CN103249278A - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- CN103249278A CN103249278A CN2012100283995A CN201210028399A CN103249278A CN 103249278 A CN103249278 A CN 103249278A CN 2012100283995 A CN2012100283995 A CN 2012100283995A CN 201210028399 A CN201210028399 A CN 201210028399A CN 103249278 A CN103249278 A CN 103249278A
- Authority
- CN
- China
- Prior art keywords
- heat
- base
- electronic product
- heat abstractor
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 5
- 230000005855 radiation Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 210000004209 hair Anatomy 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device, which can be used for cooling an electronic component inside an electronic product. The heat dissipating device comprises a base jointed with the electronic component and a plurality of heat dissipation hairs which are arranged on the base and can swing together with the micro air flow inside the electronic product. According to the invention, the heat dissipation hairs can swing together with the micro air flow inside the electronic product to reinforce the convection heat dissipation ability, so that the heat emitted by the electronic component can be dissipated to the interior of the electronic product quickly, and is further transmitted to the casing of the electronic product, and accordingly, the temperature inside the electronic product is reduced.
Description
Technical field
The present invention relates to a kind of heat abstractor, particularly the heat abstractor that heat-generating electronic elements is dispelled the heat.
Background technology
Along with the trend of various consumer electronic product towards the Portable development, electronic product has lot of challenges such as weight is lighter, volume is littler, function is more various.With a electronic product, as panel computer, under the prerequisite that adopts the same circuits design, functional more strong, its internal heat generation amount is more high, gives people's temperature sensation then more poor.For this reason, industry uses the heat-generating electronic elements in graphite flake, sheet metal heat conducting elements such as (copper/aluminium foils) and the panel computer to be sticked usually, and the spread heat that heat-generating electronic elements is produced is in panel computer and then be passed to shell to reduce the temperature of heat-generating electronic elements.Yet when no fan existed in electronic product, the heat conduction velocity of heat conducting element in closed system was lower, thereby influenced distributing of heat-generating electronic elements heat.And because the heat-generating electronic elements height in the same electronic product differs, heat conducting element such as graphite flake, sheet metal belongs to hard material, flexibility is poor, does not fit into simultaneously the heat-generating electronic elements heat radiation to differing heights usually, and then makes the versatility of heat conducting element not good.
Summary of the invention
In view of this, be necessary to provide a kind of can be simultaneously to the heat abstractor of the electronic element radiating of differing heights in light, the thin electronic installation.
A kind of heat abstractor is used for the electronic element radiating to electronic product inside, and described heat abstractor comprises a base that is sticked with electronic component and is arranged on the base, can sends out with some heat radiations of little air-flow swing of electronic product inside.
Among the present invention, the heat loss through convection ability that can swing to increase self with little air-flow of electronic product inside is sent out in heat radiation, thereby the heat that electronic component is distributed is dispersed into electronic product inside fast, and then conducts on the housing of electronic product, thereby reduces the electronic product temperature inside.
Description of drawings
Fig. 1 is the three-dimensional combination figure of the heat abstractor of first embodiment of the invention, and wherein heat abstractor is positioned at the circuit board top.
Fig. 2 is the use view after heat abstractor shown in Figure 1 is attached at circuit board.
Fig. 3 is the three-dimensional combination figure of the heat abstractor of second embodiment of the invention.
The main element symbol description
| |
1 |
| |
10 |
| Heat radiation is sent out | 30、 |
| Circuit board | |
| 50 | |
| |
51 |
Following embodiment will further specify the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1 and Fig. 2, some heat radiations that heat abstractor 1 of the present invention comprises a base 10 and is arranged at base 10 middle parts send out 30.
This base 10 is made by the good material of heat conductivility, is discoid thin slice, thus be used for circuit board 50 on electronic component 51 directly be sticked and absorb the heat that electronic component 51 distributes.In the present embodiment, this base 10 is made by flexible material, the electronic component 51 of differing heights that can be sticked simultaneously, thus increased the versatility of heat abstractor 1.Be appreciated that ground, in other embodiments, base 10 also can be arranged to required shape, is not limited to the concrete form that present embodiment is showed.
Heat radiation sends out 30 can be fixed on base 10 middle parts by vapour deposition, welding or mode such as bonding.Each heat radiation is sent out 30 and is made by the good material of heat dispersion, and is that an end is fixed on the flexible strip on the base 10.30 end spaces that are fixed on base 10 are sent out in adjacent two heat radiations.30 thickness is sent out in each heat radiation, and to be no more than 0.2 millimeter and weight very light, in light, the slim electronic product inside that no fan arranges, after it absorbs the heat of base 10, can be along with arbitrarily swing because of the air-flow of the faint variation of electronic component 51 heatings electronic product inside, increase the heat loss through convection ability of self, thereby the heat that heat-generating electronic elements 51 is distributed is dispersed into electronic product inside fast, and then conducts on the housing of electronic product, thereby reduces the electronic product temperature inside.
