CN103245807B - Probe unit structure and manufacturing method thereof - Google Patents
Probe unit structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN103245807B CN103245807B CN201210030997.6A CN201210030997A CN103245807B CN 103245807 B CN103245807 B CN 103245807B CN 201210030997 A CN201210030997 A CN 201210030997A CN 103245807 B CN103245807 B CN 103245807B
- Authority
- CN
- China
- Prior art keywords
- positioning baseplate
- positioning substrate
- hole
- positioning
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000523 sample Substances 0.000 title claims abstract description 134
- 238000004519 manufacturing process Methods 0.000 title abstract description 14
- 238000000034 method Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000009422 external insulation Methods 0.000 claims 8
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 230000000630 rising effect Effects 0.000 claims 2
- 241000270923 Hesperostipa comata Species 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 174
- 125000006850 spacer group Chemical group 0.000 abstract description 33
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 description 9
- 238000007689 inspection Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种用于检测的探针结构,尤其涉及一种探针单元结构及其制作方法。The invention relates to a probe structure for detection, in particular to a probe unit structure and a manufacturing method thereof.
背景技术Background technique
在制造IC芯片等半导体集成电路之际,为了检测不良品即会进行电性特性的检查;具体而言,进行半导体集成电路或液晶面板等的检测时,可得知检查对象的半导体集成电路的配线图案中是否有电性短路或断线;同时,为了谋求检查对象与输出检查用信号的信号处理装置之间的电性连接,会采用收容多个导电性接触探针的探针单元,以分别与检查对象及信号处理装置电性连接。When manufacturing semiconductor integrated circuits such as IC chips, electrical characteristics are inspected to detect defective products; specifically, when inspecting semiconductor integrated circuits or liquid crystal panels, etc., it is possible to know the characteristics of the semiconductor integrated circuits to be inspected. Whether there is an electrical short circuit or disconnection in the wiring pattern; at the same time, in order to seek electrical connection between the inspection object and the signal processing device that outputs the inspection signal, a probe unit that accommodates multiple conductive contact probes will be used, To be electrically connected to the inspection object and the signal processing device respectively.
传统的探针单元,如图1至图2所示,其主要包括相对应的一上定位基板10和一下定位基板20、使上定位基板10和下定位基板20间隔有一距离的一固定构件30及穿设上定位基板10和下定位基板20的一接触探针40,其中上定位基板10设有一上孔槽101,下定位基板20设有对应上孔槽101的一下孔槽201,此接触探针40先插设在上孔槽101而定位在上定位基板10,再装设下定位基板20,使接触探针40对应上下孔槽201插设定位。藉此,以达到限制接触探针40的位置。A traditional probe unit, as shown in Figures 1 to 2, mainly includes a corresponding upper positioning substrate 10 and a lower positioning substrate 20, and a fixing member 30 that is spaced apart from the upper positioning substrate 10 and the lower positioning substrate 20. And a contact probe 40 that passes through the upper positioning substrate 10 and the lower positioning substrate 20, wherein the upper positioning substrate 10 is provided with an upper hole groove 101, and the lower positioning substrate 20 is provided with a lower hole groove 201 corresponding to the upper hole groove 101. The probes 40 are first inserted into the upper slots 101 and positioned on the upper positioning substrate 10 , and then the lower positioning substrate 20 is installed so that the contact probes 40 are inserted and positioned corresponding to the upper and lower slots 201 . Thereby, the position of the contact probe 40 can be restricted.
然而,近年来,半导体集成电路在高集成化、微细化已有显着进展,就探针单元而言,为了得以配合该技术的进展,也会将各接触探针的直径细径化,同时使各接触探针彼此之间距狭窄化;但是,上述接触探针40的直径越小下,上孔槽101及下孔槽201也会越来越小,使上孔槽101及下孔槽201之间的对位产生些许的误差,进而导致接触探针40定位于上定位基板10后,却无法穿设定位于下定位基板20,此时强行组装即会损害接触探针40;因此,接触探针40的直径缩小时,现有的探针单元在制作与组合上有极大的困难而无法突破。However, in recent years, semiconductor integrated circuits have made remarkable progress in high integration and miniaturization. As far as the probe unit is concerned, in order to match the progress of this technology, the diameter of each contact probe will also be reduced. The distance between each contact probe is narrowed; however, the smaller the diameter of the above-mentioned contact probe 40, the smaller the upper hole groove 101 and the lower hole groove 201, so that the upper hole groove 101 and the lower hole groove 201 are smaller and smaller. There is a slight error in the alignment between them, which leads to the fact that the contact probe 40 is positioned on the upper positioning substrate 10, but cannot be positioned on the lower positioning substrate 20. At this time, forced assembly will damage the contact probe 40; therefore, contact When the diameter of the probe 40 shrinks, the existing probe unit has great difficulties in making and assembling and cannot break through.
发明内容Contents of the invention
本发明的一目的,在于提供一种探针单元结构及其制作方法,其是利用接触探针的直径细径化下,仍简单便利地制作成探针单元。An object of the present invention is to provide a probe unit structure and a manufacturing method thereof, which can easily and conveniently manufacture the probe unit while utilizing the reduced diameter of the contact probe.
