CN103281812B - Ceramic heating sheet applicable to liquid heating - Google Patents
Ceramic heating sheet applicable to liquid heating Download PDFInfo
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- CN103281812B CN103281812B CN201310171157.6A CN201310171157A CN103281812B CN 103281812 B CN103281812 B CN 103281812B CN 201310171157 A CN201310171157 A CN 201310171157A CN 103281812 B CN103281812 B CN 103281812B
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- heating circuit
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 113
- 239000000919 ceramic Substances 0.000 title claims abstract description 89
- 239000007788 liquid Substances 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000011812 mixed powder Substances 0.000 claims abstract description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000004927 clay Substances 0.000 claims abstract description 14
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 14
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 14
- 238000003756 stirring Methods 0.000 claims abstract description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 39
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 16
- 238000010298 pulverizing process Methods 0.000 claims description 9
- 238000005096 rolling process Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000011805 ball Substances 0.000 claims description 8
- 238000000498 ball milling Methods 0.000 claims description 8
- 238000007766 curtain coating Methods 0.000 claims description 8
- 235000011187 glycerol Nutrition 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000004382 potting Methods 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- 238000003892 spreading Methods 0.000 claims description 6
- 230000007480 spreading Effects 0.000 claims description 6
- 239000003870 refractory metal Substances 0.000 claims description 5
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000012141 concentrate Substances 0.000 claims description 3
- BJBUTJPAZHELKY-UHFFFAOYSA-N manganese tungsten Chemical compound [Mn].[W] BJBUTJPAZHELKY-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 10
- 238000002474 experimental method Methods 0.000 abstract description 2
- 238000005266 casting Methods 0.000 abstract 1
- 239000004615 ingredient Substances 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 15
- 238000005485 electric heating Methods 0.000 description 6
- 239000003566 sealing material Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- LYCAIKOWRPUZTN-NMQOAUCRSA-N 1,2-dideuteriooxyethane Chemical compound [2H]OCCO[2H] LYCAIKOWRPUZTN-NMQOAUCRSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- Surface Heating Bodies (AREA)
Abstract
The invention discloses a ceramic heating sheet applicable to liquid heating. The ceramic heating sheet comprises a ceramic substrate and a heating circuit printed on the ceramic substrate in a silk-screen printing way, wherein the ceramic substrate is formed by adopting mixed powder materials through crushing, baking, crushing, stirring and casting. The ceramic heating sheet is characterized in that the mixed powder materials comprise the following ingredients in percentage by weight: 84 to 89 percent of aluminum oxide, 1.8 to 2.8 percent of silicon dioxide, 4.5 to 6.5 percent of talcum powder and 5.5 to 7.5 percent of clay, and the total quantity is 100 percent. The proportioning ratio of the ceramic substrate is designed on the basis of the use environment and the characteristics of the heating sheet, so the properties of intensity, firmness and the like of the generated ceramic substrate are respectively improved, the structure reliability can be maintained even when the ceramic substrate works for a long time through being soaked in liquid, and experiments prove that the service life of the ceramic heating sheet can reach more than 10000 hours.
Description
Technical field
The present invention relates to a kind of liquid heating, be specially a kind of ceramic heating flake.
Background technology
Current liquid heating generally adopts several modes such as the heating of electric heating, fuel gas buring, solar energy heating.Gas accidents multiple, to the psychological impact of consumer, the requirement of installation environment and the rise of gas price, the relevant device sales volume of gas heating was declining in recent years rapidly.The mode of solar energy heating is then because limitation own cannot be popularized in an all-round way.The mode of electric heating heating is divided into storage-type to heat and Fast Heating two kinds of implementations.Storage-type heating exist volume excessive, install inconvenient, consume energy high shortcoming.Along with the raising of living standards of the people, the improvement of living environment, the enhancing of consumer's concept of time and the change of consumption idea; Add power grid construction and transformation all over China; And the construction of national policy pushing forward power plant, electricity price also will decrease, and the mode of fast electric heating is met in the service condition of China, for the universal of fast electric heating equipment brings larger development opportunity.
