CN103361610A - Evaporating source and vacuum evaporation device employing the same - Google Patents

Abstract

The invention provides an evaporating source and vacuum evaporation device not only allowing evaporation material to enter the evaporating source, but also can prevent degradation of film quality, can obstacles cannot be generated to continuous operation and maintenance. The evaporating source and vacuum evaporation device comprises a crucible with a nozzle used for discharging evaporation material evaporated by heating up the sealed evaporation material, a heating member for heating the crucible, and heat isolation members configured around the crucible and the heating member. A floating evaporation object recycling member with low temperature kept by the heating member is arranged between the heat isolation member and the crucible or the heating member, and heat isolation members are arranged between the floating evaporation object recycling member and the crucible and the heating member.

Description

Evaporation source and vacuum evaporation device using it

technical field

The present invention relates to a vacuum vapor deposition device for heating a vapor deposition material under vacuum to generate vapor deposition particles to form a film of the vapor deposition material on a substrate.

Background technique

A general organic electroluminescence element (hereinafter referred to as an organic EL element) will be briefly described.

An organic EL element forms an anode, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode in this order on a substrate, and emits light by flowing an electric current between the anode and the cathode.

In particular, from the hole transport layer to the electron injection layer, an organic compound or an inorganic compound is formed by vacuum deposition or printing or coating, and a laminated structure is formed on the anode. Furthermore, a metal film of magnesium, silver, aluminum, or the like is formed on the laminated structure by vacuum deposition or sputtering, and a cathode is provided. In this way, an organic EL element is formed.

An example of a general vacuum deposition method will be described using FIG. 2 .

In FIG. 2 , a vacuum evaporation device 1 includes a vacuum chamber 2 , a vacuum pump 3 , and an evaporation source 4 . The vacuum chamber 2 is an airtight container, and the evaporation source 4 and the substrate 5 to be evaporated are disposed therein. In addition, since the inside of the vacuum chamber 2 needs to maintain a vacuum degree of 10 ⁻³ to 10 ⁻⁶ Pa during film formation on the substrate 5 , it is evacuated by a vacuum pump 3 . The vapor deposition material is heated and vaporized in the vaporization source 4, and sprayed onto the substrate 5 to form a film. At this time, the substrate 5 is rotated or either the substrate 5 or the evaporation source 4 is moved to form a film in order to cope with the enlargement of the substrate 5 .

An example of a general evaporation source structure will be briefly described. A crucible in which an evaporation material is sealed is heated by a heater. Accordingly, the vapor deposition material is vaporized, and the gas of the vapor deposition material is discharged upward toward the substrate from the opening provided in the lid of the crucible.

The above-mentioned crucible is composed of a crucible main body, an upper cover and a middle cover. The main body of the crucible is supported by a structure, and is radiated and heated by a heater as a heating member to evaporate the evaporation material.

Accordingly, a film is formed on the substrate disposed above the crucible. To control the output of the heater, the bottom temperature of the crucible was measured by a thermocouple. Furthermore, a reflector is provided on the outer peripheral portion of the heater to concentrate the radiant heat from the heater in the crucible.

prior art literature

patent documents

Patent Document 1: Japanese Patent Laid-Open No. 2008-24998

In the conventional art described above, most of the vapor of the vapor deposition material discharged from the nozzle of the crucible moves toward the substrate. However, particles of vapor entering toward the inside of the evaporation source or particles of vapor leaking from the gap between the crucible main body and the upper cover are generated therein.

Particles of the vapor deposition material vapor entering the inside of the evaporation source concentrate on the low-temperature parts inside the evaporation source relative to the components connected to the outside of the reflector, such as structural components, heater terminals, and thermocouples, condense and Precipitate.

When the vapor deposition material of the organic compound is deposited, it is decomposed by being heated by the heater for a long time during the organic vapor deposition, and impurities that affect the film quality are generated. In addition, in the case of a vapor deposition material of an inorganic compound, parts to which the vapor deposition material adhered may stick together, and each part may not be disassembled at the time of maintenance. In particular, if a metal material is used as the vapor deposition material, there is a possibility that a short circuit may occur between terminals of the heater or the like. These problems have not been solved in conventional evaporation sources.

