CN103160211A - Solar crystalline silicon rod splicing glue and preparation method thereof - Google Patents
Solar crystalline silicon rod splicing glue and preparation method thereof Download PDFInfo
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- CN103160211A CN103160211A CN2011104271884A CN201110427188A CN103160211A CN 103160211 A CN103160211 A CN 103160211A CN 2011104271884 A CN2011104271884 A CN 2011104271884A CN 201110427188 A CN201110427188 A CN 201110427188A CN 103160211 A CN103160211 A CN 103160211A
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- 239000003292 glue Substances 0.000 title claims abstract description 48
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 238000003756 stirring Methods 0.000 claims description 28
- 238000002156 mixing Methods 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 12
- 239000007822 coupling agent Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-dioxonaphthalene Natural products C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 claims description 7
- -1 organic acid salt Chemical class 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 6
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 claims description 5
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 4
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 3
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 3
- OEOIWYCWCDBOPA-UHFFFAOYSA-N 6-methyl-heptanoic acid Chemical compound CC(C)CCCCC(O)=O OEOIWYCWCDBOPA-UHFFFAOYSA-N 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 claims description 2
- 230000002829 reductive effect Effects 0.000 claims 6
- 108010010803 Gelatin Proteins 0.000 claims 4
- 229920000159 gelatin Polymers 0.000 claims 4
- 239000008273 gelatin Substances 0.000 claims 4
- 235000019322 gelatine Nutrition 0.000 claims 4
- 235000011852 gelatine desserts Nutrition 0.000 claims 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 2
- 125000000182 1,4-naphthoquinonyl group Chemical group C1(C(=CC(C2=CC=CC=C12)=O)*)=O 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 239000004258 Ethoxyquin Substances 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- NWFNSTOSIVLCJA-UHFFFAOYSA-L copper;diacetate;hydrate Chemical compound O.[Cu+2].CC([O-])=O.CC([O-])=O NWFNSTOSIVLCJA-UHFFFAOYSA-L 0.000 claims 1
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- DECIPOUIJURFOJ-UHFFFAOYSA-N ethoxyquin Chemical compound N1C(C)(C)C=C(C)C2=CC(OCC)=CC=C21 DECIPOUIJURFOJ-UHFFFAOYSA-N 0.000 claims 1
- 229940093500 ethoxyquin Drugs 0.000 claims 1
- 235000019285 ethoxyquin Nutrition 0.000 claims 1
- VLCAYQIMSMPEBW-UHFFFAOYSA-N methyl 3-hydroxy-2-methylidenebutanoate Chemical compound COC(=O)C(=C)C(C)O VLCAYQIMSMPEBW-UHFFFAOYSA-N 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 229960004418 trolamine Drugs 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 abstract description 20
- 239000010703 silicon Substances 0.000 abstract description 20
- 239000000853 adhesive Substances 0.000 abstract description 19
- 230000001070 adhesive effect Effects 0.000 abstract description 19
- 239000013078 crystal Substances 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 9
- 238000003860 storage Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 6
- 238000005520 cutting process Methods 0.000 abstract description 4
- 210000001503 joint Anatomy 0.000 abstract description 3
- 238000012360 testing method Methods 0.000 description 21
- 239000003822 epoxy resin Substances 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 4
- 238000007599 discharging Methods 0.000 description 4
- 229940081974 saccharin Drugs 0.000 description 4
- 235000019204 saccharin Nutrition 0.000 description 4
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 4
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 3
- 239000003085 diluting agent Substances 0.000 description 3
- 239000003112 inhibitor Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- ZKXWKVVCCTZOLD-UHFFFAOYSA-N copper;4-hydroxypent-3-en-2-one Chemical compound [Cu].CC(O)=CC(C)=O.CC(O)=CC(C)=O ZKXWKVVCCTZOLD-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 206010067484 Adverse reaction Diseases 0.000 description 1
- GZTBKEOTCAVWNJ-UHFFFAOYSA-L C(C)O.C(C)(=O)[O-].[Cu+2].C(C)(=O)[O-] Chemical compound C(C)O.C(C)(=O)[O-].[Cu+2].C(C)(=O)[O-] GZTBKEOTCAVWNJ-UHFFFAOYSA-L 0.000 description 1
- GUUFUSNFDFBVIQ-UHFFFAOYSA-N CCC[Si](OC)(OC)OCCC1CO1 Chemical group CCC[Si](OC)(OC)OCCC1CO1 GUUFUSNFDFBVIQ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 206010020751 Hypersensitivity Diseases 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000006838 adverse reaction Effects 0.000 description 1
- 230000007815 allergy Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- IRFJEJVSVPRPDV-UHFFFAOYSA-N ethanol 6-methylheptanoic acid Chemical compound C(C)O.C(CCCCC(C)C)(=O)O IRFJEJVSVPRPDV-UHFFFAOYSA-N 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明涉及一种太阳能晶硅棒拼接胶及其制备方法,由厌氧胶液和促进剂组成,所述制备方法为分别制备厌氧胶液、促进剂,使用时,将被粘晶硅棒的表面涂敷促进剂,晾干,再涂厌氧胶液,对接即迅速粘合。本发明太阳能晶硅棒拼接胶在保证晶片切割过程中有足够强度和韧性的前提下,具有定位时间快、操作方便、耐化学介质性能好、储存稳定性好的特点,将成为行业用胶黏剂的首选。The invention relates to a splicing adhesive for solar crystal silicon rods and a preparation method thereof, which is composed of anaerobic glue and an accelerator. The preparation method is to prepare the anaerobic glue and the accelerator respectively. Coat the accelerator on the surface, dry it, and then apply anaerobic glue, and the butt joint will be bonded quickly. On the premise of ensuring sufficient strength and toughness in the process of wafer cutting, the splicing adhesive for solar crystal silicon rods of the present invention has the characteristics of fast positioning time, convenient operation, good resistance to chemical media, and good storage stability, and will become an adhesive for industrial use. agent of choice.
