CN103286425A - Welding device for producing array framework and chip of high-power tube - Google Patents
Welding device for producing array framework and chip of high-power tube Download PDFInfo
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- CN103286425A CN103286425A CN2013102814052A CN201310281405A CN103286425A CN 103286425 A CN103286425 A CN 103286425A CN 2013102814052 A CN2013102814052 A CN 2013102814052A CN 201310281405 A CN201310281405 A CN 201310281405A CN 103286425 A CN103286425 A CN 103286425A
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- support film
- bonding device
- power valve
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Abstract
A welding device for producing a chip of a high-power tube comprises a workbench, an automatic film support device, a chip taking device, a chip conveying device and a chip welding device, wherein the automatic film support device, the chip taking device, the chip conveying device and the chip welding device are arranged on the workbench. According to the invention, automatic welding for the production of the chip of the high-power tube is realized, a production efficiency problem is solved, operating costs of enterprises are lowered, and stability of product quality is increased.
Description
Technical field
The present invention relates to a kind of welder of chip, particularly a kind of production high power valve die-bonding device.
Background technology
High power transistor is mainly used in the Switching Power Supply of household electrical appliance, as colour TV, computer, electromagnetic oven etc., also has car electrics, as igniter for automobile etc., and industrial electrical equipment such as PLC power supply, servo controller, frequency converter, pressure regulator, chopper, DC welder etc.The high power transistor chips welding is welding by hand generally, manual welding chip inefficiency, and same time power consumption is big, and protective gas (hydrogen and nitrogen gas body) waste is also corresponding bigger, and operation cost is also bigger, and of low quality, and yield rate is low.
Chinese patent (publication number 202219366U) the utility model discloses a kind of device of producing the high power valve chip.The purpose of this utility model provides a kind of automated production, production efficiency height, saves the device of the high power valve chip of operation cost of enterprises and constant product quality.Formations such as the utility model workbench, material loading portion, tin silk portion, integer portion, image pickup part, prominent top, crawl section, trucking department, blanking portion, the utility model is mainly used in encapsulating factory and produces the power tube device.
Above-mentioned open file is disclosed a kind of device of producing the high power valve chip, higher in the error rate of tin silk portion and crawl section.
Summary of the invention
The present invention provides a kind of production high power valve die-bonding device in order to overcome the problem of above-mentioned existence.
Technical scheme of the present invention is achieved in that a kind of production high power valve die-bonding device, includes workbench, supports film device, chip pickup apparatus, chip transportation device and die-bonding device automatically; Described automatic support film device, chip pickup apparatus chip transportation device and die-bonding device all are arranged on the workbench; Described automatic support film device comprises X-direction motion, Y-direction motion, support film platform, cylinder, support zona spare and support film parts, and described Y-direction motion is arranged on the X-direction motion; On described support film platform installation and the Y-direction motion; Described support zona spare is arranged on the support film platform, is respectively arranged with a cylinder on the corner around the described support film platform, and the corner is corresponding respectively around the described support film parts is connected with each cylinder, and the top of described support zona spare is set in the support film machine; Described chip pickup apparatus includes bin, cylinder, grabbing device and motor, and described motor is connected with cylinder by screw rod, and cylinder is connected with grabbing device, is provided with bin under the grabbing device; Described chip transportation device includes delivery track, propulsion plant and motor, and a side of described delivery track below is equipped with motor, and this motor is connected with propulsion plant by belt gear, and described propulsion plant is installed on the delivery track; Described die-bonding device includes welded rails, propulsion plant, motor, welding gun and pressuring flat device, one side of described welded rails bottom is equipped with motor, this motor is connected with propulsion plant by belt gear, the other end of described welded rails bottom is equipped with heating bar, and described welding gun and pressuring flat device are fixed on the track top.
Described workbench is provided with console.
Described X-direction motion, Y-direction motion servomotor is in transmission connection mutually.
Described track below is provided with heating bar.
The heating-up temperature of described heating rod is normal temperature to 500 ℃.
Described welded rails is the closed type track.
Described welded rails below is provided with the air inlet of protective gas.
Described protective gas is the mist of hydrogen and nitrogen, and ratio is 1:9.
Described welding gun is made up of frame, welding wire wheel, arc welding gun head and motor, motor is arranged in the frame and controls welding gun and move in Z-direction, the welding wire wheel is arranged on engine body exterior, and on the welding wire wheel welding wire is housed, and this welding wire passes arc welding gun head by the perforation on arc welding gun head top.
Described pressuring flat device includes motor, body and flattens the rifle head, and motor is arranged in the body, and the control pressuring flat device moves in Z-direction and flattens the rifle head and be installed in engine body exterior.
The present invention has realized producing the automatic welding of high power valve chip, has solved the problem of production efficiency, has reduced the operation cost of enterprise, has improved the stability of product quality.
Description of drawings
Fig. 1 is structural representation of the present invention.