The key technology of fast electric heating equipment is the design of heater.The heater 80%-90% of currently marketed product adopts heat-generating pipe, really can not accomplish that electricity separation, power are large, easily fouling, life-span are not longer, mounting condition requirement and line requirements is high and fail safe is low.The appearance of ceramic heating flake can overcome above-mentioned shortcoming well.Ceramic heating flake is mainly made up of ceramic substrate and the resistance heating circuit arranged on a ceramic substrate; the heat that resistance heating circuit sends outwards is transmitted by ceramic substrate; ceramic substrate carries out good protection to heating circuit; and; based on the advantage of ceramic substrate own material; even if ceramic substrate is soaked in liquid also can not produce incrustation scale always, heating effect is good.
As previously mentioned, the effect that in ceramic heating flake, ceramic substrate plays is very crucial, which determines efficiency, the working life of device heating, therefore, technical staff is necessary to further investigate it, optimizes its composition, thus forms a kind of more excellent ceramic heating flake.
Summary of the invention
In order to achieve the above object, the invention provides a kind of ceramic heating flake being applicable to liquid heating, it is by adjusting the concrete component of ceramic substrate, makes substrate more be applicable to heating plate and uses, thus heating plate the is had efficiency of heating surface is higher, working life is longer advantage.
The technical scheme that the present invention adopts for its technical problem of solution is:
A kind of ceramic heating flake being applicable to liquid heating, comprise ceramic substrate and silk-screen heating circuit on a ceramic substrate, described ceramic substrate adopts mixed powder by the step formation of pulverizings, oven dry, spreading, stirring and curtain coating, the weight proportion of described mixed powder is: aluminium oxide 84-89%, silica 1 .8-2.8%, talcum powder 4.5-6.5%, clay 5.5-7.5%, total amount meets 100%.
Wherein, adopt ball-milling method in the step of pulverizing, the weight proportion of mixed powder, ball, water is (1-1.8): (1.5-2.): 1.
The step of spreading is divided into thick rolling and smart step of rolling over, and in thick step of rolling over, the component weight proportion of the adhesive adopted is: polydiene alcohol 15-18%, ethylene glycol 1.5-1.8%, glycerine 7-11%, water 64-74%, alcohol 5.5-6.5%, and total amount meets 100%.
The material that heating circuit adopts is refractory metal resistance slurry.
Described refractory metal resistance slurry is, but is not limited to: the wherein one of tungsten manganese, molybdenum manganese, nickel, silver-colored palladium.
Ceramic heating flake has the ceramic substrate of heating circuit and one piece of ceramic substrate not printing heating circuit to be overrided to form by one piece of one side silk-screen, and heating circuit is sealed between two pieces of ceramic substrates.
Ceramic heating flake has the ceramic substrate of heating circuit and one piece of ceramic substrate not printing heating circuit to be overrided to form successively by two pieces or more one side silk-screens, and heating circuit is sealed between two pieces of adjacent ceramic substrates.
The diameter of section size of described heating circuit is 3-5 micron.
Heating circuit with rule close around mode on ceramic substrate, form intensive hot zone, ceramic substrate is provided with the lead solder-joint connecting external power source for heating circuit, lead solder-joint is provided with insulative potting material, be provided with interval region between lead solder-joint and intensive hot zone, insulative potting material concentrates on lead solder-joint and interval region.
The invention has the beneficial effects as follows: the environment for use and the proportioning of feature to ceramic substrate that the present invention is based on this heating plate design, generated ceramic substrate is all made moderate progress in intensity, resistance to solidity etc., also can the reliability of holding structure even if be immersed in the medium-term and long-term work of liquid, experiment proves, its useful life can reach more than 10000 hours.
When arranging interval region further on ceramic substrate, the heat that intensive hot zone produces can be avoided being directly delivered on insulating sealing materials, the stability of insulating sealing materials is better, thus makes the overall sealing performance of heating plate more perfect, and working life is longer.
Accompanying drawing explanation
Be further detailed below in conjunction with the drawings and specific embodiments:
Fig. 1 is the heating circuit distribution schematic diagram of a kind of embodiment of heating plate of the present invention.
Embodiment
Ceramic heating flake of the present invention can be applied on various liquid heating apparatus, as pot-type boiler, heating water tap etc.During embody rule, the heating plate of some quantity is plugged on an erector, is then arranged on by this erector on the required equipment heated and uses.The material used due to this heating plate is nonmetal, react so can not produce with the material in water in heating process, thus solve the problem of heater surfaces fouling, would not be surrounded by dirty layer because of surface like this, cause conduction of velocity and the efficiency of the heat of electric heating piece, greatly can improve heat utilization ratio, energy savings that heater produces, the useful life of heater can also be extended.