Description
技术领域 technical field
本发明涉及一种太阳能晶硅棒拼接胶及其制备方法。The invention relates to a splicing adhesive for solar crystal silicon rods and a preparation method thereof.
背景技术 Background technique
近年来,中国太阳能光伏产业发展迅猛,成为新兴产业中为数不多的具有较强国际竞争力的产业,其根本原因在于中国光伏企业坚持技术研发和成本控制,以提高核心竞争力,使世界光伏产业的重心逐渐向中国转移。光伏产业太阳能电池的生产工艺流程一般为:铸锭→切方→切片→组件→组装。In recent years, China's solar photovoltaic industry has developed rapidly and has become one of the few emerging industries with strong international competitiveness. The center of gravity of the industry is gradually shifting to China. The production process of solar cells in the photovoltaic industry is generally: ingot casting → square cutting → slicing → module → assembly.
目前,太阳能晶硅棒拼接胶普遍采用双组分环氧树脂胶。环氧树脂胶具有粘接强度高的优点,但同时具有许多显著的缺点,具体表现为:硅棒固化定位时间长,影响生产节骤,即使采用快速固化剂也难以满足节骤要求;环氧树脂胺类固化剂有毒,对操作环境污染较大,操作工人常发生刺激过敏等不良反应;在水性/油性切削液环境中粘接强度和模量衰减下降较大;操作麻烦,甲乙组分配比严格,混合必须均匀;对温度和湿度敏感,储存稳定性差,在长久储存条件下容易出现表面结皮变质现象,严重时甚至出现掉片或掉棒的严重事故。At present, two-component epoxy resin glue is generally used for the splicing glue of solar crystal silicon rods. Epoxy resin glue has the advantage of high bonding strength, but at the same time has many significant disadvantages, specifically: the curing and positioning of silicon rods takes a long time, which affects the production process, and it is difficult to meet the process requirements even if a fast curing agent is used; Resin amine curing agent is poisonous, which pollutes the operating environment greatly, and operators often have adverse reactions such as irritation and allergies; the bonding strength and modulus attenuation decrease greatly in the water-based/oily cutting fluid environment; the operation is troublesome, and the ratio of group A and B Strict, the mixing must be uniform; sensitive to temperature and humidity, poor storage stability, prone to surface crust deterioration under long-term storage conditions, and even serious accidents of chip or rod drop in severe cases.
发明内容 Contents of the invention
为了解决现有技术中所用环氧树脂拼棒胶所存在的定位时间长、强度低,冲击韧性差、操作麻烦、环境湿气敏感、储存稳定性差等缺点,本发明提供了一种太阳能晶硅棒拼接胶,其具有操作方便、定位时间快、粘接强度高、抗冲击韧性佳、耐化学介质性好、储存稳定性好等优点,给拼棒胶性能带来极大的改善。In order to solve the shortcomings of the epoxy resin stick glue used in the prior art, such as long positioning time, low strength, poor impact toughness, troublesome operation, sensitive environment moisture, and poor storage stability, the invention provides a solar crystal silicon Stick splicing glue, which has the advantages of convenient operation, fast positioning time, high bonding strength, good impact toughness, good chemical resistance, and good storage stability, which greatly improves the performance of stick glue.
本发明解决上述技术问题的技术方案如下:一种太阳能晶硅棒拼接胶,由厌氧胶液和促进剂组成,The technical scheme of the present invention to solve the above-mentioned technical problems is as follows: a solar crystalline silicon rod splicing glue, which is composed of anaerobic glue and accelerator,
其中,所述厌氧胶液由以下重量份数的各原料组成:稀释剂10~30份,齐聚物20~80份,偶联剂1~5份,氧化剂1~5份,还原剂0.2~0.8份,助还原剂0.1~0.5份,阻聚剂0.01~0.03份;所述表面促进剂由以下重量份数的各原料组成:金属有机酸盐0.1~1份,溶剂90~99.9份。Wherein, the anaerobic glue is composed of the following raw materials in parts by weight: 10 to 30 parts of diluent, 20 to 80 parts of oligomer, 1 to 5 parts of coupling agent, 1 to 5 parts of oxidizing agent, and 0.2 parts of reducing agent. -0.8 parts, 0.1-0.5 parts of co-reducing agent, 0.01-0.03 parts of polymerization inhibitor; the surface accelerator is composed of the following raw materials in parts by weight: 0.1-1 part of metal organic acid salt, and 90-99.9 parts of solvent.
