CN103192182A - Nozzle for cutting ceramics by aid of fiber laser - Google Patents
Nozzle for cutting ceramics by aid of fiber laser Download PDFInfo
- Publication number
- CN103192182A CN103192182A CN2013101348046A CN201310134804A CN103192182A CN 103192182 A CN103192182 A CN 103192182A CN 2013101348046 A CN2013101348046 A CN 2013101348046A CN 201310134804 A CN201310134804 A CN 201310134804A CN 103192182 A CN103192182 A CN 103192182A
- Authority
- CN
- China
- Prior art keywords
- nozzle
- cutting
- oily material
- laser
- mass percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laser Beam Processing (AREA)
Abstract
A nozzle for cutting ceramics by the aid of fiber laser comprises a nozzle body, an airflow channel and an air orifice. The nozzle is characterized in that a plurality of air guide holes are arranged on a contact surface of the nozzle. The nozzle has the advantages that during cutting, an airflow field of the nozzle is free of shock waves, airflow at an outlet of the nozzle is uniform, is neat in border and does not apply force on a workpiece, accordingly, the cutting speed is obviously increased during actual cutting, and the cutting quality is obviously improved.
Description
Technical field
The present invention relates to optical-fiber laser cutting ceramic field, relate in particular to a kind of nozzle for optical-fiber laser cutting pottery.
Background technology
Laser cutting parameter is that the energy that discharges when adopting laser beam to shine ceramic surface makes pottery fusing and evaporation, pass through focus set, make laser beam concentrate on very little zone, energy height is concentrated cutting part is carried out rapid local heat, make the material evaporation, along with light beam moves relative to linear with material, make hole form the joint-cutting of narrower in width continuously, side cut is influenced by heat very little, and laser beam does not apply any power to material, be untouchable processing, so it is little or not have an advantage of being out of shape that the pottery of Laser Processing has distortion, in current laser cutting ceramic industry, what great majority adopted is traditional carbon dioxide laser cutting ceramic technology, lasing light emitter generally adopts the carbon dioxide high-power laser beam, because its cutting speed and smooth substantially cutting section efficiently at present also are the main flow technology that pottery divides plate processing.
Yet, the carbon dioxide laser cutting has following shortcoming for the ceramic cutting processing of some requirements at the higher level: cost is higher, efficient is low, the cut edge is uneven, for example the straight cuts of circuit unit profile just can't be suitable for, concavo-convex with as the ceramic substrate marginal existence stamp edge of carbon dioxide high power laser light cutting, the fluctuating scope is bigger, for the while efficiently at assurance laser cutting ceramic substrate, reduce similar stamp edge, someone has proposed to use optical-fiber laser to cut the method for pottery, as a rule, improve the cutting speed of material, the way that adopts is to improve the cutting pressure of surface of the work, and the cutting pressure that will improve surface of the work will improve the supply gas pressure of nozzle, any nozzle, if the ratio of the stream pressure of ejection and the stream pressure of surrounding environment was greater than 1.89 o'clock, the air-flow of nozzle ejection is exactly not adequately expanded supersonic airstream so, air-flow expands suddenly and can produce shock wave, and the existence of shock wave will cause cutting speed, width of slit, cutting performance and cutting stability are subjected to very big influence.
Summary of the invention
Technical problem solved by the invention is: the problem at the excessive generation shock wave influence of optical-fiber laser when pottery cutting nozzle supply gas pressure cutting achievement, a kind of new type nozzle is provided, and guarantee stable, speed, quality and the performance of cutting.
The technical solution used in the present invention is, a kind of nozzle for optical-fiber laser cutting pottery comprises nozzle body, gas channel and fumarole, and there are several gas ports at interface, described puff prot place.
As a further improvement on the present invention, described nozzle is processed by copper product, and the cutting head of nozzle and laser equipment is by being threaded.
As a further improvement on the present invention, described nozzle, fumarole and gas port are circular.
As a further improvement on the present invention, described nozzle has four gas ports.
As a further improvement on the present invention, on the contact-making surface of described nozzle cross groove is arranged.
As a further improvement on the present invention, described fumarole diameter is 0.7-1mm, and described gas port diameter is 0.5-0.8mm.
