CN103187240A - Semiconductor processing device - Google Patents
Semiconductor processing device Download PDFInfo
- Publication number
- CN103187240A CN103187240A CN2011104519216A CN201110451921A CN103187240A CN 103187240 A CN103187240 A CN 103187240A CN 2011104519216 A CN2011104519216 A CN 2011104519216A CN 201110451921 A CN201110451921 A CN 201110451921A CN 103187240 A CN103187240 A CN 103187240A
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- substrate
- fluid
- semiconductor processing
- processing equipment
- micro chamber
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 62
- 239000012530 fluid Substances 0.000 claims abstract description 133
- 239000000758 substrate Substances 0.000 claims description 85
- 238000000034 method Methods 0.000 claims description 24
- 239000013078 crystal Substances 0.000 claims description 21
- 238000004891 communication Methods 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 17
- 238000007599 discharging Methods 0.000 claims description 5
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 10
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007792 gaseous phase Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
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- Details Of Reciprocating Pumps (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a semiconductor processing device which comprises a semiconductor processing module and a fluid transfer module. The fluid transfer module comprises a support frame, a plurality of base plates, various valves, a pump, a meter, a transducer, connectors and pipelines, wherein the base plates are assembled on the support frame and form a fluid space, the various valves, the pump, the meter, the transducer, the connectors and the pipelines are used for transferring fluid, at least one base plate is provided with mounting holes, and each valve is provided with an end portion which is communicated with an end port, penetrates through the base plates and extends into the fluid space. The fluid transfer module has the advantages of being simple in structure, convenient to flexible to assemble and easy to maintain. Further, assemblies can be changed conveniently and the like.
Description
[technical field]
The present invention relates to the semiconductor surface process field, relate in particular to and a kind of semiconductor crystal wafer is carried out the surface-treated semiconductor processing equipment.
[background technology]
Integrated circuit is applied in a lot of fields gradually at present, such as computer, communication, Industry Control and consumer electronics etc.The manufacturing industry of integrated circuit has become the same important basic industry with iron and steel.
Wafer is to produce the used carrier of integrated circuit.The wafer that needs to prepare in actual production has smooth, super clean Surface, and can be divided into two kinds for the preparation of the existing method of super clean wafer surface: such as the wet treatment process of submergence and spraying technique, and such as the dry process process based on chemical gaseous phase and plasma technology.Wherein wet treatment process is that prior art adopts method comparatively widely, and the wet treatment process generally includes a succession of step that adopts suitable chemical solution submergence or spray wafer and forms.
Yet the equipment of the general super clean wafer surface of existing preparation generally has following shortcoming: 1, equipment volume is bigger; 2, the consumption for the treatment of fluid and ultra-pure water is higher; 3, in a single day a little equipment break down, and flux is produced in the regular meeting's influence of fixing a breakdown.
Therefore, be necessary to propose a solution and solve the problems referred to above.
[summary of the invention]
The technical problem to be solved in the present invention is to provide the semiconductor processing device that a kind of volume is less, simple in structure, assembly is easy to change.
In order to address the above problem, according to an aspect of the present invention, the invention provides a kind of semiconductor processing equipment, it comprises semiconductor processes module and fluid delivery module, described semiconductor processes module comprises that one is used for holding and handling the micro chamber of semiconductor crystal wafer, described micro chamber comprises one or more entrance and one or more outlets of discharging described micro chamber for fluid that enter described micro chamber for fluid, described fluid delivery module is used for the various fluids that do not use are delivered to described micro chamber by pipeline and described micro chamber entrance, described fluid delivery module comprises carriage, be assembled in a plurality of substrates and valve on the described carriage, described a plurality of substrate crosses a fluid space, one or more substrate is provided with installing hole, and the installing hole that the end that is provided with communications ports of described valve is passed on the described substrate extends in the described fluid space.
Further, be assembled in that a plurality of substrates on the described carriage comprise bottom substrate, the head substrate that arranges at interval with described bottom substrate and two are apart from one another by the side substrates that arrange, described side substrate is provided with installing hole.
Further, two side substrates be arranged in parallel, and described head substrate and described bottom substrate be arranged in parallel.