为了达到上述的目的,本发明提供一种探针单元结构,包括:In order to achieve the above object, the present invention provides a probe unit structure, comprising:
一种探针单元结构,包括:A probe unit structure, comprising:
一第一定位基板,设有多个第一穿针孔;A first positioning substrate, provided with a plurality of first pinholes;
一第二定位基板,对应该第一定位基板配置,该第二定位基板设有对应该多个第一穿针孔的多个第二穿针孔;A second positioning substrate, configured corresponding to the first positioning substrate, the second positioning substrate is provided with a plurality of second pin holes corresponding to the plurality of first pin holes;
多个接触探针,每一该接触探针的两端分别穿接于各该第一穿针孔及各该第二穿针孔;以及a plurality of contact probes, the two ends of each of the contact probes are respectively pierced through each of the first pinholes and each of the second pinholes; and
一间隔件,连接于该第一定位基板及该第二定位基板之间,该间隔件设有容置该多个接触探针的一容室;a spacer connected between the first positioning substrate and the second positioning substrate, the spacer is provided with a chamber for accommodating the plurality of contact probes;
其中,该第一定位基板相对该第二定位基板滑位移动,从而使该多个第一穿针孔及该多个第二穿针孔产生偏位关系,以令每一该接触探针的两端分别被该第一定位基板及该第二定位基板夹掣定位。Wherein, the first positioning substrate slides relative to the second positioning substrate, so that the plurality of first pinholes and the plurality of second pinholes are offset, so that each of the contact probes The two ends are clamped and positioned by the first positioning substrate and the second positioning substrate respectively.
为了达到上述的目的,本发明还提供一种探针单元的制作方法,其步骤包括:In order to achieve the above object, the present invention also provides a method for making a probe unit, the steps of which include:
a)将该第二定位基板配置在该第一定位基板上方,并令每一该接触探针穿入各该第一穿针孔及各该第二穿针孔;a) disposing the second positioning substrate above the first positioning substrate, and making each of the contact probes penetrate each of the first pinholes and each of the second pinholes;
b)提供一升高工具,该升高工具顶高该第二定位基板,使该第一定位基板及该第二定位基板之间形成有一间距;b) provide a lifting tool, the lifting tool lifts the second positioning substrate, so that a distance is formed between the first positioning substrate and the second positioning substrate;
c)将该间隔件置入该间距并夹置于该第一定位基板及该第二定位基板之间,使该第一定位基板及该第二定位基板之间形成有该容室,并令每一该接触探针的两端分别穿接于各该第一穿针孔及各该第二穿针孔;c) placing the spacer into the gap and sandwiching it between the first positioning substrate and the second positioning substrate, so that the chamber is formed between the first positioning substrate and the second positioning substrate, and the The two ends of each contact probe are respectively pierced through each of the first needle holes and each of the second needle holes;
d)提供多个螺固元件,该第二定位基板通过各该螺固元件以锁固在该间隔件;d) providing a plurality of screw fixing elements, the second positioning substrate is locked on the spacer by each of the screw fixing elements;
e)提供多个锁固元件,该第一定位基板通过各该锁固元件以锁固在该间隔件;以及e) providing a plurality of locking elements, the first positioning substrate is locked on the spacer by each of the locking elements; and
f)将该多个锁固元件暂时松脱,自该第一定位基板相对该第二定位基板滑位移动,从而使该多个第一穿针孔及该多个第二穿针孔产生偏位关系,以令每一该接触探针的两端分别被该第一定位基板及该第二定位基板夹掣定位。f) Temporarily loosen the plurality of locking elements, and slide relative to the second positioning substrate from the first positioning substrate, so that the plurality of first needle-through holes and the plurality of second needle-through holes are offset. position relationship, so that the two ends of each contact probe are clamped and positioned by the first positioning substrate and the second positioning substrate respectively.
本发明还具有以下功效:The present invention also has the following effects:
本发明利用直径细径化的接触探针受力下较容易发生弯折,使第一定位基板相对第二定位基板滑位移动,从而使第一穿针孔及第二穿针孔产生偏位关系,以令每一接触探针的两端分别被第一定位基板及第二定位基板压制产生变形,从而使每一接触探针被卡掣固定在第一定位基板及第二定位基板之间,进而达到接触探针的直径细径化下,制作成探针单元仍具有简单便利及成本低廉的功效。In the present invention, the contact probe with a reduced diameter is more likely to be bent under force, so that the first positioning substrate slides and moves relative to the second positioning substrate, so that the first needle hole and the second needle hole are displaced. relationship, so that the two ends of each contact probe are pressed and deformed by the first positioning substrate and the second positioning substrate respectively, so that each contact probe is clamped and fixed between the first positioning substrate and the second positioning substrate , and further achieve the reduction of the diameter of the contact probe, the probe unit still has the effect of simplicity, convenience and low cost.
另外,每一接触探针的两端分别被第一定位基板及第二定位基板压制产生变形,以定位接触探针并避免检测时接触探针接触不良或脱落,进而提高本发明探针单元结构的使用稳定性。In addition, the two ends of each contact probe are pressed and deformed by the first positioning substrate and the second positioning substrate respectively, so as to locate the contact probe and avoid poor contact or falling off of the contact probe during detection, thereby improving the structure of the probe unit of the present invention. use stability.
又,第一定位基板及第二定位基板在制作时是相互叠置的,并通过升高工具使第一定位基板及第二定位基板之间形成有间距,间隔件再置入间距并夹置于第一定位基板及第二定位基板之间,以形成有容置各接触探针的容室;相较现有,本发明探针单元结构在制作与组合上更具有步骤简单及组装容易的特点。In addition, the first positioning substrate and the second positioning substrate are stacked on each other during production, and a distance is formed between the first positioning substrate and the second positioning substrate by raising the tool, and the spacer is inserted into the distance and clamped. Between the first positioning substrate and the second positioning substrate, a chamber for accommodating each contact probe is formed; compared with the existing ones, the probe unit structure of the present invention has simpler steps and easier assembly in fabrication and assembly. features.
