CN103199330A - Electronic device shell integrated with antenna and manufacturing method thereof - Google Patents

Abstract

An electronic device housing with an integrated antenna and a manufacturing method thereof. The method includes the following steps: providing a shell, the shell includes a model structure, which is protruding on the inner surface of the shell, and the model structure includes a recess; spraying metal material on the model structure, and causing the metal material to fill the recess ; And remove excess metal material located on the surface of the model structure, so that the metal material in the recessed portion forms a three-dimensional antenna structure. The present invention also provides an electronic device housing made by applying the aforementioned manufacturing method of an electronic device housing with integrated antenna. Through the design of the present invention, the metal material is formed into a three-dimensional antenna through the model structure of the shell structure. Compared with the existing laser-engraved antenna, the antenna formed by the present invention itself can provide a larger size by changing the depth of the recessed portion. The overall surface area of the range is reduced, and the existing complicated antenna manufacturing process can be reduced to reduce manufacturing costs.

Description

Electronic device casing with integrated antenna and manufacturing method thereof

technical field

The invention relates to an electronic device casing, in particular to an electronic device casing integrated with an antenna and a manufacturing method thereof.

Background technique

All portable electronic devices are equipped with antenna components to provide the device with the ability to send and receive wireless communication signals or transmit data. Generally, the antenna assembly itself has a certain volume. For portable electronic devices that tend to be thinner and lighter, the internal space is limited. Therefore, issues such as space and circuit configuration must be considered when installing the antenna, which is inconvenient for device manufacturing or assembly. With the advancement of science and technology, an antenna structure made of laser engraving and molding technology (LDS) has gradually been developed, which can directly engrave the desired antenna pattern on the surface of the housing, and then electroplate the antenna pattern to form a planar antenna structure , thereby reducing the installation volume of the antenna.

However, after laser engraving and electroplating technology are used to treat the surface of the shell, the surface of the shell is prone to unevenness; in order to cover or improve the uneven shape of the antenna, the antenna must be repeatedly sprayed with paint. In the future, the time spent in the entire manufacturing process will be lengthened, and the cost of these processes will be additionally increased.

Therefore, how to provide a better integrated structure of the antenna and the housing to simplify the manufacturing process and complexity is a topic worthy of research.

Contents of the invention

In view of this, the main purpose of the present invention is to provide an electronic device housing structure with an integrated antenna and its manufacturing method, so as to solve the technical problem existing in the prior art that the electronic device housing must be arranged separately from the antenna assembly.

In order to achieve the above-mentioned purpose, the present invention employs the following technical solutions:

A method for manufacturing an antenna-integrated housing of an electronic device, the method comprising the following steps:

A shell structure is provided, the shell structure includes a model structure, which is protruded on an inner surface of the shell structure, and the model structure includes a concave portion;

spraying a metal material on the model structure, and making the metal material fill the recess; and

The excess metal material on the surface of the model structure is removed, so that the metal material in the concave part forms a three-dimensional antenna structure.

In one embodiment of the present invention, the manufacturing method of the antenna-integrated electronic device casing further includes the following steps: spraying metal material on the welding part of the three-dimensional antenna structure, so that the thickness of the welding part is greater than the three-dimensional antenna structure formed by the concave part thickness; and soldering wires to the soldering portion.

In an embodiment of the present invention, the recess has a depth, and the total surface area formed by the three-dimensional antenna structure can be adjusted by changing the depth.

The present invention also provides an electronic device housing manufactured by applying the aforementioned method for manufacturing an antenna-integrated electronic device housing, which includes:

A shell structure, including a mold structure, is protruded on an inner surface of the shell structure, and the mold structure includes a concave portion; and

A metal material fills up the recess to form a three-dimensional antenna structure.

In an embodiment of the present invention, the housing of the electronic device integrating the antenna further includes a wire, and the three-dimensional antenna structure includes a welding portion, the wire is welded to the welding portion, wherein the thickness of the welding portion is greater than that passing through the concave portion The thickness of the formed three-dimensional antenna structure.