Further, offer the under shed that is communicated with described fluid space at described bottom substrate, this under shed pipeline for connection passes.
Further, offer the upper shed that is communicated with described fluid space at described head substrate, this upper shed pipeline for connection passes.
Further, be installed on a plurality of valves on each side substrate.
Further, described fluid delivery module also includes pump, the installing hole that the suction inlet that sucks liquid and the end of discharging the outlet of liquid pass on one of them side substrate that is provided with of described pump extends in the described fluid space, and the installing hole that the end that is provided with communications ports of described valve is passed on wherein another side substrate extends in the described fluid space.
Further again, the entrance of the outlet of described pump intake, described pump, the communications ports of described valve, described micro chamber and/or the outlet of described micro chamber can be communicated with by pipeline.
Further, described fluid delivery module also comprises the 5th substrate that extends to head substrate from bottom substrate, the 5th substrate is vertical and crossing with two side substrates, and a side of the 5th substrate comprises described fluid space, is provided with gas device in the space of another side.
Further, described micro chamber comprises the portion of upper chamber of form going up working surface and forms the lower chambers portion of working surface down, portion of described upper chamber and described lower chambers portion can relatively move between the open position and that is loading and/or removing this semiconductor crystal wafer under the driving of a drive unit is handled the off-position of this semiconductor crystal wafer, when portion of upper chamber or described lower chambers portion were in the closed position, semiconductor crystal wafer was installed on described going up between working surface and the following working surface.
Compared with prior art, semiconductor processing device can reduce treatment fluid and the ultra-pure water consumption for the preparation of super clean wafer surface significantly among the present invention, reduces discharge of wastewater.In the fluid delivery module in the described semiconductor processing device enclosed fluid space is set in addition, not only can make things convenient for the connection of pipeline, also can be so that when taking place, situation such as leak of liquid or sprinkling prevent from handling diffuse fluid to other zones, and produce safety problem and other building block is damaged.
About other purposes of the present invention, feature and advantage are described in detail in embodiment below in conjunction with accompanying drawing.
[description of drawings]
In conjunction with reaching ensuing detailed description with reference to the accompanying drawings, the present invention will be more readily understood, the corresponding same structure member of same Reference numeral wherein, wherein:
Fig. 1 is the structural representation of the modularized semiconductor treatment facility among the present invention;
Fig. 2 is the fluid bearings module perspective view in one embodiment among Fig. 1;
Fig. 3 A is the fluid delivery module perspective view in one embodiment among Fig. 1
Fig. 3 B is the plane projection view of the fluid delivery module among Fig. 3 A;
Fig. 3 C is the fluid delivery module perspective view in another embodiment among Fig. 1;
Fig. 3 D is the plane projection view of the fluid delivery module among Fig. 3 C; With
Fig. 4 is the control module structured flowchart in one embodiment among Fig. 1.
[embodiment]
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Alleged herein " embodiment " or " embodiment " refers to that special characteristic, structure or the characteristic relevant with described embodiment can be contained at least one implementation of the present invention at least.Different local in this manual " in one embodiment " that occur also nonessentially all refer to same embodiment, must not be yet with other embodiment mutually exclusive separately or select embodiment." a plurality of ", " some " among the present invention represent two or more.Among the present invention " and/or " expression " with " or " or ".
Fig. 1 shows the structural representation of the modularized semiconductor treatment facility 1 among the present invention.As shown in Figure 1, described modularized semiconductor treatment facility 1 comprises semiconductor processes module 10, fluid delivery module 20, fluid bearings module 30 and control module 40.
Described semiconductor processes module 10 comprises that one is used for holding and handling the micro chamber of semiconductor crystal wafer, and described micro chamber comprises one or more for handling entrance and the one or more outlet of discharging described micro chamber for the processing fluid that fluid enters described micro chamber.Described micro chamber comprises the portion of upper chamber of form going up working surface and forms the lower chambers portion of working surface down, and portion of described upper chamber and described lower chambers portion can relatively move between the open position and that is loading and/or removing this semiconductor crystal wafer under the driving of a drive unit is used for holding the off-position of this semiconductor crystal wafer.When portion of upper chamber or described lower chambers portion were in the closed position, semiconductor crystal wafer was installed on described going up between working surface and the following working surface.Because adopt the structure of micro chamber, the volume of described semiconductor processes module 10 becomes very little.Therefore, needed treatment fluid and ultra-pure water consumption reduce significantly.
