CN103281861A - Installing method of FLASH bonding pad for preventing high-speed transmission line from being segmented in crossing way - Google Patents

Abstract

The invention relates to an installing method of a bonding pad, in particular to an installing method of a FLASH bonding pad for preventing a high-speed transmission line from being segmented in a crossing way. According to the method, the installing direction of the Flash bonding pad is rotated, the opening direction of the bonding pad is over against the transmission line, and the transmission line can pass through a notch of the bonding pad without leaving cross-segmented parts, so that the defect that a signal reflow path is lengthened, thus influencing the integrity of a signal is overcome.

Description

A method for installing FLASH pads avoiding cross-split high-speed transmission lines

technical field

The invention relates to a method for installing pads, in particular to a method for installing FLASH pads that avoid high-speed transmission lines being split across.

Background technique

With the development of modern technology, the PCB board is required to be smaller and smaller, but more and more functions need to be realized, so the integration of the board is getting higher and higher. Therefore, for many current device packages, the spacing between pins and pins is very small, so the space for wiring in the middle is also very small. Coupled with the default format of EDA (Electronic Design Automation) software for flash pads in the middle, the transmission line often has a small section across the split. For high-speed transmission lines, cross-segmentation can lead to longer signal return paths, which can cause signal integrity issues.

As shown in Figure 1, the distance between the Flash pad (1) and the transmission line (2) is too small, causing a small part of it to be split, which will affect the length of the signal return path and thus affect the signal integrity.

Contents of the invention

In order to solve the problems of the prior art, the present invention provides a method for installing high-speed transmission lines that avoid cross-split FLASH pads. By rationally designing the Flash pads, it is possible to avoid the occurrence of such transmission lines when they go out from the middle of the pins. cross-segmentation problem.

The technical scheme adopted in the present invention is as follows:

An installation method for avoiding the high-speed transmission line crossing the divided FLASH pad, rotating the FLASH pad until its opening direction faces the transmission line.

Rotate the FLASH pad to the extent that its opening direction is perpendicular to the transmission line direction.

The beneficial effects brought by the technical scheme provided by the invention are:

In the present invention, by rotating the installation direction of the Flash pad, the opening direction of the pad is facing the transmission line, so that the opening of the pad can accommodate the transmission line to pass through, without cross-segmented parts, thereby avoiding the signal return path become longer, thereby affecting signal integrity deficiencies.

Description of drawings

FIG. 1 is a schematic diagram of a soldering structure of a flash pad in the prior art;

FIG. 2 is a schematic diagram of a soldering structure of a method for installing a FLASH pad that avoids cross-split high-speed transmission lines according to the present invention.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

Embodiment one

As shown in FIG. 1 , it is the default Flash pad structure in the prior art. If the spacing between device pins is large enough, there is no problem. However, due to the current development of science and technology, the integration of boards is getting higher and higher, so the pin spacing of some soldered devices is too small. If the transmission line passes through the middle of the pins, part of the transmission line cross-splitting phenomenon will occur, resulting in the impact of high-speed signal line cross-segmentation.

In this embodiment, the opening direction of the Flash is modified, and the Flash pad is rotated by 90 degrees, so that the FLASH pad 1 is rotated to such an extent that the opening direction of the Flash pad is perpendicular to the direction of the transmission line 2 . In this way, the position where the pin is connected to the negative copper skin changes, so that a small part of the transmission line that crosses the split no longer crosses the split, as shown in Figure 2. In this way, the direction of the Flash pad 1 can be rotated according to different designs, so as to solve a small part of the transmission line split phenomenon that occurs when the transmission line passes through the middle of the device pin.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within range.

Claims (2)

1. An installation method for avoiding high-speed transmission line across the FLASH pad of division, it is characterized in that, FLASH pad is rotated to its opening direction and faces transmission line. 2. A method for installing FLASH pads that avoid high-speed transmission lines from crossing and splitting according to claim 1, wherein the FLASH pads are rotated to such an extent that the direction of the opening is perpendicular to the direction of the transmission line.

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