Due to the adoption of the above technical features, the present invention has the following advantages and positive effects compared with the prior art:

Through the design of the invention, the metal material passes through the model structure of the housing structure to form a three-dimensional antenna. Compared with the existing laser engraving antenna, the antenna itself formed by the invention can provide a larger The overall surface area of the range, and can reduce the existing complex antenna manufacturing process to reduce manufacturing costs.

The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

Description of drawings

Fig. 1 is a schematic diagram of the casing structure of the electronic device casing integrating the antenna of the present invention;

Fig. 2 is a schematic diagram of a three-dimensional antenna structure formed by using the housing structure of the electronic device housing integrating the antenna of the present invention;

FIG. 3 is a flow chart of the manufacturing method of the housing of the electronic device integrating the antenna of the present invention;

Fig. 4 (a) is the sectional view of the housing structure of the electronic device housing of the present invention along the line A-A' in Fig. 2;

Fig. 4 (b) is the sectional view of the model structure of the housing structure of the present invention along the A-A' line in Fig. 2 after the metal material is sprayed;

Fig. 4 (c) is the model structure of the housing structure of the present invention along the sectional view of line A-A' in Fig. 2 after removing the excess metal material positioned on the surface;

Fig. 4 (d) is the sectional view of the housing structure of the present invention along the line B-B' in Fig. 2 after the three-dimensional antenna structure is formed;

Fig. 4 (e) is the cross-sectional view along the line B-B' in Fig. 2 after the three-dimensional antenna structure of the present invention is welded with wires.

Detailed ways

In order to better understand the technical content of the present invention, a preferred embodiment is given and described as follows.

Please refer to Figure 1 and Figure 2 together. 1 is a schematic diagram of a housing structure 10 of an electronic device housing 1 with an integrated antenna of the present invention; FIG. In one embodiment of the present invention, the antenna-integrated electronic device casing 1 can be applied to a portable computer, but the present invention is not limited thereto, and can also be applied to smart phones, personal digital assistants, or other devices that require an antenna. Portable electronic devices, etc.

As shown in FIG. 1 , the antenna-integrated electronic device casing 1 of the present invention includes a casing structure 10 , and the casing structure 10 is made by injection molding using plastic materials (such as plastic, etc.). The casing structure 10 has an inner surface 12, and the casing structure 10 includes a model structure 11, which is protruded on the inner surface 12 to form a three-dimensional structure. The model structure 11 includes a recessed part 111, which is a groove structure with a depth, which itself is pre-shaped for the antenna pattern to be designed for the electronic device, so the shape and depth of the recessed part 111 can be changed according to different requirements .

As shown in FIG. 2 , the concave portion 111 can be filled with metal material to form a three-dimensional antenna structure 30 . The aforementioned metal material covers the shell structure 10 by means of spraying, etc., so that the metal material fills the recessed portion 111 , so as to form the integrated shape of the three-dimensional antenna structure 30 on the shell structure 10 . The metal material here can be selected from general copper, aluminum and other metal materials, but the present invention is not limited thereto.

In addition, the model structure 11 also includes a wire fixing portion 112 , which is correspondingly disposed at one end of the concave portion 111 , and is used for assisting in fixing the wire 40 connected to the three-dimensional antenna structure 30 after the three-dimensional antenna structure 30 is formed. After the conductive wire 40 is electrically connected to the three-dimensional antenna structure 30 , it can provide functions such as signal transmission and grounding of the three-dimensional antenna structure 30 .

Please refer to FIG. 3 , which is a flow chart of the manufacturing method of the antenna-integrated electronic device case of the present invention. As shown in FIG. 3 , the manufacturing method of the antenna-integrated electronic device case of the present invention includes steps S301 to S305 . Each step of the manufacturing method of the antenna-integrated electronic device case of the present invention will be described in detail below together with FIGS. 1 to 3 .

Step S301 : providing a shell structure 10 , the shell structure 10 includes a model structure 11 protruding from the inner surface 12 of the shell structure 10 , and the model structure 11 includes a concave portion 111 .