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
附图说明Description of drawings
图1本现有的探针单元的组合示意图;Fig. 1 is a combined schematic diagram of the existing probe unit;
图2本现有的探针单元的局部放大图;Figure 2 is a partial enlarged view of the existing probe unit;
图3本发明探针单元结构的分解立体图;Fig. 3 is an exploded perspective view of the probe unit structure of the present invention;
图4本发明接触探针的立体示意图;Fig. 4 is a three-dimensional schematic diagram of a contact probe of the present invention;
图5本发明探针单元结构的组合示意图;Fig. 5 combined schematic diagram of probe unit structure of the present invention;
图6本发明探针单元结构的剖视示意图;Fig. 6 is a schematic cross-sectional view of the probe unit structure of the present invention;
图7本发明探针单元制作方法的步骤流程图;Figure 7 is a flow chart of the steps of the probe unit manufacturing method of the present invention;
图8A本发明第一定位基板、第二定位基板及接触探针欲放置第一摆放工具的示意图;FIG. 8A is a schematic diagram of the first positioning substrate, the second positioning substrate and the contact probe to be placed on the first placement tool of the present invention;
图8B本发明升高工具欲穿设第一摆放工具及第一定位基板的侧视剖视图;Fig. 8B is a side sectional view of the raising tool of the present invention to be inserted with the first positioning tool and the first positioning substrate;
图8C本发明升高工具已顶高第二定位基板的侧视剖视图;Fig. 8C is a side sectional view of the raising tool of the present invention having raised the second positioning substrate;
图8D本发明半间隔板欲夹置入第一定位基板及第二定位基板的示意图;FIG. 8D is a schematic diagram of the half partition board of the present invention to be inserted into the first positioning substrate and the second positioning substrate;
图8E本发明第二摆放工具欲固定在第二定位基板及间隔件的示意图;FIG. 8E is a schematic diagram of the second placement tool of the present invention to be fixed on the second positioning substrate and the spacer;
图8F本发明第二摆放工具已固定在第二定位基板及间隔件的侧视剖视图;Fig. 8F is a side sectional view of the second positioning tool of the present invention fixed on the second positioning substrate and the spacer;
图8G本发明第一定位基板翻转设置在第二定位基板上方的侧视剖视图;Fig. 8G is a side cross-sectional view of the first positioning substrate flipped over the second positioning substrate of the present invention;
图8H本发明欲拆卸第一摆放工具及第二摆放工具的侧视剖视图;Fig. 8H is a side sectional view of the present invention to disassemble the first placement tool and the second placement tool;
图8I本发明第一定位基板欲相对第二定位基板滑位的侧视剖视图;Fig. 8I is a side sectional view of the first positioning substrate to be slid relative to the second positioning substrate in the present invention;
图8J本发明第一穿针孔及第二穿针孔欲偏位配置的侧视剖视图;Fig. 8J is a side sectional view of the first pinhole and the second pinhole of the present invention to be arranged in offset positions;
图8K本发明第一穿针孔及第二穿针孔已偏位配置的侧视剖视图;Fig. 8K is a side sectional view of the offset arrangement of the first needle hole and the second needle hole of the present invention;
图8L本发明第一定位基板已固定在间隔件及第二定位基板的侧视剖视图;Fig. 8L is a side sectional view of the first positioning substrate fixed on the spacer and the second positioning substrate of the present invention;
图9本发明探针单元结构的使用状态示意图。Fig. 9 is a schematic view of the use state of the probe unit structure of the present invention.
其中,附图标记Among them, reference signs
现有技术current technology
10…上定位基板10...upper positioning substrate
101…大孔槽101…Large hole slot
102…小孔槽102…Small hole slot
20…下定位基板20...Lower positioning substrate
30…固定构件30...fixed member
40…接触探针40…contact probe
本发明this invention
1…第一定位基板1...The first positioning substrate
11…第一内绝缘板11...the first inner insulation board
111…锁孔111...Keyhole
12…第一外绝缘板12...the first outer insulation board
121…埋设孔121...Buried hole
13…第一穿针孔13...the first pinhole
2…第二定位基板2...Second positioning substrate
21…第二内绝缘板21...Second inner insulation board
211…锁孔211...Keyhole
22…第二外绝缘板22…Second outer insulation board
221…埋设孔221...Buried hole
23…第二穿针孔23…Second needle hole
3…接触探针3…contact probe
31…检测部31...Detection Department
32…突出部32…Protrusion
4…间隔件4…Spacer
41…容室41…containment room
42…半间隔板42…half partition
421…U形容槽421...U-shaped groove
5…螺固元件5...Screw fixing element
51…头部51...Head
6…锁固元件6...Locking element
61…头部61...Head
100…第一摆放工具100...first placement tool
200…升高工具200…Elevating tools
300…第二摆放工具300…second placement tool
400…信号处理装置400…Signal processing device
S…间距S...spacing
具体实施方式Detailed ways
有关本发明的详细说明及技术内容,将配合附图说明如下,然而所附的附图仅作为说明用途,并非用于局限本发明。The detailed description and technical content of the present invention will be described as follows with the accompanying drawings, but the attached drawings are only for illustration purposes and are not intended to limit the present invention.
请参考图3至图6所示,本发明提供一种探针单元结构及其制作方法,此探针单元结构主要包括一第一定位基板1、一第二定位基板2、多个接触探针3及一间隔件4。Please refer to FIG. 3 to FIG. 6, the present invention provides a probe unit structure and its manufacturing method, the probe unit structure mainly includes a first positioning substrate 1, a second positioning substrate 2, a plurality of contact probes 3 and a spacer 4.
