CN103108537A - Electronic component mounting apparatus, and electronic component mounting method - Google Patents

Abstract

The present invention provides an electronic component mounting device and an electronic component mounting method capable of efficiently and accurately mounting electronic components on a substrate having through holes. It has: a substrate conveying part; a component supply unit, which has at least one electronic component supply device for supplying electronic components with leads; a mounting head main body; a photographing device, which is fixed on the mounting head support body, and photographs the substrate; storage part; and a control part, which controls the actions of the mounting head main body, the imaging device, and the component supply unit. The fiducial mark correction value is obtained from the fiducial mark obtained from the captured image, and the through hole correction value is calculated based on the offset between the through hole position after correction of the fiducial mark and the through hole obtained from the captured image, and the through hole correction value is calculated according to the fiducial mark The correction value and the via correction value determine where the electronic components are mounted.

Description

Electronic component mounting device and electronic component mounting method

technical field

The present invention relates to an electronic component mounting device and an electronic component mounting method that hold an electronic component using a suction nozzle, move the electronic component, and mount the electronic component on a substrate.

Background technique

An electronic component mounting apparatus for mounting an electronic component on a substrate includes a mounting head having a suction nozzle, and the electronic component is held by the suction nozzle and mounted on the substrate. The electronic component mounting device moves the suction nozzle of the mounting head in a direction perpendicular to the surface of the substrate to absorb the components in the electronic component supply device, and then makes the mounting head face to face in a direction parallel to the surface of the substrate. After reaching the mounting position of the suctioned component, the suction nozzle of the mounting head moves in a direction perpendicular to the surface of the substrate to approach the substrate, thereby mounting the suctioned electronic component on the substrate.

Here, as electronic components mounted on a substrate, there are lead-type electronic components having a main body and leads connected to the main body, in addition to mount-type electronic components mounted on a substrate. In the present invention, a lead type electronic component is a component that is mounted by inserting a lead wire into a hole formed in a substrate. In addition, in the present invention, electronic components that are mounted on a substrate without being inserted into insertion holes (substrate holes), such as SOPs and QFPs, are referred to as mounted electronic components. As an electronic component mounting apparatus for mounting lead-type electronic components on a substrate, there are, for example, those described in Patent Documents 1 and 2. As shown in FIG. In Patent Document 1, an electronic component mounting machine is described, which has a component mounting machine for mounting the following two types of electronic components, that is, a mountable electronic component that is sucked by a suction mounting head, and a mountable electronic component that is sucked by a clip. A leaded electronic component that is clamped by a mounting head, inserted into a substrate, and then clinched. Patent Document 2 describes an electronic component mounting apparatus integrally configured with a mounting suction head for mounting a mounted electronic component and an insertion mounting head for mounting a lead type electronic component.

Moreover, the electronic component mounting apparatus has a some electronic component supply apparatus which supplies the electronic component mounted on the board|substrate to the position which suctions a suction nozzle. The electronic component supply device has: a holding belt for arranging electronic components of the same type at predetermined intervals; The suction position is transported to supply the electronic components to the position where suction can be carried out by the suction nozzle.

In addition, there is also an electronic component supply device that supplies electronic components to a position where an operator can pick up the electronic component, so that the operator inserts the electronic component with his hand, and supplies radial wires in which lead wires are arranged in the radial direction. Lead type electronic component (Patent Document 3).

When an electronic component mounting apparatus mounts an electronic component with a lead on a substrate, the lead of the electronic component may be inserted into a through hole formed on the substrate to mount the electronic component. The electronic component mounting apparatus executes a process for detecting a position of a substrate where a through hole (insertion hole) is formed when mounting an electronic component. Patent Document 4 describes a method in which an image of a through hole is captured, the position of the through hole on the substrate is detected by analyzing the captured image, and the detected position is set as The origin of the substrate.

Patent Document 1: Japanese Patent Application Laid-Open No. 5-335782

Patent Document 2: Japanese Patent Application Laid-Open No. 9-83121

Patent Document 3: Japanese Patent Publication No. 7-48595

Patent Document 4: Japanese Patent Application Laid-Open No. 7-91914

Contents of the invention

By using the method described in Patent Document 4, the origin of the substrate can be detected based on the position of the through hole (insertion hole) even when the origin mark is not described. However, in the case of using the method described in Patent Document 4, since the origin is detected based on the position of the through hole, in a printed circuit board on which surface-mounted electronic components and the above-mentioned electronic components with leads are mixed and mounted at high density, , sometimes the mounting position of the electronic component may deviate from the proper position on the substrate.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of efficiently and accurately mounting electronic components on a substrate having through holes (insertion holes).

In addition, by using the devices described in Patent Documents 1 and 2, lead type electronic components can be mounted on a substrate. Here, the devices described in Patent Documents 1 and 2 are dedicated mounting devices for mixed mounting, which integrally have a dedicated clamping and mounting head for inserting axial lead type electronic components, and a mounting head for inserting the mounted electronic components to the mounting device. The dedicated suction mounting head for substrate mounting can mount both mount-type electronic components and lead-type electronic components on the substrate. Here, the mounting devices for hybrid mounting described in Patent Documents 1 and 2 cannot insert lead-type electronic components into the insertion holes by using the above-mentioned suction mounting head, and cannot insert the mounting-type electronic components onto the substrate by using the above-mentioned clamping mounting head. carry. That is, these are devices in which the mounting head is not compatible with the component types of the mount-type electronic component and the lead-type electronic component. Therefore, the types of electronic components that can be mounted corresponding to the types of mounting heads mounted on the mounting device are limited, and since there are many types of mounting heads, it becomes a very expensive device.

The present invention has been made in view of the above circumstances, and an object of the present invention is to enable efficient and high-precision mounting of lead-type electronic components.

In order to solve the above-mentioned problems and achieve the purpose, the present invention provides an electronic component mounting device, which is characterized in that it has: a substrate conveying unit that conveys the substrate; a component supply unit that has at least one component for feeding An electronic component supply device for supplying electronic components; a head body having a suction nozzle for suctioning the electronic components supplied from the component supply unit, a suction nozzle drive unit for driving the suction nozzle, and a suction nozzle driving unit for driving the suction nozzle. The nozzle and the mounting head supporting body supported by the suction nozzle driving part; the imaging device, which is fixed on the mounting head supporting body, and photographs the substrate; the storage part, which stores the coordinate design value of the through hole and the reference mark coordinate design values and electronic component mounting coordinate design values; and a control unit that controls the operations of the mounting head main body, the imaging device, and the component supply unit, the control unit using the imaging device to The through holes formed on the substrate and the fiducial marks formed on the surface of the substrate as the reference of the wiring pattern are photographed, and the reference mark correction value is obtained based on the reference marks obtained from the captured image, and based on the reference Marking the offset between the corrected position of the through hole and the through hole obtained from the captured image, calculating the correction value of the through hole, and determining the location of the electronic component mounted on the basis of the correction value of the reference mark and the correction value of the through hole. Location.

Here, it is preferable that the control unit controls the movement of the head main body to move the electronic component with leads to the position of the substrate determined based on the calibration result, and to move the leads of the electronic component to The electronic component is inserted into the through hole of the substrate to mount the electronic component on the substrate.

In addition, it is preferable that the control unit captures images of two or more through holes adjacently formed on the substrate, and based on the relative positions of the two or more through holes formed on the substrate, The position of the through hole is detected.

In addition, it is preferable that the control unit captures images of three through-holes formed adjacently on the substrate, and based on the relative positions of the three through-holes, calculates the position of the through-holes formed on the substrate. detection.

In addition, it is preferable that the electronic component mounting apparatus further includes a height sensor fixed to the mounting head support to detect the height of the surface of the substrate and the height of the electronic component mounted on the surface of the substrate. The control unit stores a reference height of the electronic component mounted on the substrate, and uses the height sensor to measure the height of the electronic component on the substrate after the lead wire of the electronic component is inserted into the through hole of the substrate. The height of the electronic component is detected, and it is determined whether the detected height of the electronic component is higher than the reference height.

In addition, it is preferable that the control unit notifies an error when determining that the detected height of the electronic component is higher than the reference height.

In addition, it is preferable that the control unit causes the mounting head main body to perform a process of pressing the electronic component in when it is determined that the detected height of the electronic component is higher than the reference height.

In addition, it is preferable that the process of pressing the electronic component is a process of pressing the electronic component toward the substrate with the tip of the suction nozzle.

In addition, it is preferable that the control unit determines the pressing amount in the pressing process based on the detected height of the electronic component.

In addition, it is preferable that the electronic component supply device includes: a storage bowl in which a plurality of the electronic components are put; a guide; a support mechanism that blocks a downstream side of the suction position of the guide rail and supports the electronic component at the suction position of the guide rail; and a vibrating portion that vibrates the storage bowl.

In addition, it is preferable that the support mechanism is movable along the extending direction of the guide rail, and can switch between a state of closing the downstream side of the guide rail from the suction position and a state of opening it, and the storage bowl is A detachable fastening mechanism is fixed on the vibrating part.

In addition, it is preferable that the component supply unit has a plurality of the electronic component supply devices, the storage bowls of the plurality of electronic component supply devices are stacked in a vertical direction, and the vibrating part of the electronic component supply device, The accommodating bowl is vibrated by the same driving device as the other vibrating part of the other electronic component supply device.

In addition, it is preferable that a plurality of the support mechanisms are arranged side by side in the horizontal direction.

In addition, it is preferable that the driving unit is supported by a fixing unit extending in the vertical direction, and vibrates the storage bowl from the fixing unit as a starting point.

In order to solve the above problems and achieve the purpose, the present invention provides an electronic component mounting method, which uses an electronic component mounting device to mount electronic components on the substrate, wherein the electronic component mounting device has: a substrate conveying unit that conveys the substrate a component supply unit having at least one electronic component supply device for supplying electronic components with leads; nozzle, a suction nozzle drive unit for driving the suction nozzle, and a mounting head support for supporting the suction nozzle and the suction nozzle drive unit. The electronic component mounting method is characterized in that it has the following steps: A process of storing the design values of hole coordinates, reference mark coordinates, and electronic component mounting coordinates; a coordinate calculation process of calculating the coordinates of the through-holes formed on the substrate, and the The coordinates of the formed fiducial mark; the fiducial mark correction value calculation process, in this process, the fiducial mark correction value is obtained according to the coordinates of the fiducial mark calculated in the coordinate calculation process; the through hole correction value calculation process, in the In the process, the through hole correction value is obtained according to the offset between the position of the through hole corrected by the calculated correction value of the reference mark and the coordinate of the through hole calculated in the coordinate calculation step; and A step of determining a position to mount an electronic component based on the reference mark correction value and the via hole correction value.

The effect of the invention

The electronic component mounting apparatus and electronic component mounting method according to the present invention have the effect that electronic components can be efficiently and accurately mounted on a substrate having through holes.

Description of drawings

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

2 is a perspective view showing a schematic configuration of a housing of the electronic component mounting device.

Fig. 3A is a front view of the frame shown in Fig. 2 .

FIG. 3B is a plan view of the frame shown in FIG. 2 .

FIG. 3C is a right side view of the frame shown in FIG. 2 .

FIG. 3D is a left side view of the frame shown in FIG. 2 .

FIG. 3E is a rear view of the frame shown in FIG. 2 .

FIG. 4 is an explanatory diagram showing a schematic configuration of a cover of a frame.

FIG. 5 is an explanatory diagram showing a schematic configuration of a lock mechanism of a housing.

FIG. 6 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

Fig. 7 is a schematic diagram showing a schematic configuration of the front container.

Fig. 8 is a schematic diagram showing a schematic configuration of the rear container.

FIG. 9 is a schematic diagram showing a schematic configuration of another example of a rear-side component supply unit.

10 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

11 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

FIG. 12 is a schematic diagram showing a schematic configuration of an example of an electronic component holding tape.

FIG. 13 is a schematic diagram showing a schematic configuration of another example of the electronic component holding tape.

14 is a perspective view showing a schematic configuration of the electronic component supply device of the component supply unit on the rear side.

Fig. 15 is a perspective view of the electronic component supply device shown in Fig. 14 viewed from a different direction from Fig. 14 .

16 is an explanatory diagram showing a schematic configuration of an electronic component supply device of a component supply unit.

17 is an explanatory diagram showing a schematic configuration of a holding unit of the electronic component supply device.

18 is an explanatory diagram showing a schematic configuration of a feeder unit of the electronic component supply apparatus.

Fig. 19 is an explanatory diagram showing a schematic configuration of a front end support portion of the feeder unit.

Fig. 20 is an explanatory diagram showing a schematic configuration of a holding tape feed claw unit of the feeder unit.

Fig. 21 is an explanatory diagram for explaining the operation of the feeder unit.

22 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply device.

23 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply device.

FIG. 24 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus.

Fig. 25 is a perspective view showing a schematic configuration of another example of a cutting unit.

Fig. 26 is a perspective view showing a schematic configuration of the cutting unit shown in Fig. 25 viewed from another direction.

Fig. 27 is a perspective view showing the relationship between the cutting unit and the housing shown in Fig. 25 .

Fig. 28 is a perspective view showing a schematic configuration of another example of a cutting unit.

Fig. 29 is an explanatory view for explaining the operation of the cutting unit shown in Fig. 25 .

Fig. 30 is an explanatory view for explaining the operation of the cutting unit shown in Fig. 25 .

Fig. 31A is an explanatory diagram showing a schematic configuration of a holding mechanism of a cutting unit.

Fig. 31B is an explanatory diagram showing a schematic configuration of another example of the holding mechanism of the cutting unit.

32 is an explanatory diagram showing a schematic configuration of another example of the feeder unit of the electronic component supply apparatus.

Fig. 33 is a perspective view showing a schematic configuration of the feeder unit shown in Fig. 32 viewed from another direction.

Fig. 34 is a front view showing a schematic configuration of the feeder unit shown in Fig. 32 .

Fig. 35 is a plan view showing a schematic configuration of the feeder unit shown in Fig. 32 .

Fig. 36 is a front view showing a schematic configuration of another state of the feeder unit shown in Fig. 32 .

Fig. 37 is a plan view showing a schematic configuration of another state of the feeder unit shown in Fig. 32 .

Fig. 38 is an explanatory diagram showing a schematic configuration of the feeder unit shown in Fig. 32 .

Fig. 39 is an explanatory diagram showing a schematic configuration of another state of the feeder unit shown in Fig. 32 .

Fig. 40 is an explanatory diagram showing a schematic configuration of an interlocking mechanism of the feeder unit shown in Fig. 32 .

FIG. 41 is an explanatory diagram showing a schematic configuration of another example of a housing.

Fig. 42 is an explanatory view for explaining the operation of the feeder unit shown in Fig. 32 .

Fig. 43 is an explanatory diagram for explaining the operation of the feeder unit shown in Fig. 32 .

Fig. 44 is an explanatory diagram showing a schematic configuration of another example of the component supply device.

FIG. 45 is an explanatory diagram showing an enlarged part of FIG. 44 .

Fig. 46 is an explanatory diagram showing a schematic configuration of another example of the components supply device.

FIG. 47 is an explanatory diagram showing an enlarged part of FIG. 46 .

FIG. 48 is an explanatory diagram showing a schematic configuration of another example of the component supply device.

FIG. 49 is an explanatory diagram showing an enlarged part of FIG. 48 .

Fig. 50 is a perspective view showing a schematic structure of the bowl feeder unit.

Fig. 51 is a perspective view showing a schematic structure of the bowl feeder unit shown in Fig. 50 .

Fig. 52 is a side view showing another example of the component supply unit.

Fig. 53 is a plan view showing another example of the component supply unit.

Fig. 54 is a side view showing a state in which the storage bowl is removed from the component supply unit shown in Fig. 52 .

FIG. 55 is an explanatory view showing the relationship between the storage bowl of the electronic component supply device of the component supply unit shown in FIG. 53 and the support portion of the vibration unit.

Fig. 56 is an explanatory diagram showing a schematic configuration of the storage bowl shown in Fig. 55 .

57A is a perspective view showing a schematic configuration of a support mechanism of the electronic component supply device of the component supply unit shown in FIG. 53 .

Fig. 57B is a front view showing a schematic structure of the support mechanism shown in Fig. 57A.

Fig. 58A is a perspective view showing another state of the support mechanism shown in Fig. 57A.

Fig. 58B is a front view showing a schematic structure of the support mechanism shown in Fig. 58A.

Fig. 59 is a plan view showing a schematic configuration of a drive device of the component supply unit shown in Fig. 53 .

Fig. 60 is a perspective view showing a schematic configuration of the driving device shown in Fig. 59 .

Fig. 61 is an enlarged plan view showing an enlarged schematic configuration of the driving device shown in Fig. 59 .

Fig. 62 is a side view showing a schematic configuration of the driving device shown in Fig. 59 .

Fig. 63 is a side sectional view showing a schematic configuration of the driving device shown in Fig. 59 .

FIG. 64 is an explanatory diagram for explaining the operation of the driving device shown in FIG. 59 .

Fig. 65 is a perspective view enlarging a part of the electronic component supply device.

Fig. 66 is a perspective view showing an enlarged part of the electronic component supply device.

Fig. 67A is a perspective view showing an enlarged part of the electronic component supply device.

Fig. 67B is a perspective view showing a part of the electronic component supply device shown in Fig. 67A from another direction.

FIG. 68 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component by the electronic component mounting device.

69 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component of the electronic component mounting device.

FIG. 70 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component by the electronic component mounting device.

FIG. 71 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component of the electronic component mounting device.

FIG. 72 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component by the electronic component mounting device.

FIG. 73 is a schematic diagram showing an example of detection results of recognition actions.

FIG. 74 is a schematic diagram showing an example of detection results of recognition actions.

75 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component by the electronic component mounting device.

FIG. 76 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 77 is an explanatory diagram showing an example of an operation screen.

Fig. 78 is an explanatory diagram showing a part of the operation screen.

Fig. 79A is an explanatory diagram showing an example of a component supply angle.

FIG. 79B is an explanatory diagram showing an example of a component supply angle.

FIG. 80 is an explanatory diagram showing an example of an operation screen.

FIG. 81 is an explanatory diagram showing an example of an operation screen.

Fig. 82 is an explanatory diagram showing a part of the operation screen.

FIG. 83A is an explanatory diagram showing an example of measurement positions of electronic components.

FIG. 83B is an explanatory diagram showing an example of measurement positions of electronic components.

FIG. 83C is an explanatory diagram showing an example of measurement positions of electronic components.

FIG. 83D is an explanatory diagram showing an example of measurement positions of electronic components.

Fig. 84 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 85 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 86 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 87A is an explanatory diagram showing an example of an electronic component.

FIG. 87B is an explanatory diagram showing an example of the measurement results of the lead wires.

FIG. 88A is an explanatory diagram showing an example of an electronic component.

FIG. 88B is an explanatory diagram showing an example of the measurement results of the lead wires.

Fig. 89 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 90 is an explanatory diagram showing the relationship between lead wires and insertion holes.

FIG. 91 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 92 is an explanatory diagram for explaining the operation of the electronic component mounting device.

FIG. 93 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 94 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 95 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 96 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 97 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 98A is an explanatory diagram for explaining the operation of the electronic component mounting apparatus.

FIG. 98B is an explanatory diagram for explaining the operation of the electronic component mounting apparatus.

Fig. 99 is an explanatory view showing an example of a suction nozzle.

Fig. 100 is an explanatory view for explaining the holding operation of the suction nozzle of Fig. 99 .

Fig. 101A is an explanatory diagram showing an example of a suction nozzle.

Fig. 101B is an explanatory diagram showing an example of a suction nozzle.

Fig. 101C is an explanatory diagram showing an example of a suction nozzle.

Fig. 101D is an explanatory diagram showing an example of a suction nozzle.

Fig. 102 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 103 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 104 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus.

Fig. 105 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 106 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 107 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 108 is an explanatory diagram showing an example of a lead type electronic component.

Fig. 109 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 110 is an explanatory diagram showing the relationship between the moving speed of the suction nozzle and time.

FIG. 111 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 112 is an explanatory diagram showing the relationship between the moving speed of the suction nozzle and time.

FIG. 113 is an explanatory diagram for explaining an example of the operation of the electronic component mounting apparatus.

FIG. 114 is an explanatory diagram for explaining an example of the operation of the electronic component mounting apparatus.

FIG. 115 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 116 is an explanatory diagram showing the relationship between the moving speed of the suction nozzle and time.

FIG. 117 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 118 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 119 is an explanatory diagram showing an example of an operation screen.

FIG. 120 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 121 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 122 is an explanatory diagram showing an example of an operation screen.

FIG. 123A is an explanatory diagram showing an example of an operation screen.

FIG. 123B is an explanatory diagram showing an example of an operation screen.

Fig. 124 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 125 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 126A is a side view showing a schematic structure of a conventional support device.

Fig. 126B is a side view showing a schematic structure of a conventional support device.

Fig. 127A is a diagram showing a nailing process of a lead member.

Fig. 127B is a diagram showing a nailing process of a lead member.

Fig. 128A is a front view showing the structure of a support pin.

Fig. 128B is a side view showing the structure of a support pin.

Fig. 129 is a diagram illustrating an opening and closing mechanism and a height adjustment mechanism of a support pin.

Fig. 130 is a perspective view showing the structure of a support pin.

Fig. 131 is a diagram showing the shape of a wire guide groove.

Fig. 132 is a diagram showing an arrangement example of support pins.

Fig. 133 is a diagram showing the positional relationship between the insertion hole of the lead wire and the inclined surface of the support pin.

Fig. 134 is a diagram showing a method of nailing a lead wire.

FIG. 135 is a diagram showing an operation at the time of mounting a lead component in this embodiment.

Fig. 136 is a diagram showing another example of a wire guide groove.

Fig. 137 is a diagram showing another example of a wire guide groove.

Fig. 138A is a side view showing another example of the parts recognition method.

Fig. 138B is a bottom view showing another example of the parts recognition method.

Fig. 139 is a diagram for explaining correction information obtained by part recognition.

FIG. 140 is a schematic diagram of the upper surface of the component supply device according to this embodiment.

Fig. 141A is a perspective view of a member according to this embodiment.

FIG. 141B is a perspective view of components related to this embodiment.

Fig. 142A is a perspective view of a part of the component supply device according to this embodiment.

Fig. 142B is a perspective view of a part of the component supply device according to this embodiment.

FIG. 143A is a diagram showing how parts are allocated by the allocation unit according to this embodiment.

FIG. 143B is a diagram showing how components are allocated by the allocation unit according to this embodiment.

FIG. 144A is a diagram illustrating how a component is guided by the arch-shaped guide portion according to the present embodiment.

FIG. 144B is a diagram illustrating how a component is guided by the arched guide portion according to the present embodiment.

FIG. 144C is a diagram illustrating how a component is guided by the arch-shaped guide portion according to the present embodiment.

FIG. 144D is a diagram illustrating how a component is guided by the arched guide portion according to the present embodiment.

FIG. 145A is a diagram showing a situation in which the posture of a component is transformed by using the drop portion according to the present embodiment.

FIG. 145B is a diagram showing a state in which the posture of a component is transformed by using the drop portion according to the present embodiment.

FIG. 145C is a diagram showing a state in which the posture of a component is transformed by using the drop portion according to the present embodiment.

FIG. 146A is a diagram showing an example of ONCE measurement for a large component according to this embodiment.

FIG. 146B is a diagram showing an example of ONCE measurement for a large component according to this embodiment.

FIG. 146C is a diagram showing an example of ONCE measurement for a large component according to this embodiment.

FIG. 147A is a diagram showing an example of ONCE measurement for small components according to this embodiment.

FIG. 147B is a diagram showing an example of ONCE measurement for small components according to this embodiment.

FIG. 148 is a flowchart of direction determination processing according to this embodiment.

FIG. 149A is a diagram showing an example of ONCE measurement for leadless components according to this embodiment.

FIG. 149B is a diagram showing an example of ONCE measurement for leadless components according to this embodiment.

FIG. 149C is a diagram showing an example of ONCE measurement for leadless components according to this embodiment.

FIG. 150 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

Fig. 151 is a perspective view showing a schematic configuration of the electronic component mounting device.

FIG. 152 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

Fig. 153 is a perspective view showing a schematic configuration of a mounting head of the electronic component mounting apparatus.

154A is a cross-sectional view showing a schematic configuration of an imaging device of the electronic component mounting device.

154B is a perspective view showing a schematic configuration of an imaging device of the electronic component mounting device.

FIG. 155 is an explanatory diagram showing an example of a design drawing of a substrate on which electronic components are mounted.

Fig. 156 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 157 is an explanatory diagram for explaining the operation of the electronic component mounting device.

Fig. 158 is a flowchart showing an example of the operation of the electronic component mounting device.

FIG. 159A is an explanatory diagram showing an example of electronic components and height measurement positions.

FIG. 159B is an explanatory diagram showing an example of electronic components and height measurement positions.

FIG. 160 is an explanatory diagram for explaining the operation of the electronic component mounting device.

Fig. 161 is a flowchart showing an example of the operation of the electronic component mounting device.

Fig. 162 is a schematic diagram showing a schematic configuration of the electronic component mounting system.

Fig. 163 is a flowchart showing an example of the operation of the electronic component mounting system.

Detailed ways

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by the form (henceforth embodiment) for carrying out the invention mentioned below. In addition, the constituent elements in the following embodiments include elements within the so-called equivalent range, such as elements that can be easily conceived by those skilled in the art, substantially the same elements, and the like. In addition, components disclosed in the following embodiments may be appropriately combined.

Hereinafter, embodiments of the electronic component mounting apparatus and electronic component mounting method according to the present invention will be described in detail based on the drawings. In addition, this invention is not limited by this embodiment. FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting device.

An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8 . The electronic component mounting apparatus 10 has: a housing 11, a substrate conveyance unit 12, component supply units 14f, 14r, a mounting head 15, an XY moving mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, a component storage unit 19, and a control device. 20. An operation unit 40 and a display unit 42. In addition, the XY movement mechanism 16 has an X-axis drive unit 22 and a Y-axis drive unit 24 . Here, as shown in FIG. 1 , the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side of the board conveyance unit 12 , respectively. In the electronic component mounting apparatus 10 , the component supply unit 14 f is arranged on the front side of the electronic component mounting apparatus 10 , and the component supply unit 14 r is arranged on the rear side of the electronic component mounting apparatus 10 . In addition, below, when not distinguishing especially two component supply units 14f and 14r, it is collectively called the component supply unit 14.

2 is a perspective view showing a schematic configuration of a housing of the electronic component mounting device. Fig. 3A is a front view of the frame shown in Fig. 2 . FIG. 3B is a plan view of the frame shown in FIG. 2 . FIG. 3C is a right side view of the frame shown in FIG. 2 . FIG. 3D is a left side view of the frame shown in FIG. 2 . FIG. 3E is a rear view of the frame shown in FIG. 2 . FIG. 4 is an explanatory diagram showing a schematic configuration of a cover of a frame. FIG. 5 is an explanatory diagram showing a schematic configuration of a lock mechanism of a housing. In addition, in FIGS. 3A to 3E , illustration of the component supply units 14 f and 14 r is omitted in order to show the housing 11 more easily.

The housing 11 has a main body 11a and covers 11bf and 11br as shown in FIGS. 3A to 3E . The main body 11 a is a case for accommodating various parts constituting the electronic component mounting apparatus 10 . In the main body 11a, a cover 11bf, an operation unit 40, a display unit 42, a front container 44, and a connector 48 are disposed on the front side, and a cover 11br, a rear container 46, and a connector 49 are formed on the rear side. Two openings 11c are formed on two side surfaces of the main body 11a, and these are used to carry the substrate 8 into and out of the apparatus. The operation unit 40 of this embodiment has a keyboard 40a and a mouse 40b. The display unit 42 of this embodiment has a touch panel 42a and an image monitor 42b. In addition, the touch panel 42 a also becomes a part of the operation unit 40 . The front side container 44 and the rear side container 46 are components which support the component supply units 14f and 14r, respectively. The detailed structures of the front container 44 and the rear container 46 will be described later. The connector 48 is connected to the wiring of each part of the component supply unit 14f described later. Moreover, the connector 49 is connected to the wiring of each part of the components supply unit 14r mentioned later. Here, as the wiring, there are wiring for transmitting electrical signals and piping for supplying air.

Next, the covers 11bf and 11br will be described. In addition, the covers 11bf and 11br differ only in that the arrangement positions are on the front side and the rear side, but have the same structure. Hereinafter, when not distinguishing in particular, it calls it the cover 11b, and demonstrates. The cover 11bf is a panel provided on a part of the front side of the main body 11a, and is arranged on the upper side in the vertical direction. The cover 11br is a shroud provided on a part of the rear side of the main body 11a, and is arranged on the upper side in the vertical direction. The cover 11b has a shape covering a part of the front or back and a part of the upper surface of the main body 11a, and has an L-shaped cross section. The cover 11b can be opened and closed with respect to the main body 11a, as shown in FIG. By making the cover 11b into an open state, it is possible to work on each part arranged inside the main body 11a. The front end of the upper surface of the cover 11b is connected to the main body 11a, and turns around the connection part as a fulcrum. In addition, the cover 11b is supported by the cover support part 11d. The cover support portion 11d is a stretchable rod-shaped member, one end thereof is connected to the main body 11a, and the other end thereof is connected to the cover 11b. The cover support part 11d expands and contracts according to opening and closing of the cover 11b. Moreover, the cover support part 11d is provided with the lock mechanism 11e which locks expansion-contraction of the cover support part 11d. The lock mechanism 11e makes the cover support part 11d into a non-stretchable state by being in a locked state, and makes the cover support part 11d a stretchable state by being in an unlocked state. When the lock mechanism 11e is in the locked state, the cover 11b is fixed at the current position. Thereby, the cover 11b in an open state can be suppressed from being closed by its own weight.

Returning to FIG. 1 , the description of the electronic component mounting apparatus 10 will be continued. The structure of the substrate 8 is not particularly limited as long as it is a component for mounting electronic components. The substrate 8 of this embodiment is a plate-shaped member, and a wiring pattern is provided on the surface. On the surface of the wiring pattern provided on the substrate 8 , solder is attached as a joining member for joining the wiring pattern of the plate-like member and the electronic component by reflow. In addition, through-holes (insertion holes, substrate holes) for inserting electronic components are also formed on the substrate 8 .

The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate conveyance unit 12 includes: a guide rail extending in the X-axis direction; and a conveyance mechanism that supports the substrate 8 and moves the substrate 8 along the guide rail. The substrate conveyance unit 12 conveys the substrate 8 in the X-axis direction by moving the substrate 8 along the rails by a conveyance mechanism in such a direction that the surface to be mounted of the substrate 8 faces the mounting head 15 . The board|substrate conveyance part 12 conveys the board|substrate 8 supplied by the equipment supplied to the electronic component mounting apparatus 10, to a predetermined position on the rail. The mounting head 15 mounts the electronic component on the surface of the substrate 8 at the above predetermined position. The substrate conveyance part 12 conveys the board|substrate 8 to the apparatus which performs a next process after mounting electronic components on the board|substrate 8 conveyed to the said predetermined position. In addition, various configurations can be used as the transport mechanism of the substrate transport unit 12 . For example, it is possible to use a conveyor-type conveyance mechanism that integrates the conveyance mechanism. In this conveyance mechanism, a guide rail arranged along the conveyance direction of the substrate 8 is combined with an endless belt rotating along the above-mentioned guide rail, and the substrate 8 is mounted on the conveyor belt. It is conveyed in the state on the above-mentioned endless belt.

FIG. 6 is a schematic diagram showing a schematic configuration of an electronic component mounting device. Fig. 7 is a schematic diagram showing a schematic configuration of the front container. Fig. 8 is a schematic diagram showing a schematic configuration of the rear container. In the electronic component mounting apparatus 10, as shown in FIG. 6, a component supply unit 14f is arranged on the front side, and a component supply unit 14r is arranged on the rear side. The component supply unit 14f on the front side and the component supply unit 14r on the rear side each have an electronic component supply device, which holds a plurality of electronic components mounted on the substrate 8, and can supply to the mounting head 15 as shown in FIG. The electronic component can be supplied to the holding position in a state held (attracted or gripped) by the mounting head 15 . The component supply units 14f and 14r of the present embodiment both supply lead type electronic components having a main body and lead wires connected to the main body.

The component supply unit 14f on the front side has two bowl feeder units 90 . The bowl feeder unit 90 has a plurality of component supply devices serving as bowl feeders, and electronic components are supplied from each component supply device to a holding position (attraction position, grip position). The electronic components supplied to the holding positions by the respective component supply devices are mounted on the substrate 8 by the mounting head 15 . The bowl feeder unit 90 will be described later.

The two bowl feeder units 90 of the component supply unit 14 f are installed on the front side container 44 . As shown in FIG. 7, the front side container 44 has the support plate 44a. The support plate 44a is fixed at a predetermined position inside the main body 11a by bolts or the like. The support plate 44a supports the two bowl feeder units 90 . The positioning shaft 44b is arranged at the end portion of the support plate 44a on the side of the substrate transport unit 12 . The positioning shaft 44b supports the bowl feeder assembly 90 and positions the bowl feeder assembly 90 . In addition, two concave portions 44c are formed on the end portion of the support plate 44a on the side opposite to the substrate transport unit 12 side. The recesses 44c also allow a part of the bowl feeder assembly 90 to be inserted, and the bowl feeder assembly 90 is positioned.

The component supply unit 14 r on the rear side has a plurality of electronic component supply devices (hereinafter simply referred to as “component supply devices”) 100 . The electronic component supply apparatus 100 is a radial feeder, and supplies electronic components to holding positions (suction position, grip position). The electronic components supplied to the holding positions by the respective component supply devices 100 are mounted on the substrate 8 by the mounting head 15 .

The component supply apparatus 100 supplies radial lead type electronic components to the mounting head 15 using an electronic component holding tape in which leads of a plurality of radial lead type electronic components are pasted on the holding tape. The component supply device 100 is a holding tape feeder that holds the electronic component holding tape, conveys the held electronic component holding tape, and moves the held radial lead type electronic component to the suction nozzle where the mounting head 15 can be used. Holding area (suction position, holding position, holding position) for holding electronic components. The component supply apparatus 100 cuts and separates the lead wires of the radial lead type electronic components that have moved to the holding area, so that the radial lead type electronic components whose leads are fixed by the holding belt can be held at predetermined positions. The radial lead type electronic component is held (adsorbed, held) by the suction nozzle of the mounting head 15 . The components supply device 100 will be described later. In addition, the plurality of component supply apparatuses 100 may supply electronic components of different types, respectively, or may supply multiple types of electronic components.

A plurality of electronic component supply devices 100 are installed on the rear side container 46 . The rear container 46 is a mechanism for supporting a plurality of electronic component supply devices 100, and as shown in FIG. 46e. The first fixing plate 46a is a plate-shaped member extending on the ZX plane, and has holes formed in a row along the X direction. The holes are holes into which protrusions formed on the electronic component supply apparatus 100 can be inserted. The first fixing plate 46 a positions the electronic component supply apparatus 100 by inserting protrusions formed on the electronic component supply apparatus 100 into the holes. The second fixing plate 46 b is a plate-shaped member arranged on the lower surface in the vertical direction, that is, the surface supporting the electronic component supply device 100 . The second fixing plate 46 b is formed with irregularities on the end surface on the side away from the substrate transfer unit 12 . The second fixing plate 46 b positions the electronic component supply apparatus 100 by inserting protrusions formed on the electronic component supply apparatus 100 into the unevenness. The lock shaft 46c is arranged on a side farther from the substrate transfer unit 12 than the second fixing plate 46b. The locking shaft 46c is clamped by the clamping unit 112 of the electronic component supply device 100 to support and position the electronic component supply device 100 . The driving cylinder 46d is a piston that can protrude upward in the vertical direction, and conveys the electronic component to the holding position of the electronic component supply device 100 by pressing a predetermined position of the electronic component supply device 100 provided at the corresponding position. The position label 46e is a guide mark that can recognize the position of the container in the rear side container 46 by visual inspection. The operator can install the electronic component supply apparatus 100 at a desired position by installing the electronic component supply apparatus 100 at a predetermined position by checking the position label 46e.

FIG. 9 is a schematic diagram showing a schematic configuration of another example of a rear-side component supply unit. The component supply unit 14 may also have the following electronic component supply device 100a on the basis of mounting a plurality of the following electronic component supply devices 100, wherein the electronic component supply device 100 mounts a plurality of radial lead type electronic components ( Radial component) The electronic component holding tape (radial component holding tape) formed by fixing to the holding tape main body, the lead wire of the lead type electronic component held by the electronic component holding tape is cut at the holding position (second holding position), However, the lead-type electronic components at the holding position can be held by using the suction nozzles or holding suction nozzles on the mounting head. The formed electronic component holding tape (chip component holding tape) is peeled off from the main body of the holding tape at the holding position (the first holding position) to hold the mounted electronic component held by the electronic component holding tape. or hold the suction nozzle to hold the mounted electronic component at the holding position. In the component supply unit 14 , a rod feeder or a tray feeder may be provided on the rear side container 46 as another electronic component supply device 100 a. The plurality of component supply devices 100 , 100 a shown in FIG. 9 are held on a support stand (receptacle) 102 . The support stand 102 has the same structure as the above-mentioned rear container 46 . In addition, the support stand 102 may mount a measurement device or a camera in addition to the component supply apparatuses 100 and 100a.

In the component supply unit 14, a plurality of component supply devices 100, 100a held on the support table 102, a plurality of types of component supply devices 100, 100a having different types of electronic components to be mounted, mechanisms for holding electronic components, or supply mechanisms constitute. In addition, the component supply unit 14 may have a plurality of components supply devices 100 and 100a of the same type. In addition, it is preferable that the component supply unit 14 has a detachable structure with respect to the apparatus main body.

The electronic component supply apparatus 100 a supplies electronic components to the mounting head 15 using an electronic component holding tape configured by bonding chip-type electronic components to be mounted on a substrate on the holding tape. In addition, the electronic component holding tape forms a plurality of storage chambers on the holding tape, and electronic components are stored in the storage chambers. The electronic component supply device 100a is a holding tape feeder that holds the electronic component holding tape, conveys the held electronic component holding tape, and moves the storage chamber to the point where the electronic component can be sucked by the suction nozzle of the mounting head 15. the holding area. Furthermore, by moving the storage chamber to the holding area, the electronic component housed in the storage chamber can be exposed at a predetermined position, and the electronic component can be sucked and held by the suction nozzle of the mounting head 15 . The electronic component supply apparatus 100a is not limited to a holding tape feeder, and various chip component feeders that supply chip-type electronic components can be employed. As the chip component feeder, for example, a rod feeder, a holding tape feeder, and a bulk feeder can be used.

The mounting head 15 uses suction nozzles to hold the electronic components held on the component supply unit 14f (lead-type electronic components held by the bowl feeder unit) or the electronic components held on the component supply unit 14r (supplied by the electronic component supply apparatus 100). The held radial lead type electronic component (lead type electronic component, plug-in type electronic component) is held (adsorbed or held), and the held electronic component is moved to the substrate 8 to a predetermined position by the substrate transfer unit 12. Install. Moreover, the mounting head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 100 a on the substrate 8 when the component supply unit 14 r has the electronic component supply device 100 a. In addition, the structure of the mounting head 15 will be described later. In addition, a chip-type electronic component (mount-type electronic component) is a leadless electronic component that does not have leads inserted into insertion holes (through holes) formed on a substrate. As the mount-type electronic component, SOP, QFP, etc. are illustrated as mentioned above. When the chip-type electronic component is mounted on the substrate, it is not necessary to insert the lead wires into the insertion holes.

The XY moving mechanism 16 is a moving mechanism that moves the mounting head 15 along the X-axis direction and the Y-axis direction in FIGS. drive part 24. The X-axis driving unit 22 is connected to the mounting head 15 and moves the mounting head 15 in the X-axis direction. The Y-axis driving unit 24 is connected to the mounting head 15 via the X-axis driving unit 22 , and moves the mounting head 15 in the Y-axis direction by moving the X-axis driving unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the mounting head 15 to a position facing the substrate 8 or to a position facing the component supply units 14 f and 14 r by moving the mounting head 15 in the XY axis direction. In addition, the XY moving mechanism 16 adjusts the relative position between the mounting head 15 and the substrate 8 by moving the mounting head 15 . Thereby, the electronic component held by the mounting head 15 can be moved to an arbitrary position on the surface of the substrate 8 , and the electronic component can be mounted on an arbitrary position on the surface of the substrate 8 . That is, the XY moving mechanism 16 moves the mounting head 15 on the horizontal plane (XY plane), and moves the electronic components in the electronic component supply device located in the component supply units 14f and 14r to predetermined positions (mounting positions, mounting positions) on the substrate 8 . Delivery unit for delivery. In addition, various mechanisms for moving the mounting head 15 in a predetermined direction can be used as the X-axis drive unit 22 . Various mechanisms for moving the X-axis drive unit 22 in a predetermined direction can be used as the Y-axis drive unit 24 . As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack and pinion, a conveyance mechanism using a ball screw, a conveyance mechanism using a conveyor belt, or the like can be used.

The VCS unit 17, the replacement suction nozzle holding mechanism 18, and the component storage unit 19 are arranged at positions overlapping with the movable area of the mounting head 15 in the XY plane, and are closer to the lead than the mounting head 15 in the Z direction. at the lower side of the vertical direction. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are arranged adjacently between the substrate transport unit 12 and the component supply unit 14r.

The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and has a camera for imaging the vicinity of the suction nozzle of the mounting head 15 and an illumination unit for illuminating the imaging area. The VCS unit 17 recognizes the shape of the electronic component picked up by the suction nozzle of the mounting head 15 and the holding state of the electronic component held by the suction nozzle. More specifically, when the mounting head 15 is moved to a position facing the VCS unit 17, the VCS unit 17 photographs the suction nozzle of the mounting head 15 from the vertically lower side, and analyzes the photographed image, thereby The shape of the electronic component picked up by the suction nozzle and the holding state of the electronic component held by the suction nozzle are recognized. The VCS unit 17 transmits the obtained information to the control device 20 .

The replacement nozzle holding mechanism 18 is a mechanism for holding various types of nozzles. The replacement nozzle holding mechanism 18 holds various types of nozzles in a state where the mounting head 15 can be detached and replaced. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds: a suction nozzle that holds the electronic component by suction; and a grip nozzle that holds the electronic component by gripping. The mounting head 15 can hold the electronic component to be held under an appropriate condition (suction or grip) by changing the nozzle to be mounted by replacing the nozzle holding mechanism 18, and supplying air pressure to the mounted nozzle to drive it. .

The component storage unit 19 is a box for storing electronic components held by the mounting head 15 using suction nozzles and not mounted on the substrate 8 . That is, in the electronic component mounting apparatus 10, it becomes a waste box which discards the electronic component which is not mounted on the board|substrate 8. As shown in FIG. The electronic component mounting apparatus 10 moves the mounting head 15 to a position facing the component storage part 19 when there is an electronic component not to be mounted on the substrate 8 among the electronic components held by the mounting head 15, and the held electronic components release, and the electronic component is put into the component storage part 19 .

The control device 20 controls each part of the electronic component mounting device 10 . The control device 20 is an aggregate of various control units. The operation unit 40 is an input device for an operator to input an operation, and has a keyboard 40a, a mouse 40b, and a touch panel 42a. The operation unit 40 transmits various detected inputs to the control device 20 . The display part 42 is a screen which displays various information to an operator, and has a touch panel 42a and an image monitor 42b. The display unit 42 displays various images on the touch panel 42 a and the image monitor 42 b based on image signals input from the control device 20 .

In addition, although the electronic component mounting apparatus 10 of this embodiment provided one mounting head, you may provide two mounting heads corresponding to each of component supply units 14f and 14r. In this case, two X-axis drive units are provided, and by moving the two mounting heads in the XY direction, the two mounting heads can be independently moved. The electronic component mounting apparatus 10 can alternately mount electronic components on one substrate 8 by having two mounting heads. As described above, by alternately mounting electronic components with the two mounting heads, while one mounting head is mounting the electronic components on the substrate 8, the other mounting head can hold the electronic components in the component supply apparatus. Thereby, the time during which electronic components are not mounted on the substrate 8 can be further shortened, and the electronic components can be mounted efficiently. Moreover, it is also preferable that the electronic component mounting apparatus 10 arranges two board|substrate conveyance parts 12 in parallel. If the electronic component mounting apparatus 10 uses the two substrate transfer units 12 to alternately move the two substrates to the electronic component mounting position, and alternately performs component mounting using the above-mentioned two mounting heads 15, the electronic components can be mounted on the substrate more efficiently. .

Next, the configuration of the mounting head 15 will be described using FIGS. 10 and 11 . 10 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus. 11 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus. In addition, in FIG. 10, various control parts which control the electronic component mounting apparatus 10, and one component supply apparatus 100 of the component supply unit 14r are shown together. As shown in FIGS. 10 and 11, the mounting head 15 has a mounting head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection portion) 37, and a laser recognition device (component state detection portion, state detection unit). Department) 38.

As shown in FIG. 10 , the electronic component mounting apparatus 10 includes a control unit 60 , a mounting head control unit 62 , and a component supply control unit 64 . The control unit 60 , the mounting head control unit 62 , and the component supply control unit 64 are part of the above-mentioned control device 20 . In addition, the electronic component mounting apparatus 10 is connected to a power source, and uses the control unit 60 , the mounting head control unit 62 , the component supply control unit 64 and various circuits to supply electric power supplied from the power source to each part. The control unit 60 , the mounting head control unit 62 , and the component supply control unit 64 will be described later.

In the electronic component supply apparatus 100 , the main body of the electronic component 80 whose leads are held on the electronic component holding tape (radial component holding tape) is exposed upward. In addition, an aluminum electrolytic capacitor is illustrated as the electronic component 80 . In addition, as the electronic component 80 , various electronic components with leads can be used in addition to the aluminum electrolytic capacitor. The electronic component supply apparatus 100 moves the electronic component 80 held on the electronic component holding tape to the holding area (adsorption area, grip area) by pulling out and moving the electronic component holding tape. In this embodiment, the vicinity of the front end in the Y-axis direction of the component supply apparatus 100 serves as a holding area where the suction nozzles of the mounting head 15 hold the electronic component 80 held on the electronic component holding tape. The configuration of the electronic component supply apparatus 100 will be described later. In addition, similarly to the case of the electronic component supply apparatus 100 a , the predetermined position is a holding area where the electronic component 80 held by the electronic component holding tape is held by the suction nozzle of the mounting head 15 .

