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CN103283012A - 用于工艺盒的装载和卸载方法 - Google Patents

用于工艺盒的装载和卸载方法 Download PDF

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CN103283012A
CN103283012A CN2011800647567A CN201180064756A CN103283012A CN 103283012 A CN103283012 A CN 103283012A CN 2011800647567 A CN2011800647567 A CN 2011800647567A CN 201180064756 A CN201180064756 A CN 201180064756A CN 103283012 A CN103283012 A CN 103283012A
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M.希尔普
A.齐茨曼
J.齐默曼
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Zimmermann and Schilp Handhabungstechnik GmbH
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/082—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
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Abstract

本发明涉及用于工艺盒的装载和卸载方法，所述工艺盒例如在等离子涂层工艺中使用，其中，实施下列方法步骤：a.提供一能够借助一拆卸和安装机器人来拆卸和安装的工艺盒（1），b.以如下方式自动化地拆卸工艺盒，使得工艺盒的底板（2）分开地存在，c.将底板（2）朝至少一个装备自动机进行供给并且分配，装备自动机将所述底板（2）以待加工的工件进行装备，d.将装备好的底板（2）朝工艺盒（1）进行安装，e.将工艺盒（1）朝工艺地点进行供给，在工艺地点处应该实施该工艺，f.实施该工艺，g.将工艺盒（1）朝该拆卸和安装机器人或者另一个拆卸和安装机器人进行供给，h.以如下方式拆卸工艺盒，使得工艺盒的底板（2）分开地存在并且i.自动化地取出加工好的工件。

Description

用于工艺盒的装载和卸载方法
本发明涉及一种用于工艺盒（Prozesskassette）的装载和卸载方法，所述工艺盒例如在等离子涂层工艺中使用。
这种工艺盒具有大量的间隔的承载板。在这些承载板的间隙中置入待加工的扁平的工件、例如晶片并且在加工之后再次取出。针对这些工作步骤例如从半导体技术的多重夹具（Mehrfachgreifer）中公知，所述多重夹具能够将一堆工件间隔开并且同时地置入到工艺盒中并且再次取出。但所述多重夹具主要适用于，将工件放下到所述工艺盒的狭窄的格中或者再次拿起。
但存在如下使用情况，在这些使用情况下，所述工件也必须固定在所述工艺盒的格中。所述固定可以例如在如下情况下是需要的，即装备好的工艺盒接来下被机器人沿着不同的方向进行运动并且所述工件在不固定的情况下会掉落下来。
用于固定的另一种必要性存在于例如等离子涂层的情况下。为此所需的是，所述工件具有与一电压源的可靠的电接触。这例如通过如下方式实现，其中，利用一真空夹具将矩形的晶片驶入到所述格中且随后转动，从而在保持和接触针下压紧所述晶片的角，从而不仅进行了机械固定而且也进行了电接触。所述晶片的取出以相同的方式进行，也就是说，所述夹具驶入到所述格中，吸住所述晶片并且如此地转动所述晶片，使得所述晶片能够在与所述保持和接触针不碰撞的情况下被拉出。
这种技术的缺点在于，为此所需的夹具系统比较耗费且因此昂贵，或者在使用具有较低的精确度和可靠性的夹具的情况下常常会出现错误装备，从而产生比较高的比例的晶片断裂。所述夹具系统的另一个缺点在于，其不提供给不同大小的工艺盒使用且因此必须作为特殊定制来制造。由此提高了这种工艺的总成本。
因此本发明的任务在于，提出一种用于工艺盒的装载和卸载方法，其中，能够以高的可靠性快速地以及安全地供给工件且同样地再次取出。此外，所述方法应该需要成本低廉的设备技术。
本发明的任务利用一种用于工艺盒的装载和卸载方法来解决，所述装载和卸载方法具有下列方法步骤：
a. 提供一种可借助一拆卸和安装机器人（Demontage- und Montage-Roboters）来拆卸和安装的工艺盒，其中，拆卸和安装机器人理解为任一类型的全自动地、自动化地工作的装置，
b. 以如下方式自动化地拆卸所述工艺盒，即所述工艺盒的底板（Böden）分开地（separiert）存在（vorliegen），
c. 将所述底板朝至少一个装备自动机进行供给并且分配，所述装备自动机将所述底板以待加工的工件进行装备，
d. 将装备好的底板朝所述工艺盒进行安装，
e. 将所述工艺盒朝工艺地点进行供给，在所述工艺地点处应该实施所述工艺，
f. 实施所述工艺，
g. 将所述工艺盒朝所述拆卸和安装机器人或者另一个拆卸和安装机器人供给，
h. 以如下方式拆卸所述工艺盒，使得所述工艺盒的底板分开地存在，并且
i. 自动化地取出加工好的工件。
对于本领域技术人员而言清楚的是，从现在起所述底板被重新以工件进行装备。无需进一步阐释，不同的底板也可以在多个装备站处进行装备。对于本领域技术人员而言也熟知的是，大量的底板借助一机器人朝一工艺盒1再次自动化地进行接合。
通过在装备技术中的令人惊奇的范例转换，可行的是，以相对较小的技术上的耗费进行了特别快速的、可靠的以及精确的装备，这是因为工件不再需要侧向地穿引到狭窄的缝隙或格中，而是可以相对不复杂地从上方套装到分开的底板2上并且必要时被固定。根据本发明的方法的优点通过如下方式特别明显，如果需要的话，在所述工艺盒的狭窄的格中分别将一第一工件固定在所述格的下侧面上以及将一第二工件与所述第一工件平行地固定在所述格的上侧面上。为此，在根据本发明的方法的情况下，仅翻转底板2，从而同样可以以工件装备背面。在此情况下设置用于将工件固定在底板2上的装置，从而当底板被翻转时，铺放在一侧上的工件不会掉落下来。
按照权利要求2，所述工艺盒设置用于一等离子涂层工艺。要提及的是，由于特别薄的工件的复杂的处理，该方法对于一等离子涂层工艺而言是特别适合的。
按照权利要求3，所述工艺盒设置用于一静电的涂漆工艺（Belackungsprozess）。
图1示出了具有大量底板2的工艺盒1的一个部分。可见的是，工件的置入和取出以常见的技术是有困难的。

