CN103289315A - Composite material, dielectric substance based on composite material and manufacturing method of composite material - Google Patents
Composite material, dielectric substance based on composite material and manufacturing method of composite material Download PDFInfo
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Abstract
The invention discloses a composite material which comprises a parent material, metal particles with high dielectric constants and an organic high-molecular material wrapping the metal particles, wherein the metal particles and the organic high-molecular material form a core-shell structure; the parent material and the organic high-molecular material are insoluble in each other; and the core-shell structure is dispersedly distributed and embedded into the parent material. The core-shell structure takes the metal particles with high dielectric constants as a core and an organic high-molecular film as a shell; and the core-shell structure and the parent material solution are mixed according to a certain proportion to obtain a viscose solution, and then the viscose solution is dried and cured so that the core-shell structure is irregularly and dispersedly distributed and embedded into the parent material, thus the loss of the formed composite material and the dielectric substance based on the composite material can be reduced by over 50%. The invention also provides a dielectric substance based on the composite material with high dielectric constants and low loss and a manufacturing method of the composite material.
Description
Technical field
The present invention relates to field of compound material, relate in particular to a kind of high-k, low-loss matrix material, based on medium substrate and the manufacture method thereof of matrix material.
Background technology
In communication system, the size of electronic devices and components progressively develops towards high effect, multi-functional and small size direction, and this performance to high frequency material proposes higher demand.The hyundai electronics information products are the high speed development of microwave radio device particularly, and application requiring such as integrated level raising greatly and digitizing, high frequencyization, multifunction have proposed challenge to general PTFE high frequency plate and manufacturing process.
High frequency material in the market mainly contains PTFE substrate, thermoset PPO, crosslinked polyhutadiene substrate and Resins, epoxy composite base plate.The demand of its specific inductivity, dielectric loss and processability three coupling is very urgent.The organic composite substrate material generally is the inorganic oxide ceramic particle to be evenly spread to make composite substrate in the organic polymer material.Inorganic oxide has higher dielectric constant, and organic polymer material has good formability and processability, in conjunction with the two advantage, just can obtain specific inductivity at higher range, the good matrix material of while processability.
Because of the raw-material restriction of choosing, existing organic polymer-oxide ceramics matrix material can not obtain higher dielectric constant, and dielectric loss is also bigger.Yet, common high dielectric organic polymer-oxide ceramics matrix material usually by the macromolecular material that specific inductivity is lower, loss is bigger such as Resins, epoxy, resol, tetrafluoroethylene and specific inductivity big but loss also higher ferroelectric ceramic grain form.In order to guarantee the workability of material, the content of resin can not be too low, namely is that the content of the ferroelectric ceramic(s) of high-k can not be too high, and this just causes the specific inductivity of matrix material not high.Simultaneously, the high loss of macromolecular material component and ferroelectric ceramic material component also can cause the higher loss of matrix material.
Summary of the invention
Based on this, in order to solve existing matrix material and based on the not high and loss technical problems of high of specific inductivity of matrix material medium substrate, therefore to provide a kind of based on high-k, low-loss matrix material.
The present invention also provides a kind of medium substrate based on high-k, low-loss composite wood.
Simultaneously, the present invention also provides a kind of manufacture method of matrix material.
A kind of matrix material comprises the metal particle of fertile material, high-k and wraps up the organic polymer material of described metal particle; Described metal particle and organic polymer material form nucleocapsid structure, and described fertile material and organic polymer material are immiscible; Described nucleocapsid structure distributes discretely and is embedded in the described fertile material.
Further, described fertile material is macromolecular material, selects in Resins, epoxy, polyolefine, polyacrylate(s), polysiloxane-based and multipolymer or the blend any one for use.
Further, the particle diameter of described metal particle is between 0.1um-2um.
Further, described metal particle comprise copper, nickel, plug with molten metal, in lead, zinc, antimony, mercury, cadmium, aluminium, magnesium, calcium, potassium, gold and silver, copper, strontium, barium and the bismuth any one.
Further, described metal particle comprises that the alloy material by single metal material, metallic compound or at least a metallic substance makes.
Further, described metal particle is coated with promoting agent on the surface, and organic polymer material is adsorbed on the tensio-active agent to form described nucleocapsid structure by chemical bond or hydrogen bond etc.