The mounting head main body 30 has a mounting head support body 31 supporting each part, a plurality of suction nozzles 32 , and a suction nozzle drive unit 34 . In the mounting head main body 30 of this embodiment, as shown in FIG. 11 , six suction nozzles 32 are arranged in a row. Six suction nozzles 32 are arranged in a direction parallel to the X axis. In addition, the suction nozzle 32 shown in FIG. 11 is equipped with the suction nozzle which suctions and holds an electronic component.

The mounting head support body 31 is a support member connected to the X-axis drive unit 22 and supports the suction nozzle 32 and the suction nozzle drive unit 34 . In addition, the mounting head support body 31 also supports the laser recognition device 38 .

The suction nozzle 32 is a suction mechanism for suctioning and holding the electronic component 80 . The suction nozzle 32 has an opening 33 at the front end, and by sucking air from the opening 33 , the electronic component 80 is sucked and held at the front end. Moreover, the suction nozzle 32 has the shaft 32a connected to the front-end|tip part in which the opening 33 was formed, and the electronic component 80 is suctioned. The shaft 32a is a rod-shaped member that supports the front end, and is arranged to extend in the Z-axis direction. The shaft 32a is provided with an air tube connecting the opening 33 and the suction mechanism of the suction nozzle drive unit 34 inside.

The suction nozzle drive unit 34 moves the suction nozzle 32 in the Z-axis direction, and suctions the electronic component 80 through the opening 33 of the suction nozzle 32 . Here, the Z axis is an axis orthogonal to the XY plane. In addition, the Z axis is a direction perpendicular to the surface of the substrate. In addition, the suction nozzle drive unit 34 rotates the suction nozzle 32 in the θ direction at the time of electronic component mounting or the like. The θ direction is a direction parallel to the circumferential direction of a circle centered on the Z-axis, where the Z-axis is an axis parallel to the direction in which the Z-axis driving unit moves the suction nozzle 32 . In addition, the θ direction becomes the rotation direction of the suction nozzle 32 .

In the nozzle driving unit 34 , as a mechanism for moving the nozzle 32 in the Z-axis direction, there is, for example, a mechanism including a linear motor whose driving direction is the Z-axis direction. The nozzle driving unit 34 moves the opening 33 at the tip of the nozzle 32 in the Z-axis direction by moving the shaft 32 a of the nozzle 32 in the Z-axis direction by a linear motor. In addition, in the suction nozzle drive unit 34 , as a mechanism for rotating the suction nozzle 32 in the θ direction, for example, there is a mechanism including a motor and a transmission element connected to the shaft 32 a. The suction nozzle drive unit 34 transmits the driving force output from the motor to the shaft 32a through the transmission element, and rotates the shaft 32a in the θ direction, whereby the tip portion of the suction nozzle 32 also rotates in the θ direction.

In the suction nozzle drive unit 34, as a mechanism for suctioning the electronic component 80 through the opening 33 of the suction nozzle 32, that is, a suction mechanism, there is, for example, a mechanism having the following components: an air tube connected to the opening 33 of the suction nozzle 32; A pump is connected to the air pipe; and a solenoid valve switches the opening and closing of the air pipe. The suction nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether or not to suck air from the opening 33 by switching the solenoid valve on and off. The suction nozzle driver 34 sucks air from the opening 33 by opening the solenoid valve, so that the opening 33 sucks (holds) the electronic component 80 , and closes the solenoid valve so that the opening 33 does not suck air, so that the electronic component adsorbed on the opening 33 80 is released, that is, it becomes a state where the electronic component 80 is not attracted by the opening 33 (a state where it is not held).

Moreover, when the mounting head 15 of this embodiment holds the main body of an electronic component, when the upper surface of a main body is in the shape which cannot be sucked by the suction nozzle 33, the grip suction nozzle mentioned later is used. The holding suction nozzle sucks and releases air similarly to the suction nozzle, thereby opening and closing the movable piece with respect to the fixed piece, whereby the main body of the electronic component can be held and released from above. In addition, the mounting head 15 can replace the nozzles driven by the nozzle driving unit 34 by performing the replacement operation by moving the nozzles 32 by the nozzle driving unit 34 .

The imaging device 36 is fixed to the head support body 31 of the head body 30 , and takes an image of a region facing the head 15 , for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and a lighting device, and obtains an image using the camera while illuminating the field of view with the lighting device. Thereby, images of positions facing the head main body 30 , for example, various images of the substrate 8 or the component supply unit 14 can be captured. For example, the imaging device 36 captures an image of a BOC mark (hereinafter abbreviated as BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8 . Here, when a fiducial mark other than the BOC mark is used, an image of the fiducial mark is captured.

The height sensor 37 is fixed on the head support body 31 of the head body 30 , and measures the distance between the head 15 and an opposing area, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. As the height sensor 37, a laser sensor can be used. This laser sensor has: a light-emitting element that emits laser light; Measure the distance to the opposite part. In addition, the height sensor 37 detects the height of the facing part, specifically, the electronic component, by processing the distance to the facing part using its own position and the board position at the time of measurement. In addition, the process of detecting the height of an electronic component based on the measurement result of the distance with respect to an electronic component may be performed by the control part 60.

The laser recognition device 38 has a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50 . As shown in FIG. 10 , the bracket 50 is connected to the lower side of the head support body 31 , the substrate 8 and the component supply device 100 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating laser light on the electronic component 80 sucked by the suction nozzle 32 of the head main body 30 . Here, the state of the electronic component 80 refers to the shape of the electronic component 80 , whether or not the electronic component 80 is sucked in a correct posture by the suction nozzle 32 , and the like. The light source 38a is a light emitting element that outputs laser light. The position in the Z-axis direction of the light receiving element 38b is arranged at a position facing the light source 38a, that is, at a position having the same height. The shape recognition processing by the laser recognition device 38 will be described later.

Next, the control function of the device configuration of the electronic component mounting device 10 will be described. As shown in FIG. 10 , the electronic component mounting apparatus 10 includes a control unit 60 , a mounting head control unit 62 , and a component supply control unit 64 as the control device 20 . Each of the various control units is composed of a CPU, ROM, RAM, and other components having arithmetic processing functions and storage functions. In addition, in this embodiment, a plurality of control units are provided for convenience of explanation, but one control unit may be provided. In addition, when realizing the control function of the electronic component mounting apparatus 10 by one control part, it may realize it by one computing device, and may realize it by several computing devices.

The control unit 60 is connected to each part of the electronic component mounting apparatus 10, and executes a stored program based on an input operation signal and information detected in each part of the electronic component mounting apparatus 10 to control the operation of each part. The control unit 60 controls, for example, the conveying operation of the substrate 8 , the driving operation of the mounting head 15 by the XY moving mechanism 16 , the shape detection operation by the laser recognition device 38 , and the like. In addition, the control unit 60 sends various instructions to the mounting head control unit 62 as described above, and controls the control operation of the mounting head control unit 62 . The control unit 60 also controls the control operations of the mounting head control unit 62 and the component supply control unit 64 .

The head control unit 62 is connected to the nozzle drive unit 34 , various sensors disposed on the head support 31 , and the control unit 60 to control the nozzle drive unit 34 and the operation of the nozzle 32 . The mounting head control unit 62 controls the suction (holding)/release operation of the electronic components by the suction nozzles 32 and the rotation operation of each suction nozzle 32 based on the operation instructions supplied from the control unit 60 and the detection results of various sensors (such as distance sensors). , Z-axis movement control.

The component supply control part 64 controls the supply operation|movement of the electronic component 80 by the component supply means 14f, 14r. The component supply control unit 64 may be provided separately in the component supply device 100 and the bowl feeder unit 400 , or all the component supply device 100 and the bowl feeder unit 400 may be controlled by one component supply control unit 64 . For example, the component supply control unit 64 controls the drawing operation of the electronic component holding tape, the cutting operation of the lead wire, and the holding operation of the radial lead type electronic component performed by the component supply device 100 . In addition, the component supply control unit 64 controls the component supply operation performed by the bowl feeder unit 400 . In addition, when the component supply unit 14f has the component supply device 100a, the component supply control unit 64 controls the pulling-out operation of the electronic component holding tape by the component supply device 100a. The component supply control unit 64 executes various operations based on instructions from the control unit 60 . The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the pulling operation of the electronic component holding tape or the electronic component holding tape.

Next, the component supply apparatus 100 will be described using FIGS. 12 to 24 . The component supply device 100 is a radial feeder that supplies radial lead type electronic components to holding positions as described above. First, the electronic component holding tape will be described using FIGS. 12 and 13 . FIG. 12 is a schematic diagram showing a schematic configuration of an example of an electronic component holding tape. Fig. 13 is a schematic diagram showing another schematic configuration example of the electronic component holding tape.

The electronic component holding tape (radial component holding tape) 70 shown in FIG. 12 has: a holding tape main body 72; 72 on. The holding belt body 72 is formed by laminating a first holding belt 74 and a second holding belt 76 narrower than the first holding belt 74 . In addition, the holding belt main body 72 is formed with holes 78 as feed holes at regular intervals in the extending direction. That is, the holding belt main body 72 has a plurality of holes 78 formed in a row along the extending direction.

The electronic component 80 has: an electronic component main body (hereinafter simply referred to as “main body”) 82 ; and two lead wires 84 arranged along the radial direction of the main body 82 . The lead wire 84 of the electronic component 80 is clamped and fixed between the 1st holding tape 74 and the 2nd holding tape 76. As shown in FIG. Thus, the electronic component 80 is fixed at a predetermined position of the holding tape main body 72 by pinching and fixing the lead wire 84 between the first holding tape 74 and the second holding tape 76 . In addition, the plurality of electronic components 80 are fixed to positions where the holes 78 are formed in the holding tape main body 72 by disposing the holes 78 between the two lead wires 84 . That is, the electronic components 80 are arranged at the same positions as the positions in the extending direction of the holding tape at intervals of the same feed pitch P as the holes 78 . The electronic component 80 is only required to have a lead pinched between the first holding tape 74 and the second holding tape 76 of the holding tape main body 72 , and the shape and type of the lead wire and the main body are not particularly limited.

Next, an electronic component holding tape 70 a shown in FIG. 13 has: a holding tape main body 72 ; and a plurality of electronic components (radial lead type electronic components) 80 held on the holding tape main body 72 . In addition, the electronic component holding tape 70 a differs only in the relative positional relationship between the electronic component 80 and the hole 78 , and is the same as the electronic component holding tape 70 in other configurations. The electronic component holding tape 70 a arranges two lead wires 84 of the electronic component 80 between the hole 78 and the hole 78 of the holding tape main body 72 . That is, the electronic components 80 are arranged at the same pitch as the feeding pitch P of the holes 78 , and their positions in the extending direction of the holding tape are shifted by half of the arrangement interval. That is, the electronic component 80 is arranged at a position shifted by half the pitch from the hole 78 .

As shown in FIGS. 12 and 13 , the electronic component holding tape has different types in which the relative positional relationship between the hole 78 and the electronic component 80 in the extending direction of the holding tape is different.

Next, FIG. 14 is a perspective view showing a schematic configuration of the electronic component supply device of the component supply unit on the rear side. Fig. 15 is a perspective view of the electronic component supply device shown in Fig. 14 viewed from a different direction from Fig. 14 . 16 is an explanatory diagram showing a schematic configuration of an electronic component supply device of a component supply unit. As shown in FIGS. 14 to 16 , the electronic component supply device 100 has: a frame body 110 that holds other parts and guides the electronic component holding tape; a clamping unit 112 that is connected to the rear container 46; The feeder unit 114 conveys the electronic component holding tape; the cutting unit 116 cuts off the leads of the electronic components held in the electronic component holding tape; And the air pressure of the driving part of the cutting unit 116 is adjusted to control the driving of each part.

The frame body 110 is a vertically elongated hollow box, and holds the clamping unit 112 , the feeder unit 114 , the cutting unit 116 , and the air pressure regulator 118 inside. The frame body 110 is provided with a guide groove 120 , a guide part 122 , a discharge part 126 , a grip part 128 and a protruding part 129 . The guide groove 120 has a shape that connects one side ends of two straight lines formed along the longitudinal direction of the vertically upper elongated surface of the frame body 110 . That is, the guide groove 120 is formed in a U-shape extending from one end of the frame body 110 to the vicinity of the other end, turning back near the other end, and extending to the one end. The guide groove 120 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end portion (end portion on the supply side) of the U-shape. The guide groove 120 moves the supplied electronic component holding tape along the U-shape, and is discharged from one end of the U-shape (the end on the discharge side). In addition, the guide groove 120 guides the electronic component holding tape in a state where the holding tape main body 72 is located inside the housing 110 and the electronic components are exposed to the outside of the housing 110 .

The guide portion 122 is connected to the supply-side end portion of the guide groove 120 , and guides the electronic component holding tape holding the electronic component toward the guide groove 120 . The ejection unit 126 is connected to the end of the guide groove 120 on the ejection side, and ejects the portion of the electronic component that has moved in the housing 110 and supplied the electronic component to the mounting head 15 from the electronic component holding tape. The grip portion 128 is a portion that is gripped by an operator when the electronic component supply apparatus 100 is conveyed. The boss portion 129 is a protrusion inserted into the hole of the first fixing plate 46 a of the above-mentioned rear side container 46 .

Next, on the basis of FIGS. 14 to 16 , the holding unit will be described using FIG. 17 . Here, FIG. 17 is an explanatory diagram showing a schematic configuration of a holding unit of the electronic component supply apparatus. The holding unit 112 is a mechanism connected to the rear container 46 . The clamping unit 112 has a connecting part 132 , a transmission part 134 , an elastic part 136 and a rod 138 .

The connecting portion 132 is a portion that contacts the rear container 46 when it is connected to the rear container 46 , and is exposed to the outside of the housing 110 . In addition, the connecting portion 132 is arranged on the surface of the housing 110 opposite to the surface on which the guide groove 120 is formed. The coupling portion 132 is provided with an engaging portion 133 at the end portion on the lower side in the vertical direction. The engaging portion 133 is connected to the lock shaft 46 c of the rear container 46 . The transmission part 134 is connected to the engaging part 133 , the elastic part 136 , and the rod 138 of the connecting part 132 , and transmits the force applied from the rod 138 and the elastic part 136 to the connecting part 132 . One end of the elastic part 136 is fixed on the frame body 110 , and the other end is fixed on the transmission part 134 . The elastic part 136 is a member such as a spring, and applies force to the transmission part 134 to stretch it toward the side fixed to the frame body 110 . Thereby, the transmission part 134 will be in the state where the part connected with the elastic part 136 is stretched in a predetermined direction. One end of the rod 138 is exposed to the outside of the housing 110 , and the other end is connected to the transmission unit 134 . The fixed shaft 139 of the rod 138 is fixed on the frame body 110 . Accordingly, when the operator operates the end portion of the lever 138 exposed to the outside of the housing 110 , the end portion connected to the transmission unit 134 moves around the fixed shaft 139 . Thereby, the transmission part 134 is moved, a predetermined force acts on the connection part 132, and the engaging part 133 is operated. The clamping unit 112 has the above-mentioned structure, and when the operator operates the lever 138, the engaging portion 133 is connected to the locking shaft 46c of the rear container 46 and fixed to the rear container 46, and the engaging portion 133 is switched between the released state without being connected to the lock shaft 46c.

Next, the feeder unit will be described using FIGS. 18 to 21 on the basis of FIGS. 14 to 16 . Here, FIG. 18 is an explanatory diagram showing a schematic configuration of a feeder unit of the electronic component supply apparatus. Fig. 19 is an explanatory diagram showing a schematic configuration of a front end support portion of the feeder unit. Fig. 20 is an explanatory diagram showing a schematic configuration of a holding tape feed claw unit of the feeder unit. Fig. 21 is an explanatory diagram for explaining the operation of the feeder unit. The feeder unit 114 is a mechanism that conveys the electronic component holding tape, that is, moves the electronic component holding tape guided along the guide groove 120 . The feeder unit 114 has a support portion 142 , a drive portion 144 , a front end support portion 146 , and a holding tape feeding claw unit 148 . In addition, in the present embodiment, the front end support portion 146 and the holding tape feed claw unit 148 serve as a position adjustment mechanism for adjusting the relative position between the holding tape feed claw unit 148 and the housing 110 .

The supporting part 142 is a member fixed to the frame body 110 and supports the driving part 144 . The driving part 144 has a fixed part 144a and a movable part 144b. The driving unit 144 is an air cylinder that expands and contracts the portion of the movable unit 144b exposed from the fixed unit 144a by air pressure. The driving part 144 reciprocates the tip of the movable part 144 b within a predetermined distance range in the extending direction of the linear part of the guide groove 120 at least corresponding to the feeding pitch. That is, the driving part 144 reciprocates the front end of the movable part 144b by at least a distance corresponding to the feeding pitch P of the holding belt. The front end support portion 146 is fixed to the front end of the movable portion 144 b of the driving portion 144 . The front-end support part 146 reciprocates integrally with the reciprocating movement of the movable part 144b. In addition, as shown in FIG. 19 , the front end support portion 146 is an upper surface in the vertical direction, and has four screw holes 149 a , 149 b , 149 c , and 149 d at the portion connected to the holding belt feed claw unit 148 . . These four screw holes 149a, 149b, 149c, and 149d are formed at four locations where the positions in the feeding direction of the holding tape are different. Here, the distance between the screw hole 149 a and the screw hole 149 b of the front end support portion 146 is half the distance P of the above-mentioned pitch P of the holes 78 of the holding belt main body 72 . That is, the screw holes 149 a and the screw holes 149 b are formed at positions shifted by a half pitch of the arrangement interval of the holes 78 . In addition, in the front end support portion 146 , the distance between the screw hole 149 c and the screw hole 149 d is half the distance P of the above-mentioned pitch P of the holes 78 holding the belt main body 72 . That is, the screw holes 149c and the screw holes 149d are formed at positions shifted by a half pitch of the arrangement interval of the holes 78 .

The holding tape feed claw unit 148 is fixed on the front end support portion 146 . The holding tape feed claw unit 148 has a mount 150 , a feed claw 152 , a pin 154 , and a spring 156 . The mount 150 is a base that supports the feed claw 152 , the pin 154 , and the spring 156 . The mounting table 150 has a bent plate shape with an L-shaped cross section perpendicular to the feeding direction of the holding belt, and a part of the upper side in the vertical direction is exposed from the frame body 110 . A grip portion 158 that can be gripped by an operator is provided in the exposed portion of the mounting table 150 . The operator can move the holding tape feeding claw unit 148 in the holding tape feeding direction by gripping and operating the holding portion 158 as necessary. The mounting table 150 is a member connected to the front end support portion 146 and is fixed to the front end support portion 146 by two fixing screws 159 . Here, in the mounting table 150, the distance between the holes into which the two fixing screws 159 are inserted is the same as the distance between the screw hole 149a and the screw hole 149c and the distance between the screw hole 149b and the screw hole 149d. That is, the front end support portion 146 has a plurality of sets of screw holes at different positions in the holding tape feeding direction at the same pitch as the fixing screws 159 inserted into the mounting table 150 of the holding tape feeding claw unit 148 . Thus, by switching the screw holes for inserting the fixing screws 159 in the mounting table 150 , the relative position between the mounting table 150 and the front end support portion 146 can be shifted by half of the pitch.

The feed claw 152 is a member having a convex portion 152a protruding from one end portion of a rod-shaped member. The feed claw 152 is arranged at a position facing the hole of the holding tape main body 72 of the electronic component holding tape (hereinafter simply referred to as "holding tape") 70, and the shape of the protrusion 152a is such that it is in the feeding direction of the holding tape feeding direction. The surface 152b on the downstream side becomes a surface perpendicular to the feeding direction, and the surface 152c on the upstream side in the feeding direction of the holding belt feeding direction becomes a surface inclined with respect to the surface orthogonal to the feeding direction. 70 to narrow the width in the feed direction. When the feed claw 152 has the hole 78 at a position facing the convex portion 152a, the convex portion 152a is inserted into the hole 78 as shown in FIG. 20 . The pin 154 rotatably supports the end portion of the feed claw 152 on the side where the convex portion 152 a is not formed in a direction parallel to the paper surface. One end of the spring 156 is fixed to the protruding surface 150 a of the mount 150 , and the other end is fixed to the feed claw 152 . The spring 156 presses the feed claw 152 toward the side holding the tape when the convex portion 152 a of the feed claw 152 faces a portion other than the hole 78 .

Next, the holding tape feeding operation of the feeder unit 114 will be described using FIG. 21 . In addition, in the example shown in FIG. 21 (steps S1 to S4), the holes formed on the holding tape main body 72 are supplied to the frame body 110 with the holes located on the downstream side in the feeding direction of the holding tape, and are first fed from the frame body 110. The order of discharge of the body 110 is sequentially referred to as 78, 78a, 78b, and 78c. In step S1 , the convex portion 152 a of the feed claw 152 is inserted into the hole 78 a of the holding belt main body 72 . The feeder unit 114 drives the driving portion 144 in a state where the convex portion 152a is inserted into the hole 78a as shown in step S1, so that the holding tape feeding claw unit 148 moves in the holding tape feeding direction to contact with the holding tape main body 72. The amount corresponding to 1 hole spacing.

If the feeder unit 114 is in the state of step S1, and the holding tape feeding claw unit 148 is conveyed along the holding tape feeding direction, the hole 78a is moved toward the holding tape by using the surface of the convex portion 152a perpendicular to the feeding direction. Pushing in this direction, as shown in step S2, both the holding tape feed claw unit 148 and the holding tape main body 72 move in the holding tape feeding direction. The feeder unit 114 moves the electronic component of the holding tape to the suction position by moving the holding tape main body 72 in the holding tape feeding direction.

When the movement of the holding tape feeding claw unit 148 in the holding tape feeding direction is completed (step S2 ), the feeder unit 114 waits for the electronic component at the tip held in the holding tape main body 72 to be held at the holding position. At this time, the electronic component at the holding position is sandwiched by the main body of the electronic component as will be described later, and the lead wires are cut by the cutter. Then, after predetermined processing is executed on the side of the electronic component mounting apparatus, a drive command is issued. For example, after the electronic component at the above-mentioned holding position held by the holding tape is sucked by the suction nozzle of the mounting head or grasped by the holding suction nozzle, a clamp release command is sent to the electronic component supply device, so that the electronic component supply device releases the electronic component. Clamping of parts. Then, after the electronic component held on the suction nozzle is raised by raising the suction nozzle, a drive command is sent to the feeder unit 114 . After issuing the drive command, the feeder unit 114 drives the driving unit 144 to move the holding tape feeding claw unit 148 by an amount corresponding to one hole pitch of the holding tape main body 72 in a direction opposite to the holding tape feeding direction. If the feeder unit 114 is in the state of step S2, and the holding tape feeding claw unit 148 is conveyed to the side opposite to the holding tape feeding direction, the inclined surface of the convex portion 152a contacts the hole 78a, and the convex portion 152a moves along the hole 78a. The inclined surface moves in the direction of pulling out from the hole 78a. Thus, the feeder unit 114 disengages the convex portion 152a from the hole 78a as shown in step S3 (step S3), the holding tape does not move, and the holding tape feeding claw unit 148 moves to the side opposite to the holding tape feeding direction. move.

Then, after the feeder unit 114 moves the holding tape feed claw unit 148 by an amount corresponding to one hole pitch of the holding tape main body 72 in the direction opposite to the holding tape feeding direction from the state shown in step S2, As shown in step S4, the convex part 152a will be in the state inserted into the hole 78b located on the upstream side by 1 pitch rather than the hole 78a. At this time, since the feed claw 152 is pressed toward the hole 78b by the spring 156, the protrusion 152a is reliably inserted into the hole 78b. Immediately thereafter, the driving unit 144 is driven in the holding tape feeding direction to convey the next electronic component held in the holding tape main body 72 to the holding position.

As described above, the feeder unit 114 reciprocates the holding tape feeding claw unit 148 in the feeding direction by the driving unit 144 by an amount corresponding to the pitch of one hole of the holding tape main body 72, so that the holding tape can be moved along the feeding direction. Move the direction by 1 spacing amount in sequence.

Next, the cutting unit will be described using FIGS. 22 to 24 on the basis of FIGS. 14 to 16 . 22 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply device. 23 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply device. FIG. 24 is an explanatory diagram showing a schematic configuration of a cutting unit of the electronic component supply apparatus. The cutting unit 116 cuts the leads of the electronic components held by the electronic component holding tape. In addition, the cutting unit 116 clamps, that is, holds, the electronic component whose lead wire has been cut until the electronic component is sucked (held) by the suction nozzle. The cutting unit 116 has a support portion 162 , a drive portion 164 , a transmission portion 166 , a cutting portion 168 , and a cover 169 .

The supporting part 162 is a component fixed on the frame body 110 and supports the driving part 164 and the transmission part 166 . In addition, the support part 162 supports the cutting part 168 via the transmission part 166 . The driving part 164 has a fixed part 164a and a movable part 164b. The driving unit 164 is an air cylinder that expands and contracts the portion of the movable unit 164b exposed from the fixed unit 164a by air pressure. The driving unit 164 reciprocates the front end of the movable unit 164 b within a predetermined distance in the direction in which the linear portion of the guide groove 120 extends. The transmission unit 166 is a transmission mechanism that transmits power generated by the reciprocating movement of the movable unit 164 b to the cutting unit 168 . The transmission part 166 converts the reciprocating movement of the movable part 164b in the feeding direction of the holding tape into a motion in a direction perpendicular to the feeding direction of the holding tape, and moves the cutting part 168 in a direction perpendicular to the feeding direction of the holding tape. . The transmission part 166 moves the front end part 166a and the front end part 166b disposed across the passing region of the holding belt in a direction to approach each other or a direction to move away from each other, that is, a direction indicated by an arrow 170 . The transmission part 166 of this embodiment moves the front-end|tip part 166a and the front-end|tip part 166b to approach each other when the movable part 164b of the drive part 164 moves in the extension direction. The transmission part 166 moves the front-end part 166a and the front-end part 166b in the direction which mutually separates, when the movable part 164b of the drive part 164 moves to the contraction direction.

The cutting part 168 is arranged on the holding area, holds the main body of the electronic component arranged on the holding area, then cuts the lead wire of the electronic component between the main body and the main body of the holding tape, and then maintains the held state of the electronic component . The cutting part 168 has the 1st blade part 168a and the 2nd blade part 168b. The cutting portion 168 is arranged at a position where the first blade portion 168a and the second blade portion 168b face each other. In addition, the holding tape is arranged between the first blade 168a and the second blade 168b, and the lead wires of the electronic components held on the holding tape pass through the positions sandwiched between the first blade 168a and the second blade 168b. As shown in FIG. 24, the first blade portion 168a is connected to the front end portion 166a of the transmission portion 166, and when the front end portion 166a moves toward the second blade portion 168b side, it moves toward the second blade portion 168b side together with the front end portion 166a. The second blade portion 168b is connected to the front end portion 166b of the transmission portion 166 as shown in FIG. Moreover, the 1st blade part 168a is connected with the front-end|tip part 166a via the spring, and is pressed toward the 2nd blade part 168b side from the front-end part 166a.

The cover 169 is a member fixed to the frame body 110 . The cover 169 is arranged around the first blade portion 168a, and the surface where the first blade portion 168a contacts the second blade portion 168b becomes an opening. Moreover, the cover 169 is connected to the front-end|tip part 166a via a spring, and presses the front-end|tip part 166a to the side apart from the 2nd blade part 168b. Thereby, when the front-end|tip part 166a is not pressed to the side of the 2nd blade part 168b, the force of the direction away from the 2nd blade part 168b can be applied to the 1st blade part 168a.

The cutting unit 116 has the above-mentioned structure, and the first blade portion 168a on the movable side of the cutting portion 168 and the second blade portion 168b on the fixed side are approached by the driving portion 164 to support the main body of the electronic component from the side, and further By bringing the movable-side first blade 168a of the cutting portion 168 into contact with the fixed-side second blade 168b, it is possible to arrange the movable-side first blade 168a and the fixed-side second blade. 168b between leads cut. In addition, the cutting unit 116 can support the main body of the electronic component cut from the holding tape main body from the side by maintaining the contact state between the first blade portion 168a and the second blade portion 168b after cutting the lead wire. That is, the lead wire can be cut and the electronic component separated from the holding tape main body can be sandwiched. In addition, the cutting unit 116 may be formed by separate mechanisms for cutting the lead wires of the electronic component and for clamping the main body of the cut electronic component.

Here, the cutting position of the lead wire cut by the cutting unit 116 will be described. In a conventional mounting apparatus having a lead-type electronic component dedicated mounting head for inserting a substrate, cutting is performed at the leading end side of the lead close to the holding tape for fixing the lead, and a very long lead is inserted into the substrate. The reason for this is that the conventional mounting device has a lead wire cutting part and a lead wire holding part on the side of the mounting head, and after the root of the lead wire is held by the lead wire holding part, the lower part of the lead wire is cut off (preliminary cutting), so after cutting The lead wire becomes longer. In addition, this is because the lead wire is inserted into the insertion hole in the conventional mounting device while being guided by the guide pin, so even if the lead wire is long, it does not interfere with insertion into the substrate. In addition, the reason for this is that in order to perform subsequent processing by using a lead bending device that cuts (actually cuts) the lead wires to a desired length on the back surface of the substrate and bends the lead wires, the conventional mounting device cuts off the lead wires from the above-mentioned component holding tape. When pre-cutting the lead wire, it is necessary to keep a longer length of the lead wire.

On the other hand, the cutting unit 116 makes the cutting length of the lead wire of the radial lead type electronic component a predetermined length such that the length is equal to the thickness of the substrate or the lead wire protruding toward the back side of the substrate does not Poor soldering occurs, and the length corresponds to the thickness of the substrate. The predetermined length is, for example, approximately the same length as the insertion hole of the substrate. More specifically, it is a length greater than or equal to 0 mm and less than or equal to 3 mm with respect to the length of the insertion hole of the substrate. As described above, it is not necessary to pre-cut the component by the mounting head as in the prior art, but the component supply device is configured to cut the component shortly from the beginning to a predetermined length, so that the following effects can be obtained.

In the electronic component mounting apparatus 10, the lead wires are cut short by the cutting unit 116. When the main body of the electronic component located in the holding position of the component supply apparatus 100 is held by the suction nozzle, the stability of the lead wire spacing can be improved, and the lead wire spacing can be increased. A component capable of inserting lead wires into an insertion hole, allowing for very efficient and high-precision mounting.

In addition, in the conventional mounting device, if a long lead is inserted into the solder pre-filled or applied in the insertion hole, almost all the solder may be extruded toward the leading end side of the lead, and may be melted during reflow soldering. The solder can't rise into the thin gap between the insertion hole and the lead, making the soldering poor. On the other hand, in the electronic component mounting apparatus 10, since the lead wire is cut short by the cutting unit 116, the melted solder rises into the above-mentioned gap, and optimum soldering can be performed without any gaps filled with the solder. And at this time, by also mounting the mount-type electronic component on the solder coated on the upper surface of the substrate, there is also an effect that the lead-type electronic component and the mount-type electronic component can be simultaneously processed through one reflow soldering process. carrying. In other words, if an excessively long lead is inserted with respect to the solder previously filled or applied in the insertion hole, almost all of the solder is squeezed out toward the leading end side of the lead, and sometimes the melted solder cannot rise to the substrate during reflow soldering, that is, The solder cannot reach the substrate, poor soldering. On the other hand, in the electronic component mounting device of the above-mentioned configuration, by cutting the lead wire short to the above-mentioned predetermined length, if a part of the solder extruded from the insertion hole is in a melted state due to the lead wire inserted into the insertion hole, Then it can rise to the back of the above-mentioned substrate and be welded with the electrodes on the back of the substrate. In addition, when electrodes exist in the insertion hole (substrate hole), solder can be raised into the gap between the lead wire and the electrode inside the substrate for soldering. In this way, welding can be performed both mechanically and electrically.

In addition, by setting the predetermined length to be equal to the thickness of the substrate, even when radial lead type electronic components are mounted on the substrate, protruding of the leads from the substrate (back surface of the substrate) can be suppressed. In addition, by setting the predetermined length so that the lead protruding toward the back side of the substrate has a length that does not cause soldering failure, even if the lead wire is cut short, the lead wire can be satisfactorily fixed to the insertion point of the substrate by reflow processing. in the hole.

The air pressure regulator 118 adjusts the air pressure of the air cylinder serving as the driving unit 144 of the feeder unit 114 and the air cylinder serving as the driving unit 164 of the cutting unit 116 to control the driving of each part. Specifically, the air pressure regulator 118 controls the expansion and contraction of the movable part 144b of the driving part 144 , that is, the position, and controls the position of the feed claw 152 . In addition, the air pressure regulator 118 controls the expansion and contraction, that is, the position, of the movable part 164b of the driving part 164 , and controls the positions of the first blade part 168a and the second blade part 168b of the cutting part 168 . In addition, the air pressure adjustment unit 118 controls the air pressure of each part based on the control of the component supply control unit 64 .

The component supply apparatus 100 has the above-mentioned structure. The component supply device 100 is configured so that a plurality of positions for mounting the mounting table 150 of the holding tape feeding claw unit 148 on the front end support portion 146 are provided along the holding tape feeding direction, so that the holding tape feeding claw unit 148 can be switched relative to the holding tape feeding claw unit 148. The front end support portion 146 is provided in such a position that it is possible to cope with various types of electronic component holding tapes having different relative positions between the holes of the holding tape main body and the electronic components without replacing parts. That is, the component supply apparatus 100 moves the mounting table 150 of the holding tape feed claw unit 148 onto the front end support portion 146 based on the relative position between the hole of the holding tape body of the loaded electronic component holding tape and the electronic component. By switching the mounting position, the electronic component can be moved to the suction position in any case of holding the electronic component.

Specifically, the feeder unit 114 can be extended to the movable part 144b of the driving part 144 in the range of reciprocating movement by changing the position where the mounting table 150 holding the tape feed claw unit 148 is mounted on the front end support part 146. The position of the convex part 152a of the feed claw 152 is changed in the position of a long state. Thereby, when the feeder unit 114 is in the feeding end position and holding position where the movable portion 144b of the driving portion 144 is in the most extended state in the range of reciprocating movement, the position of the hole holding the tape main body is located. Locations become various locations. As a result, even with respect to electronic component holding tapes having different arrangement positions of the electronic components with respect to the hole positions, the feeder unit 114 can arrange the electronic components in the most extended state in the reciprocating range of the movable part 144b. hold position.

In addition, in the component supply apparatus 100, it is preferable to set the reciprocating distance of the movable portion 144b of the feeder unit 114 to be longer than the pitch of the holes holding the tape bodies and shorter than twice the pitch. Thereby, the component supply apparatus 100 can reliably insert the convex part 152a of the feed claw 152 into the hole of the next pitch, and can feed the holding|maintenance tape by 1 pitch by one reciprocating movement of the feed claw 152. In addition, in the parts supply device 100, when there are several kinds of pitches of the holes of the holding tape, which are the objects to be conveyed, it is preferable to set the reciprocating distance of the movable part 144b of the feeder unit 114 to be the longest from the pitch of the holes. The holes are relatively long and short compared to twice the spacing of the holding strips with the shortest hole spacing. Thus, the component supply device 100 can reliably insert the convex portion 152a of the feed claw 152 into the hole of the next pitch when the pitch of the holding tape is any type, and the feed claw can be moved to and fro once by one reciprocating movement of the feed claw. Keep the amount that the belt conveys for 1 pitch. That is, the components supply device 100 can feed the holding tapes of various pitches by one pitch without changing the reciprocating distance or replacing the components.

Here, in the feeder unit 114 of the above-mentioned embodiment, the position where the holding tape feed claw unit 148 is attached to the front end support portion 146 can be selected from two positions, but the number is not limited thereto. The feeder unit 114 can cope with more kinds of electronic component holding tapes by increasing the optional positions of the positions where the holding tape feed claw unit 148 is mounted with respect to the front end support portion 146 . In addition, the feeder unit 114 may be provided so that the position where the holding tape feed claw unit 148 is attached relative to the front end support portion 146 can be adjusted linearly. For example, it is also possible to set the front end support portion 146 and the front end support portion 146 and the front end support portion 146 and the front end support portion 146 by making the screw hole on any one of the holding tape feeding claw units 148 into a long hole shape extending along the holding tape feeding direction. The relative position in the holding tape feeding direction between the holding tape feeding claw units 148 is set to various positions. In this case, it is preferable that the relative position in the holding tape feeding direction between the front end support portion 146 and the holding tape feeding claw unit 148 can be adjusted within a range of one hole pitch of the holding tape. Accordingly, the feeder unit 114 can adjust the relative position arbitrarily, and can also perform fine adjustment of the relative position.

In addition, the feeder unit 114 of the above-mentioned embodiment is configured to use the front end support portion 146 and the holding tape feed claw unit 148 as a position adjustment mechanism, and by changing the relative position between the front end support portion 146 and the holding tape feed claw unit 148, , so as to change the state after the holding belt is conveyed, that is, the position of the convex portion 152a of the feed claw 152 when the movable part 144b is in the most extended state in the reciprocating movement range, that is, the frame body 110 and the holding belt can be adjusted to move forward. The relative positions between the claw units 148 are given, but not limited thereto. The feeder unit can use various mechanisms capable of adjusting the relative position between the housing and the holding tape feed claw unit as a position adjustment mechanism. For example, the component supply device may be configured such that the relative position between the housing and the feeder unit in the feeding direction of the holding tape can be adjusted so that the state after the holding tape feeding is completed can be changed, that is, the movable part 144b The position of the convex part 152a of the feed claw 152 in the most extended state in the reciprocating movement range. That is, the feeder unit may be provided with a position adjustment mechanism at the connecting portion between the feeder unit and the housing.

Next, various modified examples of the electronic component supply device as the radial feeder will be described. Fig. 25 is a perspective view showing a schematic configuration of another example of a cutting unit. Fig. 26 is a perspective view showing a schematic configuration of the cutting unit shown in Fig. 25 viewed from another direction. Fig. 27 is a perspective view showing the relationship between the cutting unit and the housing shown in Fig. 25 . Fig. 28 is a perspective view showing a schematic configuration of another example of a cutting unit. Fig. 29 is an explanatory view for explaining the operation of the cutting unit shown in Fig. 25 . Fig. 30 is an explanatory view for explaining the operation of the cutting unit shown in Fig. 25 . In addition, the basic structure of the cutting unit 116a shown in FIGS. 25 to 30 is the same as that of the cutting unit 116 . Next, the characteristic points of the cutting unit 116a will be described.

The cutting unit 116a cuts the leads of the electronic components held by the electronic component holding tape. In addition, the cutting unit 116 a clamps, that is, holds the electronic component after the lead wire is cut, until the electronic component is sucked or held (held) by the suction nozzle 32 (suction nozzle or holding suction nozzle). The cutting unit 116a has the support part 162, the drive part 164, the transmission part 172, the cutting part 174, and a cover.

The transmission part 172 is a transmission mechanism that transmits power generated by the reciprocating movement of the movable part 164 b to the cutting part 174 . The transmission part 172 converts the reciprocating movement of the movable part 164b in the feeding direction of the holding tape into a motion in a direction perpendicular to the feeding direction of the holding tape, and moves the cutting part 174 in a direction perpendicular to the feeding direction of the holding tape. . The transmission unit 172 is composed of a stationary element 175 and a movable element 176 arranged to sandwich the passing region of the holding belt. The transmission unit 172 moves the first unit 174 a connected to the movable element 176 of the cutting unit 174 to approach or move away from the second unit 174 b connected to the fixing unit 175 of the cutting unit 174 . That is, as shown in FIG. 29 , the transmission unit 172 of the present embodiment moves the movable element 176 toward the fixed element 175 when the movable portion 164b of the drive portion 164 moves in the stretching direction. The transmission part 172 moves the movable element 176 in the direction away from the fixed element 175 when the movable part 164b of the drive part 164 moves in the contraction direction. As described above, the cutting unit 116a is configured to move only one of the two units of the cutting unit 174 .

The cutting portion 174 is arranged on the holding area, and cuts and holds the leads of the electronic components arranged on the holding area between the main body and the main body of the holding tape. The cutting part 174 holds both the main body and the lead wires of the electronic component 80 , then cuts the lead wires, and maintains the state of holding the main body and the lead wires after cutting the lead wires. The cutting unit 174 has a first unit 174a and a second unit 174b. The first unit 174a has a first blade 178a, a first body holding portion 179a, and a first lead wire holding portion 180a. The first blade 178a and the second blade 178b serve as the cutting mechanism 178, the first main body holding part 179a and the second main body holding part 179b serve as the main body holding means 179, and the first lead wire holding part 180a and the second lead wire holding part 180b serve as the lead wire holding means. 180. As shown in FIG. 30 , the cutting unit 174 has a main body holding mechanism 179 , a lead wire holding mechanism 180 , and a cutting mechanism 178 arranged in this order from the upper side in the vertical direction.

Each part of the first unit 174a and each part of the second unit 174b are arranged at positions facing each other. In addition, the holding belt is disposed between the first unit 174a and the second unit 174b, and the lead wires of the electronic components held by the holding belt are clamped by the cutting mechanism 178 and the lead wire holding mechanism 180, and the main body of the electronic component is clamped by the main body holding mechanism 179. Pass at the held position.

The first unit 174a of the cutting unit 174 is supported by the movable member 176, and moves in the direction of approaching and separating from the second unit 174b (direction of the arrow in FIG. 30 ) together with the movable member 176 . When the first unit 174 a of the cutting unit 174 moves toward the second unit 174 b, the main body of the electronic component 80 is held by the main body holding mechanism 179 , and the leads of the electronic component 80 are held by the lead wire holding mechanism 180 . Then, in the cutting section 174, when the first unit 174a further moves toward the second unit 174b, the first blade 178a and the second blade 178b of the cutting mechanism 178 intersect to cut the lead. In addition, in Fig. 30, it seems that the first blade 178a and the second blade 178b are overlapped, but because the position of the first blade 178a and the second blade 178b in the left and right direction of the paper in the front and rear direction of the paper is different (relative to the conveying direction tilt), so there is virtually no contact.

The cutting unit 116 a uses one driving unit 164 as a driving source, and operates the clamping mechanism (main body holding mechanism 179 , lead wire holding mechanism 180 ) for holding the electronic component 80 and the cutting mechanism 178 for cutting the lead wire 84 through the transmission unit 172 in conjunction with each other. Thus, the cutting unit 116a can hold the electronic component 80 and cut the leads with a simple structure. In this point, the cutting unit 116 is also the same.

In addition, the cutting unit 116a can properly hold the electronic component 80 after cutting the lead wire 84 by holding the main body 82 of the electronic component 80 by the main body holding mechanism 179 . Thereby, the electronic component 80 after cutting the lead wire 84 can be held appropriately, and the electronic component 80 can be easily held by the suction nozzle 32 . In this point, the cutting unit 116 is also the same.

In addition, the cutting unit 116a can hold the electronic component 80 by the clamping mechanism before cutting the lead wire 84, especially, the main body 82 of the electronic component 80, so that the electronic component 80 can be held in a stable position. In the state, the lead wire 84 is cut off. Thereby, the lead wire 84 can be cut|disconnected appropriately. In addition, the electronic component 80 is held by the clamping mechanism before the lead wire 84 is cut by the cutting unit 116a, so that the electronic component after cutting the lead wire 84 can be prevented from falling off or falling from the holding position.

The cutting unit 116 a holds the lead wire 84 in addition to holding the main body 82 , so that the position of the lead wire 84 can be restricted during cutting, and the lead wire 84 can be cut more appropriately. In addition, by holding the lead wire 84 on the main body side by the lead wire holding mechanism 180 , deformation of the lead wire 84 on the main body side during cutting can be reduced.

The cutting unit 116a can simplify the mechanism of the device by using one side of the transmission part 172 as the fixing member 175 . In addition, the holding position of the electronic component held by the cutting unit 116 a can be stabilized, and the handling of the mounting head 15 can be simplified. It is preferable that the cutting unit 116a has both the main body holding mechanism 179 and the lead wire holding mechanism 180, but may have only any one of them.

Here, as shown in FIG. 27, the cutting unit 116a is fixed by inserting bolts 182, 185 into long holes 181, 184 formed in the frame body 110a whose longitudinal direction is the vertical direction. Thus, the cutting unit 116a can adjust the position in the vertical direction. Thereby, the position in the vertical direction relative to the electronic component held by the holding tape moved by the feeder unit can be adjusted. Therefore, the cutting unit 116a can adjust the position in the vertical direction of the cut lead wire with respect to the position of the holding tape, that is, the cut position corresponding to the radial lead type electronic component. Thus, the cutting unit 116a can adjust the length of the lead wire after cutting. In addition, in this embodiment, the mechanism for adjusting the cutting position corresponding to the radial lead type electronic component adopts a combination of an elongated hole whose adjustment direction is in the longitudinal direction and a bolt for fixing the position relative to the elongated hole. The position adjustment mechanism is not limited to this. In the electronic component supply apparatus, any mechanism that can adjust the position of the cutting unit 116a in the Z-axis direction, more specifically, a mechanism that can adjust the position of the cutting mechanism in the Z-axis direction of the electronic component holding tape with respect to the holding area That's it.

In addition, the cutting unit 116a has a rod 188 exposed to the outside of the housing 110a. The rod 188 is connected to the linear motion part of the transmission part 172 . Thereby, the cutting unit 116a can perform the cutting operation of the electronic component by the cutting part 174 by moving the rod 188 in the direction of the arrow. That is, by moving the rod 188 in the direction of the arrow, the same operation as that of moving the transmission part 172 in the linear motion direction by the drive part 164 can be performed. Thus, for example, when the position adjustment of the cutting unit 116 a is performed, the lead wires of the electronic components can be cut without driving the drive unit 164 by the control device 20 of the electronic component mounting apparatus 10 . In addition, even in a state where air pressure or electric power is not supplied to the driving unit 164, the lead wires of the electronic components can be cut.

Moreover, the electronic component supply apparatus 100 may provide the operation part for driving the drive part 164 to the housing|casing 110a. Thereby, in the electronic component supply apparatus 100, the cutting operation|movement of the lead wire of an electronic component by the cutting means 116a can be performed without operating by the control apparatus 20. FIG. In addition, in this case, it is necessary to supply driving force (air pressure or electric power) to the driving unit 164 .

