CN103187409A - Light-emitting diode (LED) array packaging light source module based on lead frame - Google Patents
Light-emitting diode (LED) array packaging light source module based on lead frame Download PDFInfo
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- CN103187409A CN103187409A CN2011104581715A CN201110458171A CN103187409A CN 103187409 A CN103187409 A CN 103187409A CN 2011104581715 A CN2011104581715 A CN 2011104581715A CN 201110458171 A CN201110458171 A CN 201110458171A CN 103187409 A CN103187409 A CN 103187409A
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Abstract
The invention discloses a light-emitting diode (LED) array packaging light source module based on a lead frame. The LED array packaging light source module based on the lead frame comprises an LED chip, a radiating substrate, the lead frame, a support, a molding material, fluorescent powder, potting adhesive and a lens array, and is characterized in that the LED chip is installed on the radiating substrate through welding materials, silver paste and conductive adhesive, is connected with the lead frame through a bonding wire, and is fixedly installed on molding through the radiating substrate and the lead frame in a plastic package mode, wherein the radiating substrate and the lead frame are formed by stamping thin metal plates; and a lens or the lens array is fixed on a fixed clamping groove of the molding material. The LED array packaging light source module based on the lead frame has the advantages that the lead frame and the radiating substrate are formed by once stamping the thin metal plates, manufacturing process is simple, cost can be effectively reduced, radiating performance is good, junction temperature of the LED chip is effectively reduced, service life of the LED light source is prolonged, a lens fixing device on the molding material can effectively reduce the dangers that the lens and the lens array drops, and reliability of the LED light source module is improved.
Description
Technical field
The present invention relates to a kind of semiconductor lighting device, particularly a kind of led array packaged light source module based on lead frame.
Background technology
Light-emitting diode (LED) is a kind of electroluminescent device that can directly electric energy be converted into visible light and radiant energy, and its luminescence mechanism is to utilize the composite action in electronics and hole to produce photon.LED compares conventional light source and has the luminous efficiency height, and color rendering is good, and power consumption is few, energy-conserving and environment-protective, security reliability height, the advantage of long service life, and begun to be used widely in a lot of fields, thought the main direction in lighting source market to have huge market potential by industry.
Led chip process packaging technology is to form various forms of light sources.The LED encapsulation can be adopted single chip encapsulation, also can adopt the array encapsulation, no matter is single chip encapsulation, or the array encapsulation all will provide corresponding package support.Led array formula encapsulation can the chip of many certain power integrated and formation than the high-power LED light source.But at present led array formula packaging does not also satisfy requirements such as the heat radiation of led chip and mechanical protection.
Summary of the invention
The objective of the invention is at the defective that exists in the prior art, a kind of led array packaged light source module based on lead frame is provided.
The present invention includes heat-radiating substrate, lead frame, support, moulding compound led chip array, fluorescent material, casting glue, lens arra, it is characterized in that described led chip array is installed on the heat-radiating substrate through scolder, silver slurry, conducting resinl, led array is by bonding wire and lead frame interconnection, be fixedly mounted on the molding through plastic packaging by the stamping forming heat-radiating substrate of metal sheet and lead frame, lens or lens arra are fixed on the fixed card slot of moulding compound.
Described heat-radiating substrate and lead frame are applicable to horizontal chip, vertical chip, flip-chip.Heat-radiating substrate and lead frame are formed by the thin metal semi-stamping of a monoblock, and heat-radiating substrate thickness is less, can effectively reduce the heat radiation thermal resistance, and by the Sheet Metal Forming Technology one-shot forming, are easy to form module array, effectively reduce cost.Metallic plate by stamping forming heat-radiating substrate and lead frame, its thickness is between the 0.1-5 millimeter, material is aluminium or copper or stainless steel metal, because heat-radiating substrate is that the led chip array is to the main heat dissipation channel of heat radiation substrate, so thermal diffusivity copper good, that thermal conductivity is high is reasonable selection scheme.Sputtering sedimentation or electroplated metal layer on heat-radiating substrate and lead frame, the material of metal level are gold, silver.Pass through Shooting Technique, heat-radiating substrate and lead frame are fixed by moulding compound, by in heat radiation substrate and the different outstanding structures of lead frame design, made the contact area of moulding compound and lead frame increase, can prevent that moulding compound from coming off at lead frame, improve its reliability.