The invention has the beneficial effects as follows, in cutting process, there is not shock wave in the gas flowfield of the nozzle of the present invention's design, the jet expansion air-flow is even, and the border is neat, and the while exit flow does not have masterpiece and is used on the workpiece, in the cutting process of reality, cutting speed is improved significantly, and cut quality is also improved significantly, seldom waits as the roughness dross little, the joint-cutting lower limb of otch section; Under same laser power and supply gas pressure, the thickness of slab that new type nozzle is cut than conventional spout also increases; Nozzle and variation has been taken place by the distance between the cut spare, cutting performance is also more stable; New type nozzle is unlimited approach but do not contact in nozzle and workpiece distance, also can cut finely simultaneously, and conventional spout the distance between nozzle and the workpiece must be greater than 1mm when cutting.
Description of drawings
Fig. 1 is the flow chart of fiber cut ceramic methods;
Fig. 2 is the schematic diagram that nozzle is connected with cutting head;
Fig. 3 is the contact-making surface schematic diagram of nozzle;
Fig. 4 is the structure of nozzle schematic diagram;
Among the figure: 1, gas channel; 2, cutting head; 3, nozzle body; 4, gas port; 5, Cutting platform; 6, fumarole; 7, cross recess; 8, contact-making surface.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is further set forth.
S1, commissioning device, parameters such as the frequency of setting laser, pulsewidth, speed and focal height, the frequency of laser is 10kHz, pulsewidth is 28ms, speed is 50mm/s, and focal height is 20000step, the standard unit when step is laser cutting device adjustment focal height herein in the parameter database;
S2, load onto cutting nozzles, the cutting head 2 of nozzle and laser equipment is by being threaded, this nozzle and traditional nozzle are also inequality, redesign, nozzle is processed by copper product, comprise nozzle body 3, gas channel 1 and fumarole 6, nozzle, fumarole 6 and gas port 4 all are circular, 4 gas ports 4 and cross recess 7 are arranged on the contact-making surface 8 of described nozzle, fumarole 6 diameters are 0.8mm, gas port 4 diameters are 0.6mm, this cutting nozzles utilizes venturi principle, make gas form one " vacuum " district at the rear side of venturi outlet exactly, can make unlimited the tapping into nozzle of ceramic substrate, make the ceramic substrate of cutting can not blown power, in practical operation, there is not shock wave in the gas flowfield of nozzle, the jet expansion air-flow is even, the border is neat, the while exit flow does not have masterpiece and is used on the workpiece, and in the cutting process of reality, cutting speed is improved significantly, cut quality is also improved significantly, and is little as the roughness of otch section, the dross of joint-cutting lower limb seldom waits; Under same laser power and supply gas pressure, the thickness of slab that new type nozzle is cut than conventional spout also increases; Nozzle and variation has been taken place by the distance between the cut spare, cutting performance is also more stable; New type nozzle is unlimited approach but do not contact in nozzle and workpiece distance, also can cut finely simultaneously, and conventional spout the distance between nozzle and the workpiece must be greater than 1mm when cutting;
S3, clamping pallet smelting tool find relative position on cutting table top 5;
S4, ceramic substrate is placed on the pallet smelting tool, fix, ceramic substrate is before being placed into pallet smelting tool, need coat homemade absorbent, because the laser that pottery emits laser equipment can not absorb fully, so we will be by special surface treatment, help pottery and absorb laser, thereby can cut continuously and wear pottery, we have found a kind of special material-----surperficial blacking to handle optical absorbing agent, described absorbent is formed by oily material and acetone proportioning, the proportioning volume ratio of oily material and acetone is 1:525, stir after the dilution and get final product, oily material is by pigment, the pigment auxiliary agent, stabilizing agent, resist, wetting agent and anticorrisive agent proportioning form, pigment adopts ferric tannate and gallic acid iron, the pigment auxiliary agent adopts dark blue dyestuff, stabilizing agent adopts oxalic acid solution, resist adopts the resin type cure polymer, wetting agent adopts glycerine, anticorrisive agent adopts the penta sodium pentachlorophenate medicament, the mass percent that described pigment accounts for oily material is 16.7%, the mass percent that the pigment auxiliary agent accounts for oily material is 16.7%, the mass percent of stabilizer comprises oily material is 16.7%, the mass percent that resist accounts for oily material is 16.7%, the mass percent that wetting agent accounts for oily material is 16.7%, the mass percent that anticorrisive agent accounts for oily material is 16.5%, being added in stirs in the container can obtain oily material, this optical absorbing agent characteristics are environmental protection, easily be coated with, clean easily etc., the pottery that coats can be placed directly on the cutting machine and process, the absorption laser effect is fine, not disconnected optical phenomenon, cutting us directly is placed in the alcohol liquid and cleans and can remove, can not change the characteristic of pottery itself, do not have corrosion phenomenon yet, outward appearance with do not do the same that blacking handles, do not have what pollution;
S5, begin the cutting.
