CN103207526B - A kind of exposure correction-compensation method - Google Patents
A kind of exposure correction-compensation method Download PDFInfo
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- CN103207526B CN103207526B CN201210010746.1A CN201210010746A CN103207526B CN 103207526 B CN103207526 B CN 103207526B CN 201210010746 A CN201210010746 A CN 201210010746A CN 103207526 B CN103207526 B CN 103207526B
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000012937 correction Methods 0.000 claims abstract description 22
- 238000012360 testing method Methods 0.000 claims abstract description 4
- 238000005192 partition Methods 0.000 claims description 18
- 239000000047 product Substances 0.000 claims description 15
- 239000013589 supplement Substances 0.000 claims description 6
- 238000002474 experimental method Methods 0.000 claims description 4
- 238000004458 analytical method Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000012795 verification Methods 0.000 claims description 3
- 238000012019 product validation Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
The present invention open one exposure correction-compensation method, including: S10: carry out the editor of test documentation, set subregion；S11: graphic file is carried out the exposure without any correction-compensation；S12: detect product by subregion, records IC opening size X on X with Y-direction in each subregion’ 1、Y’ 1；X’ 2、Y’ 2；……X’ m、Y’ m；S13: calculate scaling multiplying power；S14: be analyzed the data of X, Y-direction, fits to corresponding relation formula respectively, draws dissimilar IC cutout structural data X respectivelyMend、YMend；S15: apply on file after determining offset data and make Product Validation repeatability.The present invention exposes correction-compensation method and compensates on file, mainly achieves the effect of correction opening, and it is more more convenient, more economical, the most feasible by compensating light shield, exposure sources method than typically.
Description
Technical Field
The invention belongs to the technical field of exposure of solar cell substrates, and particularly relates to an exposure correction compensation method.
Background
The exposure technique is to cover a photoresist layer (photoresist layer) with a photosensitive material (photo-sensitive material) on a substrate, and then parallel light emitted from a light source is irradiated onto the photoresist layer through a photomask. In brief, the exposure is to pass parallel light through the mask to completely transfer the pattern on the mask to the photoresist layer.
However, in the subsequent production process, the pattern may be deformed due to liquid impact, temperature, etc. to cause deviation. Therefore, to obtain acceptable product dimensions, this needs to be corrected.
In the prior art, the correction method mainly includes:
1. a correction mechanism (correction mechanism) is provided for the exposure machine to prevent the film patterns on the substrate from deviating from each other. The specific scheme is as follows: after exposure, the position of a positioning mark (dummy mark) on the substrate is measured to estimate the deformation of the device film layer on the substrate. Then, according to the calculation result, performing correction of each dimension (dimension), including displacement correction, to correct the position error of the pattern in the X-axis direction and the Y-axis direction; a magnification (scale) correction for correcting magnification or reduction errors of the pattern; and rotation (rotate) correction for correcting the amount of torsional deformation of the pattern along the Z-axis.
2. Different types of openings are given different correction data on the X axis and the Y axis during data processing. The compensation data is obtained by calculating the compensation value by measuring the dimension of the final product pattern on the basis of one experiment, and finally correcting the exposure pattern by using the compensation value before exposure.
However, neither of the above-mentioned methods is a compensation on the document, and the quality and fineness of the product are difficult to be guaranteed. Therefore, development and research are necessary to provide a solution that ensures the provision of both product quality and fineness.
Disclosure of Invention
To solve the above problems, it is an object of the present invention to provide an exposure correction compensation method for improving the quality and fineness of an exposed product.
In order to achieve the purpose, the technical scheme of the invention is as follows:
an exposure correction compensation method includes the following steps:
s10: editing the test file and setting partitions;
s11: exposing the graphic file without any correction compensation;
s12: the product is inspected in the partitions of step S10, and the dimensions X of the IC opening in each partition in the X and Y directions are recorded’ 1、Y’ 1；X’ 2、Y’ 2；……X’ m、Y’ m；
S13: mixing X’(X’ 1、X’ 2、……X’ m) And X (X)1、X2、……Xm) For comparison, Y’(Y’ 1、Y’ 2、……Y’ m) And Y (Y)1、Y2、……Ym) Comparing and calculating the zoom ratio;
s14: after at least 2 times of experiments, the data in the direction of X, Y are analyzed and respectively fit into corresponding relationsIs a formula to respectively obtain different types of IC opening compensation data XSupplement device、YSupplement device；
S15: the compensation data is determined and applied to the document and a product verification reproducibility is made.
Further, the step S10 is specifically: setting partitions, and editing IC openings of the same type in the partitions, wherein the number of the IC openings is N; because the IC openings of different areas are required to be different, including the shapes and the sizes, characters for marking and distinguishing different subareas are marked; recording X and Y dimensions X for IC openings of different partitions1、Y1；X2、Y2；……Xm、Ym。
Further, the data detection in step S12 is performed by advanced four-in-one equipment, which is high in precision.
Further, the analysis of the data in step S14 is performed by fitting with a special data analysis software, and then an optimal parameter combination is obtained.
The exposure correction compensation method of the invention can compensate on the file, mainly achieve the function of correcting the opening, and is very useful for improving the product quality and the fineness compared with the compensation of an exposure machine. It is more convenient, more economical, more effective and feasible than the common compensation mask and exposure equipment method.