Described heat-radiating substrate is planar structure or produces groove structure through Sheet Metal Forming Technology, the heat-radiating substrate upper surface is a kind of concave shape, its degree of depth is the 0.1-5 millimeter, the inclination angle is the arbitrarily angled of 0-90 degree, described heat-radiating substrate, lead frame and support are as a whole, and encapsulation is finished by cutting muscle technology and separated formation modular optical source module from support.Heat-radiating substrate is made up of one or several, and is in aggregates with corresponding lead frame combination by one or several heat-radiating substrates.
Described heat-radiating substrate and lead frame are fixed by moulding compound injection moulding mode plastic packaging, and heat-radiating substrate exposes the moulding compound lower surface with the described heat radiation substrate lower surface of lead-in wire, and the side of lead frame stretches out moulding compound and forms pin, and pin is two or more.It is mosaic texture between the frame structure.
Described moulding compound is formed for fixed lens and lens arra groove by injection moulding, and it is shaped as rectangle or trapezoidal.
The number of described led array is two or more, forms serial or parallel connection between the LED and connects.
Described phosphor powder layer applies by guarantor's type or some glue mode is coated on the chip array.
Described lens are that single big lens or lens arra or integral type lens arra are installed in the fixture of moulding compound, big lens be shaped as semicircle spherical or cone shape or round table-like or free form surface shape, lens arra or integral type lens arra are dome-type lens arra or free-form surface lens array, and its material is PC, PMMA, silica gel, glass.Single big lens or lens arra or integral type lens arra can also directly be made by mould-injection process or two-shot process finishing on the module of fluorescent powder coated technique.
Advantage of the present invention is to realize the encapsulation of led light source modularization, can satisfy the different application requirement, heat-radiating substrate and lead frame are one time punching molded by metal sheet simultaneously, manufacture process is simple, can effectively reduce cost, simultaneously perfect heat-dissipating, effectively reduce the led chip junction temperature, improve the life-span of led light source, the lens fixing device on the moulding compound can effectively reduce the danger that lens and lens arra come off, and improves the reliability of led light source module.
Description of drawings
Fig. 1 schematic appearance of the present invention;
Fig. 2 structural representation of the present invention;
The heat-radiating substrate of Fig. 3 embodiment one and array of lead frames schematic diagram;
The heat-radiating substrate of the individual module of Fig. 4 embodiment one and lead frame schematic diagram;
Fig. 5 Fig. 4 A-A generalized section;
The heat-radiating substrate of Fig. 6 embodiment one, lead frame, moulding compound plastic packaging schematic diagram;
Fig. 7 Fig. 6 A-A generalized section;
The led chip paster schematic diagram of Fig. 8 embodiment one;
The gold thread lead-in wire bonding schematic diagram of Fig. 9 embodiment one;
The fluorescent material conformal of Figure 10 embodiment one applies schematic diagram;
The installation integral type lens arra schematic diagram of Figure 11 embodiment one;
Figure 12 Figure 11 A-A generalized section;
Figure 13 embodiment one silica gel embedding schematic diagram;
Figure 14 lens fixed card slot (trapezoidal) schematic diagram;
Single lenslet schematic diagram is installed among Figure 15 embodiment six;
Utilize Shooting Technique to make big lens schematic diagram among Figure 16 embodiment seven
Utilize Shooting Technique to make the free-form surface lens schematic diagram among Figure 17 embodiment seven;
The single big lens schematic diagram of the installation of Figure 18 embodiment eight;
The single big lens of the installation of Figure 19 embodiment eight (round table-like) schematic diagram;
Among the figure: 101 heat-radiating substrates, 102 lead frames, 103 moulding compounds, the 104LED chip array, 105 gold threads, 106 phosphor powder layers, 107 silica gel, the 107a soft silica gel, 108 integral type lens arras, 109 lens arras, the big lens of 110 injection mo(u)ldings, the big lens of 111 injection mo(u)lding free form surfaces, the big lens of 112 hemispheres, the big lens of 112 truncated cone-shaped, 201 array of packages, 202 circular grooves, 203 supports, more than 204 heat-radiating substrate combination, 301 package modules that are combined to form by a plurality of heat-radiating substrates, 302 rectangular lens fixed card slots, 303 fixed card slots of falling the trapezoid lens, 401 injecting glue holes.
