CN103298254B - The encapsulation and preparation method thereof of components and parts on a kind of printed substrate - Google Patents
The encapsulation and preparation method thereof of components and parts on a kind of printed substrate Download PDFInfo
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- CN103298254B CN103298254B CN201210043250.4A CN201210043250A CN103298254B CN 103298254 B CN103298254 B CN 103298254B CN 201210043250 A CN201210043250 A CN 201210043250A CN 103298254 B CN103298254 B CN 103298254B
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- 238000005538 encapsulation Methods 0.000 title claims 12
- 239000000758 substrate Substances 0.000 title claims 11
- 238000002360 preparation method Methods 0.000 title description 5
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 98
- 239000010959 steel Substances 0.000 claims abstract description 98
- 238000004519 manufacturing process Methods 0.000 claims abstract description 58
- 239000002184 metal Substances 0.000 claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 16
- 239000013078 crystal Substances 0.000 claims description 164
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 55
- 239000010949 copper Substances 0.000 claims description 55
- 238000000034 method Methods 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 25
- 238000013461 design Methods 0.000 abstract description 13
- 229910000679 solder Inorganic materials 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000013072 incoming material Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000001788 irregular Effects 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明提供一种印刷线路板上元器件的封装，所述封装包括焊盘部分和钢网部分，所述焊盘部分包括第二元器件焊盘结构和用于焊接第一元器件的顶层金属皮结构，所述顶层金属皮结构的中心与第二元器件焊盘结构的中心重叠，第二元器件焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成焊盘部分；所述钢网部分包括间距设置的第一元器件钢网结构和第二元器件钢网结构，所述第二元器件钢网结构和第一元器件钢网结构结合形成钢网部分。本发明还提供所述封装的制作方法。本发明提供的印刷线路板上元器件的封装结构可以对第一元器件和第二元器件进行贴片生产，不需要重新设计封装结构，有效减少了产品的生产周期、修改设计带来的额外风险和备料的风险。
The invention provides a package of components on a printed circuit board, the package includes a pad part and a steel mesh part, and the pad part includes a pad structure of a second component and a top layer metal for welding the first component A skin structure, the center of the top metal skin structure overlaps with the center of the second component pad structure, and the second component pad structure is combined with the top metal skin structure for welding the first component to form a pad portion; The stencil part includes a first component stencil structure and a second component stencil structure arranged at intervals, and the second component stencil structure and the first component stencil structure are combined to form the stencil part. The invention also provides a manufacturing method of the package. The packaging structure of the components on the printed circuit board provided by the present invention can be used for SMT production of the first components and the second components without redesigning the packaging structure, which effectively reduces the production cycle of the product and the additional cost caused by modifying the design. Risk and risk of stocking.
Description
技术领域technical field
本发明属于印刷线路板领域，尤其涉及一种印刷线路板上元器件的封装及其制作方法。The invention belongs to the field of printed circuit boards, and in particular relates to packaging of components on a printed circuit board and a manufacturing method thereof.
背景技术Background technique
由于现代电子产品技术的飞速发展，竞争越来越激烈，尤其是对于如今日新月异的手机等消费类电子产品，其生产成本和生产周期决定了产品是否能顺利上市的两个非常重要的因素，而且随着电子产品一旦大批量的生产，电子产品的所有元器件都必须要有充足的来源；这样一来如何让电子产品的元器件的价格和货源稳定，成为了很重大的事情。Due to the rapid development of modern electronic product technology, the competition is becoming more and more fierce, especially for consumer electronic products such as mobile phones that are changing with each passing day. The production cost and production cycle determine whether the product can be listed smoothly. Two very important factors, and Once electronic products are produced in large quantities, all components of electronic products must have sufficient sources; in this way, how to stabilize the price and supply of components of electronic products has become a very important matter.
而目前，印刷线路板(PrintedCircuitBoard，简称PCB)上的每一种元器件封装结构只能对应该元器件的来料贴片，如果元器件的来料更换为同类不同型号的元器件，此时需要重新设计更换后元器件的封装结构，然后再进行贴片生产。但是，这样就大大提高了产品的生产周期，增加了再次修改设计带来的额外风险；同时，如果更换后元器件的货源不足，还会增加备料的风险。At present, each component packaging structure on the Printed Circuit Board (PCB) can only correspond to the incoming patch of the component. It is necessary to redesign the packaging structure of the replaced components, and then carry out patch production. However, this will greatly increase the production cycle of the product and increase the additional risk of modifying the design again; at the same time, if the supply of components after replacement is insufficient, the risk of material preparation will also increase.
发明内容Contents of the invention
本发明的目的是提供一种印刷线路板上元器件的封装，解决现有技术中由于换料，需要重新设计产品更换后元器件的封装结构所导致的产品生产周期增长、修改设计带来的额外风险和增加备料风险的技术问题。The purpose of the present invention is to provide a package of components on a printed circuit board, which solves the problem of product production cycle growth and design modification caused by redesigning the packaging structure of components after product replacement due to refueling in the prior art. Additional risks and technical issues that increase the risk of stockpiling.
本发明的目的是通过以下技术方案实现的：The purpose of the present invention is achieved through the following technical solutions:
一种印刷线路板上元器件的封装，所述封装包括焊盘部分和钢网部分，所述焊盘部分包括第二元器件焊盘结构和用于焊接第一元器件的顶层金属皮结构，所述顶层金属皮结构的中心与第二元器件焊盘结构的中心重叠，第二元器件焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成焊盘部分；所述钢网部分包括间距设置的第一元器件钢网结构和第二元器件钢网结构，所述第二元器件钢网结构和第一元器件钢网结构结合形成钢网部分。A package of components on a printed circuit board, the package includes a pad portion and a stencil portion, the pad portion includes a second component pad structure and a top layer metal skin structure for welding the first component, The center of the top metal skin structure overlaps the center of the second component pad structure, and the second component pad structure is combined with the top metal skin structure for welding the first component to form a pad part; the steel mesh The part includes a first component stencil structure and a second component stencil structure arranged at intervals, and the second component stencil structure and the first component stencil structure are combined to form a stencil part.