本发明的有益效果是:本发明针对太阳能晶硅棒拼接专用胶工艺及性能要求,以特定成分的厌氧胶复合单体为主体成分,再配以相应的增强剂、氧化剂、还原剂、阻聚剂等助剂,成为硅棒拼接专用厌氧胶。再通过在表面促进剂的组份里添加金属有机酸盐,摈弃传统的丙酮、氯仿等有毒溶剂,采用无毒的无水乙醇作溶剂,以此缩短胶粘剂固化物定位时间,提高储存稳定性、粘接强度、冲击韧性,改善工艺操作性和耐化学介质性,降低环境的湿气敏感度;并对本发明厌氧胶粘剂和传统的环氧树脂胶黏剂的性能对比测试进行评价。The beneficial effects of the present invention are: the present invention is aimed at the process and performance requirements of the special glue for splicing solar crystal silicon rods. Auxiliaries such as polymerizing agents become special anaerobic adhesives for splicing silicon rods. By adding metal organic acid salts to the surface accelerator components, the traditional toxic solvents such as acetone and chloroform are discarded, and non-toxic absolute ethanol is used as the solvent to shorten the positioning time of the cured adhesive and improve storage stability. Adhesive strength, impact toughness, improve process operability and chemical medium resistance, reduce environmental moisture sensitivity; and evaluate the performance comparison test of the anaerobic adhesive of the present invention and the traditional epoxy resin adhesive.
在上述技术方案的基础上,本发明还可以做如下改进。On the basis of the above technical solutions, the present invention can also be improved as follows.
进一步,所述稀释剂为三缩四乙二醇多丙烯酸酯、甲基丙烯酸羟乙酯、2-苯氧基乙基丙烯酸酯中的一种或几种的混合。Further, the diluent is one or a mixture of tetraethylene glycol polyacrylate, hydroxyethyl methacrylate, and 2-phenoxyethyl acrylate.
进一步,所述齐聚物为乙氧化双酚A二甲基丙烯酸酯(优选市售长兴化学公司BPA2EODMA型号)、双酚A环氧丙烯酸酯、聚氨酯双酯中的一种或几种的混合。Further, the oligomer is one or a mixture of ethoxylated bisphenol A dimethacrylate (preferably the commercially available BPA2EODMA model of Changxing Chemical Company), bisphenol A epoxy acrylate, and polyurethane diester.
进一步,所述氧化剂为过氧化苯甲酰、异丙苯过氧化氢、过氧化苯甲酸叔丁酯中的一种或几种的混合。Further, the oxidizing agent is one or more of benzoyl peroxide, cumene hydroperoxide, and tert-butyl peroxybenzoate.
进一步,所述还原剂为三乙胺、N,N-二甲基苯胺、三乙醇胺中的一种或几种的混合;所述助还原剂为不溶性糖精。Further, the reducing agent is one or a combination of triethylamine, N,N-dimethylaniline, and triethanolamine; the co-reducing agent is insoluble saccharin.
进一步,所述阻聚剂为1,4-萘醌、对苯二酚、对苯醌中的一种或几种的混合。Further, the polymerization inhibitor is one or a mixture of 1,4-naphthoquinone, hydroquinone and p-benzoquinone.
进一步,所述偶联剂为(2,3-环氧丙基)丙基三甲氧基硅烷A-187。Further, the coupling agent is (2,3-epoxypropyl)propyltrimethoxysilane A-187.
进一步,所述表面促进剂为二茂铁乙醇溶液、醋酸铜乙醇溶液、异辛酸铜乙醇溶液、乙酰丙酮铜乙醇溶液中的一种或几种的混合。Further, the surface accelerator is one or a combination of ferrocene ethanol solution, copper acetate ethanol solution, copper isooctanoate ethanol solution, and copper acetylacetonate ethanol solution.