Please refer to FIG. 4(a) which is a cross-sectional view of the housing structure 10 of the electronic device housing of the present invention along the line A-A' in FIG. 2 . As shown in FIG. 4( a ), in order to implement the manufacturing method of the antenna-integrated electronic device housing of the present invention, it is first necessary to provide the aforementioned housing structure 10 . The shell structure 10 includes a model structure 11 protruding from the inner surface 12 of the shell structure 10 , and the model structure 11 includes a recessed portion 111 substantially downward from the surface, such that the recessed portion 111 has a depth. In this embodiment, the depth of the recessed portion 111 can pass through the body of the model structure 11 and reach the inner surface 12 of the housing structure 10. This depth can be changed according to different designs of the model structure 11, and is not limited to this embodiment. For example, a shallower depth can be used, or even a corresponding part of the groove is formed on the inner surface 12 of the housing structure 10 to deepen the depth of the overall antenna formed.

Step S302 : Spraying metal material on the model structure 11 , and making the metal material fill the recessed portion 111 .

Please refer to FIG. 4(b) which is a cross-sectional view of the model structure 11 of the shell structure 10 of the present invention along the line A-A' in FIG. 2 after spraying the metal material. As shown in Figure 4(b), after the shell structure 10 is obtained in step S201, the metal material 20 can be used to spray the model structure 11 on the inner surface 12 of the shell structure 10, mainly for the model structure 11 The concave portion 111 is sprayed to fill the concave portion 111 with the metal material 20 to form the designed antenna structure. As the spraying operation progresses, part of the metal material 20 will also be formed on the surface of the model structure 11 .

In another embodiment of the present invention, the metal material may also be a material with anti-electromagnetic interference properties, such as zinc alloy metal. Generally, in order to achieve the effect of preventing electromagnetic interference, the casing of an electronic device will spray anti-electromagnetic interference material on the casing to form a protective layer with anti-electromagnetic interference effect; therefore, the manufacturing method of the present invention can be combined with the application of anti-electromagnetic interference. Shell spraying process, when spraying the anti-electromagnetic interference material on the inner surface 12 of the shell structure 10, use the same anti-electromagnetic interference material to spray on the recessed part 111 of the model structure 11 until the anti-electromagnetic interference material fills the recessed part 111 In order to form the designed antenna structure, the process and cost of spraying different materials can also be reduced during the manufacturing process, but the present invention is not limited thereto.

Step S303 : remove excess metal material located on the surface of the model structure 11 , so that the metal material in the concave portion 111 forms a three-dimensional antenna structure 30 .

Please refer to FIG. 4(c), which is a cross-sectional view of the model structure 11 of the shell structure 10 of the present invention along the line A-A' in FIG. 2 after removing excess metal material on the surface. As shown in Figure 4(c), no matter which embodiment is used in the aforementioned step S302, in the process of spraying metal material (or anti-electromagnetic interference material) to fill up the recessed portion 111 of the model structure 11, the model structure 11 Excess metal material is formed on the surface of the surface; since these excess metal materials will cover the recessed part 111 and contact the metal material in the recessed part 111, which will affect the function of the formed three-dimensional antenna structure 30, it must be processed through tools or related processing techniques. (such as CNC machining) to remove excess metal material on the surface of the model structure 11 . After the aforementioned excess metal material is removed, the metal material filled in the concave portion 111 can form a three-dimensional antenna structure 30 . The three-dimensional antenna structure 30 can form antenna radiating arms supporting different transmission bandwidths through the size and shape design of the recessed portion 111; and the recessed portion 111 also makes the antenna structure appear in a three-dimensional form, increasing the overall surface area of the antenna. Therefore, by changing the depth of the recessed portion 111 , the total surface area formed by the antenna structure is also changed accordingly, and then the bandwidth or performance of the three-dimensional antenna structure can be adjusted correspondingly.

In another embodiment of the method for manufacturing an electronic device housing of the present invention, after step S303, steps S304 and S305 are further included.

Step S304 : spraying metal material on the welding portion 31 of the three-dimensional antenna structure 30 , so that the thickness of the welding portion 31 is greater than the thickness of the three-dimensional antenna structure 30 formed by the recessed portion 111 .