本发明还提供一种印刷线路板上元器件的封装的制作方法，包括焊盘制作和钢网制作步骤，其中，The present invention also provides a manufacturing method for packaging components on a printed circuit board, including pad manufacturing and steel mesh manufacturing steps, wherein,
所述焊盘制作包括步骤：The making of the pad comprises the steps of:
S11、根据第二元器件的尺寸创建该第二元器件的焊盘结构，所述焊盘结构的原点位置位于该第二元器件的中心，并标注该第二元器件的第一脚位置；S11. Create a pad structure of the second component according to the size of the second component, the origin of the pad structure is located at the center of the second component, and mark the position of the first pin of the second component;
S12、以第二元器件的中心为原点，保持与第二元器件的第一脚位置一致的基础上，根据第一元器件的尺寸创建该第一元器件的焊盘结构；S12. Taking the center of the second component as the origin and keeping the same position as the first pin of the second component, create a pad structure of the first component according to the size of the first component;
S13、用顶层金属皮将第一元器件焊盘结构的外形轮廓描绘出来，并删除第一元器件的焊盘结构，将第二元器件的焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成焊盘部分；S13. Use the top metal skin to draw the outline of the pad structure of the first component, and delete the pad structure of the first component, and connect the pad structure of the second component with the top layer for welding the first component The metal skin structure is combined to form the pad part;
所述钢网制作包括步骤：Described stencil making comprises steps:
S14、将所述步骤S13描绘出来的顶层金属皮进行复制，形成同样大小的且属性为钢网层的金属皮，作为第一元器件钢网结构；S14. Copy the top metal skin drawn in step S13 to form a metal skin with the same size and attribute as a steel mesh layer, as the first component steel mesh structure;
S15、以第一元器件钢网结构与第二元器件钢网结构的预设间距和第二元器件的焊盘结构为基础，创建属性为钢网层的金属皮，作为第二元器件钢网结构；S15. Based on the preset spacing between the steel mesh structure of the first component and the steel mesh structure of the second component and the pad structure of the second component, create a metal skin whose property is the steel mesh layer as the second component steel net structure;
S16、将所述第二元器件钢网结构和第一元器件钢网结构结合形成钢网部分。S16. Combining the second component stencil structure with the first component stencil structure to form a stencil part.
本发明提供的印刷线路板上元器件的封装及其制作方法中，所述封装包括焊盘部分和钢网部分，其焊盘部分由第二元器件焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成，且所述顶层金属皮结构的中心与第二元器件焊盘结构的中心重叠；其钢网部分由第二元器件钢网结构和第一元器件钢网结构结合形成，且第二元器件钢网结构和第一元器件钢网结构间距设置。因此，当第一元器件和第二元器件之间相互更换来料时，所述印刷线路板上元器件的封装结构都可以对第一元器件和第二元器件进行贴片生产，不需要重新设计封装结构，因而有效减少了产品的生产周期和修改设计带来的额外风险；同时，所述封装结构可以用两种不同的来料进行贴片，因此大大减少了货源不足及其备料的风险。In the packaging of components on a printed circuit board and the manufacturing method thereof provided by the present invention, the packaging includes a pad part and a steel mesh part, and the pad part is composed of the pad structure of the second component and is used for welding the first component. The top metal skin structure is formed by combining the top metal skin structure, and the center of the top metal skin structure overlaps with the center of the second component pad structure; the stencil part is combined by the second component stencil structure and the first component stencil structure formed, and the distance between the steel mesh structure of the second component and the steel mesh structure of the first component is set. Therefore, when the incoming materials are exchanged between the first component and the second component, the packaging structure of the component on the printed circuit board can be used for SMT production of the first component and the second component, without the need for The packaging structure is redesigned, thus effectively reducing the additional risks caused by the product's production cycle and modification of the design; at the same time, the packaging structure can be patched with two different incoming materials, thus greatly reducing the lack of supply and the need for material preparation risk.
附图说明Description of drawings
图1是现有技术提供的第一晶振的封装结构示意图。FIG. 1 is a schematic diagram of a packaging structure of a first crystal oscillator provided in the prior art.
图2是现有技术提供的第二晶振的封装结构示意图。FIG. 2 is a schematic diagram of a package structure of a second crystal oscillator provided in the prior art.
图3是本发明提供的第二晶振的封装结构示意图。FIG. 3 is a schematic diagram of the packaging structure of the second crystal oscillator provided by the present invention.
图4是本发明提供的在图3基础上创建第一晶振焊盘的结构示意图。FIG. 4 is a schematic diagram of the structure of the first crystal oscillator pad created on the basis of FIG. 3 provided by the present invention.
图5是本发明提供的在图4基础上创建第一晶振焊盘铜皮的结构示意图。FIG. 5 is a schematic diagram of the structure of the first crystal oscillator pad copper skin created on the basis of FIG. 4 provided by the present invention.
图6是本发明提供的印刷线路上元器件的兼容焊盘的结构示意图。FIG. 6 is a structural schematic diagram of compatible pads of components on a printed circuit provided by the present invention.
图7是本发明提供的在图5基础上创建第一晶振钢网铜皮的结构示意图。FIG. 7 is a schematic structural diagram of creating the copper skin of the first crystal oscillator stencil on the basis of FIG. 5 provided by the present invention.
图8是本发明提供的印刷线路上元器件的封装结构示意图。Fig. 8 is a schematic diagram of the package structure of the components on the printed circuit provided by the present invention.
具体实施方式detailed description
为了使本发明所解决的技术问题、技术方案及有益效果更加清楚明白，以下结合实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。In order to make the technical problems, technical solutions and beneficial effects solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
请参考图3-8所示，一种印刷线路板上元器件的封装，所述封装包括焊盘部分和钢网部分，所述焊盘部分包括第二元器件焊盘结构31、32、33、34和用于焊接第一元器件的顶层金属皮结构51、52、53、54，所述顶层金属皮结构51、52、53、54的中心与第二元器件焊盘结构的中心30重叠，第二元器件焊盘结构31、32、33、34与用于焊接第一元器件的顶层金属皮结构51、52、53、54结合形成焊盘部分61、62、63、64；所述钢网部分包括间距设置的第一元器件钢网结构71、72、73、74和第二元器件钢网结构75、76、77、78，所述第二元器件钢网结构75、76、77、78和第一元器件钢网结构71、72、73、74结合形成钢网部分81、82、83、84。Please refer to Figures 3-8, a package of components on a printed circuit board, the package includes a pad part and a steel mesh part, and the pad part includes a second component pad structure 31, 32, 33 , 34 and top layer metal skin structures 51, 52, 53, 54 for welding the first components, the centers of the top layer metal skin structures 51, 52, 53, 54 overlap with the center 30 of the second component pad structure , the second component pad structures 31, 32, 33, 34 are combined with the top metal skin structures 51, 52, 53, 54 for welding the first components to form pad portions 61, 62, 63, 64; The stencil part includes first component stencil structures 71, 72, 73, 74 and second component stencil structures 75, 76, 77, 78 arranged at intervals, and the second component stencil structures 75, 76, 77 , 78 and first component stencil structures 71 , 72 , 73 , 74 combine to form stencil portions 81 , 82 , 83 , 84 .