Described fluid bearings module 30 is used for the needed chemicals of the carrying described semiconductor crystal wafer of various processing, super clean water or other fluids (can be referred to as and not use fluid) and/or carries the fluid of use of handling described semiconductor crystal wafer, described fluid can be liquid, also can be gas.As shown in Figure 2, it shows an embodiment of described fluid bearings module 30, described fluid bearings module 30 comprises carriage 31 and is positioned over a plurality of containers 32 in the described carriage 31 that described container can hold for the treatment of the needed various various fluids that used that do not use fluid and/or handled described semiconductor crystal wafer of described semiconductor crystal wafer.Such as containing super clean water in the container, contain in another container and utilize super clean water to handle the waste liquid that obtains behind the described semiconductor crystal wafer.Certainly waste liquid also can directly be discharged by predetermined discharge line, and is not positioned in the container 32 of described fluid bearings module 30.In one embodiment, fluid can be by predetermined service real-time feed, and can arrange fluid bearings module 30 specially and carry various fluids this moment.
Described fluid delivery module 20 is connected with the entrance and exit of described micro chamber by pipeline, by the fluid communication in pipeline and the described fluid bearings module 30, it is used for the fluid bearings module 30 various fluids that do not use interior or that supplied with by the predetermined fluid service are urged to described micro chamber by the entrance of pipeline and described micro chamber.Described fluid is handled described semiconductor crystal wafer in described micro chamber, such as utilizing super clean water that described semiconductor crystal wafer is carried out surface clean, order about the described contaminated-fluid that used and send in the corresponding container or predetermined fluid discharge line in the described fluid bearings module 30 via the outlet of described micro chamber and pipeline owing to the delivery of pressure, gravity or gas afterwards.
Shown in Fig. 3 A and 3B, it shows an embodiment of described fluid delivery module 20, the head substrate 23 that described fluid delivery module 20 comprises carriage 21, be assembled in bottom substrate 22 on the described carriage 21, arrange at interval with described bottom substrate 22 and two are apart from one another by the side substrates 24 and 25 that arrange, a plurality of valves 26, and one or more pump 27.In this embodiment, two side substrates 24 and 25 be arranged in parallel, and described head substrate 23 and described bottom substrate 24 be arranged in parallel, and described bottom substrate 22 and two side substrates 24 and 25 intersect, described head substrate 23 and two side substrates 24 and 25 crossing.Described bottom substrate 22, described head substrate 23 and two side substrates 24 and 25 centre cross a fluid space 28.
One end of described valve 26 is provided with a plurality of communications ports 261, can optionally two communications ports 261 be communicated with according to the described valve 26 of external control.One end of described pump 27 is provided with the suction inlet 271 and the outlet 272 of discharging liquid that suck liquid.Each side substrate is provided with one or more installing holes (unmarked).The installing hole that the end that is provided with communications ports 261 of described valve 26 is passed on the described side substrate 24 extends in the described fluid space 28, the other end of described valve 26 includes electrical cable (not shown), and the electrical cable of described valve 26 is positioned at a side in the nonfluid space 28 of described side substrate 24.The installing hole that the end that is provided with suction inlet 271 and outlet 272 of described pump 27 is passed on the described side substrate 25 extends in the described fluid space 28, the other end of described pump 27 includes electrical cable (not shown), and the electrical cable of described pump 27 is positioned at a side in the nonfluid space 28 of described side substrate 25.
In use, can utilize pipeline that the outlet of the suction inlet 271 of described pump 27, the outlet 272 of described pump 27, the communications ports 261 of described valve 26, the entrance of described micro chamber, described micro chamber and/or the fluid of described fluid bearings module carrying 30 are communicated with.Like this, the fluid of described fluid bearings module carrying 30 can be delivered to described micro chamber by pipeline and/or described valve 26 under the driving of pump 27, the fluid that flows out from described micro chamber is delivered in described fluid bearings module carrying 30 or the predetermined fluid discharge line by pipeline and/or described valve 26.