第一定位基板1包含一第一内绝缘板11及黏接于第一内绝缘板11的一第一外绝缘板12,第一内绝缘板11及第一外绝缘板12共同设有多个第一穿针孔13;又,第一内绝缘板11设有多个锁孔111,第一外绝缘板12设有对应该多个锁孔111的多个埋设孔121。The first positioning substrate 1 includes a first inner insulating plate 11 and a first outer insulating plate 12 bonded to the first inner insulating plate 11, the first inner insulating plate 11 and the first outer insulating plate 12 are jointly provided with a plurality of The first pin hole 13 ; moreover, the first inner insulating plate 11 is provided with a plurality of locking holes 111 , and the first outer insulating plate 12 is provided with a plurality of embedding holes 121 corresponding to the plurality of locking holes 111 .
第二定位基板2对应第一定位基板1配置,第二定位基板2包含一第二内绝缘板21及黏接于第二内绝缘板21的一第二外绝缘板22,第二内绝缘板21及第二外绝缘板22共同设有对应该多个第一穿针孔13的多第二穿针孔23;又,第二内绝缘板21设有多个锁孔211,第二外绝缘板22设有对应该多个锁孔211的多个埋设孔221。The second positioning substrate 2 is configured corresponding to the first positioning substrate 1. The second positioning substrate 2 includes a second inner insulating plate 21 and a second outer insulating plate 22 bonded to the second inner insulating plate 21. The second inner insulating plate 21 and the second outer insulating plate 22 are jointly provided with multiple second pin holes 23 corresponding to the plurality of first pin holes 13; again, the second inner insulating plate 21 is provided with a plurality of lock holes 211, and the second outer insulating plate The board 22 is provided with a plurality of embedding holes 221 corresponding to the plurality of locking holes 211 .
每一接触探针3的两端分别穿接于各第一穿针孔13及各第二穿针孔23,每一接触探针3一端具有一检测部31,另一端具有一突出部32,检测部31经由各第一穿针孔13裸露于第一定位基板1,突出部32经由各第二穿针孔23卡掣于第二定位基板2。The two ends of each contact probe 3 are connected to each first needle hole 13 and each second needle hole 23 respectively, and each contact probe 3 has a detection portion 31 at one end and a protruding portion 32 at the other end. The detection part 31 is exposed to the first positioning substrate 1 through each first needle-through hole 13 , and the protruding part 32 is locked to the second positioning substrate 2 through each second needle-through hole 23 .
间隔件4连接于第一定位基板1及第二定位基板2之间,详细说明如下,第一内绝缘板11夹置在间隔件4及第一外绝缘板12之间,第二内绝缘板21夹置在间隔件4及第二外绝缘板22之间;间隔件4包含对称组合的二半间隔板42,二半间隔板42夹置于第一定位基板1及第二定位基板2之间,每一半间隔板42设有一U形容槽421,二U形容槽421形成有容置该多个接触探针3的一容室41。The spacer 4 is connected between the first positioning substrate 1 and the second positioning substrate 2. The details are as follows. The first inner insulating plate 11 is sandwiched between the spacer 4 and the first outer insulating plate 12, and the second inner insulating plate 21 is sandwiched between the spacer 4 and the second outer insulating plate 22; the spacer 4 includes two half-spacers 42 that are symmetrically combined, and the two half-spacers 42 are sandwiched between the first positioning substrate 1 and the second positioning substrate 2 In between, each half of the partition plate 42 is provided with a U-shaped groove 421 , and the two U-shaped grooves 421 form a chamber 41 for accommodating the plurality of contact probes 3 .
其中,第一定位基板1相对第二定位基板2滑位移动,从而使该多个第一穿针孔13及该多个第二穿针孔23产生偏位关系,以令每一接触探针3的两端分别被第一定位基板1及第二定位基板2夹掣定位,详细说明如下,每一接触探针3的两端分别被第一定位基板1及第二定位基板2压制产生变形,从而使每一接触探针3被卡掣固定在第一定位基板1及第二定位基板2之间。Wherein, the first positioning substrate 1 slides and moves relative to the second positioning substrate 2, so that the plurality of first needle holes 13 and the plurality of second needle holes 23 are offset, so that each contact probe The two ends of 3 are clamped and positioned by the first positioning substrate 1 and the second positioning substrate 2 respectively. The details are as follows. The two ends of each contact probe 3 are respectively pressed by the first positioning substrate 1 and the second positioning substrate 2 to generate deformation. , so that each contact probe 3 is locked and fixed between the first positioning substrate 1 and the second positioning substrate 2 .
本发明还包括多个螺固元件5,每一螺固元件5具有一头部51,每一头部51的外周缘尺寸小于每一埋设孔221的孔径尺寸,各螺固元件5经由各锁孔211将第二内绝缘板21对应间隔件4锁固,各头部51埋设于各埋设孔221。The present invention also includes a plurality of screw fixing elements 5, each screw fixing element 5 has a head 51, the outer peripheral dimension of each head 51 is smaller than the aperture size of each embedding hole 221, and each screw fixing element 5 passes through each lock The holes 211 lock the second inner insulating plate 21 corresponding to the spacer 4 , and each head 51 is buried in each embedding hole 221 .
本发明还包括多个锁固元件6,每一锁固元件6具有一头部61,每一头部61的外周缘尺寸小于每一埋设孔121的孔径尺寸,各锁固元件6经由各锁孔111将第一内绝缘板11对应间隔件4锁固,各头部61埋设于各埋设孔121。The present invention also includes a plurality of locking elements 6, each locking element 6 has a head 61, the outer peripheral dimension of each head 61 is smaller than the aperture size of each embedding hole 121, each locking element 6 passes through each lock The holes 111 lock the first inner insulating plate 11 corresponding to the spacer 4 , and each head 61 is embedded in each embedding hole 121 .