Drawings
FIG. 1 is a flow diagram of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, the exposure correction compensation method of the present invention includes the following steps:
s10: editing and setting partitions of test files
Setting partitions, and editing IC openings of the same type in the partitions, wherein the number of the IC openings is N; because the IC openings of different areas are required to be different, including the shapes and the sizes, characters for marking and distinguishing different subareas are marked; recording X and Y dimensions X for IC openings of different partitions1、Y1；X2、Y2；……Xm、Ym。
S11: exposure without any correction compensation for graphic files
And after pretreatment and film pasting, exposing the graphic file without any correction compensation, and after exposure is finished, continuing normal production processes such as electroforming or etching and the like to finish product production.
S12: the product is inspected in the partitions of step S10, and the dimensions X of the IC opening in each partition in the X and Y directions are recorded’ 1、Y’ 1；X’ 2、Y’ 2；……X’ m、Y’ m。
S13: mixing X’(X’ 1、X’ 2、……X’ m) And X (X)1、X2、……Xm) For comparison, Y’(Y’ 1、Y’ 2、……Y’ m) And Y (Y)1、Y2、……Ym) And comparing to calculate the scaling factor, wherein the scaling factor can be more than 1 or less than 1.
S14: after at least 2 times of experiments, the data in the direction of X, Y are analyzed and respectively fit into corresponding relationsIs a formula to respectively obtain different types of IC opening compensation data XSupplement device、YSupplement device。
S15: the compensation data is determined and applied to the document and a product verification reproducibility is made.
Wherein,
the detection of the data in the step S12 is obtained by advanced four-in-one equipment, and the precision is high.
And the analysis of the data in the step S14 is performed by adopting special data analysis software for fitting, and then the optimal parameter combination is obtained.
The invention makes the image size of the product meet the product requirement by carrying out the scaling compensation in the X, Y direction on the image data, thereby reducing the rejection rate. It is more convenient, more economical, more effective and feasible than the common compensation mask and exposure equipment method. In addition, the scheme for compensating data is simple and reliable, the feasibility is strong, the operation is simple, and the consumption is low. The requirement of high precision of products can be met, and the size precision of each opening is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (3)
1. An exposure correction compensation method is characterized by comprising the following steps:
s10: editing the test file and setting partitions;
s11: exposing the graphic file without any correction compensation;
s12: the product is inspected in the partitions of step S10, and the dimensions X of the IC opening in each partition in the X and Y directions are recorded’ 1、Y’ 1；X’ 2、Y’ 2；……X’ m、Y’ m；
S13: mixing X’(X’ 1、X’ 2、……X’ m) And X (X)1、X2、……Xm) For comparison, Y’(Y’ 1、Y’ 2、……Y’ m) And Y (Y)1、Y2、……Ym) Comparing and calculating the zoom ratio;
s14: through at least more than 2 times of experiments, the data in the X, Y direction are analyzed and respectively fitted into corresponding relational formulas to respectively obtain different types of IC opening compensation data XSupplement device、YSupplement device；
S15: applying the compensation data on the file after determining the compensation data and making product verification reproducibility;
wherein the step S10 specifically includes: setting partitions, and editing IC openings of the same type in the partitions, wherein the number of the IC openings is N; because the IC openings of different areas are required to be different, including the shapes and the sizes, characters for marking and distinguishing different subareas are marked; recording X and Y dimensions X for IC openings of different partitions1、Y1；X2、Y2；……Xm、Ym。
2. The exposure correction compensation method according to claim 1, wherein: the detection of the data in the step S12 is obtained by advanced four-in-one equipment, and the precision is high.
3. The exposure correction compensation method according to claim 1, wherein: and the analysis of the data in the step S14 is performed by adopting special data analysis software for fitting, and then the optimal parameter combination is obtained.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010746.1A CN103207526B (en) | 2012-01-16 | 2012-01-16 | A kind of exposure correction-compensation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010746.1A CN103207526B (en) | 2012-01-16 | 2012-01-16 | A kind of exposure correction-compensation method |
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| Publication Number | Publication Date |
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| CN103207526A CN103207526A (en) | 2013-07-17 |
| CN103207526B true CN103207526B (en) | 2016-08-10 |
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| CN201210010746.1A Expired - Fee Related CN103207526B (en) | 2012-01-16 | 2012-01-16 | A kind of exposure correction-compensation method |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6581202B1 (en) * | 2000-11-10 | 2003-06-17 | Viasystems Group, Inc. | System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture |
| US6569579B2 (en) * | 2001-03-13 | 2003-05-27 | Chartered Semiconductor Manufacturing, Ltd. | Semiconductor mask alignment system utilizing pellicle with zero layer image placement indicator |
| JP3977364B2 (en) * | 2004-09-03 | 2007-09-19 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
| US7773195B2 (en) * | 2005-11-29 | 2010-08-10 | Asml Holding N.V. | System and method to increase surface tension and contact angle in immersion lithography |
| JP4984810B2 (en) * | 2006-02-16 | 2012-07-25 | 株式会社ニコン | Exposure method, exposure apparatus, and photomask |
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