CN103199031A - Full-automatic glue film coating and developing device - Google Patents
Full-automatic glue film coating and developing device Download PDFInfo
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- CN103199031A CN103199031A CN2012100010470A CN201210001047A CN103199031A CN 103199031 A CN103199031 A CN 103199031A CN 2012100010470 A CN2012100010470 A CN 2012100010470A CN 201210001047 A CN201210001047 A CN 201210001047A CN 103199031 A CN103199031 A CN 103199031A
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Abstract
The invention belongs to the technical field of integrated circuits (IC) and light-emitting diodes (LED), and particularly relates to a full-automatic glue film coating and developing device. The full-automatic glue film coating and developing device comprises a robot, a box station, an independent centering unit and wafer processing units, wherein the box station is located above the independent centering unit, the robot is located in the center of the full-automatic glue film coating and developing device, the box station and the wafer processing units are installed on the periphery of the robot, and the robot sends wafers through a mechanical arm to the wafer processing units on the periphery of the robot. According to the full-automatic glue film coating and developing device, maximization of capacity of a single device is achieved through adjustment of matching of functional units, maximization of functions of the single device is achieved through adjustment of a software formula, and fund investment of customers can be greatly reduced.
Description
Technical field
The invention belongs to IC and LED technical field, specifically a kind of full-automatic glued membrane coating, developing apparatus.
Background technology
At present, the output of LED industry is big, less investment, this reaches maximum with regard to the production capacity that requires unitary device, and floor space is as much as possible little, and stabilization of equipment performance and reliability of technology are had relatively high expectations, LED gluing developing process is simple relatively, relative looser with the inhomogeneity requirement of CD to the glued membrane uniformity, just can dispose more centrifugal unit in this case, make the unitary device production capacity reach maximization.
Summary of the invention
At the problems referred to above, the object of the present invention is to provide a kind of full-automatic glued membrane coating, developing apparatus.This device is realized the maximization of single device production capacity by adjusting the proportioning of functional unit, adjusts by the software prescription, can realize the maximization of single device function, can significantly reduce client's fund input.
To achieve these goals, the present invention is by the following technical solutions:
A kind of full-automatic glued membrane applies, developing apparatus, comprise robot, box station, independent centering unit and processing of wafers unit, wherein the box erect-position is in the top of independent centering unit, described robot is positioned at the center of device, described box station and processing of wafers unit be installed in robot around, described robot by manipulator with on wafer each processing of wafers unit around delivering to.
Described processing of wafers unit is provided with 1～7 station, comprises thermal treatment unit and centrifugal unit, and described thermal treatment unit and centrifugal unit are interchangeable.
Described thermal treatment unit is four-layer structure, and each of this structure layer goes up places high temperature cold-heated plate unit, low warm dish, surface a kind of in allonge unit or the independent centering body once.
Described centrifugal unit comprises vacuum cup, vacuum cup lift cylinder, quill shaft motor, glue cup, glue arm, glue arm lift cylinder, glue arm rotation motor and medicine company control valve, wherein the glue cup is positioned at the below of vacuum cup, described vacuum cup is connected with vacuum cup lift cylinder and quill shaft motor respectively, finishes the gluing development with the lifting or the rotation that realize vacuum cup; Described glue arm be positioned at vacuum cup the top, and is connected with glue arm lift cylinder and glue arm rotation motor respectively, to realize lifting or the rotation of glue arm, described glue arm is controlled photoresist by the medicine company control valve.
The top of described centrifugal unit is provided with the box of preserving moisture, and the Jiao Zui that finishes on the glue arm after the technology puts into the described box of preserving moisture by the driving of glue arm rotation motor; The below of described centrifugal unit is provided with discard solution discharge port, and this discard solution discharge port is communicated with the glue cup, and the waste liquid that the glue cup is collected is discharged by described discard solution discharge port.
Described box station comprises film magazine, film magazine guide vane end stop and box station base plate, and wherein film magazine is positioned on the base plate of box station, also locatees by the film magazine guide vane end stop.
Described independent centering unit comprises centering cylinder, centering wafer-supporting platform, centering anchor clamps and centering wafer-supporting platform lift cylinder, wherein centering wafer-supporting platform below connects centering wafer-supporting platform lift cylinder, and described centering anchor clamps are positioned at the top of centering wafer-supporting platform and are connected with the centering cylinder.
The circular standard wafer of the simultaneously compatible 2-6 inch of described device.