本发明探针单元结构的组合,其是利用第一定位基板1设有各第一穿针孔13;第二定位基板2对应第一定位基板1配置,第二定位基板2设有对应各第一穿针孔13的各第二穿针孔23;每一接触探针3的两端分别穿接于各第一穿针孔13及各第二穿针孔23;间隔件4夹置于第一定位基板1及第二定位基板2之间;其中,第一定位基板1相对第二定位基板2滑位移动,从而使该多个第一穿针孔13及该多个第二穿针孔23产生偏位关系,以令每一接触探针3的两端分别被第一定位基板1及第二定位基板2夹掣定位,详细说明如下,每一接触探针3的两端分别被第一定位基板1及第二定位基板2压制产生变形,从而使每一接触探针3被卡掣固定在第一定位基板1及第二定位基板2之间。The combination of the probe unit structure of the present invention utilizes the first positioning substrate 1 to be provided with each first pin hole 13; the second positioning substrate 2 is configured corresponding to the first positioning substrate 1, and the second positioning substrate 2 is provided with corresponding first Each of the second needle holes 23 of the first needle hole 13; the two ends of each contact probe 3 are respectively connected to the first needle holes 13 and the second needle holes 23; the spacer 4 is sandwiched between the first needle holes 23 Between a positioning substrate 1 and a second positioning substrate 2; wherein, the first positioning substrate 1 slides relative to the second positioning substrate 2, so that the plurality of first needle holes 13 and the plurality of second needle holes 23 produces a bias relationship, so that the two ends of each contact probe 3 are respectively clamped and positioned by the first positioning substrate 1 and the second positioning substrate 2. The details are as follows, and the two ends of each contact probe 3 are respectively held by the second positioning substrate 2. The first positioning substrate 1 and the second positioning substrate 2 are deformed by pressing, so that each contact probe 3 is locked and fixed between the first positioning substrate 1 and the second positioning substrate 2 .
藉此,因探针单元为配合半导体集成电路在高集成化、微细化的进展,也会将各接触探针的直径细径化,但接触探针的直径缩小时,导致探针单元在制作与组合上有极大的困难而无法突破;相较下,本发明利用直径细径化的接触探针3受力下较容易发生弯折,使第一定位基板1相对第二定位基板2滑位移动,从而使该多个第一穿针孔13及该多个第二穿针孔23以偏位配置,以令每一接触探针3的两端分别被第一定位基板1及第二定位基板2压制产生变形,从而使每一接触探针3被卡掣固定在第一定位基板1及第二定位基板2之间,进而达到接触探针3的直径细径化下,制作成探针单元仍具有简单便利及成本低廉的功效。In this way, the diameter of each contact probe will also be reduced in order to cooperate with the progress of high integration and miniaturization of semiconductor integrated circuits in the probe unit, but when the diameter of the contact probe is reduced, the probe unit will not There are great difficulties in combination and cannot be broken through; in comparison, the present invention utilizes the contact probe 3 with a reduced diameter to bend easily under force, so that the first positioning substrate 1 slides relative to the second positioning substrate 2 position, so that the plurality of first needle holes 13 and the plurality of second needle holes 23 are arranged in offset positions, so that the two ends of each contact probe 3 are respectively positioned by the first positioning substrate 1 and the second positioning substrate 1. The positioning substrate 2 is pressed and deformed, so that each contact probe 3 is clamped and fixed between the first positioning substrate 1 and the second positioning substrate 2, and then the diameter of the contact probe 3 is reduced to make a probe. The needle unit still has the functions of simplicity, convenience and low cost.
请参考图7及图8A至图8L所示,上述探针单元结构的制作方法步骤。Please refer to FIG. 7 and FIG. 8A to FIG. 8L for the manufacturing method steps of the above-mentioned probe unit structure.
如图7的步骤a及图8A所示,首先,提供一第一摆放工具100、一第一定位基板1、一第二定位基板2及多个接触探针3,第一摆放工具100依序定位第一定位基板1、第二定位基板2及多个接触探针3,第一定位基板1设有多个第一穿针孔13,第二定位基板2设有对应该多个第一穿针孔13的多个第二穿针孔23,第二定位基板2配置在第一定位基板1的上方,每一接触探针3穿入各第一穿针孔13及各第二穿针孔23;其中,每一接触探针3一端具有一检测部31,另一端具有一突出部32,检测部31经由各第一穿针孔13裸露于第一定位基板1,突出部32经由各第二穿针孔23卡掣于第二定位基板2;详细说明如下,第一摆放工具100使第二定位基板2定位设置在第一定位基板1上方;再者,每一接触探针3穿入各第一穿针孔13及各第二穿针孔23时,第一摆放工具100会提供一空间,使每一接触探针3会经由各第一穿针孔13及各第二穿针孔23而容置在第一摆放工具100中,导致各突出部32经由各第二穿针孔23以卡掣于第二定位基板2,进而定位每一接触探针3的位置。As shown in step a of Figure 7 and Figure 8A, at first, provide a first placement tool 100, a first positioning substrate 1, a second positioning substrate 2 and a plurality of contact probes 3, the first placement tool 100 The first positioning substrate 1, the second positioning substrate 2 and a plurality of contact probes 3 are positioned sequentially. The first positioning substrate 1 is provided with a plurality of first needle holes 13, and the second positioning substrate 2 is provided with corresponding A plurality of second pin holes 23 of a pin hole 13, the second positioning substrate 2 is disposed above the first positioning substrate 1, and each contact probe 3 penetrates each first pin hole 13 and each second pin hole. Pinholes 23; wherein, one end of each contact probe 3 has a detection portion 31, and the other end has a protruding portion 32, the detection portion 31 is exposed to the first positioning substrate 1 through each first pin hole 13, and the protruding portion 32 passes through Each second pin hole 23 is locked on the second positioning substrate 2; the details are as follows, the first positioning tool 100 positions the second positioning substrate 2 above the first positioning substrate 1; moreover, each contact probe 3 When penetrating each first needle-through hole 13 and each second needle-through hole 23, the first placement tool 100 will provide a space so that each contact probe 3 will pass through each first needle-through hole 13 and each second needle-through hole 23. Two needle holes 23 are accommodated in the first placement tool 100, so that each protrusion 32 is locked to the second positioning substrate 2 through each second needle hole 23, thereby positioning the position of each contact probe 3 .