Ceramic heating flake comprises ceramic substrate and silk-screen heating circuit on a ceramic substrate, and the material that wherein heating circuit adopts is refractory metal resistance slurry, and high-temperature metal resistance slurry is, but is not limited to: the wherein one of tungsten manganese, molybdenum manganese, nickel, silver-colored palladium.
Ceramic substrate adopts mixed powder by the step formation of pulverizings, oven dry, spreading, stirring and curtain coating, the weight proportion of described mixed powder is: aluminium oxide 84-89%, silica 1 .8-2.8%, talcum powder 4.5-6.5%, clay 5.5-7.5%, total amount meets 100%.Adopt ball-milling method in the step pulverized, the weight proportion of mixed powder, ball, water is (1-1.8): (1.5-2.): 1.The step of spreading is divided into thick rolling and smart step of rolling over, and in thick step of rolling over, the component weight proportion of the adhesive adopted is: polydiene alcohol 15-18%, ethylene glycol 1.5-1.8%, glycerine 7-11%, water 64-74%, alcohol 5.5-6.5%, and total amount meets 100%.
In various embodiments, the structure of ceramic heating flake can be different.In the structure of double-layer ceramic heating plate, ceramic heating flake has the ceramic substrate of heating circuit and one piece of ceramic substrate not printing heating circuit to be overrided to form by one piece of one side silk-screen, and heating circuit is sealed between two pieces of ceramic substrates.In the structure of multi-layer ceramics heating plate, ceramic heating flake has the ceramic substrate of heating circuit and one piece of ceramic substrate not printing heating circuit to be overrided to form successively by two pieces or more one side silk-screens, and heating circuit is sealed between two pieces of adjacent ceramic substrates.Laminate and need to carry out under certain pressure and temperature, under hydrogen shield, the percent by volume of hydrogen is 30%-100%, the percent by volume of nitrogen is 70%--0%, and according to the binder removal sintering curve of setting, the highest jointly sintering more than 1600 DEG C forms.Said structure all makes heating circuit seal completely, oxidation of forever having no chance, thus stable work in work, and the life-span is long; And the thickness of whole fever tablet only has the thickness of 1.3-4mm, make its Double-side heating in the course of the work, its heat is brought into play rapidly, behind disconnected power down source, also can cool rapidly, delayed heat would not be caused when equipment use so excessive.
As shown in Figure 1, heating circuit of the present invention adopts the mode winding of rule distribution on a ceramic substrate.Consider the safety of use, the diameter of section general control of heating circuit of the present invention is between 3-5 micron, and this diameter of section is the size of the mean value of the periphery of the major part of heating circuit circuit value when being converted into equal circular in periphery.Even if heating plate ruptures, the short circuit current that heating circuit is produced in a liquid also can be restricted, and institute's electric current of letting out is completely within human-body safety scope; Can not produce and human body is damaged.
In order to ensure the reliability of heating plate further, as shown in Figure 1, heating circuit with rule close around mode on ceramic substrate, form intensive hot zone 1, ceramic substrate is provided with the lead solder-joint 2 connecting external power source for heating circuit, lead solder-joint 2 is provided with insulative potting material, be provided with interval region 3 between lead solder-joint 2 and intensive hot zone 1, insulative potting material concentrates on lead solder-joint 2 and interval region 3.This set makes the heat that intensive hot zone 1 produces can avoid being directly delivered on insulating sealing materials, and the stability of insulating sealing materials is better, thus makes the overall sealing performance of heating plate more perfect, and working life is longer.
Below specifically making of ceramic substrate is enumerated embodiment and be described.