Further, described organic polymer material is selected any one in polystyrene (PS) or the polymethylmethacrylate (PMMA) for use.
A kind of medium substrate based on matrix material comprises a conductive foil and the matrix material that depends on the described conductive foil; Described matrix material comprises the metal particle of fertile material, high-k and wraps up the organic polymer material of described metal particle; Described metal particle and organic polymer material form nucleocapsid structure, and described fertile material and organic polymer material are immiscible; Described nucleocapsid structure distributes discretely and is embedded in the described fertile material.
Further, described conductive foil selects any one in Copper Foil, silver foil or the goldleaf.
A kind of manufacture method of matrix material comprises the steps:
The normal metal of high dielectric is processed into metal particle;
Metal particle is coated with the machine macromolecular material, forms nucleocapsid structure;
Above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage;
Dry and solidify above-mentioned viscosity solution and form matrix material.
By adopting above-mentioned high-k, low-loss matrix material complete processing and based on above-mentioned matrix material, and join in the polymer fertile material with relative simple ceramic powder and to compare, the present invention is that nuclear, organic high molecular layer are the nucleocapsid structure of shell with the metal particle of high-k, and above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage; Dry then and solidify described viscosity solution and make random the distribution discretely of described nucleocapsid structure be embedded in the described fertile material, the loss that reaches based on the medium substrate of matrix material of the matrix material of Xing Chenging can reduce more than 50% like this.Make the demand that medium substrate just satisfies existing electronics.
Description of drawings
Fig. 1 is the synoptic diagram of high-k of the present invention, low-loss matrix material one embodiment;
Fig. 2 is the synoptic diagram of high-k of the present invention, another embodiment of low-loss matrix material;
Fig. 3 is for being processed into the synoptic diagram of medium substrate one embodiment of single face Copper Foil based on matrix material shown in Figure 1;
Fig. 4 is for being processed into the synoptic diagram of another embodiment of medium substrate of two-sided Copper Foil based on matrix material shown in Figure 1;
Fig. 5 is nucleocapsid structure forming process synoptic diagram in this matrix material;
Fig. 6 is the manufacturing process flow diagram of high-k of the present invention, low-loss matrix material;
Fig. 7 is the embodiment process flow sheet that medium substrate shown in Figure 4 is made;
Fig. 8 is another embodiment process flow sheet that medium substrate shown in Figure 4 is made.
Embodiment
The present middle embodiment that describes in detail with reference to the accompanying drawings.For complete understanding the present invention, numerous details have been mentioned in the following detailed description.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In other embodiments, be not described in detail known method.Process, assembly and circuit are in order to avoid unnecessarily make embodiment fuzzy.
Please refer to Fig. 1, be the synoptic diagram of high-k of the present invention, low-loss matrix material one embodiment.Described matrix material 10 comprises the metal particle 103 of fertile material 101, high-k and wraps up the organic polymer material 102 of the metal particle 103 of described high-k.The metal particle 103 of described high-k and organic polymer material 102 form nucleocapsid structure 11, and described nucleocapsid structure 11 random distributions discretely are embedded in the described fertile material 101.Described matrix material 10 do not dry and solidify before be the macromolecular solution of certain viscosity.In the present invention, described metal particle 103 comprises that the alloy material by single metal material, metallic compound or at least a metallic substance makes.Described single metal material includes but not limited to copper, nickel, plugs with molten metal, lead, zinc, antimony, mercury, cadmium, aluminium, magnesium, calcium, potassium, gold and silver, copper, strontium, barium and bismuth.Metallic compound refers to mutual chemical action be taken place and formed a kind of material with metallic character by at least a metallic element and other arbitrary elements, as aluminium sesquioxide etc.Alloy material refers to be mixed with other arbitrary elements by at least a metallic element and forms a kind of material with metallic character.
Described fertile material 101 is macromolecular material, includes but not limited to Resins, epoxy, polyolefine, polyacrylate(s), polysiloxane-based and multipolymer or blend.
In the present embodiment, by adopting high dielectric ceramic material to grind into the metal particle 103 of described high-k, the particle diameter of the metal particle 103 of each high-k is between 0.05um-4um, wherein preferably between the particle diameter 0.1um-2um of the metal particle 103 of high-k.