如图7的步骤b及图8A至图8C所示,另外,提供一升高工具200,升高工具200从第一摆放工具100的下方顶高第二定位基板2,使第一定位基板1及第二定位基板2之间形成有一间距S。As shown in step b of Figure 7 and Figures 8A to 8C, in addition, a lifting tool 200 is provided, and the lifting tool 200 lifts the second positioning substrate 2 from the bottom of the first placement tool 100, so that the first positioning substrate A distance S is formed between 1 and the second positioning substrate 2 .
如图7的步骤c及图8D所示,提供一间隔件4,此间隔件4分为对称组合的二半间隔板42,每一半间隔板42设有一U形容槽421,二U形容槽421共同形成一容室41;再将二半间隔板42置入间距S中,同时让二半间隔板42组合成间隔件4,以让间隔件4夹置于第一定位基板1及第二定位基板2之间,且使第一定位基板1及第二定位基板2之间形成有容置该多个接触探针3的容室41,并令每一接触探针3的两端分别穿接于各第一穿针孔13及各第二穿针孔23。As shown in step c of Fig. 7 and Fig. 8D, a spacer 4 is provided, and this spacer 4 is divided into two half partition plates 42 of symmetrical combination, each half partition plate 42 is provided with a U-shaped groove 421, two U-shaped grooves 421 A chamber 41 is formed together; then the two half-spacer plates 42 are placed in the distance S, and the two half-spacer plates 42 are combined into a spacer 4, so that the spacer 4 is sandwiched between the first positioning substrate 1 and the second positioning plate. Between the substrates 2, and between the first positioning substrate 1 and the second positioning substrate 2, a chamber 41 for accommodating the plurality of contact probes 3 is formed, and the two ends of each contact probe 3 are respectively pierced. In each first needle hole 13 and each second needle hole 23 .
如图7的步骤d及图8D所示,又,提供多个螺固元件,第二定位基板2经由各该螺固元件5以锁固在间隔件4;详细说明如下,第二定位基板2包含一第二内绝缘板21及黏接于第二内绝缘板21的一第二外绝缘板22,第二内绝缘板21夹置在间隔件4及第二外绝缘板22之间,第二内绝缘板21及第二外绝缘板22共同设有该多个第二穿针孔23;每一螺固元件5具有一头部51,第二内绝缘板21设有多个锁孔211,第二外绝缘板22设有对应各锁孔211的多个埋设孔221,每一埋设孔221的孔径尺寸大于每一头部51的外周缘尺寸,各螺固元件5经由各锁孔211将该第二内绝缘板21对应间隔件4锁固,使各头部51埋设于各埋设孔221。As shown in step d of FIG. 7 and FIG. 8D, a plurality of screw fixing elements are provided, and the second positioning substrate 2 is locked on the spacer 4 through each of the screw fixing elements 5; detailed description is as follows, the second positioning substrate 2 It includes a second inner insulating board 21 and a second outer insulating board 22 bonded to the second inner insulating board 21, the second inner insulating board 21 is sandwiched between the spacer 4 and the second outer insulating board 22, the second The second inner insulating plate 21 and the second outer insulating plate 22 are jointly provided with the plurality of second needle holes 23; each screw element 5 has a head 51, and the second inner insulating plate 21 is provided with a plurality of locking holes 211 , the second outer insulating plate 22 is provided with a plurality of embedding holes 221 corresponding to each locking hole 211, the aperture size of each embedding hole 221 is larger than the outer peripheral dimension of each head 51, and each screw element 5 passes through each locking hole 211 The second inner insulating plate 21 is locked corresponding to the spacer 4 so that the heads 51 are buried in the embedding holes 221 .
如图7的步骤e及图8E至图8G所示,其中,本发明还包括在e步骤之前的一个步骤e’,其中e’步骤中提供一第二摆放工具300,第二摆放工具300对应第二定位基板2装固并顶抵该多个接触探针3,第一摆放工具100及第二摆放工具300共同夹置第一定位基板1、第二定位基板2、该多个接触探针3及间隔件4;此第二摆放工具300目的使第一定位基板1经由第二摆放工具300翻转以设置在第二定位基板2上方,第二摆放工具300并防止各接触探针3脱落于各第一穿针孔13及各第二穿针孔23;因此,第二摆放工具300装固在第二定位基板2后,再翻转使第一定位基板1设置在第二定位基板2的上方,即可脱开升高工具200,以进行如下步骤。As shown in step e of FIG. 7 and FIG. 8E to FIG. 8G, the present invention also includes a step e' before step e, wherein a second placement tool 300 is provided in the step e', and the second placement tool 300 corresponds to the second positioning substrate 2 and is fixed against the plurality of contact probes 3. The first positioning tool 100 and the second positioning tool 300 clamp the first positioning substrate 1, the second positioning substrate 2, the plurality of contact probes 3 together. a contact probe 3 and a spacer 4; the purpose of the second placing tool 300 is to turn the first positioning substrate 1 over the second positioning substrate 2 to be arranged on the second positioning substrate 2, and the second placing tool 300 prevents Each contact probe 3 falls off each first needle hole 13 and each second needle hole 23; therefore, after the second positioning tool 300 is installed and fixed on the second positioning substrate 2, it is turned over to make the first positioning substrate 1 set. On the top of the second positioning substrate 2 , the lifting tool 200 can be disengaged to perform the following steps.