Embodiment
Embodiment one
Further specify embodiments of the invention below in conjunction with accompanying drawing:
Referring to Fig. 1～Figure 13, present embodiment comprises: tabular heat-radiating substrate 101, lead frame 102, play insulating effect and moulding compound 103, led chip array 104, metal lead wire 105, fluorescent powder silica gel mixture 106, silica gel 107, the integral type lens arra 108 of structural support effect are provided.
Tabular heat-radiating substrate 101 and lead frame 102 are made by Sheet Metal Forming Technology.Its technical process is: get metal sheet, its thickness is the 0.1-5 millimeter, the diel that making meets the demands, punching course are carried out in two steps, and the first step stamps out circular groove 202 earlier, the degree of depth of groove is the 0-0.3 millimeter, the second step punching press is told heat-radiating substrate 101, lead frame 102 and support 203, tabular heat-radiating substrate 101 after punching press is finished, lead frame 102 and support 203 still are an array of packages 201, as shown in Figure 3.Comprise 4 or 101, one array of packages 201 of a plurality of tabular heat-radiating substrate in the module 204 and can comprise a plurality of modules 204.Because tabular heat-radiating substrate 101 is main heat dissipation channels that led chip arrives thermal conductive substrate, so thermal diffusivity copper good, that thermal conductivity is high is reasonable selection scheme.For lead frame 102 increases reflection, improve and get optical efficiency, at lead frame 102 electroplating surface metal layers, its material can be silver or golden.
Tabular heat-radiating substrate 101 is fixing by moulding compound 103 with lead frame 102, and moulding compound 103 also plays insulating effect.Moulding material can be liquid state or solid state heat hardening resin, such as PA9T, and PPA etc.Moulding compound is made by Shooting Technique, its technical process is: make the injection mold that meets the demands, apply release agent, with tabular heat-radiating substrate 101, the overall structure of lead frame 102 and support 203 is that array of packages 201 is put into mould, inject moulding compound by injecting hole, cooling forming forms individual module 301 after cutting muscle.Have the fixed card slot 302 of lens arra 108 on the moulding compound of institute's moulding, lens arra fixed card slot 302 has guaranteed the reliability of lens arra.The side of lead frame 102 stretches out moulding compound 103, forms pin, in order to realize and extraneous electrical interconnection.
102 of tabular heat-radiating substrate 101 and lead frames can be designed to the alternate form of convex-concave, are conducive to increase in the moulding compound filling process contact area of moulding compound and lead frame 102 like this, can prevent coming off of moulding compound.
Led chip array 104 is assembled to the upper surface of the circular groove 202 of tabular heat-radiating substrate 101 by scolder, silver slurry, conducting resinl etc., and circular groove 202 can be placed four or more led chip.At the led chip top, be bonded to lead frame 102 by spun gold 105 lead-in wire and finish and be electrically connected, can be by series connection between led chip, or mode in parallel connects.At led chip array 104 surface-coated layer of fluorescent powder layers 106, the blue light of blue-light LED chip outgoing is converted into white light by guarantor's type coating processes.
Embodiment two
Embodiment two is identical with embodiment one, difference is that the silica gel phosphor mixture is filled into for the circular groove 202 that mounts led chip array 104, because the degree of depth of circular groove 202 is between the 0-0.3 millimeter, by this simple some glue mode at led chip surface-coated layer of even phosphor powder layer 106, the blue light of blue-light LED chip outgoing is converted into white light, the side of circular groove 202 is stamped into inclination, and its angle is between 20 degree-90 degree.
Embodiment three
Embodiment three is identical with embodiment one, and difference is the inverted ladder type that is shaped as of lens fixed card slot, and the edge of lens arra 108 is the inverted ladder type that cooperates with it, as shown in figure 14.By falling the cooperation of trapezoidal fixed card slot 303, guarantee the fixing of lens arra 108, improve the reliability of LED package module.
