CN103203952A - Production process of step stencil - Google Patents
Production process of step stencil Download PDFInfo
- Publication number
- CN103203952A CN103203952A CN2012100107245A CN201210010724A CN103203952A CN 103203952 A CN103203952 A CN 103203952A CN 2012100107245 A CN2012100107245 A CN 2012100107245A CN 201210010724 A CN201210010724 A CN 201210010724A CN 103203952 A CN103203952 A CN 103203952A
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- template according
- manufacture craft
- opening
- follows
- etching
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000007639 printing Methods 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000003698 laser cutting Methods 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 238000005554 pickling Methods 0.000 claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000002203 pretreatment Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims description 17
- 238000011161 development Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910000863 Ferronickel Inorganic materials 0.000 claims 1
- 238000005238 degreasing Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000005488 sandblasting Methods 0.000 abstract 1
- 230000002087 whitening effect Effects 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 241001233242 Lontra Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000011266 Passiflora quadrangularis Nutrition 0.000 description 2
- 244000179684 Passiflora quadrangularis Species 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
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- Laser Beam Processing (AREA)
- ing And Chemical Polishing (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
A production process of a step stencil. The production process flow is as follows: substrate processing (cutting) ->pre-treatment (degreasing, pickling, and sandblasting) -> film mounting -> double sided exposure -> double sided developing-> etching (a printing surface with up steps) -> film stripping -> pre-treatment (degreasing and pickling) -> laser cutting (openings of flat openings and up steps). The process includes etching and laser cutting steps, and a metal stencil having a printing surface with up steps can be produced by using the process. The metal stencil produced by using the process has a high position alignment precision of the pattern opening of the area of up steps with a substrate opening; walls of opening holes of the overall stencil are smooth and straight and without undesirable phenomena of burrs or jags, etc.; the metal stencil has good surface quality and no undesirable defects of deformation, whitening, etc.; and the COV of the board thickness uniformity is less than10%.
Description
Technical field
The present invention relates to a kind of preparation technology of step template, belong to material manufacturing and manufacture field, be specifically related to a kind of printing surface in a kind of SMT field have raised step (up step) and raised step zone have opening figure the mask used for printing plate be mixed with technology.
Background technology
Along with China's electron trade develops rapidly, mould printing technology also is applied at electronics manufacturing, and the SMT printing is exactly the typical case.In the electronic product manufacture process, to weld electronic component and PCB need be placed on tin on the PCB earlier, and have hundreds of pad need go up tin on the PCB, the position of each pad corresponding electronic component, print the disposable first-class tin the best way accurately of the pad of tin on the needs exactly.Usually the method for usefulness is to make the stainless steel substrates that countless apertures are arranged in electronics manufacturing, each hole corresponding the pad of tin on needs, then stainless steel substrates is attached on the grenadine that stretches tight, grenadine is attached on the bottom surface of print stencil net frame.
Printing stencil is the mould of print solder paste, at present the general steel mesh that adopts.And the punching block opening precision that traditional handicraft is made by laser cutting technique can not reach requirement, and plate face quality is also not high enough.The electroformed nickel mask plate then easily forms pin hole, rough point because of the plate face, and the solution instability, cost height, defective such as energy consumption is big.
Whether the tin cream on the pad is smooth, even, whether consumption suitably will directly influence the effect of electronic component SMT, when precision electronic element pad and hot pressing finger is particularly arranged, requires higher to printing stencil.
The development of PCB industry not only is confined to plane template, and existing PCB industry development is rapid, and some have the position of particular requirement to need the spill position, as B2it printed board.Prepared 3-dimensional metal mask plate has and the identical 3-D in male structure of substrate; with corresponding concavo-convex position, protective substrate surface; and when using prepared 3-dimensional metal mask plate to shift in substrate surface relief region edge, thereby mask open can closely contact accurately contraposition with substrate.Make simultaneously have the metal mask plate corresponding with concaveconvex shape on the pcb board be after development in future trend.The template of chemical etching is the main type in the template world.Their costs are minimum, have enough to meet the need the fastest.The making of the stainless steel template of chemical etching be by light-sensitive surface on exposing to the sun at the metal steel disc, with pin location sensitization instrument with graph exposure on metal steel disc two sides, use double-side technology simultaneously from two sides corroding metal steel disc then.The defective of etching template itself and difficulty of processing have determined the etching template to withdraw from the market gradually.Etch process then is applied to the ladder template.
