CN103140036A - Manufacturing method of heat dissipation circuit board - Google Patents

Abstract

The manufacturing method of the invention can provide a substrate, one surface of the substrate is provided with a circuit layer, at least one through groove is formed on the substrate, and a metal heat dissipation structure is provided, the metal heat dissipation structure is provided with a metal carrier plate and a plurality of metal heat dissipation bodies which are convexly arranged on the metal carrier plate, the metal heat dissipation bodies are pressed and fixed in the through grooves in a hot pressing mode, so that the metal carrier plate of the metal heat dissipation structure is fixed on the other surface of the substrate, and then the subsequent steps of surface smoothing, conductive hole forming and the like are carried out, so as to complete the heat dissipation circuit board, the manufacturing process is simple and convenient, the cost is reduced, and the metal heat dissipation structure not only can be used as a part of a bottom layer circuit, but also.

Description

Manufacturing method of heat dissipation circuit board

technical field

The invention relates to a manufacturing method of a heat dissipation circuit board, and aims to provide a metal radiator at a specific position of the circuit board for electronic parts, which is helpful for the heat dissipation of the electronic parts and can reduce production costs.

Background technique

With the gradual development of electronic products in the direction of high performance, high frequency, high speed and thinness, under the design concept of "light, thin, short, small and multifunctional", various electronic related main components such as central processing Processors (CPUs), chipsets (Chipsets), etc. are all researched and developed in the direction of high speed, multi-function, high power, and small size. Therefore, the calorific value per unit volume in the components is constantly increasing, and the heat dissipation of the components has become the key to the improvement of the performance of electronic components.

Multi-layer circuit board is a good solution to increase the density of electronic components and circuits. The general multi-layer circuit board structure and process usually use a flat substrate as the base, and then form an adhesive layer or insulating layer on one or both sides of the base. , and then cover the metal circuit layer. Or after the first metal circuit layer is formed on the substrate, a plurality of circuit layers and adhesive layers are laminated by a gluing process, and finally processed to complete the production of a multilayer printed circuit board. Increasing the relative density of components and circuits also leads to the problem of poor heat dissipation efficiency. The components on the circuit board need to use air as the heat transfer medium. However, heat dissipation through air conduction cannot quickly and effectively dissipate the heat accumulated in the components, which reduces the performance of the components and even reduces the life of the components. This situation is more serious in multi-layer circuit boards.

In the development trend of packaging design, it is no longer possible to dissipate enough heat only by the packaging design of the components, and the heat dissipation function must be enhanced by the design of the circuit board. Therefore, in order to prevent the heat accumulation of multilayer circuit boards, the practice of using thermally conductive adhesive as the adhesive layer of the metal circuit layer has been produced. However, the amount of thermally conductive adhesive used to bond the components, each metal circuit layer and the substrate is quite large, so it is also necessary Increases the manufacturing cost of the multilayer circuit board.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for manufacturing a heat-dissipating circuit board. The method for manufacturing a heat-dissipating circuit board in the present invention uses a metal radiator to be hot-pressed and fixed in the substrate, which not only facilitates the manufacturing process but also reduces production costs, and can Meet the needs of users.

In the manufacturing method of the present invention, a substrate can be provided, one surface of the substrate is provided with a circuit layer, and at least one through groove is formed on the substrate, and a metal heat dissipation structure is provided, and the metal heat dissipation structure is provided with a metal carrier plate and a plurality of protrusions The metal heat dissipation body arranged on the metal carrier plate is pressed and fixed in the through groove by hot pressing, so that the metal heat dissipation structure of the metal heat dissipation structure is fixed on the other surface of the substrate, and then the subsequent Steps such as surface smoothing and conductive hole forming are used to complete the heat dissipation circuit board. The manufacturing process is simple to reduce costs. The metal heat dissipation structure can not only be used as a part of the bottom circuit, but also can be used for heat dissipation.

Description of drawings

Fig. 1 is a schematic block diagram of the manufacturing method in the present invention.

2A-D are schematic flow charts of the manufacturing method in the present invention.

FIG. 3 is a schematic structural diagram of electronic components arranged on a heat dissipation circuit board in the present invention.

FIG. 4 is another structural schematic diagram of electronic components arranged on a heat dissipation circuit board in the present invention.

FIG. 5 is another structural schematic diagram of the substrate in the present invention.

Description of figure number:

Substrate 1

first surface 11

second surface 12

Groove 13

Border 14

Cover 15

Laminate 16

Adhesive film 17

Metal cooling structure 2

Metal carrier 21

Metal Radiator 22

Line layer 31

Conductive hole 32

bonding layer 33

Electronic Components 4

Wire 41

thermal paste5.

Detailed ways

In order to make your examiner clear about the structure and composition of the present invention, as well as the overall mode of operation, it is described as follows with reference to the drawings: The "method for manufacturing a heat-dissipating circuit board" of the present invention, as shown in Figure 1, at least includes the following steps: Step A. Provide a metal heat dissipation structure 2. As shown in FIG. 2A, the metal heat dissipation structure 2 is provided with a metal carrier plate 21 and a plurality of metal heat sinks 22 protruding from the metal carrier plate 21. The metal heat dissipation structure 2 can be Metal materials with high heat dissipation coefficients such as gold, copper, and aluminum can be formed by mechanical or chemical processing.

Step B, providing a substrate 1 , as shown in FIG. 2B , the substrate 1 is provided with opposite first and second surfaces 11 , 12 , and the first surface 11 is formed with a circuit layer 31 .