本发明提供的印刷线路板上元器件的封装中，所述封装包括焊盘部分和钢网部分，其焊盘部分由第二元器件焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成，且所述顶层金属皮结构的中心与第二元器件焊盘结构的中心重叠；其钢网部分由第二元器件钢网结构和第一元器件钢网结构结合形成，且第二元器件钢网结构和第一元器件钢网结构间距设置。因此，当第一元器件和第二元器件之间相互更换来料时，所述印刷线路板上元器件的封装结构都可以对第一元器件和第二元器件进行贴片生产，不需要重新设计封装结构，因而有效减少了产品的生产周期和修改设计带来的额外风险；同时，所述封装结构可以用两种不同的来料进行贴片，因此大大减少了货源不足及其备料的风险。In the package of components on a printed circuit board provided by the present invention, the package includes a pad part and a steel mesh part, and the pad part is composed of the pad structure of the second component and the top metal skin for welding the first component. The structure is combined to form, and the center of the top metal skin structure overlaps with the center of the second component pad structure; its stencil part is formed by combining the second component stencil structure and the first component stencil structure, and the second Set the spacing between the stencil structure of the secondary component and the stencil structure of the first component. Therefore, when the incoming materials are exchanged between the first component and the second component, the packaging structure of the component on the printed circuit board can be used for SMT production of the first component and the second component, without the need for The packaging structure is redesigned, thus effectively reducing the additional risks caused by the product's production cycle and modification of the design; at the same time, the packaging structure can be patched with two different incoming materials, thus greatly reducing the lack of supply and the need for material preparation risk.
作为具体的实施方式，所述第一元器件和第二元器件的类型为晶振，即所述第一元器件为第一晶振，第二元器件为第二晶振。当然，本领域技术人员在前述元器件类型选择的基础上，还可以选择所述第一元器件和第二元器件的类型为电阻、电容、电感、二极管、三极管、连接器或者其他集成芯片等不同类别的器件。As a specific implementation manner, the type of the first component and the second component is a crystal oscillator, that is, the first component is a first crystal oscillator, and the second component is a second crystal oscillator. Of course, on the basis of the selection of the aforementioned component types, those skilled in the art can also select the types of the first component and the second component to be resistors, capacitors, inductors, diodes, triodes, connectors or other integrated chips, etc. different classes of devices.
作为具体的实施方式，所述第二晶振的封装尺寸大于第一晶振的封装尺寸，因此本发明在设计时以第二晶振的封装焊盘为基础，反之亦然；然后将第一晶振的封装焊盘与第二晶振的封装焊盘结合，即让第一晶振和第二晶振兼容在一个封装焊盘里，使其该封装焊盘既可以对第一晶振进行贴片生产，又可对第二晶振进行贴片生产。在具体的实施例中，本发明的发明人研究发现，只要是顶层金属皮就能够和焊盘结合形成新的焊盘结构；优选地，所述顶层金属皮为顶层铜皮，并且铜皮可以为任何形状，而第一晶振和第二晶振的基础焊盘都是规则的焊盘，例如为正方型、长方型、圆形等规则形状，因此本发明要得到兼容且不规则的封装焊盘，只有跟不规则的铜皮结合，才能实现；因此，本发明优选用顶层铜皮结构来代替第一晶振的焊盘结构，与第二晶振的焊盘结构结合形成焊盘部分。如果不用顶层金属皮替换结合，而只是简单用一个焊盘的结构与另一焊盘的结构叠在一起，但它们仍然是两个引角(PIN)，而不是本发明所述的一个兼容焊盘所对应的一个引角(PIN)。As a specific implementation, the package size of the second crystal oscillator is greater than the package size of the first crystal oscillator, so the present invention is based on the package pad of the second crystal oscillator when designing, and vice versa; then the package of the first crystal oscillator The pad is combined with the package pad of the second crystal oscillator, that is, the first crystal oscillator and the second crystal oscillator are compatible in one package pad, so that the package pad can not only carry out chip production for the first crystal oscillator, but also for the second crystal oscillator. Two crystal oscillators are used for patch production. In a specific embodiment, the inventors of the present invention found that as long as the top metal skin can be combined with the pad to form a new pad structure; preferably, the top metal skin is a top copper skin, and the copper skin can be It can be any shape, and the basic pads of the first crystal oscillator and the second crystal oscillator are regular pads, such as square, rectangular, circular and other regular shapes, so the present invention will obtain compatible and irregular package soldering pads. The plate can only be realized by combining with the irregular copper skin; therefore, the present invention preferably replaces the pad structure of the first crystal oscillator with the copper skin structure of the top layer, and combines with the pad structure of the second crystal oscillator to form the pad part. If the top layer of metal skin is not used to replace the combination, but the structure of one pad is simply stacked with the structure of another pad, but they are still two lead angles (PIN), rather than a compatible soldering described in the present invention. A leading angle (PIN) corresponding to the disk.