Fig. 31A is an explanatory diagram showing a schematic configuration of a holding mechanism of a cutting unit. Fig. 31B is an explanatory diagram showing a schematic configuration of another example of the holding mechanism of the cutting unit. The second body holding portion 179b of the cutting unit 116a is a stopper having two holes 190 for inserting bolts fixed to the fixing member 175 of the transmission portion 172, as shown in FIG. 31A. In the second main body holding portion 179b, the surface parallel to the line connecting the two holes 190 is composed of four surfaces with different distances from the holes 190 . The distance between the first surface 191a and the hole 190 is indicated by the arrow 192a. The distance between the second surface 191b and the hole 190 is indicated by the arrow 192b. The distance between the third surface 191c and the hole 190 is indicated by the arrow 192c. The distance between the fourth surface 191d and the hole 190 is indicated by the arrow 192d. Arrow 192a, arrow 192b, arrow 192c and arrow 192d are all different in length. For the cutting unit 116a, when the second main body holding part 179b is fixed on the fixing member 175, by changing the orientation of the second main body holding part 179b (reversing up and down, turning left and right), it can be connected with the first main body holding part. The surface facing 179a is switched to the first surface 191a, the second surface 191b, the third surface 191c, or the fourth surface 191d. Here, since the position of the bolt in the fixing hole 190 is fixed, by switching the surface facing the first body holding portion 179a, the surface of the second body holding portion 179b facing the first body holding portion 179a and the surface facing the first body holding portion 179a can be changed. The distance between the first main body holding parts 179a.

Thus, the cutting unit 116a can change the distance between the second main body holding part 179b and the first main body holding part 179a to four kinds during the cutting operation of the lead wires, and the distance between the second main body holding part 179b and the first main body holding part 179a can be changed according to the type of electronic components supplied by the electronic component supply apparatus 100. , properly adjust the distance between the second main body holding portion 179b and the first main body holding portion 179a.

The second main body holding portion 195 shown in FIG. 31B has an octagonal prism shape, and the first main body holding portion 179a has one flat surface. The second body holding portion 195 forms holes 196 for inserting bolts. The hole 196 is a long hole whose longitudinal direction is the direction perpendicular to the feeding direction of the holding tape, that is, the direction in which the cutting unit moves. The second main body holding part 195 can adjust the position of the second main body holding part 195 relative to the bolt in the operating direction of the cutting part by adjusting the relative position between the hole 196 and the bolt. As described above, by using the second main body holding part 195, the cutting means can be used for the surface of the second main body holding part 195 opposing the first main body holding part 179a and the second main body holding part 195 between the distances in the longitudinal direction of the hole 196. 1 The distance between the main body holding parts 179a is adjusted. Thereby, the cutting unit can cope with more widths of the electronic component main body. For example, the cutting unit can cut lead wires while holding 20 types of lead-type electronic components so that 20 types of lead-type electronic components can be supplied to the holding position in the state where the lead wires are cut.

32 is an explanatory diagram showing a schematic configuration of another example of the feeder unit of the electronic component supply apparatus. Fig. 33 is a perspective view showing a schematic configuration of the feeder unit shown in Fig. 32 viewed from another direction. Fig. 34 is a front view showing a schematic configuration of the feeder unit shown in Fig. 32 . Fig. 35 is a plan view showing a schematic configuration of the feeder unit shown in Fig. 32 . Fig. 36 is a front view showing a schematic configuration of another state of the feeder unit shown in Fig. 32 . Fig. 37 is a plan view showing a schematic configuration of another state of the feeder unit shown in Fig. 32 . In addition, in the feeder unit 200 shown in FIGS. 32 to 37 , the position of the convex portion 152a of the feed claw 152 can be changed except that the state after the belt feeding is completed, that is, the most extended state in the reciprocating movement range of the movable portion 144b, can be changed. It basically has the same structure as the feeder unit 114 except for the structure of the position.

The feeder unit 200 has a support unit 202 , a driving unit 204 , a first front end support unit 206 , a holding tape feed claw unit 208 , a second front end support portion 209 , a return direction holding tape feed claw unit 210 , and an interlocking mechanism 211 . The drive unit 204 has the same structure as the drive unit 144 . In addition, the first front end support portion 206 and the holding tape feeding claw unit 208 of the present embodiment do not have the function of holding the position adjustment of the tape feeding direction. In addition, the holding tape feeding claw unit 208 does not have a grip portion. Other configurations of the first front end support portion 206 and the holding tape feed claw unit 208 are the same as those of the front end support portion 146 and the holding tape feed claw unit 148 .

The support part 202 is a mechanism for directly or indirectly supporting the driving part 204, the first front end support part 206, the holding belt feed claw unit 208, the return direction holding belt feed claw unit 210, and the linkage mechanism 211, and is fixed to the frame. 110 on. The support part 202 has a support member 222 , two bosses 230 , two screws 232 and two screws 236 .

The support member 222 is a plate member facing the widest surface of the elongated box shape of the housing 110 , and faces one surface of the driving unit 204 , the first front end support unit 206 , and the holding belt feed claw unit 208 . The supporting member 222 is connected to the fixed part of the drive part 204, and supports the fixed part. In addition, the support member 222 is fixed on the frame body 110 via the protrusion 230 .

The protrusion 230 is arranged on the surface of the supporting member 222 opposite to the surface facing the holding tape feed claw unit 208 and the like. The protrusion 230 protrudes in a direction away from the holding tape feeding claw unit 208 and the like. Two protrusions 230 are arranged at positions separated by a predetermined distance in the holding tape feeding direction of the supporting member 222 .

The two screws 232 are screwed to one end of the boss 230 (the end on the side in contact with the supporting member 222 ). In addition, the screws 232 are respectively inserted into the elongated holes 222 a formed in the supporting member 222 . The elongated hole 222a formed in the supporting member 222 is a hole extending in the feeding direction of the holding tape. Further, the elongated hole 222a has a shape such that the screw 232 can move within the range of one hole pitch of the holding tape in the holding tape feeding direction.

The two screws 236 are screwed to the other end of the boss 230 . In addition, the screws 236 are respectively inserted into the elongated holes 212 formed in the housing 110 . The elongated hole 212 formed in the frame body 110 is a hole extending in the feeding direction of the holding tape. In addition, the elongated hole 212 has a shape that allows the screw 236 to move within a range corresponding to one hole pitch of the holding tape in the holding tape feeding direction.

In addition, in the feeder unit 200 , a screw 232 screwed with the boss 230 is inserted into the elongated hole 222 a of the supporting member 222 . The combination of the boss 230 of the feeder unit 200, the screw 232, and the elongated hole 222a formed in the support member 222 serves as a position adjustment mechanism. With regard to the feeder unit 200 , by tightening the screws 232 to fasten the protrusion 230 and the supporting member 222 , the relative positions of the feeder unit 200 and the housing 110 in the feeding direction of the holding tape can be fixed. In addition, in the feeder unit 200 , the elongated hole 222 a and the screw 232 can be relatively moved by making the screw 232 loose. Thereby, the supporting member 222 formed with the elongated hole 222 a can be relatively moved in the holding tape feeding direction with respect to the boss 230 into which the screw 232 is inserted. With respect to the feeder unit 200 , the supporting member 222 and the protrusion 230 can be relatively moved, so that the feeder unit 200 can be moved relative to the housing 110 in the holding tape feeding direction. Thus, for the feeder unit 200, by loosening the screw 232, the relative position of the feeder unit 200 and the frame body 110 in the feeding direction of the holding tape can be adjusted, and by tightening the screw 232, the feeder unit 200 and the frame body 110 can be adjusted. 110 is fixed in the relative position on the holding belt feeding direction.

In addition, in the feeder unit 200 , a screw 236 screwed with the boss 230 is inserted into the elongated hole 212 of the housing 110 . The combination of the boss 230 of the feeder unit 200, the screw 236, and the elongated hole 212 formed in the frame 110 serves as a position adjustment mechanism. With regard to the feeder unit 200 , by tightening the screws 236 to fasten the protrusion 230 and the frame body 110 , the relative positions of the feeder unit 200 and the frame body 110 in the feeding direction of the holding tape can be fixed. In addition, in the feeder unit 200 , the elongated hole 212 and the screw 236 can be relatively moved by setting the screw 236 in a loosened state. Thereby, the frame body 110 formed with the elongated hole 212 can be relatively moved in the holding tape feeding direction with respect to the boss 230 into which the screw 236 is inserted. With respect to the feeder unit 200 , since the frame body 110 and the boss 230 can be relatively moved, the feeder unit 200 can be moved relative to the frame body 110 in the feeding direction of the holding tape. Thus, for the feeder unit 200, by loosening the screw 236, the relative position of the feeder unit 200 and the frame body 110 in the feeding direction of the holding tape can be adjusted, and by tightening the screw 236, the feeder unit 200 and the frame body 110 can be adjusted. The frame body 110 is fixed while maintaining the relative position in the tape feeding direction.

Since the feeder unit 200 has a structure in which the entire feeder unit 200 and the frame body 110 can move relative to each other in the feeding direction of the holding tape, it is possible to easily adjust the direction of the holding tape feeding direction of the feed claw without replacing parts or the like. The position is adjusted. In addition, regarding the feeder unit 200 , the feeder unit 200 can be moved relative to the housing 110 only by loosening the screw 232 from the outside of the housing 110 . This makes it possible to more easily adjust the position of the feed claw in the holding tape feed direction. Here, when the operator relatively moves the feeder unit 200 and the housing 110 in the feeding direction of the holding tape, by holding the supporting member 222, the supporting member 222 is moved relative to the housing 110 in the feeding direction of the holding tape, thereby Relative movement is possible. In addition, the operator may hold the boss portion 230 and move it relatively. In addition, when the operator loosens the screw 236 to relatively move the feeder unit 200 and the frame body 110 along the feeding direction of the holding tape, the operator holds the loosened screw 236 to move the screw 236 relative to the elongated hole 212, thereby Alternatively, the feeder unit 200 and the housing 110 may be relatively moved in the holding tape feeding direction. In this case, it is preferable to form the screw 236 into a shape that is easy to hold.

In addition, when feeder unit 200 performs relative positional movement by a mechanism formed by combining screws 232 and elongated holes 222a, it is preferable to be in a state where frame body 110 and boss 230 are fixed by screws 236 . In addition, in the feeder unit 200 , when the relative position is moved by a mechanism combining the screw 236 and the elongated hole 212 , it is preferable to be in a state where the support member 222 and the boss 230 are fixed by the screw 232 .

In addition, in the feeder unit 200, two mechanisms, the mechanism combining the screw 232 and the elongated hole 222a and the mechanism combining the screw 236 and the elongated hole 212, are provided as the position adjustment mechanism, and these two mechanisms can be used to adjust the position. The relative position between the feeder unit 200 and the housing 110 in the feeding direction of the holding tape is adjusted, but the present invention is not limited thereto. In the feeder unit 200 , as the position adjustment mechanism, only a combination of the screw 232 and the elongated hole 222 a provided at the portion where the boss 230 and the support member 222 are fixed may be provided. In addition, in the feeder unit 200 , as the position adjustment mechanism, only a combination of the screw 236 and the elongated hole 212 may be provided, which fixes the boss 230 and the frame body 110 .

In addition, with regard to the feeder unit 200, by using the drive unit 204 to reciprocate the first front end support portion 206 along the holding tape feeding direction, the holding tape feeding claw unit 208 is placed in the positions and diagrams shown in FIGS. 34 and 35 . 36 and reciprocating movement between the positions shown in Fig. 37. Thereby, by reciprocating the holding tape feed claw unit 208 , the holding tape can be fed by one pitch in the holding tape feeding direction similarly to the feeder unit 114 .

Here, the feeder unit 200 of this embodiment further includes the second front end support portion 209 , the return direction holding tape feeding claw unit 210 , and the interlocking mechanism 211 as described above. Next, the second front end support portion 209 , the return direction holding belt feed claw unit 210 , and the interlocking mechanism 211 will be described with reference to FIGS. 32 to 37 and FIGS. 38 to 43 . Fig. 38 is an explanatory diagram showing a schematic configuration of the feeder unit shown in Fig. 32 . Fig. 39 is an explanatory diagram showing a schematic configuration of another state of the feeder unit shown in Fig. 32 . Fig. 40 is an explanatory diagram showing a schematic configuration of an interlocking mechanism of the feeder unit shown in Fig. 32 . FIG. 41 is an explanatory diagram showing a schematic configuration of another example of a housing. Fig. 42 is an explanatory view for explaining the operation of the feeder unit shown in Fig. 32 . Fig. 43 is an explanatory diagram for explaining the operation of the feeder unit shown in Fig. 32 . In FIG. 41 , a housing 280 is shown for describing the feeder unit 200 .

As shown in FIGS. 38 and 39 , the second front end support portion 209 is a plate member facing the widest surface of the elongated box shape of the frame body 110, and is connected to the driving portion 204, the first front end support portion 206, The other face of the tape feed claw unit 208 is kept facing. That is, the second front end support portion 209 and the support member 222 are disposed at positions sandwiching the driving portion 204 , the first front end support portion 206 , and the holding tape feed claw unit 208 . The second front end support portion 209 is fixed to the support member 222 via the connection portion 226 and the linkage mechanism 211 . The second front end support portion 209 is a mechanism for supporting a return direction holding tape feed claw unit 210 described later, and is connected to the interlocking mechanism 211 by a connection portion 226 . Part of the vertically upper side of the second front end support portion 209 is exposed from the frame body 110 . That is, a part of the vertically upper side of the second front end support portion 209 is exposed from the outside of the frame body 110 where the guide groove 120 is formed and faces the frame body 110 . A grip portion 228 is provided on a part of the upper side in the vertical direction of the second front end support portion 209 . In addition, the supporting member 222 and the second distal end support portion 209 support the first distal end support portion 206 in a movable state in the holding tape feeding direction.

The connecting portion 226 is composed of bolts, nuts, etc., and fixes the second front end support portion 209 to the linkage mechanism 211 . The grip portion 228 is provided on a part of the vertically upper side of the second tip support portion 209 as described above. The grip portion 228 is a portion that can be gripped by an operator. The grip portion 228 is formed in a shape that facilitates the operator to move the second front end support portion 209 in a direction parallel to the feeding direction of the holding belt. The operator moves the second front end support portion 209 in a direction parallel to the holding tape feeding direction, so that the holding tape feeding claw unit 208 and the returning direction holding tape feeding claw unit 210 can be moved along the direction parallel to the holding tape feeding direction. Move in a parallel direction.

The return direction holding tape feeding claw unit 210 has basically the same structure as the holding tape feeding claw unit 208 . The returning direction holding tape feeding claw unit 210 is oriented perpendicularly to the surface of the support portion 202 and is arranged at a position away from the holding tape feeding claw unit 208 and opposite to the holding tape feeding claw unit 208 . The return direction holding belt feed claw unit 210 is fixed to the second front end support portion 209 and moves in the linear movement direction (the direction in which the movable portion of the drive portion 204 moves) together with the second front end support portion 209 . In addition, the returning direction holding tape feeding claw unit 210 has the feeding claw in the linear movement direction facing opposite to the holding tape feeding claw unit 208 . In addition, the return direction holding tape feed claw unit 210 has the convex portion of the feed claw protrude toward the side opposite to the support portion 202 side.

The interlocking mechanism 211 is a mechanism that transmits power transmitted from the drive unit 204 to the first distal end support portion 206 to the second distal end support portion 209 . As shown in FIG. 40 , the interlocking mechanism 211 has a first slide mechanism 242 , a transmission unit 244 , and a second slide mechanism 246 . The first slide mechanism 242 has a fixed portion 242a and a movable portion 242b. The fixing part 242a is fixed on the supporting part 202 . The movable part 242b is supported by the fixed part 242a in a state of being movable in a linear movement direction (the direction in which the movable part of the driving part 204 moves). The movable part 242b is fixed to the first front end support part 206, and moves along the linear movement direction together with the first front end support part 206. As shown in FIG.

The transmission unit 244 is a transmission mechanism that transmits power transmitted from the first slide mechanism 242 to the second slide mechanism 246 . The transmission part 244 has a gear fixed to the support part via a pin.

The second slide mechanism 246 has a fixed portion 246a and a movable portion 246b. The fixing part 246a is fixed on the supporting part 202 . The movable part 246b is supported by the fixed part 246a in a state of being movable in a linear movement direction (the direction in which the movable part of the driving part 204 moves). The movable part 246b is fixed to the second front end support part 209, and moves in the linear movement direction together with the second front end support part 209. FIG.

The interlocking mechanism 211 has the above-mentioned structure. As the transmission part 244 , gears are inserted into the gear grooves formed in the movable part 242b of the first slide mechanism 242 and the gear grooves formed in the movable part 246b of the second slide mechanism 246 . That is, the interlocking mechanism 211 connects the transmission part 244 and the 1st slide mechanism 242 by a rack and pinion mechanism, and connects the transmission part 244 and the 2nd slide mechanism 246 by a rack and pinion mechanism. In addition, as shown in FIG. 40, in the interlocking mechanism 211, the position where the transmission part 244 and the first slide mechanism 242 are connected, and the position where the transmission part 244 and the second slide mechanism 246 are connected are positions facing the gears. Accordingly, in the feeder unit 200, when the gear rotates, the first slide mechanism 242 and the second slide mechanism 246 move in directions opposite to each other along the linear movement direction.

Here, the housing 280 of the fixed feeder unit 200 will be described. As shown in FIG. 41 , the frame body 280 forms the same guide groove 282 as that of the frame body 110 described above. The shape of the guide groove 282 is such that one end of two linear portions 283 and 285 formed along the longitudinal direction of the vertically upper elongated surface of the frame body 280 is connected at the folded portion 284 . That is, the guide groove 282 is formed in a U-shape, that is, the straight portion 283 extends from one end of the frame body 280 to the vicinity of the other end, and is folded back at the turn-back portion 284 near the other end. The straight portion 285 extends to one end. The guide groove 282 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end portion (end portion on the supply side) of the U-shape. The guide groove 282 moves the supplied electronic component holding tape along the U-shape, and is discharged from one end portion (the discharge-side end portion) of the U-shape. In addition, the guide groove 282 guides the electronic component holding tape in a state where the main body of the tape is located inside the housing 280 and the electronic components are exposed outside the housing 280 . In the folded portion 284 of the frame body 280 , a guide portion 286 a is arranged on the outer peripheral side of the conveying area of the holding tape, and a guide portion 286 b is arranged on the inner peripheral side of the conveying area of the holding tape. The guide portions 286a, 286b are each formed in a curved surface shape curved along the outer circumference and inner circumference of the folded-back conveyance area. The frame body 280 can move the holding belt in an appropriate direction by using the folded portion 284 by providing guide portions 286 a and 286 b at the folded portion 284 .

Next, the feeding operation of the electronic component holding tape of the feeder unit 200 will be described with reference to FIGS. 42 and 43 . As shown in FIG. 42 , in the feeder unit 200 , the tape feed claw unit 208 is fixed and held on the first front end support portion 206 , and the return direction holding tape feed claw unit 210 is fixed on the second front end support portion 209 .

The holding tape feed claw unit 208 has a feed claw 152 . The feeding claw 152 is a member having a convex portion 152a protruding from one end portion of a rod-shaped member, similarly to the holding tape feeding claw unit 148 described above. The feed claw 152 is arranged at a position facing the hole of the holding tape main body of the electronic component holding tape 70, and the shape of the protrusion 152a is such that the holding tape is fed on the downstream side in the feeding direction (front side in the feeding direction). The surface 152b is a surface orthogonal to the feeding direction, and the surface 152c on the upstream side (rear side of the feeding direction) of the holding tape feeding direction is a surface inclined relative to the surface orthogonal to the feeding direction. , the width in the feed direction narrows as it approaches the holding belt. When the feed claw 152 has the hole 78 at a position facing the convex portion 152a, the convex portion 152a is inserted into the hole as shown in FIG. 42 . Here, the holding tape feed claw unit 208 is disposed at a position facing the holding tape 70 located in the straight portion 283 of the guide groove 282 , and the convex portion 152 a is disposed on the folded portion 284 side. The holding tape feed claw unit 208 feeds the holding tape 70 positioned in the straight portion 283 of the guide groove 282 toward the holding area PP where electronic components are attracted.

The return direction holding belt feed claw unit 210 has a feed claw 252 . The feed claw 252 is a member having a convex portion 252 a protruding from one end portion of a rod-shaped member, similarly to the holding tape feed claw unit 208 described above. The feed claw 252 is arranged at a position facing the hole of the holding tape main body of the holding tape 70, and the shape of the protrusion 252a is a surface on the downstream side in the feeding direction (front side in the feeding direction) of the holding tape feeding direction. 252b becomes a surface perpendicular to the feeding direction, and the surface 252c holding the upstream side of the feeding direction (rear side in the feeding direction) in the belt feeding direction becomes a surface inclined with respect to the surface orthogonal to the feeding direction. As it approaches the holding belt, the width in the feed direction becomes narrower. When the feed claw 252 has the hole 78 at a position facing the convex portion 252a, the convex portion 252a is inserted into the hole as shown in FIG. 42 . Here, the return direction holding tape feeding claw unit 210 is arranged at a position facing the holding tape 70 in the straight portion 285 of the guide groove 282, and the convex portion 252a is arranged on the opposite side to the folded portion 284 side. That is, the feed claw 252 of the return direction holding tape feed claw unit 210 is disposed in a direction opposite to that of the feed claw 152 of the holding tape feed claw unit 208 in the linear movement direction. The return direction holding tape feeding claw unit 210 feeds the holding tape 70 passing through the holding area PP where the electronic component is sucked, to the discharge portion of the linear portion 285 of the guide groove 282 .

Next, the holding tape feeding operation of the feeder unit 200 will be described using FIG. 43 . In step S6, the protrusion 152a of the feeding claw 152 is inserted into the hole 78 of the holding belt main body of the holding belt 70, and the protrusion of the feeding claw 252 is inserted into the hole of the holding belt main body. Here, the protrusions of the feed claws 152 are inserted into the holes of the holding tape 70 located upstream (before passing the holding area PP) from the holding area PP in the holding tape feeding direction. The convex portion of the feed claw 252 is inserted into a hole of the holding tape that is located on the downstream side (after passing through the holding area PP) than the holding area PP in the holding tape feeding direction and is turned back at the turn-back portion 284 . In the feeder unit 200, as shown in step S6, the driving part 204 is driven in a state where the convex portion of the feed claw 152 is inserted into the hole and the convex portion of the feed claw 252 is inserted into the hole, and the tape feed claw unit is held. 208 . The returning direction holding tape feeding claw unit 210 moves along the holding tape feeding direction by an amount corresponding to the distance between one hole of the holding tape main body.

If the feeder unit 200 is in the state of step S6, and the holding tape feeding claw unit 208 and the return direction holding tape feeding claw unit 210 are conveyed along the holding tape feeding direction, then the convex portion of the feeding claw 152 is utilized to feed the claw unit 208. The surface perpendicular to the feed direction and the surface perpendicular to the feed direction of the convex portion of the feed claw 252 push the hole to the feed direction of the holding tape, and as shown in step S7, the feed claw unit 208 and the feed claw unit 208 of the holding tape are kept The holding belts all move in the feeding direction of the holding belt. Here, the holding tape feeding claw unit 208 and the returning direction holding tape feeding claw unit 210 are moved in opposite directions by the interlocking mechanism 211 . As described above, the return direction holds the tape feeding claw unit 210 by moving in the direction opposite to the holding tape feeding claw unit 208, so that the holding tape having holes inserted into the feeding claws 152, 252 can be moved along the holding tape. The feed direction, that is, the guide groove 282, feeds in the direction from the guide portion toward the discharge portion.

If the movement of the holding tape feeding claw unit 208, the return direction holding tape feeding claw unit 210 in the holding tape feeding direction is completed (step S7), the feeder unit 200 puts the electronic component at the front end held by the holding tape main body in an adsorption position. position and stand by. At this time, the lead wires of the electronic component located at the holding position (attraction area) PP are clamped by the electronic component main body, and the cutting portion cuts the lead. Then, predetermined processing is performed on the electronic component mounting apparatus side, for example, after supplying the electronic component at the holding position held by the holding tape to the mounting head, a drive command is sent to drive the drive unit 204 to feed the holding tape to the claw unit 208. . Return direction Holding tape feeding claw unit 210 moves by an amount corresponding to one hole pitch of holding tape main body 72 in a direction opposite to the holding tape feeding direction. If the feeder unit 200 is in the state of step S7, and the holding tape feeding claw unit 208 and the return direction holding tape feeding claw unit 210 are transported to the opposite side to the holding tape feeding direction, the feeding claws 152, 252 The inclined surfaces of the protrusions of the feed claws 152 and 252 are in contact with the holes, so that the protrusions of the feed claws 152, 252 move along the inclination in the direction of pulling out from the holes. Thus, the feeder unit 200 disengages the protrusions of the feed claws 152, 252 from the holes as shown in step S8 (step S8), keeps the tape from moving, holds the tape feed claw unit 208, and keeps the tape forward in the return direction. The gripper unit 210 moves to the side opposite to the feeding direction of the holding tape.

Then, start from the state shown in step S7 in the feeder unit 200, make the holding tape feeding claw unit 208, the return direction holding tape feeding claw unit 210 move and hold the tape main body in the direction opposite to the holding tape feeding direction. After an amount corresponding to 1 hole pitch of 72, as shown in step S9, the protrusions of the feed claws 152, 252 are inserted into the holes of 1 pitch on the upstream side compared with the holes inserted in step S7. . Immediately thereafter, the driving unit 204 is driven in the holding tape feeding direction to convey the next electronic component held in the holding tape main body 72 to the holding position.

As described above, the feeder unit 200 can feed the holding tape along the feeding direction by reciprocating the holding tape feeding claw unit 208 by the driving unit 204 in the feeding direction by an amount corresponding to one hole pitch of the holding tape main body 72 . The direction moves sequentially by the amount of 1 pitch.

In addition, the feeder unit 200 is provided with the return direction holding tape feed claw unit 210, and the return direction holding tape feed claw unit 210 is driven in conjunction with the holding tape feed claw unit 208 by using the linkage mechanism 211, so that The holding belt behind the holding area PP is conveyed in the feed direction. As described above, since the holding belt passing through the holding area PP can be conveyed in the feed direction, the holding belt can be moved both upstream and downstream of the holding area PP. Thereby, it is possible to suppress bending of the holding tape or misalignment of the holding tape in the holding area PP. In addition, in the feeder unit 200 of the present embodiment, the holding tape feeding claw unit 208 and the return direction holding tape feeding claw unit 210 are moved in conjunction with the interlocking mechanism 211, so that two feeding claws can be fed by one drive mechanism. The claw moves. In addition, by moving in conjunction, the distance between the two feed claws can be maintained constant, and the holding belt can be fed appropriately.

Here, it is preferable that the electronic component supply apparatus 100 is located downstream of the arrangement position of the feed claw 152 in the feeder unit 200 and upstream of the turn-back portion in the feeding direction of the holding tape as shown in the above-described embodiments. The side configuration holding area (holding position) PP. That is, it is preferable that in the electronic component supply apparatus 100, the holding area PP where the electronic component 80 is held by the suction nozzle 32 is disposed between the feed claw 152 that transports the electronic component holding tape 70 to the holding area and the folded-back portion of the guide groove 282. between the clamped positions. Thereby, bending or deformation of the electronic component holding tape 70 passing through the holding area PP can be suppressed, and the position of the electronic component holding tape 70 and the position of the electronic component 80 in the holding area PP can be stabilized.

Fig. 44 is an explanatory diagram showing a schematic configuration of another example of the component supply device. FIG. 45 is an explanatory diagram showing an enlarged part of FIG. 44 . The electronic component supply device 310 has a plate-shaped member 312 connected to the feeder unit, and an opening 314 is formed in the housing. The plate member 312 moves in the conveying direction together with the fixing portion of the feeder unit. The opening 314 forms a plurality of sides 314 a , 314 b , 314 c , and 314 d extending in the vertical direction at positions overlapping the ends of the plate member 312 within the movable range of the plate member 312 . Here, the sides 314a, 314b, 314c, and 314d are formed at positions corresponding to the intervals of the holes of the various holding tapes and the arrangement of the electronic components with respect to the holes. The user aligns the positions of the sides of the plate-shaped member 312 with the sides that match the conditions of the sides 314a, 314b, 314c, and 314d with respect to the combination of the spacing of the holes of the holding tape and the arrangement of the electronic components relative to the holes, so that the The controller unit transports the electronic components to the holding area. In addition, in the present embodiment, as in the above-mentioned embodiment, there are four kinds of combinations of the spacing of the holes of the tape and the arrangement of the electronic components with respect to the holes, but the shape of the opening 314 may be changed according to the combination.

Fig. 46 is an explanatory diagram showing a schematic configuration of another example of the components supply device. FIG. 47 is an explanatory diagram showing an enlarged part of FIG. 46 . In the electronic component supply apparatus 320 shown in FIGS. 46 and 47 , a holding tape discharge guide 322 is disposed on the discharge portion. The holding tape ejection guide 322 is arranged in a direction in which the angle formed by the semi-cylindrical and the vertical direction on the surface opposite to the ejection portion is 60 degrees. In addition, the holding tape discharge guide 322 is provided with a plate-shaped member on a surface facing the guide 122 . The electronic component supply apparatus 320 can change the direction of the holding tape ejected from the ejection portion 126 along the semi-cylindrical portion by disposing the holding tape ejection guide portion 322 and guide it appropriately downward in the vertical direction. Accordingly, the discharge angle of the electronic component holding tape that passes through the guide groove and is discharged from the discharge portion can be restricted. The holding tape ejection guide 322 can reduce the load applied to the electronic component holding tape by making the surface facing the ejection portion cylindrical, and can appropriately change the direction of the electronic component holding tape. In addition, the holding tape ejection guide 322 can reduce the load on the electronic component holding tape by setting the inclination angle of the cylindrical portion to 60 degrees with respect to the vertical direction, and can appropriately change the direction of the electronic component holding tape. In addition, since the holding tape ejection guide 322 adopts the structure of FIGS. 46 and 47 , the direction can be changed smoothly and the electronic component holding tape can be ejected to a desired position, but the structure is not limited to this.

Fig. 48 is an explanatory diagram showing a schematic configuration of another example of the components supply device. FIG. 49 is an explanatory diagram showing an enlarged part of FIG. 48 . In the electronic component supply device 320 shown in FIGS. 48 and 49 , a component storage box 324 is provided on the guide portion 122 . The component storage box 324 is provided with a wedge portion 326 connected to the guide portion 122 and supported by the guide portion 122 . The component storage box 324 accommodates the electronic component holding tape supplied to the electronic component supply device 320 . In addition, the electronic component holding tape may be placed in the component storage box 324 together with a box accommodating the electronic component holding tape. The electronic component supply device 320 can shorten the distance between the position where the electronic component holding tape is stored and the guide part 122 by providing the component storage box 324 . Thereby, the load applied to the electronic component holding tape during conveyance from the position where the electronic component holding tape is stored to the guide portion 122 can be reduced. Accordingly, the electronic component holding tape can be appropriately conveyed by the electronic component supply device 320 . In addition, it is possible to suppress the electronic component holding tape from breaking due to its own weight or from elongating the hole.

Next, the components supply unit 14f will be described. Here, the components supply unit 14f has two bowl feeder assemblies 90. The two bowl feeder assemblies 90 are arranged in parallel and basically have the same structure. Next, one bowl feeder unit 90 will be described.

Fig. 50 is a perspective view showing a schematic structure of the bowl feeder unit. Fig. 51 is a perspective view showing a schematic structure of the bowl feeder unit shown in Fig. 50 . The bowl feeder unit 90 has two bowl feeder units 400 and a support mechanism 401 as shown in FIGS. 50 and 51 . In this embodiment, the operations of the bowl feeder unit 400 and the bowl feeder assembly 90 are controlled by a control unit. The bowl feeder unit 400 and the bowl feeder assembly 90 may use the control device 20 included in the electronic component mounting apparatus 10 as a control unit, or the bowl feeder unit 400 and the bowl feeder assembly 90 may have a control unit.

The support mechanism 401 is a mechanism that supports the two bowl feeder units 400 . The support mechanism 401 has a support plate 491 , a support rod 492 and a connection part 493 . The support plate 491 is a plate-shaped member, and the two bowl feeder units 400 are installed and fixed. The front end of the support plate 491 on the supply member side is connected to the positioning shaft 44 b and the recess 44 c of the front container 44 . The support rod 492 is connected to the side of the support plate 491 away from the front container 44 via the connection portion 493 . The vertically lower end of the support rod 492 is supported on the installation surface (floor) on which the electronic component mounting apparatus 10 is installed. The support mechanism 401 supports the support plate 491 provided with the two bowl feeder units 400 by the front container 44 and the support rod 492 . The support mechanism 401 can suppress the support plate 491 from bending by supporting the support plate 491 at two locations of the front container 44 and the support bar 492 away from the front container 44 . Thereby, the vibration of the bowl feeder unit 400 can be suppressed from being absorbed as the vibration of the support plate 491, and the bowl feeder unit 400 can be driven appropriately.

One bowl feeder unit 400 included in the bowl feeder unit 90 is arranged so that storage bowls described later and storage bowls of other bowl feeder units 400 are arranged in two rows in the vertical direction, and the holding position (The front end of the guide rail 422, the suction position) is shifted forward and backward. That is, in the bowl feeder unit 90 , storage bowls described later in the two bowl feeder units 400 are arranged at front and rear positions in the Y direction. In addition, in the X direction (the direction perpendicular to the extending direction of the guide rail described later, the conveying direction of the substrate), the storage bowls included in the bowl feeder units 400 in the first row and the bowl feeder units in the second row At least a part of the arrangement area between the storage bowls included in 400 overlaps. That is, in the bowl feeder unit 90 , the bowl feeder units 400 of the two bowl feeder units 400 are arranged so that the bowl storage positions described later overlap with each other in the X direction. In addition, in the bowl feeder unit 90 , storage bowls described later of the two bowl feeder units 400 are arranged at front and rear positions in the Y direction. Thus, the bowl feeder assembly 90 can efficiently configure the bowl feeder unit 400 . Specifically, the width in the X direction can be narrowed, and more component supply devices can be arranged in the component supplyable area of the electronic component mounting apparatus 10 .

In this embodiment, the storage bowls of the bowl feeder units 400 in the first row and the bowl feeder units 400 in the second row (compared with the bowl feeder units 400 in the first row are arranged at a distance from the holding bowl). position) is disposed in an area smaller than twice the outer diameter of the housing bowl in a direction (X direction, substrate conveyance direction) perpendicular to the direction in which the guide rails extend. In this way, the width in the X direction can be reliably narrowed, and more component supply devices can be arranged in the component supplyable area of the electronic component mounting apparatus 10 .

Next, the bowl feeder unit 400 of the bowl feeder unit 90 of the component supply unit 14f will be described using FIGS. 52 to 67B. The bowl feeder unit 400 shown in FIGS. 52 to 67B uses a bowl feeder as an electronic component supply device. First, the overall structure of the bowl feeder unit 400 will be described using FIGS. 52 to 54 . Fig. 52 is a side view showing another example of the component supply unit. Fig. 53 is a plan view showing another example of the component supply unit. Fig. 54 is a side view showing a state in which the storage bowl is removed from the component supply unit shown in Fig. 52 .

The bowl feeder unit 400 has bowl feeders 402 , 404 , and 406 as electronic component supply devices, a drive device 408 , and a fixing unit 410 . That is, the bowl feeder unit 400 is a mechanism that has three electronic component supply devices 402, 404, and 406 and can supply components at three locations. In addition, one drive device 408 of the bowl feeder unit 400 serves as a drive unit of the electronic component supply devices 402 , 404 , and 406 . In addition, in the bowl feeder unit 400 , the fixing unit 410 supports the electronic component supply devices 402 , 404 , and 406 and the drive device 408 . The fixing part 410 has frame-shaped support parts 442 and 444 extending in the vertical direction, and supports the electronic component supply devices 402 , 404 , and 406 and the drive device 408 at upper and lower ends. In addition, the supporting part 442 and the supporting part 444 extend to the rotation shaft of the drive device 408 described later, and in the state where the drive device 408 can rotate around the target part of the electronic component supply device 402, 404, 406 as the center of the rotation shaft, The drive unit 408 is supported.

The electronic component supply apparatus 402 has a storage bowl 420a, a guide rail 422a, a support mechanism 424a, and a connection part 436a. The electronic component supply apparatus 404 has a storage bowl 420b, a guide rail 422b, a support mechanism 424b, and a connection part 436b. The electronic component supply device 406 has a storage bowl 420c, a guide rail 422c, a support mechanism 424c, and a connection part 436c. The electronic component supply devices 402, 404, 406 are stacked at positions where the storage bowls 420a, 420b, 420c overlap in the horizontal direction, and are arranged in the order of the storage bowls 420a, 420b, 420c from above in the vertical direction. Moreover, the supporting mechanisms 424a, 424b, and 424c in the electronic component supply apparatuses 402, 404, and 406 are arranged in parallel on the same plane. That is, the respective holding positions of the plurality of guide rails 422a, 422b, and 422c are arranged on the same plane.

The electronic component supply apparatuses 402, 404, and 406 differ only in arrangement positions and the shapes of guide rails 422a, 422b, and 422c due to the difference in arrangement positions, and have basically the same structure. Next, the storage bowl 420 will be used as the description regarding the common points of the storage bowls 420 a , 420 b , and 420 c of the electronic component supply apparatuses 402 , 404 , and 406 . Similarly, for the common points of the guide rails 422a, 422b, and 422c, the guide rail 422 will be used for description. Regarding the common points of the support mechanisms 424a, 424b, and 424c, the support mechanism 424 will be used for description. The common points of the connecting parts 436a, 436b, and 436c will be described using the connecting part 436 .

The storage bowl 420 is a container in which a plurality of electronic components are placed. The guide rail 422 serves as a guide member that guides the electronic component placed in the storage bowl 420 to the suction position. The support mechanism 424 is a mechanism that supports the electronic component guided by the guide rail 422 at the suction position. The connecting portion 436 is connected to the storage bowl 420 and the vibrating portion of the drive device 408 , and transmits vibration from the drive device 408 to the storage bowl 420 . In addition, in this embodiment, in the electronic component supply apparatuses 402, 404, 406, the connection part 436 and the drive device 408 become a vibrating part. Next, each part will be described in detail.

The storage bowl 420 will be described using FIGS. 55 and 56 . FIG. 55 is an explanatory view showing the relationship between the storage bowl of the electronic component supply device of the component supply unit shown in FIG. 53 and the support portion of the vibration unit. Fig. 56 is an explanatory diagram showing a schematic configuration of the storage bowl shown in Fig. 55 . The storage bowl 420 is a container in which a plurality of electronic components are contained as described above. The container main body 450 of the storage bowl 420 has a box shape with a circular bottom, an outer edge extending in a direction perpendicular to the bottom, and an open top. The storage bowl 420 has a protrusion 451 extending vertically downward on the bottom surface of the main body 450 , and a fastening member 452 for fastening to the coupling portion 436 is inserted into the protrusion 451 . The fastening member 452 is a mounting screw, and can be supported in a rotatable state relative to the boss portion 451 and in a structure that does not detach from the boss portion 451 . The connecting portion 436 is provided with a fastening hole 454 fastened by a fastening member 452 . The storage bowl 420 is fixed to the coupling portion 436 by fastening the fastening member 452 into the fastening hole 454 .

As described above, the storage bowl 420 is detachably fixed to the connecting portion 436 by the fastening member 452, so that the electronic component supply devices 402, 404, 406 and the bowl feeder unit 400 can be connected to each other. The storage bowl 420 is easily disassembled. Thus, the storage bowl 420 can be easily replaced.

In addition, one end of the guide rail 422 is connected to the storage bowl 420 , and the other end is connected to the support mechanism 424 . The guide rail 422 is formed with a guide groove for guiding electronic components, so that the electronic component carried out from the storage bowl 420 moves along the guide groove, and is guided to a part connected to the supporting mechanism 424 . In addition, as will be described later, the part where the guide rail 422 is connected to the storage bowl 420 is fixed to the vibrating part of the driving device 408 and vibrates together with the storage bowl 420 . In addition, one end portion of the guide rail 422 connected to the support mechanism 424 is supported in a slidable state in one direction in which the guide rail 422 extends.

The two bowl-type feeder units 400 shown in FIG. 50 and FIG. 51 each have a plurality of storage bowls 420a, 420b, and 420c arranged in the vertical direction. The one closest to the respective holding positions (attracting positions) of the plurality of guide rails 422a, 422b, 422c is used as the bowl feeder unit 400 in the first row, and the one farther from the holding position is used as the bowl feeder unit 400 in the second row. feeder unit 400 . At this time, the plurality of guide rails 422a, 422b, 422c included in the bowl feeder unit 400 of the second row are located on the sides of the plurality of guide rails 422a, 422b, 422c included in the bowl feeder unit 400 of the first row. , arranged side by side along the vertical direction. And, as shown in FIG. 53 , their front ends are developed along a direction perpendicular to the extending direction of the plurality of guide rails 422a, 422b, 422c, and the respective holding positions of the plurality of guide rails 422a, 422b, 422c, that is, the support mechanism 424a, 424b and 424c are arranged side by side on the same plane.

Next, the supporting mechanism 424 will be described using FIGS. 57A to 58B . 57A is a perspective view showing a schematic configuration of a support mechanism of the electronic component supply device of the component supply unit shown in FIG. 53 . Fig. 57B is a front view showing a schematic structure of the support mechanism shown in Fig. 57A. Fig. 58A is a perspective view showing another state of the support mechanism shown in Fig. 57A. Fig. 58B is a front view showing a schematic structure of the support mechanism shown in Fig. 58A. 57A and 57B show the state where the position adjustment bracket 470 of the support mechanism 424 is closed, and FIGS. 58A and 58B show the state where the position adjustment bracket 470 of the support mechanism 424 is opened. In addition, in FIG. 57B and FIG. 58B , in order to show the relative positions of the components, the guide groove 464 is virtually shown on the upper side of the bracket 470 .

The support mechanism 424 has a base 460 , a rail support portion 462 , a guide groove 464 , and an adsorption position adjustment unit 468 . The base 460 is a component fixed to a fixing portion of the bowl feeder unit 400 . The rail support portion 462 is a wheel portion rotatably supported on the base 460 , and supports the rail 422 from below in the vertical direction. The rail support part 462 rotates corresponding to the movement in the direction parallel to the extending direction of the rail 422 . Accordingly, the guide rail 422 is supported in a movable state in a direction parallel to the extending direction with respect to the supporting mechanism 424 . The guide groove 464 is formed at an end portion of the base 460 in the extending direction of the guide rail 422 . The guide groove 464 is connected to the groove of the guide rail 422 and receives electronic components guided by the guide rail 422 . That is, the guide groove 464 accepts electronic components passing through the guide rail 422 .

The adsorption position adjustment unit 468 is a mechanism for adjusting the adsorption position of the electronic component in the support mechanism 424 , and includes a position adjustment bracket 470 , a rotation shaft 472 , a fixing portion 474 , and a screw 476 . The position adjustment bracket 470 is a member disposed at a position closing the guide groove 464 , and a protrusion 480 is formed at an end portion on the side of the guide rail 422 . The position adjustment bracket 470 closes the guide groove 464 with the projection 480 , thereby supporting the electronic component passing through the guide groove 464 so that it does not move downstream of the projection 480 in the moving direction of the electronic component. . Accordingly, the position adjustment bracket 470 can hold the electronic component at a predetermined position in the guide groove 464 . The rotation shaft 472 is a shaft protruding in the direction in which the guide groove 464 extends, and is rotatably fixed to the fixing portion 474 . The rotation shaft 472 supports the bracket 470 for position adjustment so that the bracket 470 for position adjustment can move along the direction in which the guide groove 464 extends, and can rotate about the shaft protruding in the direction in which the guide groove 464 extends. status. The fixing part 474 is fixed on the base 460 .

The screw 476 is a member for fixing the position adjustment bracket 470 to the fixing portion 474 , and the screw 476 is inserted into a long hole 482 formed in the position adjustment bracket 470 . The elongated hole 482 is a hole whose longitudinal direction is the direction in which the guide groove 464 extends. In the adsorption position adjustment unit 468, the bracket 470 for position adjustment is fixed on the fixed part 474 by using the screw 476, thereby the bracket 470 for position adjustment is fixed, so that the bracket 470 for position adjustment can be fixed relative to the fixed part. 474 is in a state of moving along the direction in which the guide groove 464 extends, and is in a state of being able to rotate around an axis protruding in the direction in which the guide groove 464 extends.

The adsorption position adjustment unit 468 has the above-mentioned structure, and as shown in FIGS. 57A and 57B , by fixing the position adjustment bracket 470 to the fixing part 474 with the screw 476, the electronic component can be supported at a predetermined position of the support mechanism 424. . 58A and 58B, by removing the screw 476 from the position adjustment bracket 470, the suction position adjustment unit 468 can open the downstream end 490 of the guide groove 464 in the moving direction of the electronic component. Accordingly, the electronic components supplied to the guide rail 422 and the guide groove 464 can be discharged from the front end of the guide groove 464 , that is, the end on the downstream side in the moving direction of the electronic component. As described above, by forming a mechanism capable of ejecting electronic components from the front end of the guide groove 464, when the electronic components to be supplied are changed by replacing the storage bowl 420, the electronic components remaining in the guide rail 422 and the guide groove 464 can be easily discharged. electronic components.

The electronic component supply apparatuses 402, 404, 406 make the bracket 470 for position adjustment into the following structure, that is, become the state that can move along the extending direction of the guide groove 464 with respect to the fixed part 474, and fix it with the screw 476, thereby The position of the position adjustment bracket 470 in the extending direction of the guide groove 464 can be easily adjusted. Thereby, the position which supports an electronic component can be changed according to the kind of electronic component. That is, the position of the protrusion 480 can be adjusted corresponding to the suction position of the electronic component. Thereby, even when the supplied electronic components are of different types, the electronic components can be supported at appropriate suction positions.

In addition, the electronic component supply apparatuses 402, 404, 406 make the storage bowl 420 the above-mentioned structure and the support mechanism 424 the above-mentioned structure, so that the storage bowl 420 can be easily replaced, and electronic components remaining during replacement can be easily discharged. Thereby, the kind of the electronic component supplied by the electronic component supply apparatus 402, 404, 406 can be changed easily.

Next, the driving device 408 will be described using FIGS. 52 to 54 and FIGS. 59 to 64 . FIG. 59 is a plan view showing a schematic configuration of a drive device of the electronic component supply device of the component supply unit shown in FIG. 53 . Fig. 60 is a perspective view showing a schematic configuration of the driving device shown in Fig. 59 . Fig. 61 is an enlarged plan view showing an enlarged schematic configuration of the driving device shown in Fig. 59 . Fig. 62 is a side view showing a schematic configuration of the driving device shown in Fig. 59 . Fig. 63 is a side sectional view showing a schematic configuration of the driving device shown in Fig. 59 . FIG. 64 is an explanatory diagram for explaining the operation of the driving device shown in FIG. 59 .