再者,提供多个锁固元件6,第一摆放工具100设有多个通孔,各锁固元件6利用第一摆放工具100的通孔,以将第一定位基板1锁固在间隔件4上;详细说明如下,第一定位基板1包含一第一内绝缘板11及黏接于第一内绝缘板11的一第一外绝缘板12,第一内绝缘板11夹置在间隔件4及第一外绝缘板12之间,第一内绝缘板11及第一外绝缘板12共同设有该多个第一穿针孔13;每一锁固元件6具有一头部61,该第一内绝缘板11设有多个锁孔111,第一外绝缘板12设有对应各锁孔111的多个埋设孔121,每一埋设孔121的孔径尺寸大于每一头部61的外周缘尺寸,各锁固元件6经由各锁孔111将第一内绝缘板11锁固于间隔件4,各头部61埋设于各埋设孔121。Furthermore, a plurality of locking elements 6 are provided, and the first placing tool 100 is provided with a plurality of through holes, and each locking element 6 utilizes the through holes of the first placing tool 100 to lock the first positioning substrate 1 on the On the spacer 4; detailed description is as follows, the first positioning substrate 1 includes a first inner insulating plate 11 and a first outer insulating plate 12 bonded to the first inner insulating plate 11, the first inner insulating plate 11 is sandwiched between Between the spacer 4 and the first outer insulating plate 12, the first inner insulating plate 11 and the first outer insulating plate 12 are jointly provided with the plurality of first needle holes 13; each locking element 6 has a head 61 , the first inner insulating plate 11 is provided with a plurality of locking holes 111, the first outer insulating plate 12 is provided with a plurality of embedding holes 121 corresponding to each locking hole 111, and the diameter of each embedding hole 121 is larger than that of each head 61 Each locking element 6 locks the first inner insulating plate 11 to the spacer 4 through each locking hole 111 , and each head 61 is buried in each embedding hole 121 .
如图7的步骤f及图8H至图8L所示,利用升高工具200拆卸第一摆放工具100,此时第一定位基板1及第二定位基板2分别经由锁固元件6及螺固元件5对应间隔件4锁固;最后,将该多个锁固元件6暂时松脱,自第一定位基板1相对第二定位基板2滑位移动,从而使该多个第一穿针孔13及该多个第二穿针孔23产生偏位关系,以令每一接触探针3的两端分别被第一定位基板1及第二定位基板2夹掣定位,详细说明如下,每一接触探针3的两端分别被第一定位基板1及第二定位基板2压制产生变形,从而使每一接触探针3被卡掣固定在第一定位基板1及第二定位基板2之间,再拆卸第二摆放工具300,即完成探针单元结构。As shown in step f of FIG. 7 and FIG. 8H to FIG. 8L, the first positioning tool 100 is disassembled by using the lifting tool 200. At this time, the first positioning substrate 1 and the second positioning substrate 2 are respectively fixed by the locking element 6 and the screw. The element 5 is locked corresponding to the spacer 4; finally, the plurality of locking elements 6 are temporarily released, and the first positioning substrate 1 is slid to move relative to the second positioning substrate 2, so that the plurality of first needle holes 13 And the plurality of second pinholes 23 produce an offset relationship, so that the two ends of each contact probe 3 are respectively clamped and positioned by the first positioning substrate 1 and the second positioning substrate 2. The details are as follows. The two ends of the probes 3 are pressed and deformed by the first positioning substrate 1 and the second positioning substrate 2 respectively, so that each contact probe 3 is clamped and fixed between the first positioning substrate 1 and the second positioning substrate 2, Then the second placement tool 300 is disassembled to complete the structure of the probe unit.
所以,通过上述的构造组成,即可得到本发明探针单元结构及其制作方法。藉此,第一定位基板1及第二定位基板2在制作时是相互叠置的,并通过升高工具200使第一定位基板1及第二定位基板2之间形成有间距S,间隔件4再置入间距S并夹置于第一定位基板1及第二定位基板2之间,以形成有容置各接触探针3的容室41;相较现有,本发明探针单元结构在制作与组合上还具有步骤简单及组装容易的特点。Therefore, the probe unit structure of the present invention and its manufacturing method can be obtained through the above-mentioned structural composition. Thereby, the first positioning substrate 1 and the second positioning substrate 2 are stacked on each other during manufacture, and a space S is formed between the first positioning substrate 1 and the second positioning substrate 2 through the lifting tool 200, and the spacer 4. Then insert the spacing S and sandwich between the first positioning substrate 1 and the second positioning substrate 2 to form a chamber 41 for accommodating each contact probe 3; compared with the existing ones, the probe unit structure of the present invention It also has the characteristics of simple steps and easy assembly in production and combination.