Please refer to FIG. 4(d), which is a cross-sectional view of the shell structure 10 of the present invention along the line B-B' in FIG. 2 after the three-dimensional antenna structure 30 is formed. As shown in FIG. 4( d), the formed three-dimensional antenna structure 30 must be connected with signal wires to achieve the function of sending and receiving signals. Therefore, after the three-dimensional antenna structure 30 is formed, the soldering portion 31 and the wires of the three-dimensional antenna structure 30 (Fig. not shown) are connected by welding. In order to avoid damage to the shell structure 10 during welding due to the thickness of the welded portion 31 being too thin, the present invention reinforces the welded portion 31 of the three-dimensional antenna structure 30, and continues to spray metal materials on the welded portion 31, so that the welded portion 31 The thickness a of is greater than the thickness b of other adjacent three-dimensional antenna structures 30 formed by the concave portion 111 . Because the welding portion 31 forms a thicker structure, the wire welding is more stable and safe.

Step S305 : welding a wire 40 to the welding portion 31 .

Please refer to FIG. 4(e) which is a cross-sectional view of the three-dimensional antenna structure 30 of the present invention along the line B-B' in FIG. 2 after the wire 40 is welded. As shown in Figure 4 (e), the welding part 31 of the three-dimensional antenna structure 30 formed in the foregoing steps is welded with a wire 40, where the wire 40 can be a coaxial cable with signal transmission and grounding functions, so as to provide The three-dimensional antenna structure 30 has functions such as signal transmission and grounding. At this time, the wire 40 can be passed through the wire fixing portion 112 of the model structure 11 to assist in fixing the wire 40 connected to the three-dimensional antenna structure 30 .

Through this design, the present invention utilizes the model structure provided on the casing to fill in metal materials to form a three-dimensional antenna structure, and the three-dimensional antenna structure can be controlled with the depth of the concave part of the model structure to change the overall surface area of the three-dimensional antenna structure, which can further improve Flexibility in antenna design and its application.

Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.

Claims (10)

1. the manufacture method of the case of electronic device of an integral antenna is characterized in that, this method may further comprise the steps:

One shell structure is provided, and this shell structure comprises a model structure, be an inner surface that is convexly set in this shell structure, and this model structure comprises a depressed part;

Spray a metal material on this model structure, and make this metal material fill up this depressed part; And

Removal is positioned at the excess metal material on the surface of this model structure, so that this metal material in this depressed part forms a 3 D antenna structure.

2. the manufacture method of the case of electronic device of integral antenna as claimed in claim 1 is characterized in that, and is further comprising the steps of:

Spray this metal material in a weld part of this 3 D antenna structure, make the thickness of this weld part greater than the thickness by formed this 3 D antenna structure of this depressed part; And

Weld a lead in this weld part.

3. the manufacture method of the case of electronic device of integral antenna as claimed in claim 1 is characterized in that, wherein this model structure comprises a lead fixed portion, is the position that is arranged at should weld part, in order to auxiliary this lead of fixing.

4. the manufacture method of the case of electronic device of integral antenna as claimed in claim 1 is characterized in that, wherein this depressed part has a degree of depth, by changing this depth size to adjust the formed total surface area size of this 3 D antenna structure.

5. the manufacture method of the case of electronic device of integral antenna as claimed in claim 4 is characterized in that, wherein this metal material is an anti-electromagnetic interference material.

6. the case of electronic device that the described method of application of aforementioned claim 1 is made is characterized in that, comprising:

One shell structure comprises a model structure, be an inner surface that is convexly set in this shell structure, and this model structure comprises a depressed part; And

One metal material is to fill up this depressed part to form a 3 D antenna structure.

7. case of electronic device as claimed in claim 6, it is characterized in that, this case of electronic device also comprises a lead, and this 3 D antenna structure comprises a weld part, this wire bonds is in this weld part, and wherein the thickness of this weld part is greater than the thickness by formed this 3 D antenna structure of this depressed part.

8. case of electronic device as claimed in claim 7 is characterized in that, wherein this model structure comprises a lead fixed portion, is to arrange corresponding to this weld part, in order to auxiliary this lead of fixing.

9. case of electronic device as claimed in claim 6 is characterized in that, wherein this depressed part has a degree of depth, by changing this depth size to adjust the formed total surface area size of this 3 D antenna structure.

10. case of electronic device as claimed in claim 6 is characterized in that, wherein this metal material is an anti-electromagnetic interference material.

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