As shown in FIGS. 59 to 62 , the driving device 408 has a motor 430 , a shaft 432 , a linear guide 433 , a stopper 434 , a guide support 502 , a proximal guide 504 , a fixed part 506 and a rotating part 508 .

As shown in FIGS. 59 to 63 , the motor 430 is a drive source of the drive device 408 and has a motor body 550 , an eccentric shaft 552 , a bearing 554 , and a linear guide 556 . The motor 430 rotates the eccentric shaft 552 by rotating the shaft 550 a with the motor main body 550 . The motor 430 transmits rotational force via the eccentric shaft 552 and the bearing 554 to rotate the linear guide 556 .

As shown in FIGS. 59 to 63 , the shaft 432 is rotatably supported by bearings 562 and 564 fixed to the fixed portion. In addition, the bearings 562 and 564 are supported by a washer 566 connected to the shaft 432 so as not to move in the vertical direction.

The vicinity of one end of the linear guide 433 is rotatably supported by the outer end of the linear guide 556 , and the vicinity of the other end is fixed to the mounting stopper 434 . In addition, the linear guide 433 is supported in a rotatable state around the shaft 432 . Here, among the linear guide 433 and the linear guide 556, the linear guide 433 serves as a rail unit, and the linear guide 556 serves as a slide unit. Thus, the linear guide 433 is connected to the linear guide 556 in a state where the connection position can move. That is, the position at which the linear guide 433 is connected to the linear guide 556 changes. With such a configuration, by rotating the linear guide 556 , the linear guide 433 turns around the shaft 432 .

The attachment stopper portion 434 is supported in a state to be rotatable about the shaft 432 , and is connected to the linear guide 433 . The attachment stopper portion 434 and the linear guide rail 433 are connected by a connection member 570 . The mounting stopper portion 434 is an elongated plate-shaped member protruding in a horizontal direction perpendicular to the extending direction of the linear guide rail 433 , and its end is connected to the rail support portion 502 . In addition, the upper surface of the plate-shaped member where the attachment stopper portion 434 is connected to the linear guide rail 433 is connected to the connection portion 436 . In addition, the attachment stopper portion 434 has the same elongated plate member as the linear guide rail 433 connected to each connecting portion 436 , and its upper surface is connected to the connecting portion 436 . Furthermore, as shown in FIGS. 52 to 53 , the attachment stopper portion 434 is provided with a rod portion extending in the vertical direction, and the rod portion is connected to an end portion of an elongated plate-shaped member. As a result, the attachment stopper portion 434 and the elongated plate-like member connected to the connection portion 436 integrally rotate around the shaft 432 as a rotation axis.

The rail support portion 502 is connected to an end portion of the mounting stopper portion 434 . One end portion of the base end rail 504 is connected to the rail support portion 502 , and the other end portion is connected to the guide rail 422 . The proximal end rail 504 converts the rotational motion of the mounting stopper portion 434 into a linear motion by using the rail support portion 502 and transmits it. In addition, the base end guide rail 504 is connected to the electronic component supply part of the storage bowl 420 , and guides the electronic component supplied from the storage bowl 420 to the guide rail 422 . The fixed part 506 is fixed to a base or the like which is a non-moving part of the drive device 408 . The rotating part 508 is supported on the fixing part 506 in a rotatable state. The rotating part 508 has a fixed end 520 rotatably supported by the fixed part 506 , and a movable end 522 serving as a connecting part between the base end rail 504 and the guide rail 422 . In the rotating portion 508 , the movable end 522 is connected to the connection portion between the proximal rail 504 and the rail 422 , and the movement range of the connection portion between the proximal rail 504 and the rail 422 is restricted.

The driving device 408 has the above-mentioned structure, and as shown in FIG. 64 , the motor 430 is a driving source, and rotates while transmitting a driving force to the linear guide 433 . In addition, the attachment stopper part 434 is fixed in a rotatable state around the shaft 432 , and rotates around the rotation axis of the shaft 432 by rotating the linear guide 433 . The rotation of the mounting stopper portion 434 is transmitted to the rail support portion 502 . The rail support part 502 converts the driving force in the rotational direction of the mounting stopper part 434 into the driving force in the linear direction, and reciprocates the proximal end rail 504 in a direction parallel to the extending direction of the rail. At this time, the rotating part 508 provided on the connection part between the base end guide rail 504 and the guide rail 422 rotates the connection part between the base end guide rail 504 and the guide rail 422 , that is, the movable end 522 around the fixed end 520 . The driving device 408 is formed as described above, and vibrates the installation stopper part 434 and the base end guide rail 504 so that the storage bowl 420 mounted on the installation stopper part 434 and the guide rail connected to the base end guide rail 504 via the connection part 436 are vibrated. 422 vibrations. The bowl feeder unit 400 vibrates the storage bowl 420 by the driving device 408 to move the electronic components put in the storage bowl 420 in the storage bowl 420 and supply them to the guide rail 422 . In addition, the bowl feeder unit 400 supplies the electronic components guided in the guide rail 422 to the support mechanism 424 by vibrating the guide rail 422 by the driving device 408 .

The bowl feeder unit 400 stacks the storage bowls of the component supply devices 402, 404, and 406 in the vertical direction as described above, so that the horizontal area can be effectively used, and a plurality of component supply devices can be arranged in a space-saving manner. Thus, the bowl feeder unit 400 can supply a plurality of electronic components to the suction position. In addition, in the bowl feeder unit 400 , by stacking the storage bowls of the component supply devices 402 , 404 , and 406 in the vertical direction as described above, the support mechanism 424 can be arranged close to the horizontal direction. Thereby, the suction position of the electronic component can be approached, and the moving distance of the mounting head at the time of component suction can be reduced. In addition, the bowl feeder unit 400 can reduce the number of drive sources by using one drive device 408 as a drive unit for the three component supply devices 402, 404, and 406, and can simplify the device structure. In addition, by supporting the rotation shafts of the component supply devices 402 , 404 , and 406 by the fixing unit 410 , each part can be stably vibrated. In addition, in the bowl feeder unit 400 of the above-mentioned embodiment, three component supply devices are provided, but the present invention is not limited thereto, and the number of component supply devices is not limited.

In addition, in this embodiment, although the drive mechanism which vibrates the storage bowl 420 is used as the drive part of the bowl feeder unit 400, it is not limited to this. The electronic component supply device (bowl feeder) constituting the bowl feeder unit 400 may supply the electronic component 80 to the rail 422 by vibrating the storage bowl 420 . For example, a drive unit that swings the storage bowl 420 may be used as the drive unit.

Fig. 65 is an enlarged perspective view showing a part of the electronic component supply device. The component supply devices 402, 404, and 406 of the bowl feeder unit 400, as shown in FIG. , 580b, 580c. The starting end side component detection sensors 580 a , 580 b , 580 c detect the presence or absence of electronic components at the ends of the guide rail 422 on the housing bowl 420 side. Laser sensors can be used as the starting end side component detection sensors 580a, 580b, and 580c. The bowl feeder unit 400 can detect whether or not the electronic components are staying on the guide rail 422 by detecting whether or not the electronic components are present at the end of the guide rail 422 on the storage bowl 420 side by using the starting end side component detection sensors 580a, 580b, 580c. And in full state to detect. For example, when the state of the electronic component detection sensor 580a, 580b, 580c on the head end side detects the state of the electronic component continuously for a certain period of time, the bowl feeder unit 400 becomes unable to guide the rail due to the electronic component staying at a predetermined position. 422 ahead of the state, so it can be judged as a full state.

Fig. 66 is an enlarged perspective view showing a part of the electronic component supply device. As shown in FIG. 66, the component supply devices 402, 404, and 406 of the bowl feeder unit 400 include a holding position side component detection sensor 582a for detecting the presence or absence of electronic components at the front end (attraction position, holding position) of the guide rail 422, 582b, 582c. The holding position side component detection sensors 582 a , 582 b , and 582 c detect whether or not an electronic component is present at the holding position, which is the front end side of the corresponding guide rail 422 . The holding position side member detection sensor 582a is an optical sensor having a light emitting unit 584a and a light receiving unit 586a. Both the light emitting unit 584a and the light receiving unit 586a are arranged at positions interposing the holding position. The holding position side component detection sensor 582a detects that there is no electronic component in the measurement area (holding position in this embodiment) when the measurement light output from the light emitting unit 584a is received by the light receiving unit 586a. The holding position side component detection sensor 582a detects the presence of an electronic component in the measurement area (holding position in this embodiment) when the measurement light output from the light emitting unit 584a is not received by the light receiving unit 586a. Similarly, the holding position side component detection sensor 582b is also an optical sensor having a light emitting unit 584b and a light receiving unit 586b, and the holding position side component detection sensor 582c is also an optical sensor having a light emitting unit 584c and a light receiving unit 586c. Holding position side component detection sensors 582a, 582b, and 582c detect the presence or absence of electronic components with the same configuration. The bowl feeder unit 400 detects the presence or absence of electronic components at the holding positions by the holding position side component detection sensors 582a, 582b, and 582c, and drives the bowl feeder unit 400 based on the detection results. The bowl feeder unit 400 drives the drive device 408 and conveys the electronic component, for example, when it is determined by the component detection sensors 582a, 582b, and 582c on the holding position side that there is no electronic component at the holding position.

In addition, when the electronic component mounting apparatus 10 uses the suction nozzle 32 of the mounting head 15 to perform the operation of holding the electronic component at the holding position of the bowl feeder unit 400, it may use the holding position side component detection sensor 582a , 582b, 582c detect that there is an electronic component at the holding position, perform a holding operation for holding the electronic component at the holding position, and use the holding position side component detection sensors 582a, 582b, 582c to detect that the electronic component is at the holding position Standby in the absence of electronic components. Thereby, the electronic component mounting apparatus 10 can more reliably hold the electronic component, and can suppress the situation where the holding operation is performed without the electronic component at the holding position. Accordingly, the electronic component mounting apparatus can more efficiently perform the holding operation of the electronic component.

Fig. 67A is an enlarged perspective view showing a part of the electronic component supply device. Fig. 67B is a perspective view showing a part of the electronic component supply device shown in Fig. 67A from another direction. In addition, in FIG. 67A, FIG. 67B, although the component supply apparatus 402 of the bowl type feeder unit 400 is shown, the component supply apparatus 404,406 also has the same structure. The component supply device 402 has an air blower 590 that blows upward in the vertical direction (arrow 591 ) when the electronic component of the storage bowl 420 is located at the end of the proximal guide rail 504 that connects the storage bowl 420 and the guide rail 422 on the side of the guide rail 422 . direction) to inject air. The air blower 590 blows air in the direction of the arrow 591 toward the end of the base end rail 504 on the side of the guide rail 422 to return the electronic component located at that position to the housing bowl 420 .

The base end rail 504 is provided with a guide portion 592 at a connection portion with the storage bowl 420 . The guide part 592 guides the electronic components that are not properly oriented among the electronic components conveyed from the storage bowl 420 to the base end rail 504 toward the storage bowl 420 . That is, the guide portion 592 prevents electronic components conveyed in an inappropriate orientation among the electronic components conveyed to the proximal rail 504 from entering the proximal rail 504 . Specifically, the guide portion 592 arranges a plate-shaped member at a position where a lead wire of an electronic component in an inappropriate direction contacts, and guides the electronic component with the lead wire contacted to the storage bowl 420 .

In addition, the proximal end rail 504 is provided with a drop portion 594 on the upper side in the vertical direction of the region where the air blower 590 blows air. The drop portion 594 is disposed outside the proximal end rail 504 (on the side away from the storage bowl 420 ), and has an inclined portion that gradually approaches the storage bowl 420 as it goes upward in the vertical direction. The drop portion 594 guides the electronic component lifted vertically upward by the air blown from the blower portion 590 to the storage bowl 420 side by using the inclined portion. Thereby, it is possible to suppress electronic components from flying out of the housing bowl 420 .

As shown in FIGS. 67A and 67B , the component supply device 402 can properly guide the electronic components to the guide rail 422 by providing the air blower 590 to return the electronic components moving toward the guide rail 422 to the storage bowl 420 . For example, the component supply device 402 can periodically return the electronic component located at the target position to the storage bowl 420 by regularly blowing air from the air blower 590 . Thereby, it is possible to exclude electronic components that are conveyed obliquely with respect to the guide rail 422 and are not carried into the guide rail 422 in the target area. In addition, the component supply device 402 may use the blower unit 590 to remove electronic components in an inappropriate orientation that cannot be removed by the guide unit 592 . In addition, in this embodiment, an air blower 590 is provided as a mechanism for returning the electronic components on the proximal guide rail 504 at the leading end of the guide rail 422 to the housing bowl 420 , but the present invention is not limited thereto. For example, a mechanical mechanism may be used instead of the air blower 590 .

Next, the operation of each part of the electronic component mounting apparatus will be described. In addition, the operation of each part of the electronic component described below can be executed by controlling the operation of each part by the control device 20 .

The shape recognition operation of the electronic component of the electronic component mounting apparatus will be described using FIGS. 68 to 74 . FIG. 68 is an explanatory diagram for explaining an electronic component shape recognition operation of the electronic component mounting device. FIG. 69 is an explanatory diagram for explaining an electronic component shape recognition operation of the electronic component mounting device. FIG. 70 is an explanatory diagram for explaining an electronic component shape recognition operation of the electronic component mounting device. FIG. 71 is an explanatory diagram for explaining an electronic component shape recognition operation of the electronic component mounting device. FIG. 72 is an explanatory diagram for explaining an electronic component shape recognition operation of the electronic component mounting device. FIG. 73 is a schematic diagram showing an example of detection results of recognition actions. FIG. 74 is a schematic diagram showing an example of detection results of recognition actions.

The electronic component mounting apparatus 10 measures the shape of an electronic component using the laser recognition device 38 as described above. As shown in FIG. 68, the laser recognition device 38 outputs laser light from the light source 38a in the state where the electronic component 80 is disposed between the light source 38a and the light receiving element 38b, and detects the arriving laser light by the light receiving element 38b, thereby detecting the incoming laser light arranged between the light source 38a and the light receiving element 38b. The shape of the member between the light receiving elements 38b is detected. In addition, after the laser recognition device 38 detects the shape in one direction of the electronic component 80 sucked by the suction nozzle 32, the suction nozzle 32 is moved or rotated by the suction nozzle drive unit 34, and the electronic component 80 is moved or rotated, and the process is performed again. shape detection. As described above, by rotating the electronic component 80 , the laser recognition device 38 changes the direction of irradiating laser light on the electronic component 80 and the angle of the light receiving element 38 b relative to the electronic component 80 as shown in FIG. 69 .

As shown in FIG. 70, the electronic component mounting apparatus 10, as step S11, corresponds to the height of the electronic component 80 in the Z-axis direction, and recognizes the electronic component 80 by laser light in a state where the electronic component 80 is disposed between the light source 38a and the light receiving element 38b. The device 38 irradiates a certain area with laser light from a light source 38a. Then, in the electronic component mounting apparatus 10 , as step S12 , the rotation of the electronic component 80 (rotation in the θ direction) is started.

Then, when the rotation speed of the electronic component 80 reaches a constant speed, the electronic component mounting apparatus 10 starts measuring the shape of the electronic component 80 in a predetermined orientation by the laser recognition device 38 as step S13 . At this time, the laser recognition device 38 irradiates laser light to a certain area from the light source 38a with the electronic component 80 disposed between the light source 38a and the light receiving element 38b, and receives the laser light by the light receiving element 38b. Here, the laser light intercepted by the electronic component 80 does not reach the light-receiving element 38 b or its intensity decreases. Thereby, the laser recognition device 38 can detect the shape of the electronic component 80 in the cross section of the measured angle based on the distribution of the laser light received by the light receiving element 38b. In this embodiment, the laser recognition device 38 detects the edge part of the laser light received by the light receiving element 38b, and detects the outermost shape of the electronic component 80 in this direction. In the electronic component mounting apparatus 10 , as step S14 , while rotating the electronic component 80 , the shape detection of the electronic component 80 is repeated by the method of step S13 , thereby detecting the shape of the electronic component 80 in one rotation. Thereby, the shape of the electronic component 80 can be detected in all directions. As mentioned above, the laser recognition device 38 detects the shape in the direction of one rotation, and as shown in FIG. shape).

Here, as described above, the electronic component mounting apparatus 10 of the present embodiment mounts the electronic component 80 which is a radial lead type electronic component on the substrate 8 . When the electronic component mounting apparatus 10 detects the shape of the electronic component 80 shown in FIG. 72, the detected shape differs depending on the height in the Z-axis direction for measurement. That is, the laser recognition device 38 of the electronic component mounting apparatus 10, as shown in FIG. The detected shape in the case is a different shape.

For example, if the laser recognition device 38 performs shape measurement on the line A shown in FIG. 72 , the shape of the main body 82 of the electronic component 80 can be detected as shown in FIG. 73 . In addition, if the laser recognition device 38 performs shape measurement on the line B shown in FIG. 72 , the shape of the lead wire 84 of the electronic component 80 can be detected as shown in FIG. 74 . In addition, since the laser recognition device 38 detects the shape of the outermost portion of the electronic component at the measured height, a shape related to the outermost portion (the outermost lead 84 ) of the electronic component is detected as the shape of the electronic component. In addition, if the laser recognition device 38 performs shape measurement at the line C shown in FIG. The shape of the lower surface position of the lead wire 84. The electronic component mounting apparatus 10 can adjust the height of the Z-axis direction of the adsorption nozzle 32 which adsorbs the electronic component 80, so that the position where the laser recognition device 38 measures the shape of the electronic component 80 can be various positions.

75 is an explanatory diagram for explaining the recognition operation of the shape of the electronic component by the electronic component mounting device. In addition, in the electronic component mounting apparatus 10 , an electronic component 80 a shown in FIG. 75 may be used as an electronic component of the radial lead type electronic component. The electronic component 80a forms a cutout 89 in a part of the main body 82a. The portion of the electronic component 80a in which the notch 89 is formed has a shape different from that of other electronic components. In addition, the electronic component 80a can determine the orientation from the position where the notch 89 is formed.

Here, the control unit 60 of the electronic component mounting apparatus 10 according to the present embodiment sets in advance the position of the electronic component to be mounted, that is, the position of the electronic component to be picked up by the suction nozzle (the position of the electronic component in the Z-axis direction of the electronic component) by the operator. position), the shape of the electronic component at the position set by the operator is detected by the laser recognition device 38 . As described above, the electronic component mounting apparatus 10 measures the shape of the electronic component based on the position set by the operator, so that the characteristic shape part of the electronic component can be used as the measurement position, and the electronic component can be mounted more accurately. Type identification and detection of the orientation of electronic components.

In addition, although the electronic component mounting apparatus 10 demonstrated the case where the shape recognition of an electronic component was performed using the laser recognition device 38, it is not limited to this. In the electronic component mounting apparatus 10 , a camera (the VCS unit 17 of the present embodiment) that three-dimensionally measures the shape of the electronic component supported on the housing 11 may be used as the state detection unit. In addition, a known camera for three-dimensionally measuring the shape of an electronic component other than the VCS may be used. The same process can be performed by measuring the distance between the lead ends of the electronic component to be measured, the bent shape of the lead, the shape of the component body, etc., using a camera that three-dimensionally measures the shape of the electronic component.

FIG. 76 is a flowchart showing an example of the operation of the electronic component mounting device. The outline of the overall processing operation of the electronic component mounting apparatus 10 will be described using FIG. 76 . In addition, the processing shown in FIG. 76 is executed by controlling the operation of each part by the control device 20 . In the electronic component mounting apparatus 10, a production program is read as step S52. The production program is generated by a dedicated production program generation device, or by the control device 20 based on various input data.

After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus as step S54. Specifically, the configurations of the component supply units 14f and 14r, the types of filled electronic components, the types of prepared suction nozzles, and the like are detected. After the electronic component mounting apparatus 10 detects the state of the apparatus in step S54 and completes the preparation, as step S56 , the board is carried in. The electronic component mounting apparatus 10 carries in a board|substrate in step S56, arrange|positions a board|substrate to the position to mount an electronic component, and as a step S58, mounts an electronic part on a board|substrate. The electronic component mounting apparatus 10 carries out the board|substrate as step S60 after completion|finish of mounting of an electronic component in step S58. After the electronic component mounting apparatus 10 unloads the substrate in step S60, it is determined in step S62 whether or not the production has been completed. When the electronic component mounting apparatus 10 determines in step S62 that production has not been completed (No), it proceeds to step S56 and executes the processing from step S56 to step S60 . That is, a process of mounting electronic components on a substrate based on a production program is performed. When the electronic component mounting apparatus 10 determines in step S62 that the production has been completed (YES), it ends this process.

The electronic component mounting apparatus 10 reads the production program and performs various settings as described above, and then mounts the electronic component on the substrate, thereby manufacturing the substrate on which the electronic component is mounted. In addition, in the electronic component mounting apparatus 10, as an electronic component, a lead type electronic component having a main body and a lead connected to the main body is mounted on a substrate, specifically, by inserting the lead into a hole (insertion hole) formed on the substrate. Inserted in, so that the electronic components can be mounted on the substrate.

Fig. 77 is an explanatory diagram showing an example of an operation screen. Fig. 78 is an explanatory diagram showing a part of the operation screen. Fig. 79A is an explanatory diagram showing an example of a component supply angle. Fig. 79B is an explanatory diagram showing an example of a component supply angle. FIG. 80 is an explanatory diagram showing an example of an operation screen. FIG. 81 is an explanatory diagram showing an example of an operation screen. Fig. 82 is an explanatory diagram showing a part of the operation screen. 83A to 83D are explanatory views each showing an example of a measurement position of an electronic component.

Next, an example of the process of registering various information of the electronic component mounted on the electronic component mounting apparatus 10 is demonstrated using FIG. 77 to FIG. 83D. The electronic component mounting apparatus 10 specifies various values of the mounting process by the production program based on the registered electronic component information, and executes mounting of the electronic component based on the specified values. In addition, various information on electronic components may be registered as a part of the production process, or may be registered as information on a single electronic component shared by a plurality of production processes.

The electronic component mounting apparatus 10 displays an operation screen 602 shown in FIG. 77 on the display unit 42 (the touch panel 42 a or the image monitor 42 b ). The operation screen 602 displays various input items. An operator can input information on electronic components by performing various operations in a state displayed on the operation screen 602 . 77 shows a screen for inputting information on electronic components as component data, the electronic component mounting apparatus 10 may also input board data, mounting data, suction data, and image data.

An operation screen 602 shown in FIG. 77 displays an input item 604 for inputting a component type of an electronic component and an input item 606 for inputting a package shape. In addition, the operation screen 602 includes items for inputting external dimensions including the width, length, height, and lead length of the electronic component; and for selecting whether to use a laser (laser recognition device 38 ) or an image (VCS unit 17 ) in the centering method. Items; Items to enter the package size (size of the main body of the electronic part), etc. In addition, tabs for displaying detailed items such as package shape, centering, additional information, expansion, and inspection are also displayed on the operation screen 602 . In addition, in the operation screen 602 of this embodiment, as detailed items of the package shape, there are input items 608 indicating the angle of electronic components supplied to the holding position, input items 608 indicating the angle of electronic components supplied to the holding position, input items indicating the type of holding tape, and an The input item for the spacing information of the configured spacing.

Here, the input item 604 is an item for inputting the type of electronic component to be registered, and when an item is selected, a list 610 of selected items is displayed on the pull-down menu as shown in FIG. 78 . In the list 610 , in addition to the types of various electronic components, options for inserting components and other components are displayed. The operator can input information into the input item 604 of the component category by aligning the cursor 612 with a desired selection item and performing a confirmation operation.

In the input item 608, 0°, 90°, 180°, 270°, or others can be selected as the component providing angle indicating the angle of the electronic component supplied to the input holding position. For example, as shown in FIG. 79A , when the target electronic component is the electronic component 614 , the states of the electronic component 614 after every 90° rotation are 0°, 90°, 180°, and 270° attitudes. The operator inputs an angle to the input item 608 based on the posture of the electronic component 614 when it is supplied to the holding position of the electronic component supply apparatus. In addition, the reference position of the angle of the electronic component 614 may be set by an operator.

In addition, in the electronic component mounting apparatus 10 , as shown in FIG. 79B , the electronic component 616 may be held in a state inclined at a predetermined angle with respect to the holding tape 618 . Here, the electronic component 616 is a film capacitor. When the posture shown by the electronic component 616 does not correspond to any of 0°, 90°, 180°, and 270°, the operator inputs the angle of the electronic component 616 in "Other". Here, in the case of holding the electronic component 616 , in the mounting head 15 , it is preferable to use a holding suction nozzle that clamps and holds the electronic component 616 as the suction nozzle 32 . When the electronic component mounting apparatus 10 holds the electronic component 616 using the holding suction nozzle, the angle of the suction nozzle can be adjusted based on the angle provided to the component input in "Other" of the input item 608, so that the gripping nozzle can be adjusted. The contact surface of the holding nozzle is formed at an angle corresponding to the inclination of the electronic component 616, so that the occurrence of holding errors can be reduced.

In the electronic component mounting apparatus 10, when the operation screen 602 shown in FIG. An operation screen 620 shown in FIG. 80 is displayed on a part of the screen 602 . The operation screen 620 includes an input item 622 of a loading pushing amount and an input item 624 of an adsorption pushing amount. In addition, the operation screen 620 also displays the following selection items: whether to perform a test run, whether to confirm component release by a sensor, whether to perform component suction position correction, whether to perform automatic teaching, and whether to perform component skipping. In addition, an item of component disposal for inputting an electronic component processing method when the component is discarded (when it is determined that the component cannot be mounted) is also displayed.

The input item 622 is an item for setting the size of the electronic component to be press-fitted from the upper surface of the substrate at the time of mounting. "0" is a value which makes the distance between an electronic component and a board|substrate zero among design values. In the electronic component mounting apparatus 10, when the numerical value becomes larger in the positive direction, the electronic component is moved to a state of being pressed in below the substrate in the vertical direction. By setting the push-in amount, it is possible to suppress the occurrence of mounting misalignment or component slipping on the solder when mounting without reaching the substrate due to the influence of the flatness of the substrate, etc. In addition, in order to more reliably mount the electronic component on the board, it is preferable to set the initial value to a positive value, for example, to 0.5 mm.

The input item 624 is the pushing amount at the time of component holding. That is, it is an item for setting the distance between the suction nozzle and the electronic component when the electronic component is held by the suction nozzle at the holding position of the electronic component supply apparatus. "0" is a value that makes the distance between the electronic component and the holding portion of the suction nozzle zero in the design value. In the electronic component mounting apparatus 10, when the numerical value becomes larger in the positive direction, the suction nozzle is moved to a state in which the electronic component is pressed downward in the vertical direction. By setting the push-in amount, it is possible to suppress the influence of fluctuations in the size (height) of the component, such that the suction nozzle cannot reach the electronic component, the component cannot be sucked or held, or the chip-shaped electronic component is raised, etc. Phenomenon. Moreover, in order to hold an electronic component by a suction nozzle more reliably, it is preferable to set an initial value to a positive value, for example, to 0.2 mm.

In addition, the operation screen 620 displays input items of the component layer. The input item of the component layer is an item for setting the priority of each component in the same mounting layer. By setting this item, it is possible to set the priority of the mounting order of the electronic components when the production is performed in the optimum order.

In addition, the operation screen 620 displays input items of gripping nozzle data. Here, the gripping nozzle is a gripping nozzle that grips and holds an electronic component. The pressing position is a position where the electronic component is pressed when being held. Horizontal clearance is an item for inputting the clearance between the pressing surface of the fixed side arm holding the suction nozzle and the component in negative numbers. Nozzle direction during suction is an item for inputting the direction of the nozzle during suction when parts are supplied at 0 degrees. The suction height fine-tuning value is an item for inputting an offset value of the grip height (suction height) when gripping.

In the electronic component mounting apparatus 10, when the operation screen 602 shown in FIG. An operation screen 630 shown in FIG. 81 is displayed on a part of the operation screen 602 . On the operation screen 630 , items for setting various conditions of the state detection process of the electronic component executed by the laser recognition device 38 are displayed. The operation screen 630 includes an input item 632 for setting the moving speed of the suction nozzle, an input item 632 for the laser height, and an input item 634 for the component shape. Here, θ speed (during measurement) is an item for inputting the θ-axis acceleration of the suction nozzle during laser recognition, and θ speed (outside of measurement) is the input of rotation after laser centering, such as rotation for obtaining a mounting angle, etc. The item of the θ-axis acceleration of the suction nozzle in the case.

The input item 632 is an item for inputting the distance from the tip of the suction nozzle to the laser irradiation surface at the time of measurement. The input item 634 is an item for inputting the shape of the electronic component to be measured. As shown in FIG. 82 , the component shape information is input by specifying it with a cursor 638 from a list 636 of display options. By inputting the shape of the component, specifically the main body shape of the electronic component, in the input item 634 , when the shape of the electronic component is recognized by the laser recognition device 38 , it can be determined whether it is a feature point of the electronic component. For example, when no notch is input in the input item 634, four vertices are detected. In the case of the electronic components 640 and 641 shown in FIG. 83A , the positions of four vertices 1 to 4 are respectively detected. Thus, it is possible to detect positional deviation and angular deviation. In addition, when a missing corner is input to the input item 634, 5 to 8 vertices are detected. In the case of the electronic component 642 shown in FIG. 83B , the positions of six vertices 1 to 6 are detected. In the case of the electronic component 643 shown in FIG. 83B , the positions of eight vertices 1 to 8 are detected. Thus, it is possible to detect positional deviation and angular deviation. When PLCC is input to the input item 634, eight vertices are detected. In the case of the electronic component 644 shown in FIG. 83C , the positions of eight vertices 1 to 8 are detected. In addition, in the case of PLCC, positional deviation and angular deviation can be detected using 4 points out of 8 detected vertices. In addition, when flexibility is input in the input item 634, 8 points in the vicinity which make the member width of an XY direction minimum are detected. In the case of the electronic components 646 and 647 shown in FIG. 83D , the positions of eight points 1 to 8 are detected. In the case of the electronic component 643 shown in FIG. 83D , the positions of eight vertices 1 to 8 are detected. Thus, it is possible to detect positional deviation and angular deviation.

The electronic component mounting apparatus 10 can display the operation screens 602, 620, 630, etc. as described above, and acquire various information related to electronic components. The electronic component mounting apparatus 10 can appropriately mount the electronic component on the board by performing the mounting process of the electronic component based on the acquired various information related to the electronic component. In addition, the electronic component mounting apparatus 10 can provide various inputs suitable for leadless electronic components without leads (mount-type electronic components) and lead-type electronic components with leads inserted into the board (plug-in electronic components). Processing corresponding to each electronic component is performed. For example, in the electronic component mounting apparatus 10, as a component type, an insertion component indicated as an insertion type electronic component can be input. Thus, the electronic component mounting apparatus 10 can detect whether it is a mount-type electronic component or an insertion-type electronic component by detecting the type of the component, that is, whether the lead wire is inserted into the hole (insertion hole) of the substrate during mounting ( plugged in or piggybacked) for detection.

The recognition operation of the shape of an electronic component will be described using FIGS. 84 and 85 . 84 and 85 are flowcharts each showing an example of the operation of the electronic component mounting device. The processing shown in FIGS. 84 and 85 is executed by controlling the operation of each part by the control unit 60 .

The processing shown in FIG. 84 is processing for setting a position for measuring the shape of an electronic component. Here, the control unit 60 may perform the processing shown in FIG. 84 every time the shape of the electronic component is measured, or may execute it for all electronic components when setting the mounting operation of the electronic component on the substrate. In the actual electronic component mounting process, shape measurement can also be performed based on the result (measurement position setting result) performed and determined in advance.

As step S112, the control unit 60 determines whether or not a measurement position is set. Here, the "measurement position setting" refers to the information on the position for measuring the shape of the target electronic component set by the operator, and the input value of the laser height on the above-mentioned operation screen. When the control unit 60 determines in step S112 that there is a setting (Yes), as step S114, the measurement position is set based on the setting, that is, the measurement position set by the operator is set as the electronic component. at the measurement position, this process ends. In addition, when it is determined in step S112 that there is no setting (No), the control unit 60 sets the reference position as the measurement position in step S116 and ends this process. Here, the reference position refers to a reference measurement position set according to the type of electronic component, that is, a capacitor, an IC chip, or the like.

In the electronic component mounting apparatus 10, the measurement position can be set by the operator as described above, and a position arbitrarily set by the operator can be used as the measurement position. In addition, the electronic component mounting apparatus 10 may set a plurality of measurement positions for one electronic component. For example, in the case of a radial lead type electronic component, the shapes of two parts, the main body and the lead, can be measured. In addition, when the measurement position is set, the electronic component mounting apparatus 10 acquires information on the shape of the electronic component at the measurement position based on the setting. In addition, as the information on the shape, the result of measurement by the laser recognition device 38 may be used, or the shape data of the electronic component input by the operator may be used.

Next, the processing shown in FIG. 85 is the processing before mounting the electronic component, specifically, the measurement processing of the shape of the electronic component and the determination processing based on the measurement result. In addition, the control unit 60 executes the process of FIG. 85 for all the electronic components to be sucked. As step S120, the control part 60 acquires the data of the electronic component of a storage object. Here, the data of an electronic component to be held (attraction target, grip target) refers to various information necessary for mounting the electronic component on a substrate. The data of the electronic component to be held is the position of the component supply device 100 holding the electronic component, the shape data of the electronic component, the suction height (holding height) of the electronic component, and the measurement position of the electronic component by the laser recognition device 38 . information etc.

After acquiring the data in step S120, the control unit 60 specifies the measurement position as step S122. That is, the control part 60 specifies the position which detects the shape of an electronic component, ie, the position in the Z-axis direction of an electronic component based on the data acquired in step S120. In addition, the control part 60 may perform the process of step S120 and step S122 before adsorption|suction of an electronic component.

When the measurement position is specified in step S122 and the electronic component is sucked by the suction nozzle, the control unit 60 adjusts the Z-axis position of the electronic component as step S124. That is, the control part 60 moves the measurement position of the electronic component specified in step S122 to the measurement area|region of the laser recognition device 38 by moving a suction nozzle to Z-axis direction. The control part 60 measures the shape of an electronic component as step S126 after adjusting the Z-axis position of an electronic component in step S124. That is, the control unit 60 detects the shape of the electronic component at the measurement position using the laser recognition device 38 .

After the control part 60 detects the shape at the measurement position of an electronic component in step S126, it determines whether measurement is complete|finished as step S128. That is, the control unit 60 determines whether the shape measurement at the measurement position specified in step S122 has been completed. When it is determined in step S128 that the measurement has not been completed (No), the control unit 60 proceeds to step S124 and performs the processing of steps S124 and S126 again to measure the shape of the measurement position where the measurement has not been completed. The control part 60 detects the shape of the set measurement position by repeating position adjustment and shape measurement of an electronic component as mentioned above.

When the control unit 60 determines in step S128 that the measurement has been completed (Yes), in step S130 , the measurement result is compared with the reference data. Here, the reference data is data on the shape of the electronic component to be sucked (to be held) acquired in step S120. The control unit 60 compares the measurement result with the reference data to determine whether the attracted electronic component has a shape matching the reference data, whether the orientation of the electronic component matches the reference data, and the like.

After the comparison in step S130, as step S132, the control unit 60 determines whether or not the component is appropriate. Specifically, in step S132, the control unit 60 determines whether or not the electronic component has been sucked in a mountable state. When the control unit 60 determines in step S132 that the component is unsuitable (No), as step S134 , the electronic component sucked by the suction nozzle is discarded, and this process is ended. The control unit 60 moves the mounting head and the suction nozzle to a position facing the component storage unit 19 , and puts the electronic component held by the suction nozzle into the component storage unit 19 to discard the electronic component. In addition, the control unit 60 executes again the process of mounting the same type of electronic component on the same mounting position (mounting position) on the substrate.

When the control unit 60 determines in step S132 that the component is appropriate (Yes), as step S136 , it determines whether or not the direction of the component (direction in the rotation direction of the suction nozzle) is appropriate. That is, it is determined whether or not the attracted electronic component is oriented in the same direction as the reference. Moreover, as step S136, the control part 60 of this embodiment judges whether an electronic component is reversed. When the control part 60 determines in step S136 that the direction is inappropriate, that is, the electronic component is in an inverted state (No), it inverts the electronic component in step S138, and then proceeds to step S140.

When the determination in step S136 is YES or when the process of step S138 is executed, the control unit 60 finely adjusts the mounting position (mounting position) of the electronic component based on the holding position as step S140 . For example, based on the detection result of the shape of the electronic component, the position at which the suction nozzle picks up the electronic component is detected, and based on the deviation of the holding position from the reference position, the relative position between the suction nozzle and the substrate during mounting is adjusted. The control unit 60 ends this process after executing the process of step S140. Moreover, after performing the process of step S140 of FIG. 85, the control part 60 mounts an electronic component on a board|substrate based on the result of step S140 with respect to the electronic component determined.

The electronic component mounting apparatus 10 detects the shape of the electronic component using the laser recognition device 38 as described above, and performs various processes based on the result to more appropriately mount the electronic component on the substrate.

The electronic component mounting apparatus 10 discards the electronic component in step S134 of the flowchart shown in FIG. 85 , but may execute a process of correcting the lead shape when determining that the lead shape of the electronic component is not appropriate. That is, instead of discarding the electronic component in step S134 , the leads of the electronic component may be corrected (processed) into an insertable shape and mounted at the mounting position (mounting position). In the electronic component mounting device 10, the lead wires of the electronic components can be corrected by using the mechanism for clamping the electronic components of the cutting unit of the electronic component supply device 100, or the lead wires of the electronic components can be corrected by using an additional correction mechanism. fix. As described above, as the processing means for processing the shape of the lead wire, various means such as a mechanism for clamping the main body of the electronic component or the lead wire, and a separately provided correction mechanism can be used.

FIG. 86 is a flowchart showing an example of the operation of the electronic component mounting device. Next, the recognition operation of the state (shape) of the leads of the electronic component will be described using FIG. 86 . In addition, the process shown in FIG. 86 is partly the same process as the electronic component recognition process using the laser recognition apparatus 38 mentioned above. In the electronic component mounting apparatus 10, as step S150, the Z-axis position is adjusted, and the shape of the lead wire is moved to the measurement position. After the electronic component mounting apparatus 10 moves an electronic component to a measurement position in step S150, it rotates an electronic component and performs measurement as step S152. In addition, the process of step S152 is the same as the process of FIG. 70 mentioned above. After the electronic component mounting apparatus 10 performs the measurement in step S152, as step S154, the outermost shape of the lead wire is detected based on the measurement result. That is, the shape related to the outer lead wire is detected at the measurement position.

After the electronic component mounting apparatus 10 detects the outermost shape of the lead wire in step S154, as step S156, the orientation of the electronic component is rotated to the set orientation, and the measurement is performed with the set orientation, that is, with a fixed One direction is measured, and as step S158, the number of lead wires is detected based on the measurement result, and this process ends.

Here, FIG. 87A is an explanatory diagram showing an example of an electronic component. FIG. 87B is an explanatory diagram showing an example of the measurement results of the lead wires. FIG. 88A is an explanatory diagram showing an example of an electronic component. FIG. 88B is an explanatory diagram showing an example of the measurement results of the lead wires. In the electronic component mounting apparatus 10 , for example, when measuring the lead shape of the electronic component 670 shown in FIG. 87A , in step S156 , the measurement is performed in a direction where the laser beam is irradiated toward the front and back of the paper. When the shape measurement of the lead is performed in the orientation shown in FIG. 87A , a waveform 673 shown on a screen 672 shown in FIG. 87B is detected as a measurement result. The output of waveform 673 decreases where the leads are present. Electronic component 670 has five leads. Therefore, in the waveform 673, troughs in which the output decreases are detected at five places.

Next, in the electronic component mounting apparatus 10 , when measuring the lead shape of the electronic component 671 shown in FIG. 88A , measurement is performed in step S156 in the direction of irradiating laser light in the front-back direction of the paper. When the shape measurement of the lead wire is performed in the orientation shown in FIG. 88A , a waveform 675 shown in a screen 674 shown in FIG. 88B is detected as a measurement result. The output of waveform 675 decreases where the leads are present. The electronic component 671 has three leads. Therefore, in the waveform 675 , troughs in which the output decreases are detected at three places.

As described above, in the electronic component mounting apparatus 10, the electronic component is fixed in a predetermined orientation, the shape measurement is performed, and by analyzing the result, it is possible to detect not only the outermost shape of the electronic component, but also a predetermined shape. The number of lead wires (number of pins) detected by orientation. The electronic component mounting apparatus 10 can detect not only the outer shape of the electronic component but also the number of lead wires by performing the process of FIG. 86 .

An example of determining whether or not the electronic component after measuring the shape is appropriate will be described using FIGS. 89 and 90 . That is, an example of processing executed in steps S130 and S132 of FIG. 85 will be described. Fig. 89 is a flowchart showing an example of the operation of the electronic component mounting device. Fig. 90 is an explanatory diagram showing the relationship between lead wires and insertion holes. The electronic component mounting apparatus 10 acquires the outermost shape of the lead wire of an electronic component as step S160. In addition, the outermost shape of the lead wire can be detected by the processing of FIG. 86 described above. After acquiring the shape in step S160, the electronic component mounting apparatus 10 determines whether or not it matches the electronic component to be mounted as step S162. That is, based on the feature point of the outermost shape of the lead wire, it is determined whether or not the electronic component held by the suction nozzle is an electronic component to be mounted. In addition, it is also possible to compare shapes other than the outermost shape of the lead, the shape of the main body, and the like when performing the determination in step S162.

The electronic component mounting apparatus 10 proceeds to step S166 when it determines with the electronic component in step S162 (Yes), and proceeds to step S169 when it determines with inconsistency (No). When the electronic component mounting apparatus 10 judges as YES in step S162, as step S166, it is judged whether the space|interval of the outermost shape is contained in the allowable range. Specifically, the electronic component mounting apparatus 10 compares the detected outermost shape of the lead with the substrate insertion hole into which the lead is inserted, and determines whether the interval between the outermost shape of the lead is within the allowable range of the interval between the insertion holes.

Next, the allowable range when the lead wires 684 of the electronic component 680 are respectively inserted into the four insertion holes 682 arranged at the vertices of the quadrangle shown in FIG. 90 will be described. In addition, in FIG. 90 , the vertical direction on the paper is the Y direction, and the horizontal direction on the paper is the X direction. Here, the diameter of the insertion hole 682 is dP, and the diameter of the lead wire 684 is dL. In addition, the distance in the X direction connecting the farthest positions of the lead wires 684 of the design value is dA, and the distance in the Y direction connecting the farthest positions of the lead wires 684 of the design value is dB.

In the case of the example shown in FIG. 90 , the design values are arranged so that the center of the insertion hole 682 and the center of the lead wire 684 coincide with each other. In this case, the upper limit of the allowable range is the distance connecting the farthest positions of the insertion holes 682 . That is, the upper limit value in the X direction is the distance of the farthest point in the X direction of the insertion hole 682 , that is, dC. The upper limit value in the Y direction is the distance of the farthest point in the Y direction of the insertion hole 682 , that is, dD. In addition, the lower limit value of the allowable range is the distance connecting the farthest positions of the lead wires 684 when the position closest to the insertion hole 682 is inscribed. The lower limit value in the X direction is the distance of the farthest point in the X direction of the lead wire 684a, that is, dE. The lower limit value of the Y direction is the distance of the farthest point in the Y direction of the lead wire 684b, that is, dF. In addition, the allowable range (upper limit value, lower limit value) shown in FIG. 90 is an example, and various settings can be made for the allowable range. For example, the allowable range may be set as long as at least a part of the lead wire is in contact with the insertion hole. By expanding the allowable range, it is possible to reduce discarded electronic components, and by narrowing the allowable range, it is possible to suppress the occurrence of mounting errors.

When the electronic component mounting apparatus 10 determines in step S166 that the space between the outermost shapes is within the allowable range (Yes), it determines in step S168 that the electronic component is appropriate, and ends this process. When the electronic component mounting apparatus 10 determines in step S166 that the interval of the outermost shape is not included in the allowable range (No), in the case of determining No in step S162, as step S169, it is determined that the electronic component is not suitable. , to end this process.

The electronic component mounting apparatus 10 detects the shape of the lead wire, and based on the detected result, determines whether the electronic component is suitable, specifically, whether it can be inserted into the insertion hole, so that the electronic component can be more reliably mounted on the board. That is, the leads of the electronic components can be more reliably inserted into the insertion holes. In particular, when the lead wire is cut by the electronic component supply device and supplied to the holding position as shown in the radial feeder, the lead wire is easily deformed, so the held electronic component may not be easily mounted. Since the electronic component mounting apparatus 10 can determine the state of the lead wires, it is possible to suppress the mounting operation of electronic components that cannot be mounted on the substrate, and to prevent uninserted electronic components from remaining on the substrate. Accordingly, it is also possible to suppress adverse effects on other electronic components. In addition, when performing the process of FIG. 89, in the process of FIG. 86 which detects the lead shape of an electronic component, the process of step S156, S158 does not need to be performed.

FIG. 91 is a flowchart showing an example of the operation of the electronic component mounting device. In FIG. 89 , after determining whether or not the electronic component is appropriate based on the outermost shape of the electronic component, determination based on the number of lead wires may be further performed. In the electronic component mounting apparatus 10, the outermost shape of the lead wire of an electronic component is acquired as step S160. After acquiring the shape in step S160, the electronic component mounting apparatus 10 determines whether or not it matches the electronic component to be mounted as step S162.

The electronic component mounting apparatus 10 proceeds to step S163 when judging in step S162 that it matches the electronic component (Yes), and proceeds to step S169 when judging that it does not match (No). When the electronic component mounting apparatus 10 determines Yes in step S162, as step S163, the lead wire number of the component is acquired. In addition, the number of leads can also be obtained together with the outermost shape. In addition, the outermost shape and the number of lead wires may be measured in advance before this process.

When the electronic component mounting apparatus 10 acquires the number of lead wires in step S163, it determines whether it matches the electronic component to be mounted as step S164. That is, it is determined whether or not the number of leads is the same as that of the electronic component to be mounted. The electronic component mounting apparatus 10 proceeds to step S166 when judging in step S164 that it matches the electronic component (Yes), and proceeds to step S169 when judging that it does not match (No).

