected 206 and is connected with the described the 4th.
Be appreciated that, if described the second connecting sheet circuit board 20 is incomplete same with described the first connecting sheet circuit board 10, but as long as the second connecting sheet circuit board 20 has at least one circuit board unit identical with second circuit board unit 102, then also can separate according to the method for the step 3 circuit board unit identical with second circuit board unit 102 with the second connecting sheet circuit board 20.
The 5th step saw also Fig. 5, by gluing mode described the first connector 13 was bonded on described the first connecting sheet circuit board 10, formed the 3rd connecting sheet circuit board 30 of the full non-defective unit after transplanting.
At first, all glue coatings will have been separated on the tangent plane of four the first otch 120 of described the first connecting sheet circuit board 10 of described the first connector 13; Then, to place from described the second connector 23 that described the second connecting sheet circuit board 20 is separated on described the first connecting sheet circuit board 10, described four the second cut portion 230 correspondences are placed in described four the first otch 120, and its tangent plane is all fitted fully, thereby the second connector 23 that includes described the 4th circuit board unit 202 is bonded on described the first connecting sheet circuit board 10; At last, solidify described glue, obtain comprising the 3rd connecting sheet circuit board 30 of first circuit board unit 101 and the 4th circuit board unit 202, described first circuit board unit 101 and the 4th circuit board unit 202 are the electrical measurement non-defective unit.Also namely, described the 4th circuit board unit 202 has been transplanted to the position of the second circuit board unit 102 in the first connecting sheet circuit board 10, forms the 3rd connecting sheet circuit board 30.
Wherein, the T font design of described four the first otch 120 and described four the second cut portions 230 can make described four the second cut portions 230 be sticked in respectively in described four the first otch 120, can be mutually spacing, therefore can better be fixed together, and described four the second cut portions 230 are excised on described the 4th garbage area 204.Excise in the less little connection of size compared to of the prior art, it is larger that the area of section can be done, can further improve mutual bond strength, certainly, as long as with described second little Breadth Maximum of 106 described the first cut portions 130 that connect that is connected greater than the width of described second little connection 106, then all can play described four the first otch 120 interior effects of better fixing that are sticked in.
Be appreciated that, if tertiary circuit plate unit 201 is non-defective units, and described the 4th circuit board unit 202 is defective productss, also tertiary circuit plate unit 201 can be transplanted to the position of described second circuit board unit 102, if with the tangent plane of otch and off-position with remove described second circuit board unit 102 after the first connecting sheet circuit board 10 in tangent plane and the off-position of the first otch 120 corresponding.
In addition, described glue also can be coated on the tangent plane of described the second cut portion 230.Described glue also can change and do solid-state pressure-sensing glue etc.In addition, if described the first connecting sheet circuit board 10 comprises the circuit board unit that plural electrical measurement is bad, it is good circuit board unit that described the second connecting sheet circuit board 20 only has an electrical measurement, then can transplant the circuit board unit of several non-defective units to described the first connecting sheet circuit board 10 from other several connecting sheet circuit boards again according to said method.
The 6th step saw also Fig. 6, and four reinforced sheets 410 are provided, and the size of described reinforced sheet 410 is greater than the size of described the second cut portion 230.
Reinforced sheet described in the present embodiment 410 is rectangular body, the size of described reinforced sheet 410 is greater than the size of described the second cut portion 230, define described the second cut portion 230 and the described the 4th little to be connected 206 ends that link to each other to described the 4th garbage area 204 outermost distance H be the width of described the 4th garbage area 204, the width of described reinforced sheet 410 is less than the width of described the 4th garbage area 204.Described reinforced sheet 410 comprises a substrate layer 411 and is located at respectively an adhesive-layer 412 on substrate layer 411 surfaces.The plastics of the preferred moisture absorption of described substrate layer 411 materials, thermal endurance, dimensional stability and chemical stability excellence are such as polyimides, polyethylene naphthalenedicarboxylate, PETG or this area other resin commonly used.Described adhesive-layer 412 can be made by thermoplastic adhesive or ultraviolet photo-curing cementing agent.Preferably, the thickness of substrate layer 411 is between 8 microns to 100 microns, and the thickness of adhesive-layer 412 is between 8 microns to 50 microns.
