CN103200762B - Circuit board and its manufacture method and the lighting device with the circuit board - Google Patents
Circuit board and its manufacture method and the lighting device with the circuit board Download PDFInfo
- Publication number
- CN103200762B CN103200762B CN201210006381.5A CN201210006381A CN103200762B CN 103200762 B CN103200762 B CN 103200762B CN 201210006381 A CN201210006381 A CN 201210006381A CN 103200762 B CN103200762 B CN 103200762B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat
- manufacture method
- lighting device
- circuit line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention relates to a kind of circuit board, the circuit board includes matrix (1) and circuit line (2) made of heat-conducting plastic, and described matrix (1) and the circuit line (2) are molded together by inlaying injection molding process.Moreover, it relates to a kind of lighting device of circuit board with the above-mentioned type and the manufacture method of the circuit board.
Description
Technical field
The present invention relates to a kind of circuit board.In addition the invention further relates to a kind of illumination of circuit board with the above-mentioned type dress
Put and the manufacture method of the circuit board.
Background technology
With the continuous progress of technology, LED light device is increasingly favored by people, because LED illumination fills
The luminous efficiency put is high, and size is small, more saves and compared with traditional lighting device, it is lasted a long time.But LED illumination
Device LED chip can produce heat at work, and these heats must be gone by export is arranged from LED light device in time, no
The heat then assembled on lighting device can have undesirable effect to electronic device, such as weaken the luminous effect of LED light device
Rate and shorten its service life.Therefore, designer tries every means to design LED light device, is led with arranging well
These heats, such as design various types of heat abstractors.But in the heat transfer path of LED chip to heat abstractor also
Circuit board be present, the height of the heat conductivility of circuit board in itself directly affects the heat dispersion of whole lighting device.
Therefore, occur polytype circuit board in the prior art, such as FR4 printed circuit board (PCB)s or ceramic printing
Circuit board or metal-core printed circuit board.The printed circuit board (PCB) of these above-mentioned types to some extent can pass heat
It is delivered on heat abstractor, but it has the defects of different respectively again, for example, the reason for FR4 printed circuit board (PCB)s are limited to material,
Its thermal conductivity is only 0.3W/m/K, and it is obviously not suitable for using in the application of high heat density.Although ceramic printed-circuit board
Its thermal conductivity is higher, but its is with high costs and frangible.Metal-core printed circuit board can equally provide relatively good lead
Hot property, but due to the problem of metal core circuit board has to consider insulation, need to set an insulation in its structure
Layer, the insulating barrier inevitably improve thermal resistance, and this largely reduces the heat conductivility of circuit board.
The content of the invention
To solve the above problems, the present invention proposes a kind of circuit board, the circuit board relative inexpensiveness, using the teaching of the invention it is possible to provide compared with
Good heat conductivility, its electrical insulation capability is also splendid, while its is simple in construction, easy to manufacture, can apply in various environment.
In addition the invention also provides a kind of lighting device of circuit board with the above-mentioned type and a kind of circuit board of the above-mentioned type
Manufacture method.
First purpose of the present invention is achieved in by a kind of circuit board, i.e., the circuit board includes being made up of heat-conducting plastic
Matrix and circuit line, and matrix and circuit line are molded together by inlaying injection molding process.According to the electricity of the present invention
The matrix of road plate is made up of heat-conducting plastic, therefore can provide good heat conductivility.Because the material of heat-conducting plastic in itself is special
The reason for property, it provides preferable electrical insulation capability, and because plastics have certain pliability, therefore its not rapid wear
It is bad.Meanwhile the relative inexpensiveness of circuit board of the invention.Further, since matrix and circuit line are by inlaying injection molding work
Skill is molded together, and this technique is very simple, and something which increases the production efficiency of circuit board.It is molded together
Matrix and circuit board between bonding strength it is bigger, there is provided more preferably structural stability.
Preferably, heat-conducting plastic is the mixed plastic material of material based on PP, ABS, PC, PA, LCP, PPS or PEEK
Material.The heat conduction particle with higher heat conductivility can be mixed with above-mentioned basic material.With advances in technology, it is above-mentioned
The thermal conductivity of the heat-conducting plastic of type is usually 1-20W/m/K, and some grades even can reach 100W/m/K, and it can be to shine
Bright device provides very good heat dispersion, while these materials can also be obtained easily from commercial market.
Preferably, circuit line is made up of copper sheet metal.Preferably, circuit line passes through punch forming process system
Into.
Another object of the present invention is achieved in by a kind of manufacture method of circuit board, i.e., the manufacture method includes following
Step：A) circuit line is provided；B) circuit line is placed in a mold；C) existed using heat-conducting plastic by inlaying injection molding process
Matrix is molded into around circuit line.Manufacturing method according to the invention greatly simplifies the manufacturing process of circuit board.Meanwhile root
The circuit board manufactured according to the manufacture method of the present invention can provide good heat conductivility and good structural stability.