The specific embodiment
As shown in Figure 1, a kind of production high power valve die-bonding device includes workbench, servomotor, supports film device, chip pickup apparatus, framework conveying arrangement and die-bonding device automatically; Described automatic support film device,, chip pickup apparatus framework conveying arrangement and die-bonding device all be arranged on the workbench; Described servomotor, support film device automatically and comprise X-direction motion, Y-direction motion, support film platform, cylinder, support zona spare and support film parts, described Y-direction motion is arranged on the X-direction motion, described X-direction motion, Y-direction motion servomotor is in transmission connection mutually; On described support film platform installation and the Y-direction motion; Described support zona spare is arranged on the support film platform, is respectively arranged with a cylinder on the corner around the described support film platform, and the corner is corresponding respectively around the described support film parts is connected with each cylinder, and the top of described support zona spare is set in the support film machine; Described chip pickup apparatus includes bin, cylinder, grabbing device and motor, and described motor is connected with cylinder by screw rod, and cylinder is connected with grabbing device, is provided with bin under the grabbing device; Described framework conveying arrangement includes delivery track, propulsion plant and motor, and a side of described delivery track below is equipped with motor, and this motor is connected with propulsion plant by belt gear, and described propulsion plant is installed on the delivery track; Described die-bonding device includes welded rails, propulsion plant, motor, welding gun and pressuring flat device, one side of described welded rails bottom is equipped with motor, this motor is connected with propulsion plant by belt gear, the other end of described welded rails bottom is equipped with heating bar, and described welding gun and pressuring flat device install and fix in orbit; Described welded rails below is provided with heating bar; The heating-up temperature of described heating rod is 500 ℃ of normal temperature; Described welded rails is the closed type track; Described welded rails below is provided with the air inlet of protective gas, and described protective gas is the mist of hydrogen and nitrogen; Described workbench is provided with console; Described X-direction motion, Y-direction motion servomotor is in transmission connection mutually; Described welding gun is made up of frame, welding wire wheel, arc welding gun head and motor, motor is arranged in the frame and controls welding gun and move in Z-direction, the welding wire wheel is arranged on engine body exterior, and on the welding wire wheel welding wire is housed, and this welding wire passes arc welding gun head by the perforation on arc welding gun head top; Described pressuring flat device includes motor, body and flattens the rifle head, and motor is arranged in the body, and the control pressuring flat device moves in Z-direction and flattens the rifle head and be installed in engine body exterior.
Claims (10)
1. produce the high power valve die-bonding device for one kind, it is characterized in that: include workbench, support film device, chip pickup apparatus, framework conveying arrangement and die-bonding device automatically; Described automatic support film device,, chip pickup apparatus chip transportation device and die-bonding device all be arranged on the workbench; Described automatic support film device comprises X-direction motion, Y-direction motion, support film platform, cylinder, support zona spare and support film parts, and described Y-direction motion is arranged on the X-direction motion; On described support film platform installation and the Y-direction motion; Described support zona spare is arranged on the support film platform, is respectively arranged with a cylinder on the corner around the described support film platform, and the corner is corresponding respectively around the described support film parts is connected with each cylinder, and the top of described support zona spare is set in the support film machine; Described chip pickup apparatus includes bin, cylinder, grabbing device and motor, and described motor is connected with cylinder by screw rod, and cylinder is connected with grabbing device, is provided with bin under the grabbing device; Described framework conveying arrangement includes delivery track, propulsion plant and motor, and a side of described delivery track below is equipped with motor, and this motor is connected with propulsion plant by belt gear, and described propulsion plant is installed on the delivery track; Described die-bonding device includes welded rails, propulsion plant, motor, welding gun and pressuring flat device, one side of described welded rails bottom is equipped with motor, this motor is connected with propulsion plant by belt gear, the other end of described welded rails bottom is equipped with heating bar, and described welding gun and pressuring flat device are fixed on the track top.
2. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: described workbench is provided with console.
3. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: described X-direction motion, Y-direction motion servomotor is in transmission connection mutually.
4. a kind of production high power valve die-bonding device according to claim 1 is characterized in that: be provided with heating bar below the described track.
5. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: the heating-up temperature of described heating rod is 500 ℃ of normal temperature.
6. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: described welded rails is the closed type track.
7. a kind of production high power valve die-bonding device according to claim 1 is characterized in that: the air inlet that is provided with protective gas below the described welded rails.
8. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: described protective gas is the mist of hydrogen and nitrogen.
9. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: described welding gun is made up of frame, welding wire wheel, arc welding gun head and motor, motor is arranged in the frame and controls welding gun and move in Z-direction, the welding wire wheel is arranged on engine body exterior, and on the welding wire wheel welding wire is housed, this welding wire passes arc welding gun head by the perforation on arc welding gun head top.