Described device is reserved with the Interface interface, and this interface is connected with factory automation system.
Described device connects the independent chemicals supply system that realizes round-the-clock uninterrupted feed flow.
Advantage of the present invention and beneficial effect are:
1, the present invention can handle 2-6 inch circular substrate simultaneously.
2, the present invention can realize the maximization of production capacity under the different process state by different unit proportionings.
3, element number of the present invention can dispose arbitrarily, and, can exchange between the unit, improved the adaptability of equipment to different process.
4, the present invention is modular construction, and wherein any one unit breaks down can not influence the use of other unit.
5, present device is full-closed structure, can effectively prevent chemical liquid volatilization leakage, the protection personal safety.
Description of drawings
Fig. 1 is plane figure schematic diagram of the present invention;
Fig. 2 is thermal treatment unit structural representation of the present invention;
Fig. 3 is centrifugal unit structural representation of the present invention;
Fig. 4 is unit, box of the present invention station and opposition centering cellular construction schematic diagram;
Wherein: 1, station I; 2, station II; 3, station III; 4, station IV; 5, robot; 6, station V; 7, station VI; 8, station VII; 9, guidance panel; 10, independent centering unit; 11, box station; 12, dish I; 13, dish II; 14, dish III; 15, dish IV; 16, thimble; 17, discard solution discharge port; 18, vacuum cup lift cylinder; 19, quill shaft motor; 20, vacuum cup; 21, glue cup; 22, glue arm; 23, the box of preserving moisture; 24, glue arm lift cylinder; 25, glue arm rotation motor; 26, medicine company control valve; 27, centering cylinder; 28, centering wafer-supporting platform; 29, box station base plate; 30, film magazine; 31, film magazine guide vane end stop; 32, centering anchor clamps; 33, centering wafer-supporting platform lift cylinder.
Embodiment
Below in conjunction with accompanying drawing the present invention is further described.
As shown in Figure 1, the present invention includes robot 5, box station 11, independent centering unit 10 and processing of wafers unit, wherein box station 11 is positioned at the top of independent centering unit 10, robot 5 is positioned at the center of device, box station 11 and processing of wafers unit be installed in robot 5 around, robot 5 by manipulator with on wafer each processing of wafers unit around delivering to.Described processing of wafers unit is provided with 7 stations, comprises 1～3 group of thermal treatment unit and 1～7 centrifugal unit, but each unit independent operating.Wherein station I 1, station II 2, station III 3 are centrifugal unit, and station V 6, station VI 7, station VII 8 are thermal treatment unit, and station IV 4 can be connected with factory automation system for reserving the Interface interface.Station IV 4 also can be used as the installation passage of robot 5.Described 7 stations can exchange arbitrarily, adapt to the different technological requirement of client by adjusting 7 block configuration in the station.The front end of this device is provided with operation panel face 9, as human-computer interaction interface.
As shown in Figure 2, described thermal treatment unit is four-layer structure, comprise dish I 12, dish II 13, dish III 14 and dish IV 15, dish IV 15 tops are thimble 16, can place elevated temperature heat dish, cold dish unit, low warm dish, surface a kind of in allonge unit or the independent centering body once on every dish, be configured according to customer requirement.When robot 5 heat treated unit transmit wafer, thimble 16 is in a high position, robot 5 is placed on wafer on the thimble 16, when withdrawing from back center 16, robot 5 descends, wafer is placed on carries out PROCESS FOR TREATMENT on the card, finish back center 16 and rise, robot 5 takes wafer away and carries out next process.
The heating-up temperature of elevated temperature heat dish and low warm dish is adjustable, and maximum heating temperature is 300 ℃, and minimum adjustment amount is 0.1 ℃; The surface is once sticking by heated chip, makes the HMDS after the atomizing be attached to wafer surface, improves the contact angle of crystal column surface; The cold dish unit is controlled by semiconductor chilling plate, and heating and cooling is adjustable.