Step C, forming step, forming at least one through-groove 13 on the substrate 1, and the through-groove 13 runs through the first and second surfaces 11, 12. The forming step can be physical mechanical processing (such as cutting) or chemical method (such as chemical etching) molding.

Step D, hot pressing step, a bonding layer 33 is provided between the second surface 12 of the substrate and the metal carrier plate 21 of the metal heat dissipation structure, and hot pressing is performed, as shown in FIG. 2C, so that the second surface 12 of the substrate and the metal The carrier board 21 is bonded so that each metal radiator 22 is press-fitted and fixed in the through groove 13. The metal radiator 22 protrudes from the first surface 11 of the substrate, and the bonding layer 33 can overflow between the through groove 13 and each The metal radiator 22 is used to form a firm joint. 

Step E, the conductive hole forming step, at least one conductive hole 32 is formed at the place where the non-metallic heat sink 22 of the substrate 1 is disposed, as shown in FIG. 2D, to connect the circuit layer 31 on the first surface and the metal carrier on the second surface. board 21 to complete the heat dissipation circuit board, wherein the conductive hole is formed before the substrate is provided with a through hole, and then electroplated in the through hole to form a conductive hole structure, and a circuit patterning process can be applied to convert the circuit on the first surface Layer 31 and the metal carrier 21 on the second surface are patterned.

Step F can be further carried out between step D and step E. This step F is a surface smoothing step. Surface smoothing is carried out on the metal carrier plate or the lower surface of the metal radiator, so as to reduce the thickness of the metal carrier plate 21 and remove The resin overflowing from the joining layer 33; of course, the step F can be performed after the step D and before the step E, or can be performed after the step E, and the step A can also be performed between the step C and the step D.

Of course, step G can be further carried out after step F, and step G is an electronic component setting step. As shown in FIG. After the surface of the metal radiator 22 is provided with solder paste or thermally conductive glue 5, another electronic component 4 is fixed on the metal radiator 22 by welding or thermally conductive glue 5, and the electronic component 4 can be soldered or at least one wire 41 is connected to the circuit layer 31, and when the electronic part 4 is energized to work, the working heat source emitted by its work can be directly dissipated quickly and effectively by the metal radiator 22 in contact with it, as shown in the embodiment shown in the figure Among them, the working heat source is dissipated from the bottom of the metal heat sink 22 to maintain the working performance of the electronic components and maintain their service life, and the metal carrier plate 21 of the metal heat dissipation structure can also be used as a part of the bottom circuit.

Furthermore, the electronic component 4 can be shown in FIG. 4 , and the substrate 1 is provided with two frames 14 and a top cover 15 , and the top cover 15 is arranged on the two frames 14 to seal the electronic component 4 .

In the above-mentioned embodiments, the substrate is provided with at least one laminate, that is, a single-layer circuit board or a multi-layer circuit board can be formed. As shown in the embodiment of FIG. 5, the substrate 1 is provided with a two-layer laminate. Laminates 16, each of the laminates 16 can be further bonded to each other by an adhesive film 17, using the adhesive film 17 as a part of the substrate 1 can not only replace the laminate to reduce costs, but also greatly reduce The thickness of the overall substrate can be more in line with the requirements of lightness, thinness and shortness.

Claims (9)

1. A method for manufacturing a heat dissipation circuit board, characterized in that it at least includes the following steps: A. Provide a metal heat dissipation structure, the metal heat dissipation structure is provided with a metal carrier and a plurality of metal radiators protruding from the metal carrier; B. A substrate is provided, the substrate is provided with opposite first and second surfaces, and a circuit layer is formed on the first surface of the substrate; C. Forming step, forming at least one through-groove on the substrate, and the through-groove runs through the first and second surfaces; D. Hot pressing step, placing the metal radiator under the second surface of the substrate for hot pressing, so that the second surface of the substrate is bonded to the metal carrier, so that each metal radiator is pressed and fixed in the through groove; and E. Conductive hole forming step, at least one conductive hole is formed at the place where the non-metallic heat sink is disposed on the substrate, so as to connect to the circuit layer on the first surface. 2. The method for manufacturing a heat dissipation circuit board according to claim 1, wherein a step F is further carried out between the step D and the step E, and the step F is a surface smoothing step on the surface of the metal carrier of the metal radiator Surface smoothing is performed to reduce the thickness of the metal carrier. 3. The method for manufacturing a heat dissipation circuit board according to claim 1 or 2, wherein, in the hot pressing step of step D, a bonding layer is provided between the second surface of the substrate and the metal carrier of the metal heat dissipation structure, And perform thermocompression bonding. 4 . The method for manufacturing a heat dissipation circuit board according to claim 3 , wherein the joint layer overflows between the through groove and each metal heat sink after the heat-pressing step. 5 . 5 . The method for manufacturing a heat dissipation circuit board as claimed in claim 3 , wherein step A is placed between step C and step D. 6 . 6 . The method for manufacturing a heat dissipation circuit board according to claim 2 , wherein step G is further performed after step F, and step G is an electronic component installation step, at least one electronic component is installed on the metal heat sink. 7 . 7. The method for manufacturing a heat dissipation circuit board as claimed in claim 6, wherein in the step G, solder paste or heat-conducting glue is placed on the surface of the metal heat sink, and then another electronic component is fixed by welding or heat-conducting glue on the metal radiator. 8 . The manufacturing method of the heat dissipation circuit board according to claim 6 , wherein the circuit board is provided with two frames and a top cover, and the top cover is arranged on the two frames to enclose the electronic components. 9 . The method for manufacturing a heat dissipation circuit board according to claim 3 , wherein the substrate is provided with at least one laminate, and the laminates are further bonded to each other by an adhesive film.

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