如图9所示,本发明探针单元结构的使用状态,其中,接触探针3一端的检测部31对应检查对象接触,并触探针3的另一端,即具有突出部32的一端对应信号处理装置400电性连接,使探针单元以分别电性连接检查对象及信号处理装置400,以达到检查对象与输出检查用信号的信号处理装置400之间的电性连接。此外,每一接触探针3的两端分别被第一定位基板1及第二定位基板2压制产生变形;藉此,定位接触探针3,以避免检测时接触探针3接触不良或脱落,进而提高本发明探针单元结构的使用稳定性。As shown in Figure 9, the use state of the probe unit structure of the present invention, wherein, the detection part 31 of one end of the contact probe 3 is in contact with the corresponding inspection object, and the other end of the contact probe 3, that is, the end with the protruding part 32 corresponds to the signal The processing device 400 is electrically connected so that the probe unit is electrically connected to the inspection object and the signal processing device 400 respectively, so as to achieve the electrical connection between the inspection object and the signal processing device 400 that outputs inspection signals. In addition, the two ends of each contact probe 3 are pressed and deformed by the first positioning substrate 1 and the second positioning substrate 2 respectively; thereby, the contact probe 3 is positioned to avoid poor contact or falling off of the contact probe 3 during detection, Further, the use stability of the probe unit structure of the present invention is improved.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210030997.6A CN103245807B (en) | 2012-02-06 | 2012-02-06 | Probe unit structure and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210030997.6A CN103245807B (en) | 2012-02-06 | 2012-02-06 | Probe unit structure and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103245807A CN103245807A (en) | 2013-08-14 |
CN103245807B true CN103245807B (en) | 2015-11-25 |
Family
ID=48925454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210030997.6A Active CN103245807B (en) | 2012-02-06 | 2012-02-06 | Probe unit structure and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103245807B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107607746B (en) * | 2016-07-11 | 2024-04-09 | 致茂电子(苏州)有限公司 | Clip type probe device |
JP2018179721A (en) * | 2017-04-12 | 2018-11-15 | 株式会社日本マイクロニクス | Electrical connection device |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1657949A (en) * | 2004-02-17 | 2005-08-24 | 财团法人工业技术研究院 | Integrated probe card and assembly method |
CN1879025A (en) * | 2003-11-14 | 2006-12-13 | 温特沃斯实验室公司 | Die design with integrated assembly aid |
JP2008102070A (en) * | 2006-10-20 | 2008-05-01 | Hioki Ee Corp | Electronic component inspection probe |
TW201009343A (en) * | 2008-08-21 | 2010-03-01 | Kun-Mao Jiang | Vertical probe card |
TWM395828U (en) * | 2010-08-25 | 2011-01-01 | Certain Micro Applic Technology Inc | testing device for electronic component |
CN201845029U (en) * | 2010-11-08 | 2011-05-25 | 港建日置股份有限公司 | Test probe |
CN102193009A (en) * | 2010-03-16 | 2011-09-21 | 台湾积体电路制造股份有限公司 | Vertical probe card |
TW201137357A (en) * | 2009-12-18 | 2011-11-01 | Nihon Micronics Kk | Probe card and inspection apparatus |
CN202133687U (en) * | 2011-03-25 | 2012-02-01 | 金准科技股份有限公司 | Test Probes and Probe Holders |
-
2012
- 2012-02-06 CN CN201210030997.6A patent/CN103245807B/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1879025A (en) * | 2003-11-14 | 2006-12-13 | 温特沃斯实验室公司 | Die design with integrated assembly aid |
CN1657949A (en) * | 2004-02-17 | 2005-08-24 | 财团法人工业技术研究院 | Integrated probe card and assembly method |
JP2008102070A (en) * | 2006-10-20 | 2008-05-01 | Hioki Ee Corp | Electronic component inspection probe |
TW201009343A (en) * | 2008-08-21 | 2010-03-01 | Kun-Mao Jiang | Vertical probe card |
TW201137357A (en) * | 2009-12-18 | 2011-11-01 | Nihon Micronics Kk | Probe card and inspection apparatus |
CN102193009A (en) * | 2010-03-16 | 2011-09-21 | 台湾积体电路制造股份有限公司 | Vertical probe card |
TWM395828U (en) * | 2010-08-25 | 2011-01-01 | Certain Micro Applic Technology Inc | testing device for electronic component |
CN201845029U (en) * | 2010-11-08 | 2011-05-25 | 港建日置股份有限公司 | Test probe |
CN202133687U (en) * | 2011-03-25 | 2012-02-01 | 金准科技股份有限公司 | Test Probes and Probe Holders |
Also Published As
Publication number | Publication date |
---|---|
CN103245807A (en) | 2013-08-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103063886B (en) | Probe card for probing integrated circuit | |
TWI727162B (en) | Probe card for a testing apparatus of electronic devices | |
US20080139017A1 (en) | Electric connector and electrical connecting apparatus using the same | |
KR100928228B1 (en) | Inspection socket for semiconductor chip test | |
KR100994219B1 (en) | Test socket | |
TW200912323A (en) | Probe card | |
CN103675369B (en) | Probe card and method of manufacturing the same | |
US9453875B2 (en) | Multi-stage circuit board test | |
CN103245807B (en) | Probe unit structure and manufacturing method thereof | |
TWI432735B (en) | Probe unit structure and method of manufacturing the same | |
TWI400442B (en) | A detection method for a detection device and a panel | |
KR20110093242A (en) | Probe block assembly | |
JP2013148464A (en) | Test jig structure of circuit board | |
CN109387767B (en) | Be applied to positioning jig of PCB board | |
CN201812003U (en) | Test equipment for electronic components | |
CN105445501B (en) | Electrical detection device for environmental testing | |
CN205910222U (en) | Improved Needle Seat Structure of Inspection Fixture | |
CN210514407U (en) | Probe head and conductive probe thereof | |
CN105277754B (en) | Probe card and its switching circuit board and signal feed-in structure | |
TWM591621U (en) | Detecting device | |
TWI724482B (en) | Probe module | |
CN206848309U (en) | Gauging fixture and the check device for possessing the gauging fixture | |
US20110204911A1 (en) | Prober unit | |
TW201329468A (en) | Structural improvement of circuit board testing jig | |
CN206330995U (en) | Improved structure of wafer test needle seat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |