CN103313590A - Surface Mount Technology (SMT) production line - Google Patents

Abstract

The invention discloses a surface mount technology (SMT) production line. The SMT production line comprises printing machines, a connection table, chip mounters and a reflow soldering machine, wherein the printing machines, the connection table, the chip mounters and the reflow soldering machine are arranged in sequence. The number of the printing machines is a lot, a plurality of printing machines are respectively connected with the connection table, the printing machines are full-automatic printing machines, and the chip mounters are a plurality of full-automatic chip mounters. The SMT production line is simple in structure and convenient to install, the device utilization rate and the automation degree are improved by optimizing device combination connecting relations, and production efficiency of SMT production enterprises is greatly improved.

Description

A kind of SMT production line

technical field

The invention relates to an SMT production line. the

Background technique

At present, with the increase of labor costs, the automation transformation of enterprises is accelerating. In the field of electronic product production, SMT projects are put on the agenda by enterprises. In the existing SMT production line configuration, printing machines, placement machines, reflow soldering, and AOI are generally coordinated. Efficiency is the most important technical index that determines the benefit of an enterprise. How to improve efficiency is an urgent problem that enterprises need to solve. In SMT production, the placement machine is generally the fastest. Taking the current ordinary placement machine as an example, the speed can reach 20,000 pieces per hour. However, the speed of the printing machine is that each board takes about 20 seconds. Therefore, in a production and processing enterprise, the number of processed circuit boards is large, but when there are relatively few components on each circuit board, the speed depends on the printing machine. , so that the efficiency of the placement machine cannot be fully utilized. The placement machine is the most invested equipment in the production line, so its utilization rate must be fully improved in order to improve the efficiency of the SMT production line. the

Contents of the invention

The technical problem to be solved by the present invention is to provide an SMT production line, which solves the problem of speed matching between the printing machine and the placement machine in the SMT by improving the configuration relationship of the equipment. the

In order to solve the problems of the technologies described above, the present invention adopts the following technical solutions:

An SMT production line includes a printing machine, a connecting station, a placement machine, and reflow soldering arranged in sequence. The printing machine includes at least two sets, and the at least two printing machines are respectively connected to the connecting station.

The printing machine is a fully automatic printing machine, and the placement machine is a fully automatic placement machine. the

The placement machine includes at least one. the

There are two placement machines, and the two placement machines are arranged in sequence. the

Compared with prior art, the present invention has following beneficial effect:

The invention has simple structure and convenient installation, and improves the utilization rate and automation degree of the equipment by optimizing the combination and connection relationship of the equipment, so that the production efficiency of the SMT processing enterprise is obviously improved.

With multiple printing machines, when one of the printing machines fails, the other printing machines can continue to work without affecting the operation of the entire SMT production line, reducing downtime and improving production efficiency. the

Description of drawings

FIG. 1 is a block diagram of an SMT production line in the prior art. the

Fig. 2 is a block diagram of the SMT production line of the present invention. the

Detailed ways

The technical scheme of the present invention is described in detail below in conjunction with accompanying drawing:

As shown in Figure 1, the existing SMT production line includes a fully automatic printing machine, a connecting station, a first fully automatic placement machine 1, a second fully automatic placement machine 2, reflow soldering, and a circuit to be processed. The board is first printed with solder paste by a fully automatic printing machine, and then transferred to a fully automatic placement machine through a feeder for placement, and then the soldering of the circuit board is completed by reflow soldering.

The printing machine of the present invention includes multiple printing machines, and the multiple printing machines are respectively connected to the connection table, and the printing machines work in time-sharing, and provide printed circuit boards for the placement machine through the connection table. the

This embodiment illustrates the working process of the SMT production line of the present invention with two printing machines and two placement machines as an example:

In this embodiment, the two printing machines adopt a fully automatic printing machine, the model is GKG-5, the connecting station adopts the matching connecting station of Kelongwei Company, the first fully automatic placement machine 1 adopts YAMAHA YS12, and the second The automatic placement machine 2 adopts YAMAHA YS12p.

The composition of the SMT production line of this embodiment is as shown in Figure 2, the connecting station, the first fully automatic placement machine 1, the second fully automatic placement machine 2, and reflow soldering are arranged in sequence, and the two fully automatic printing machines are respectively connected with docking station connection. the

When the number of circuit boards is large and there are few components on the circuit board, the average time for each circuit board is 10 seconds to calculate, and the time required for each circuit board to print solder paste is 20 seconds. Taking 100 circuit boards as an example, The total placement time takes 1000 seconds, and the total printing solder paste time is 2000 seconds, so it takes at least 1000 seconds to complete the placement of 100 circuit boards. However, according to the equipment configuration of the traditional SMT production line, it takes a long time to finish placing a board each time. It takes 10 seconds to paste the next board, so it takes at least 2000 seconds to complete the placement of 100 boards. In order to achieve the shortest time for completing the placement of 100 circuit boards, the placement machine needs to work continuously. Using the configuration scheme of this embodiment, The two printing machines work at the same time, and it takes 1000 seconds to complete the printing of 100 boards, which can ensure that the placement machine and printing machine are always working. the

Using the above embodiment, the working efficiency is twice that of the traditional SMT production line. the

Embodiment 2: When the number of circuit boards is large and there are few components to be placed on the circuit board, it takes 5 seconds to calculate the average time for each circuit board to be placed, and the time required to print solder paste on each circuit board is 20 seconds. Similarly, 100 Take a circuit board as an example, the total placement time is 500 seconds, and the total printing solder paste time is 2000 seconds, so it takes at least 500 seconds to complete the placement of 100 circuit boards, but if the equipment configuration of the traditional SMT production line is used, each time It needs to wait 15 seconds to paste the next board after one board is finished. In this way, it takes at least 2000 seconds to complete the placement of 100 boards. In order to achieve the shortest time to complete the placement of 100 circuit boards, the placement machine needs to work continuously. Four Two printing machines work at the same time, and it takes 500 seconds to complete the printing of 100 boards, which can ensure that the placement machine and printing machine are always working. the

Adopting the placement machine and printing machine configuration scheme of Embodiment 2, the working efficiency is 4 times of that of the traditional SMT production line. the

Furthermore, using multiple printing machines, when one of the printing machines fails, other printing machines can continue to work without affecting the operation of the entire SMT production line, reducing downtime and improving production efficiency. the

When the base of the circuit board is large and there are many SMT components on the circuit board, multiple placement machines can be used to work at the same time. the

Claims (4)

1. A kind of SMT production line, comprises the printing machine that arranges successively, connecting table, placement machine, reflow soldering, it is characterized in that: described printing machine comprises at least two, and at least two printing machines are respectively connected with connecting table . 2. The SMT production line according to claim 1, characterized in that: the printing machine is a fully automatic printing machine, and the placement machine is a fully automatic placement machine. 3. The SMT production line according to claim 1 or 2, characterized in that the placement machine comprises at least one. 4. The SMT production line according to claim 3, characterized in that: there are two placement machines, and the two placement machines are arranged in sequence.

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