In contrast, the evaporation source disclosed in Patent Document 1 does not disclose a solution to the above-described problem of deposition of the evaporation material inside the evaporation source.

Contents of the invention

It is an object of the present invention to provide an evaporation source and a vacuum evaporation device that prevent deterioration of film quality even if an evaporation material enters the evaporation source, and does not hinder continuous operation and maintenance.

In order to achieve the above object, the present invention is an evaporation source, which consists of a crucible with a nozzle, a heating member for heating the crucible, and a heat insulating member (the first insulation member) arranged around the crucible and the heating member. thermal member), and the above-mentioned nozzle is used to discharge the vapor deposition material that is evaporated by heating the enclosed vapor deposition material, wherein, between the above-mentioned heat insulating member and the crucible or the heating member, a A floating vapor deposition recovery member is provided, and a heat insulating member (second heat insulating member) is provided between the floating vapor deposition recovery member, the crucible, and the heating member.

The heating member may be provided integrally with the crucible or provided inside the crucible.

The heating means may be a heating means that generates heat using resistance heating.

The heating means may be arranged outside the crucible, and any one of resistance heating, induction heating, and infrared heating may be used.

The said 1st heat insulation member may be a shape which covers at least the surface of the said floating vapor deposition recovery member which opposes the said crucible and a heating member.

Moreover, in order to achieve the said objective, in this invention, it is preferable that the said 1st heat insulation member is single or the structure which laminated|stacked a plurality of boards.

In addition, in order to achieve the above object, in the present invention, it is also preferable to use a plate made of any one or more of carbon, metal, and ceramics as the first heat insulating member.

Moreover, in order to achieve the said objective, in this invention, it is preferable that the said 2nd heat insulating member is single or the structure which laminated|stacked the several plates.

In addition, in order to achieve the above object, in the present invention, it is also preferable that the second heat insulating member is a plate made of any one or more of carbon, metal, and ceramics.

In addition, in order to achieve the above object, in the present invention, it is preferable to provide a detachable cover around the above-mentioned floating vapor deposition recovery member, and the cover is cooled by at least partial contact with the cooling member.

In addition, in order to achieve the above-mentioned object, in the present invention, it is also preferable to install the above-mentioned floating vapor deposition recovery member on a surface other than the surface of the above-mentioned crucible having the nozzle.

In addition, in order to achieve the above object, in the present invention, it is also preferable that the floating vapor deposition recovery device is cooled by a circulating cooling medium.

In addition, in order to achieve the above object, in the present invention, it is preferable that the cooling medium circulates through the wall itself of the casing, and the casing and the floating vapor deposition recovery member are in thermal contact.

Moreover, the structure of this invention for achieving the said object is the vacuum evaporation apparatus which used any one of the said evaporation sources.

According to the present invention, it is possible to provide a vacuum evaporation device and an evaporation source that prevent deterioration of film quality even if an evaporation material enters the inside of the evaporation source, and do not hinder continuous operation and maintenance.

Description of drawings

FIG. 1 is a schematic diagram of a basic structure of a vacuum evaporation apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a general vacuum evaporation-based film formation device.

Fig. 3 is a schematic configuration diagram of a vacuum evaporation device according to an embodiment of the present invention.

Fig. 4 is a schematic configuration diagram of an organic EL device manufacturing apparatus according to an embodiment of the present invention.

Fig. 5 is a diagram showing a cooling member of an evaporation source according to another embodiment of the present invention.

Fig. 6 is a diagram showing a cooling member of an evaporation source according to another embodiment of the present invention.

Symbol Description

1: Vacuum evaporation device; 2: Chamber; 3: Vacuum pump; 4: Evaporation source; 5: Substrate; 6: Gate valve; 7: Vacuum transfer chamber; 8: Substrate stocker chamber; 9: Vacuum transfer robot; 10: Substrate; 11: evaporation source; 12: mask; 13: substrate holding part; 14: gate valve; 16: vacuum evaporation chamber; 21: evaporation material; 22: crucible; 25: thermocouple; 24: reflector; 26 : rate sensor; 27: casing; 28: cooling block; 34: nozzle; 43: heat insulation member; 44: heating member (heater 23); 45: cooling member (floating vapor deposition recovery member); 46: 50: terminal; 51: water cooling pipe; 52: cooling liquid; 52a: cooling liquid flow hole; 52b: U-shaped turning part; 100: organic EL device manufacturing device.