When the electronic component mounting apparatus 10 judges as YES in step S164, as step S166, it is judged whether the space|interval of the outermost shape is contained in the allowable range. When the electronic component mounting apparatus 10 determines in step S166 that the space between the outermost shapes is within the allowable range (Yes), it determines in step S168 that the electronic component is appropriate, and ends this process. When the electronic component mounting apparatus 10 determines in step S166 that the interval of the outermost shape is not included in the allowable range (NO), and in the case of determining NO in steps S162 and S164, as step S169, it is determined that the electronic component is Inappropriate, end this process.

The electronic component mounting apparatus 10 detects and compares the number of lead wires of electronic components, thereby distinguishing electronic components that differ only in the number of lead wires. Accordingly, even when the outermost shape of the lead wire is detected to determine the shape of the lead wire, electronic components having different numbers of lead wires can be identified.

The electronic component mounting apparatus 10 can detect the shape of the lead with simple processing by using the laser recognition device 38 as a device for detecting the shape of the lead of the electronic component. In addition, in the above-mentioned embodiment, the outermost shape (outermost lead wire interval) is detected as the shape of the lead wire in order to enable processing and judgment in a short time, but other shapes such as the diameter of the lead wire and other than The outermost lead spacing is detected. In addition, the electronic component mounting apparatus 10 can appropriately perform mounting of a plug-in type electronic component (lead type electronic component) using a structure used in mounting of a mount-type electronic component by using the laser recognition device 38 . In addition, in the electronic component mounting device 10 , other devices such as the VCS unit 17 having a camera may be used as a device for detecting the lead shape of an electronic component. In addition, in the case of using the VCS unit 17, since the shape of the electronic component is measured from the lower side of the electronic component, it is possible to measure the electronic component from the side, that is, the position in the Z-axis direction and the light source In the case of the laser recognition device 38 that measures electronic components at the same position as the light receiving element 38a and the light receiving element 38b, the processing may become complicated and the accuracy may decrease.

Next, the determination operation for determining the mounting order (mounting order) of electronic components will be described using FIGS. 92 and 93 . The mounting sequence includes the sequence of inserted electronic components. FIG. 92 is an explanatory diagram for explaining the operation of the electronic component mounting device.

The electronic component mounting apparatus 10 of this embodiment has a list 302 shown in FIG. 92 as data of a production program. The list 302 contains information on mounting layers corresponding to mounting points of the substrate (including points inserted into the substrate) and information specifying insertion components. Here, the "mounting layer" refers to priority information used when determining the mounting order of electronic components, and is set with a numerical value of 1 to 7. Here, with regard to the loading layer, the smaller the numerical value, the higher the loading order is, and the larger the numerical value, the lower the loading order is. In addition, the loading layer is a value set by an operator in consideration of various information. The insertion component designation is an item indicating whether or not the electronic component mounted on the mounting point is an insertion component. In addition, in FIG. 92 , "Yes" indicates the mounting point designated as the insertion component. Here, the insertion member mainly refers to an electronic component such as a radial lead type electronic component in which leads are inserted into holes formed in a substrate. In addition, the designation of insertion parts is also information set by the operator. Therefore, the designation of the insertion component may be set to “Yes” for the mounting point determined by the operator to be the insertion component regardless of the type of the electronic component.

The electronic component mounting apparatus 10 generates the mounting order list 304 using the information of the list 302 . Here, in the mounting sequence list 304 , the mounting points on the upper side of the list are the mounting points where the electronic components are mounted first, and the mounting points on the lower side of the list are the mounting points where the electronic components are mounted later. That is, in the mounting order list 304 , the order of mounting electronic components is shown sequentially from the top. Here, the internal layers of the mounting order list 304 are information specifying a layer specified by the control unit 60 based on the mounting layer and the insertion component. The control unit 60 specifies the mounting points where the electronic components are mounted in order from the mounting point with the smaller numerical value of the inner layer.

FIG. 93 is a flowchart showing an example of the operation of the electronic component mounting device. The process shown in FIG. 93 is an example of the process of generating the installation order list 304 based on the list 302 . The processing shown in FIG. 93 is executed by controlling the operation of each part by the control unit 60 . As step S200, the control unit 60 reads out the production program. The control unit 60 reads the production program from an external device, or reads the production program from the storage unit of the electronic component mounting apparatus 10 . After reading the production program in step S200, the control unit 60 acquires information on the mounting point n as step S202. Specifically, the information on the mounting layer of the mounting point n and the information specifying the insertion part are acquired.

After the control unit 60 acquires the information of the mounting point n in step S202, as step S204, it is determined whether the mounting point n=insert part, that is, the information specifying the insertion part of the mounting point n is "Yes". When the control unit 60 determines in step S204 that it is not the mounting point n=insert component (No), it sets as step S206 that the internal layer=mounting layer. That is, the control unit 60 sets the numerical value of the mounting layer to the numerical value of the inner layer when the information of the designation of the insertion component of the mounting point n is not “Yes”. After the control part 60 performs the process of step S206, it progresses to step S210. When the control unit 60 determines in step S204 that mounting point n=insert component (Yes), it sets internal layer=mounting layer+7 as step S208. That is, the control unit 60 sets the numerical value obtained by adding 7 to the numerical value of the mounting layer as the numerical value of the internal layer when the information of the insertion component designation of the mounting point n is “Yes”. After the control part 60 performs the process of step S208, it progresses to step S210.

After performing the process of step S206 or step S208 , the control unit 60 determines whether the loading data is completed, that is, whether the inner layer has been calculated for all the loading points, as step S210 . When the control part 60 judges in step S210 that it is not finished (No), as step S212, it sets the mounting point n to n+1, and progresses to step S202. That is, the above-described processing is performed with the mounting point of the detection target in the inner layer being the next mounting point.

When the control unit 60 determines in step S210 that it is completed (YES), that is, when the internal layers of all the mounting points have been set, as step S214 , the mounting order is determined. That is, the control unit 60 determines the order of mounting electronic components on the mounting points based on the set internal layers and various conditions. After determining the installation order, the control unit 60 creates an installation order list, and ends this process.

As mentioned above, the electronic component mounting apparatus 10 can make the insertion part Mounted on the substrate in sequence. In addition, the operator can lower the mounting order of the electronic components to be targeted only by determining whether or not they are insertion components. Accordingly, when setting the mounting layer, it is not necessary to set the mounting layer of the electronic component in consideration of the layer used for the mounting layer. Thus, the burden on the operator in the operation of specifying the loading floor can be reduced.

Using FIG. 94, the operation|movement of the component supply apparatus of an electronic component mounting apparatus is demonstrated. FIG. 94 is a flowchart showing an example of the operation of the electronic component mounting device. The processing shown in FIG. 94 is executed by the components supply control unit 64 controlling the operation of each part of the components supply device based on the processing of the control unit 60 . Note that the processing shown in FIG. 94 is started in a state where no electronic components are placed in the holding area. As step S260, the component supply control unit 64 moves the holding belt by one pitch. That is, the component supply control unit 64 moves the holding belt by one pitch by reciprocating once or moving the feeding claw of the feeder unit once or in the feeding direction. As a result, the electronic component held on the holding tape main body is moved to the holding area.

After the component supply control unit 64 moves the electronic component to the holding area in step S260, as step S262, the lead wire of the electronic component moved to the holding area is cut. That is, the component supply control unit 64 cuts the portion of the lead wire located between the component main body and the holding tape main body using the cutting unit. After the component supply control unit 64 cuts the lead wire in step S262, the clamping state is maintained in step S264. That is, after the lead wire is cut by the cutting means, the component supply control unit 64 maintains a state in which the lead wire is sandwiched by the cut teeth.

After the component supply control unit 64 maintains the gripping state in step S264 , as step S266 , it is determined whether the suction nozzle 32 holds (suctions or holds) the electronic component. When the component supply control part 64 determines in step S266 that the electronic component is not held on the suction nozzle (No), it progresses to step S264. The component supply control unit 64 maintains the clamped state of the electronic component until it is determined that the electronic component is held on the suction nozzle.

When the component supply control unit 64 determines in step S266 that the electronic component is held on the suction nozzle (Yes), in step S268 , the electronic component is released, that is, the clamped state is released. As a result, the electronic component separated from the holding tape by cutting the lead wire is moved to a predetermined mounting position (mounting position) by the suction nozzle, and mounted on the substrate.

After the component supply control unit 64 releases the electronic component in step S268, as step S270, it is determined whether or not there is a holding tape feed request. Here, the holding tape feed request refers to a request to move the holding tape by one pitch to move the next electronic component to the holding area. When the component supply control part 64 judges in step S270 that there is a request (Yes), it progresses to step S260, and performs the said process again.

When the component supply control unit 64 determines in step S270 that there is no request (No), it determines in step S272 whether or not the processing has ended. When the components supply control part 64 determines in step S272 that the processing has not been completed (No), it proceeds to step S270. In addition, when the component supply control part 64 determines with processing completion|finish (Yes) in step S272, this processing is complete|finish.

The component supply control unit 64 moves the electronic component to the holding area as described above, cuts and clamps the lead wire, and makes the suction nozzle suck the electronic component, and then releases the clamp so that the suction nozzle can suck the diameter in a movable state. to leaded electronic components.

FIG. 95 is a flowchart showing an example of the operation of the electronic component mounting device. In addition, the processing operation shown in FIG. 95 is an operation after carrying in a board|substrate to completion of mounting an electronic component on a board|substrate. In addition, the processing operation shown in FIG. 95 is executed by controlling the operation of each part by the control unit 60 .

As step S302, the control unit 60 carries in the substrate. Specifically, the control unit 60 uses the substrate transport unit 12 to transport the target substrate on which the electronic component is mounted to a predetermined position. After the control unit 60 carries in the substrate in step S302, it performs holding movement in step S304. Here, holding movement (suction movement) refers to a processing operation of moving the head body 30 to a position where the suction nozzle 32 faces the electronic component 80 located in the holding area of the component supply unit 14 .

After the control unit 60 performs suction movement in step S304, the suction nozzle 32 is lowered as step S306. That is, the control unit 60 moves the suction nozzle 32 downward to a position where the electronic component 80 can be held (suctioned, gripped). After the control unit 60 lowers the suction nozzle 32 in step S306, the component is held by the suction nozzle 32 in step S308, and the suction nozzle 32 is raised in step S310. After the control unit 60 raises the suction nozzle to a predetermined position in step S310, specifically, after moving the electronic component 80 to the measurement position of the laser recognition device 38, as step S312, the shape of the electronic component sucked by the suction nozzle 32 is checked. to test. After the control part 60 detects the shape of an electronic component in step S312, it raises a suction nozzle as step S314. In addition, the control unit 60 detects the component shape in step S312 as described above, and when it determines that the held electronic component is unmountable, discards the electronic component and adsorbs the electronic component again. After the control unit 60 raises the suction nozzle to a predetermined position, as step S316, it performs mounting movement, that is, a process of moving the electronic component sucked by the suction nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8 . The action is as step S318, the suction nozzle 32 is lowered, as step S320, component mounting (component mounting), that is, the processing operation of releasing the electronic component 80 from the suction nozzle 32 is performed, and as step S322, the suction nozzle 32 is raised. That is, the control unit 60 executes the processing operations from step S312 to step S320 to execute the above-mentioned installation processing.

When the control unit 60 raises the suction nozzle in step S322 , as step S324 , it is determined whether the mounting of all components has been completed, that is, whether the mounting process of the electronic components scheduled to be mounted on the substrate 8 has been completed. In step S324, the control unit 60 determines that the mounting of all components has not been completed (No), that is, when there are still electronic components scheduled to be mounted, the control unit 60 proceeds to step S304, and executes the process of mounting the next electronic component on the substrate 8. Handle actions. As described above, the control unit 60 repeats the above-mentioned processing operations until all the components are mounted on the substrate. When it is determined in step S324 that the mounting of all components has been completed (Yes), the control unit 60 ends this process.

Next, the operations of the component supply apparatus 100 and the mounting head 15 before and after the suction nozzles adsorb the electronic components held in the component supply apparatus 100 will be described using FIG. 96 . FIG. 96 is a flowchart showing an example of the operation of the electronic component mounting device. The processing shown in FIG. 96 is executed by controlling the operation of each part by the control unit 60 .

As step S340 , the control unit 60 performs the XY suction movement of the mounting head 15 and starts clamping the electronic component by the component supply device 100 . That is, as step S340, the control part 60 moves the mounting head 15 to XY direction, and moves the suction nozzle 32 to a holding|maintenance area. In addition, the control unit 60 arranges the electronic component in the holding area of the component supply device 100 , and then cuts the lead wires to bring it into a clamped state.

The control unit 60 performs the process of step S340, and as step S342, when the movement of the holding position of the mounting head 15 is completed, that is, after moving the suction nozzle 32 of the mounting head 15 to the holding area, as step S344, the holding position of the mounting head 15 is moved to the holding area. The waiting time is compared with the elapsed time, and as step S346, it is determined whether the waiting time has elapsed, that is, whether the elapsed time is greater than or equal to the clamping waiting time.

In step S346 , the control unit 60 proceeds to step S344 when it is determined that the waiting time has not elapsed (No), that is, the elapsed time is less than the clamping waiting time. The control unit 60 repeats the processing of steps S344 and S346 until the waiting time elapses.

When it is determined in step S346 that the waiting time has elapsed (Yes), the control unit 60 performs a Z-axis suction drop as step S348 . That is, the control unit 60 moves the suction nozzle to the lower side in the Z-axis direction to a position where the electronic component located in the holding area can be suctioned. After the control unit 60 performs the Z-axis suction drop in step S348, it performs component suction in step S350, that is, uses the suction nozzle to suck the electronic component. As step S352, the clamp release waiting time and the existing Z-axis drop Waiting time for comparison. Here, the “clamp release waiting time” refers to the processing time required to release the clamped state of the electronic component being clamped by the component supply apparatus 100 . The conventional Z-axis descending waiting time is the waiting time for the suction nozzle of the mounting head at the position where the electronic component is suctioned. In addition, the waiting time when the conventional Z-axis descends is a preset value, and is the time required for the adsorption process of the electronic component.

After the comparison in step S352, the control unit 60 determines in step S354 whether the unclamp waiting time is relatively large, that is, whether the conventional Z-axis descending waiting time<clamp unclamping waiting time. In step S354, the control unit 60 judges that the clamp release waiting time is relatively large (Yes), that is, when the existing Z-axis descending waiting time < clamp release waiting time, as step S356, the clamp release waiting time Stand by and go to step S360. In addition, when the control unit 60 determines in step S354 that the waiting time for clamp release is not large (No), that is, when the conventional Z-axis descending waiting time≧clamp release waiting time, as step S358, the conventional When the Z-axis descends, it waits for the time to wait, and proceeds to step S360.

After the control unit 60 performs the processes of steps S356 and S358, as step S360, the Z-axis suction lift of the mounting head and the supply operation of the component supply device are performed, and this process ends.

The electronic component mounting apparatus 10 can mount electronic components on the substrate by executing the processing operations shown in FIGS. 95 and 96 .

Next, an example of the processing in the case of holding the electronic component at the holding position of the electronic component supply apparatus 100 by the suction nozzle will be described using FIGS. 97 to 98B . FIG. 97 is a flowchart showing an example of the operation of the electronic component mounting device. FIG. 98A is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 98B is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. The processing shown in FIG. 97 can be executed by controlling each part by the control device 20 of the electronic component mounting apparatus 10 .

In the electronic component mounting apparatus 10, as step S402, the electronic component is held by the suction nozzle. That is, the electronic component mounting apparatus 10 performs an operation of holding (suctioning, gripping) an electronic component located in the holding area of the electronic component supply apparatus by the suction nozzle. After the electronic component mounting apparatus 10 executes the holding operation in step S402, as step S404, the holding state of the electronic component is detected. Specifically, whether or not the suction nozzle holds an electronic component is detected by the laser recognition device 38 or the VCS unit 17 .

After the electronic component mounting apparatus 10 detects the holding state in step S404, as step S406, it is determined whether or not the suction nozzle holds the electronic component. When the electronic component mounting apparatus 10 determines in step S406 that the electronic component is held (Yes), this process ends. When the electronic component mounting apparatus 10 determines in step S406 that the electronic component is not held (No), as step S408 , the state of the holding position of the electronic component supply apparatus is detected. For example, the electronic component mounting apparatus 10 detects the height of the holding position by the height sensor 37 and detects whether or not an electronic component is present at the holding position. In addition, the presence or absence of electronic components may be detected by imaging with the imaging device 36 .

After the electronic component mounting apparatus 10 detects the state of the holding position in step S408, it determines in step S410 whether or not there is an electronic component in the holding position. The electronic component mounting apparatus 10 proceeds to step S416 when determining that there is an electronic component in step S410 (Yes), and proceeds to step S412 when determining that there is no electronic component (No). Here, the electronic component mounting apparatus 10 detects the presence or absence of electronic components based on the height of the holding position obtained by the height sensor 37 . For example, as shown in FIG. 98A, when there is an electronic component 80 on the holding area, the height of the holding area becomes higher, and as shown in FIG. 98B, when there is no electronic component 80 on the holding area, the height of the holding area becomes higher. Low (becomes the holding strap position). Accordingly, the electronic component mounting apparatus 10 determines that the electronic component exists when the height of the holding area is higher than the threshold, and determines that there is no electronic component when the height is lower than the threshold.

When the electronic component mounting apparatus 10 determines No in step S410 , as step S412 , it is determined whether the number of feeding operations is greater than or equal to the threshold number of times. Here, the feeding operation refers to an operation in which the electronic component supply apparatus 100 conveys the holding tape corresponding to the arrangement interval of the electronic components. The number of feed operations in step S412 is the number of feed operations performed in a state where electronic components cannot be sucked. When the electronic component mounting apparatus 10 determines in step S412 that the number of feeding operations is greater than or equal to the threshold number of times (Yes), it proceeds to step S416, and when it determines that the number of feeding operations is not greater than or equal to the threshold number of times (No). , go to step S414.

When the electronic component mounting apparatus 10 determines No in step S412, it executes a holding tape feeding operation as step S414, and proceeds to step S402. When the electronic component mounting apparatus 10 judges as YES in step S410 or step S412, it executes error processing as step S416, and ends this process. Here, when the electronic component mounting apparatus 10 determines Yes in step S410, it notifies that an electronic component remains at the holding position as an error process. When the determination in step S412 is YES, the electronic component mounting apparatus 10 notifies that the component cannot be confirmed even if the electronic component supply apparatus 100 performs a certain number of feeding operations as an error process.

As described above, when there is no electronic component remaining at the holding position, the electronic component mounting apparatus 10 carries out the holding operation of the electronic component again by conveying the holding tape. , and the installation of electronic components can be continued without stopping the device. In addition, even if the electronic component mounting apparatus 10 moves from the holding position without being held by the suction nozzle after cutting the lead wire in the electronic component supply apparatus 100, when there is no remaining electronic component at the holding position, the mounting operation is continued. , allowing for more efficient mounting of electronic components.

Fig. 99 is an explanatory view showing an example of a suction nozzle. Fig. 100 is an explanatory view for explaining the holding operation of the suction nozzle of Fig. 99 . 99 and 100 are diagrams showing an example of holding the suction nozzle (holding the suction nozzle). The suction nozzle 690 shown in FIGS. 99 and 100 has a fixed arm 692 and a movable arm 694 . In the adsorption nozzle 690, the fulcrum 695 of the movable arm 694 is fixed on the main body of the adsorption nozzle 690 in a rotatable state. The direction of 692 moves away. In the movable arm 694 , the drive unit 696 is connected to the opposite side of the portion approaching or separating from the fixed arm 692 with respect to the main body portion of the suction nozzle 690 across the fulcrum 695 . The drive unit 696 is moved by a drive source (air pressure) that drives the suction nozzle. The movable arm 694 moves the part opposing the fixed arm 692 from the direction approaching the fixed arm 692 to the direction away from the fixed arm 692 by the movement of the driving part 696 .

The suction nozzle 690 can hold the electronic component 80 as shown in FIG. .

The holding suction nozzle is not limited to the suction nozzle 690, and may have various shapes. 101A to 101D are explanatory views each showing an example of a suction nozzle. The suction nozzle 690a shown in FIG. 101A, the suction nozzle 690b shown in FIG. 101B, the suction nozzle 690c shown in FIG. 101C and the suction nozzle 690d shown in FIG. Nozzles with different ranges of motion. Therefore, the shapes of electronic components that can be held differ from the suction nozzle 690a to the suction nozzle 690d.

The electronic component mounting apparatus 10 can appropriately hold the electronic component by selecting the type of suction nozzle holding the electronic component according to the type of the electronic component to be held. Specifically, by selecting whether to use the suction nozzle or the grip suction nozzle according to the electronic component to be held, and switching which suction nozzle to use among each type of suction nozzle, it is possible to use one electronic component mounting apparatus Install a wider variety of electronic components.

Next, an example of processing while the electronic component mounting apparatus is mounting electronic components will be described using FIG. 102 . Fig. 102 is a flowchart showing an example of the operation of the electronic component mounting device. In the electronic component mounting apparatus 10, as step S450, the electronic components held by the suction nozzles of the mounting head are specified. That is, the type of the electronic component to be held by the suction nozzle next is determined.

After the electronic component mounting apparatus 10 has specified the electronic component in step S450, it is determined whether or not the suction nozzle has been replaced as step S452. If it is determined in step S452 that the electronic component mounting apparatus 10 has not replaced the suction nozzle (No), it will progress to step S456. If the electronic component mounting apparatus 10 determines in step S452 that there is replacement of the suction nozzle (Yes), it executes the replacement of the suction nozzle in step S454 . Specifically, the electronic component mounting apparatus 10 moves the mounting head 15 to the replacement nozzle holding mechanism 18, moves the nozzle held by the mounting head to the replacement nozzle holding mechanism 18, and holds the nozzle on the replacement nozzle holding mechanism 18. Attach the suction nozzle to be used next time to the loading head. The electronic component mounting apparatus 10 uses the replacement nozzle holding mechanism 18 to change the nozzle mounted on the mounting head from a nozzle to a grip nozzle, or to change the type of nozzle, or to change the type of grip nozzle. After the electronic component mounting apparatus 10 performs the process of step S454, or in the case of determining No in step S452, as step S456, the holding operation of the electronic component is performed, that is, using the suction nozzle mounted on the mounting head 15, performing The holding operation of the electronic component determined in step S450 ends this process.

As shown in FIG. 102 , the electronic component mounting apparatus 10 can hold the electronic component with a more appropriate suction nozzle by replacing the suction nozzle attached to the mounting head according to the type of electronic component. In addition, since the suction nozzle can be replaced, both the lead-type electronic component and the mount-type electronic component can be appropriately held by one electronic component mounting apparatus 10 . In addition, more kinds of electronic components can be held. Since the electronic component mounting apparatus 10 holds the main parts of both the lead type electronic component and the mount type electronic component, that is, the portion without leads, a common suction nozzle can be used to hold both types of electronic components. Thereby, it is possible to hold the lead type electronic component without providing a dedicated suction nozzle for holding the lead wire. In addition, since the above-mentioned effect can be obtained, it is preferable to hold the main body of the lead type electronic component, but it is also possible to provide a suction nozzle for holding the lead wire.

Next, an example of processing from execution of preparatory process processing (setting of production program, preparation of each part, adjustment of parts supply device, etc.) to start of production will be described using FIG. 103 and FIG. 104 . FIG. 103 is a flowchart showing an example of the operation of the electronic component mounting device. FIG. 104 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. In addition, the process of FIG. 103 may be performed as the process from production suspension to restart.

In the electronic component mounting apparatus 10, as step S460, the preparatory process is executed, and as step S462, the lead wire of the electronic component is cut by the cutting unit of the electronic component supply apparatus 100, and the electronic component is clamped. In addition, the process of step S462 is performed as a partial process of the preparatory process process of step S460. In addition, the electronic component mounting apparatus 10 does not hold the electronic component by the mounting head after sandwiching it.

After executing the process of step S462, the electronic component mounting apparatus 10 outputs information as step S464. Specifically, the screen 698 shown in FIG. 104 is displayed as a message. On the screen 698, a message "Maintain clamped state?", a "Yes" button 699a, and a "No" button 699b are displayed.

The electronic component mounting apparatus 10 displays a message in step S464, selects and confirms any one of the buttons 699a and 699b, and then determines whether or not to maintain the clamping state as step S466. If the electronic component mounting apparatus 10 determines in step S466 that the clamped state is not maintained (No), that is, the button 699 b is selected, the clamped state is released in step S467 , the electronic component is released, and this process ends. In this case, the operator recovers the electronic components from the holding area. In addition, in this embodiment, an inquiry is made as to whether or not to maintain the clamped state, but it is also possible to inquire as to whether or not to release the clamped state. In this case, the corresponding functions of "yes" and "no" are reversed.

If the electronic component mounting apparatus 10 determines in step S466 that the clamping state is maintained (Yes), that is, the button 699a is selected, then as step S468, the clamping state is maintained, and as step S469, after the start of production, the clamped electronic component is used. part, end this process.

As shown in FIG. 103 , the electronic component mounting apparatus 10 prepares the electronic component for the purpose of adjusting the cutting position of the electronic component, etc., by using the electronic component whose leads have been cut as the first step of the electronic component supply device after the start of production. The use of one electronic part can reduce the burden on the operator. Specifically, time for collecting electronic components can be saved, and time for manually inserting collected electronic components into a board can be reduced.

Next, an example of processing executed by the electronic component mounting apparatus 10 at the time of electronic component mounting will be described using FIG. 105 . Fig. 105 is a flowchart showing an example of the operation of the electronic component mounting device.

The electronic component mounting apparatus 10 specifies the position where the electronic component is mounted as step S470, and detects the height of the mounting position as step S472. In addition, the height of the substrate at the mounting position can be detected by the height sensor 37 . After detecting the height in step S472 , the electronic component mounting apparatus 10 determines whether the height is less than or equal to a threshold (whether the distance between the mounting head and the measurement position is longer than the threshold) in step S474 . That is, the electronic component mounting apparatus 10 determines whether or not there is nothing mounted on the position on the substrate where the electronic component is mounted.

When the electronic component mounting apparatus 10 determines in step S474 that the height is not less than or equal to the threshold value (No), that is, when the height is higher than the threshold value, it determines that some components are mounted on the mounting position, performs error processing as step S476, and ends. This processing. When the electronic component mounting apparatus 10 determines in step S474 that the height is smaller than or equal to the threshold value (Yes), it determines that no component is mounted on the mounting position, executes electronic component mounting processing in step S478 , and ends the processing.

As shown in FIG. 105 , the electronic component mounting apparatus 10 detects the height of the substrate at the position where the electronic component is mounted. In the case of an obstacle, when performing an action to mount an electronic component. Thereby, electronic components can be mounted while suppressing damage to a board|substrate or an electronic component. In addition, in FIG. 105 , the height sensor 37 is used to detect the height of the board in order to simplify the process, but the state of the mounting position on the board may be detected by the imaging device 36 .

Next, an example of the processing operation after electronic component mounting by the electronic component mounting apparatus 10 will be described using FIG. 106 . Fig. 106 is a flowchart showing an example of the operation of the electronic component mounting device.

In the electronic component mounting apparatus 10 , as step S480 , it is determined whether or not the mounting of all components has been completed, that is, whether or not all the electronic components mounted on the board based on the production program have been mounted on the board. When the electronic component mounting apparatus 10 determines in step S480 that the mounting of all components has not been completed (No), that is, when there is an electronic component that has not been mounted, the process proceeds to step S480.

When it is determined in step S480 that the mounting of all components has been completed (Yes), the electronic component mounting apparatus 10 detects the state of the electronic component at the mounting position as step S482 . Here, the state of the electronic component at the mounting position can be detected by, for example, detecting the height of each position of the substrate with the height sensor 37 or acquiring a surface image of the substrate with the imaging device 36 .

After detecting the state of the electronic component in step S482, the electronic component mounting apparatus 10 determines whether or not there is a mounting position without an electronic component as step S484. Using the detection result of the height sensor 37 , the electronic component mounting apparatus 10 determines that there is no electronic component when there is a mounting position whose height is detected to be lower than a design value (for example, the height of the board). In addition, the electronic component mounting apparatus 10 may determine that there is no electronic component when the image obtained by the imaging device 36 is used for determination, and when the shape of the component stored as component data does not match. When the electronic component mounting apparatus 10 determines in step S484 that there is no mounting position for electronic components (YES), in step S486 , an error message indicating a missing component is generated, and the process proceeds to step S488 . Furthermore, the electronic component mounting apparatus 10 determines whether or not an electronic component is present for all mounting positions, and generates error information indicating a missing component for all mounting positions determined as having no electronic component. When the electronic component mounting apparatus 10 determines in step S484 that there is no mounting position without an electronic component (No), that is, when electronic components are mounted in all mounting positions, the process proceeds to step S488.

When the electronic component mounting apparatus 10 determines No in step S484, or when executing the process in step S486, as step S488, it is determined whether there is a mounting position where the position of the electronic component is shifted. When using the detection result of the height sensor 37 , the electronic component mounting apparatus 10 determines that there is a mounting position detected at a position where the height changes (arrangement of the electronic component) deviates from the design value. is the positional offset of the electronic components. In addition, when the electronic component mounting apparatus 10 makes a determination using the image acquired by the imaging device 36, it can match the component shape stored as component data, and when the component shape is identical but the position is not identical, it can be determined that the component is an electronic component. position offset. When the electronic component mounting apparatus 10 determines in step S488 that there is a mounting position where the position of the electronic component is displaced (YES), as step S490 , error information indicating the positional deviation is generated, and the process proceeds to step S492 . Furthermore, the electronic component mounting apparatus 10 determines whether or not the position of the electronic component is displaced for all mounting positions, and generates error information indicating positional deviation for all mounting positions determined to be positional deviation of the electronic component. When the electronic component mounting apparatus 10 determines in step S488 that there is no mounting position where the position of the electronic component deviates (No), that is, when the electronic components at all mounting positions are mounted at appropriate positions, the process proceeds to step S492 .

When the electronic component mounting apparatus 10 makes a negative determination in step S488, or when the process of step S490 is performed, as step S492, it is determined whether there is an erroneous detection. That is, it is determined whether or not there is error information generated in steps S486 and S490. When the electronic component mounting apparatus 10 determines in step S492 that there is an erroneous detection (Yes), it outputs an error message as step S494 and ends the present process. That is, the electronic component mounting apparatus 10 outputs the error information generated in step S486 and step S490. In addition, as an output method of error information, various methods can be used. The electronic component mounting apparatus 10 can display an error message on the display unit 42, for example. When the electronic component mounting apparatus 10 determines in step S492 that there is no erroneous detection (No), it ends this process.

As shown in FIG. 106 , the electronic component mounting apparatus 10 can confirm whether the electronic component is properly mounted on the board by detecting whether the electronic component is mounted after the mounting is completed. In addition, the confirmation by the electronic component mounting apparatus 10 can reduce the man-hours for visual confirmation, and can reduce the possibility that the produced board becomes a defective product. In addition, by outputting error information based on the detection results, it is possible to notify the operator of the occurrence of mounting failures such as missing parts and misalignment. In addition, by notifying the location where the mounting defect occurred and the type of the electronic component as error information, the mounting defect can be eliminated before the processing of the next process is performed. Thereby, production efficiency can be improved.

In addition, in FIG. 106, although all mounted components are set as the object of determination, it is not limited to this. The electronic component mounting apparatus 10 may make only a specific electronic component the determination object. For example, only lead type electronic components may be targeted, or only radial lead type electronic components may be targeted for determination. In addition, only a specific type of electronic component may be determined, or only an electronic component at a specific mounting position may be determined.

Next, using FIGS. 107 to 116, the operation of mounting an electronic component to a mounting position (mounting position) on a substrate in the processing operation of the electronic component mounting apparatus, specifically, the process of moving the suction nozzle in the Z-axis direction will be described. action. Fig. 107 is a flowchart showing an example of the operation of the electronic component mounting device. FIG. 108 is an explanatory diagram showing an example of a lead type electronic component. In addition, it is preferable that the processing shown in FIG. 107 is executed during the operation of the preparatory process (optimization processing) based on the production program and the teaching result. In this case, the electronic component mounting apparatus 10 may control the operation based on the result calculated by the operation of the preparatory process during production, that is, when the process of actually mounting the electronic component on the board is performed. In addition, the electronic component mounting apparatus 10 may perform the process shown in FIG. 107 at the time of production, that is, when actually performing the process of mounting the electronic component on the board. In addition, the electronic component mounting apparatus 10 executes the processing shown in FIG. 107 for each electronic component mounted on the board.

As step S502, the electronic component mounting apparatus 10 determines whether it is a lead type electronic component. That is, the electronic component mounting apparatus 10 determines whether or not the electronic component mounted on the substrate (electronic component to be processed) is an electronic component in which leads are inserted into the insertion holes of the substrate. When the electronic component mounting apparatus 10 determines in step S502 that it is not a lead type electronic component (No), as step S504 , the movement pattern in the Z-axis direction is calculated using the first speed reference, and this process ends. In addition, the processing of step S504 will be described later.

When the electronic component mounting apparatus 10 determines in step S502 that it is a lead-type component (Yes), it determines in step S506 whether or not the lead is molded. Here, the term "formed leads" refers to a state where the lead wires are not in a straight shape but have bent portions and meandering portions formed therein. For example, in the electronic component 700 shown in FIG. 108 , when a bent portion is formed on the lead 704 connected to the main body 702 , the lead 704 is molded. Connectors and the like are excited as electronic components with lead wires molded. In addition, the lead wire of the electronic component is molded, that is, provided with a bent portion or a meander portion, so that it is difficult to be pulled out after being inserted into the insertion hole. That is, the molded portion functions to prevent detachment.

When the electronic component mounting apparatus 10 determines in step S506 that the leads are not molded (No), as step S508 , the movement pattern in the Z-axis direction is calculated using the second speed reference, and this process ends. In addition, the processing of step S508 will be described later. When the electronic component mounting apparatus 10 determines in step S506 that the leads have already been molded (Yes), as step S510 , the movement pattern in the Z-axis direction is calculated using the third speed reference, and the process ends. In addition, the processing of step S510 will be described later.

Next, the process of step S504, that is, the method of calculating the movement pattern in the Z-axis direction based on the first speed reference, will be described with reference to FIGS. 109 and 110 . Fig. 109 is a flowchart showing an example of the operation of the electronic component mounting device. Fig. 110 is an explanatory diagram showing the relationship between the moving speed of the suction nozzle and time. Here, step S504 is performed when it is determined that the electronic component is not a lead-type electronic component, that is, a mount-type electronic component in which a lead wire is not inserted into the insertion hole. That is, it is executed when the electronic component to be processed is an on-board electronic component.

The electronic component mounting apparatus 10 acquires the component height as step S520. Specifically, information on the height of the electronic component is acquired. The height of the electronic component refers to the height of the electronic component in the Z-axis direction. After detecting the component height in step S520, the electronic component mounting apparatus 10 calculates the distance in the Z-axis direction between the mounting position and the suction nozzle as step S522. Specifically, the distance between the mounting position and the suction nozzle when the mounting head moves to the mounting position and the suction nozzle is moved in the Z-axis direction is calculated. In addition, the processing order of step S520 and step S522 may be reversed. In addition, the information in step S520 and step S522 may be obtained based on pre-input conditions, or may be obtained through measurement.

After the electronic component mounting apparatus 10 calculates the distance between the mounting position and the suction nozzle in step S522, as step S524, the condition for decelerating from the speed V1 to the speed V2 is determined, and as step S526, the condition for decelerating from the speed V2 is determined. Conditions are determined, and this process ends. Here, the speeds V1 and V2 are moving speeds in the Z-axis direction. The condition of decelerating from the speed V1 to the speed V2 refers to a condition for decelerating the moving speed of the suction nozzle from the speed V1 to the speed V2 when moving in the Z-axis direction. In the electronic component mounting apparatus 10 , the condition for decelerating from the speed V2 refers to a condition for further decelerating the moving speed of the suction nozzle from the speed V2 when moving in the Z-axis direction.

The electronic component mounting apparatus 10 specifies the movement pattern of the suction nozzle shown in FIG. 110 by specifying the conditions for changing (decelerating) the moving speed of the suction nozzle in steps S524 and S526 . In FIG. 110 , the relationship between the moving speed of the suction nozzle and time, that is, the moving speed of the suction nozzle at each time is shown. The movement pattern based on the first speed reference shown in FIG. 110 is that when the nozzle starts to move to the mounting position (the nozzle descends), it accelerates to the speed V1, and then moves at the speed V1 until time t1. Then, the suction nozzle starts to decelerate at time t1, and decelerates to speed V2 at time t2. Here, time t2 is the time for making the distance between the lower end of the electronic component and the substrate a set distance. Specifically, it is the time when the lower end of the electronic component and the substrate approach to a certain distance. Then, the suction nozzle moves at a constant speed until time t3, starts to decelerate at time t3, and then stops.

The electronic component mounting apparatus 10 can move the electronic component at a speed (first speed) V1 within a time t1 by moving the electronic component in the movement pattern shown in FIG. 110 until the electronic component approaches the substrate within a certain distance (that is, at a range farther than a certain distance). Then, the electronic component is moved at a speed (second speed) V2 that is slower than the speed V1 until the electronic component is mounted (mounted) on the substrate, that is, until the electronic component can approach the substrate within a certain distance until the mounting is completed. (i.e., within a range of a certain distance). Thereby, the electronic component can be moved quickly within a range not affecting the substrate, and the electronic component can be moved slowly within a range capable of affecting the substrate. Accordingly, the time required for mounting can be shortened while maintaining the accuracy of mounting on the substrate. In addition, the electronic component mounting apparatus 10 can press the electronic component to the substrate by determining the time t3 so that the electronic component moves at a constant speed and then stops after contacting the substrate, and the solder on the substrate can be pressed under a predetermined pressure. contact with electronic components.

Next, the method of calculating the movement pattern in the Z-axis direction based on the second velocity reference, which is the process of step S508, will be described using FIGS. 111 to 114 . FIG. 111 is a flowchart showing an example of the operation of the electronic component mounting device. Fig. 112 is an explanatory diagram showing the relationship between the moving speed of the suction nozzle and time. 113 and 114 are explanatory diagrams for explaining an example of the operation of the electronic component mounting apparatus, respectively. Here, step S508 is executed when it is determined that the electronic component is a lead type electronic component, the lead is not molded, that is, it is a lead type electronic component in which the lead is inserted into the insertion hole, and the lead is linear. That is, it is executed when the electronic component to be processed is an unmolded lead-type electronic component.

In the electronic component mounting apparatus 10, a component height is acquired as step S530. Specifically, information on the height of the electronic component is acquired. The height of the lead type electronic component is the height of the electronic component in the Z-axis direction, that is, the component height 87 obtained by adding the heights of the main body 82 and the leads 84 of the electronic component, as shown in FIG. After acquiring the component height (component length) in step S530, the electronic component mounting apparatus 10 acquires the lead wire length as step S532. Here, the lead wire length is the height of the lead wire 84 in the Z-axis direction, that is, the length 86 of the lead wire 84 of the electronic component as shown in FIG. 113 . After acquiring the lead wire length 86 in step S532, the electronic component mounting apparatus 10 calculates the distance in the Z-axis direction between the mounting position and the suction nozzle as step S534. Specifically, the distance between the mounting position and the suction nozzle when the mounting head moves to the mounting position and the suction nozzle is moved in the Z-axis direction is calculated. In addition, the processing order of step S530, step S532 and step S534 may be reversed. In addition, the information in step S530, step S532, and step S534 may be obtained based on pre-input conditions, or may be obtained through measurement.

After the electronic component mounting apparatus 10 calculates the distance in the Z-axis direction between the mounting position and the suction nozzle in step S534, as step S536, the condition for decelerating from the speed V1 to the speed V3 is determined, and as step S538, based on the length of the lead wire , the conditions for decelerating from the speed V3 are determined, and this process ends. Here, the speeds V1 and V3 are moving speeds in the Z-axis direction. The condition for decelerating from the speed (first speed) V1 to the speed (second speed) V3 is a condition for decelerating the moving speed of the suction nozzle from the speed V1 to the speed V3 when moving in the Z-axis direction. In the electronic component mounting apparatus 10 , the condition for decelerating from the speed V3 is a condition for further decelerating the moving speed of the suction nozzle from the speed V3 when moving in the Z-axis direction. In addition, the speed V3 is slower than the speed V2 described above.

In the electronic component mounting apparatus 10 , the movement pattern of the suction nozzle shown in FIG. 112 is specified by specifying the conditions for changing (decelerating) the moving speed of the suction nozzle in steps S536 and S538 . In FIG. 112 , the relationship between the moving speed of the suction nozzle and time, that is, the moving speed of the suction nozzle at each time is shown. The movement pattern based on the second speed reference shown in FIG. 112 is to accelerate to the speed V1 when the nozzle starts to move to the mounting position (decline of the nozzle), and then move at the speed V1 until time t4. Then, the suction nozzle starts to decelerate at time t4, and decelerates to speed V3 at time t5. Here, the time t5 is the time for making the distance between the lower end of the electronic component (that is, the lower end of the lead wire 84 ) and the substrate a set distance as shown in FIG. 113 . Specifically, it is the time when the lower end of the electronic component and the substrate approach to a certain distance. Then, the suction nozzle moves at a constant speed until time t6, starts to decelerate at time t6, and then stops. Here, the electronic component mounting apparatus 10 inserts the lead wire 84 into the insertion hole of the substrate as shown in FIG. 114 between time t5 and time t6 when mounting the electronic component in the movement pattern shown in FIG. 112 .

The electronic component mounting apparatus 10 can move the electronic component at the speed (first speed) V1 within the time t4 by moving the electronic component in the movement pattern shown in FIG. 114 until the electronic component approaches the substrate within a certain distance (that is, , within a range farther than a certain distance). Then, the electronic component is moved at a speed (second speed) V3 that is slower than the speed V1 until the electronic component is mounted (mounted) on the substrate, that is, the electronic component can approach the substrate within a certain distance until the lead wire Insert it into the insertion hole and finish loading (that is, within a certain distance). Thereby, the electronic component can be moved quickly within a range not affecting the substrate, and the electronic component can be moved slowly within a range capable of affecting the substrate. Accordingly, the time required for mounting can be shortened while maintaining the accuracy of mounting on the substrate.

The electronic component mounting apparatus 10 can stably insert the lead into the board by detecting the timing of deceleration from the speed V3 based on the lead length, that is, by determining the interval from time t5 to time t6 . In addition, the electronic component may be moved until the main body 82 and the substrate approach each other at a certain distance. That is, the electronic component mounting apparatus 10 can adjust the movement condition of the electronic component when the lead wire is inserted into the insertion hole, which cannot be adjusted only based on the component height, by using the lead wire length as a criterion for determination. Specifically, if the height of the main body 82 of the lead-type electronic component is taken as the component height, there is a case where the lead wire is decelerated after contacting the substrate. If the component height 87 of the lead-type electronic component is taken as the component height, it is necessary to The press-fit amount is adjusted for components, but in this embodiment, various conditions can be determined according to the length by inputting the length of the lead wire as a parameter.

Also, in the case of lead type electronic components, the electronic component mounting apparatus 10 can adjust the pressing force for pressing the main body of the electronic component against the substrate after the electronic component contacts the substrate by adjusting the timing of time t6. Thereby, the main body can be moved to the board|substrate under different conditions with respect to the mount-type electronic component which presses the terminal to the solder.

Next, the process of step S510, that is, the method of calculating the movement pattern in the Z-axis direction based on the third speed reference will be described using FIG. 115 and FIG. 116 . FIG. 115 is a flowchart showing an example of the operation of the electronic component mounting device. Fig. 116 is an explanatory diagram showing the relationship between the moving speed of the suction nozzle and time. Here, step S510 is executed when it is determined that the electronic component is a lead type electronic component, the lead is molded, that is, the lead is inserted into the insertion hole, and the lead is not linear. That is, it is executed when the electronic component to be processed is a molded lead-type electronic component.

In the electronic component mounting apparatus 10, a component height is acquired as step S540. Specifically, information on the height of the electronic component is acquired. After obtaining the component height in step S540, the electronic component mounting apparatus 10 obtains the lead wire length as step S541. The electronic component mounting apparatus 10 calculates the distance in the Z-axis direction between the mounting position and the suction nozzle as step S542 after acquiring the lead wire length in step S541. Specifically, the distance between the mounting position and the suction nozzle when the mounting head moves to the mounting position and the suction nozzle is moved in the Z-axis direction is calculated. In addition, the processing order of step S540, step S541, and step S542 may be reversed. In addition, the information in step S540, step S541, and step S542 may be obtained based on pre-input conditions, or may be obtained through measurement.

After the electronic component mounting apparatus 10 calculates the distance between the mounting position and the suction nozzle in step S542, as step S544, the condition for decelerating from the speed V1 to the speed V4 is determined, and as step S546, based on the length of the lead wire, the The conditions for the deceleration of the speed V4 are determined, and this process ends. Here, the speeds V1 and V4 are moving speeds in the Z-axis direction. The condition for decelerating from the speed (first speed) V1 to the speed (fourth speed) V4 is a condition for decelerating the moving speed of the suction nozzle from the speed V1 to the speed V4 when moving in the Z-axis direction. In the electronic component mounting apparatus 10, the condition to decelerate from the velocity V4 is a condition to further decelerate the moving velocity of the suction nozzle from the velocity V4 when moving in the Z-axis direction. In addition, the speed (fourth speed) V4 is slower than the speed (second speed) V3 described above.

In the electronic component mounting apparatus 10 , the nozzle movement pattern shown in FIG. 116 is determined by determining conditions for changing (decelerating) the movement speed of the nozzle in steps S544 and S546 . In FIG. 116 , the relationship between the moving speed of the suction nozzle and time, that is, the moving speed of the suction nozzle at each time is shown. The movement pattern based on the third speed reference shown in FIG. 116 is that when the nozzle starts to move to the mounting position (decline of the nozzle), it accelerates to the speed V1, and then moves at the speed V1 until time t7. Then, the suction nozzle starts to decelerate at time t7, and decelerates to speed V4 at time t8. Here, the time t8 is the time for bringing the distance between the lower end of the electronic component (that is, the lower end of the lead) and the substrate to a set distance. Specifically, it is the time until the lower end of the electronic component and the substrate approach to a certain distance. Then, the suction nozzle moves at a constant speed until time t9, starts to decelerate at time t9, and then stops.

The electronic component mounting apparatus 10 can move the electronic component at the speed (first speed) V1 within the time t7 similarly to the case of FIG. 112 by moving the electronic component in the movement pattern shown in FIG. Close to the substrate within a certain distance (that is, within a range farther than a certain distance). Then, the electronic component is moved at a speed (fourth speed) V4 that is slower than the speed V1 until the electronic component is mounted (mounted) on the substrate, that is, the electronic component can approach the substrate within a certain distance until the lead wire Insert it into the insertion hole and finish loading (that is, within a certain distance). Thereby, the electronic component can be moved quickly within a range not affecting the substrate, and the electronic component can be moved slowly within a range capable of affecting the substrate. Accordingly, the time required for mounting can be shortened while maintaining the accuracy of mounting on the substrate.