Embodiment 1
Aluminium oxide, silicon dioxide, talcum powder, clay are mixed to get mixed powder, and the weight proportion of mixed powder is: aluminium oxide 84%, silicon dioxide 2.8%, talcum powder 6.5%, clay 6.7%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1:1.5:1; Powder after pulverizing is dried; Slightly roll over powder, the component weight proportion of the adhesive adopted is: polydiene alcohol 15%, ethylene glycol 1.8%, glycerine 11%, water 66.7%, alcohol 5.5%; Carry out essence to powder to roll over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 2
Aluminium oxide, silicon dioxide, talcum powder, clay are mixed to get mixed powder, and the weight proportion of mixed powder is: aluminium oxide 89%, silica 1 .8%, talcum powder 4.5%, clay 4.7%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1.8:2:1; Powder after pulverizing is dried; Slightly roll over powder, the component weight proportion of the adhesive adopted is: polydiene alcohol 18%, ethylene glycol 1.5%, glycerine 7%, water 67%, alcohol 6.5%; Carry out essence to powder to roll over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 3
Aluminium oxide, silicon dioxide, talcum powder, clay are mixed to get mixed powder, and the weight proportion of mixed powder is: aluminium oxide 86%, silicon dioxide 2%, talcum powder 6.5%, clay 5.5%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1.3:1.8:1; Powder after pulverizing is dried; Slightly roll over powder, the component weight proportion of the adhesive adopted is: polydiene alcohol 17%, ethylene glycol 2%, glycerine 9%, water 66%, alcohol 6%; Carry out essence to powder to roll over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 4
Aluminium oxide, silicon dioxide, talcum powder, clay are mixed to get mixed powder, and the weight proportion of mixed powder is: aluminium oxide 85%, silicon dioxide 2%, talcum powder 5.5%, clay 7.5%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1:1.7:1; Powder after pulverizing is dried; Slightly roll over powder, the component weight proportion of the adhesive adopted is: polydiene alcohol 18%, ethylene glycol 1.8%, glycerine 10.7%, water 64%, alcohol 5.5%; Carry out essence to powder to roll over; Stir, enter curtain coating and make ceramic substrate.
Embodiment 5
Aluminium oxide, silicon dioxide, talcum powder, clay are mixed to get mixed powder, and the weight proportion of mixed powder is: aluminium oxide 87.5%, silicon dioxide 2%, talcum powder 4.5%, clay 6%; Adopt ball-milling method to pulverize mixed powder, the weight proportion of mixed powder, ball, water is 1:1.5:1; Powder after pulverizing is dried; Slightly roll over powder, the component weight proportion of the adhesive adopted is: polydiene alcohol 15%, ethylene glycol 1.5%, glycerine 7%, water 71%, alcohol 5.5%; Carry out essence to powder to roll over; Stir, enter curtain coating and make ceramic substrate.
Claims (8)
1. one kind is applicable to the ceramic heating flake of liquid heating, comprise ceramic substrate and silk-screen heating circuit on a ceramic substrate, described ceramic substrate adopts mixed powder by the step formation of pulverizings, oven dry, spreading, stirring and curtain coating, it is characterized in that the weight proportion of described mixed powder is: aluminium oxide 84-89%, silica 1 .8-2.8%, talcum powder 4.5-6.5%, clay 5.5-7.5%, total amount meets 100%; Described heating circuit with rule close around mode on ceramic substrate, form intensive hot zone, ceramic substrate is provided with the lead solder-joint connecting external power source for heating circuit, lead solder-joint is provided with insulative potting material, be provided with interval region between lead solder-joint and intensive hot zone, insulative potting material concentrates on lead solder-joint and interval region.
2. a kind of ceramic heating flake being applicable to liquid heating according to claim 1, it is characterized in that adopting ball-milling method in the step pulverized, the weight proportion of mixed powder, ball, water is (1-1.8): (1.5-2.): 1.
3. a kind of ceramic heating flake being applicable to liquid heating according to claim 1, it is characterized in that the step of spreading is divided into thick rolling and smart step of rolling over, in thick step of rolling over, the component weight proportion of the adhesive adopted is: polydiene alcohol 15-18%, ethylene glycol 1.5-1.8%, glycerine 7-11%, water 64-74%, alcohol 5.5-6.5%, total amount meets 100%.
4. a kind of ceramic heating flake being applicable to liquid heating according to claim 1, is characterized in that the material that heating circuit adopts is refractory metal resistance slurry.
5. a kind of ceramic heating flake being applicable to liquid heating according to claim 4, is characterized in that described refractory metal resistance slurry is, but is not limited to: the wherein one of tungsten manganese, molybdenum manganese, nickel, silver-colored palladium.
6. a kind of ceramic heating flake being applicable to liquid heating according to claim 1, it is characterized in that ceramic heating flake has the ceramic substrate of heating circuit and one piece of ceramic substrate not printing heating circuit to be overrided to form by one piece of one side silk-screen, heating circuit is sealed between two pieces of ceramic substrates.