Detailed ways

Next, an embodiment of the present invention will be described based on the drawings.

Example 1

The best mode for carrying out the present invention will be described with reference to the drawings.

FIG. 1 is a schematic diagram of a basic structure of a vacuum evaporation apparatus according to an embodiment of the present invention. Using FIG. 1, the outline|summary of the vacuum evaporation apparatus concerning the Example of this invention is demonstrated.

In FIG. 1 , a vacuum evaporation apparatus 1 has a chamber 2 as a vacuum container, and an evaporation source 4 for discharging vapor of an evaporation material 21 and a substrate 5 as an object to be evaporated are disposed therein. In order to achieve a vacuum higher than 10 ^-3 Pa inside the chamber 2 during vapor deposition, the vacuum pump 3 connected to the chamber 2 is always evacuated. Here, the substrate 5 is not only a member constituting the vacuum vapor deposition device 1 but also a member formed by the vacuum vapor deposition device 1 .

After starting the decompression, the crucible 22 is heated by the heating member 44 of the evaporation source 4 . By this heating, vapor deposition material 21 is evaporated or sublimated, vapor of vapor deposition material 21 is generated, and a film is formed on substrate 5 . As the substrate 5 used here, a flat plate of any of glass, ceramics, metal, and organic matter is used. For example, when forming an organic EL element, an anode is formed in advance on the vapor deposition surface of the substrate 5 .

The following materials are used for each layer of the organic EL element. The anode is preferably a conductive compound of a metal or an alloy having a high hole injection capability and a large work function, such as ITO, gold, copper iodide, and tin oxide.

As the hole injection layer, for example, CuPc and m-MTDATA are used. As the hole transport layer, for example, α-NPD, TPD, and PDA are used. As the light-emitting layer, for example, rubrene, CBP, CDBP, and Alq3 are used as host materials, and coumarin 6, Ir(ppy)3, FIrpic, and the like are used as dopant materials. As the electron transport layer, for example, Alq3, PBD, TAZ, BND, OXD, etc. are used. As the electron injection layer, LiF, BCP, strontium, etc. are used, for example. As the cathode, a Mg-Ag co-evaporated film, Al, or the like is used.

Vapor deposition was carried out using evaporation source 4 including crucible 22 , heating member 44 , and heat insulating member 43 . Crucible 22 enclosing vapor deposition material 21 is heated by heating means 44 to generate vapor of vapor deposition material 21 . Also, film formation is performed by discharging toward the substrate 5 from the nozzle 34 provided on the crucible 22 . These crucible 22 , heating member 44 , heat insulating member 43 , and the like are accommodated in case 27 . In addition, since the heating member 44 should just be able to heat the vapor deposition material inside a crucible, there is no problem also inside a crucible. Also in the following Examples 2 to 3, the position of the heating member 44 can be provided regardless of the inside and outside of the crucible.

The control of the evaporation source 4 is to install a thermocouple inside the evaporation source 4 and adjust the electric power supplied to the heating member 44 so that the temperature of the crucible 22 and its environment reach a predetermined temperature. Alternatively, a rate sensor 26 may be provided in the space between the evaporation source 4 and the substrate, and the input power of the heating member 44 may be adjusted so that the evaporation rate per unit time to the rate sensor 26 reaches a predetermined value. . 25 is a thermocouple. 50 is a terminal.

When the substrate 5 becomes larger, the substrate 5 is rotated, and the evaporation source 4 is fixed in a state shifted from the rotation axis, or either the substrate 5 or the evaporation source 4 is moved in a direction perpendicular to the vapor ejection direction. . Especially in the latter case, it is only necessary to arrange the nozzles 34 in the width direction of the substrate and move the substrate 5 or the evaporation source 4 in a direction perpendicular to the arrangement direction.