The electronic component mounting apparatus 10 detects the timing of deceleration from the speed V4 based on the length of the lead, that is, determines the interval from time t8 to time t9 , thereby stably inserting the lead into the board as described above. In addition, the electronic component may be moved until the main body 82 and the substrate approach each other at a certain distance.

Also, in the case of lead type electronic components, the electronic component mounting apparatus 10 can adjust the pressing force for pressing the main body of the electronic component against the substrate after the electronic component contacts the substrate by adjusting the timing of time t9. Thereby, the main body can be moved to the board|substrate under different conditions with respect to the mount-type electronic component which presses the terminal to the solder.

In addition, in the electronic component mounting apparatus 10, when the lead wire is molded and a larger sliding resistance occurs when the lead wire is inserted into the insertion hole, by setting the moving speed when the lead wire is inserted into the insertion hole to be slower than the speed V3 V4, so that the molded lead wire can be properly inserted into the insertion hole. Thereby, the electronic component which molded the lead wire can be mounted suitably on a board|substrate.

As shown in FIGS. 107 to 116 , the electronic component mounting apparatus 10 adjusts the movement pattern of the electronic component in the Z-axis direction according to the type of electronic component, specifically whether it is a lead type electronic component or a mountable electronic component. Accordingly, the electronic components can be mounted on the substrate in a movement pattern corresponding to each electronic component. Also, in the case of lead-type electronic components, by adjusting the movement pattern of the electronic component in the Z-axis direction according to whether or not it is molded, the electronic component can be mounted on the substrate with a movement pattern corresponding to each electronic component.

The electronic component mounting apparatus 10 can set the moving speed V3 in the case of the lead-type electronic component slower than the moving speed V2 in the case of the mount-type electronic component in the range where the electronic component approaches the vicinity of the substrate. More reliable mounting of lead-type electronic components on boards.

In addition, the electronic component mounting apparatus 10 makes the moving speed V4 of the electronic component after the lead forming is slower than the moving speed V3 of the electronic component without the lead forming by setting the moving speed in the range of the electronic component close to the substrate. , so that the formed lead can be inserted into the insertion hole more reliably. Thereby, the reliability with which electronic components are mounted can be further improved.

In addition, in the case of mounting electronic components with leads as described above, by setting the movement pattern based on the length of the leads, the leads can be inserted into the insertion holes more appropriately, and the electronic components can be placed on the substrate with higher accuracy and efficiency. Install.

In addition, it is preferable that the electronic component mounting apparatus 10 changes the speed reference according to the type of electronic component as shown in FIG. 107 and performs calculation in a movement pattern corresponding to the type, but the present invention is not limited thereto. When the electronic component mounting apparatus 10 is configured to mount only lead type electronic components, the process of step S504 may be executed each time. In addition, the processing of step S506, step S508, and step S510 in FIG. 107 may be repeated. In addition, the electronic component mounting apparatus 10 shows the relationship between speed and time as the movement pattern, but the movement pattern may be calculated from the relationship between speed and position, and between speed and distance.

Next, using FIGS. 117 to 125, the operation of the bowl feeder unit 400 in the processing operation of the electronic component mounting apparatus 10, specifically, the use of the bowl feeder unit 400 to place the electronic components to the holding position (holding area) ) supply action will be described. In the operation of the bowl feeder unit 400 described below, the control device 20 can be used as the control unit of the bowl feeder unit 400 to control the operation of each part.

First, using FIG. 117 , the electronic component supply devices 402 , 404 , and 406 of the bowl feeder unit 400 will describe the electronic component fullness determination operation. FIG. 117 is a flowchart showing an example of the operation of the electronic component mounting device. Here, full of electronic components refers to a state in which it is determined that electronic components are arranged without gaps on the corresponding rails 422 of the electronic component supply devices 402 , 404 , and 406 . That is, electronic component supply devices 402 , 404 , and 406 are full of electronic components means a state in which it is determined that the guide rail 422 is full of electronic components and new electronic components cannot be guided from the storage bowl 420 to the guide rail 422 . Next, a case where it is determined whether or not the electronic component supply apparatus 402 is full will be described as an example. The electronic component mounting apparatus 10 repeatedly executes the process of FIG. 117 while the electronic component supply apparatus 402 is driven. In addition, the electronic component supply apparatuses 404 and 406 may also perform determination by the same process.

In the electronic component mounting apparatus 10, as step S602, the detection result of the head side component detection sensor 580a is acquired, and as step S604, it is judged whether an electronic component exists. That is, the electronic component mounting apparatus 10 determines whether or not an electronic component exists at the measurement position of the base end rail 504 (starting end of the guide rail 422 ) based on the detection result of the start end side component detection sensor 580 a. When the electronic component mounting apparatus 10 determines in step S604 that there is no electronic component (No), that is, if there is no electronic component at the leading end of the guide rail 422 , the duration time is reset in step S606 , and the process ends. The so-called duration refers to the time during which the electronic component exists.

When the electronic component mounting apparatus 10 determines in step S604 that the electronic component is present (Yes), in step S608 , it is determined whether the duration of the state in which the electronic component is detected continues to be greater than or equal to the threshold, that is, greater than or equal to the threshold time. In addition, the threshold value is a time set by an operator, or a reference time set as an initial value. The threshold is entered as the end-of-full wait time.

When the electronic component mounting apparatus 10 determines in step S608 that the continuation time is not greater than or equal to the threshold value (No), it proceeds to step S602 and repeats the above processing. When the electronic component mounting apparatus 10 determines in step S608 that the continuation time is greater than or equal to the threshold value (Yes), it determines in step S610 that it is full, and ends this process.

As shown in FIG. 117 , the electronic component mounting device 10 can determine whether the electronic component supply device 402 is full, that is, whether the guide rail 422 ( 422 a ) is filled with Electronic components are judged.

In the process of FIG. 117 , only the detection result of the component detection sensor on the starting end side is used to determine whether it is full, but it is preferable to also use the detection result of the holding position side detection sensor to determine whether it is full. Next, an example of processing will be described using FIG. 118 .

FIG. 118 is a flowchart showing an example of the operation of the electronic component mounting device. In addition, part of the processing shown in FIG. 118 is the same as the processing in FIG. 117 . Therefore, the same step numbers are assigned to the same processes, and detailed descriptions are omitted. In the electronic component mounting apparatus 10, as step S602, the detection result of the head side component detection sensor 580a is acquired, and as step S604, it is judged whether an electronic component exists. When the electronic component mounting apparatus 10 determines in step S604 that there is no electronic component (No), that is, when there is no electronic component, as step S606 , the duration time is reset, and this process is ended.

When the electronic component mounting apparatus 10 determines in step S604 that there is an electronic component (Yes), in step S612 , the detection result of the holding position side component detection sensor 582 a is obtained, and in step S614 , whether or not the electronic component is present is determined. That is, the electronic component mounting apparatus 10 determines whether or not an electronic component exists at the measurement position of the holding position (the end of the guide rail 422 ) based on the detection result of the holding position side component detection sensor 582 a. When the electronic component mounting apparatus 10 determines in step S614 that there is no electronic component (No), that is, if there is no electronic component at the holding position, the duration time is reset in step S606 and the process ends.

When the electronic component mounting apparatus 10 determines in step S614 that the electronic component is present (Yes), in step S608 , it is determined whether the duration of the state in which the electronic component is detected continues to be greater than or equal to the threshold, that is, greater than or equal to the threshold time. When the electronic component mounting apparatus 10 determines in step S608 that the continuation time is not greater than or equal to the threshold value (No), it proceeds to step S602 and repeats the above processing. When the electronic component mounting apparatus 10 determines in step S608 that the continuation time is greater than or equal to the threshold value (Yes), it determines in step S610 that it is full, and ends this process.

As shown in FIG. 118, the electronic component mounting apparatus 10 checks whether an electronic component is present at the holding position based on the detection result of the electronic component detection sensor 580a on the head end side and the detection result of the component detection sensor 582a on the holding position side. Judgment, to determine whether it is full, can further improve the detection accuracy of full. By detecting the presence or absence of an electronic component at the holding position, it is possible to prevent the electronic component from being determined as full when the electronic component stops in the middle of the guide rail 422 and the electronic component is not supplied to the front end.

Next, the processing operation of the air blower 590 of the electronic component supply apparatus 402 will be described using FIGS. 119 and 120 . FIG. 119 is an explanatory diagram showing an example of an operation screen. FIG. 120 is a flowchart showing an example of the operation of the electronic component mounting device. The electronic component mounting apparatus 10 displays the operation screen 710 shown in FIG. 119 , and the operator sets the control conditions of the blower unit 590 . That is, the electronic component mounting apparatus 10 may display the operation screen 710 as a screen for inputting an operation for setting the control conditions of the blower unit 590 .

The operation screen 710 displays a display area 712 for displaying the air blowing stop interval conditions. The display area 712 has a first area 718 and a second area 720 . The first area 718 is an area for displaying information corresponding to the electronic component supply device 402 of one bowl feeder unit 90 . The second area 720 is an area for displaying information corresponding to the electronic component supply device 402 of the other bowl feeder unit 90 . In the first area 718 and the second area 720, for each electronic component supply device (for each guide rail in the operation screen 720), an input item 722 for inputting the air blowing stop interval before full and an input item for inputting is displayed. The input item 724 of the air supply stop interval after full. Here, the air blowing stop interval is the time during which the air blowing is stopped. That is, it is the time from the air blowing unit 590 stopping the air blowing to the next execution of the air blowing. The corresponding electronic component supply apparatus executes air blowing at the stop interval of the input item 722 when fullness is not detected, and performs air blowing at the stop interval of the input item 724 when fullness is detected. In addition, the display area 712 divides the area for each bowl feeder unit 90 and further displays input items 722 and 724 for each electronic component supply device, so that the interval corresponding to each electronic component supply device can be easily input. It is preferable that the numerical value (stop interval) input to the input item 722 by the electronic component mounting apparatus 10 is limited to be longer than the numerical value (interval) input to the input item 724 . For example, it is preferable to set the air blowing stop time before fullness to 10 seconds, and to set the air blowing stop time after fullness to 1 second. As a result, the electronic component mounting apparatus 10 can perform air blowing at shorter intervals than when the electronic component supply apparatus is full when the electronic component supply apparatus is not full. In the electronic component mounting apparatus 10, when the electronic component supply apparatus becomes full, the air blowing interval is shortened, so that electronic components can be prevented from entering and being squeezed into the full guide rail 422 .

On the operation screen 710 , an input item 714 for inputting a blowing duration time and an input item 716 for inputting a full-fill waiting time are also displayed. Here, the blowing continuation time refers to the time for performing one blowing, that is, the duration of blowing. The blowing duration is a time that can be set by the operator, for example, 0.2 seconds. The so-called full-end waiting time is the time from when the sensor detects the presence of electronic components to when the electronic component is determined to be full, and the threshold time for determining whether it is full, that is, the threshold in step S608. The electronic component mounting apparatus 10 allows an operator to input various conditions by displaying the operation screen 710 .

Next, the control operation of the electronic component mounting apparatus 10 for controlling the air blower will be described using FIG. 120 . The electronic component mounting apparatus 10 controls the operation of the blower unit based on the conditions input through the operation screen 710 and the result of the fullness determination described above. In the electronic component mounting apparatus 10 , after driving the drive device in step S620 , it is determined whether or not the drive device is stopped as step S622 . Here, the so-called drive means is the drive means of the bowl feeder unit. Driving the driving device refers to a state in which the electronic component mounting device is operating (a state in which the housing bowl vibrates). When the electronic component mounting apparatus 10 determines in step S622 that the driving device has not stopped (No), it determines whether or not it is fully loaded as step S624 . That is, it is determined whether or not the electronic component supply device in which the air blower is installed is full. In addition, whether it is full or not can be determined by the above-mentioned processing.

When the electronic component mounting apparatus 10 determines in step S624 that it is not full (No), as step S626, it is checked whether the threshold time before full has passed, that is, whether the elapsed time from the latest air blowing is shorter than before full. The threshold is longer for judgment. The electronic component mounting apparatus 10 proceeds to step S622 when it is determined in step S626 that the threshold time before full has not passed (No), and proceeds to step S622 when it determines in step S626 that the threshold time before full has passed (Yes). Step S630.

When the electronic component mounting apparatus 10 determines in step S624 that it is full (Yes), as step S628, it is checked whether the threshold time after full has elapsed, that is, whether the elapsed time from the latest air blowing is shorter than the threshold after full. long to judge. The electronic component mounting apparatus 10 proceeds to step S622 when it determines in step S628 that the threshold time after full has not passed (No), and proceeds to step S626 when it determines in step S626 that the threshold time after full has passed (Yes). Step S630.

If the electronic component mounting apparatus 10 determines "Yes" in step S626 or step S628, that is, when the elapsed time is longer than the threshold, in step S630, blow air is performed, in step S632, the elapsed time is reset, and the process proceeds to step S622. When the electronic component mounting apparatus 10 determines in step S622 that the drive device has stopped (Yes), it ends this process. As described above, the electronic component mounting apparatus 10 repeats the above process while the driving device of the electronic component supply apparatus is driven, and the air blowing unit performs air blowing at intervals of stops based on each situation.

The electronic component mounting apparatus 10 can suppress clogging of the electronic component at the connection portion where the electronic component is supplied from the storage bowl to the rail by performing air blowing before it is fully loaded. In addition, the electronic component mounting apparatus 10 can suppress supply of electronic components from the storage bowl to the rail in the full state by performing air blowing after full. Thereby, it is possible to suppress the clogging of electronic components due to accumulation of electronic components on the proximal end rail. In particular, as shown in this embodiment, when a plurality of electronic component supply devices are driven by one drive device, since the vibration of the storage bowl continues, the electronic components are moved from the base end rail to the storage bowl by blowing air. By moving the bowl, it is possible to suppress excessive concentration of the electronic components on the base end rail while maintaining the supply operation of supplying the electronic components from the housing bowl to the rail.

Fig. 121 is a flowchart showing an example of the operation of the electronic component mounting device. Next, the control operation of the drive device based on the detection result of the full state of the bowl feeder unit 400 will be described using FIG. 121 . In the electronic component mounting apparatus 10, the electronic component supply apparatus 402, 404, 406 is driven as step S640, and the motor is excited as step S642. That is, the electronic component mounting apparatus 10 brings each part of the bowl feeder unit 400 into an activated state. After the electronic component mounting apparatus 10 excites the motor in step S642, as step S646, the supply operation of the electronic component is started. That is, the motor is driven to vibrate the storage bowl 422 and the like, and supply of the electronic component to the holding position is started. In addition, it is preferable that the electronic component mounting apparatus executes the air blowing operation described above during execution of the electronic component supply operation.

After the electronic component mounting apparatus 10 starts the supply operation in step S646, as step S648, it is determined whether or not all the electronic component supply apparatuses driven by the same driving apparatus are full. That is, it is determined whether or not all the electronic component supply devices of one bowl feeder unit 400 are full. In addition, whether or not each electronic component supply device is full can be detected by the above processing.

When the electronic component mounting apparatus 10 determines in step S648 that it is not full (No), it determines whether to stop the electronic component supply apparatus as step S650. Specifically, it is determined whether or not there is an instruction to stop the electronic component supply apparatus. The electronic component mounting apparatus 10 outputs an instruction to stop the electronic component supply apparatus when the electronic component mounting operation stops, for example, when an error is output, an error occurs in the electronic component supply apparatus, or production is interrupted. The electronic component mounting apparatus 10 progresses to step S659 when it determines with stop (Yes) in step S650, and progresses to step S648 when it determines with not stopping (No).

When the electronic component mounting apparatus 10 determines in step S648 that it is full (YES), in step S652, the excitation state is maintained, and the motor is stopped, and in step S654, whether the component detection sensor 582 on the holding position side detects that there is no Parts are judged. In addition, the electronic component mounting apparatus 10 may determine whether or not the electronic component at the holding position of the electronic component supply apparatus is held by the mounting head instead of detecting the absence of the component by the holding position side component detection sensor 582 . When the electronic component mounting apparatus 10 determines in step S654 that the holding position side component detection sensor 582 detects the absence of components (Yes), it proceeds to step S646 . When the electronic component mounting apparatus 10 determines in step S654 that no component has been detected by the holding position side component detection sensor 582 (No), as step S656, it is checked whether there is an electronic component supply device that is not full. determination.

When the electronic component mounting apparatus 10 determines in step S656 that there is an electronic component supply apparatus that is not fully loaded (Yes), it proceeds to step S646 . In step S656, the electronic component mounting apparatus 10 judges that there are no electronic component supply devices that are not fully filled (No), that is, when all the electronic component supply devices maintain a full state, as step S658, it is determined whether to use the electronic component supply device Stop making judgments. The electronic component mounting apparatus 10 progresses to step S659 when it determines with stop (Yes) in step S658, and progresses to step S654 when it determines with not stopping (No).

When the electronic component mounting apparatus 10 determines "YES" in step S650 or S658, as step S659, the excitation state is released, the electronic component supply apparatus is stopped, and this process ends.

The electronic component mounting apparatus 10, as shown in FIG. 121 , when all the electronic component supply devices become full, stops the motor 430, that is, stops the vibration of the storage bowl 420 by the driving device 408, thereby making the storage bowl 420 vibrate. 420 The supply operation of supplying electronic components to the rail 422 is stopped. The electronic component mounting apparatus 10 can reduce power consumption by stopping the supply operation of electronic components from the storage bowl 420 in a full state to the rail 422 . In addition, the electronic component mounting apparatus 10 can restart the vibration in a short time by maintaining the state in which the motor 430 is excited even when the vibration is stopped. Thereby, delay in supply of electronic components to the holding position can be suppressed, and electronic components can be efficiently mounted on a board.

Preferably, the electronic component mounting apparatus 10 may operate as a preparatory process, that is, perform a filling and replenishing operation for filling the bowl feeder assembly 90 (or bowl feeder unit 400 ) before the start of mounting the electronic components on the board.

Next, the full replenishment operation will be described using FIGS. 122 to 124 . FIG. 122 is an explanatory diagram showing an example of an operation screen. 123A and 123B are explanatory views each showing an example of an operation screen. Fig. 124 is a flowchart showing an example of the operation of the electronic component mounting device.

The electronic component mounting apparatus 10 displays the operation screen 730 based on the operation of the operator during the operation of the preparatory process. The operation screen 730 is a screen for inputting various operations during the operation of the preparation process, and buttons 732 are displayed. The button 732 is a button for instructing execution of the full replenishment operation. When the electronic component mounting apparatus 10 performs an input operation on the button 732, the operation screen 740 of FIG. 123A related to the filling and replenishing operation is displayed.

The operation screen 740 shown in FIG. 123A is an operation screen for the full replenishment operation displayed after the button 732 is operated. The operation screen 740 includes a display area 742 and buttons 748 and 749 . The display area 742 is a display area showing the state of each electronic component mounting device (bowl feeder), and displays an item 744 corresponding to each electronic component mounting device. Item 744 indicates whether filling and replenishment is completed, and also indicates whether an electronic component mounting device is installed at the corresponding position. Item 744 shows "Yes" if it is full, and "Incomplete" if it is not full. Moreover, when the electronic component mounting apparatus is not installed in the corresponding position of item 744, "****" is displayed. When the button 748 is operated while the operation screen 740 is displayed, the electronic component mounting apparatus executes a filling and replenishing operation. When the button 749 is operated while the operation screen 740 is displayed, the electronic component mounting apparatus stops the filling and replenishing operation.

The operation screen 740a shown in FIG. 123B is a screen displayed in a state where the filling and replenishing operation is completed. In the operation screen 740a, the item 744 does not have "unfinished", and the text "replenishment has been completed." is displayed in the message display column 746 .

As shown in FIG. 124 , the electronic component mounting apparatus 10, after detecting the filling and replenishing instruction instructing the execution of the filling and replenishing operation in step S660, drives the driving device to start the supply operation of electronic components in step S662. .

After the electronic component mounting apparatus 10 starts the supply operation in step S662, as step S664, it is determined whether or not all the electronic component supply apparatuses driven by the same driving apparatus are full. That is, it is determined whether or not all the electronic component supply devices of one bowl feeder unit 400 are full. In addition, whether or not each electronic component supply device is full can be detected by the above processing. When the electronic component mounting apparatus 10 determines in step S664 that it is not fully loaded (No), it progresses to step S664. When the electronic component mounting apparatus 10 determines in step S664 that it is full (Yes), it stops the drive device in step S666 and ends this process.

By executing the processing shown in FIG. 123 , the electronic component mounting apparatus 10 can bring the electronic component mounting apparatus into a full state. It is preferable that the electronic component mounting apparatus 10 executes the air blowing operation described above during execution of the electronic component supply operation. The electronic component mounting apparatus 10 can quickly start mounting electronic components at the start of production by executing the filling and replenishing operation.

Next, the control operation of the mounting head based on the detection result of the holding position side component detection sensor will be described using FIG. 125 . Fig. 125 is a flowchart showing an example of the operation of the electronic component mounting device. The electronic component mounting apparatus 10 repeatedly executes the processing of FIG. 125 while the electronic component mounting operation is being performed. In the electronic component mounting apparatus 10, as step S670, the detection result of the holding position side component detection sensor is acquired, and as step S672, it is determined whether or not the electronic component is present. That is, the electronic component mounting apparatus 10 determines whether or not an electronic component is detected at the holding position.

When the electronic component mounting apparatus 10 determines in step S672 that the electronic component exists (YES), as step S674 , the mounting head performs a holding operation of the electronic component, and ends this process. That is, the electronic component detected at the holding position is held by the suction nozzle of the mounting head, and the electronic component mounting operation is performed. When it is determined in step S672 that there is no electronic component (No), the electronic component mounting apparatus 10 puts the mounting head on standby as step S676 . That is, it waits for execution of the holding operation of holding the electronic component at the holding position by the mounting head.

If the mounting head is put on standby in step S676, then as step S678, the electronic component mounting apparatus 10 determines whether the state of no electronic component continues for a fixed time, that is, whether the state of no electronic component detected at the holding position continues for a fixed time. When the electronic component mounting apparatus 10 determines in step S678 that the electronic component-free state has not continued for a predetermined time (No), it proceeds to step S670 and repeats the above-described processing.

When the electronic component mounting apparatus 10 determines in step S678 that the electronic component-free state continues for a predetermined time (YES), it outputs an error message in step S679 and ends this process.

As shown in FIG. 125 , the electronic component mounting apparatus 10 controls the holding operation of the mounting head based on the detection result of the component detection sensor on the holding position side, so that the electronic component holding operation can be prevented from being performed in a state where the electronic component cannot be held. Case. Thereby, it is possible to reduce the repeated execution of a series of operations of "executing the electronic component holding operation, using the laser recognition device 38, etc. to measure the state of the electronic component, detecting that the electronic component is not held, and then performing the electronic component holding operation again". Possibility to improve work efficiency. In addition, when an electronic component is not detected, by outputting an error message, it is possible to promptly notify an operator that "a problem occurred in supplying an electronic component by the electronic component mounting apparatus".

Here, the electronic component mounting apparatus 10 of the above-described embodiment is configured to include a bowl feeder assembly 90 using a bowl feeder as the component supply unit 14f, and an electronic component supplying unit 14r including a radial feeder. device 100, but is not limited thereto. The electronic component mounting apparatus 10 can have various combinations of component supply units. For example, an electronic component supply device with a bowl feeder installed on the front and rear component supply units, or an electronic component supply device with a radial feeder installed on the front and rear component supply units . In addition, as described above, an electronic component supply device (chip component feeder) 100 a that supplies mountable electronic components may be included as the component supply unit. In addition, all the electronic component supply devices of one component supply unit on the front side and the rear side may be provided as the electronic component supply device (chip component feeder) 100 a. That is, one of the component supply units on the front side and the rear side may supply lead-type electronic components (electronic components inserted into the substrate), and the other may supply leadless electronic components (electronic components mounted on the substrate). In addition, a so-called tray feeder or an axial feeder can also be used as the electronic component mounting apparatus. The electronic component mounting apparatus 10 can mount or insert an electronic component on a board by suctioning or holding the electronic component regardless of which electronic component supply apparatus is supplied. In addition, in an electronic component supply device that supplies lead-type electronic components, the lead-type electronic components are placed in an orientation in which the main body is arranged on the upper side in the vertical direction of the leads, that is, in an orientation in which the leads are arranged on the lower side in the vertical direction of the main body. The holding position supply is carried out by the suction nozzle. Here, it is preferable for the electronic component mounting apparatus 10 to arrange a component supply unit of an electronic component mounting apparatus having a bowl feeder and a component supply unit of another type of electronic component mounting apparatus between each other as shown in this embodiment. The position opposite to the substrate conveying part 12. Thereby, it can suppress that the vibration of a bowl feeder affects the component supply unit which has another type of electronic component mounting apparatus.

Next, modifications of the electronic component mounting apparatus will be described using FIGS. 126 to 139 . The electronic component mounting apparatus described in FIGS. 126 to 139 is an electronic component mounting apparatus that performs electronic component mounting processing in a state where the substrate is supported from the back by a support device having a plurality of support pins.

126A and 126B are side views each showing a schematic structure of a conventional supporting device. Here, FIG. 126A shows a state where the substrate 100 is stopped at the component mounting position. A support device 862 is disposed below the substrate 861. The support device 862 has a support table 864 on which a plurality of support pins 863 are vertically provided for supporting the substrate 861 from the lower surface during component mounting.

The support table 864 is constructed so that it can be raised and lowered in the vertical direction. As shown in FIG. 126B, after the substrate 861 is positioned at the component mounting position, the support table 864 is raised as shown in FIG. 861 lifted. As described above, the electronic component 107 is mounted on the substrate 861 by the suction nozzle 866 of the mounting head 865 in a state where the substrate 861 is supported by the front end portion of the support pin 863 from the lower surface.

The positions of the support pins 863 standing upright on the support table 864 are determined according to the type (size, shape, etc.) of the substrate 861 . Therefore, the support table 864 is configured to provide a plurality of pin holes through which the support pins 863 can be inserted and extracted, and the arrangement position of the support pins 863 can be changed according to the type of substrate.

As a technique for automatically checking whether or not support pins 863 are arranged at appropriate positions according to the type of substrate 861 , there is a technique described in Patent Document 1, for example. This technique is to provide a plurality of switches that are turned on and off in response to the insertion/extraction of the support pin 863, and the arrangement position data of the support pin 863 acquired based on the signals of the plurality of switches and the pre-registered appropriate location data for comparison.

Here, as electronic components mounted on the board, there are aluminum electrolytic capacitors, resistors that need to be mounted upright, etc., and radial lead type electronic components (radial components, lead components) in which leads as terminals protrude from the lower surface. When mounting such a radial lead type electronic component on a board, as described above, it may be necessary to nail the leads of the electronic component inserted into the insertion hole. In addition, although the electronic component mounting apparatus 10 can be reliably mounted on a board|substrate even if it is not implemented as mentioned above, the structure which performs nailing may be employ|adopted.

127A and 127B are diagrams each showing a nailing process of a radial lead type electronic component. Such a radial lead type electronic component is an insertion mounting type electronic component. When mounting on a substrate, first, as shown in FIG. , so that the leads 820a protrude from the lower surface of the substrate. Then, as shown in FIG. 127B , the radial lead type electronic component 820 is fixed to the substrate 861 by performing a nailing process for bending the lead part on the lower surface of the substrate.

As mentioned above, in the electronic component mounting apparatus that is not provided with a mechanism for nailing the lead part, when mounting radial lead type electronic components, the lead wires are inserted into the insertion holes formed on the substrate, and when necessary, the lead wires are inserted into the insertion holes formed on the substrate. Next, after the board is carried out to the outside of the mounting device, it is nailed with a dedicated device. Therefore, it is preferable that the electronic component mounting apparatus 10 has a mechanism capable of nailing lead wires of electronic components. In addition, it is preferable that the electronic component mounting apparatus 10 is provided with a mechanism capable of nailing lead wires of electronic components on the support pins.

Next, the specific structure of the support pin in this embodiment is demonstrated. Fig. 128A is a front view showing the structure of a support pin. Fig. 128B is a side view showing the structure of a support pin. The support pins 840 have a pair of nailing guides (support members) 841 extending in the vertical direction and supporting the lower surface of the circuit board 8 by their upper ends during component mounting. The pair of nailing guides 841 are disposed opposite to each other in the left-right direction in FIG. 128A , and their lower ends are connected to the guide flange 842 with a predetermined interval therebetween. Here, each nailing guide portion 841 is centered on an axis 843 extending in a direction perpendicular to the paper surface in FIG. connected in rotation. At this time, the nail guide portion 841 is closely attached to the guide flange 842 by caulking or the like. Thereby, as shown in the support pins 840a, 840b, and 840c of FIG. 129, the distance α between the upper end portions of the nailing guide portion 841 can be varied. As described above, the opening and closing mechanism of the nailing guide 841 is realized by the guide flange 842 and the shaft 843 .

In addition, at the upper end portion of each nailing guide portion 841 , a lead wire guide groove 841 a is formed on the side surface opposite to the side where the opposing nailing guide portion 841 is arranged. The lead wire guide groove 841a has a constant groove width in the extending direction, and the bottom surface of the lead wire guide groove 841a is an inclined surface inclined with respect to the horizontal plane. Each of the nailing guides 841 supports the lower surface of the board 8 with the upper surface 841 b shown in FIG. 130 during component mounting. Here, the upper surface 841b of the nailing guide 841 becomes a horizontal plane.

Fig. 131 is a diagram showing the shape of the wire guide groove 841a. As shown in this FIG. 131 , the inclined surface formed by the wire guide groove 841 a is composed of two inclined surfaces whose inclination angles with respect to the horizontal plane are different up and down. That is, the inclination angle of the inclined surface changes at a point P in the middle of the vertical direction, the inclination angle of the upper inclined surface Q-P is gentle (inclination angle = θ1), and the inclination angle of the lower inclined surface P-R Steep (tilt angle = θ1 + θ2). The angles θ1 and θ2 are, for example, θ1=30° and θ2=30°. In addition, in FIG. 131 , point Q is the upper end portion of the bottom surface (inclined surface) of the wire guide groove 841a, and point R is the lower end portion of the bottom surface (inclined surface) of the wire guide groove 841a.

Returning to Fig. 128, the guide flange 842 is screwed with the threaded shaft 844 extending in the vertical direction, and its height can be adjusted. In addition, on the threaded shaft 844 , a nut 845 is screwed under the guide flange 842 , so that the height position of the guide flange 842 can be locked by means of double nuts. The lower end of the threaded shaft 844 is fixed on a base 846 provided on the support table. As described above, the height adjustment mechanism (height adjustment unit) for nailing the guide portion 841 is realized by the guide flange 843 , the threaded shaft 844 , and the nut 845 .

And, when the support pin 840 is erected on the support table, as shown in the support pins 840a, 840b, and 840c of FIG. The height) β is adjusted so as to be constant regardless of the interval α (the distance between points Q shown in FIG. 131 ) between the upper end portions of the nailing guide 841 . The arrangement positions of such support pins 840 on the support table are predetermined based on the type of substrate 8 (substrate mounting pattern). Therefore, before starting the component mounting process, a layout diagram marking the arrangement positions of the support pins 840 is pasted on the support table 850 corresponding to the substrate mounting pattern, and the support pins 840 are arranged according to the layout diagram. In addition, the support pin 840 is installed upright on the support table 850 by being attracted to the support table 850 with a magnet, or inserted into a hole provided in the support table 850 , or the like.

FIG. 132 is a diagram showing an arrangement example of support pins 840 . As shown in this FIG. 132 , a plurality of support pins 840 are arranged on a support table 850 . In this case, support pins 840 must be arranged at positions corresponding to the mounting points of the insertion mount type radial lead type electronic components 820 shown in FIG. 127 . Also, in the other regions, the support pins 840 with the upper ends of the nailing guides 841 closed are appropriately arranged at positions where the substrate 8 can be supported without bending the substrate 8 during component mounting.

The radial lead type electronic component 820 has one lead terminal 820 a protruding downward on both sides of the lower surface. On the substrate 8, a plurality of insertion holes for inserting the lead wires 820a of the radial lead type electronic component 820 are formed. When mounting the radial lead type electronic component 820 on the substrate 8, first, the The lead wire 820 a is inserted upward so that the lead wire 820 a protrudes from the lower surface of the substrate 8 . Then, the radial lead type electronic component 820 is fixed to the substrate 8 by performing a nailing process of bending the lead 820 a on the lower surface of the substrate 8 .

In the present embodiment, when the support pin 840 is arranged at a position corresponding to the mounting point of the radial lead type electronic component 820, the positional relationship between the insertion hole of the lead wire 820a and the nailing guide 841 becomes the relationship shown in FIG. 133 . . Fig. 133 is a diagram showing the positional relationship between the insertion hole of the lead wire and the inclined surface of the support pin. 133 is a plan view showing the positional relationship between the lead wire insertion hole and the inclined surface of the support pin on the upper side of the paper, and a front sectional view showing the positional relationship between the lead wire insertion hole and the inclined surface of the support pin on the lower side of the paper. . FIG. 133 shows a simplified front end portion of the support pin 840 . As shown in FIG. 133, the support pin 840 arranged at the position corresponding to the mounting point of the radial lead type electronic component 820 adjusts the opening of the nailing guide 841 through the opening and closing mechanism so that the diameter A (the distance α between the upper ends of the nailing guides 841 ) is smaller than the center-to-center distance B of the insertion holes 805 a for inserting the leads 820 a of the radial lead type electronic component 820 . In addition, the thickness of the nailing guides 841 is set such that the outer diameter C of the support pin 840 (the distance between the points R of the nailing guides 841) is smaller than the center-to-center distance B of the insertion holes 805a and the diameter of the insertion holes 805a. The sum D is large.

That is, as shown in the front sectional view of FIG. 133, in the front view, the position Q in the horizontal direction (radial direction of the insertion hole 805a) of the upper end of the above-mentioned inclined surface is within the range of the insertion hole 805a and is located in the same direction as the insertion hole 805a. The center position of the hole 805 a is shifted inward from the support pin 840 . In addition, in the front view, the position R in the horizontal direction (radial direction of the insertion hole 805a) of the lower end portion of the above-mentioned inclined surface is outside the range of the insertion hole 805a and is located toward the support pin compared with the center position of the insertion hole 805a. 840 outboard offset position.

In addition, although not particularly shown, in a side view, the center position of the upper end portion of the inclined surface in the horizontal direction (radial direction of the insertion hole 805 a ) coincides with the center position of the insertion hole 805 a. In addition, the width of the upper end portion of the inclined surface (the groove width of the upper end portion of the lead wire guide groove 841 a ) is set to be equal to or larger than the diameter of the insertion hole 805 a. With this configuration, when the electronic component mounting device mounts the radial lead type electronic component 820 on the substrate 8, the lead wire 820a is inserted into the insertion hole 805a to lower the radial lead type electronic component 820, and the front end of the lead wire 820a In contact with the inclined surface formed on the upper end portion of the support pin 840, it bends along the inclined surface as shown in FIG. 134 . As described above, the electronic component mounting apparatus can perform the nailing process of the leads 820 a simultaneously with mounting the radial lead type electronic components 820 on the substrate 8 .

Next, a method of mounting the radial lead type electronic component 820 on the substrate 8 in this embodiment will be described using FIG. 135 . FIG. 135 is a diagram showing an operation during mounting of the radial lead type electronic component in this embodiment. First, the mounting head 15 is moved, and the upper surface of the radial lead type electronic component 820 is held by the suction nozzle 32 from the component supply device 15 . Then, the electronic component mounting apparatus moves the mounting head 15 to the mounting point of the held radial lead type electronic component 820 after performing component recognition by the VCS unit 17 . At this time, the electronic component mounting apparatus stops the mounting head 15 at a position where the lead wire 820a of the radial lead type electronic component 820 reaches the position directly above the insertion hole 805a formed in the substrate 8 as shown in step S701 of FIG. 135 .

Then, the suction nozzle of the mounting head 15 is lowered. At this time, as shown in step S702 of FIG. 135 , the lead wire 820a is inserted into the insertion hole 805a. Since the tip diameter A (interval α of the upper end) of the nailing guide 841 is set to be smaller than the center-to-center distance B of the insertion hole 805a, if the suction nozzle 32 is further lowered from the state shown in step S702 of FIG. , as shown in step S703 of FIG. 135 , the lower end portion of the lead wire 820 a abuts against the bottom surface of the lead wire guide groove 841 a formed at the upper end portion of the supporting pin 840 .

Since the bottom surface of the wire guide groove 841a is an inclined surface inclined relative to the horizontal plane, if the suction nozzle is further lowered from the state shown in step S703 of FIG. As shown in step S704 of FIG. 135 , the lower end of the lead wire 820a is bent along the shape of the lead wire guide groove 841a. Then, as shown in step S705 of FIG. 135 , the suction nozzle 32 descends until the lower surface of the radial lead type electronic component 820 contacts the upper surface of the substrate 8 , and releases the suction of the radial lead type electronic component 820 . The angle of the front end portion of the lead wire 820a at this time with respect to the horizontal plane is an angle θ1 of the upper inclined surface of the bottom surface of the lead wire guide groove 841a. Since the angle θ1 of the upper inclined surface is set to a relatively small angle, the radial lead type electronic component 820 cannot be pulled out from the substrate 8 by nailing using the upper inclined surface.

Here, in this embodiment, the inclined surface formed by the bottom surface of the wire guide groove 841a is composed of two inclined surfaces with different vertical inclination angles. Assuming that the lower inclined surface with a relatively large inclination angle relative to the horizontal plane is not provided, and only the upper inclined surface with a relatively small inclination angle relative to the horizontal plane is used for nailing, the front end of the lead wire 820a is convex below the insertion hole 805a. In the process of pulling out, the front end part does not expand to the outside of the nailing guide part 841, and the nailing process may not be properly performed.

On the other hand, in this embodiment, since the front end of the lead wire 820a protrudes below the insertion hole 805a, the front end of the lead wire 820a can be extended to the outside of the nailing guide 841 by using the lower inclined surface. The leads 820a are extended appropriately. In addition, at this time, since the lead wire 820a can be nailed while being guided by the side surface of the concave lead wire guide groove 841a, the lead wire 820a can be suppressed from spreading in the width direction of the lead wire guide groove 841a during nailing.

Then, after mounting all the electronic components on the substrate 8 , the support table is lowered, and the support pins 840 are separated from the substrate 8 as shown in step S706 of FIG. 135 . As described above, after releasing the support of the substrate 8 by the supporting device, the substrate 8 is carried out from the electronic component mounting apparatus 1, and the leads 820a of the radial lead type electronic component 820 are completely fixed by reflow soldering or the like. As described above, since the leads 820a of the radial lead type electronic components 820 are fastened when mounted on the substrate 8, even if the substrate 8 vibrates when the substrate 8 is carried out, as long as the radial lead type electronic components 820 are not The state in which the lead wire 820a is inserted into the insertion hole 805a can be maintained by directly applying an external force.

As described above, the upper end portion of the support pin that supports the circuit board from the back during component mounting is formed with an inclined surface that is inclined with respect to the horizontal plane, and the support pin is arranged at least in front of the mounting point of the radial lead type electronic component. below. In this case, the position of the end portion on the inclined surface in the radial direction of the lead wire insertion hole formed in the circuit board is shifted to one side from the center position of the insertion hole within the range of the insertion hole. In addition, it is arranged such that the position of the lower end portion of the inclined surface in the radial direction of the insertion hole is outside the range of the insertion hole and shifted to the other side with respect to the center position of the insertion hole.

Thereby, when the lead of the radial lead type electronic component protrudes from the lower surface of the insertion hole of the circuit board during component mounting, the front end portion thereof can be brought into contact with the inclined surface. Therefore, by lowering the radial lead type electronic component from this state, the front end portion of the lead terminal can be bent along the above-mentioned inclined surface. As described above, the nailing process of the lead terminal can be performed simultaneously with component mounting, and a state in which the lead terminal cannot be pulled out from the insertion hole of the substrate can be obtained. Therefore, even if the substrate vibrates during unloading after component mounting, the state in which the radial lead type electronic component is mounted on the substrate can be maintained.

In addition, since the support pin has the wire nailing function, it is not necessary to newly install a dedicated machine for the nailing process, and accordingly space can be saved. In addition, since the support pin is not limited to the nailing function, it can be used as a normal substrate support pin as long as it is arranged except directly below the mounting point of the radial lead type electronic component. In addition, since the lead wire guide groove extending in the vertical direction is provided at the upper end of the nailing guide part, and the bottom surface of the lead wire guide groove constitutes the above-mentioned inclined surface, the expansion of the lead terminal can be suppressed by the guidance of the lead wire guide groove, and the Proper nail handling.

In addition, since the above-mentioned inclined surface is composed of two inclined surfaces whose inclination angles are different up and down with respect to the horizontal plane, and the angle of the upper inclined surface is set to be smaller than that of the lower inclined surface, when mounting components, the lead terminal When the front end of the lead wire protrudes below the insertion hole, the front end of the lead wire can be expanded in the nailing direction by using the lower inclined surface. Therefore, the lead terminal can be smoothly bent. In addition, since the angle of the lead terminal after the nailing process with respect to the horizontal plane can be set to a relatively small angle of the upper inclined surface, the radial lead type electronic component after the nailing process can be stably fixed on the circuit board. .

In addition, since there is an opening and closing mechanism that can adjust the opening degree of the upper end of the nailing guide, one type of support pin can be used for nailing a plurality of radial lead type electronic components with different lead pitches. In this case, since the lower end portions of the pair of nail guides are rotatably connected to the guide flange, the opening and closing mechanism described above can be realized with a relatively simple structure.

In addition, since there is a height adjustment mechanism for the nailing guide, the heights of the plurality of support pins can be fixed regardless of the opening degree of the upper end of the nailing guide, and the circuit board can be stably supported. At this time, by locking the height position of the nailing guide with the double nut method, it is possible to cope well with height changes during component mounting.

In addition, in the above-mentioned embodiment, the case where only one wire guide groove 841a is provided in the nailing guide portion 841 has been described, but two wire guide grooves 841a may be provided as shown in FIG. 136 . Therefore, as an electronic component of an insertion mounting type, not only the radial lead type electronic component 820 having one lead 820a on one side shown in FIG. type electronic components. In addition, for radial lead type electronic components with more than or equal to 2 leads on one side, the number of lead wire guide grooves 841a, the groove interval, the groove width, etc. , so as to correspond.

In addition, in the above-mentioned embodiment, the case where the groove width of the lead wire guide groove 841a is made constant in the extending direction has been described, but as shown in FIG. The narrower the groove width is at the front end. Accordingly, it is possible to more effectively suppress the spread of the lead wire during nailing.

In addition, in the above-mentioned embodiment, the case where the component recognition is performed using the VCS unit 17 has been described, but the component recognition may be performed using the laser recognition device 38 as described above. In this case, the laser device includes: a laser irradiation unit that irradiates laser light in the horizontal direction; and a laser light receiving unit that receives the laser light irradiated by the laser irradiation unit.

Fig. 138A is a side view showing another example of the parts recognition method. Fig. 138B is a bottom view showing another example of the parts recognition method. As shown in FIGS. 138A and 138B , when performing identification of the radial lead type electronic component 820 , the component identification is performed with the suction nozzle moved to a position where the lead wire 820 a is located on the laser surface. As the component recognition method using laser light, the method described above can be used. First, while the laser light irradiated from the laser irradiation unit is being received by the laser light receiving unit, the suction member is rotated, and a shadow portion is stored for every predetermined rotation angle. Then, at the end of the rotation, the shape of the part is drawn based on the optical axis and shadow of the laser. With this method, as shown in FIG. 139 , the X-direction dimension (distance X between the leads 820 a ) and the Y-direction dimension (diameter Y of the lead 820 a ) of the lead portion can be identified.

Then, based on the result of recognition of the shape of the lead portion, the position of the component center is calculated, and the amount of deviation of the component center from the rotation center of the mounting head (component suction center) stored as a parameter in advance is calculated. Here, as the above-mentioned offset amount, the offset amount (dX) of the component center in the X direction relative to the head rotation center, the Y direction offset amount (dY) of the component center relative to the head rotation center (dY), and the component The angular offset (dθ) of the center relative to the center of rotation of the mounting head. Then, using the calculated offsets dX, dY, and dθ as X-direction correction values, Y-direction correction values, and θ-direction correction values, the position of the component mounting coordinates is corrected to perform component mounting. Accordingly, the radial lead type electronic component 820 can be mounted at an appropriate position on the substrate 8 at an appropriate angle.

In addition, in the above-mentioned embodiment, the case where the lead wires 820a on both sides are nailed in opposite directions has been described, but the direction of nailing the lead wires 820a is not limited to this. That is, the surface on which the lead wire guide groove 841a is formed on the nailing guide portion 841 can be appropriately selected. In addition, the rotation position is adjusted and maintained by attaching each lower end portion of the nail guide portion 841 to the guide flange 842 by nailing, but it is also possible to tighten/loosen the rotation position using screws or the like. The position is adjusted and maintained.

In addition, in the above-mentioned embodiment, the case where the opening and closing mechanism is realized by rotatably connecting the lower ends of the pair of nail guides 841 to the guide flange 842 has been described, but as long as the pair of nails A structure in which the interval α between the upper end portions of the firm guide portion 841 is variable is sufficient and is not limited thereto. In addition, the case where the height adjustment mechanism is realized by screwing the guide flange 842 with the threaded shaft 844 extending in the vertical direction has been described, but any structure that can adjust the height of the nailing guide 841 is sufficient. , is not limited to this.

Next, an example of a component supply device as a bowl feeder will be described using FIGS. 140 to 149C. In addition, the electronic component mounting apparatus 902 shown in FIG. 140 to FIG. 149C has basically the same structure as the electronic component mounting apparatus 402, 404, 406 mentioned above.

As shown in FIG. 140 , the electronic component supply device 902 is a bowl type feeder that vibrates and supplies electronic components P to a holding position held by a suction nozzle of a mounting head. The electronic component supply device 9910 transports the electronic component P to the holding position on the front side of the substrate transport unit 12 via the linear guide rail 904 . The electronic component supply device 902 has a cylindrical metal storage bowl 931 (storage container) formed with an open upper surface, and a plurality of electronic components P are scattered and stored in the storage bowl 931 . On the storage bowl 931 , a transport path 933 for transporting the electronic component P is provided in a spiral shape along the inner peripheral surface 932 from the bottom toward the opening side.