See also Fig. 3, the heat abstractor 1a that present embodiment is showed and the difference of first embodiment form of sending out 30a that is to dispel the heat is different.In the present embodiment, it is ultra-thin flexible lamellar body that 30a is sent out in heat radiation, and the one end is fixed on the base 10.
Be appreciated that ground, heat radiation sends out 30 can be other any required shapes, as long as its weight surface area enough light, that contact with air is enough big, in the process with little air-flow swing, can get final product by quick heat radiating.
Claims (7)
1. heat abstractor is used for the electronic element radiating to electronic product inside, it is characterized in that: described heat abstractor comprises a base that is sticked with electronic component and is arranged on the base, can sends out with some heat radiations of little air-flow swing of electronic product inside.
2. heat abstractor as claimed in claim 1 is characterized in that: described base is the flexible bottom of the electronic component of the differing heights that can be sticked simultaneously.
3. heat abstractor as claimed in claim 1, it is characterized in that: the thickness that described heat radiation is sent out is no more than 0.2 millimeter.
4. heat abstractor as claimed in claim 1, it is characterized in that: described heat radiation is sent out by the good material of heat dispersion and is made.
5. heat abstractor as claimed in claim 1 is characterized in that: described heat radiation is sent out by vapour deposition, welding or bonding mode and is fixed on the base middle part.
6. heat abstractor as claimed in claim 1 is characterized in that: it is that an end is fixed on the flexible strip on the base that each heat radiation is sent out.
7. heat abstractor as claimed in claim 1 is characterized in that: it is one section flexible lamellar body that is fixed on the base that each heat radiation is sent out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100283995A CN103249278A (en) | 2012-02-09 | 2012-02-09 | Heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100283995A CN103249278A (en) | 2012-02-09 | 2012-02-09 | Heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103249278A true CN103249278A (en) | 2013-08-14 |
Family
ID=48928404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100283995A Pending CN103249278A (en) | 2012-02-09 | 2012-02-09 | Heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103249278A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
| US5150748A (en) * | 1990-06-18 | 1992-09-29 | Mcdonnell Douglas Corporation | Advanced survivable radiator |
| US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
| US6191944B1 (en) * | 1998-11-05 | 2001-02-20 | Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. | Heat sink for electric and/or electronic devices |
| US20010047858A1 (en) * | 1999-05-06 | 2001-12-06 | Mccullough Kevin A. | Conforming heat sink assembly |
| US20050168941A1 (en) * | 2003-10-22 | 2005-08-04 | Sokol John L. | System and apparatus for heat removal |
| CN1748011A (en) * | 2002-12-19 | 2006-03-15 | 3M创新有限公司 | Flexible heat sink |
| JP2009260169A (en) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | Heat sink and heat radiating apparatus |
-
2012
- 2012-02-09 CN CN2012100283995A patent/CN103249278A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3706127A (en) * | 1970-04-27 | 1972-12-19 | Ibm | Method for forming heat sinks on semiconductor device chips |
| US5150748A (en) * | 1990-06-18 | 1992-09-29 | Mcdonnell Douglas Corporation | Advanced survivable radiator |
| US5852548A (en) * | 1994-09-09 | 1998-12-22 | Northrop Grumman Corporation | Enhanced heat transfer in printed circuit boards and electronic components thereof |
| US6191944B1 (en) * | 1998-11-05 | 2001-02-20 | Electrovac, Fabrikation Elektrotechnischer Spezialartikel Gesellschaft M.B.H. | Heat sink for electric and/or electronic devices |
| US20010047858A1 (en) * | 1999-05-06 | 2001-12-06 | Mccullough Kevin A. | Conforming heat sink assembly |
| CN1748011A (en) * | 2002-12-19 | 2006-03-15 | 3M创新有限公司 | Flexible heat sink |
| US20050168941A1 (en) * | 2003-10-22 | 2005-08-04 | Sokol John L. | System and apparatus for heat removal |
| JP2009260169A (en) * | 2008-04-21 | 2009-11-05 | Sumitomo Electric Ind Ltd | Heat sink and heat radiating apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130814 |
|
| RJ01 | Rejection of invention patent application after publication |