10. a kind of production high power valve die-bonding device according to claim 1, it is characterized in that: described pressuring flat device includes motor, body and flattens the rifle head, motor is arranged in the body, and the control pressuring flat device moves in Z-direction and flattens the rifle head and be installed in engine body exterior.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310281405.2A CN103286425B (en) | 2013-07-05 | 2013-07-05 | A kind of array framework and die-bonding device of producing high power valve |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310281405.2A CN103286425B (en) | 2013-07-05 | 2013-07-05 | A kind of array framework and die-bonding device of producing high power valve |
Publications (2)
| Publication Number | Publication Date |
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| CN103286425A true CN103286425A (en) | 2013-09-11 |
| CN103286425B CN103286425B (en) | 2016-05-18 |
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| CN201310281405.2A Active CN103286425B (en) | 2013-07-05 | 2013-07-05 | A kind of array framework and die-bonding device of producing high power valve |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531505A (en) * | 2013-10-12 | 2014-01-22 | 四川蓝彩电子科技有限公司 | Wafer assembly system |
| CN104084659A (en) * | 2014-07-02 | 2014-10-08 | 施文桦 | Production method for preparing transistor through hot-gas welding |
| CN110919214A (en) * | 2019-12-05 | 2020-03-27 | 珠海东精大电子科技有限公司 | Crystal oscillator's encapsulation equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909837A (en) * | 1997-05-09 | 1999-06-08 | Quad Systems Corporation | Contactless bonding tool heater |
| CN1835197A (en) * | 2005-03-15 | 2006-09-20 | 三星电子株式会社 | Chip welding device and method using same |
| CN102294526A (en) * | 2011-07-25 | 2011-12-28 | 揭阳市宏乾电子有限公司 | Welding method for producing high-power tube chips and device thereof |
| CN102554388A (en) * | 2010-10-29 | 2012-07-11 | 株式会社日立高新技术仪器 | Chip bonding device, chip bonding method and chip bonding quality evaluation equipment |
| US8240541B2 (en) * | 2010-10-29 | 2012-08-14 | Samsung Electronics Co., Ltd. | Apparatus for mounting semiconductor chip |
| CN202772117U (en) * | 2012-08-31 | 2013-03-06 | 佛山市南海区宏乾电子有限公司 | Automatic film distraction device of full-automatic die bonding machine |
| CN102990255A (en) * | 2011-09-16 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| CN103182577A (en) * | 2013-01-21 | 2013-07-03 | 广州市明森机电设备有限公司 | Chip welding method of dual-interface card and equipment thereof |
-
2013
- 2013-07-05 CN CN201310281405.2A patent/CN103286425B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909837A (en) * | 1997-05-09 | 1999-06-08 | Quad Systems Corporation | Contactless bonding tool heater |
| CN1835197A (en) * | 2005-03-15 | 2006-09-20 | 三星电子株式会社 | Chip welding device and method using same |
| CN102554388A (en) * | 2010-10-29 | 2012-07-11 | 株式会社日立高新技术仪器 | Chip bonding device, chip bonding method and chip bonding quality evaluation equipment |
| US8240541B2 (en) * | 2010-10-29 | 2012-08-14 | Samsung Electronics Co., Ltd. | Apparatus for mounting semiconductor chip |
| CN102294526A (en) * | 2011-07-25 | 2011-12-28 | 揭阳市宏乾电子有限公司 | Welding method for producing high-power tube chips and device thereof |
| CN102990255A (en) * | 2011-09-16 | 2013-03-27 | 株式会社日立高新技术仪器 | Die bonder and bonding method |
| CN202772117U (en) * | 2012-08-31 | 2013-03-06 | 佛山市南海区宏乾电子有限公司 | Automatic film distraction device of full-automatic die bonding machine |
| CN103182577A (en) * | 2013-01-21 | 2013-07-03 | 广州市明森机电设备有限公司 | Chip welding method of dual-interface card and equipment thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531505A (en) * | 2013-10-12 | 2014-01-22 | 四川蓝彩电子科技有限公司 | Wafer assembly system |
| CN103531505B (en) * | 2013-10-12 | 2015-12-30 | 四川蓝彩电子科技有限公司 | Wafer assembly system |
| CN104084659A (en) * | 2014-07-02 | 2014-10-08 | 施文桦 | Production method for preparing transistor through hot-gas welding |
| CN104084659B (en) * | 2014-07-02 | 2016-04-20 | 佛山市施翔腾科技设备有限公司 | Hot air welding method is adopted to prepare the production method of transistor |
| CN110919214A (en) * | 2019-12-05 | 2020-03-27 | 珠海东精大电子科技有限公司 | Crystal oscillator's encapsulation equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103286425B (en) | 2016-05-18 |
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Address after: 528216 Guangdong province Foshan City Danzao Town Nanhai District Xin'an community the Bund Jinning No. 3 Patentee after: Guangdong macro dried Polytron Technologies Inc Address before: 510620, No. three, No. 1107, Tian An Ping Lu, Nanhai Jian, Nanhai District, Guangdong, Foshan, Guicheng Patentee before: Foshan Nanhai Hongqian Electronic Co., Ltd. |