Embodiment four
Embodiment four is identical with embodiment one, and difference is that led chip adopts the vertical electrode chip.Its positive pole of vertical electrode chip and negative pole lay respectively at end face and the bottom surface of chip.Form electrical interconnection at the chip end face by gold wire bonding 105 and lead frame 102, another electrode forms electric interconnection by scolder and tabular heat-radiating substrate 101, forms between each chip of led chip to be connected in parallel.
Embodiment five
Embodiment five is identical with embodiment one, and difference is that lens arra 108 adopts the free-form surface lens array, and lens integral body is embedded in the moulding compound.This packing forms can form different optics distribution curve fluxs, satisfies different lighting requirements.
Embodiment six
Embodiment six is identical with embodiment one, and difference is to be corresponding single lenslet on every group of led chip chip array 104, forms lens arra 109, lens be shaped as dome-type or free-form surface lens, lens are installed in the moulding compound, separately as shown in figure 15.
Embodiment seven
Embodiment seven is identical with embodiment one, and to be lens form or adopt the method for post forming by mold injection to difference, and adopting the material of mold injection method is harder silica gel.Lens arra is sphere lens 110 or free-form surface lens 111.Adopt post forming method to adopt softer silica gel to form protective layer 107a earlier, form sphere lens 110 or free-form surface lens 111 with harder silica gel again, to improve the reliability of led module, as Figure 16, shown in 17.
Embodiment eight
Embodiment eight is identical with embodiment one, and difference is that lens are whole big lens, and its shape can be hemisphere 112 or semicircle bench-type 113, to satisfy the different optical requirement, shown in Figure 18,19.
Claims (11)
1. led array packaged light source module based on lead frame, comprise led chip, heat-radiating substrate, lead frame, support, moulding compound, fluorescent material, casting glue, lens arra, it is characterized in that described led chip is installed on the heat-radiating substrate through scolder, silver slurry, conducting resinl, led chip is by bonding wire and lead frame interconnection, be fixedly mounted on the molding through plastic packaging by the stamping forming heat-radiating substrate of metal sheet and lead frame, lens or lens arra are fixed on the fixed card slot of moulding compound.
2. the led array packaged light source module based on lead frame according to claim 1, it is characterized in that described metallic plate by stamping forming heat-radiating substrate and lead frame, its thickness is between the 0.1-5 millimeter, material is aluminium or copper or stainless steel metal, sputtering sedimentation or electroplated metal layer on heat-radiating substrate and lead frame, the material of metal level are gold, silver.
3. the led array packaged light source module based on lead frame according to claim 1, it is characterized in that described heat-radiating substrate is planar structure or for to produce groove structure through Sheet Metal Forming Technology, the heat-radiating substrate upper surface is a kind of concave shape, its degree of depth is the 0.1-5 millimeter, the inclination angle is the arbitrarily angled of 0-90 degree, described heat-radiating substrate, lead frame and support are as a whole, and encapsulation is finished by cutting muscle technology and separated formation modular optical source module from support.
4. the led array packaged light source module based on lead frame according to claim 1 is characterized in that described heat-radiating substrate is made up of one or several, is combined into an integral body by one or several heat-radiating substrates with corresponding lead frame.
5. the led array packaged light source module based on lead frame according to claim 1 is characterized in that described heat-radiating substrate and lead frame fix by moulding compound injection moulding mode plastic packaging, is mosaic texture between heat-radiating substrate and the lead frame structure.
6. the led array packaged light source module based on lead frame according to claim 1 is characterized in that the side of described lead frame stretches out moulding compound formation pin, and pin is two or more.
7. the led array packaged light source module based on lead frame according to claim 1 is characterized in that described moulding compound is formed for fixed lens and lens arra groove by injection moulding, and it is shaped as rectangle or trapezoidal.
8. the led array packaged light source module based on lead frame according to claim 1, the number that it is characterized in that described led array is two or more, forms serial or parallel connection between the LED and connects.
9. the led array packaged light source module based on lead frame according to claim 1 is characterized in that described phosphor powder layer applies by guarantor's type or some glue mode is coated on the chip array.