Embodiment 2: the difference of itself and embodiment 1 is,
The frequency of laser is 5kHz among the step S1, and pulsewidth is 10ms, and speed is 8mm/s, and focal height is 18000step;
The volume ratio of oily material and acetone is 1:500 among the step S4, the mass percent that described pigment accounts for oily material is 10%, the mass percent that the pigment auxiliary agent accounts for oily material is 10%, the mass percent of stabilizer comprises oily material is 30%, the mass percent that resist accounts for oily material is 30%, the mass percent that wetting agent accounts for oily material is 10%, and the mass percent that anticorrisive agent accounts for oily material is 10%.
Embodiment 3: the difference of itself and embodiment 1 is,
The frequency of laser is 15kHz among the step S1, and pulsewidth is 50ms, and speed is 80mm/s, and focal height is 18000step;
The volume ratio of oily material and acetone is 1:550 among the step S4, the mass percent that described pigment accounts for oily material is 30%, the mass percent that the pigment auxiliary agent accounts for oily material is 30%, the mass percent of stabilizer comprises oily material is 10%, the mass percent that resist accounts for oily material is 10%, the mass percent that wetting agent accounts for oily material is 10%, and the mass percent that anticorrisive agent accounts for oily material is 10%.
Embodiment 4: the difference of itself and embodiment 1 is,
The frequency of laser is 12kHz among the step S1, and pulsewidth is 20ms, and speed is 60mm/s, and focal height is 21000step;
The volume ratio of oily material and acetone is 1:530 among the step S4, the mass percent that described pigment accounts for oily material is 10%, the mass percent that the pigment auxiliary agent accounts for oily material is 10%, the mass percent of stabilizer comprises oily material is 10%, the mass percent that resist accounts for oily material is 10%, the mass percent that wetting agent accounts for oily material is 30%, and the mass percent that anticorrisive agent accounts for oily material is 30%.
In the description of this specification, concrete feature, structure, material or characteristics that the description of reference term " embodiment ", " some embodiment ", " example ", " concrete example " or " some examples " etc. means in conjunction with this embodiment or example description are contained at least one embodiment of the present invention or the example.In this manual, the schematic statement to above-mentioned term not necessarily refers to identical embodiment or example.And concrete feature, structure, material or the characteristics of description can be with the suitable manner combination in any one or more embodiment or example.
Although illustrated and described embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple variation, modification, replacement and modification to these embodiment under the situation that does not break away from principle of the present invention and aim, scope of the present invention is limited by claim and equivalent thereof.
Claims (6)
1. a nozzle that is used for optical-fiber laser cutting pottery comprises nozzle body, gas channel and fumarole, it is characterized in that several gas ports are arranged on the contact-making surface of described nozzle.
2. nozzle according to claim 1 is characterized in that, described nozzle is processed by copper product, and the cutting head of nozzle and laser equipment is by being threaded.
3. nozzle according to claim 1 is characterized in that, described nozzle, fumarole and gas port are circular.
4. nozzle according to claim 1 is characterized in that, described nozzle has four gas ports.
5. nozzle according to claim 1 is characterized in that, on the contact-making surface of described nozzle cross groove is arranged.