Offer the under shed 221 that is communicated with described fluid space 28 at described bottom substrate 22, this under shed 221 pipeline for connection passes.For instance, if shown in each module 10,20,30 and 40 location diagram 1, the pipeline that passes from described under shed 221 will be communicated to described fluid bearings module 30 so.Offer the upper shed 231 that is communicated with described fluid space 28 at described head substrate 23, this upper shed 231 pipeline for connection passes.For instance, if shown in each module 10,20,30 and 40 location diagram 1, the pipeline that passes from described upper shed 231 will be communicated to the micro chamber of described semiconductor processes module 10 so.
Characteristic or the advantage of the fluid delivery module 20 among the present invention are: extend in the described fluid space 28 because described side substrate 25 is passed in the end that is provided with suction inlet 271 and outlet 272 of described pump 27, the end that is provided with communications ports 261 of described valve 26 is passed described side substrate 24 and is extended in the described fluid space 28, make the suction inlet 271 of described pump 27 and the communications ports 261 of outlet 272 and described valve 26 be oppositely arranged like this, thereby shorten the distance of the communications ports of the suction inlet of pump 27 and outlet and described valve 26 as much as possible, make things convenient for them to be communicated with by pipeline, space availability ratio is very high, feasible whole smaller volume.
Another characteristics or the advantage of the fluid delivery module 20 among the present invention are: the bottom substrate 22 of described fluid delivery module 20, head substrate 23 and two side substrates 24 and 25 have surrounded a comparatively fluid space 28 of sealing, the fluid that described fluid delivery module 20 transmits all passes through from this fluid space 28, if the situation that fluid leaks or sprays takes place, the fluid that leaks or spray all can be limited in the fluid space 28, damage and the destruction that can not be diffused into other zone and produce potential safety hazard and cause other parts, the fail safe that can improve equipment so to greatest extent.For instance, described liquid is generally acidity or akaline liquid, if do not set the fluid space of sealing, if situations such as leak of liquid take place, described acidity or akaline liquid corrode electrical cable and other parts of described valve or described pump possibly, thereby may bring out security incident or damage equipment.
Refer again to shown in Fig. 3 A and the 3B, described fluid delivery module 20 comprises that also the 5th substrate 29, the five substrates 29 that extend to head substrate 23 from bottom substrate 22 and described side substrate 24 are vertical with 25 and intersects.One side of the 5th substrate 29 comprises described fluid space 28, is provided with gas device such as air valve and barometer in the space of another side.In the container of described fluid bearings module 30 or predetermined gas service gas supplied can be transported to the micro chamber of described semiconductor processes module 10 by described air valve and pipeline, the gas that the micro chamber of described semiconductor processes module 10 is discharged can be expelled in the container of described fluid bearings module 30 or the predetermined gas discharge line by pipeline and described air valve.Described barometer can detect the air pressure of micro chamber.Like this, described the 5th substrate 29 can and comprise that air valve and the barometrical gas compartment separate with described fluid space 28, can not have influence on the equipment of gas zone like this when leak of liquid occurring, thereby further improve fail safe.Described air valve also includes electrical cable.
Shown in Fig. 3 C and 3D, it shows another embodiment of described fluid delivery module 20.For the internal structure in more can clear and definite described fluid delivery module 20, in Fig. 3 C and not shown described head substrate 23.Fluid delivery module among Fig. 3 C and Fig. 3 D is identical with the most of structure among Fig. 3 A and Fig. 3 B, difference is: what install on the side substrate 25 of the fluid delivery module shown in Fig. 3 C is not pump, and or valve 26, the installing hole that the end that is provided with communications ports 261 of described valve 26 is passed on the described side substrate 25 extends in the described fluid space 28.That is to say, in this embodiment, on two side substrates 24 and 25 described valve 26 is set all, this moment, fluid can be by the real-time feed of predetermined fluid service, be transported to described micro chamber via described valve 26, and be fed to the predetermined fluid discharge line from described micro chamber via described valve 26.
Described control module 40 be used for semiconductor processes module 10 in electrical cable (not shown), the electrical cable of described valve 26, the electrical cable of described pump 27 and/or the electrical cable of air valve of drive unit electrically connect, thereby can realize drive unit, valve 26, pump 27 and/or air valve are controlled.It shows an embodiment of described control module 40 Fig. 4, and described control module 40 comprises valve positioner 41, driving governor 42, pump controller 43 and air valve controller 44.Described valve positioner 41 can be controlled each valve 26 in the described fluid delivery module 20, whether is communicated with which communications ports and which communications ports connection etc. such as each valve 26.Drive unit in the described semiconductor processes module 10 of described driving governor 42 controls, make that such as controlling described drive unit micro chamber is shown in an open position up and down, can load and/or remove this semiconductor crystal wafer this moment, also can control described drive unit and make that micro chamber is in the closed position up and down.Pumps 27 in the described fluid delivery modules 20 of 43 pairs of described pump controllers are controlled, and such as opening or closing, various parameters for another example are such as hydraulic pressure, rotating speed etc.The air valves that can also control in the described fluid delivery modules 20 of 44 pairs of described air valve controllers are controlled, and such as opening or closing, control various parameters for another example, such as air pressure etc.Described control module 40 can also comprise monitoring unit, described monitoring unit is according to monitoring in real time from the transducer in the semiconductor processes module 10 or the induced signal that is arranged at the transducer of other positions, for example: report to the police when leak sensor has detected leak of liquid or remind.
In common application, described semiconductor processes module 10 is communicated with described fluid delivery module 20 by pipeline, described fluid delivery module 20 is communicated with fluid in the described fluid bearings module 30 by pipeline, described control module 40 is electrical connected by the drive unit in electrical cable and the described semiconductor processes module 10, pump, valve, the air valve in the described fluid delivery module 20, the annexation of each module is very simple, assembles and change very convenient.In one embodiment, each module can put together each module according to position relation shown in Figure 1, described fluid bearings module 30 is positioned over bottommost, described fluid delivery module 20 is positioned over the top of described fluid bearings module 30, described semiconductor processes module 10 is positioned over the top of described fluid delivery module 20, and described control module 40 is positioned over the side of described fluid delivery module 20 and described fluid bearings module 30.In other embodiments, the position that can carry out adjusting between each module the position to each module as required concerns.
With respect to the existing semiconductor processing equipment of bulky complex, the semiconductor processing device among the present invention has following advantage: 1, volume is little, and structure is simple relatively, and 2, easy care and easy-maintaining; 3, treatment fluid and ultra-pure water consumption are very low; 4, in the described fluid delivery module enclosed fluid space is set, not only can make things convenient for the connection of pipeline, also can be so that when situations such as generation leak of liquid or sprinkling, prevent from handling diffuse fluid to other zones, produce safety problem and other building block is damaged, device security is higher.
Above-mentioned explanation has fully disclosed the specific embodiment of the present invention.It is pointed out that and be familiar with the scope that any change that the person skilled in art does the specific embodiment of the present invention does not all break away from claims of the present invention.Correspondingly, the scope of claim of the present invention also is not limited only to previous embodiment.
Claims (10)
1. a semiconductor processing equipment is characterized in that, it comprises semiconductor processes module and fluid delivery module,
Described semiconductor processes module comprises that one is used for holding and handling the micro chamber of semiconductor crystal wafer, and described micro chamber comprises one or more entrance and one or more outlets that supply fluid to discharge described micro chamber that supply fluid to enter described micro chamber,
Described fluid delivery module is used for the various fluids that do not use are delivered to described micro chamber by pipeline and described micro chamber entrance, described fluid delivery module comprises carriage, be assembled in a plurality of substrates and valve on the described carriage, described a plurality of substrate crosses a fluid space, one or more substrate is provided with installing hole, and the installing hole that the end that is provided with communications ports of described valve is passed on the described substrate extends in the described fluid space.
2. semiconductor processing equipment according to claim 1, it is characterized in that, be assembled in that a plurality of substrates on the described carriage comprise bottom substrate, the head substrate that arranges at interval with described bottom substrate and two are apart from one another by the side substrates that arrange, described side substrate is provided with installing hole.
3. semiconductor processing equipment according to claim 2 is characterized in that, two side substrates be arranged in parallel, and described head substrate and described bottom substrate be arranged in parallel.