The storage bowl 931 is connected to a vibrating part for vibrating. When vibration is applied to the storage bowl 931 by the vibrating portion, the electronic component P placed on the bottom moves on the transport path 933 toward the opening side. In the vicinity of the exit of the spiral conveyance path 933 , there is attached a resin delivery unit 941 that unifies the orientation of the electronic components P and sends out the electronic components P to the guide rail 904 . On the sending part 941, a linear conveyance path (proximal guide rail) 942 connected to the spiral conveyance path 933 is formed, and this linear conveyance path 942 is also vibrated by the vibrating part to direct the electronic component P toward the guide rail 904. move.

In the delivery part 941, near the exit of the spiral conveyance path 933, the screening part 943 which passes only the electronic component P of a predetermined direction is provided. In addition, in the delivery part 941 , a dropping part 944 is provided near the entrance of the guide rail 904 , which changes the posture of the electronic components P unified by the sorting part 943 into a posture that can be sucked by the suction nozzle 21 . The electronic component P passing through the sending part 941 is delivered to the guide rail 904, and is conveyed toward a holding position. The guide rail 904 is composed of a pair of linear metal plates, and extends from the electronic component supply device 902 toward the holding position to be slightly inclined downward. The guide rail 904 is also vibrated by the vibrator, and conveys the electronic component P to the mounting device 1 .

Here, referring to FIG. 141 and FIG. 142 , the delivery unit will be described in detail. In addition, in the following description, the case where the electronic component supply apparatus supplies each large electronic component is demonstrated in FIG. 141A and FIG. 142A, and the case where the electronic component supply apparatus supplies small components is demonstrated in FIG. 141B and FIG. 142B. 141A and 141B are perspective views of components according to this embodiment, respectively. 142A and 142B are perspective views of a part of the component supply device according to this embodiment, respectively. Additionally, Figure 141A shows a large component. Figure 141B shows a small part. In addition, FIG. 142A shows a parts supply device for conveying the large parts shown in FIG. 141A. Fig. 142B shows a parts supply device for conveying the small parts shown in Fig. 141A.

As shown in FIG. 141A, for a large electronic component Pa, if the X-axis direction is set as the length dimension X, the Y-axis direction is set as the width dimension Y, and the Z-axis direction is set as the height dimension Z, then it has X>Z> The component main body 971a of the rectangular parallelepiped shape of Y. The component main body 971a is provided with a plurality of lead wires 973a protruding outward from a mounting surface 972a mounted on the substrate W. As shown in FIG. On the mounting surface 972a, four lead wires 973a and five lead wires 973a arranged in the X-axis direction are arranged in two rows. The electronic component Pa is mounted on the substrate W by inserting the lead wire 973 a into the mounting hole formed on the substrate W. As shown in FIG.

As shown in FIG. 141B , for a small electronic component Pb, if the X-axis direction is defined as the length dimension X, the Y-axis direction is defined as the width dimension Y, and the Z-axis direction is defined as the height dimension Z, then it has X>Z > Y rectangular parallelepiped-shaped component main body 971b. The component main body 971b is provided with a plurality of lead wires 973b protruding outward from a mounting surface 972b on which the substrate W is mounted. On the mounting surface 972b, three leads 973b arranged in the X-axis direction are arranged in one row. In addition, a recessed portion 975b is formed in the component main body 971b so that the central lead 973b is exposed to the outside. The electronic component Pb is mounted on the substrate W by inserting the lead 973 b into the mounting hole formed on the substrate W. As shown in FIG.

As shown in FIG. 142A , in the housing bowl 931a of the electronic component supply apparatus 902a, a spiral transport path 933a is formed along the peripheral wall portion 934a. That is, one end side of the conveyance width direction of the conveyance path 933a is surrounded by the peripheral wall portion 934a, and the other end side in the conveyance direction is opened into the storage bowl 931a. On this conveyance path 933a, the electronic component Pa is conveyed in various postures along the peripheral wall portion 934a. For example, the electronic component Pa has an upright posture in which the longitudinal direction (X-axis direction) of the component main body 971a is oriented vertically, a lateral posture in which the width direction (Y-axis direction) of the component main body 971a is oriented vertically, and a height direction (Z-axis direction) of the component main body 971a. ) towards the vertical orientation conveyed in the vertical direction. In addition, in the upright posture and the horizontal posture, the lead wire 973a is oriented laterally, and in the vertical posture, the lead wire 973a is oriented vertically.

The sending part 941a is provided near the exit of the conveyance path 933a of the bowl 931a, and has a conveyance path (proximal end rail) 942a connecting the spiral conveyance path 933a of the bowl 931 to the guide rail 904a. On one end side of the conveyance path 942a in the conveyance width direction, an outer wall portion 945a continuous with the peripheral wall portion 934a of the housing bowl 931a is formed. The other end side of the conveyance path 942a in the conveyance width direction is open toward the storage bowl 931a. The sending part 941a is provided with the screening part 943a which sorts the electronic component Pa which entered in various postures from the spiral conveyance path 933a.

The screening unit 943a is a member that passes only electronic components Pa transported in a predetermined posture, and has a metal guide 951a (first guide) provided on the transport path 942a; and a chamfer 952a (width narrowing portion), which is formed on the transport path 942a. The guide portion 951a is provided on a mounting plate 953a mounted on the outer wall portion 945a, and is formed by folding back a belt extending forward from the mounting plate 953a. The guide portion 951a extends obliquely across the upper side of the conveyance path 942a from the upstream side toward the downstream side in the conveyance direction.

In this case, the lower end of the guide portion 951a crosses at a position slightly higher than the width dimension Y of the electronic component Pa with respect to the road surface of the conveyance path 942a. Therefore, the electronic component Pa in the horizontal posture passes under the guide portion 951a, and the electronic components Pa in the upright posture and the vertical posture are restricted from passing by the guide portion 951a. The electronic components Pa in the upright posture and the vertical posture are guided along the extending direction of the guide portion 951a, fall off the transport path 942a, and return to the storage bowl 931a (see FIG. 143 ). As mentioned above, the guide part 951a passes only the electronic component Pa of a horizontal posture.

The chamfered portion 952a is formed below the guide portion 951a in a range slightly longer than the length dimension X of the electronic component Pa on the other end side of the conveyance path 942a in the conveyance width direction. The chamfered portion 952a narrows the conveyance width of the conveyance path 942a so that only the electronic component Pa in the basic posture (refer to electronic component Pa2 in FIG. 143A ) in which the lead wire 973a faces the inside of the storage bowl 931a in the horizontal posture passes. Among the electronic components Pa in the horizontal position, the electronic component Pa in the reverse position in which the lead 973a faces the outer wall portion 945a side falls off the transport path 942a due to the center of gravity shifting toward the chamfered portion 952a side, and returns to the storage bowl 931a. As described above, the chamfered portion 952a passes only the electronic component Pa of the basic posture among the electronic components Pa of the lateral posture.

In addition, in the electronic component Pa in the horizontal position, the length dimension X of the electronic component Pa in which the lead wire 973a faces the conveying direction is sufficiently large with respect to the conveying width of the conveying path 933a, so it falls off the conveying path 933a before entering the delivery part 941a. Return to containment bowl 931. With such a configuration, the postures of the electronic components Pa passing through the screening unit 943a are unified and conveyed to the guide rail 904a. In addition, a drop portion 944a is formed in the sending portion 941, which changes the electronic component Pa in the basic posture to a posture that can be sucked by the mounting head 3, and sends it out to the guide rail 904a.

The drop portion 944a is formed so that the electronic component Pa conveyed along the outer wall portion 945 rolls sideways by its own weight in the conveying width direction by using the recessed portion 954a provided to narrow the conveying width of the conveying path 942a. At this time, the electronic component Pa in the basic posture falls into the recessed portion 954a from the lead wire 973a facing inside the housing bowl 931a, and the posture of the lead wire 973a is changed to a vertical posture facing downward (see FIGS. 145A to 145C). The electronic component Pa whose posture has been changed is conveyed toward the guide rail 904a, and is conveyed toward the holding position. The posture of the electronic component Pa at this time is an appropriate posture for the mounting head 15 that mounts the electronic component Pa onto the substrate W from above.

As shown in FIG. 142B , in the electronic component supply apparatus 902b, there is a metal guide portion 955b (second guide portion) that guides the small electronic component Pb toward the chamfered portion 952b. different. Therefore, description of the same configuration as that of the electronic component supply apparatus 902a will be omitted as much as possible, and only the guide part 955b will be described in detail. In this electronic component supply device 902b, since the length dimension X of the electronic component Pb is not sufficiently large with respect to the conveying width of the spiral conveying path 933b, the lead wire 973b of the electronic component Pb in the lateral posture faces the electronic component in the conveying direction. Pb (see electronic component Pb5 in FIG. 143B ) enters the delivery portion 941 b without falling off.

Since the electronic component Pb conveyed in this direction is conveyed in a horizontal posture, it passes below the strip-shaped guide part 951b. In addition, also in the conveyance path 942b narrowed by the chamfered portion 952b, since the center of gravity of the electronic component Pb is located on the conveyance path 942b, it is difficult for the electronic component Pb to fall off from the chamfered portion 952b. Therefore, the sending part 941b guides the electronic component Pb toward the chamfered part 952b by the guide part 955b, and thereby separates the electronic component Pb whose lead wire 973b faces the conveyance direction among the components in the horizontal position from the conveyance path 933b.

The guide part 955b is attached to the protection part 56b fixed to the outer wall part 945b, and is formed in arch shape in cross-sectional view. The guide portion 955b is provided so as to straddle the transport path 942b from the outer wall portion 945b side toward the inside of the storage bowl 931b, and the front end portion toward the inside of the storage bowl 931b is located above the chamfered portion 952b. The tip portion of the guide portion 951b is formed in a wedge shape so that the electronic component Pb can be guided to the chamfered portion 952b. In this case, the front end portion of the guide portion 951b is formed so as to avoid the lead wire 973b directed toward the inside of the storage bowl 931b with respect to the electronic component Pb conveyed in the basic posture, and to avoid the lead wire 973b directed toward the inside of the storage bowl 931b, and to avoid the electronic component conveyed in a posture other than the basic posture. Pb is in contact with the component main body 971b (see FIG. 144 ). In this way, the electronic components Pb passing through the screening unit 943b are conveyed toward the guide rail 904b in a uniform posture.

143A and 143B, the case of screening parts by the screening unit will be described. FIG. 143A and FIG. 143B are diagrams each showing a situation in which parts are sorted by the sorting unit according to this embodiment. In addition, FIG. 143A shows the case of sorting out large parts, and FIG. 143B shows the case of sorting out small parts.

As shown in FIG. 143A, in the electronic component supply apparatus 902a, a large electronic component Pa is conveyed in various postures from the spiral conveyance path 933a of the storage bowl 931a. Here, the frontmost electronic component Pa1 is transported in a vertical posture, the second electronic component Pa2 is transported in a horizontal basic posture, the third electronic component Pa3 is transported in a reverse posture of the basic posture, and the fourth electronic component Pa4 is transported in an upright posture. delivery. When the vertical electronic component Pa1 enters the delivery portion 941a, the lead wire 973a of the vertical electronic component Pa1 is guided by the strip-shaped guide portion 951a and returns to the storage bowl 931a. Then, when the electronic component Pa2 in the basic posture enters the delivery portion 941a, the lead wire 973a and the width dimension Y that fall down in the horizontal direction pass below the strip-shaped guide portion 951a toward the component body 971a in the vertical direction. At this time, since the lead wire 973a of the electronic component Pa2 faces the inside of the storage bowl 931a, and the center of gravity of the electronic component Pa2 is biased toward the outer wall portion 945a side, the electronic component Pa2 will not fall off into the storage bowl 931a through the chamfered portion 952a.

Then, when the electronic component Pa3 in the reverse posture enters the sending part 941a, the lead wire 973a and the width dimension Y which fall down in the horizontal direction pass below the strip-shaped guide part 951a toward the component main body 971a in the vertical direction. At this time, since the lead wire 973a of the electronic component Pa3 faces the outer wall portion 945a side, and the center of gravity of the electronic component Pa3 is biased toward the chamfered portion 952a side, the electronic component Pa3 falls off the transport path 942a and returns to the storage bowl 931a. Then, when the upright electronic component Pa4 enters the delivery portion 941a, the component main body 971a whose length X is vertically erected is guided by the strip-shaped guide portion 951a, and returns to the storage bowl 931a. As mentioned above, only the electronic component Pa2 of a basic posture is conveyed to the drop part 944a.

As shown in FIG. 143B, in the electronic component supply apparatus 902b, the small electronic components Pb are conveyed in various postures from the spiral conveyance path 933b of the storage bowl 931b. Here, the leading electronic component Pb1 is transported in a vertical posture, the second electronic component Pb2 is transported in a horizontal basic posture, the third electronic component Pb3 is transported in a reverse posture of the basic posture, and the fourth electronic component Pb4 is transported in an upright posture. In posture conveyance, the fifth electronic component Pb5 is conveyed in an orthogonal posture rotated 90 degrees in the horizontal direction with respect to the basic posture. When the electronic component Pb1 in the vertical position enters the delivery portion 941b, the lead wire 973b of the electronic component Pb1 facing the vertical direction is guided by the strip-shaped guide portion 951b and returns to the storage bowl 931b.

Then, when the electronic component Pb2 in the basic posture enters the sending part 941b, the lead wire 973b and the width dimension Y which fall down in the horizontal direction pass below the strip-shaped guide part 951b toward the component main body 971b in the vertical direction. At this time, since the lead wire 973b of the electronic component Pb2 faces the inside of the housing bowl 931b, the center of gravity of the electronic component Pb2 is close to the outer wall portion 945b side, and the electronic component Pb2 is not in contact with the arched guide portion 955b, so the electronic component Pb2 does not pass through the chamfer. The portion 952b falls off into the housing bowl 931b (see FIG. 144A and FIG. 144B ). Then, when the electronic component Pb3 in the reverse posture enters the sending part 941b, the lead wire 973b and the width dimension Y that fall down in the horizontal direction are directed toward the component main body 971 in the vertical direction, and also pass under the strip-shaped guide part 951b. At this time, the electronic component Pb3 is guided toward the chamfered portion 952b by the front end portion of the arch-shaped guide portion 955b, falls off the transport path 942b, and returns to the storage bowl 931b.

Then, when the electronic component Pb4 in the upright position enters the delivery portion 941b, the component main body 971b whose length X is vertically erected is guided by the guide portion 951b and returns to the storage bowl 931b. Then, when the electronic component Pb5 in the orthogonal posture enters the delivery portion 941b, the lead wire 973b and the width dimension Y that fall down in the horizontal direction pass below the guide portion 951b toward the component body 971b in the vertical direction. At this time, the electronic component Pb5 is guided toward the chamfered portion 952b by the tip of the arched guide portion 955b, falls off the transport path 942b, and returns to the storage bowl 931b (see FIGS. 144C and 144D ). As mentioned above, also when conveying a small electronic component Pb, only the electronic component Pb2 of a basic posture is conveyed to the drop part 944b.

Referring to FIG. 144 , a case where a small component is guided by an arcuate guide portion will be described. FIG. 144 is a diagram showing how a component is guided by the arched guide portion according to the present embodiment. In addition, FIGS. 144A and 144B show the case of transporting parts in the basic posture, and FIGS. 144C and 144D show the case in which parts in the orthogonal posture are transported.

As shown in FIGS. 144A and 144B , for the electronic component Pb transported in the basic posture, the lead wire 973b faces the inside of the housing bowl 931b, and a space is formed near the root of the lead wire 973b that is offset from the front end of the guide portion 955b. Therefore, even if the electronic component Pb in the basic posture is transported on the transport path 942b, the guide portion 955b does not come into contact with the electronic component Pb. On the other hand, as shown in FIG. 144C and FIG. 144D , for the electronic component Pb transported in a perpendicular posture, the lead wire 973b faces forward in the transport direction, and there is no space deviated from the leading end portion of the guide portion 955b. Therefore, when the electronic component Pb in a perpendicular posture is transported on the transport path 942b, the electronic component Pb is guided toward the chamfered portion 952b by the front end portion of the guide portion 955b, and falls out into the storage bowl 931b. With such a structure, the arched guide portion 955b can pass only the electronic component Pb in the basic posture.

Referring to FIG. 145A to FIG. 145C , the case of using the drop part to transform the posture of the component will be described. FIG. 145A to FIG. 145C are diagrams showing how the posture of a component is transformed by using the dropping portion according to this embodiment. In addition, FIG. 145A shows a case of performing posture transformation on a large component, FIG. 145B shows a situation of performing posture transformation on a large component using a drop portion of a comparative example, and FIG. 145C shows a situation of performing posture transformation on a small component.

As shown in FIG. 145A, the drop portion 944a is formed by narrowing the conveyance path 942a by using the recessed portion 954a. The concave portion 954a is formed by a pair of slopes 961a and 963a facing the conveying width direction so that the width becomes narrower downward. When the electronic component Pa is conveyed on the conveyance path 942a narrowed by the concave portion 954a, the electronic component Pa rolls in the direction of the arrow using the corner portion 962a between the conveyance path 942a and the inclined surface 961a as a fulcrum. At this time, the inclined surface 963a functions as a guide surface for guiding the tip of the lead wire 973a to the bottom surface 964a, so that the electronic component Pa can be rolled smoothly. With such a configuration, the posture of the electronic component Pa in the horizontal posture is changed to the vertical posture in which the leads 973 a face downward.

In addition, as shown in FIG. 145B , in the drop portion 944c according to the comparative example, the guide rail 904c is provided directly below. Therefore, when the electronic component Pa rolls, a phenomenon occurs in which the front end of the lead wire 973a is caught at the boundary portion between the slope 963c and the guide rail 904c. Therefore, in the drop portion 944a according to this embodiment, when the electronic component Pa rolls, the tip of the lead wire 973a is guided along the inclined surface 963a, and after the attitude change of the electronic component Pa is reliably completed, it is sent out to the rail 904a. Thereby, the electronic component Pa can be continuously sent out to the guide rail 904a without being jammed in the recessed portion 954a.

In addition, as shown in FIG. 145C , the lead wires 973b of the small electronic component Pb are formed in a row in the horizontal direction, and the posture is changed in the same manner as in the large electronic component Pb. In addition, in this embodiment, although the guide surface which guides the front-end|tip of lead wire 973a, 973b is comprised by the inclined surface 963a, 963b, it is not limited to this structure. The guide surface only needs to be able to guide the tips of the lead wires 973a and 973b, and may be, for example, a curved surface.

With the above configuration, the electronic component P is conveyed from the electronic component supply device 902 to the holding position with an appropriate posture. In this case, the electronic component P is transported to the holding position with the longitudinal dimension X facing the transport direction and the lead wire 973 facing downward. Therefore, the electronic component mounting apparatus discriminates the orientation of the electronic component P as described above, and mounts the electronic component P on the substrate W after returning to an appropriate orientation for the electronic component P transported upside down. Next, the orientation determination processing of the electronic component P in the electronic component mounting apparatus will be described.

The mounting head 15 takes out the electronic component P supplied from the electronic component supply apparatus 902 using the suction nozzle 32, and corrects the amount of misalignment by SWEEP measurement. The SWEEP measurement refers to a measurement method of irradiating laser light from the side to the component body 971 while rotating the electronic component P adsorbed by the suction nozzle 32 . In addition, by detecting the shadow of the component main body 971 with the CCD linear sensor, the displacement amount (XYθ) of the position and orientation of the electronic component P with respect to the suction nozzle 32 is calculated. According to the amount of deviation, the amount of deviation is corrected by the rotation of the θ motor of the suction nozzle 32 and the XY moving mechanism 16 or the like.

When the mounting head 15 performs position correction by SWEEP measurement, the irradiation height of the laser beam is aligned with the lead 973 of the electronic component P. FIG. Then, laser light is irradiated to the lead wire 973 of the electronic component P, and the front-back direction of the electronic component P is discriminated by ONCE measurement. The ONCE measurement refers to a measurement method of irradiating laser light on the lead wire 973 of the electronic component P adsorbed by the suction nozzle 32 to obtain the left inner coordinate (left end coordinate) and the right inner coordinate (right end coordinate) of the shadow of the lead wire 973 . The mounting head 15 discriminates the reversed state based on how asymmetric the shadow generated by the lead wire 973 is based on the threshold value α set as the reference coordinate.

Here, the direction discrimination process using ONCE measurement will be described in detail with reference to FIGS. 146A to 146C. 146A to 146C are diagrams each showing an example of ONCE measurement of a large component according to this embodiment. 147A and 147B are diagrams each showing an example of ONCE measurement of a small component according to this embodiment. In addition, in the following description, it is assumed that the component orientation during normal supply is set to 90 degrees, and the component orientation during reverse supply is set to 270 degrees for the control unit of the mounting device. In addition, in FIG. 146 and FIG. 147 , the coordinate axes are set to increase from the left side to the right side. In addition, in the following description, the ONCE measurement is used to perform the direction discrimination process, but the SWEEP measurement may be used to perform the direction discrimination process.

As shown in FIG. 146A , a large-sized electronic component Pa is arranged such that a plurality of leads 973 a are arranged in two rows along the longitudinal direction (X-axis direction). Therefore, even if laser light is irradiated from the direction in which the wires 973a are arranged, the shadows generated by the wires 973a are symmetrical with respect to the threshold value α as a reference coordinate, and it is impossible to distinguish whether the wires are being transported normally at 90 degrees or reversed at 270 degrees. Therefore, for example, as shown in FIG. 146B and FIG. 146C , by setting the direction discrimination angle to 945 degrees, the shadow generated by the lead wire 973 a becomes asymmetrical with respect to the threshold value α during normal supply and reverse supply.

As shown in FIG. 146B and FIG. 146C , by irradiating the lead wire 973 a with laser light, the coordinates of the left inner side and the right inner side of the shadow formed by the lead wire 973 a are obtained. Then, the center coordinate between the left inner coordinate and the right inner coordinate is calculated, and the orientation of the electronic component Pa is determined according to which side the center coordinate is located on the left or right with respect to the threshold value α. In the case of the orientation shown in FIG. 146B, the center coordinate Ac of the left inner coordinate Al and the right inner coordinate Ar of the shadow is located on the left side compared with the threshold value α, and the value of the center coordinate Ac is set to be greater than the threshold value α. lower. On the other hand, in the case of the orientation shown in FIG. 146C , the center coordinate Bc of the left inner coordinate Bl and the right inner coordinate Br of the shadow is located on the right side compared with the threshold value α, and the value of the center coordinate Bc is equal to the threshold value α. higher than the setting. In addition, for example, when the orientation shown in FIG. 146B indicates normal supply, the electronic component Pa shown in FIG. 146C is rotated by 180 degrees and adjusted to an appropriate orientation.

In addition, the threshold value α is a coordinate stored in advance in the control device 20 , and satisfies the requirement of α=(Ac+Bc)/2, for example. In addition, in this embodiment, in addition to the above-described direction determination processing, it is also determined whether or not the lead wire 973a is properly arranged with respect to the component main body 971a. For example, when the center coordinates Ac and Bc exist within a predetermined error range around the threshold value α, the electronic component Pa is determined to be a defective product and discarded. Thereby, for example, a defective product in which the lead wire 973a is bent can be removed from the production line. In addition, the error range is threshold value α±error judgment value β, which satisfies, for example, the requirement of error judgment value β=(Ac−α)/2.

As shown in FIG. 147 , the small electronic component Pb is arranged such that a plurality of leads 973b are arranged in a row along the longitudinal direction (X-axis direction). In this case, if laser light is irradiated from the direction in which the lead wires 973b are arranged, the shadows generated by the lead wires 973b will be asymmetrical with respect to the threshold value α during normal supply and reverse supply. Orientation of normal conveying, or reverse conveying in the direction of 270 degrees. Therefore, the direction discrimination angle is set to 0 degrees. In the case of the orientation shown in FIG. 147A , the center coordinate Ac of the left inner coordinate Al and the right inner coordinate Ar of the shadow is located on the left side compared with the threshold value α, and the value of the center coordinate Ac is set to be greater than the threshold value α. lower. On the other hand, in the case of the orientation shown in FIG. 147B , the center coordinate Bc of the left inner coordinate Bl and the right inner coordinate Br of the shadow is located on the right side compared with the threshold value α, and the value of the center coordinate Bc is equal to the threshold value α. higher than the setting. In addition, for example, when the orientation shown in FIG. 147A indicates normal supply, the electronic component Pb shown in FIG. 147B is rotated by 180 degrees and adjusted to an appropriate orientation.

In addition, the threshold value α is a coordinate stored in advance in the control unit 18 similarly to the direction determination process of the large electronic component Pa, and satisfies the requirement of α=(Ac+Bc)/2, for example. In addition, in the case of an electronic component Pb in which the leads 973b are in a row, the center coordinates of the shadows of the leads 973b may not be calculated, and direction determination may be performed using only the left inner coordinates or the right inner coordinates. In addition, in this embodiment, in addition to the above-described direction determination processing, it is determined whether or not the lead wire 973b is properly arranged with respect to the component main body 971b. For example, when the center coordinates Ac and Bc exist within a predetermined error range around the threshold value α, the electronic component Pb is determined to be a defective product and discarded. Thereby, the defective product with the lead wire 973b bent can be removed from the production line. In addition, the error range is threshold value α±error determination value β, which satisfies, for example, the requirement of error determination value β=(Ac−α)/2.

The direction determination processing described in this embodiment is merely an example, and is not limited to this configuration. The direction determination process may be configured to determine the inversion of the component using the coordinates of the shadow of the lead wire, and the threshold value α, the method of the direction determination process, the irradiation position of the laser light, and the like may be appropriately changed. In addition, the error determination process may be configured to determine whether the lead wire is properly arranged with respect to the component body using the coordinates of the shadow of the lead wire, and the error range, the method of the error determination process, and the like may be appropriately changed.

Referring to Fig. 148, the flow of direction discrimination processing will be described. FIG. 148 is a flowchart of direction determination processing according to this embodiment. In addition, although the flow of the direction determination process of a large component is demonstrated here, the flow of the direction determination process of a small component is also the same. In addition, it is assumed that presence or absence of direction discrimination, a discrimination method, a threshold value, an error determination value, a direction discrimination height, and a direction discrimination angle are set in advance in the control unit of the mounting device.

148 , after the electronic component Pa is transported to the electronic component supply device 902a, the electronic component Pa is taken out from the guide rail 904 by the suction nozzle 32 of the mounting head 15, and the electronic component Pa is transported toward the mounting position on the substrate W. In conveyance of this electronic component Pa, each process of step S681 to step S689 is implemented. First, in the electronic component mounting apparatus, as step S681, when the conveyance of the electronic component Pa starts, the electronic component Pa is subjected to the SWEEP process. In the SWEEP process, the height position of the component main body 971a is aligned with the laser light source and the CCD line sensor, and the component main body 971a is irradiated with laser light while the component main body 971a is rotated. Then, based on the shadow of the component main body 971a, the displacement amount of the position and orientation of the electronic component Pa with respect to the suction nozzle 32 is calculated, and the displacement amount is corrected.

Then, in the electronic component mounting apparatus, as step S682, the laser light source and the CCD line sensor are aligned with the direction discrimination height, that is, the height of the lead wire 973a of the electronic component Pa. Then, in the electronic component mounting apparatus, as step S683, ONCE processing is performed on the electronic component Pa for which the lead 973a is positioned at the direction discrimination height. In the ONCE process, the orientation of the electronic component Pa is made to coincide with the direction discrimination angle, and laser light is irradiated to the lead 973a of the electronic component Pa that coincides with the direction discrimination angle. Then, the coordinates of the left inner side and the right inner side of the shadow of the lead wire 973a are obtained, and the center coordinates of the shadow of the lead wire 973a are calculated. After acquiring the coordinates of the left inner side and the right inner side of the shadow of the lead wire 973a, the orientation of the electronic component Pa is returned to the original angle from the direction discrimination angle.

Then, in the electronic component mounting apparatus, as step S684, it is determined whether or not the center coordinates are within the error range defined by the error determination value. When the electronic component mounting apparatus determines in step S684 that the center coordinates are within the error range (YES), in step S685 , it considers that the lead wire 973 a is bent or the like, and discards the electronic component Pa. On the other hand, when the electronic component mounting apparatus determines in step S684 that the center coordinates are outside the error range (No), as step S686, the center coordinates are compared with the value of the threshold α, and the orientation of the electronic component Pa is 90°. It is judged whether the orientation of 270 degrees or the orientation of 270 degrees.

When the electronic component mounting apparatus determines in step S686 that the orientation of the electronic component Pa during normal supply is set to 90 degrees (90°), it determines in step S687 whether the center coordinate is smaller than the threshold value α. When the electronic component mounting apparatus determines in step S687 that the center coordinate is smaller than the threshold value α (Yes), the electronic component Pa is supplied from the electronic component supply apparatus 902a to the holding position in the normal orientation (90 degrees), and in step S690, Insertion into the substrate W is performed. On the other hand, when the electronic component mounting apparatus determines in step S687 that the center coordinates are greater than or equal to the threshold value α (No), the electronic component supply apparatus 902a supplies the mounting apparatus 1 with the inverted orientation (270 degrees). As for the electronic component Pa, as step S689, the orientation of the electronic component Pa is reversed so as to match the normal orientation. In the electronic component mounting apparatus, an insertion operation of inserting the electronic component Pa in the normal orientation into the substrate W is performed as step S690.

When the electronic component mounting apparatus determines in step S686 that the orientation of the electronic component Pa during normal supply is set to 270 degrees (270°), it determines in step S688 whether the center coordinate is larger than the threshold value α. When the electronic component mounting apparatus determines in step S688 that the center coordinate is larger than the threshold value α (Yes), the electronic component Pa is supplied from the electronic component supply apparatus 902 a to the holding position in the normal orientation (270 degrees), and as step S690 , Insertion into the substrate W is performed. On the other hand, when the electronic component mounting apparatus determines in step S688 that the center coordinates are smaller than or equal to the threshold value α (No), electrons are supplied from the electronic component supply apparatus 902 a to the holding position in the reversed direction (90 degrees). As for the component Pa, as step S689, the orientation of the electronic component Pa is reversed so as to match the normal orientation. In the electronic component mounting apparatus, an insertion operation of inserting the electronic component Pa in the normal orientation into the substrate W is performed as step S690.

As described above, by controlling not only the transport posture of the electronic component Pa from the electronic component supply device 902a to be consistent, but also the front and rear orientation of the electronic component Pa in the transport direction to be consistent with the normal orientation, it is possible to reliably prevent electronic components from being transported. Wrong mounting of the component Pa on the substrate W. In addition, during the conveyance of the electronic component Pa by the mounting head 15 , the electronic component Pa can be efficiently mounted on the substrate W by performing rotational correction of the front-back orientation of the electronic component Pa. In addition, in step S686, the electronic component mounting apparatus may set, for example, the normal supply orientation of the large electronic component Pa to 90 degrees, and the normal supply orientation of the small electronic component Pb to 270 degrees.

In the present embodiment, the orientation determination process is performed on components with leads, but the orientation determination process may be performed on components without leads. Referring to FIGS. 149A to 149C , the direction discrimination process using ONCE measurement for a leadless component will be described. 149A to 149C are diagrams showing an example of ONCE measurement for leadless components according to this embodiment. In addition, in the following description, the orientation of the component during normal supply is set to 90 degrees, and the orientation of the component during reversed supply is set to 270 degrees for the control unit of the mounting apparatus. In addition, in FIG. 149 , the coordinate axes are set to increase in size from the left side to the right side.

As shown in FIG. 149A , the electronic component Pc has one corner of a rectangle cut off in plan view to form a slope 977c inclined at approximately 45 degrees. Therefore, by rotating the electronic component Pc by 45 degrees and irradiating laser light parallel to the inclined surface 977c, the shadow generated by the electronic component Pc is made asymmetrical around the threshold value α during normal supply and reverse supply. As shown in FIG. 149B and FIG. 149C , by irradiation with laser light, the coordinates of the left inner side and the right inner side of the shadow formed by the electronic component Pc are obtained. Then, the center coordinates of the left inner coordinates and the right inner coordinates are calculated, and the orientation of the electronic component Pc is determined based on which side the center coordinates are on the left or right with respect to the threshold value α.

In the case of the orientation shown in FIG. 149B , the center coordinate Ac of the left inner coordinate Al and the right inner coordinate Ar of the shadow is located on the right side compared with the threshold value α, and the value of the center coordinate Ac is set to be greater than the threshold value α. higher. On the other hand, in the case of the orientation shown in FIG. 149C , the center coordinate Bc of the left inner coordinates Bl and right inner coordinates Br of the shadow is on the left side of the threshold α, and the value of the center coordinate Bc is equal to the threshold α. than set lower. And, for example, when the orientation shown in FIG. 149B indicates normal supply, the electronic component P shown in FIG. 149C is rotated by 180 degrees and adjusted to an appropriate orientation.

In addition, the threshold value α is a coordinate stored in advance in the control device 20 , and satisfies the requirement of α=(Ac+Bc)/2, for example. In addition, in this embodiment, in addition to the above-mentioned direction determination processing, it is also determined whether the dimensional error of the electronic component Pc is within an appropriate range. For example, when the center coordinates Ac and Bc exist within a predetermined error range around the threshold value α, the electronic component Pc is determined to be a defective product and discarded. As a result, defective products with large dimensional errors can be removed from the production line. In addition, the error range is threshold value α±error judgment value β, which satisfies, for example, the requirement of error judgment value β=(Ac−α)/2.

In the case of this electronic component P, the orientation determination process is implemented in substantially the same flow as that of the component with leads, but in the flow chart shown in FIG. 148 , the process of adjusting the orientation determination height (step S682). As described above, in the electronic component mounting apparatus according to this embodiment, even if it is an electronic component Pc without leads, as long as it is measured at ONCE, the shadow formed by the electronic component Pc during normal supply and reverse supply If there is a difference, direction discrimination processing can be performed.

As described above, according to the electronic component supply apparatus 902 according to the present embodiment, even if the electronic component P is an electronic component such as an odd-shaped component or a connector, the screening unit 943 sorts out only the electronic component P in a predetermined posture, and uses The dropping portion 944 is changed to a posture that can be taken out by the loading head 15 . Therefore, since the electronic component P is supplied to the holding position with the lead wires 973 facing downward, it is not necessary to change the posture of the electronic component P on the side of the mounting head 15, and the electronic component can be mounted on the substrate W placed horizontally. The electronic component P is supplied with an appropriate posture at the holding position where the mounting head 15 of P holds.

The electronic component supply apparatus which is a bowl type feeder is not limited to the said embodiment. For example, in the above-described embodiment, the components are sorted by the strip-shaped guide portion and the chamfered portion, but the configuration is not limited to this configuration. The screening unit may be configured as long as it allows only components of a predetermined posture to pass through. Moreover, although the screening part is comprised so that only the components of a horizontal posture may pass, it may be comprised so that only the components of a vertical posture may pass.

In addition, in the above-described embodiment, the component is supplied to the mounting device in a vertical posture with the leads directed downward by the screening unit and the dropping unit, but the configuration is not limited to this configuration. As long as the mounting suction nozzle corresponds to the lateral member whose leads are oriented sideways, the component may be supplied to the mounting device in a state of a lateral posture.

In addition, in the above-described embodiment, the component supply device is configured to supply electronic components with leads (lead-type electronic components) to the holding positions, but the configuration is not limited to this configuration. The component supply device can also use the sorting unit and the dropping unit to unify the components without leads (mountable electronic components) in an appropriate posture, and supply them to the mounting device.

In addition, in the above-mentioned embodiment, the belt-shaped plate material is extended so as to cross the upper side of the conveyance path as the first guide portion, but the configuration is not limited to this configuration. The first guide portion may have any structure as long as it allows only components with a predetermined posture to pass therethrough.

In addition, in the above-mentioned embodiment, as the second guide portion, the arc-shaped plate material is disposed so as to straddle the transport path, but the configuration is not limited to this configuration. What is necessary is just to be a structure which a 2nd guide part abuts on the member other than a basic posture, and makes it fall from a conveyance path.

In addition, in the above-described embodiment, the conveying width of the conveying path is narrowed by the chamfered portion as the narrowed-width portion, but the present invention is not limited to this configuration. The reduced-width portion may be configured as long as it reduces the conveying width of the conveying path, for example, the conveying width may be reduced by notching.

In addition, in the above-mentioned embodiment, the electronic component is mounted on the board, but it is not limited to this structure. A configuration may also be adopted in which electronic components are mounted on a base material other than the substrate.

Moreover, in the said embodiment, although the bowl type feeder was illustrated and demonstrated as an electronic component supply apparatus, it is not limited to this structure. For example, a sorting unit, a dropping unit, direction discrimination processing, and the like can be applied to a bulk feeder and the like.

In addition, in the above-mentioned embodiment, it is configured to perform direction discrimination processing using ONCE measurement, but it is not limited to this configuration. What is necessary is just to be able to discriminate|determine the back-and-forth inversion in the conveyance direction of a component, For example, you may perform direction discrimination processing using SWEEP measurement.

Next, another example of the electronic component mounting apparatus will be described using FIGS. 150 to 160 . FIG. 150 is a schematic diagram showing a schematic configuration of an electronic component mounting device. Fig. 151 is a perspective view showing a schematic configuration of the electronic component mounting device. In addition, the electronic component mounting apparatus 10a shown in FIG. 150 to FIG. 160 is the same as the electronic component mounting apparatus 10 except some structures, such as the number of mounting heads.

The electronic component mounting apparatus 10 a shown in FIGS. 150 and 151 is an apparatus for mounting electronic components on a substrate 8 . The electronic component mounting apparatus 10 a has a substrate conveyance unit 12 , component supply units 14 f and 14 r , mounting heads 15 f and 15 r , and an XY moving mechanism 16 . The XY moving mechanism 16 has X-axis drive units 22 f and 22 r and a Y-axis drive unit 24 . Here, the electronic component mounting apparatus 10a of this embodiment has component supply units 14f, 14r, mounting heads 15f, 15r, and X-axis drive parts 22f, 22r, as shown in FIG. 150 . As described above, in the electronic component mounting apparatus 10a, a part of the structure has two sets. However, in FIG. icon. In the electronic component mounting apparatus 10a, the component supply unit 14f, the mounting head 15f, and the X-axis drive unit 22f form a single module disposed on the front side of the electronic component mounting apparatus 10a, and the component supply unit 14r, the mounting head 15r, and the X-axis drive The part 22r becomes one module arrange|positioned at the rear side of the electronic component mounting apparatus 10a. In addition, hereinafter, when the two component supply units 14f and 14r are not particularly distinguished, they are referred to as the component supply unit 14, and when the two mounting heads 15f and 15r are not particularly distinguished, they are referred to as the mounting head 15a. When the two X-axis drive units 22f and 22r are not particularly distinguished, they are referred to as the X-axis drive unit 22a. Here, the substrate conveyance unit 12 and the component supply units 14 f and 14 r have the same configuration as that of the electronic component mounting apparatus 10 . Component supply units 14 f and 14 r include electronic component mounting apparatus 100 for supplying lead type electronic components, bowl feeder unit 90 , electronic component mounting apparatus 100 a for supplying mountable electronic components, and the like.

The mounting head 15a is to adsorb the electronic components held on the component supply unit 14, that is, the radial lead type electronic components held on the component supply device 100 or the chip electronic components held on the component supply device 100a, and the adsorbed The electronic components are mounted on the substrate 8 moved to a predetermined position by the substrate transport unit 12 . In addition, the structure of the mounting head 15 will be described later.

The XY moving mechanism 16 is a moving mechanism that moves the mounting heads 15f and 15r in the X-axis direction and the Y-axis direction in FIG. drive part 24. The X-axis driving unit 22f is connected to the mounting head 15f, and moves the mounting head 15f in the X-axis direction. The X-axis driving unit 22r is connected to the mounting head 15r, and moves the mounting head 15r in the X-axis direction. The Y-axis driving unit 24 is connected to the mounting head 15 via the X-axis driving unit 22. By moving the X-axis driving unit 22f in the Y-axis direction, the mounting head 15f is moved in the Y-axis direction. By moving the X-axis driving unit 22r in the Y-axis direction, The mounting head 15r moves in the Y-axis direction by moving in the Y-axis direction. The XY moving mechanism 16 can move the mounting head 15f to a position facing the substrate 8 or to a position facing the component supply unit 14f by moving the mounting head 15f in the XY axis direction. The XY moving mechanism 16 can move the mounting head 15r to a position facing the substrate 8 or to a position facing the component supply unit 14r by moving the mounting head 15r in the XY axis direction. In addition, the XY moving mechanism 16 adjusts the relative position between the mounting head 15 and the substrate 8 by moving the mounting head 15 . Thereby, the electronic component held by the mounting head 15 can be moved to an arbitrary position on the surface of the substrate 8 , and the electronic component can be mounted on an arbitrary position on the surface of the substrate 8 . In addition, various mechanisms for moving the mounting head 15 in a predetermined direction can be used as the X-axis drive unit 22 . Various mechanisms for moving the X-axis drive unit 22 in a predetermined direction can be used as the Y-axis drive unit 24 . As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack and pinion, a conveyance mechanism using a ball screw, a conveyance mechanism using a conveyor belt, or the like can be used.

The electronic component mounting apparatus 10a can alternately mount electronic components on one board|substrate by having two mounting heads 15f and 15r. As described above, by alternately mounting electronic components with the two mounting heads 15, while one mounting head is mounting the electronic components on the substrate, the other mounting head can attract the electronic components on the component supply device. Thereby, the time during which electronic components are not mounted on the substrate 8 can be further shortened, and the electronic components can be mounted efficiently.

Next, the configuration of the mounting head 15 will be described using FIGS. 152 and 153 . FIG. 152 is a schematic diagram showing a schematic configuration of a mounting head of the electronic component mounting apparatus. Fig. 153 is a perspective view showing a schematic configuration of a mounting head of the electronic component mounting apparatus. In addition, in FIG. 152, various control parts which control the electronic component mounting apparatus 10a and one component supply apparatus 100 of the component supply unit 14 are shown together. As shown in FIGS. 152 and 153, the mounting head 15 has a mounting head main body 30, a laser recognition device 38, an imaging device 36a, and a height sensor 37a. As shown in FIG. 152 , the electronic component mounting apparatus 10 a has a control unit 60 , a storage unit 61 , a mounting head control unit 62 , and a component supply control unit 64 . In addition, the electronic component mounting apparatus 10a is connected to a power supply, and supplies electric power supplied from the power supply to each part using the control unit 60, storage unit 61, mounting head control unit 62, component supply control unit 64, and various circuits. The control unit 60 , the storage unit 61 , the mounting head control unit 62 , and the component supply control unit 64 will be described later. The electronic component supply apparatus 100 exposes the electronic component 80 held by the electronic component holding tape as mentioned above.

The mounting head main body 30 has a mounting head support body 31 supporting each part, a plurality of suction nozzles 32 , and a suction nozzle drive unit 34 . In the mounting head main body 30 of this embodiment, as shown in FIG. 153 , six suction nozzles 32 are arranged in a row. Six suction nozzles 32 are arranged in a direction parallel to the X axis. The mounting head support body 31 is a support member connected to the X-axis drive unit 22 and supports the suction nozzle 32 and the suction nozzle drive unit 34 . In addition, the mounting head support body 31 also supports the imaging device 36 a, the height sensor 37 a, and the laser recognition device 38 . In addition, the mounting head main body 30 and the laser recognition device 38 have the same structure as each part of the mounting head 15 mentioned above.

The imaging device 36 a is fixed on the head support body 31 of the head body 30 , and takes an image of an area facing the head 15 , such as the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. Next, the configuration of the imaging device 36a will be described using FIGS. 154A and 154B. Here, FIG. 154A is a cross-sectional view showing a schematic configuration of an imaging device of the electronic component mounting device. 154B is a perspective view showing a schematic configuration of an imaging device of the electronic component mounting device. As shown in FIGS. 154A and 154B , the imaging device 36 a has a housing 51 , a camera body 52 , a lens 54 , a vertical lighting unit 56 , an angle lighting unit 58 , and an outer contour lighting unit 59 . The frame body 51 is a supporting member that supports each of the camera body 52 , the lens 54 , the vertical lighting unit 56 , the angle lighting unit 58 , and the outline lighting unit 59 , and is fixed to the mounting head support body 31 . The camera body 52 has an imaging element, and is a mechanism for imaging an area facing the mounting head 15 . The camera body 52 sends the acquired image to the control unit 60 . The lens 54 is mounted on the substrate 8 side of the camera body 52 , that is, on the lower side in the vertical direction, and adjusts the focus and magnification of an image incident on the camera body 52 . In addition, as the lens 54 , an optical system that does not have a mechanism for adjusting the focus and magnification of an image incident on the camera body 52 , that is, a fixed optical system may be used. The vertical illuminating unit 56 is disposed on the substrate 8 side of the lens 54 , that is, on the lower side in the vertical direction. The vertical illuminating part 56 illuminates the board|substrate 8 by irradiating light to the board|substrate 8 from a vertical direction. The angle lighting unit 58 is disposed on the side of the substrate 8 of the vertical lighting unit 56 , that is, on the lower side in the vertical direction. The angle lighting unit 58 illuminates the substrate 8 by irradiating light to the substrate 8 from an oblique direction. The outline lighting unit 59 is disposed on the side of the substrate 8 of the angle lighting unit 58 , that is, on the lower side in the vertical direction. The outline illumination unit 59 illuminates the substrate 8 by irradiating light to the substrate 8 so as to surround the periphery of the imaging area of the camera body 52 . In the vertical lighting unit 56 , the angle lighting unit 58 , and the outer contour lighting unit 59 , various lighting devices can be used as lighting devices for emitting light, for example, light-emitting elements such as LEDs can be used. In addition, the vertical lighting section 56 , the angle lighting section 58 , and the outline lighting section 59 have openings between the camera body 52 and the substrate 8 . As a result, the camera body 52 can capture an image of the board 8 without being blocked by the vertical illuminating unit 56 , the angle illuminating unit 58 , and the outer contour illuminating unit 59 .

The imaging device 36 a of the present embodiment has the above-mentioned configuration, and captures images of the BOC mark and the through hole as reference marks formed on the surface of the substrate 8 , which will be described later. Here, in this embodiment, the reference position of the wiring pattern formed on the substrate surface is detected using the BOC mark, but other reference marks may be used. In addition, the imaging device 36a can adjust the light quantity for illuminating the substrate 8 from three directions by adjusting the light quantity of the light output from the vertical lighting unit 56, the angle lighting unit 58, and the outer contour lighting unit 59, and can achieve higher precision. The image of the through-hole formed on the substrate and the image of the BOC mark are accurately obtained. In addition, the control unit 60 detects the through hole by inverting the polarity of the image captured by the imaging device 36 a , that is, inverting black and white, so that the position of the through hole can be detected more accurately. Specifically, since the through hole is a hole, it appears black on the image, so by reversing the polarity, white can appear, and the outline and diameter of the through hole can be detected with higher accuracy.