10. the led array packaged light source module based on lead frame according to claim 1, it is characterized in that described lens are that single big lens or lens arra or integral type lens arra are installed in the fixture of moulding compound, big lens be shaped as semicircle spherical or cone shape or round table-like or free form surface shape, the integral type lens arra is dome-type lens arra or free-form surface lens array, and its material is PC, PMMA, silica gel, glass.
11. according to claim 1 or 10 described led array packaged light source modules based on lead frame, it is characterized in that described lens are single big lens or lens arra or integral type lens arra and directly are made by mould-injection process or two-shot process finishing on the module of fluorescent powder coated technique.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011104581715A CN103187409A (en) | 2011-12-31 | 2011-12-31 | Light-emitting diode (LED) array packaging light source module based on lead frame |
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| CN2011104581715A CN103187409A (en) | 2011-12-31 | 2011-12-31 | Light-emitting diode (LED) array packaging light source module based on lead frame |
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Cited By (11)
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| CN104659006A (en) * | 2013-11-19 | 2015-05-27 | 西安永电电气有限责任公司 | Lead frame structure of plastic package type IPM (intelligent power module) |
| CN106229401A (en) * | 2016-08-24 | 2016-12-14 | 电子科技大学 | Fluorescence LED array of packages |
| CN108258098A (en) * | 2017-12-26 | 2018-07-06 | 佛山市南海区联合广东新光源产业创新中心 | A kind of inorganic integrated deep ultraviolet LED encapsulation structure |
| CN108447854A (en) * | 2018-03-30 | 2018-08-24 | 南昌大学 | A kind of package module of LED chip and preparation method thereof |
| CN108730927A (en) * | 2018-06-17 | 2018-11-02 | 厦门天微电子有限公司 | A kind of four groups of LED lamp integral packaging methods |
| CN108799861A (en) * | 2018-07-13 | 2018-11-13 | 深圳市蓝谱里克科技有限公司 | A kind of LED integrating packaging modules with integral array formula lens |
| CN108895313A (en) * | 2018-08-01 | 2018-11-27 | 苏州汇影光学技术有限公司 | A kind of array ultraviolet LED source of parallel light |
| CN109727963A (en) * | 2019-01-11 | 2019-05-07 | 深圳市同一方光电技术有限公司 | A kind of novel formal dress COB light source of the not dead lamp encapsulation of thermostable |
| CN111326429A (en) * | 2020-03-06 | 2020-06-23 | 浙江工业职业技术学院 | A double base island heat dissipation chip packaging process |
| CN111379981A (en) * | 2020-04-28 | 2020-07-07 | 东莞市索菲电子科技有限公司 | Light-concentrating high-color-rendering-index high-brightness surface-mounted LED |
| CN112133693A (en) * | 2020-10-13 | 2020-12-25 | 业成科技（成都）有限公司 | Packaging structure and manufacturing method thereof, backlight source assembly, electronic equipment and packaging equipment |
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| CN108799861A (en) * | 2018-07-13 | 2018-11-13 | 深圳市蓝谱里克科技有限公司 | A kind of LED integrating packaging modules with integral array formula lens |
| CN108895313A (en) * | 2018-08-01 | 2018-11-27 | 苏州汇影光学技术有限公司 | A kind of array ultraviolet LED source of parallel light |
| CN109727963A (en) * | 2019-01-11 | 2019-05-07 | 深圳市同一方光电技术有限公司 | A kind of novel formal dress COB light source of the not dead lamp encapsulation of thermostable |
| CN111326429A (en) * | 2020-03-06 | 2020-06-23 | 浙江工业职业技术学院 | A double base island heat dissipation chip packaging process |
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| CN111379981A (en) * | 2020-04-28 | 2020-07-07 | 东莞市索菲电子科技有限公司 | Light-concentrating high-color-rendering-index high-brightness surface-mounted LED |
| CN112133693A (en) * | 2020-10-13 | 2020-12-25 | 业成科技（成都）有限公司 | Packaging structure and manufacturing method thereof, backlight source assembly, electronic equipment and packaging equipment |
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Application publication date: 20130703 |