本发明解决上述技术问题的技术方案如下:一种太阳能晶硅棒拼接胶的制备方法,包括以下步骤:The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a method for preparing solar crystalline silicon rod splicing glue, comprising the following steps:
(1)分别制备厌氧胶液和表面促进剂:(1) Prepare anaerobic glue and surface accelerator respectively:
1)将重量份数为20~80份的齐聚物、10~30份的稀释剂、0.01~0.03份的阻聚剂加入搅拌机内混合均匀,再加入重量份数为0.2~0.8份的还原剂、0.1~0.5份的助还原剂,先加热,再搅拌,然后冷却降至室温,再加入重量份数为1~5份的偶联剂,再次搅拌,然后再进行抽真空,即得所述太阳能晶硅棒拼接胶的厌氧胶液;1) Add 20-80 parts by weight of oligomer, 10-30 parts of diluent, and 0.01-0.03 parts of polymerization inhibitor into the mixer and mix evenly, then add 0.2-0.8 parts by weight of reducing agent, 0.1-0.5 parts of co-reducing agent, heating first, then stirring, then cooling down to room temperature, then adding 1-5 parts by weight of coupling agent, stirring again, and then vacuumizing to obtain the obtained The anaerobic glue of the splicing glue for solar crystalline silicon rods;
2)将重量份数为0.1~1份的金属有机酸粉末,90~99.9份的溶剂,加入搅拌机内进行搅拌,至混合均匀,即得所述太阳能晶硅棒拼接胶的表面促进剂。2) Add 0.1-1 part by weight of metal-organic acid powder and 90-99.9 parts of solvent into a mixer and stir until the mixture is uniform, and the surface accelerator for the solar crystal silicon rod splicing glue is obtained.
(2)使用时,将被粘晶硅棒的表面涂敷表面促进剂,晾干,再涂厌氧胶液,对接即迅速粘合。10秒左右即可定位,固化后进行晶片切割。(2) When in use, the surface of the silicon rod to be bonded is coated with a surface accelerator, dried, and then coated with anaerobic glue, and the butt joint is quickly bonded. It can be positioned in about 10 seconds, and the wafer can be cut after curing.
在上述技术方案的基础上,本发明还可以做如下改进。On the basis of the above technical solutions, the present invention can also be improved as follows.
进一步,在步骤1)中,所述加热后的温度为40~60℃。Further, in step 1), the temperature after the heating is 40-60°C.
进一步,在步骤1)中,所述搅拌的工艺条件为:在自转速度为500~1000转/分钟,公转速度为5~8转/分钟的条件下,搅拌0.3~1小时。Further, in step 1), the stirring process conditions are: stirring for 0.3-1 hour under the conditions of rotation speed of 500-1000 rpm and revolution speed of 5-8 rpm.
进一步,在步骤1)中,所述再次搅拌的时间为0.5~1.5小时;所述抽真空的工艺条件为:抽真空5~15分钟,使真空度至-0.1~-0.08MPa。Further, in step 1), the time for stirring again is 0.5 to 1.5 hours; the process conditions for vacuuming are: vacuuming for 5 to 15 minutes to make the vacuum degree to -0.1 to -0.08 MPa.
进一步,在步骤2)中,所述搅拌的工艺条件为:在自转速度为200~500转/分钟,公转速度为5~8转/分钟的条件下,搅拌0.2~1小时。Further, in step 2), the stirring process conditions are as follows: stirring for 0.2-1 hour under the condition that the rotation speed is 200-500 revolutions/minute and the revolution speed is 5-8 revolutions/minute.
本发明的有益效果是:本发明太阳能晶硅棒拼接胶在保证晶片切割加工过程中有足够的强度避免质量事故的前提下,相比传统环氧树脂胶而言,可明显提高工件定位时间、提高粘接强度和抗冲击韧性,改善储存稳定性、工艺操作性和耐化学介质性,降低环境的湿气敏感度。The beneficial effects of the present invention are: the solar crystalline silicon rod splicing glue of the present invention can significantly improve the workpiece positioning time, Improve bonding strength and impact toughness, improve storage stability, process operability and resistance to chemical media, and reduce environmental moisture sensitivity.
具体实施方式 Detailed ways
以下对本发明的原理和特征进行描述,所举实例只用于解释本发明,并非用于限定本发明的范围。The principles and features of the present invention are described below, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.
实施例1Example 1
准确称取如下各种原料:乙氧化双酚A二甲基丙烯酸酯67份、三缩四乙二醇多丙烯酸酯15份、1,4-萘醌0.02份加入双行星动力混合搅拌机内混合均匀,再加入N,N-二甲基苯胺0.5份、糖精0.3份,升温至40℃,在所述双行星动力混合搅拌机自转速度为500转/分钟,公转速度为8转/分钟的条件下,机械搅拌0.5小时使完全溶解,随后快速冷却降至室温,加入过氧化苯甲酰3份,再加入A-187偶联剂2份,搅拌1小时均匀后,抽真空10分钟,真空度至-0.1MPa。出料,即得到本发明太阳能晶硅棒拼接的厌氧胶液,包装放置待用。Accurately weigh the following raw materials: 67 parts of ethoxylated bisphenol A dimethacrylate, 15 parts of tetraethylene glycol polyacrylate, and 0.02 parts of 1,4-naphthoquinone, add them into a double planetary power mixing mixer and mix evenly , then add 0.5 parts of N,N-dimethylaniline and 0.3 parts of saccharin, and heat up to 40°C. Under the condition that the rotation speed of the double planetary power mixer is 500 rpm and the revolution speed is 8 rpm, Mechanically stir for 0.5 hours to completely dissolve, then quickly cool down to room temperature, add 3 parts of benzoyl peroxide, and then add 2 parts of A-187 coupling agent, stir for 1 hour, then vacuum for 10 minutes, and the vacuum degree reaches - 0.1 MPa. After discharging, the anaerobic glue solution for splicing solar crystal silicon rods of the present invention is obtained, which is packaged and placed for use.