As shown in Figure 3, described centrifugal unit comprises vacuum cup 20, vacuum cup lift cylinder 18, quill shaft motor 19, glue cup 21, glue arm 22, glue arm lift cylinder 24, glue arm rotation motor 25 and medicine company control valve 26, wherein glue cup 21 is positioned at the below of vacuum cup 20, adopt three-decker, realize gas-liquid separation.Vacuum cup 20 is connected and is arranged on the top of quill shaft motor 19 respectively with vacuum cup lift cylinder 18 and quill shaft motor 19.Quill shaft motor 19 drive vacuum cups 20 are done rotation at a high speed and are finished the gluing development, vacuum cup lift cylinder 18 drives vacuum cups 20 and moves up and down, and gluing is positioned at the below when developing, finish technology after, vacuum cup 20 is positioned at the top, makes things convenient for robot 5 to fetch and deliver wafer; Glue arm 22 is positioned at the top of vacuum cup 20, in the gluing process, by glue arm 22 different photoresists is dripped to wafer surface.Glue arm 22 is connected with glue arm lift cylinder 24 and glue arm rotation motor 25 respectively, by the lifting of glue arm lift cylinder 24 control glue arms 22, and the rotation of glue arm rotation motor 25 control glue arms 22.Glue arm 22 is by the amount of dripping of medicine company control valve 26 control photoresists; The top of described centrifugal unit is provided with the box 23 of preserving moisture, and the Jiao Zui that finishes the glue arm 22 after the technology puts into the box 23 of preserving moisture by the driving of glue arm rotation motor 25, prevents the glue crystallization; The below of described centrifugal unit is provided with discard solution discharge port 17, and this discard solution discharge port 17 is communicated with glue cup 21, and the waste liquid that glue cup 21 is collected is discharged by discard solution discharge port 17.
According to gluing and the configuration of developing, centrifugal unit uses single glue arm and two glue arm, and configurable minimum one road glue in each centrifugal unit unit, one road back of the body spray, one tunnel protection nitrogen, one tunnel are cut edge, one road RRC, and glue mouth moisture-keeping functions is arranged, and prevent the crystallization of shower nozzle glue.
As shown in Figure 4, box station 11 comprises film magazine 30, film magazine guide vane end stop 31 and box station base plate 29, the film magazine 30 of filling wafer is placed on the box station base plate 29 and by film magazine guide vane end stop 31 position.Independent centering unit 10 comprises centering cylinder 27, centering wafer-supporting platform 28, centering anchor clamps 32 and centering wafer-supporting platform lift cylinder 33, wherein centering wafer-supporting platform 28 belows connect centering wafer-supporting platform lift cylinder 33, and centering anchor clamps 32 are positioned at the top of centering wafer-supporting platform 28 and are connected with centering cylinder 27.Before robot 5 put into independent centering with the taking-up of the wafer in the film magazine 30, centering wafer-supporting platform lift cylinder 33 had been with 28 liftings of centering wafer-supporting platform, according to the suitable centering anchor clamps 32 of size Selection, after wafer is put into, by the clamping of centering cylinder 27, finishes wafer centering.
The present invention is the circular standard wafer of compatible 2-6 inch simultaneously, need not any change.Robot 5 is sent to wafer on corresponding each processing of wafers unit by manipulator according to technology and processes, robot 5 takes out wafer from box station 11 after, flow process according to program setting, automatically finish whole gluing developing process in device inside, and then the wafer after will being machined by robot 5 sends back in the film magazine 30, finishes the whole course of processing.This device can connect independent chemicals supply system, realizes round-the-clock uninterrupted feed flow.
Claims (10)
- A full-automatic glued membrane apply, developing apparatus, it is characterized in that: comprise robot (5), box station (11), independent centering unit (10) and processing of wafers unit, wherein box station (11) are positioned at the top of independent centering unit (10), described robot (5) is positioned at the center of device, described box station (11) and processing of wafers unit be installed in robot (5) around, described robot (5) by manipulator with on wafer each processing of wafers unit around delivering to.
- 2. by the described full-automatic glued membrane coating of claim 1, developing apparatus, it is characterized in that: described processing of wafers unit is provided with 1～7 station, comprises thermal treatment unit and centrifugal unit, and described thermal treatment unit and centrifugal unit are interchangeable.
- 3. by the described full-automatic glued membrane coating of claim 2, developing apparatus, it is characterized in that: described thermal treatment unit is four-layer structure, and each of this structure layer goes up places high temperature cold-heated plate unit, low warm dish, surface a kind of in allonge unit or the independent centering body once.