See also Fig. 5, form organic polymer material 102 in order to make on metal particle 103 surfaces of high-k, at first be coated with promoting agent 104 with metal particle 103 surface modifications of high-k on metal particle 103 surfaces of high-k, organic polymer material 102 is adsorbed on the tensio-active agent 104 by chemical bond or hydrogen bond etc. then.
Described organic polymer material 102 can be selected the immiscible organic polymer material of various and fertile material 101 for use, in the course of processing, should select different corresponding materials according to different process.In the present embodiment, organic polymer material 102 is selected polystyrene (PS) or polymethylmethacrylate (PMMA) for use.
Please refer to Fig. 2, is the synoptic diagram of high-k of the present invention, another embodiment of low-loss matrix material.Described nucleocapsid structure 11 disperses and distributes equably and is embedded in the described fertile material 101.Described matrix material 10 do not dry and solidify before be the macromolecular solution of certain viscosity.
Please refer to Fig. 3, for be processed into the synoptic diagram of medium substrate one embodiment based on described matrix material.Described medium substrate 8 comprises a conductive foil 13 and the matrix material 10 that depends on the described conductive foil 13.In the present embodiment, described conductive foil 13 preferred Copper Foils.In other embodiments, described conductive foil 13 is selected silver foil or goldleaf.
Please refer to Fig. 4, for be processed into the synoptic diagram of another embodiment of medium substrate based on described matrix material.Described medium substrate 8 comprises first conductive foil 11, second conductive foil 13 and is sandwiched in the matrix material 10 of described first conductive foil 11 and second conductive foil 13.In the present embodiment, described first conductive foil 11 and second conductive foil, 13 preferred Copper Foils.In other embodiments, described first conductive foil 11 and second conductive foil, 13 silver foil or goldleaf.Also be referred to as veneer sheet at medium substrate 8 of the present invention, can further be applied to antenna substrate, pcb board, copper-clad base plate, chip carrier spare or similar application part.
Introduce above-mentioned high-k, low-loss matrix material below and make medium substrate based on high-k, low-loss composite technology:
See also Fig. 6, be the manufacturing process flow diagram of high-k of the present invention, low-loss matrix material.Described matrix material work flow is as follows:
Step 21: the normal metal of high dielectric is processed into metal particle.In this step, by high dielectric metal being ground into the metal particle of described high-k, the particle diameter of the metal particle of each high-k is between 0.05um-4um, wherein preferably between the particle diameter 0.1um-2um of the metal particle of high-k.In the present invention, described metal particle 103 comprises that the alloy material by single metal material, metallic compound or at least a metallic substance makes.Described single metal material includes but not limited to copper, nickel, plugs with molten metal, lead, zinc, antimony, mercury, cadmium, aluminium, magnesium, calcium, potassium, gold and silver, copper, strontium, barium and bismuth.Metallic compound refers to mutual chemical action be taken place and formed a kind of material with metallic character by at least a metallic element and other arbitrary elements, as aluminium sesquioxide etc.Alloy material refers to be mixed with other arbitrary elements by at least a metallic element and forms a kind of material with metallic character.
Step 23: metal particle is coated with the machine macromolecular material, forms nucleocapsid structure.In the present embodiment, at first be coated with promoting agent with the metal particle surface modification of high-k on the metal particle surface that high-k is made pottery, organic polymer material is adsorbed on the tensio-active agent to form nucleocapsid structure by chemical bond or hydrogen bond etc. then.
Step 25: above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage.Nucleocapsid structure and fertile material solution proportionally mix and stir, and make it to become the liquid of viscosity.In the present embodiment, described fertile material is macromolecular material, include but not limited to Resins, epoxy, polyolefine, polyacrylate(s), polysiloxane-based and multipolymer or blend, and not by dried or cured means, described fertile material liquid state.
Step 27: dry and solidify above-mentioned viscosity solution and form high-k of the present invention, low-loss matrix material.In the present embodiment, between the temperature of oven dry, solidification process is controlled 50～100 ℃; And its oven dry, curing employing industry common method and equipment.