7. a kind of ceramic heating flake being applicable to liquid heating according to claim 1, it is characterized in that ceramic heating flake has the ceramic substrate of heating circuit and one piece of ceramic substrate not printing heating circuit to be overrided to form successively by two pieces or more one side silk-screens, heating circuit is sealed between two pieces of adjacent ceramic substrates.
8. a kind of ceramic heating flake being applicable to liquid heating according to claim 1, is characterized in that the diameter of section size of described heating circuit is 3-5 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310171157.6A CN103281812B (en) | 2013-05-10 | 2013-05-10 | Ceramic heating sheet applicable to liquid heating |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310171157.6A CN103281812B (en) | 2013-05-10 | 2013-05-10 | Ceramic heating sheet applicable to liquid heating |
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| Publication Number | Publication Date |
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| CN103281812A CN103281812A (en) | 2013-09-04 |
| CN103281812B true CN103281812B (en) | 2015-07-15 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103762013B (en) * | 2013-12-31 | 2016-05-11 | 宁波兴慈热动电器有限公司 | A kind of electronic heater high temperature insulating material and preparation method |
| CN104703307B (en) * | 2015-02-10 | 2016-06-01 | 孙庄 | Ceramic heating plate |
| US9658409B2 (en) * | 2015-03-03 | 2017-05-23 | Senko Advanced Components, Inc. | Optical fiber connector with changeable polarity |
| CN105326092B (en) * | 2015-11-28 | 2018-07-24 | 广东中烟工业有限责任公司 | A kind of very fast heating device of non-burning low temperature and its cigarette case |
| CN105451433A (en) * | 2015-12-14 | 2016-03-30 | 福建闽航电子有限公司 | Fabrication method of electric heating substrate |
| CN116321551A (en) * | 2023-02-27 | 2023-06-23 | 衡阳凯新特种材料科技有限公司 | A ceramic heating element |
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| CN1649449A (en) * | 2004-01-20 | 2005-08-03 | 珠海粤科清华电子陶瓷有限公司 | High temperature coburning heating element and its producing method |
| CN1833143A (en) * | 2003-08-05 | 2006-09-13 | 松下电器产业株式会社 | Fluid heating device and washing device using the device |
| CN101389164A (en) * | 2007-09-11 | 2009-03-18 | 石荣 | Ceramic heater and manufacturing method thereof |
| CN101860993A (en) * | 2009-04-09 | 2010-10-13 | 陈建中 | MCH co-fired ceramic heating substrate and preparation method thereof |
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2013
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1833143A (en) * | 2003-08-05 | 2006-09-13 | 松下电器产业株式会社 | Fluid heating device and washing device using the device |
| CN1649449A (en) * | 2004-01-20 | 2005-08-03 | 珠海粤科清华电子陶瓷有限公司 | High temperature coburning heating element and its producing method |
| CN101389164A (en) * | 2007-09-11 | 2009-03-18 | 石荣 | Ceramic heater and manufacturing method thereof |
| CN101860993A (en) * | 2009-04-09 | 2010-10-13 | 陈建中 | MCH co-fired ceramic heating substrate and preparation method thereof |
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Effective date of registration: 20201020 Address after: 550000 Station No. 1402-321, 14th floor, building A2, Taisheng international, No. 9, Airport Road, Shuanglong Airport Economic Zone, Guiyang City, Guizhou Province Patentee after: Guiyou Tianchuang Co.,Ltd. Address before: 528429 Guangdong city of Zhongshan province Zhenkang Huangpu Road No. 10 Patentee before: Wu Zhangjie Patentee before: Pang Chunhong |
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Address after: 550000 Station No. 1402-321, 14th floor, building A2, Taisheng international, No. 9, Airport Road, Shuanglong Airport Economic Zone, Guiyang City, Guizhou Province Patentee after: Guiyou Tianchuang (Group) Co.,Ltd. Address before: 550000 Station No. 1402-321, 14th floor, building A2, Taisheng international, No. 9, Airport Road, Shuanglong Airport Economic Zone, Guiyang City, Guizhou Province Patentee before: Guiyou Tianchuang Co.,Ltd. |
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Granted publication date: 20150715 |