作为一种具体的实施例，所述第二晶振的封装尺寸大于第一晶振的封装尺寸，而正常的焊盘的钢网设计就是焊盘本身的大小，即第一晶振和第二晶振钢网的大小与元器件本身的焊盘大小一样。但是，当采用本发明提供的第二元器件焊盘结构31、32、33、34与用于焊接第一元器件的顶层金属皮结构51、52、53、54结合形成如图6所示的焊盘部分61、62、63、64后，钢网制作的大小就不能与焊盘的大小一样。具体地，钢网制作的作用是为生产流程中印刷线路板上焊锡用的，焊锡量的大小是与钢网的面积大小相同的，如果钢网的大小与焊盘的大小相同，当用料为第二晶振时，由于结合后的焊盘部分稍大于它本身的实体焊盘，也就是说焊锡量超过得很少，过高温炉时锡力也就很小，可以忽略不计，这样就不会对第二晶振的贴片生产产生影响。但是，当选用第一晶振用料时，由于结合后的焊盘部分比它本身的实体焊盘大许多(这是因为本发明的焊盘部分在制作时，以第二晶振的焊盘结构为基准设计的)，即钢网超出第一晶振的实体焊盘许多，导致回锡量过多，这样过高温炉时锡力就会产生影响，会导致第一晶振无规则的偏移，贴片生产完后不居中，东倒西歪，甚至还可能出现虚焊、短路等不良现象发生。如果所述第一晶振的封装尺寸大于第二晶振的封装尺寸，则本发明所述焊盘部分则会以第一晶振的焊盘结构为基准进行设计，所述第二晶振也会出现与所述第一晶振来料贴片生产时类似的不良情况和现象。As a specific embodiment, the package size of the second crystal oscillator is larger than the package size of the first crystal oscillator, and the stencil design of the normal pad is the size of the pad itself, that is, the first crystal oscillator and the second crystal oscillator stencil The size is the same as the pad size of the component itself. However, when the second component pad structure 31, 32, 33, 34 provided by the present invention is combined with the top layer metal skin structure 51, 52, 53, 54 for welding the first component to form the structure shown in Figure 6 After the pads 61, 62, 63, 64, the size of the stencil cannot be the same as that of the pads. Specifically, the role of stencil production is for soldering on printed circuit boards in the production process. The size of the amount of solder is the same as the area of the stencil. If the size of the stencil is the same as the size of the pad, when the material used When it is the second crystal oscillator, since the combined pad part is slightly larger than its own physical pad, that is to say, the amount of solder exceeds very little, and the tin force is very small when it is passed through a high-temperature furnace, which can be ignored, so that it will not It has an impact on the patch production of the second crystal oscillator. But, when selecting the first crystal vibration material for use, because the pad part after bonding is much larger than its own physical pad (this is because the pad part of the present invention is when making, the pad structure of the second crystal oscillator is Benchmark design), that is, the stencil exceeds the physical pad of the first crystal oscillator a lot, resulting in too much tin return, so that the tin force will have an impact when the furnace is overheated, which will cause the first crystal oscillator to shift irregularly, and the patch After production, it is not centered, it is rickety, and even bad phenomena such as virtual welding and short circuit may occur. If the package size of the first crystal oscillator is larger than the package size of the second crystal oscillator, the pad part of the present invention will be designed based on the pad structure of the first crystal oscillator, and the second crystal oscillator will also appear different from the second crystal oscillator. Describe the similar adverse conditions and phenomena during the production of the first crystal oscillator incoming patch.
因此，发明人在前述分析和研究的基础上，对所述结合后的焊盘部分的钢网设计进行了改进，具体请参考图7所示：将所述第一晶振的钢网结构71、72、73、74与第一晶振的焊盘结构41、42、43、44设计相同，而所述第二晶振的钢网结构75、76、77、78的内侧701与第一晶振的钢网结构间距设置，外侧702与第二晶振的焊盘结构边缘重叠；即第二晶振的钢网的内侧701与第一晶振的钢网结构保持了一定的防焊锡连接间距，外侧702与第二晶振自身的焊盘结构边缘重叠，然后将第一晶振的钢网结构71、72、73、74与第二晶振的钢网结构75、76、77、78结合，形成如图8所示的钢网部分81、82、83、84。当采用如图8所示的钢网结构选用第一晶振用料时，相对于第一晶振自身来说，多余的焊锡面积就是第二晶振的四个钢网结构75、76、77和78了，但是该钢网结构中已用预设间距将第一晶振自身所需的焊锡量和第二晶振隔开了，这样当选用第一晶振来料进行贴片生产时，就不会再有偏位了。所以，不管选用第一晶振还是第二晶振来料贴片生产时，都不会有不良情况和现象出现了。Therefore, on the basis of the aforementioned analysis and research, the inventor has improved the steel mesh design of the bonded pad part, please refer to Figure 7 for details: the steel mesh structure 71 of the first crystal oscillator, 72, 73, 74 have the same design as the pad structures 41, 42, 43, 44 of the first crystal oscillator, and the inner side 701 of the steel mesh structure 75, 76, 77, 78 of the second crystal oscillator is the same as the steel mesh of the first crystal oscillator. The structure spacing is set, and the outer side 702 overlaps with the edge of the pad structure of the second crystal oscillator; that is, the inner side 701 of the steel mesh of the second crystal oscillator and the steel mesh structure of the first crystal oscillator maintain a certain solder-proof connection distance, and the outer side 702 and the second crystal oscillator The edges of the own pad structures overlap, and then the steel mesh structures 71, 72, 73, 74 of the first crystal oscillator are combined with the steel mesh structures 75, 76, 77, 78 of the second crystal oscillator to form a steel mesh as shown in Figure 8 Sections 81, 82, 83, 84. When the steel mesh structure shown in Figure 8 is used to select the material for the first crystal oscillator, compared to the first crystal oscillator itself, the redundant solder area is the four steel mesh structures 75, 76, 77 and 78 of the second crystal oscillator. , but the stencil structure has used the preset spacing to separate the amount of solder required for the first crystal oscillator itself from the second crystal oscillator, so that when the first crystal oscillator is selected for SMT production, there will be no bias Bit up. Therefore, no matter whether the first crystal oscillator or the second crystal oscillator is selected for SMT production, there will be no adverse situations and phenomena.
作为优选的实施方式，所述第二晶振的钢网结构的内侧701与第一晶振的钢网结构的间距距离大于等于0.15毫米，从而可以有效的防止第二晶振钢网结构上的焊锡与第一晶振自身所需要的焊锡连接，保证第一晶振能有效的焊接。As a preferred embodiment, the distance between the inner side 701 of the steel mesh structure of the second crystal oscillator and the steel mesh structure of the first crystal oscillator is greater than or equal to 0.15 millimeters, thereby effectively preventing the solder on the steel mesh structure of the second crystal oscillator from interfering with the first crystal oscillator. The solder connection required by a crystal oscillator itself ensures that the first crystal oscillator can be soldered effectively.