See also Fig. 8, be an embodiment process flow sheet of medium substrate manufacturing of the present invention.Described medium substrate work flow is as follows:
Step 31: the normal metal of high dielectric is processed into metal particle.In this step, by high dielectric metal being ground into the metal particle of described high-k, the particle diameter of the metal particle of each high-k is between 0.05um-4um, wherein preferably between the particle diameter 0.1um-2um of the metal particle of high-k.Wherein in the present invention, described metal particle 103 comprises that the alloy material by single metal material, metallic compound or at least a metallic substance makes.Described single metal material includes but not limited to copper, nickel, plugs with molten metal, lead, zinc, antimony, mercury, cadmium, aluminium, magnesium, calcium, potassium, gold and silver, copper, strontium, barium and bismuth.Metallic compound refers to mutual chemical action be taken place and formed a kind of material with metallic character by at least a metallic element and other arbitrary elements, as aluminium sesquioxide etc.Alloy material refers to be mixed with other arbitrary elements by at least a metallic element and forms a kind of material with metallic character.
Step 33: metal particle is coated with the machine macromolecular material, forms nucleocapsid structure.In the present embodiment, at first be coated with promoting agent with the metal particle surface modification of high-k on the metal particle surface that high-k is made pottery, organic polymer material is adsorbed on the tensio-active agent to form nucleocapsid structure by chemical bond or hydrogen bond etc. then.
Step 35: above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage.Nucleocapsid structure and fertile material solution proportionally mix and stir, and make it to become viscosity solution.In the present embodiment, described fertile material is macromolecular material, include but not limited to Resins, epoxy, polyolefine, polyacrylate(s), polysiloxane-based and multipolymer or blend, and not by dried or cured means, described fertile material liquid state.
Step 37: first conductive foil is provided, with the viscosity solution coat on first conductive foil.In the present embodiment, described first conductive foil 11 selects Copper Foil, then industry solution coat method and apparatus commonly used with the viscosity solution coat on Copper Foil one surface.In other embodiments, described first conductive foil 11 can be selected silver foil or goldleaf for use.
Step 38: dry and solidify above-mentioned viscosity solution formation single face and cover the conductive foil medium substrate.In the present embodiment, between the temperature of oven dry, solidification process is controlled 50～100 ℃; And its oven dry, curing employing industry common method and equipment.
Step 39: will cover the first conductive foil medium substrate and the second conductive foil pressing, and form the two-sided medium substrate that covers conductive foil.The described first conductive foil medium substrate refers to matrix material oven dry on first conductive foil and solidify to form single face cover the conductive foil medium substrate.
See also Fig. 8, be another embodiment process flow sheet of medium substrate manufacturing of the present invention.Described medium substrate work flow is as follows:
Step 41: the normal metal of high dielectric is processed into metal particle.In this step, by high dielectric metal being ground into the metal particle of described high-k, the particle diameter of the metal particle of each high-k is between 0.05um-4um, wherein preferably between the particle diameter 0.1um-2um of the metal particle of high-k.In the present invention, described metal particle 103 comprises that the alloy material by single metal material, metallic compound or at least a metallic substance makes.Described single metal material includes but not limited to copper, nickel, plugs with molten metal, lead, zinc, antimony, mercury, cadmium, aluminium, magnesium, calcium, potassium, gold and silver, copper, strontium, barium and bismuth.Metallic compound refers to mutual chemical action be taken place and formed a kind of material with metallic character by at least a metallic element and other arbitrary elements, as aluminium sesquioxide etc.Alloy material refers to be mixed with other arbitrary elements by at least a metallic element and forms a kind of material with metallic character.
Step 43: metal particle is coated with the machine macromolecular material, forms nucleocapsid structure.In the present embodiment, at first be coated with promoting agent with the metal particle surface modification of high-k on the metal particle surface that high-k is made pottery, organic polymer material is adsorbed on the tensio-active agent to form nucleocapsid structure by chemical bond or hydrogen bond etc. then.
Step 45: above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage.Nucleocapsid structure and fertile material solution proportionally mix and stir, and make it to become viscosity solution.In the present embodiment, described fertile material is macromolecular material, include but not limited to Resins, epoxy, polyolefine, polyacrylate(s), polysiloxane-based and multipolymer or blend, and not by dried or cured means, described fertile material liquid state.
Step 47: first conductive foil is provided, with the viscosity solution coat on first conductive foil.In the present embodiment, described first conductive foil 11 selects Copper Foil, then industry solution coat method and apparatus commonly used with the viscosity solution coat on Copper Foil one surface.In other embodiments, described first conductive foil 11 can be selected silver foil or goldleaf for use.