准确称取表面促进剂各组分如下:将重量为0.2份异辛酸铜粉末,无水乙醇99.8份溶剂,加入双行星动力混合搅拌机内混合,在所述双行星动力混合搅拌机自转速度为300转/分钟,公转速度为5转/分钟的条件下,机械搅拌0.5小时,出料,即得到本发明太阳能晶硅棒拼接胶的促进剂,包装放置待用。Accurately weigh the components of the surface accelerator as follows: add 0.2 parts of copper isooctanoate powder by weight and 99.8 parts of absolute ethanol as a solvent, and add them to a double planetary power mixer for mixing, and the rotation speed of the double planetary power mixer is 300 rpm /min, under the condition that the revolution speed is 5 revs/min, mechanically stir for 0.5 hour, discharge, promptly obtain the accelerant of splicing glue of solar crystal silicon rod of the present invention, pack and place for use.
实施例2Example 2
准确称取如下各种原料:双酚A环氧丙烯酸酯60份、乙氧化双酚A二甲基丙烯酸酯20份、甲基丙烯酸羟乙酯10份、对苯二酚0.02份加入双行星动力混合搅拌机内混合均匀,再加入三乙胺0.2份、糖精0.1份,升温至60℃,在所述双行星动力混合搅拌机自转速度为500转/分钟,公转速度为8转/分钟的条件下,机械搅拌0.5小时使完全溶解,随后快速冷却降至室温,加入异丙苯过氧化氢2份,再加入A-187偶联剂1份,搅拌1小时均匀后,抽真空10分钟,真空度至-0.08MPa。出料,即得到本发明太阳能晶硅棒拼接的厌氧胶液,包装放置待用。Accurately weigh the following raw materials: 60 parts of bisphenol A epoxy acrylate, 20 parts of ethoxylated bisphenol A dimethacrylate, 10 parts of hydroxyethyl methacrylate, 0.02 parts of hydroquinone and add double planetary power Mix evenly in the mixing mixer, then add 0.2 parts of triethylamine and 0.1 parts of saccharin, heat up to 60°C, under the condition that the rotation speed of the double planetary power mixing mixer is 500 rpm and the revolution speed is 8 rpm, Mechanically stir for 0.5 hours to completely dissolve, then quickly cool down to room temperature, add 2 parts of cumene hydroperoxide, and then add 1 part of A-187 coupling agent, stir for 1 hour, then vacuumize for 10 minutes, and the vacuum degree reaches -0.08MPa. After discharging, the anaerobic glue solution for splicing solar crystal silicon rods of the present invention is obtained, which is packaged and placed for use.
准确称取表面促进剂各组分如下:将重量为0.8份丁基二茂铁,无水乙醇99.2份溶剂,加入双行星动力混合搅拌机内混合,在所述双行星动力混合搅拌机自转速度为300转/分钟,公转速度为5转/分钟的条件下,机械搅拌0.5小时,出料,即得到本发明太阳能晶硅棒拼接胶的促进剂,包装放置待用。Accurately weigh the components of the surface accelerator as follows: add 0.8 parts of butyl ferrocene and 99.2 parts of absolute ethanol as a solvent and mix them in a double planetary power mixer, and the rotation speed of the double planetary power mixer is 300 revolutions per minute, under the condition of a revolution speed of 5 revolutions per minute, mechanically stirred for 0.5 hours, and discharged to obtain the accelerant for splicing glue for solar crystalline silicon rods of the present invention, which is packaged and placed for use.
实施例3Example 3
准确称取如下各种原料:乙氧化双酚A二甲基丙烯酸酯10份、聚氨酯改性丙烯酸双酯20份、2-苯氧基乙基丙烯酸酯30份、对苯醌0.01份加入双行星动力混合搅拌机内混合均匀,再加入三乙醇胺0.8份、糖精0.5份,升温至50℃,在所述双行星动力混合搅拌机自转速度为500转/分钟,公转速度为8转/分钟的条件下,机械搅拌0.5小时使完全溶解,随后快速冷却降至室温,加入过氧化苯甲酸叔丁酯1份,再加入A-187偶联剂4份,搅拌1小时均匀后,抽真空10分钟,真空度至-0.06MPa。出料,即得到本发明太阳能晶硅棒拼接的厌氧胶液,包装放置待用。Accurately weigh the following raw materials: 10 parts of ethoxylated bisphenol A dimethacrylate, 20 parts of polyurethane modified diester acrylate, 30 parts of 2-phenoxyethyl acrylate, 0.01 part of p-benzoquinone Mix evenly in the power mixing mixer, then add 0.8 parts of triethanolamine and 0.5 parts of saccharin, and heat up to 50°C. Under the condition that the rotation speed of the double planetary power mixing mixer is 500 rpm and the revolution speed is 8 rpm, Mechanically stir for 0.5 hours to completely dissolve, then quickly cool down to room temperature, add 1 part of tert-butyl peroxybenzoate, and then add 4 parts of A-187 coupling agent, stir for 1 hour, then vacuum for 10 minutes, the vacuum degree to -0.06MPa. After discharging, the anaerobic glue solution for splicing solar crystal silicon rods of the present invention is obtained, which is packaged and placed for use.