In order to continuously vapor-deposit different substrates 5, as long as a gate valve 6 is provided in the chamber 2, the substrate 5 that has been processed can be moved to other chambers 2 while maintaining a vacuum state, and the untreated substrate 5 can be moved to another chamber while maintaining a constant vacuum degree. The processed substrate 5 may be carried in.

In this way, the operation of the evaporation device and the evaporation source is sought. The evaporation source 4 of the present invention can also be used in the same manner as described above.

Next, the evaporation source of the present invention will be described using FIG. 1 .

In addition, although the figures shown in this embodiment all show an example in which the substrate 5 is processed with the film-forming surface facing downward, the present invention can be applied regardless of the orientation of the film-forming surface.

In Fig. 1, evaporation source 4 is sealed with evaporation material 21, and has the crucible 22 that is used for the nozzle 34 that evaporation material 21 is discharged, is in the outside of crucible 22, is used for heating member 44 that crucible 22 is heated, The heat insulating member (first heat insulating member) 43 arranged around the crucible 22 and the heating member 44 is constituted. In addition, a cooling member 45 (floating vapor deposition recovery member) is provided between the heat insulating member 43 and the crucible 22 or the heating member 44 .

The cooling member 45 can trap particles of the material vapor entering the evaporation source 4 and selectively precipitate them. Accordingly, the precipitation to the surrounding parts is minimized. The temperature of the cooling member 45 is very low compared with the evaporation temperature of the vapor deposition material. For example, if the vapor deposition material is sublimated, it is preferably kept at a temperature below the sublimation point, and if it is a vapor deposition material, it is preferably kept at the melting point. below temperature.

On the other hand, when the cooling member 45 is installed at the above position, since the radiant heat of the crucible 22 or the heating member 44 is significantly absorbed, the temperature of the vapor deposition material in the crucible is lowered, and the vapor deposition itself is hindered. In order to prevent this, a heat radiation heat insulating member (second heat insulating member) 46 is provided so that the crucible 22 and the heating member 44 cannot directly face the cooling member 45 .

The heat radiation insulation member 46 may or may not be in close contact with the cooling member 45 . It is only necessary that the temperature of the outermost surface facing the heating member 44 or the crucible 22 is much higher than the temperature of the cooling member 45 and does not affect the evaporation of the vapor deposition material 21 in the crucible 22 . In addition, a structure in which a part of the cooling member 45 is exposed in a region surrounded by the heat insulating member 43 may be used.

FIG. 3(A) shows an example of use as a resistance heating type heating member 44 (heater 23 ).

In FIG. 3(A), if the heating element of the heater 23 is 700° C. or lower, measures for insulation from the surroundings are simple, so it is preferable to use a sheath heater because it is easy to manage. In the case of exceeding 700°C, especially above 1000°C, a heater may be formed by winding metal wires of metals such as Mo, Ta, W, or alloys thereof on a ceramic frame. As a material of the ceramic frame, a material excellent in insulating properties at a high temperature, such as alumina, SiC, boron nitride, and aluminum nitride, is preferable. The heater 23 is configured in a donut shape, and may be divided into two or more, such as vertically or horizontally. As long as crucible 22 and vapor deposition material 21 can be heated uniformly, heater 23 may be configured in any way. As the heating means 44 , in addition to resistance heating, induction heating and infrared heating can also be used.

A crucible 22 is accommodated in an area surrounded by the heater 23 . In FIG. 3 , the crucible 22 and the heater 23 are not in contact, but the crucible 22 and the heater 23 may be brought into contact unless they are short-circuited or grounded due to direct or indirect contact.

As the material of the crucible 22, metals such as Mo, Ta, W, or alloys containing these are preferable as the metal material. Alumina, SiC, boron nitride, aluminum nitride, etc. are preferable as a ceramic material, In addition, materials, such as carbon graphite, can also be used.

In FIG. 3 , instead of the heat insulating member 43 shown in FIGS. 1 and 2 , a so-called reflector 24 in which a plurality of reflecting plates 48 are separated is shown. When the reflection plate 48 is 700° C. or lower, a stainless steel material or a titanium material can be used. In the temperature range of 700° C. or higher, metal materials such as Au, Cu, Mo, Ta, W, and alloys thereof, and ceramic materials such as carbon, alumina, SiC, BN, and AlN can be used. It is only necessary to ensure the function of reflecting electromagnetic waves such as infrared rays that propagate heat radiation. Therefore, in order to increase the reflectance in the infrared band, the surface of the reflector 48 is preferably mirror-finished, and metal such as Ag, Au, Cu, or Al may be plated.