Formation for opening, its principal mode is electroforming and laser cutting, development along with laser cutting technique and equipment, add electric throwing technology, the formed opening of laser cutting is also very smooth close to hole wall as the electroforming, add characteristics such as its cycle weak point, yield height, the laser cutting template accounts for more than 80% of world's template.
How to develop a kind of printing stencil or even metallic nickel printing stencil of making than common steel mesh, the new product that performance is more excellent, and have accurate depth-to-width ratio and the measured concavo-convex position of opening matter is most important.
Summary of the invention
The present invention is intended to solve above technical problem, invents a kind of manufacture craft of step template.The metal form that utilizes this manufacture craft to be made, printing surface have raised step (up step).
A kind of manufacture craft of step template.The technological process of this kind manufacture craft is as follows: processing substrate (cutting) → pre-treatment (oil removing, pickling, sandblast) → pad pasting → double-sided exposure → two-sided development → etching (printing surface has up step) → take off film → pre-treatment (oil removing, pickling) → laser cutting (opening of plane opening and up step).
This kind step template is prepared from by being mixed with technology, comprises etching, laser cutting parameter, and its concrete technological process is as follows:
(1) processing substrate: select stainless steel as baseplate material, and substrate is cut into needed size
(2) pre-treatment: after substrate oil removing, pickling, carry out the two sides blasting treatment, improve surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
(3) pad pasting: select the high dry film of adhesive force, prevent that serious side corrosion phenomenon from taking place, and avoids consequent positional precision problem.After choosing dry film, carry out two-sided pad pasting.
(4) double-sided exposure: double-sided exposure behind the two-sided pad pasting, exposure area are printing surface raised step zone, and the dry film after the exposure is as the diaphragm of subsequent etch technology, avoid the substrate liquid that is corroded to corrode.
(5) two-sided development: unexposed dry film is removed by two-sided developing process, inspections of developing after the development (whether fall film, rub film, phenomenon such as develop to the greatest extent), the operation that enters etching up step as if no problem.
(6) etching: send in the horizontal type double-side etching machine by the substrate after pad pasting, exposure, the development, etching solution is sprayed the upper and lower surface of substrate by the mode that sprays up and down, produce chemical reaction at the substrate surface that does not have the exposure dry film, etch away layer of metal, so just formed the raised step zone at printing surface.
(7) take off film: after etching is finished, diaphragm cleaned to take off remove, clean up.
(8) pre-treatment: with metal form oil removing, pickling;
(9) laser cutting: in the raised step zone and base plan zone cutting opening, the laser cutting concrete steps are as follows:
After tightening, substrate after above-mentioned operation made is placed on the cutting base station;
Adjust cutting parameter, adjust vertical height of laser cutting head, make its laser spot drop on printing surface;
Launch laser by laser cutting head, cut in the open area of substrate surface.
Preferably, the concrete technological parameter in each step is as follows:
The pre-treating technology parameter is as follows:
| The oil removing time | 1～2min |
| The pickling time | 1～2min |
| The sandblast time | 2～3min |
| Pressure (pis) | 2～5 |
The exposure imaging technological parameter is as follows:
Etch process parameters is as follows:
| Etching solution proportion | 1.30～1.50 |
| Fe 3+Concentration (g/L) | 100～300 |
| pH | 1.4～1.8 |
| Temperature (℃) | 50～60 |
| Pressure (pis) | 10～20 |
| Etching speed | 8～20Hz |
The technological parameter of laser cutting is as follows:
| Cutting speed (hole/hour) | 10000～20000 |
| Energy (mj) | 400～1000 |
| Gas pressure (MPa) | 0.5～5 |
| Electric current (mA) | 500～1000 |
| Laser frequency (Hz) | 6000～8000 |
| Straight cuts speed (cm.min -1） | 100～200 |
So just produce step template as shown in Figure 2, and the printing process of this kind printing stencil as shown in Figure 1, and printing surface has raised step, and its effect is mainly the number to be printed that increases printing material in printing process, be used for the welding of big element, shown in 6 among Fig. 1.