Claims (3)

1. 用于一工艺盒（1）的装载和卸载方法，所述装载和卸载方法具有下列方法步骤：
a. 提供一能够借助一拆卸和安装机器人来拆卸和安装的工艺盒（1），
b. 以如下方式自动化地拆卸所述工艺盒，使得所述工艺盒的底板（2）分开地存在，
c. 将所述底板（2）朝至少一个装备自动机进行供给并且分配，所述装备自动机将所述底板（2）以待加工的工件进行装备，
d. 将装备好的底板（2）朝所述工艺盒（1）进行安装，
e. 将所述工艺盒（1）朝工艺地点进行供给，在所述工艺地点处应该实施所述工艺，
f. 实施所述工艺，
g. 将所述工艺盒（1）朝所述拆卸和安装机器人或者另一个拆卸和安装机器人进行供给，
h. 以如下方式拆卸所述工艺盒，使得所述工艺盒的底板（2）分开地存在，并且
i. 自动化地取出加工好的工件。
2. 按照权利要求1所述的装载和卸载方法，其中，所述工艺盒设置用于一等离子涂层工艺。
3. 按照权利要求1所述的装载和卸载方法，其中，所述工艺盒设置用于一静电的涂漆工艺。
CN2011800647567A 2010-11-11 2011-11-11 用于工艺盒的装载和卸载方法 Pending CN103283012A (zh)

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DE102010050918 2010-11-11
DE102010050918.3 2010-11-11
PCT/DE2011/001977 WO2012062288A2 (de) 2010-11-11 2011-11-11 Belade- und entladeverfahren für eine prozesskassette

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EP (1) EP2638567A2 (zh)
JP (1) JP2014503989A (zh)
KR (1) KR20130117809A (zh)
CN (1) CN103283012A (zh)
DE (1) DE102011118276A1 (zh)
WO (1) WO2012062288A2 (zh)

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DE102011118276A1 (de) * 2010-11-11 2012-08-23 Zimmermann & Schilp Handhabungstechnik Gmbh Belade- und Entladeverfahren für eine Prozesskassette
CN105960589B (zh) 2013-07-22 2019-04-26 Zs-处理有限责任公司 用于检查工件表面和带材料的装置
CN105960308B (zh) 2013-07-22 2018-01-19 Zs-处理有限责任公司 用于表面处理或者表面加工的装置
US10861692B2 (en) * 2017-10-26 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate carrier deterioration detection and repair

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KR20130117809A (ko) 2013-10-28
WO2012062288A2 (de) 2012-05-18
DE102011118276A1 (de) 2012-08-23
JP2014503989A (ja) 2014-02-13
US20140041186A1 (en) 2014-02-13
EP2638567A2 (de) 2013-09-18

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Application publication date: 20130904