6. nozzle according to claim 3 is characterized in that, described fumarole diameter is 0.7-1.0mm, and described gas port diameter is 0.5-0.8mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101348046A CN103192182A (en) | 2013-04-18 | 2013-04-18 | Nozzle for cutting ceramics by aid of fiber laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101348046A CN103192182A (en) | 2013-04-18 | 2013-04-18 | Nozzle for cutting ceramics by aid of fiber laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103192182A true CN103192182A (en) | 2013-07-10 |
Family
ID=48715096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101348046A Pending CN103192182A (en) | 2013-04-18 | 2013-04-18 | Nozzle for cutting ceramics by aid of fiber laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103192182A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104646824A (en) * | 2015-01-26 | 2015-05-27 | 武汉华工激光工程有限责任公司 | Absorbent for ceramic laser cutting and preparation method for absorbent |
| CN118162777A (en) * | 2024-05-15 | 2024-06-11 | 杭州智控网络有限公司 | Electronic price tag circuit board production and processing system and technology |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4992643A (en) * | 1989-08-25 | 1991-02-12 | United States Department Of Energy | Method and device for controlling plume during laser welding |
| CN1106329A (en) * | 1993-10-21 | 1995-08-09 | 三菱电机株式会社 | Processing head and laser processing device |
| EP0924022A2 (en) * | 1997-12-22 | 1999-06-23 | Esse. A. S.a.s. di Achiluzzi Stefano & C. | Terminal group for laser beam devices, in particular for cutting metal sheets |
| JP2000084686A (en) * | 1998-09-09 | 2000-03-28 | Tanaka Seisakusho Kk | Laser piercing method, laser machining nozzle and laser cutting device |
| US6118097A (en) * | 1992-10-23 | 2000-09-12 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| EP1354663A1 (en) * | 2002-03-27 | 2003-10-22 | LVD Company NV | Nozzle for lasercutting |
| JP2005082414A (en) * | 2003-09-04 | 2005-03-31 | Tokyo Metropolis | Ceramic material cutting method and cutting apparatus |
| US20050274702A1 (en) * | 2004-06-15 | 2005-12-15 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| US20070062921A1 (en) * | 2005-09-13 | 2007-03-22 | Lemi Ltd. | Full-body laser scribing method of fragile material |
| US20070199927A1 (en) * | 1999-12-28 | 2007-08-30 | Bo Gu | Laser-based method and system for removing one or more target link structures |
| JP2008000818A (en) * | 2007-07-26 | 2008-01-10 | Lemi Ltd | Method of cleaving brittle material and brittle material to be used for it |
| JP2009178720A (en) * | 2008-01-29 | 2009-08-13 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| CN101658979A (en) * | 2009-10-09 | 2010-03-03 | 廊坊昊博金刚石有限公司 | Laser double-faced synchronous machining system and machining method thereof |
| CN102371433A (en) * | 2011-11-21 | 2012-03-14 | 苏州吉矽精密科技有限公司 | Laser cutting head nozzle device |
| JP4930594B2 (en) * | 2007-08-03 | 2012-05-16 | 三菱電機株式会社 | Laser processing nozzle |
| CN203371171U (en) * | 2013-04-18 | 2014-01-01 | 苏州光韵达光电科技有限公司 | Nozzle used for ceramic cutting by optical fiber laser |
-
2013
- 2013-04-18 CN CN2013101348046A patent/CN103192182A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4992643A (en) * | 1989-08-25 | 1991-02-12 | United States Department Of Energy | Method and device for controlling plume during laser welding |
| US6118097A (en) * | 1992-10-23 | 2000-09-12 | Mitsubishi Denki Kabushiki Kaisha | Machining head and laser machining apparatus |
| CN1106329A (en) * | 1993-10-21 | 1995-08-09 | 三菱电机株式会社 | Processing head and laser processing device |
| EP0924022A2 (en) * | 1997-12-22 | 1999-06-23 | Esse. A. S.a.s. di Achiluzzi Stefano & C. | Terminal group for laser beam devices, in particular for cutting metal sheets |
| JP2000084686A (en) * | 1998-09-09 | 2000-03-28 | Tanaka Seisakusho Kk | Laser piercing method, laser machining nozzle and laser cutting device |