准确称取表面促进剂各组分如下:将重量为1份醋酸铜粉末,无水乙醇99份溶剂,加入双行星动力混合搅拌机内混合,在所述双行星动力混合搅拌机自转速度为300转/分钟,公转速度为5转/分钟的条件下,机械搅拌0.5小时,出料,即得到本发明太阳能晶硅棒拼接胶的促进剂,包装放置待用。Accurately weigh the components of the surface accelerator as follows: 1 part of copper acetate powder and 99 parts of absolute ethanol as a solvent are mixed in a double planetary power mixer, and the rotation speed of the double planetary power mixer is 300 rpm. Minutes, under the condition of a revolution speed of 5 rpm, mechanically stirred for 0.5 hours, and discharged, the accelerator for splicing glue for solar crystal silicon rods of the present invention was obtained, which was packaged and placed for use.
实施例4Example 4
准确称取如下各种原料:双酚A环氧丙烯酸酯80份、2-苯氧基乙基丙烯酸酯20份、1,4-萘醌0.03份加入双行星动力混合搅拌机内混合均匀,再加入三乙胺0.6份、糖精0.4份,升温至45℃,在所述双行星动力混合搅拌机自转速度为500转/分钟,公转速度为8转/分钟的条件下,机械搅拌0.5小时使完全溶解,随后快速冷却降至室温,加入异丙苯过氧化氢5份,再加入A-187偶联剂5份,搅拌1小时均匀后,抽真空10分钟,真空度至-0.05MPa。出料,即得到本发明太阳能晶硅棒拼接的厌氧胶液,包装放置待用。Accurately weigh the following raw materials: 80 parts of bisphenol A epoxy acrylate, 20 parts of 2-phenoxyethyl acrylate, 0.03 parts of 1,4-naphthoquinone, add them into a double planetary power mixer and mix evenly, then add 0.6 part of triethylamine, 0.4 part of saccharin, heat up to 45 ° C, under the condition that the rotation speed of the double planetary power mixing mixer is 500 rpm and the revolution speed is 8 rpm, mechanically stir for 0.5 hours to completely dissolve, Then cool down to room temperature quickly, add 5 parts of cumene hydroperoxide, and then add 5 parts of A-187 coupling agent, stir for 1 hour, and then vacuumize for 10 minutes to -0.05MPa. After discharging, the anaerobic glue solution for splicing solar crystal silicon rods of the present invention is obtained, which is packaged and placed for use.
准确称取表面促进剂各组分如下:将重量为0.6份乙酰丙酮铜粉末,无水乙醇99.4份溶剂,加入双行星动力混合搅拌机内混合,在所述双行星动力混合搅拌机自转速度为300转/分钟,公转速度为5转/分钟的条件下,机械搅拌0.5小时,出料,即得到本发明太阳能晶硅棒拼接胶的促进剂,包装放置待用。Accurately weigh the components of the surface accelerator as follows: add 0.6 parts of copper acetylacetonate powder by weight and 99.4 parts of absolute ethanol as a solvent into a double planetary power mixer for mixing, and the rotation speed of the double planetary power mixer is 300 rpm /min, under the condition that the revolution speed is 5 revs/min, mechanically stir for 0.5 hour, discharge, promptly obtain the accelerant of splicing glue of solar crystal silicon rod of the present invention, pack and place for use.
以上实施例1至实施例4,工艺使用时,将被粘晶硅棒的表面涂敷促进剂,晾干,再涂厌氧胶液,对接,粘合,定位,固化,即进行晶片切割。In the above embodiments 1 to 4, when the process is used, the surface of the silicon rod to be bonded is coated with an accelerator, dried, and then coated with anaerobic glue, docking, bonding, positioning, curing, and wafer cutting.