- 4. apply by the described full-automatic glued membrane of claim 2, developing apparatus, it is characterized in that: described centrifugal unit comprises vacuum cup (20), vacuum cup lift cylinder (18), quill shaft motor (19), glue cup (21), glue arm (22), glue arm lift cylinder (24), glue arm rotation motor (25) and medicine company control valve (26), wherein glue cup (21) is positioned at the below of vacuum cup (20), described vacuum cup (20) is connected with vacuum cup lift cylinder (18) and quill shaft motor (19) respectively, finishes the gluing development with the lifting or the rotation that realize vacuum cup (20); Described glue arm (22) be positioned at vacuum cup (20) the top, and is connected with glue arm lift cylinder (24) and glue arm rotation motor (25) respectively, to realize lifting or the rotation of glue arm (22), described glue arm (22) is controlled photoresist by medicine company control valve (26).
- 5. by the described full-automatic glued membrane coating of claim 4, developing apparatus, it is characterized in that: the top of described centrifugal unit is provided with the box of preserving moisture (23), and the Jiao Zui that finishes on the glue arm (22) after the technology puts into the described box of preserving moisture (23) by the driving of glue arm rotation motor (25); The below of described centrifugal unit is provided with discard solution discharge port (17), and this discard solution discharge port (17) is communicated with glue cup (21), and the waste liquid that glue cup (21) is collected is discharged by described discard solution discharge port (17).
- 6. by the described full-automatic glued membrane coating of claim 1, developing apparatus, it is characterized in that: described box station (11) comprises film magazine (30), film magazine guide vane end stop (31) and box station base plate (29), and wherein film magazine (30) is positioned on the box station base plate (29), also locatees by film magazine guide vane end stop (31).
- 7. by the described full-automatic glued membrane coating of claim 1, developing apparatus, it is characterized in that: described independent centering unit (10) comprises centering cylinder (27), centering wafer-supporting platform (28), centering anchor clamps (32) and centering wafer-supporting platform lift cylinder (33), wherein centering wafer-supporting platform (28) below connects centering wafer-supporting platform lift cylinder (33), and described centering anchor clamps (32) are positioned at the top of centering wafer-supporting platform (28) and are connected with centering cylinder (27).
- 8. by the described full-automatic glued membrane coating of claim 1, developing apparatus, it is characterized in that: the circular standard wafer of the simultaneously compatible 2-6 inch of described device.
- 9. by the described full-automatic glued membrane coating of claim 1, developing apparatus, it is characterized in that: described device is reserved with the Interface interface, and this interface is connected with factory automation system.
- 10. by the described full-automatic glued membrane coating of claim 1, developing apparatus, it is characterized in that: described device connects the independent chemicals supply system that realizes round-the-clock uninterrupted feed flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210001047.0A CN103199031B (en) | 2012-01-04 | 2012-01-04 | Full-automatic glue film coating, developing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210001047.0A CN103199031B (en) | 2012-01-04 | 2012-01-04 | Full-automatic glue film coating, developing apparatus |
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| CN103199031A true CN103199031A (en) | 2013-07-10 |
| CN103199031B CN103199031B (en) | 2015-10-14 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104597855A (en) * | 2013-10-30 | 2015-05-06 | 沈阳芯源微电子设备有限公司 | Process module layout method of gluing developer |
| CN104597726A (en) * | 2013-10-30 | 2015-05-06 | 沈阳芯源微电子设备有限公司 | Technological module structure of photo-resist coating and developing machine and layout method |
| CN105319871A (en) * | 2014-05-30 | 2016-02-10 | 盛美半导体设备（上海）有限公司 | Semiconductor substrate developing apparatus and semiconductor substrate developing method |
| CN105321829A (en) * | 2014-07-29 | 2016-02-10 | 盛美半导体设备（上海）有限公司 | Wafer gluing equipment |
| CN106292204A (en) * | 2015-05-28 | 2017-01-04 | 沈阳芯源微电子设备有限公司 | A kind of even glue developing device |
| CN106610568A (en) * | 2015-10-27 | 2017-05-03 | 沈阳芯源微电子设备有限公司 | Glue coating development process module and control method for module internal environment parameters |
| CN106647171A (en) * | 2015-11-02 | 2017-05-10 | 沈阳芯源微电子设备有限公司 | Sharing nozzle structure for two gumming units |
| CN109388028A (en) * | 2017-08-08 | 2019-02-26 | 长鑫存储技术有限公司 | A kind of offline photolithography method and its system |
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| CN106647171A (en) * | 2015-11-02 | 2017-05-10 | 沈阳芯源微电子设备有限公司 | Sharing nozzle structure for two gumming units |
| CN109388028A (en) * | 2017-08-08 | 2019-02-26 | 长鑫存储技术有限公司 | A kind of offline photolithography method and its system |
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| CN103199031B (en) | 2015-10-14 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |