CN103160889A - Preplating copper electroplating solution - Google Patents
Preplating copper electroplating solution Download PDFInfo
- Publication number
- CN103160889A CN103160889A CN 201110423949 CN201110423949A CN103160889A CN 103160889 A CN103160889 A CN 103160889A CN 201110423949 CN201110423949 CN 201110423949 CN 201110423949 A CN201110423949 A CN 201110423949A CN 103160889 A CN103160889 A CN 103160889A
- Authority
- CN
- China
- Prior art keywords
- electroplating solution
- copper electroplating
- preplating copper
- copper facing
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 16
- 239000010949 copper Substances 0.000 title claims abstract description 16
- 238000009713 electroplating Methods 0.000 title claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 238000005282 brightening Methods 0.000 claims abstract description 7
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 3
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 claims description 3
- 235000011006 sodium potassium tartrate Nutrition 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000011230 binding agent Substances 0.000 abstract 2
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- VZOPRCCTKLAGPN-ZFJVMAEJSA-L potassium;sodium;(2r,3r)-2,3-dihydroxybutanedioate;tetrahydrate Chemical compound O.O.O.O.[Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O VZOPRCCTKLAGPN-ZFJVMAEJSA-L 0.000 abstract 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 abstract 1
- 229940074446 sodium potassium tartrate tetrahydrate Drugs 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 4
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- 238000004065 wastewater treatment Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000000796 flavoring agent Substances 0.000 description 1
- 235000019634 flavors Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a preplating copper electroplating solution which is characterized by comprising the components, by weight, of CuCN 20%-30%, NaCN 25%-40%, sodium potassium tartrate tetrahydrate 20%-30%, brightening agents 1%-1.5%, and binding agents 0.5%-1%. The brightening agents are SNR-5A, and the binding agents are propargyl alcohol. The preplating copper electroplating solution is reasonable in formula, does not have harmful gases separated out in the production, and is environment-friendly through adoption of a cyanide-free formula, and stable in performance.
Description
Technical field
The invention belongs to fine chemical technology field, metallic surface, be specifically related to a kind of pre-copper facing electroplating solution.
Background technology
Metalwork needs pre-copper facing to improve bonding strength and the surface smoothness of copper plate before copper facing, and pre-copper plating solution directly affects the quality and performance of product, present pre-copper plating solution poor stability wastewater treatment difficulty.
Summary of the invention
The object of the present invention is to provide a kind of formula reasonable, the simple environmental protection of wastewater treatment, the pre-copper facing electroplating solution that plating solution performance is stable.
Technical solution of the present invention is:
A kind of pre-copper facing electroplating solution is characterized in that each composition is by weight percentage: CuCN20-30%, NaCN25-40%, Na
2CO
315-25%, Seignette salt 20-30%, brightening agent 1-1.5%, wedding agent 0.5-1%.
Described brightening agent is: SNR-5A, wedding agent is: propargyl alcohol.
The present invention fills a prescription rationally, separates out without obnoxious flavour in production, adopts without the environment friendly and pollution-free stable performance of cyanogen formula.
Embodiment:
Embodiment 1
Be used for the pre-copper facing electroplating solution of electronic pure aluminum steel, each composition is by weight percentage: CuCN20-30%, NaCN25-40%, Na
2CO
315-25%, Seignette salt 20-30%, brightening agent 1-1.5%, wedding agent 0.5-1%.Processing condition are: the copper plating bath temperature is controlled at 50-60 ° of C, current density 1.5-2A/dm2, time 30S.
Claims (2)
1. a pre-copper facing electroplating solution, is characterized in that each composition is by weight percentage: CuCN20-30%, NaCN25-40%, Na
2CO
315-25%, Seignette salt 20-30%, brightening agent 1-1.5%, wedding agent 0.5-1%.
2. a kind of pre-copper facing electroplating solution according to claim 1, it is characterized in that described brightening agent is: SNR-5A, wedding agent is: propargyl alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423949 CN103160889A (en) | 2011-12-19 | 2011-12-19 | Preplating copper electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110423949 CN103160889A (en) | 2011-12-19 | 2011-12-19 | Preplating copper electroplating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103160889A true CN103160889A (en) | 2013-06-19 |
Family
ID=48584409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110423949 Pending CN103160889A (en) | 2011-12-19 | 2011-12-19 | Preplating copper electroplating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103160889A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103882486A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Archaistic bronze electroplating solution as well as preparation method and application thereof |
-
2011
- 2011-12-19 CN CN 201110423949 patent/CN103160889A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103882486A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Archaistic bronze electroplating solution as well as preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C05 | Deemed withdrawal (patent law before 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130619 |