Instead of the reflector 24, at least one or more sheets made of ceramic plates or ceramic fibers with low heat conduction and high heat-resistant temperature may be laid. In the case of using a ceramic plate, a ceramic plate with a small porosity can be used in consideration of vacuum exhaust. In addition, the reflector 24 shown in FIG. 3, a heat insulating material, etc. may be shared.

FIG. 3(B) is a diagram showing the shape of the heater 23 .

In FIG. 3(B), the heater 23 a shown in (1) is an integrally formed heater, and the heater 23 b shown in (2) is a divided heater. The application of these heaters is selected to match the size of the housing 27 and the size of the base plate 5 .

Here, using FIG. 4, the structure of the production line for manufacturing an organic EL device will be briefly described.

Fig. 4 is a schematic configuration diagram of an organic EL device manufacturing apparatus according to an embodiment of the present invention.

In FIG. 4 , the organic EL device manufacturing apparatus 100 of the present invention is configured such that alignment and deposition are performed by the same vacuum deposition chamber 16 . The organic EL device manufacturing apparatus 100 is configured as a cluster-type organic EL device manufacturing apparatus 100 in which a polygonal vacuum transfer chamber 7 having a vacuum transfer robot 9 is disposed at the center, and substrate stockers are radially disposed at its periphery. The device chamber 8 and the vacuum evaporation chamber 16 as a film forming chamber. Each vacuum deposition chamber 16 has a substrate holding portion 13 for holding a substrate 10 and a mask 12 . In addition, between the vacuum evaporation chamber 16 and the substrate stocker chamber 8 and the vacuum transport chamber 7, a gate valve member 14 is provided for isolating the vacuum from each other. As the evaporation source 11, the evaporation source 4 shown in FIG. 1 or FIG. 3 is used.

With such a structure, the vacuum transfer robot 9 takes out the substrate 10 from the substrate stocker chamber 8 and carries it into the substrate holding portion 13 of the vacuum deposition chamber 16 . Moreover, in the vacuum evaporation chamber 16, the substrate 10 carried in is made to face the mask 12 by a substrate turning member (not shown), and calibration (alignment of the substrate and the mask is carried out), so that the evaporation source 11 is up and down. movement, the substrate 10 is vapor-deposited. After vapor deposition, the substrate 10 is returned to a horizontal state. Thereafter, the substrate 10 is transported out of the vacuum evaporation chamber 16 by the vacuum transport robot 9 into another vacuum evaporation chamber 16 or returned to the substrate stocker chamber 8 .

When the substrate 10 is carried in and out during such processing, the related gate valve 14 is controlled so as not to affect the processing of each vacuum deposition chamber 16 .

As described above, in the present embodiment, the cooling member 45 is provided outside the crucible 22 and the heating member 44 (heater 23 ), and provided inside the area surrounded by the heat insulating member 44 (reflector 24 ). According to this, since the floating leakage vapor can be concentratedly attached to the cooling member 45, it is possible to prevent the above-mentioned attachment to an extra location.

In addition, since the heat from the heater 23 to the cooling member 45 is blocked by the radiant heat insulation member 46 (reflector 24 ), the cooling member 45 is not heated. Therefore, stable trapping of leaked vapor can be performed.

[Example 2]

Figure 5 shows details of the cooling components.

Fig. 5 is a diagram showing a cooling member of an evaporation source according to another embodiment of the present invention.

In FIG. 5 , in this embodiment, the cooling member 45 is made of, for example, a block 28 made of stainless steel, and a cooling liquid 52 (oil or water, etc. is used as a cooling medium) is circulated from the outside of the reflector 24 .

That is to say, two coolant flow holes 52 a connecting the cavity 2 and the housing 27 are provided, and a U-shaped turning portion 52 b is further provided so that the two coolant flow holes 52 a are merged by the cooling block 28 . The coolant flow holes 52a are respectively connected by pipes 51 to form continuous flow holes.