对比实施例1Comparative Example 1
传统环氧树脂胶粘剂配方,准确称取如下各种原料:双酚A型环氧树脂55份,端羧基丁晴橡胶CTBN增韧环氧树脂20份,活性硅微粉20份,纳米碳酸钙3份,气相二氧化硅2份,KH-560偶联剂0.2份,将上述各原料依次加入双行星动力混合搅拌机内,抽真空至-0.1MPa,于自转速度为1000转/分钟,公转速度为8转/分钟的条件下,机械搅拌2小时,混合均匀,得到环氧树脂胶粘剂的A组分,包装放置待用。Traditional epoxy resin adhesive formula, accurately weigh the following raw materials: 55 parts of bisphenol A epoxy resin, 20 parts of carboxyl-terminated nitrile rubber CTBN toughened epoxy resin, 20 parts of active silica powder, 3 parts of nano-calcium carbonate , 2 parts of fumed silica, 0.2 parts of KH-560 coupling agent, add the above-mentioned raw materials into the double planetary power mixer in turn, vacuumize to -0.1MPa, at the rotation speed of 1000 rpm, the revolution speed of 8 Under the condition of revolutions per minute, stir mechanically for 2 hours, and mix evenly to obtain component A of the epoxy resin adhesive, which is packaged and placed for use.
准确称取固化剂各组分如下:GPM800环氧固化剂65份,650#聚酰胺固化剂13份,碳酸钙22份,将上述各原料依次加入双行星动力混合搅拌机内,抽真空至-0.1MPa,于自转速度为1000转/分钟,公转速度为8转/分钟的条件下,机械搅拌2小时,混合均匀,得到环氧树脂胶粘剂的B组分,包装放置待用。Accurately weigh the components of the curing agent as follows: 65 parts of GPM800 epoxy curing agent, 13 parts of 650# polyamide curing agent, and 22 parts of calcium carbonate. MPa, under the condition that the rotation speed is 1000 rpm and the revolution speed is 8 rpm, mechanically stir for 2 hours and mix evenly to obtain the B component of the epoxy resin adhesive, which is packaged and placed for use.
将对比实施例1得到的环氧树脂胶粘剂的A组分和B组分按重量配比1∶1进行称取,混合,涂敷,定位,固化,再进行晶片切割。Component A and component B of the epoxy resin adhesive obtained in Comparative Example 1 were weighed in a weight ratio of 1:1, mixed, coated, positioned, cured, and then wafers were cut.
通过下面的试验测试本发明的太阳能晶硅棒拼接胶的性能。The performance of the solar crystalline silicon rod splicing glue of the present invention is tested by the following test.
测试方法的步骤为:The steps of the test method are:
将实施例1至4各实施例中得到的太阳能晶硅棒拼接胶,在测试时,将被粘物的表面涂敷促进剂,晾干,再涂厌氧胶液8-10克,对接,定位,固化,再进行性能测试。With the solar crystalline silicon rod splicing glue obtained in each embodiment of Examples 1 to 4, when testing, the surface of the adherend is coated with an accelerator, dried, and then coated with 8-10 grams of anaerobic glue, butt joint, Positioning, curing, and performance testing.
将对比实施例1得到的环氧树脂胶粘剂的A组分和B组分按重量配比1∶1进行混合,称取混胶8-10克,对接,定位,固化,再进行性能测试。Component A and component B of the epoxy resin adhesive obtained in Comparative Example 1 were mixed at a weight ratio of 1:1, and 8-10 grams of the mixed glue was weighed, docked, positioned, cured, and then performance tested.
试验实施例1剪切强度的测试:The test of test embodiment 1 shear strength:
将上述实施例1-4和现有的传统环氧树脂胶粘剂进行对比测试,按照标准GB/T 6329-1996测试。Above-mentioned embodiment 1-4 and existing traditional epoxy resin adhesive are carried out comparative test, according to standard GB/T 6329-1996 test.
试验实施例2冲击强度测试:Test Example 2 Impact Strength Test:
将上述实施例1-4和现有的传统环氧树脂胶粘剂进行对比测试,按照标准GB/T 2571-1995测试。Above-mentioned embodiment 1-4 and existing traditional epoxy resin adhesive are carried out comparative test, according to standard GB/T 2571-1995 test.
试验实施例3定位时间的测试:The test of test embodiment 3 positioning time:
将上述实施例1-4和现有的传统环氧树脂胶粘剂进行对比测试,按照标准ASTM 5363-1997测试。以经丙酮除油后的钢质M8螺栓和螺母作为室温测试对象。The above-mentioned Examples 1-4 and the existing traditional epoxy resin adhesives were compared and tested according to the standard ASTM 5363-1997. Steel M8 bolts and nuts degreased with acetone are used as test objects at room temperature.
试验实施例4储存稳定性测试Test Example 4 Storage Stability Test
将上述实施例1-4和现有的传统环氧树脂胶粘剂的组分,各取100g倒入200毫升玻璃烧杯中,然后将其置于恒温恒湿箱中,在温度25℃、相对湿度50%的环境中,敞口放置15天,观察胶液变化状况。100 g of the above-mentioned components of Examples 1-4 and existing traditional epoxy resin adhesives are poured into a 200 ml glass beaker, and then placed in a constant temperature and humidity chamber at a temperature of 25° C. and a relative humidity of 50 % environment, leave it open for 15 days, and observe the change of the glue.