Certainly, reinforced sheet 410 is not limited to said structure, and for example it can be by mutual alternately laminated the forming of an adhesive-layer and a substrate layer, but its at least one skin is adhesive-layer.Store for blocks dust enters adhesive-layer and is convenient to, reinforced sheet 410 can further comprise the protective layer that adheres to described adhesive-layer 412 surfaces.In addition, reinforced sheet 410 also can only comprise a substrate layer 411, uses glue etc. and thing bonding to be bonded in follow-up technique.Described reinforced sheet 410 can also be other shapes, described reinforced sheet 410 also only the size on some directions or a plurality of direction greater than the size of described the second cut portion 230.
The 7th step, see also Fig. 7, described four reinforced sheets 410 are placed respectively on described the 3rd connecting sheet circuit board 30, and make described four reinforced sheets 410 cover respectively described four the second cut portions 230 and described four the second cut portions 230 described the second garbage area 104 on every side, described adhesive-layer is solidified in pressing is bonded on described four the second cut portions 230 and described four the second cut portions 230 described the second garbage area 104 on every side described four reinforced sheets 410, forms one the 4th connecting sheet circuit board 40.
Because of described reinforced sheet 410 bonding with described the second garbage area 104 around described the second cut portion 230 and described the second cut portion 230 simultaneously, described reinforced sheet 410 and described the second cut portion 230 and described the second cut portion 230 described the second garbage area 104 are on every side become one, therefore can better make described the second cut portion 230 and described the second garbage area 104 bondings.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection range that all should belong to claim of the present invention with distortion.
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101010035A CN103369862A (en) | 2012-04-09 | 2012-04-09 | Continuous circuit boards and manufacturing method for continuous circuit boards |
| TW101113265A TW201343030A (en) | 2012-04-09 | 2012-04-13 | Printed circuit board assembly and method for making the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101010035A CN103369862A (en) | 2012-04-09 | 2012-04-09 | Continuous circuit boards and manufacturing method for continuous circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103369862A true CN103369862A (en) | 2013-10-23 |
Family
ID=49370081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101010035A Pending CN103369862A (en) | 2012-04-09 | 2012-04-09 | Continuous circuit boards and manufacturing method for continuous circuit boards |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103369862A (en) |
| TW (1) | TW201343030A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897334A (en) * | 1996-10-19 | 1999-04-27 | Anam Semiconductor, Inc. | Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards |
| JP2002232089A (en) * | 2001-01-30 | 2002-08-16 | Ibiden Denshi Kogyo Kk | Multi-piece substrate and manufacturing method thereof |
| TW513902B (en) * | 2001-07-12 | 2002-12-11 | Unitech Printed Circuit Board | Defective unit piece removal and filling method for various printed circuit boards |
| TW200520641A (en) * | 2003-12-02 | 2005-06-16 | jin-quan Lai | Method for replacing inter-connected defective printed circuit boards |
| US20070087630A1 (en) * | 2005-10-18 | 2007-04-19 | Shing-San Ku | Board placement method and system for defective printed circuit board panel having multiple interconnected printed circuit board units |
-
2012
- 2012-04-09 CN CN2012101010035A patent/CN103369862A/en active Pending
- 2012-04-13 TW TW101113265A patent/TW201343030A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897334A (en) * | 1996-10-19 | 1999-04-27 | Anam Semiconductor, Inc. | Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards |
| JP2002232089A (en) * | 2001-01-30 | 2002-08-16 | Ibiden Denshi Kogyo Kk | Multi-piece substrate and manufacturing method thereof |
| TW513902B (en) * | 2001-07-12 | 2002-12-11 | Unitech Printed Circuit Board | Defective unit piece removal and filling method for various printed circuit boards |
| TW200520641A (en) * | 2003-12-02 | 2005-06-16 | jin-quan Lai | Method for replacing inter-connected defective printed circuit boards |
| US20070087630A1 (en) * | 2005-10-18 | 2007-04-19 | Shing-San Ku | Board placement method and system for defective printed circuit board panel having multiple interconnected printed circuit board units |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201343030A (en) | 2013-10-16 |
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Application publication date: 20131023 |