In this embodiment, although the cavity 2, the casing 27, and the coolant flow hole 52a passing through the cooling block 28 are constituted, of course, the structure is not limited to this structure, and even if it is constituted by U-shaped piping, the can get the same effect.

As described above, according to the present embodiment, since the cooling block 28 can always be kept at a low temperature by circulating the cooling liquid 52 in the cooling block 28 , the trapping effect of leakage vapor can be improved.

[Example 3]

Fig. 6 is a diagram showing a cooling member of an evaporation source according to another embodiment of the present invention.

In Fig. 6, in Embodiment 2, the cooling medium is made to circulate in the cooling block 28, but in this embodiment, a hole is opened on the reflector 24, and it is connected or integrated with the external housing 27. Structure. In addition, in the case of being connected to the case 27 or having an integral structure, only the case side may be water-cooled.

That is, if the cooling block 28 is used as it is, heat radiation from the crucible 22 or the heating member 44 (heater 23 ) will be absorbed, the temperature inside the evaporation source will drop significantly, and evaporation will be hindered. Therefore, as shown in FIG. 5 or FIG. 6 , in the cooling block 28 , a radiant heat blocking member 46 is provided on a surface facing the heating member 44 or the crucible 22 . The radiant heat blocking member 46 may be either the reflector 24 or a heat insulating material.

It is desirable that the temperature of the cooling block 28 is set to be lower than any of the components located inside the reflector 24 of the evaporation source 4 . In addition, it is preferable to set it at a very low temperature compared with the evaporation temperature of the vapor deposition material 21. For example, when the vapor deposition material 21 is a molten material, it is preferably set near the melting point. In this case, it is preferable to set it below the sublimation start temperature. Accordingly, the particles of the evaporation material 21 entering the evaporation source 4 from the side of the nozzle can concentrate on the cooling block 28 instead of the components of the evaporation source 4 such as the thermocouple and the reflector 24 .

In addition, as shown in FIG. 5 or FIG. 6 , an anti-sticking plate 29 may be attached to the cooling block body 28 . It is desirable that the anti-sticking plate 29 is in contact with the cooling block 28 and is made of a material with good thermal conductivity. In addition, the outer surface of the anti-adhesion plate 29 may be roughened by sandblasting or the like so that the adhered vapor deposition material does not come off. In addition, since the anti-sticking plate 29 can be easily attached and detached, maintenance can be easily performed.

Furthermore, in the second embodiment, the U-shaped turning portion 52b of the cooling liquid flow hole 52a is provided on the cooling block 28, but in this embodiment, it is provided on the housing 27. According to this, since the cooling block body 28 is indirectly cooled via the casing 27, the machining of the cooling liquid flow holes 52a can be performed relatively easily, and cost reduction can be achieved.

In addition, as mentioned above, in this embodiment, the cavity 2 and the coolant flow hole 52a penetrating the housing 27 are also constituted. However, it is of course not limited to this structure. to get the same effect.

As described above, according to the present invention, the cooling member is provided in the middle covered by the heat insulating member, and the cooling member can locally generate a temperature that is very low compared with the evaporation temperature of the vapor deposition material or reaches below the melting point of the vapor deposition material. Partially, according to this, the particles of the vapor deposition material that entered between the crucible, the heating member and the heat insulating member can be collected on the cooling member 45 and deposited.

In addition, by providing a heat insulating member at a portion where the cooling member faces the heating member or the crucible, the influence of the vapor deposition process can be suppressed.

In addition, it is possible to minimize the adhesion of the vapor deposition material to the terminals of the heating member (heater), thermocouples, crucibles, and structures supporting the heating member, and to suppress the deposition of the vapor deposition material to these parts, which has occurred in the past. Deterioration of membrane quality, obstacles to continuous operation or maintenance.

In addition, by detachably attaching and detachably attaching to the part of the cooling member where the vapor deposition material is deposited, and attaching a non-sticking plate made of a material with good thermal conductivity, maintenance can be easily performed and performance can be maintained.