本发明还提供一种印刷线路板上元器件的封装的制作方法，包括焊盘制作和钢网制作步骤，其中，The present invention also provides a manufacturing method for packaging components on a printed circuit board, including pad manufacturing and steel mesh manufacturing steps, wherein,
所述焊盘制作包括步骤：The making of the pad comprises the steps of:
S11、根据第二元器件的尺寸创建该第二元器件的焊盘结构，所述焊盘结构的原点位置位于该第二元器件的中心，并标注该第二元器件的第一脚位置；S11. Create a pad structure of the second component according to the size of the second component, the origin of the pad structure is located at the center of the second component, and mark the position of the first pin of the second component;
S12、以第二元器件的中心为原点，保持与第二元器件的第一脚位置一致的基础上，根据第一元器件的尺寸创建该第一元器件的焊盘结构；S12. Taking the center of the second component as the origin and keeping the same position as the first pin of the second component, create a pad structure of the first component according to the size of the first component;
S13、用顶层金属皮将第一元器件焊盘结构的外形轮廓描绘出来，并删除第一元器件的焊盘结构，将第二元器件的焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成焊盘部分；S13. Use the top metal skin to draw the outline of the pad structure of the first component, and delete the pad structure of the first component, and connect the pad structure of the second component with the top layer for welding the first component The metal skin structure is combined to form the pad part;
所述钢网制作包括步骤：Described stencil making comprises steps:
S14、将所述步骤S13描绘出来的顶层金属皮进行复制，形成同样大小的且属性为钢网层的金属皮，作为第一元器件钢网结构；S14. Copy the top metal skin drawn in step S13 to form a metal skin with the same size and attribute as a steel mesh layer, as the first component steel mesh structure;
S15、以第一元器件钢网结构与第二元器件钢网结构的预设间距和第二元器件的焊盘结构为基础，创建属性为钢网层的金属皮，作为第二元器件钢网结构；S15. Based on the preset spacing between the steel mesh structure of the first component and the steel mesh structure of the second component and the pad structure of the second component, create a metal skin whose property is the steel mesh layer as the second component steel net structure;
S16、将所述第二元器件钢网结构和第一元器件钢网结构结合形成钢网部分。S16. Combining the second component stencil structure with the first component stencil structure to form a stencil part.
本发明提供的印刷线路板上元器件的封装中，所述封装包括焊盘部分和钢网部分，其焊盘部分由第二元器件焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成，且所述顶层金属皮结构的中心与第二元器件焊盘结构的中心重叠；其钢网部分由第二元器件钢网结构和第一元器件钢网结构结合形成，且第二元器件钢网结构和第一元器件钢网结构间距设置。因此，当第一元器件和第二元器件之间相互更换来料时，所述印刷线路板上元器件的封装结构都可以对第一元器件和第二元器件进行贴片生产，不需要重新设计封装结构，因而有效减少了产品的生产周期和修改设计带来的额外风险；同时，所述封装结构可以用两种不同的来料进行贴片，因此大大减少了货源不足及其备料的风险。In the package of components on a printed circuit board provided by the present invention, the package includes a pad part and a steel mesh part, and the pad part is composed of the pad structure of the second component and the top metal skin for welding the first component. The structure is combined to form, and the center of the top metal skin structure overlaps with the center of the second component pad structure; its stencil part is formed by combining the second component stencil structure and the first component stencil structure, and the second Set the spacing between the stencil structure of the secondary component and the stencil structure of the first component. Therefore, when the incoming materials are exchanged between the first component and the second component, the packaging structure of the component on the printed circuit board can be used for SMT production of the first component and the second component, without the need for The packaging structure is redesigned, thus effectively reducing the additional risks caused by the product's production cycle and modification of the design; at the same time, the packaging structure can be patched with two different incoming materials, thus greatly reducing the lack of supply and the need for material preparation risk.
以下将以所述第一元器件和第二元器件的类型为晶振，即所述第一元器件为第一晶振，第二元器件为第二晶振，作为具体实施例对本发明提供的制作方法进行详细说明。当然，本领域技术人员在前述元器件类型选择的基础上，还可以选择所述第一元器件和第二元器件的类型为电阻、电容、电感、二极管、三极管、连接器或者其他集成芯片等不同类别的器件。In the following, the type of the first component and the second component will be the crystal oscillator, that is, the first component will be the first crystal oscillator, and the second component will be the second crystal oscillator, and the manufacturing method provided by the present invention will be used as a specific embodiment. Describe in detail. Of course, on the basis of the selection of the aforementioned component types, those skilled in the art can also select the types of the first component and the second component to be resistors, capacitors, inductors, diodes, triodes, connectors or other integrated chips, etc. different classes of devices.
请参考图1所示，为现有技术提供的第一晶振1的封装结构示意图，即第一晶振1自身的封装结构。所述第一晶振1包括第一焊盘11、第二焊盘12、第三焊盘13和第四焊盘14；其中，所述标号10表示第一晶振1的中心，标号15表示第一晶振1对应的印刷线路板上设计的焊盘大小。Please refer to FIG. 1 , which is a schematic diagram of the package structure of the first crystal oscillator 1 provided in the prior art, that is, the package structure of the first crystal oscillator 1 itself. The first crystal oscillator 1 includes a first bonding pad 11, a second bonding pad 12, a third bonding pad 13 and a fourth bonding pad 14; wherein, the label 10 represents the center of the first crystal oscillator 1, and the label 15 represents the first Crystal oscillator 1 corresponds to the pad size designed on the printed circuit board.
请参考图2所示，为现有技术提供的第二晶振2的封装结构示意图，即第二晶振2自身的封装结构。所述第二晶振2包括第一焊盘21、第二焊盘22、第三焊盘23和第四焊盘24；其中，所述标号20表示第二晶振2的中心，标号25表示第二晶振2对应的印刷线路板上设计的焊盘大小。Please refer to FIG. 2 , which is a schematic diagram of the package structure of the second crystal oscillator 2 provided in the prior art, that is, the package structure of the second crystal oscillator 2 itself. The second crystal oscillator 2 includes a first bonding pad 21, a second bonding pad 22, a third bonding pad 23 and a fourth bonding pad 24; wherein, the label 20 indicates the center of the second crystal oscillator 2, and the label 25 indicates the second Crystal oscillator 2 corresponds to the pad size designed on the printed circuit board.