| US20070199927A1 (en) * | 1999-12-28 | 2007-08-30 | Bo Gu | Laser-based method and system for removing one or more target link structures |
| EP1354663A1 (en) * | 2002-03-27 | 2003-10-22 | LVD Company NV | Nozzle for lasercutting |
| JP2005082414A (en) * | 2003-09-04 | 2005-03-31 | Tokyo Metropolis | Ceramic material cutting method and cutting apparatus |
| US20050274702A1 (en) * | 2004-06-15 | 2005-12-15 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
| US20070062921A1 (en) * | 2005-09-13 | 2007-03-22 | Lemi Ltd. | Full-body laser scribing method of fragile material |
| JP2008000818A (en) * | 2007-07-26 | 2008-01-10 | Lemi Ltd | Method of cleaving brittle material and brittle material to be used for it |
| JP4930594B2 (en) * | 2007-08-03 | 2012-05-16 | 三菱電機株式会社 | Laser processing nozzle |
| JP2009178720A (en) * | 2008-01-29 | 2009-08-13 | Mitsubishi Electric Corp | Laser beam machining apparatus |
| CN101658979A (en) * | 2009-10-09 | 2010-03-03 | 廊坊昊博金刚石有限公司 | Laser double-faced synchronous machining system and machining method thereof |
| CN102371433A (en) * | 2011-11-21 | 2012-03-14 | 苏州吉矽精密科技有限公司 | Laser cutting head nozzle device |
| CN203371171U (en) * | 2013-04-18 | 2014-01-01 | 苏州光韵达光电科技有限公司 | Nozzle used for ceramic cutting by optical fiber laser |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104646824A (en) * | 2015-01-26 | 2015-05-27 | 武汉华工激光工程有限责任公司 | Absorbent for ceramic laser cutting and preparation method for absorbent |
| CN118162777A (en) * | 2024-05-15 | 2024-06-11 | 杭州智控网络有限公司 | Electronic price tag circuit board production and processing system and technology |
| CN118162777B (en) * | 2024-05-15 | 2024-07-26 | 杭州智控网络有限公司 | Electronic price tag circuit board production and processing system and technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103170751A (en) | Method for cutting ceramics by optical fiber lasers | |
| JP5073485B2 (en) | Laser machining of workpieces | |
| CN106112280B (en) | Laser perforation processing method | |
| AU2013343367B2 (en) | Laser nozzle having an external mobile element | |
| US20180354073A1 (en) | Laser nozzle comprising an element movable in a gas layer | |
| CN105479016A (en) | Laser cutting method for PCB containing copper layer | |
| CN103358028A (en) | Method and system for scribing brittle ultrathin piece by water jet and laser | |
| CN103831540A (en) | Laser composite punching method for ceramics | |
| KR102060673B1 (en) | Laser machining apparatus | |
| CN108500468A (en) | A kind of method of curved profile laser deburring | |
| CN207013872U (en) | A kind of glass very low power processing unit (plant) | |
| CN203390389U (en) | System for etching fragile material ultrathin sheet with water jet and laser | |
| CN106141445A (en) | A kind of non-coaxial laser processing device | |
| CN103192182A (en) | Nozzle for cutting ceramics by aid of fiber laser | |
| CN103192199B (en) | Absorbent for cutting ceramics by aid of fiber laser | |
| CN203371171U (en) | Nozzle used for ceramic cutting by optical fiber laser | |
| CN109048088B (en) | Method and device for composite machining of micropores by long-pulse laser and plasma jet | |
| CN103802024B (en) | A kind of Apparatus and method for using dual-beam to repair ultra-thin extra hard material grinding wheel | |
| CN101474720A (en) | Laser processing method | |
| CN107414322A (en) | One kind reduces re cast layer device and method caused by laser micropore processing | |
| JP2017177155A (en) | Laser processing head | |
| CN111347179A (en) | Ultraviolet laser processing technology and system for light-transmitting micropores of electronic equipment | |
| CN202804480U (en) | Flushing and immersion cooling laser cutting device | |
| CN106271096A (en) | A kind of processing method of pcb board | |
| CN117086478A (en) | Annular water curtain composite water guide laser processing device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130710 |