Final object of the present invention is achieved in by a kind of lighting device, and the lighting device includes the above-mentioned type
The LED chip of circuit board and setting on the board.Good heat dispersion is had according to the lighting device of the present invention, and
Cost is cheaper.
Brief description of the drawings
Accompanying drawing forms the part of this specification, is used to help further understand the present invention.These accompanying drawings illustrate this hair
Bright embodiment, and together with specification be used for illustrate the present invention principle.Identical part identical label in the accompanying drawings
Represent.Shown in figure：
Fig. 1 is the schematic diagram according to the circuit board of the present invention；
Fig. 2 is the sectional view according to the circuit board of the present invention.
Embodiment
Fig. 1 shows the schematic diagram of the circuit board according to the present invention.It can be seen that included according to the circuit board of the present invention
Matrix 1 and circuit line 2 made of heat-conducting plastic, and matrix 1 and circuit line 2 are molded in one by inlaying injection molding process
Rise.In the present embodiment, matrix 1 by material based on PP, ABS, PC, PA, LCP, PPS or PEEK mixed plastic fraction system
Into, wherein, can be mixed with the heat conduction particle with higher heat conductivility in above-mentioned basic material, and circuit line 2 by
Copper sheet metal is made up of punch forming process.It can be seen that the contact surface of circuit line 2 is exposed to the outside of matrix 1,
So as to form corresponding electrical connection section and the chip installation portion of the LED chip (not shown) for installing lighting device.
Fig. 2 shows the sectional view of the circuit board according to the present invention.It can be seen that matrix 1 is molded in one with circuit line 2
Rise, some contact surfaces of circuit line 2 are exposed to outside matrix 1, form corresponding electrical connection section and for installing lighting device
LED chip (not shown) chip installation portion.
In circuit board of the manufacture according to the present invention, punch forming work will be utilized by sheet metal, such as copper sheet first
Skill manufactures circuit line 2, and then circuit line 2 is placed in corresponding mould.Using heat-conducting plastic by inlaying injection molding work
Skill is molded into matrix 1 around circuit line 2 in a mold.Mould is finally removed, forms circuit board.
The preferred embodiments of the present invention are these are only, are not intended to limit the invention, for those skilled in the art
For member, the present invention can have various modifications and variations.Any modification for being made within the spirit and principles of the invention, etc.
With replacement, improvement etc., should be included in the scope of the protection.
Reference number
1 matrix
2 circuit lines
Claims (2)
- A kind of 1. manufacture method of circuit board, it is characterised in that following steps：Circuit line (2) a) is provided；B) circuit line (2) is placed in a mold；C) matrix (1) is molded into around the circuit line (2) by inlaying injection molding process using heat-conducting plastic, described The circuit line (2) is manufactured using punch forming process by sheet metal in step a).
- 2. manufacture method according to claim 1, it is characterised in that the heat-conducting plastic be PP, ABS, PC, PA, LCP, The mixed plastic fraction of material based on PPS or PEEK.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210006381.5A CN103200762B (en) | 2012-01-10 | 2012-01-10 | Circuit board and its manufacture method and the lighting device with the circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210006381.5A CN103200762B (en) | 2012-01-10 | 2012-01-10 | Circuit board and its manufacture method and the lighting device with the circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103200762A CN103200762A (en) | 2013-07-10 |
| CN103200762B true CN103200762B (en) | 2018-03-06 |
Family
ID=48723070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210006381.5A Expired - Fee Related CN103200762B (en) | 2012-01-10 | 2012-01-10 | Circuit board and its manufacture method and the lighting device with the circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103200762B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109121287A (en) * | 2017-06-26 | 2019-01-01 | 马培中 | A kind of circuit board making insulating carrier by plastics made of injection molding |
| CN107394985A (en) * | 2017-08-14 | 2017-11-24 | 厦门新鸿洲精密科技有限公司 | It can be achieved to automatically adjust the closed loop voice coil motor of movement locus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201050765Y (en) * | 2007-07-03 | 2008-04-23 | 杭州中宙科技有限公司 | Water-proof LED light-emitting module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001177951A (en) * | 1999-12-15 | 2001-06-29 | Yazaki Corp | Conductive circuit structure |
| KR20080005762A (en) * | 2006-07-10 | 2008-01-15 | 삼성코닝 주식회사 | Light emitting device module |
| CN100546445C (en) * | 2007-07-19 | 2009-09-30 | 华为技术有限公司 | The method of a kind of printed substrate and housing injection moulding thereof and device |
| CN101578015A (en) * | 2008-05-06 | 2009-11-11 | 富准精密工业(深圳)有限公司 | Connection structure for metal piece and plastic piece and preparation method and electronic device shell |
-
2012
- 2012-01-10 CN CN201210006381.5A patent/CN103200762B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201050765Y (en) * | 2007-07-03 | 2008-04-23 | 杭州中宙科技有限公司 | Water-proof LED light-emitting module |
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| Publication number | Publication date |
|---|---|
| CN103200762A (en) | 2013-07-10 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180306 Termination date: 20210110 |