4. semiconductor processing equipment according to claim 2 is characterized in that, offers the under shed that is communicated with described fluid space at described bottom substrate, and this under shed pipeline for connection passes.
5. semiconductor processing equipment according to claim 2 is characterized in that, offers the upper shed that is communicated with described fluid space at described head substrate, and this upper shed pipeline for connection passes.
6. semiconductor processing equipment according to claim 2 is characterized in that, is installed on a plurality of valves on each side substrate.
7. semiconductor processing equipment according to claim 2, it is characterized in that, described fluid delivery module also includes pump, the installing hole that the suction inlet that sucks liquid and the end of discharging the outlet of liquid pass on one of them side substrate that is provided with of described pump extends in the described fluid space, and the installing hole that the end that is provided with communications ports of described valve is passed on wherein another side substrate extends in the described fluid space.
8. semiconductor processing equipment according to claim 7 is characterized in that, the entrance of the outlet of described pump intake, described pump, the communications ports of described valve, described micro chamber and/or the outlet of described micro chamber can be communicated with by pipeline.
9. semiconductor processing equipment according to claim 2, it is characterized in that, described fluid delivery module also comprises the 5th substrate that extends to head substrate from bottom substrate, the 5th substrate is vertical and crossing with two side substrates, one side of the 5th substrate comprises described fluid space, is provided with gas device in the space of another side.
10. semiconductor processing equipment according to claim 1, it is characterized in that, described micro chamber comprises the portion of upper chamber of form going up working surface and forms the lower chambers portion of working surface down, portion of described upper chamber and described lower chambers portion can relatively move between the open position and that is loading and/or removing this semiconductor crystal wafer under the driving of a drive unit is handled the off-position of this semiconductor crystal wafer, when portion of upper chamber or described lower chambers portion were in the closed position, semiconductor crystal wafer was installed on described going up between working surface and the following working surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110451921.6A CN103187240B (en) | 2011-12-30 | 2011-12-30 | Semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110451921.6A CN103187240B (en) | 2011-12-30 | 2011-12-30 | Semiconductor processing equipment |
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| Publication Number | Publication Date |
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| CN103187240A true CN103187240A (en) | 2013-07-03 |
| CN103187240B CN103187240B (en) | 2016-06-01 |
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| CN201110451921.6A Active CN103187240B (en) | 2011-12-30 | 2011-12-30 | Semiconductor processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103837185A (en) * | 2014-03-10 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Test instrument mounting support |
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|---|---|---|---|---|
| CN1806312A (en) * | 2003-06-13 | 2006-07-19 | 温子瑛 | Method and apparatus for thin-layer chemical processing of semiconductor wafers |
| CN1985026A (en) * | 2003-04-18 | 2007-06-20 | 应用材料有限公司 | Multi-chemistry plating system |
| CN101663736A (en) * | 2007-04-16 | 2010-03-03 | 朗姆研究公司 | Fluid handling system for wafer electroless plating and associated methods |
| CN202423231U (en) * | 2011-12-30 | 2012-09-05 | 无锡华瑛微电子技术有限公司 | Semiconductor processing equipment |
-
2011
- 2011-12-30 CN CN201110451921.6A patent/CN103187240B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1985026A (en) * | 2003-04-18 | 2007-06-20 | 应用材料有限公司 | Multi-chemistry plating system |
| CN1806312A (en) * | 2003-06-13 | 2006-07-19 | 温子瑛 | Method and apparatus for thin-layer chemical processing of semiconductor wafers |
| CN101663736A (en) * | 2007-04-16 | 2010-03-03 | 朗姆研究公司 | Fluid handling system for wafer electroless plating and associated methods |
| CN202423231U (en) * | 2011-12-30 | 2012-09-05 | 无锡华瑛微电子技术有限公司 | Semiconductor processing equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103837185A (en) * | 2014-03-10 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Test instrument mounting support |
| CN103837185B (en) * | 2014-03-10 | 2016-08-24 | 上海华虹宏力半导体制造有限公司 | Test instrunment mounting bracket |
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| CN103187240B (en) | 2016-06-01 |
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