The printing surface of this patent invention has the preparation technology of raised step, has following beneficial effect:
(1) can make the metal form that printing surface has up step;
(2) the opening quality of metal otter board graphics field is good, and hole wall is smooth, bad phenomenon such as no burr, sawtooth;
(3) the positional precision height in the opening figure zone of metal otter board;
(4) the metal otter board thickness evenness is good, and uniformity COV is in 10%
Description of drawings
Above-mentioned and/or additional aspect of the present invention and advantage are from obviously and easily understanding becoming the description of embodiment in conjunction with following accompanying drawing.
The opening cutaway view in Fig. 1, printing surface up zone
The 1-PCB substrate
The 2-template
3a-welds base station
3b-welds base station
4-plane opening
5-printing surface up zone
The opening in 6-printing surface up zone
The 7-printing surface
The 8-PCB face
Fig. 2, mould printing face up schematic diagram
The 1-template
2-stencil plane opening
3-mould printing face up zone
4-mould printing face up zone opening
5-mould printing face.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein identical or similar label is represented identical or similar elements or the element with identical or similar functions from start to finish.Be exemplary below by the embodiment that is described with reference to the drawings, only be used for explaining the present invention, and can not be interpreted as limitation of the present invention.
Attention problem among the concrete technological process of this religious name and the present invention in the technological process will be more detailed in the following description.
A kind of manufacture craft of step template.This kind step template is prepared from by being mixed with technology, comprises etching, laser cutting parameter, and its concrete technological process is as follows:
(1) processing substrate: select stainless steel as baseplate material, and substrate is cut into needed size
(2) pre-treatment: after substrate oil removing, pickling, carry out the two sides blasting treatment, improve surface roughness, thus the adhesion of dry film and steel disc when improving pad pasting.
(3) pad pasting: select the high dry film of adhesive force, prevent that serious side corrosion phenomenon from taking place, and avoids consequent positional precision problem.After choosing dry film, carry out two-sided pad pasting.
(4) double-sided exposure: double-sided exposure behind the two-sided pad pasting, exposure area are printing surface raised step zone, and the dry film after the exposure is as the diaphragm of subsequent etch technology, avoid the substrate liquid that is corroded to corrode.
(5) two-sided development: unexposed dry film is removed by two-sided developing process, inspections of developing after the development (whether fall film, rub film, phenomenon such as develop to the greatest extent), the operation that enters etching up step as if no problem.
(6) etching: send in the horizontal type double-side etching machine by the substrate after pad pasting, exposure, the development, etching solution is sprayed the upper and lower surface of substrate by the mode that sprays up and down, produce chemical reaction at the substrate surface that does not have the exposure dry film, etch away layer of metal, so just formed the raised step zone at printing surface, shown in 4 among Fig. 2.
(7) take off film: after etching is finished, diaphragm cleaned to take off remove, clean up.
(8) pre-treatment: with metal form oil removing, pickling;
(9) laser cutting: in the raised step zone and base plan zone cutting opening, the laser cutting concrete steps are as follows:
After tightening, substrate after above-mentioned operation made is placed on the cutting base station;
Adjust cutting parameter, adjust vertical height of laser cutting head, make its laser spot drop on printing surface;
Launch laser by laser cutting head, cut in the open area of substrate surface.
Concrete technological parameter in one group of preferred each step is as follows:
The pre-treating technology parameter:
| The oil removing time | 2min |
| The pickling time | 2min |
| The sandblast time | 3min |
| Pressure (pis) | 5 |
The exposure imaging technological parameter is as follows:
Etch process parameters is as follows:
| Etching solution proportion | 1.40 |
| Fe 3+Concentration (g/L) | 200 |
| pH | 1.6 |
| Temperature (℃) | 55 |
| Pressure (pis) | 15 |
| Etching speed | 14Hz |
The technological parameter of laser cutting is as follows:
| Cutting speed (hole/hour) | 15000 |
| Energy (mj) | 700 |
| Gas pressure (MPa) | 3.5 |
| Electric current (mA) | 800 |
| Laser frequency (Hz) | 7000 |
| Straight cuts speed (cm.min -1） | 150 |
So just produce step template as shown in Figure 2, and the printing process of this kind printing stencil as shown in Figure 1, and printing surface has raised step, and its effect is mainly the number to be printed that increases printing material in printing process, be used for the welding of big element, shown in 6 among Fig. 1.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (10)
1. the manufacture craft of a step template, the technological process of this kind manufacture craft is as follows: processing substrate (cutting) → pre-treatment (oil removing, pickling, sandblast) → pad pasting → double-sided exposure → two-sided development → etching (printing surface has raised step (up step)) → take off film → pre-treatment (oil removing, pickling) → laser cutting (opening of plane opening and raised step (up step)).