对于背景技术中出现的问题，如何让第一晶振和第二晶振兼容在一个封装里，以便该封装既可以对第一晶振进行贴片生产，又可对第二晶振进行贴片生产；针对前述技术问题，本发明提出了一种封装的制作方法。具体地，所述封装的制作方法包括焊盘制作和钢网制作步骤，其中，For the problems that arise in the background technology, how to make the first crystal oscillator and the second crystal oscillator compatible in one package, so that the package can not only carry out patch production for the first crystal oscillator, but also carry out patch production for the second crystal oscillator; for the aforementioned Technical problem, the present invention proposes a manufacturing method of packaging. Specifically, the manufacturing method of the package includes the steps of pad manufacturing and stencil manufacturing, wherein,
所述焊盘制作包括步骤：The making of the pad comprises the steps of:
S11、根据第二元器件的尺寸创建该器件的焊盘结构，所述焊盘结构的原点位置位于该器件的中心，并标注该器件的第一脚位置。具体请参考图3所示，第二元器件为前述的第二晶振2，创建的第二晶振2的焊盘结构与自身的结构相同，所述焊盘结构的原点位置位于该器件的中心30处，该器件的第一脚即第一焊盘31的位置用小圆圈37标注。其中，所述标号32、33和34分别表示第二晶振2的第二焊盘、第三焊盘和第四焊盘，标号35表示第二晶振2对应的印刷线路板上设计的焊盘大小。S11. Create the pad structure of the device according to the size of the second component, the origin of the pad structure is located at the center of the device, and mark the position of the first pin of the device. Please refer to FIG. 3 for details. The second component is the aforementioned second crystal oscillator 2. The pad structure of the created second crystal oscillator 2 is the same as its own structure. The origin of the pad structure is located at the center of the device 30 , the position of the first pin of the device, that is, the first pad 31 is marked with a small circle 37 . Wherein, the reference numerals 32, 33 and 34 represent the second pad, the third pad and the fourth pad of the second crystal oscillator 2 respectively, and the reference numeral 35 represents the size of the pad designed on the printed circuit board corresponding to the second crystal oscillator 2 .
S12、以第二元器件的中心为原点，保持与第二元器件的第一脚位置一致的基础上，根据第一元器件的尺寸创建该器件的焊盘结构。具体请参考图4所示，以第二晶振2的中心30为原点，并保持第一晶振1的第一焊盘41与第二晶振2的第一焊盘31位置一致的基础上，根据第一元器件即前述第一晶振1的焊盘大小15创建该器件的焊盘结构，形成第一焊盘41、第二焊盘42、第三焊盘43和第四焊盘44所示的第一晶振1的焊盘结构。至此，完成在第二晶振2的基础上创建第一晶振1的四个焊盘的步骤。S12. Taking the center of the second component as the origin, and on the basis of keeping the position of the first pin of the second component consistent, create a pad structure of the device according to the size of the first component. Please refer to FIG. 4 for details. Taking the center 30 of the second crystal oscillator 2 as the origin and keeping the first pad 41 of the first crystal oscillator 1 in the same position as the first pad 31 of the second crystal oscillator 2, according to the first A component, that is, the pad size 15 of the aforementioned first crystal oscillator 1 creates the pad structure of the device, forming the first pad 41, the second pad 42, the third pad 43 and the fourth pad 44 shown in the first pad structure. The pad structure of a crystal oscillator 1. So far, the steps of creating four pads of the first crystal oscillator 1 on the basis of the second crystal oscillator 2 are completed.
S13、用顶层金属皮将第一元器件焊盘结构的外形轮廓描绘出来，并删除第一元器件的焊盘结构，将第二元器件的焊盘结构与用于焊接第一元器件的顶层金属皮结构结合形成焊盘部分。具体请考图5所示，以第一元器件即第一晶振1的焊盘结构为基础，将第一晶振1的第一焊盘41、第二焊盘42、第三焊盘43和第四焊盘44的外形轮廓用顶层金属皮将其描绘出来形成顶层金属皮结构。作为优选的实施方式，所述顶层金属皮为顶层铜皮(TopCopper)，对应地，顶层铜皮结构包括第一顶层铜皮51、第二顶层铜皮52、第三顶层铜皮53和第四顶层铜皮54，以此代替第一晶振1的四个焊盘；然后再删除第一晶振1的四个焊盘即第一焊盘41、第二焊盘42、第三焊盘43和第四焊盘44；最后将第二元晶振的焊盘结构31、32、33、34与代替第一晶振焊盘结构的顶层铜皮结构51、52、53、54结合，形成如图6所示的焊盘部分，所述焊盘部分包括第一焊盘61、第二焊盘62、第三焊盘63和第四焊盘64；所述结合即是让第一晶振和第二晶振兼容在一个封装焊盘里，使其该封装焊盘既可以对第一晶振进行贴片生产，又可对第二晶振进行贴片生产。至此，实现对图4所示的八个焊盘的转变，使其转换成元器件晶振常见的四个焊盘，完成焊盘部分的制作。S13. Use the top metal skin to draw the outline of the pad structure of the first component, and delete the pad structure of the first component, and connect the pad structure of the second component with the top layer for welding the first component The metal skin structures are combined to form pad portions. Please refer to FIG. 5 for details. Based on the pad structure of the first component, that is, the first crystal oscillator 1, the first pad 41, the second pad 42, the third pad 43 and the first pad of the first crystal oscillator 1 are The contours of the four pads 44 are drawn with the top metal skin to form a top metal skin structure. As a preferred embodiment, the top layer metal skin is top layer copper skin (Top Copper), correspondingly, the top layer copper skin structure includes a first top layer copper skin 51, a second top layer copper skin 52, a third top layer copper skin 53 and a fourth top layer copper skin The top layer of copper skin 54 replaces the four pads of the first crystal oscillator 1; then delete the four pads of the first crystal oscillator 1, namely the first pad 41, the second pad 42, the third pad 43 and the first pad Four pads 44; finally, the pad structures 31, 32, 33, 34 of the second crystal oscillator are combined with the top layer copper skin structures 51, 52, 53, 54 replacing the pad structure of the first crystal oscillator, forming as shown in Figure 6 The pad part, the pad part includes the first pad 61, the second pad 62, the third pad 63 and the fourth pad 64; the combination is to make the first crystal oscillator and the second crystal oscillator compatible in One package pad is used to make the package pad not only for SMT production of the first crystal oscillator, but also for SMT production of the second crystal oscillator. So far, the eight pads shown in Figure 4 have been converted into four common pads for component crystal oscillators, and the production of the pads is completed.