Step 48: dry and solidify above-mentioned viscosity solution formation single face and cover the conductive foil medium substrate.In the present embodiment, between the temperature of oven dry, solidification process is controlled 50～100 ℃; And its oven dry, curing employing industry common method and equipment.
Step 49: will cover the first conductive foil medium substrate and the second conductive foil pressing, and form the two-sided medium substrate that covers conductive foil.The described first conductive foil medium substrate that covers refers to matrix material oven dry on first conductive foil and solidify to form single face cover the conductive foil medium substrate.The two-sided medium substrate that covers conductive foil refers to cover the first conductive foil medium substrate and the second conductive foil pressing forms the two-sided medium substrate that covers conductive foil with described.
By adopting above-mentioned high-k, low-loss matrix material complete processing and based on above-mentioned matrix material, and join in the polymer fertile material with relative simple ceramic powder and to compare, the present invention is that nuclear, organic high molecular layer are the nucleocapsid structure of shell with the metal particle of high-k, and above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage; Dry then and solidify described viscosity solution and make random the distribution discretely of described nucleocapsid structure be embedded in the described fertile material, the loss that reaches based on the medium substrate of matrix material of the matrix material of Xing Chenging can reduce more than 50% like this.Make the demand that medium substrate just satisfies existing electronics.
By reference to the accompanying drawings embodiments of the invention are described above; but the present invention is not limited to above-mentioned embodiment; above-mentioned embodiment only is schematic; rather than it is restrictive; those of ordinary skill in the art is under enlightenment of the present invention; not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (10)
1. a matrix material is characterized in that, comprises the metal particle of fertile material, high-k and wraps up the organic polymer material of described metal particle; Described metal particle and organic polymer material form nucleocapsid structure, and described fertile material and organic polymer material are immiscible; Described nucleocapsid structure distributes discretely and is embedded in the described fertile material.
2. matrix material according to claim 1, it is characterized in that: described fertile material is macromolecular material, selects in Resins, epoxy, polyolefine, polyacrylate(s), polysiloxane-based and multipolymer or the blend any one for use.
3. matrix material according to claim 1 and 2, it is characterized in that: the particle diameter of described metal particle is between 0.1um-2um.
4. matrix material according to claim 3 is characterized in that: described metal particle comprises copper, nickel, plugs with molten metal, in lead, zinc, antimony, mercury, cadmium, aluminium, magnesium, calcium, potassium, gold and silver, copper, strontium, barium and the bismuth any one.
5. matrix material according to claim 3, it is characterized in that: described metal particle comprises that the alloy material by single metal material, metallic compound or at least a metallic substance makes.
6. according to claim 4 or 5 described matrix materials, it is characterized in that: described metal particle is coated with promoting agent on the surface, and organic polymer material is adsorbed on the tensio-active agent to form described nucleocapsid structure by chemical bond or hydrogen bond etc.
7. matrix material according to claim 6, it is characterized in that: described organic polymer material is selected any one in polystyrene (PS) or the polymethylmethacrylate (PMMA) for use.
8. the medium substrate based on matrix material comprises a conductive foil and the matrix material that depends on the described conductive foil; Described matrix material comprises the metal particle of fertile material, high-k and wraps up the organic polymer material of described metal particle; Described metal particle and organic polymer material form nucleocapsid structure, and described fertile material and organic polymer material are immiscible; Described nucleocapsid structure distributes discretely and is embedded in the described fertile material.
9. matrix material according to claim 8, it is characterized in that: described conductive foil selects any one in Copper Foil, silver foil or the goldleaf.
10. the manufacture method of a matrix material, it is characterized in that: described manufacture method comprises the steps:
The normal metal of high dielectric is processed into metal particle;
Metal particle is coated with the machine macromolecular material, forms nucleocapsid structure;
Above-mentioned nucleocapsid structure and fertile material solution are hybridly prepared into viscosity solution according to a certain percentage;
Dry and solidify above-mentioned viscosity solution and form matrix material.
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| JP2017095694A (en) * | 2015-11-20 | 2017-06-01 | ゼロックス コーポレイションＸｅｒｏｘ Ｃｏｒｐｏｒａｔｉｏｎ | Three phase immiscible polymer-metal blends for high conductivity composites |
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