2. the manufacture craft of step template according to claim 1 is characterized in that, the metal form printing surface for preparing has raised step (up step).
3. the manufacture craft of step template according to claim 1 is characterized in that, the metal form raised step zone and the plane domain that prepare all have the opening that satisfies print request.
4. the manufacture craft of step template according to claim 1 is characterized in that, the material of substrate is a kind of in stainless steel, pure nickel, the ferronickel.
5. the manufacture craft of step template according to claim 1 is characterized in that, printing surface has at least two blind holes, and mould printing face blind hole is in diagonal position.
6. step template according to claim 1 is characterized in that, plane domain and PCB face elevated regions have the opening that satisfies print request.
Step template according to claim 1 be mixed with technology, it is characterized in that the pre-treating technology parameter is as follows:
。
8. the manufacture craft of step template according to claim 1 is characterized in that, the exposure imaging technological parameter is as follows:
。
Step template according to claim 1 be mixed with technology, it is characterized in that etch process parameters is as follows:
。
Step template according to claim 1 be mixed with technology, it is characterized in that the technological parameter of laser cutting is as follows:
。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010724.5A CN103203952B (en) | 2012-01-16 | 2012-01-16 | A kind of processing technology of stepped formwork |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010724.5A CN103203952B (en) | 2012-01-16 | 2012-01-16 | A kind of processing technology of stepped formwork |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203952A true CN103203952A (en) | 2013-07-17 |
| CN103203952B CN103203952B (en) | 2016-12-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210010724.5A Expired - Fee Related CN103203952B (en) | 2012-01-16 | 2012-01-16 | A kind of processing technology of stepped formwork |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103203952B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103556113A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Method for producing high-precision mask plate |
| CN103556150A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Method for producing high-precision mask plate |
| CN107422598A (en) * | 2017-06-02 | 2017-12-01 | 昆山国显光电有限公司 | Mask plate and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59214623A (en) * | 1983-05-20 | 1984-12-04 | Nippon Kogaku Kk <Nikon> | Mold for molding fine pattern of plastic |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN2349218Y (en) * | 1998-11-18 | 1999-11-17 | 中国科学院长春光学精密机械研究所 | Attached type mask assembly for quasi-molecule laser etching |
| WO2002027073A1 (en) * | 2000-09-26 | 2002-04-04 | Eastman Kodak Company | Method for producing metal mask and metal mask |
| CN1958862A (en) * | 2006-10-13 | 2007-05-09 | 南京航空航天大学 | Electroforming method suitable to fine structure with high depth-width ratio |
-
2012
- 2012-01-16 CN CN201210010724.5A patent/CN103203952B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59214623A (en) * | 1983-05-20 | 1984-12-04 | Nippon Kogaku Kk <Nikon> | Mold for molding fine pattern of plastic |
| US5704286A (en) * | 1996-08-02 | 1998-01-06 | Kabushik Kaisha Toshiba | Screen printing apparatus |
| CN2349218Y (en) * | 1998-11-18 | 1999-11-17 | 中国科学院长春光学精密机械研究所 | Attached type mask assembly for quasi-molecule laser etching |
| WO2002027073A1 (en) * | 2000-09-26 | 2002-04-04 | Eastman Kodak Company | Method for producing metal mask and metal mask |
| CN1958862A (en) * | 2006-10-13 | 2007-05-09 | 南京航空航天大学 | Electroforming method suitable to fine structure with high depth-width ratio |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103556113A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Method for producing high-precision mask plate |
| CN103556150A (en) * | 2013-10-30 | 2014-02-05 | 昆山允升吉光电科技有限公司 | Method for producing high-precision mask plate |
| CN107422598A (en) * | 2017-06-02 | 2017-12-01 | 昆山国显光电有限公司 | Mask plate and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103203952B (en) | 2016-12-14 |
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