Claims (20)

1. An evaporation source comprising a crucible with a nozzle, a heating member for heating the crucible, and a first heat insulating member disposed on the periphery of the crucible and the heating member, and the nozzle is used to discharge the The vapor deposition material evaporated by being heated by the enclosed vapor deposition material is characterized in that, Between the above-mentioned first heat insulating member and the crucible or the heating member, there is provided a floating vapor deposition recovery member kept at a low temperature by the heating member, and A second heat insulating member is provided between the floating vapor deposition recovery member, the crucible, and the heating member. 2. The evaporation source as claimed in claim 1, characterized in that, The heating member is provided integrally with the crucible or is provided inside the crucible. 3. The evaporation source as claimed in claim 2, characterized in that, The heating means generates heat using resistance heating. 4. The evaporation source as claimed in claim 1, characterized in that, The heating means is arranged outside the crucible, and any one of resistance heating, induction heating, and infrared heating is used. 5. The evaporation source according to any one of claims 1 to 4, characterized in that, The first heat insulating member is shaped to cover at least a surface of the floating vapor deposition recovery member that faces the crucible and the heating member. 6. The evaporation source according to any one of claims 1 to 4, characterized in that, The above-mentioned first heat insulating member has a single structure or a structure in which a plurality of plates are laminated. 7. The evaporation source according to any one of claims 1 to 4, characterized in that, As the first heat insulating member, a plate made of any one or more of carbon, metal, and ceramics is used. 8. The evaporation source according to any one of claims 1 to 4, characterized in that, The above-mentioned second heat insulating member has a single or a structure in which a plurality of plates are laminated. 9. The evaporation source according to any one of claims 1 to 4, characterized in that, As the second heat insulating member, a plate made of any one or more of carbon, metal, and ceramics is used. 10. The evaporation source according to any one of claims 1 to 4, wherein A detachable cover is provided around the floating vapor deposition recovery member, and the cover is cooled by at least partial contact with the cooling member. 11. The evaporation source according to any one of claims 1 to 4, wherein The above-mentioned floating vapor deposition recovery member is provided on a surface other than the surface of the above-mentioned crucible having the nozzle. 12. The evaporation source according to any one of claims 1 to 4, wherein The above-mentioned device for recovering floating evaporated deposits is cooled by a circulating cooling medium. 13. The evaporation source of claim 12, wherein: The aforementioned cooling medium circulates in the walls of the housing itself, and The housing is in thermal contact with the floating vapor deposition recovery member. 14. A vacuum evaporation device, the vacuum evaporation device is equipped with: an evaporation source that discharges the vapor of the evaporation material; The substrate that is formed into a film by the vapor out, is characterized in that, The evaporation source is composed of a crucible having a nozzle, a heating member for heating the crucible, and a first heat insulating member arranged around the crucible and the heating member. evaporated evaporation material, A means for recovering floating evaporative deposits kept at a low temperature by the heating means is provided between the above-mentioned first heat insulating means and the crucible or the heating means, and A second heat insulating member is provided between the floating vapor deposition recovery member, the crucible, and the heating member. 15. vacuum evaporation apparatus as claimed in claim 14, is characterized in that, The above-mentioned second heat insulating member has a single or a structure in which a plurality of plates are laminated. 16. vacuum evaporation apparatus as claimed in claim 14, is characterized in that, As the second heat insulating member, a plate made of any one or more of carbon, metal, and ceramics is used. 17. vacuum evaporation apparatus as claimed in claim 14, is characterized in that, A detachable cover is provided around the floating vapor deposition recovery member, and the cover is cooled by at least partial contact with the cooling member. 18. vacuum evaporation apparatus as claimed in claim 14, is characterized in that, The above-mentioned floating vapor deposition recovery member is provided on a surface other than the surface of the above-mentioned crucible having the nozzle. 19. The vacuum evaporation device according to claim 14, characterized in that, The above-mentioned device for recovering floating evaporated deposits is cooled by a circulating cooling medium. 20. The vacuum evaporation device as claimed in claim 19, characterized in that, The aforementioned cooling medium circulates in the walls of the housing itself, and The housing is in thermal contact with the floating vapor deposition recovery member.

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