在前述焊盘的制作具体实施例中，本发明的发明人研究发现，只要是顶层金属皮就能够和焊盘结合形成新的焊盘结构；优选地，所述顶层金属皮为顶层铜皮，并且铜皮可以为任何形状，而第一晶振和第二晶振的基础焊盘都是规则的焊盘，例如为正方型、长方型、圆形等规则形状，因此本发明要得到兼容且不规则的封装焊盘，只有跟不规则的铜皮结合，才能实现；因此，本发明优选用顶层铜皮结构来代替第一晶振的焊盘结构，与第二晶振的焊盘结构结合形成焊盘部分。如果不用顶层金属皮替换结合，而只是简单用一个焊盘的结构与另一焊盘的结构叠在一起，但它们仍然是两个引角(PIN)，而不是本发明所述的一个兼容焊盘所对应的一个引角(PIN)。In the specific embodiment of the aforementioned pad production, the inventors of the present invention found that as long as it is the top metal skin, it can be combined with the pad to form a new pad structure; preferably, the top metal skin is a top layer of copper skin, And the copper skin can be in any shape, and the basic pads of the first crystal oscillator and the second crystal oscillator are regular pads, such as square, rectangular, circular and other regular shapes, so the present invention should be compatible and not Regular packaging pads can only be realized by combining with irregular copper skins; therefore, the present invention preferably uses the top-layer copper skin structure to replace the pad structure of the first crystal oscillator, and combines with the pad structure of the second crystal oscillator to form a pad part. If the top layer of metal skin is not used to replace the combination, but the structure of one pad is simply stacked with the structure of another pad, but they are still two lead angles (PIN), rather than a compatible soldering described in the present invention. A leading angle (PIN) corresponding to the disk.
以下将对钢网制作进行说明：The stencil fabrication will be explained as follows:
在现有正常的钢网设计中，所述钢网的大小实际就是焊盘的大小，也就是说第一晶振1和第二晶振2的大小分别如图1和图2所示，但是现在焊盘的结构已结合成如图6所示的形状，因此，钢网制作的大小就不能与焊盘的大小一样，必须对该焊盘所对应的钢网结构进行改进。In the existing normal stencil design, the size of the stencil is actually the size of the pad, that is to say, the sizes of the first crystal oscillator 1 and the second crystal oscillator 2 are shown in Figure 1 and Figure 2 respectively, but now the solder The structure of the disc has been combined into the shape shown in Figure 6, therefore, the size of the stencil cannot be the same as the size of the pad, and the stencil structure corresponding to the pad must be improved.
具体地，钢网制作的作用是为生产流程中印刷线路板上焊锡用的，焊锡量的大小是与钢网的面积大小相同的，如果钢网的大小与焊盘的大小相同，当用料为第二晶振时，由于结合后的焊盘部分稍大于它本身的实体焊盘，也就是说焊锡量超过得很少，过高温炉时锡力也就很小，可以忽略不计，这样就不会对第二晶振的贴片生产产生影响。但是，当选用第一晶振用料时，由于结合后的焊盘部分比它本身的实体焊盘大许多(这是因为本发明的焊盘部分在制作时，以第二晶振的焊盘结构为基准设计的)，即钢网超出第一晶振的实体焊盘许多，导致回锡量过多，这样过高温炉时锡力就会产生影响，会导致第一晶振无规则的偏移，贴片生产完后不居中，东倒西歪，甚至还可能出现虚焊、短路等不良现象发生。如果所述第一晶振的封装尺寸大于第二晶振的封装尺寸，则本发明所述焊盘部分则会以第一晶振的焊盘结构为基准进行设计，所述第二晶振也会出现与所述第一晶振来料贴片生产时类似的不良情况和现象。Specifically, the role of stencil production is for soldering on printed circuit boards in the production process. The size of the amount of solder is the same as the area of the stencil. If the size of the stencil is the same as the size of the pad, when the material used When it is the second crystal oscillator, since the combined pad part is slightly larger than its own physical pad, that is to say, the amount of solder exceeds very little, and the tin force is very small when it is passed through a high-temperature furnace, which can be ignored, so that it will not It has an impact on the patch production of the second crystal oscillator. But, when selecting the first crystal vibration material for use, because the pad part after bonding is much larger than its own physical pad (this is because the pad part of the present invention is when making, the pad structure of the second crystal oscillator is Benchmark design), that is, the stencil exceeds the physical pad of the first crystal oscillator a lot, resulting in too much tin return, so that the tin force will have an impact when the furnace is overheated, which will cause the first crystal oscillator to shift irregularly, and the patch After production, it is not centered, swaying here and there, and even bad phenomena such as virtual welding and short circuit may occur. If the package size of the first crystal oscillator is larger than the package size of the second crystal oscillator, the pad part of the present invention will be designed based on the pad structure of the first crystal oscillator, and the second crystal oscillator will also appear different from the second crystal oscillator. Describe the similar adverse conditions and phenomena during the production of the first crystal oscillator incoming patch.
因此，发明人在前述分析和研究的基础上，对所述结合后的焊盘部分的钢网设计进行了改进，所述钢网制作包括步骤：Therefore, on the basis of the aforementioned analysis and research, the inventor has improved the design of the stencil of the bonded pad part, and the production of the stencil includes the steps of:
S14、将所述步骤S13描绘出来的顶层金属皮进行复制，形成同样大小的且属性为钢网层的金属皮，作为第一元器件钢网结构。作为优选的实施方式，所述顶层金属皮为顶层铜皮(TopCopper)，具体请参考图7所示，将如图5所示的第一顶层铜皮51、第二顶层铜皮52、第三顶层铜皮53和第四顶层铜皮54进行复制，形成同样大小的且属性为钢网层(PasteLayer)的铜皮，所述钢网层属性的铜皮包括第一钢网铜皮71、第二钢网铜皮72、第三钢网铜皮73和第四钢网铜皮74，将所述第一钢网铜皮71、第二钢网铜皮72、第三钢网铜皮73和第四钢网铜皮74作为第一晶振1的钢网结构。S14. Duplicate the top metal skin drawn in step S13 to form a metal skin with the same size and property as a stencil layer as the first component stencil structure. As a preferred embodiment, the top layer metal skin is top layer copper skin (Top Copper). Please refer to FIG. 7 for details. The first top layer copper skin 51, the second top layer copper skin 52, the third Top layer copper skin 53 and the 4th top layer copper skin 54 are duplicated, form the same size and the copper skin that property is steel net layer (PasteLayer), the copper skin of described steel net layer property comprises the first steel net copper skin 71, the second Two steel mesh copper skins 72, the third steel mesh copper skin 73 and the fourth steel mesh copper skin 74, the first steel mesh copper skin 71, the second steel mesh copper skin 72, the third steel mesh copper skin 73 and The fourth stencil copper skin 74 serves as the stencil structure of the first crystal oscillator 1 .