试验实施例5耐介质性能测试Test Example 5 Medium Resistance Performance Test
将上述实施例1-4和现有的传统环氧树脂胶粘剂的组分按所定要求进行粘合M10钢块,定位后室温放置24小时,在70℃条件下,分别在200#溶剂油中浸泡24小时,测试其压缩剪切强度,测试标准参Q/SH 114-2009标准执行。The components of the above-mentioned Examples 1-4 and the existing traditional epoxy resin adhesive are bonded to the M10 steel block according to the specified requirements. After positioning, place it at room temperature for 24 hours, and soak it in 200# solvent oil at 70°C. 24 hours, test its compressive shear strength, test standard reference Q/SH 114-2009 standard implementation.
测试所得结果如表一所示。The test results are shown in Table 1.
表一测试所得结果Table 1 Test results
从上述结果可以看出,本发明的一种太阳能晶硅棒拼接胶比现有的传统环氧树脂胶的力学性能更好,尤其是抗冲击韧性更高,并同时提高了储存稳定性和耐化学介质性能。而且,新发明的硅棒拼接胶定位时间更为快捷,极大的提高了工效,完全可以满足太阳能晶硅切割工序中快速定位粘接的要求。From the above results, it can be seen that a solar crystalline silicon rod splicing glue of the present invention has better mechanical properties than the existing traditional epoxy resin glue, especially higher impact toughness, and simultaneously improves storage stability and durability. Chemical media properties. Moreover, the positioning time of the newly invented silicon rod splicing glue is faster, which greatly improves the work efficiency, and can fully meet the requirements of fast positioning and bonding in the cutting process of solar crystal silicon.
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within range.
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CN103319924A (en) * | 2013-07-05 | 2013-09-25 | 广东恒大新材料科技有限公司 | Anaerobic adhesive promoting primer and preparation method thereof |
CN103525356A (en) * | 2013-10-23 | 2014-01-22 | 南宁珀源化工有限公司 | Fixing glue for cutting sapphire |
CN103555252A (en) * | 2013-10-23 | 2014-02-05 | 南宁珀源化工有限公司 | Fixing adhesive for cutting ceramic glass |
CN104327775A (en) * | 2014-10-17 | 2015-02-04 | 太仓市茜泾化工有限公司 | UV (ultraviolet) curable adhesive and preparation method thereof |
CN105001829A (en) * | 2015-07-02 | 2015-10-28 | 东莞优邦材料科技有限公司 | Priming coat type acrylic acid ester conductive adhesive and preparation method thereof |
CN106590513A (en) * | 2016-10-31 | 2017-04-26 | 南宁珀源能源材料有限公司 | Powder silicon-ingot-cutting adhesive with good fluidity and preparation method thereof |
CN107189701A (en) * | 2017-07-03 | 2017-09-22 | 上海都伟光伏科技有限公司 | A kind of high temperature resistant anaerobism acrylic acid adhesive |
CN117247756A (en) * | 2023-08-23 | 2023-12-19 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
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CN103319924A (en) * | 2013-07-05 | 2013-09-25 | 广东恒大新材料科技有限公司 | Anaerobic adhesive promoting primer and preparation method thereof |
CN103525356A (en) * | 2013-10-23 | 2014-01-22 | 南宁珀源化工有限公司 | Fixing glue for cutting sapphire |
CN103555252A (en) * | 2013-10-23 | 2014-02-05 | 南宁珀源化工有限公司 | Fixing adhesive for cutting ceramic glass |
CN103525356B (en) * | 2013-10-23 | 2015-04-15 | 南宁珀源化工有限公司 | Fixing glue for cutting sapphire |
CN104327775A (en) * | 2014-10-17 | 2015-02-04 | 太仓市茜泾化工有限公司 | UV (ultraviolet) curable adhesive and preparation method thereof |
CN105001829A (en) * | 2015-07-02 | 2015-10-28 | 东莞优邦材料科技有限公司 | Priming coat type acrylic acid ester conductive adhesive and preparation method thereof |
CN105001829B (en) * | 2015-07-02 | 2018-01-05 | 东莞优邦材料科技股份有限公司 | A kind of primary coat type acrylate conductive adhesive and preparation method thereof |
CN106590513A (en) * | 2016-10-31 | 2017-04-26 | 南宁珀源能源材料有限公司 | Powder silicon-ingot-cutting adhesive with good fluidity and preparation method thereof |
CN106590513B (en) * | 2016-10-31 | 2019-09-20 | 南宁珀源能源材料有限公司 | Powder silicon ingot cutting glue of good fluidity and preparation method thereof |
CN107189701A (en) * | 2017-07-03 | 2017-09-22 | 上海都伟光伏科技有限公司 | A kind of high temperature resistant anaerobism acrylic acid adhesive |
CN117247756A (en) * | 2023-08-23 | 2023-12-19 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
CN117247756B (en) * | 2023-08-23 | 2024-05-28 | 广东金湾高景太阳能科技有限公司 | Silicon rod joint glue and preparation method and application thereof |
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