S15、以第一元器件钢网结构与第二元器件钢网结构的预设间距和第二元器件的焊盘结构为基础，创建属性为钢网层的金属皮，作为第二元器件钢网结构。具体请参考图7所示，在制作第二元器件即第二晶振的钢网结构之前，可以预设一个间距，作为钢网部分中第一元器件钢网结构和第二元器件钢网结构的焊锡连接间距；同时，所述第二元器件钢网结构以不超出第二元器件焊盘结构为准，由此创建属性为钢网层(PasteLayer)的金属皮，优选为铜皮，所述钢网层属性的铜皮包括第五钢网铜皮75、第六钢网铜皮76、第七钢网铜皮77和第八钢网铜皮78，将所述第五钢网铜皮75、第六钢网铜皮76、第七钢网铜皮77和第八钢网铜皮78作为第二元器件即第二晶振的钢网结构。S15. Based on the preset spacing between the steel mesh structure of the first component and the steel mesh structure of the second component and the pad structure of the second component, create a metal skin whose property is the steel mesh layer as the second component steel net structure. Please refer to Figure 7 for details. Before making the steel mesh structure of the second component, that is, the second crystal oscillator, a distance can be preset as the steel mesh structure of the first component and the steel mesh structure of the second component in the steel mesh part. The solder connection pitch; at the same time, the second component stencil structure shall not exceed the second component pad structure, thus creating a metal skin whose property is a stencil layer (PasteLayer), preferably a copper skin, so The copper skin of the stencil layer properties includes the fifth steel mesh copper skin 75, the sixth steel mesh copper skin 76, the seventh steel mesh copper skin 77 and the eighth steel mesh copper skin 78, the fifth steel mesh copper skin 75. The sixth stencil copper skin 76, the seventh stencil copper skin 77 and the eighth stencil copper skin 78 serve as the second component, that is, the stencil structure of the second crystal oscillator.
S16、将所述第二元器件钢网结构和第一元器件钢网结构结合形成钢网部分。具体请参考图8所示，将所述第二元器件钢网结构的第五钢网铜皮75、第六钢网铜皮76、第七钢网铜皮77和第八钢网铜皮78与所述第一元器件钢网结构的第一钢网铜皮71、第二钢网铜皮72、第三钢网铜皮73和第四钢网铜皮74结合形成钢网部分，所述钢网部分包括第一钢网81、第二钢网82、第三钢网83和第四钢网84。所述结合即是让第一元器件和第二元器件兼容在一个封装钢网里，使其该封装钢网既可以对第一晶振进行贴片生产，又可对第二晶振进行贴片生产。S16. Combining the second component stencil structure with the first component stencil structure to form a stencil part. Please refer to FIG. 8 for details. The fifth stencil copper skin 75, the sixth stencil copper skin 76, the seventh stencil copper skin 77 and the eighth stencil copper skin 78 of the second component stencil structure are Combined with the first stencil copper skin 71, the second stencil copper skin 72, the third stencil copper skin 73 and the fourth stencil copper skin 74 of the first component stencil structure to form a stencil part, the The stencil part includes a first stencil 81 , a second stencil 82 , a third stencil 83 and a fourth stencil 84 . The combination is to make the first component and the second component compatible in one packaging steel mesh, so that the packaging steel mesh can not only carry out patch production for the first crystal oscillator, but also carry out patch production for the second crystal oscillator .
至此，当采用如图8所示的钢网结构选用第一晶振用料时，相对于第一晶振自身来说，多余的焊锡面积就是第二晶振的四个钢网结构75、76、77和78了，但是该钢网结构中已用预设间距将第一晶振自身所需的焊锡量和第二晶振隔开了，这样当选用第一晶振来料进行贴片生产时，就不会再有偏位了。所以，不管选用第一晶振还是第二晶振来料贴片生产时，都不会有不良情况和现象出现了。So far, when the steel mesh structure shown in Figure 8 is used to select the material for the first crystal oscillator, relative to the first crystal oscillator itself, the redundant solder area is the four steel mesh structures 75, 76, 77 and 78, but the stencil structure has used the preset spacing to separate the amount of solder required for the first crystal oscillator itself from the second crystal oscillator, so that when the first crystal oscillator is selected for SMT production, there will be no more There is a bias. Therefore, no matter whether the first crystal oscillator or the second crystal oscillator is selected for SMT production, there will be no adverse situations and phenomena.
作为具体的实施例，所述第一晶振的钢网结构与第一晶振的焊盘结构相同，所述第二晶振的钢网结构75、76、77、78的内侧701与第一晶振的钢网结构间距设置，外侧702与第二晶振的焊盘结构边缘重叠；即第二晶振的钢网的内侧701与第一晶振的钢网结构保持了一定的防焊锡连接间距，外侧702与第二晶振自身的焊盘结构边缘重叠。As a specific example, the steel mesh structure of the first crystal oscillator is the same as the pad structure of the first crystal oscillator, and the inner side 701 of the steel mesh structure 75, 76, 77, 78 of the second crystal oscillator is the same as the steel mesh structure of the first crystal oscillator. The mesh structure spacing is set, and the outer side 702 overlaps with the edge of the pad structure of the second crystal oscillator; that is, the inner side 701 of the steel mesh of the second crystal oscillator and the steel mesh structure of the first crystal oscillator maintain a certain solder-proof connection distance, and the outer side 702 and the second The pad structure edges of the crystal itself overlap.
作为优选的实施方式，所述第二晶振的钢网结构的内侧701与第一晶振的钢网结构的间距距离大于等于0.15毫米，从而可以有效的防止第二晶振钢网结构上的焊锡与第一晶振自身所需要的焊锡连接，保证第一晶振能有效的焊接。As a preferred embodiment, the distance between the inner side 701 of the steel mesh structure of the second crystal oscillator and the steel mesh structure of the first crystal oscillator is greater than or equal to 0.15 millimeters, thereby effectively preventing the solder on the steel mesh structure of the second crystal oscillator from interfering with the first crystal oscillator. The solder connection required by a crystal oscillator itself ensures that the first crystal oscillator can be soldered effectively.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. within range.
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| CN101925262A (en) * | 2010-08-02 | 2010-12-22 | 深圳和而泰智能控制股份有限公司 | Steel mesh and PCB (Printed Circuit Board) |
| US7859119B1 (en) * | 2003-11-10 | 2010-12-28 | Amkor Technology, Inc. | Stacked flip chip die assembly |
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