The height sensor 37 a is fixed to the head support body 31 of the head body 30 , and measures the distance of a region facing the head 15 , for example, to the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. As the height sensor 37a, a laser sensor can be used. This laser sensor has: a light emitting element that emits laser light; Measure the distance to the opposite part. In addition, the height sensor 37a detects the height of the facing part, specifically, the electronic component, by processing the distance from the facing part using its own position and the board position at the time of measurement. In addition, the process for detecting the height of an electronic component may be performed by the control part 60 based on the measurement result of the distance with respect to an electronic component.

Next, the control function of the device configuration of the electronic component mounting device 10a will be described. As shown in FIG. 152 , the electronic component mounting apparatus 10 a has a control unit 60 , a storage unit 61 , a mounting head control unit 62 , and a component supply control unit 64 as control functions. Each of the various control units is composed of a CPU, ROM, RAM, and other components having arithmetic processing functions and storage functions. In addition, in this embodiment, a plurality of control units are provided for convenience of explanation, but one control unit may be provided. In addition, when the control function of the electronic component mounting apparatus 10a is set as one control part, it may implement|achieve by one arithmetic apparatus, and may implement|achieve it by several arithmetic apparatus. The control unit 60 , the mounting head control unit 62 , and the component supply control unit 64 have the same configurations as those of the electronic component mounting apparatus 10 . In addition, like the electronic component mounting apparatus 10 , the storage unit 61 may be provided independently of the control unit 60 .

The storage unit 61 is connected to the control unit 60 and has a storage function such as ROM and RAM. In addition, the storage unit 61 may be provided integrally with the control unit 60 or may be provided independently. The storage unit 61 stores data acquired by the control unit 60 from each unit and data calculated and calculated by the control unit 60 . The storage unit 61 stores, for example, design drawing data including through-hole coordinate design values, fiducial mark coordinate design values, and electronic component mounting coordinate design values, shapes of various electronic components, adsorption conditions, calibration conditions for adsorption processing, production programs, and the like. In addition, the storage unit 61 may delete unnecessary data under the control of the control unit 60 .

Next, each operation|movement of the electronic component mounting apparatus 10a is demonstrated. In addition, the electronic component mounting apparatus 10 can also perform the same operation|movement about the following control operation|movement. Using FIGS. 155 to 157 , the operation of the electronic component mounting apparatus 10 a to determine the position on the substrate 8 on which the electronic components are mounted will be described. FIG. 155 is an explanatory diagram showing an example of a design drawing of a substrate on which electronic components are mounted. Fig. 156 is a flowchart showing an example of the operation of the electronic component mounting device. Fig. 157 is an explanatory diagram for explaining the operation of the electronic component mounting device.

The electronic component mounting apparatus 10 a stores information on a design drawing 970 as shown in FIG. 155 , and based on the information on the design drawing 970 , specifies the position to mount the electronic component 80 on the board 8 . The electronic component mounting apparatus 10a acquires the information of the design drawing 970 via a communication line or from a storage medium, and stores the acquired information in the storage unit 61 . Here, the blueprint 970 includes a plurality of electronic component mounting regions 980 . The electronic component mounting area 980 is design value information of electronic component mounting coordinates on the substrate, that is, electronic component mounting coordinate design values. The plurality of electronic component mounting regions 980 included in the blueprint 970 have different sizes and shapes depending on the type of electronic components to be mounted. In addition, the electronic component mounting area 980 includes design value information of via hole formation coordinates 982 a , 982 b , 982 c , 984 a , 984 b , 986 a , 986 b , and 986 c corresponding to positions where leads of electronic components to be mounted are inserted, that is, via hole coordinate design information. value. Here, the via hole forming position 982a, the via hole forming position 982b, and the via hole forming position 982c are via holes adjacent to each other. The via hole forming position 986a, the via hole forming position 986b, and the via hole forming position 986c are also via holes adjacent to each other. Another through hole is arranged between the through hole forming position 984a and the through hole forming position 984b. In addition, in FIG. 155 , symbols are attached to some via hole formation positions in the electronic component mounting region 980 , but if via holes also exist in other electronic component mounting regions 980 , the via hole formation positions are provided. In addition, in FIG. 155 , only the electronic component mounting area 980 corresponding to the electronic component with leads is shown, but in the design drawing 970, electronic components without leads are mounted as types of electronic components, that is, , the information of the electronic component mounting area corresponding to the position of the surface-mounted electronic component. In addition, the design drawing 970 also includes coordinate design value information of the BOC mark 990 which is a reference mark of a mounting position of a surface-mounted electronic component, that is, a reference mark coordinate design value. As described above, the design drawing 970 includes information on electronic component mounting coordinate design values, via hole coordinate design values, and reference mark coordinate design values.

The electronic component mounting apparatus 10a reads and analyzes the information of the design drawing 970 shown in FIG. . Moreover, the electronic component mounting apparatus 10a corrects the acquired design value based on the information of the board|substrate acquired by the imaging device 36a. Next, the correction processing of the loading position will be described using FIG. 156 . In addition, the processing shown in FIG. 156 can be realized by executing the processing of the control unit 60 and controlling the operation of each part.

First, in the control unit 60, as step S712, the design value of the coordinate of the BOC mark is read. That is, in the control unit 60, the information of the design drawing corresponding to the target substrate on which the electronic components are mounted is read out from the storage unit 61, and based on the information of the design drawing, the position where the BOC mark is formed on the substrate, that is, the reference mark coordinate design value information is read out. Then, in the control unit 60, as step S714, the coordinate design values of the through holes are read out. That is, in the control unit 60 , based on the information of the design drawing, the position information of the through-hole formed on the substrate, that is, the through-hole coordinate design value is read out from the storage unit 61 . Here, the control unit 60 reads out at least two or more through-hole coordinate design values to be corrected among the plurality of through-hole coordinate design values. The read coordinates of the through hole, as shown by the three points of the through hole design coordinates 982a, 982b, and 982c and the three points of the through hole design coordinates 986a, 986b, and 986c, will be adjacent to each other in the upper, lower, left, and right sides of any position. The location of the via as an object. That is, a via hole having other via hole design coordinates between them as indicated by the two points of via hole design coordinates 984 a and 984 b is not targeted. In addition, the processing order of step S712 and step S714 may be reversed. Moreover, in the control part 60, the information of the electronic component mounting coordinate design value which is an electronic component mounting area other than a BOC mark coordinate design value and a via hole coordinate design value is read out. That is, the control unit 60 reads out a mounting program for executing processing of mounting electronic components on the substrate 8 , that is, a production program. In addition, the control unit 60 may read a pre-generated loading program, or may generate a production program based on the coordinates of the design drawing 970 . The mounting coordinate data of each part, part angle, size, etc. obtained from the board data are input into the production program. The control unit 60 mounts components on the substrate according to the production program.

After the control unit 60 performs the process of step S714, as step S716, the substrate is carried in. That is, the control part 60 carries and fixes the board|substrate 8 to the position where electronic components can be mounted by the mounting head 15a, ie, a component mounting area.

After the control unit 60 carries in the board in step S716, as step S718, the position of the BOC mark is measured. Specifically, the control unit 60 acquires an image of a position where the BOC mark is expected to exist based on the coordinate design value of the BOC mark read in step S712 and the position of the conveyed substrate 8 using the imaging device 36a. The control part 60 measures the position of the BOC mark on the board|substrate 8, ie, the actual position of a BOC mark, by analyzing the image acquired by the imaging device 36a.

After the control unit 60 measures the position of the BOC mark in step S718, as step S720, it measures the position of the through-hole to be measured. Specifically, the control unit 60 uses the imaging device 36a to obtain an image of the position where the through-hole expected to be measured is located based on the through-hole coordinate design value read in step S712 and the position of the conveyed substrate 8 . The control unit 60 measures the position of the through-hole on the substrate 8 , that is, the actual through-hole position by analyzing the image acquired by the imaging device 36 a. In addition, the electronic component mounting apparatus 10a may measure the coordinates of the through holes by using the height sensor 37a provided on the mounting head. That is, the electronic component mounting apparatus 10a may measure the height of the substrate surface by using the height sensor 37a, and may measure a coordinate whose height is lower than the substrate surface or a coordinate whose height cannot be measured as a coordinate where a through hole is formed. .

After measuring the position of the through hole in step S720, the control unit 60 compares the measurement result with the design value in step S722, calculates the correction amount in step S724, and determines the mounting coordinates based on the correction amount in step S726. Specifically, the control unit 60 calculates a reference mark correction value and a through hole correction value as correction values.

Next, an example of correction will be described using FIG. 157 . In the substrate 8 a shown in FIG. 157 , BOC design coordinates 990 , electronic component design coordinates 992 , electronic component design coordinates 994 , and via hole design coordinates 996 are coordinates of design values. In addition, the BOC design coordinates 990 are provided at three places on the substrate 8a. The electronic component design coordinates 992 are coordinates for surface mounting on the substrate 8 a , that is, positional coordinates for mounting an electronic component without inserting leads into through holes. The electronic component design coordinates 994 are design coordinates for mounting a lead type electronic component in which leads are inserted into through holes formed in the substrate 8 a. On the substrate 8 a , in a region in the vicinity of the electronic component design coordinates 994 , through-hole design coordinates 996 into which lead wires of mounted electronic components are inserted are provided. In addition, in FIG. 157 , one electronic component design coordinate 992 and one electronic component design coordinate 994 are shown respectively, but the electronic component design coordinate 992 and the electronic component design coordinate 994 correspond to the number of mounted electronic components. And set.

The control unit 60 obtains the information of the BOC mark formation position 990a actually formed on the substrate 8a through the imaging device 36a, and calculates the deviation between the BOC mark design coordinate 990 of the design value and the actual BOC mark formation position 990a obtained by measurement. Detection, based on the detection results, calculate the reference mark correction value used to correct the coordinates (x, y, θ) of the electronic component design coordinates 992, based on the calculated reference mark correction value, perform the process shown by the arrow ma in Fig. 157 The BOC mark is corrected to specify the coordinates (x1, y1, θ1) of the electronic component mounting position 992a as mounting coordinates. In addition, the control unit 60 calculates the reference mark correction value for correcting the coordinates (x2, y2, θ2) of the electronic component design coordinates 994, and performs the BOC shown by the arrow mb in FIG. 157 based on the calculated reference mark correction value. Mark correction is performed to specify the coordinates (x3, y3, θ3) of the electronic component mounting position 994a as mounting coordinates.

Here, the process of forming a wiring pattern as a BOC mark and a pattern position electrically connected to an electronic component on a substrate is the same process. That is, the BOC mark formation position 990a on the actual substrate, the electronic component mounting position 992a and the electronic component mounting position 994a determined by the actual pattern position on the substrate are positioned on the substrate in one process. Therefore, by obtaining the deviation between the BOC mark design coordinates 990 and the actual BOC mark formation position 990a, and based on the deviation of the BOC mark, the BOC mark correction value of each electronic component mounting position can be obtained, so that the deviation from the substrate setting can be set at one time. Correct for the offset that accompanies the phase shift. That is, by correcting the electronic component design coordinates 992 based on the deviation between the BOC mark design coordinates 990 and the actually measured BOC mark formation position 990a, it is possible to mount the actual electronic component at the position where the wiring pattern or pattern is formed. The position 992a is determined as the loading position.

In addition, the step of opening a through hole in the substrate is a different step from the step of forming a wiring pattern as a pattern position electrically connected to an electronic component and a BOC mark on the substrate. Therefore, even if the BOC mark correction is performed, there may be a difference between the mounting position of the via hole corresponding to the calculated electronic component mounting position 994a based on the BOC mark correction value and the via hole formed on the substrate. During the position correction of 996b, a position shift occurs. That is, even if the deviation between the BOC mark formation position 990 based on the design value and the measured BOC mark formation position 990a is obtained, the substrate installation deviation for installation to the mounting device is obtained, and based on the BOC mark correction, the lead wire The design coordinates (x2, y2, θ2) of the lead-type electronic component mounting position (referred to as the electronic component mounting position) 994 and the design coordinates (A, B, C) of the through-hole forming position 996 are corrected, and the electronic component mounting position 994a coordinates (x3, y3, θ3) and the coordinates (A1, B1, C1) of the via hole forming position 996a may also cause the calculated via hole forming position 996a to deviate from the actual via hole forming position 996b. If it is moved, it is impossible to insert the lead wire of the lead type electronic component (for example, the radial lead type electronic component) into the through-hole forming position 996b.

In order to solve the above problem, it is considered to detect the deviation between the via hole design coordinates 996 and the actual via hole formation position 996b, and obtain the correction value (arrow h in FIG. 157 ). When a board is loaded into a mounting device, the detection of the BOC mark for mounting a chip-type electronic component and the calculation of the BOC mark correction value (arrows ma, mb) are performed, and it is necessary to repeat for each lead-type electronic component. The inspection of the through hole and the calculation of the correction value (arrow h) for correcting the offset are performed to mount the lead type electronic component, thereby reducing the tact.

Here, the actual through-hole formation position 996b and the electronic component mounting position 994b of the radial lead type electronic component include offsets corrected by the above-mentioned BOC mark correction for the through-hole coordinate design coordinate 996 and the mounting coordinate design coordinate 994 (arrow mb), and the offset (arrow n) between the via formation position 996a after the BOC mark correction and the via formation position 996b on the actual substrate.

In step 24, the control unit 60 calculates the correction amount (arrow mb) of the above-mentioned BOC mark correction for the through hole, and calculates the through hole formation position 996a after the BOC mark correction and the actual through hole formation position on the substrate. The offset amount (arrow n) between 996b is calculated as the correction amount of the through hole correction, and stored in the storage unit 61 . Here, as described above, since the through-holes on the substrate are formed in the same process, the deviation of the actual via-hole formation position relative to the via-hole formation position after the BOC mark correction is performed on the design coordinates of the via-hole is Any through hole is the same, and calculation can be performed based on the correction amount of the target through hole. Therefore, in the control unit 60, since the correction amount of the via hole formation position 996b on the actual substrate with respect to the via hole formation position 996a after the BOC mark correction, that is, the via hole correction amount, is obtained and stored, it is only necessary to calculate By calculating the correction amount of the BOC mark correction (arrows m1, m2, etc.), the actual chip-type electronic component mounting position 992a can be determined through the BOC mark correction with respect to the electronic component design coordinates 992 . In addition, the control unit 60 reads out the via hole correction (correction of the arrow n) from the storage unit 61 after performing the BOC mark correction (correction of the arrow mb) on the electronic component design coordinates 994, so that the actual The electronic component mounting position 994b of the lead type electronic component is determined as the mounting position. In addition, the electronic component mounting apparatus shares the information of the offset (arrow n) between the through-hole formation position 996 a corrected by the BOC mark and the actual via-hole formation position 996 b on the substrate with other electronic component mounting apparatuses, so that Through-hole calibration can be performed without detecting the position of the through-hole when loading it into other electronic component mounting equipment.

Thus, even when chip-type electronic components and radial electronic components are mixedly mounted and mounted on the substrate by one electronic component mounting apparatus, the tact can be improved. In addition, the correction amount (arrow n) of the via hole correction in FIG. The situation where the position 996b is far away is formed.

The control unit 60 calculates the correction amount in step S724, and in step S726, based on the correction amount of the BOC mark correction (arrow ma, mb) and the correction amount of the via hole correction (arrow n), the chip-type electronic component and the diameter After the mounting coordinates 992a and 994b of the lead type electronic component are specified, as step S728, the mounting process of the electronic component is executed. The control unit 60 drives the mounting head 15 a via the mounting head control unit 62 , and mounts chip-type electronic components or radial lead-type electronic components supplied from the component supply unit 14 on the specified mounting coordinates 992 a and 994 b. In the control unit 60, after mounting the electronic components on the substrate, the substrate on which the electronic components are mounted is carried out of the apparatus in step S730, and it is determined whether the production is completed or not in step S732.

When the control unit 60 determines in step S732 that the production has not been completed (No), it proceeds to step S716 and repeats the above-described processing. Here, the control unit 60 determines that the production has not been completed when electronic components are mounted on the substrate using the same mounting procedure, that is, when the same product is remanufactured. When the control unit 60 determines in step S732 that the production is completed (YES), the present process is terminated.

In the electronic component mounting apparatus 10a, the position of the BOC mark and the through hole of the measurement object is detected by the imaging device 36a, and based on the position of the BOC mark, the mounting coordinates of the surface-mounted electronic component are corrected, that is, BOC mark correction, arrow The correction of ma and mb is based on the position of the through hole of the measurement object, and the mounting coordinates of the electronic component that inserts the lead wire into the through hole are corrected, that is, the through hole correction and the correction of the arrow n. The mounting positions of both the component and the electronic component into which the lead wire is inserted into the through hole are properly corrected, and the electronic component can be mounted at a more appropriate position on the substrate.

In addition, in the electronic component mounting apparatus 10a, the angle correction value can be obtained by setting the coordinates of the through-hole to be measured to be two or more points, and by further setting three points, it is possible to more accurately measure the Onboard coordinates are corrected. In addition, in the present embodiment, the mounting of the electronic component is carried out after the execution of the calibration process, but the detection of the position of the via hole in step S720 may be performed before mounting the electronic component whose lead wire is inserted into the via hole. It may be performed after mounting the surface-mounted electronic components.

Next, the processing operation at the time of mounting the electronic component will be described using FIGS. 158 to 160 . Fig. 158 is a flowchart showing an example of the operation of the electronic component mounting device. FIG. 159A is an explanatory diagram showing an example of electronic components and height measurement positions. FIG. 159B is an explanatory diagram showing an example of electronic components and height measurement positions. FIG. 160 is an explanatory diagram for explaining the operation of the electronic component mounting device. Here, the electronic component mounting apparatus 10 a executes the processing operations shown in FIGS. 158 to 160 when inserting lead wires into through holes to mount electronic components.

Using FIG. 158 , the flow of processing operations at the time of electronic component mounting will be described. In addition, the processing shown in FIG. 158 can be realized by executing the processing of the control unit 60 and controlling the operation of each part. In addition, the control unit 60 executes the process shown in FIG. 158 every time one electronic component is mounted on the substrate.

In the control unit 60 , as step S750 , electronic components are mounted on the board. That is, the control unit 60 uses the mounting head 15a to suction the electronic components from the component supply unit, and mounts the suctioned electronic components on the substrate. After mounting the electronic component on the board, the control unit 60 measures the position of the electronic component as step S752. Specifically, the control unit 60 measures the height of the mounted components using the height sensor 37a.

Here, it is preferable that the electronic component mounting apparatus 10a measures the heights of a plurality of positions of the electronic component. For example, an electronic component 80a shown in FIG. 159A has a main body 82a and a plurality of leads 84a arranged along the radial direction of the main body 82a. The surface perpendicular to the radial direction of the main body 82a, that is, the surface sucked by the suction nozzle 32 has a rectangular shape. When mounting the electronic component 80a, the electronic component mounting apparatus 10a measures the heights of the four measurement positions 88a using the four corners of the rectangular shape of the main body 82a as the measurement positions 88a. Next, an electronic component 80b shown in FIG. 159B has a main body 82b and a plurality of lead wires 84b arranged along the radial direction of the main body 82b. The surface of the main body 82b perpendicular to the radial direction, that is, the surface to be sucked by the suction nozzle 32 has a circular shape. When electronic component mounting apparatus 10a mounts electronic component 80b, three locations near the circular outer edge of main body 82b are used as measurement locations 88b, and the heights of measurement locations 88b at the three locations are measured. In addition, the measurement positions 88b are positions at a distance of 120 degrees from each other on the circumference. The electronic component mounting apparatus 10a can accurately measure which position of the electronic component is lifted by measuring the heights of a plurality of positions of the electronic component.

After the control part 60 measures the position of the height direction of an electronic component in step S752, as step S754, it determines whether the electronic component is lifted. Specifically, in the control unit 60, the height information at the measurement position when the target electronic component is mounted on the substrate is stored in advance, the previously stored height is compared with the measured height, and whether the height of the electronic component is the predetermined height or not is determined. Judgment is made within the allowable value of the stored height.

When the control part 60 determines in step S754 that there is no lifting of the electronic component (No), that is, when the height of the electronic component is within the allowable value, this process is terminated. Since the control unit 60 can determine that the lead wire of the electronic component has been inserted into the through hole when the height of the electronic component is within the allowable value, the electronic component is deemed to have been properly inserted, and this process ends.

When the control unit 60 determines in step S754 that the electronic component is lifted (Yes), that is, the height of the electronic component is higher than the allowable value, as step S756 , the pushing amount and the pushing position are determined. Specifically, based on the measurement result of the height of the electronic component, the control unit 60 detects which position and the amount of the electronic component are lifted. The control unit 60 specifies the position where the electronic component is pushed in and the amount of pushing in at that position based on the detected lifting position and amount of the electronic component.

After the control unit 60 determines the pushing amount and the pushing position in step S756, as step S758, the electronic component is pushed in using the suction nozzle. That is, the control unit 60 presses the electronic component with the suction nozzle at the pushing position determined in step S756 at a height corresponding to the pushing amount. The control part 60 measures the position of an electronic component similarly to step S752 as step S760 after executing a push-in process in step S758.

After the control part 60 measures the position of an electronic component in step S760, as step S762, similarly to step S754, it determines whether the electronic component is lifted. When it is determined in step S762 that the electronic component is not lifted (No), the control unit 60 ends this process.

When the control unit 60 determines in step S762 that the electronic component is warped (Yes), in step S764, it is determined whether the threshold value≦the number of press-in processes, that is, whether the number of press-in processes performed is greater than or equal to the threshold value. When the control unit 60 determines in step S764 that the threshold value>the number of times of push-in processing (No), it proceeds to step S756 and repeats the above-described processing.

When the control unit 60 determines in step S764 that the threshold value≦the number of times of push-in processing (Yes), it executes error processing in step S766 and ends the present processing. That is, in the control unit 60, when there is warping of the electronic component even if the press-in process is performed more than the threshold number of times, it is determined that the warp cannot be eliminated by the press-in process, an error process is executed, and the present process is terminated. . As the error processing, there are processing such as stopping the device, suctioning and discarding the mounted electronic component with a suction nozzle, and mounting a new electronic component.

Next, using FIG. 160 , the processing in the case where the electronic component is warped will be described. In addition, FIG. 160 is an example at the time of measuring the height of four places of the electronic component 80a. In the control unit 60, as step S780, the height of two measurement positions on the side of one lead wire 84a of the electronic component 80a is measured by the height sensor 37a, and the height of the other measurement position of the electronic component 80a is measured by the height sensor 37a as step S782. The heights of two measurement positions on the lead wire 84a side are measured. The control unit 60 determines that the side of the other lead wire 84 a measured in step S782 is lifted from the measurement results in steps S780 and S782 .

In the control unit 60, based on the measurement results of steps S780 and S782, it is determined that the other lead wire 84a side of the measurement is lifted, and the press-fit position and press-fit amount of the other lead wire 84a side of the electronic component 80a After determination, as step S784 , the other lead wire 84 a side of the electronic component 80 a is pressed into the substrate 8 by the suction nozzle 32 .

After the control unit 60 executes the press-fitting process on the electronic component 80a in step S784, as step S786, the height sensor 37a measures the heights of two measurement positions on the side of one lead wire 84a of the electronic component 80a, and as step S788, uses The height sensor 37a measures the heights of two measurement positions on the other lead wire 84a side of the electronic component 80a. When the control unit 60 detects that the height of the electronic component 80a is within the allowable value based on the measurement results in steps S786 and S788, it determines that the electronic component 80 is properly mounted on the substrate 8, and ends this process. In addition, in FIG. 160 , the case where the electronic component 80a is pressed into the substrate 8 by one press-in process has been described, but there are cases where the press-in process is not performed based on the measurement results, and there are cases where the press-in process is performed multiple times. Condition. In addition, as the press-fitting process, a plurality of positions of the electronic component may be press-fitted with a suction nozzle.

The electronic component mounting apparatus 10a detects the height of the mounted electronic component when mounting the electronic component by inserting the leads of the electronic component into the through holes, and performs press-fit processing when the electronic component is warped. Accordingly, electronic components with leads can be appropriately mounted on the substrate. In addition, the electronic component mounting apparatus 10a detects the height of the electronic component by using the height sensor 37a mounted on the head body that performs the electronic component mounting process, and when the electronic component is lifted, press-fitting the electronic component by using the suction nozzle 32 processing, it is possible to efficiently manufacture substrates on which electronic components are mounted. That is, since the height sensor can be arranged near the electronic component when the electronic component is mounted, and the press-in process can be performed by the suction nozzle, the press-in process can be performed in a short time, and the substrate on which the electronic component is mounted can be manufactured efficiently. In addition, by using the height sensor to determine the lifting, it is possible to more accurately detect the lifting electronic component.

In addition, the electronic component mounting apparatus 10a of the above-mentioned embodiment executes the press-fit process when it is determined that the electronic component is lifted, but the present invention is not limited thereto. The electronic component mounting apparatus 10a may display an error when it is determined that the electronic component is lifted. That is, it is also possible to display only errors without performing push processing. Also in this case, the lifted electronic component can be detected more accurately, and the presence of the lifted electronic component can be notified to the operator with high accuracy. Thereby, it is possible to accurately grasp the substrate on which the electronic component is lifted and the position of the electronic component that is lifted, and it is possible to accurately grasp the mounting of the electronic component with less burden than in the case of visual inspection or the like. state.

In addition, in the said embodiment, although the structure which has one mounting head or the structure which has two mounting heads 15a is employ|adopted, this invention is not limited to this. For example, the electronic component mounting apparatus 10a may have three mounting heads.

In addition, when the mounting head 15a has a plurality of suction nozzles, it is only necessary to have at least one suction nozzle capable of holding and mounting radial lead type electronic components, and various configurations of the suction nozzles can be adopted. For example, the mounting head 15a may be configured such that half of the suction nozzles are suction nozzles capable of holding and mounting radial lead type electronic components, and the remaining half of the suction nozzles are suction nozzles that cannot suction radial lead type electronic components. In addition, in the mounting head 15a, all the suction nozzles may be used as suction nozzles capable of holding and mounting radial lead type electronic components. In addition, the electronic component mounting apparatus 10a specifies the nozzle for holding and mounting the electronic component according to the type of the nozzle when specifying the nozzle for holding the electronic component to be mounted based on the production program. In addition, although the electronic component mounting apparatus 10a of this embodiment is comprised so that the component supply apparatus 100 and the supply apparatus 100a may exist mixedly, it may comprise only the component supply apparatus 100.

In addition, the electronic component mounting apparatus 10a is configured to have a component supply unit 14 including an electronic component supply device 100 for supplying electronic components with leads and an electronic component supply device for supplying electronic components without leads. Component supply apparatus 100a, but component supply units of other configurations may also be used.

Next, an example of the processing operation at the time of mounting the electronic component will be described using FIG. 161 . Fig. 161 is a flowchart showing an example of the operation of the electronic component mounting device. The electronic component mounting apparatus 10 executes the process of FIG. 161 every time the suction nozzle of the mounting head performs an operation of picking up an electronic component. In addition, the process of FIG. 161 is basically the process in the case where both a lead type electronic component and a mount type electronic component are mounted on a board|substrate as an electronic component. In the electronic component mounting apparatus 10 , as step S910 , the electronic component to be held is specified, and as step S912 , it is determined whether or not the component to be held is a lead type electronic component.

When the electronic component mounting apparatus 10 determines in step S912 that it is a lead type electronic component (Yes), as step S914 , the lead type electronic component of the electronic component supply apparatus is held by the suction nozzle. That is, the electronic component mounting apparatus 10 holds the lead-type electronic components supplied to the holding positions (second holding positions) of the electronic component supply apparatuses 100 , 402 , 404 , 406 and the like by the suction nozzles. After the electronic component mounting apparatus 10 holds the lead type electronic component by the suction nozzle in step S914, in step S916, the lead wire of the lead type electronic component is inserted into the insertion hole and mounted on the board.

When the electronic component mounting apparatus 10 determines in step S912 that it is not a lead type electronic component (No), as step S917 , the electronic component supply apparatus holds the mountable electronic component by the suction nozzle. That is, the electronic component mounting apparatus 10 holds the mounted electronic component supplied to the holding position (first holding position) of the electronic component supply apparatus 100a etc. by the suction nozzle. After the electronic component mounting apparatus 10 holds the mount-type electronic component by the suction nozzle in step S917, as step S918, the mount-type electronic component is mounted on the board. That is, the electronic component mounting apparatus 10 mounts the mount-type electronic component on the board without inserting it into the insertion hole.

After the electronic component mounting apparatus 10 executes the process of step S916 or step S918 , that is, mounts electronic components, it determines whether or not mounting of all electronic components has been completed as step S919 . When the electronic component mounting apparatus 10 determines in step S919 that the mounting has not been completed (No), it proceeds to step S910 , specifies the next electronic component to be mounted, and executes the above-described processing on the specified electronic component. The electronic component mounting apparatus 10 will complete this process, if it determines with mounting completion (Yes) in step S919.

As shown in FIG. 161 , the electronic component mounting apparatus 10 can mount mount-type electronic components and lead-type electronic components on a board by using one mounting head. In addition, the electronic component mounting apparatus 10 can mount both the mount-type electronic component and the lead-type electronic component using the same suction nozzle. Here, the electronic component mounting apparatus 10 can carry out conveyance and mounting using the same suction nozzle as the mountable electronic component by holding (absorbing or holding) the main body of the lead type electronic component. In addition, the electronic component mounting apparatus 10 determines whether it is a mount-type electronic component or a lead-type electronic component, and switches whether to insert the lead wire into the insertion hole or not, so that even when using the same mounting head or the same suction nozzle, When mounting, it is also possible to mount on the substrate under conditions suitable for each electronic component. Thereby, the mount-type electronic component and the lead-type electronic component can be mounted without replacing the suction nozzle. In addition, since mount-type electronic components and lead-type electronic components can be mixed and mounted without distinguishing between them, restrictions on the order of mounting can be reduced, and mounting efficiency can be further improved.

Here, the electronic component mounting apparatus 10 can more appropriately obtain the above effects by using radial lead type electronic components supplied by the electronic component supply apparatus 100 as described above as lead type electronic components. The electronic component mounting apparatus 10 holds the radial lead type electronic component after the lead wire has been cut into a predetermined length in the electronic component supply apparatus 100 by using the suction nozzle, more specifically, holds and transports the main body by the suction nozzle, and the lead wire Insert it into the insertion hole to install it on the board. As described above, since the electronic component mounting apparatus 10 holds the main body of the electronic component, the lead length can be shortened. In addition, since the electronic component mounting apparatus 10 is configured to transport the main body of the holding belt and cut the lead wires before holding, it is possible to remove the portion of the lead wires of radial lead type electronic components that are held by the holding belt for transport. In the last state, mount it on the board. Thereby, the lead wire of a radial lead type electronic component can be shortened and mounted on a board|substrate, and it can mount to a board|substrate in the state which stabilized the electronic component. Specifically, since the leads of the radial lead type electronic component can be mounted on the substrate with shortened lengths, vibrations applied to the substrate due to the leads coming into contact with the insertion holes during substrate mounting can be reduced. As a result, even if the radial lead type electronic components and the mounting type electronic components are mounted in the same process, the influence on the mounting of each other can be reduced. Even in the same process, that is, using the same mounting head or the same The suction nozzle can be installed continuously, and two kinds of electronic components can also be installed appropriately.

Here, the electronic component mounting apparatus 10 of the above-described embodiment is configured to include a bowl feeder device 90 using a bowl feeder as the component supply unit 14f, and an electronic component supplying unit including a radial feeder as the component supply unit 14r. device 100, but is not limited thereto. The electronic component mounting apparatus 10 can have various combinations of component supply units. For example, an electronic component supply device in which a bowl-type feeder is installed on the two component supply units on the front side and a rear side, or an electronic component supply device in which a radial feeder is installed on the two component supply units on the front side and the rear side may also be used. device. In addition, as described above, an electronic component supply device (chip component feeder) 100 a that supplies mountable electronic components using an electronic component holding tape may be included as the component supply unit. In addition, all the electronic component supply devices of one component supply unit on the front side and the rear side may be provided as the electronic component supply device (chip component feeder) 100 a. That is, one of the front and rear component supply units may supply lead-type electronic components (electronic components inserted into the substrate), and the other may supply leadless electronic components (electronic components mounted on the substrate). In addition, in the electronic component mounting apparatus, a so-called tray feeder can also be used as the electronic component mounting apparatus. In addition, in the electronic component mounting apparatus, as the electronic component supply device, an axial feeder that cuts the lead wires of the axial type electronic components held on the holding tape to the substrate as described above may be used. Supply to the holding position with the lower part exposed and bent into a "U" shape. In this case, after the electronic component mounting device holds the main body of the axial type electronic component at the holding position of the axial feeder with the suction nozzle, it judges whether the lead wire spacing is good or not, and judges that the axial type electronic component is good. Insert into the insertion hole (board hole). The electronic component mounting apparatus 10 can mount or insert an electronic component on a board by suctioning or holding the electronic component, regardless of which electronic component supply device is supplied. In addition, in an electronic component supply device that supplies lead-type electronic components, the lead-type electronic components are placed in an orientation in which the main body is arranged on the upper side in the vertical direction of the leads, that is, in an orientation in which the leads are arranged on the lower side in the vertical direction of the main body. The holding position supply is carried out by the suction nozzle. Here, the electronic component mounting apparatus 10 is preferably a component supply unit having a bowl type feeder, or other types of electronic component supply devices, such as the above-mentioned radial feeder, the above-mentioned axial feeder, and a mount-type feeder, as shown in this embodiment. Component supply units such as an electronic component holding tape feeder, a bar feeder, and a tray feeder are arranged at positions facing each other via the substrate conveyance unit 12 , that is, the front side and the rear side. This prevents the vibration of the bowl feeder from affecting other types of component supply units, thereby stabilizing the holding action of the suction nozzles for electronic components supplied at the holding positions by other types of electronic component supply devices.

In addition, in this embodiment, although the component supply means was demonstrated as two components supply means 14f and 14r, the number is not limited. In addition, the two component supply units 14f and 14r may be regarded as one component supply unit, and the component supply units 14f and 14r may be regarded as a first component supply unit and a second component supply unit, respectively. For example, it can be considered that one component supply unit has a bowl feeder (component supply unit 14f, first component supply unit) and a radial feeder (component supply unit 14r, second component supply unit) as shown in the above-mentioned embodiment. supply department). In this case, the first component supply unit and the second component supply unit are disposed at positions facing each other across the substrate arrangement position. In addition, it can also be considered that one component supply unit 14f has a first component supply unit and a second component supply unit. For example, as described above, it can be considered that one component supply unit 14 f has a radial feeder (first component supply unit) and a chip component feeder (second component supply unit). As described above, the electronic component mounting apparatus 10 may employ a configuration including a plurality of electronic component supplying apparatuses regardless of combination.

Here, as electronic components supplied by the electronic component supply apparatus 100 which is a radial feeder, there are various radial lead type electronic components in which leads can be held by holding tapes. The electronic component supply apparatus 100 can supply, for example, aluminum electrolytic capacitors, inductors, ceramic capacitors, film capacitors, and the like. In addition, as electronic components supplied by the electronic component supply devices 402 , 404 , and 406 which are bowl-type feeders, there are various lead-type electronic components of packaged components. The electronic component supply devices 402 , 404 , and 406 can supply, for example, solid state relays, DIP type electronic components, SIP type electronic components, connectors, transformers, and the like.

In addition, when the mounting head 15 of the present embodiment has a plurality of suction nozzles in order to mount more types of electronic components with one mounting head, the above-mentioned suction nozzle automatic replacement device (in the present embodiment In order to replace the mounting head by replacing the combination of the nozzle holding mechanism and the mounting head body), each nozzle is replaced with a variety of nozzles and grip nozzles during installation and production. The electronic component mounting apparatus 10 specifies, for each component, according to component conditions such as the size and weight corresponding to the mountable electronic component and the lead type electronic component, whether the upper surface of the component body has a plane that can be sucked, and whether the component body can be gripped. Suction nozzles with suitable suction apertures or gripping nozzles with suitably shaped gripping parts and stored in the production program. The electronic component mounting apparatus 10 switches the nozzles mounted on the mounting head based on the correspondence between the electronic components and the nozzles stored in the production program, or specifies the nozzles holding the electronic components in the mounting head.

As a result, for example, when the electronic component mounting apparatus 10 changes the electronic component held by the suction nozzle from the mount-type electronic component to the lead-type electronic component during board mounting, the same suction nozzle as the suction nozzle holding the mount-type electronic component may be used. A case of holding a lead type electronic component, and a case of holding a lead type electronic component with a different suction nozzle. The electronic component mounting apparatus 10 uses the automatic nozzle replacement device to automatically replace the nozzles when the mounted electronic components are changed during the preparation process or during production when the nozzles are different. That is, the following operation is continued: when the electronic component mounted on the substrate during production is, for example, a mount-type electronic component, the suction nozzle (suction nozzle or holding suction nozzle) suitable for the electronic component is selected, and the suction nozzle is moved to The mounted electronic component located at the holding position of the electronic component supply device that supplies the electronic component holds the electronic component and moves to a predetermined position on the substrate, and performs the mounting operation while controlling the descending speed of the electronic component. The electronic component mounting apparatus 10 determines whether the suction nozzles are the same or different when the mounting of the predetermined number of the electronic components is completed and the next electronic component to be mounted is changed to a lead type electronic component. When the electronic component mounting apparatus 10 determines that the suction nozzles are the same, since there is no need to replace the suction nozzles, the same suction nozzles are used as the suction nozzles for the lead-type electronic components. In addition, when the electronic component mounting apparatus 10 determines that the suction nozzles are different, if there is a usable suction nozzle among other suction nozzles mounted on the mounting head, the suction nozzle is used as the suction nozzle for the lead type electronic component. When there is no usable nozzle among the other nozzles, the nozzle is automatically replaced by the nozzle automatic replacement device for the lead-type electronic component. After preparing the suction nozzles for lead-type electronic components in this way, the electronic component mounting apparatus 10 moves the mounting head to move the suction nozzles to the holding position of the lead-type electronic component supply apparatus. The electronic component mounting apparatus 10 utilizes an electronic component supply device that supplies lead-type electronic components, and uses a built-in cutting device (cutting unit) to pre-cut the lead wire from the electronic component tape (electronic component holding tape) to a short predetermined length. type electronic components, set in holding position. The electronic component mounting apparatus 10 holds the lead-type electronic component by sucking or gripping the lead-type electronic component with the above-mentioned suction nozzle, and discriminates the distance between the lead wires and the positional deviation by using the detection unit (laser recognition device 38 ), thereby Electronic components moved to the substrate and inserted into the insertion hole (substrate hole) are screened, and the positional deviation of the lead wire is corrected when inserted into the insertion hole, and the descending speed at the time of insertion corresponds to the cut length of the lead wire. Gradually decelerates the switching control while proceeding with the installation.

In addition, when the mounting head 15 has a plurality of suction nozzles, it is only necessary to have at least one suction nozzle capable of holding and mounting lead-type electronic components (plug-in type electronic components), and various structures of the suction nozzles can be adopted. . For example, in the mounting head 15 , a part of the suction nozzles may be suction nozzles for holding lead-type electronic components, and the remaining suction nozzles may be suction nozzles for holding mount-type electronic components. In this case, the electronic component mounting apparatus performs mounting control for mounting the mounted electronic component on a substrate when holding the mounted electronic component with the suction nozzle, and performs mounting control for mounting the mounted electronic component on a substrate when holding the lead type electronic component. Mounting control for inserting the lead type electronic component into the insertion hole (substrate hole) is performed. In addition, in the mounting head 15, all suction nozzles may be used as suction nozzles which hold a lead type electronic component. In addition, when the electronic component mounting apparatus 10 determines the suction nozzle (or the holding suction nozzle for gripping) that suctions and mounts the electronic component based on the production program, it selects the suction nozzle for holding and mounting the electronic component according to the type of the electronic component. Mouth to confirm. As described above, the electronic component mounting apparatus 10 prepares a plurality of suction nozzles that can be mounted on one mounting head, operates the suction nozzle automatic changing device during production according to the instructions based on the production program, and mounts the suction nozzles on the mounting head. The suction nozzles are detachably replaced with suction nozzles corresponding to the electronic parts (mounted electronic parts) to be produced next time, so that the lead type electronic parts are kept inserted on the substrate, and by substrate mounting of the mount type electronic parts, thus Substrate mounting can be performed sequentially.

Next, an example of an electronic component mounting system (mounting system) using the electronic component mounting apparatus described above will be described with reference to FIGS. 162 and 163 . Fig. 162 is a schematic diagram showing a schematic configuration of the electronic component mounting system. An electronic component mounting system (hereinafter also referred to as “mounting system”) 1 shown in FIG. 162 has a pattern forming device 2 , a reflow processing device 4 , conveyance devices 6 and 7 , and an electronic component mounting device 10 . In the mounting system 1 , each part is arranged in order of the pattern forming device 2 , the conveying device 6 , the electronic component mounting device 10 , the conveying device 7 , and the reflow processing device 4 to convey the substrate.

The pattern forming device 2 is a device that forms a solder pattern on the surface of the substrate and fills the insertion holes of the substrate with solder. The reflow device 4 heats the substrate to a predetermined temperature to temporarily melt the solder on the substrate, thereby bonding the substrate and the electronic component in contact with the solder. That is, the reflow device 4 uses the patterned solder to bond the mounted electronic component mounted on the solder pattern formed on the surface of the substrate to the substrate, inserts the lead into the lead type electronic component and the lead insertion hole in the insertion hole, and uses Insert the solder filled in the hole for bonding.

The transfer devices 6 and 7 are devices for transferring substrates. The conveying device 6 carries the substrate processed and carried out by the pattern forming device 2 into the electronic component mounting device 10 . The transport device 7 carries the substrate processed and carried out by the electronic component mounting device 10 into the reflow processing device 4 .

The electronic component mounting apparatus 10 mounts electronic components on a board as described above. Here, the electronic component mounting apparatus 10 can mount lead type electronic components as electronic components. In addition, the electronic component mounting apparatus 10 may mount both lead-type electronic components and mount-type electronic components as electronic components. The installation system 1 has the above-mentioned structure.

Fig. 163 is a flowchart showing an example of the operation of the electronic component mounting system. In the mounting system 1, as step S960, solder is printed on the substrate. That is, in the mounting system 1 , as step S960 , the pattern forming device 2 forms a solder pattern on the surface of the substrate, and fills the insertion hole with solder. In the mounting system 1, after solder is printed on the substrate in step S960, the substrate is carried into the electronic component mounting apparatus 10 by the conveyance device 6, and as step S962, the electronic component mounting apparatus 10 is used to mount lead type electronic components on the substrate and mount them. type electronic components. In the mounting system 1, after mounting the electronic components on the substrate in step S962, the substrate mounted with the electronic components is carried into the reflow processing device 4 by the conveyance device 7, and the reflow processing is performed in step S964, and this process ends.

In the mounting system 1, as described above, by using the electronic component mounting apparatus 10 to mount the lead-type electronic components and the mount-type electronic components, the lead-type electronic components and the mount-type electronic components can be mounted with one reflow process. Both are fixed to the substrate. Thereby, in the installation system 1, the structure of a manufacturing line can be simplified.

In addition, by mounting the lead type electronic component and the mount type electronic component using the electronic component mounting apparatus 10 , as described above, the radial lead type electronic component can be mounted with the lead wires shortened. Thus, in the mounting system 1, even if the lead type electronic component and the mount type electronic component are mounted in the same process, and the lead type electronic component and the mount type electronic component are reflowed at the same time, the electronic component can be bonded appropriately. connected to the substrate. Thereby, the production efficiency of a board|substrate can be improved.

In addition, in the electronic component mounting system 1, the lead wire after insertion is temporarily fixed in the insertion hole via solder by prefilling or applying solder into the insertion hole. The component bending process of bending components on the back side of the board can shorten the lead wires, thereby eliminating the need for a lead bending device provided on the back side of the board in an existing dedicated mounting device for board insertion. In addition, support pins for supporting substrates used in conventional electronic component mounting devices (die mounters) can be arranged at arbitrary positions, and the substrates can be mounted and inserted into the insertion holes by the mounting head.

In addition, the mounting system of the electronic component mounting apparatus which has a preferable structure for making the mounting system 1 shown in FIG. 162, FIG. 163 obtain the said effect is not limited to this. For example, the mounting system may be configured to have a plurality of electronic component mounting apparatuses 10 . In addition, in the mounting system, the electronic component mounting apparatus 10 may be used as a mounting apparatus for mounting only lead-type electronic components. In addition, the electronic component mounting device 10 is a device capable of appropriately mounting lead type electronic components, but may also be used as a device for temporarily mounting only mountable electronic components.

Claims (15)

1. An electronic component mounting device, characterized in that it has: a substrate conveying unit, which conveys the substrate; A component supply unit having at least one electronic component supply device for supplying electronic components with lead wires; The mounting head main body has a suction nozzle for suctioning the electronic component supplied from the component supply unit, a suction nozzle drive unit for driving the suction nozzle, and supports the suction nozzle and the suction nozzle drive unit. The carrying head support body; a photographing device, which is fixed on the support body of the mounting head, and photographs the substrate; a storage unit that stores a through-hole coordinate design value, a fiducial mark coordinate design value, and an electronic component mounting coordinate design value; and a control unit that controls operations of the head body, the imaging device, and the component supply unit, The control unit uses the imaging device to image a through hole formed in the substrate and a reference mark as a reference of a wiring pattern formed on the surface of the substrate, Calculate the correction value of the fiducial mark based on the fiducial mark obtained from the captured image, and calculate the through hole correction based on the offset between the position of the through hole after correction of the fiducial mark and the through hole obtained from the captured image value, and according to the correction value of the fiducial mark and the correction value of the through hole, the position where the electronic component is mounted is determined. 2. The electronic component mounting apparatus according to claim 1, wherein: The control unit controls the movement of the mounting head main body, moves the electronic component with leads to the position of the substrate determined based on the calibration result, and inserts the leads of the electronic component into the substrate. The electronic components are mounted on the substrate in the through holes. 3. The electronic component mounting apparatus according to claim 1 or 2, wherein: The control unit takes images of two or more through holes adjacently formed on the substrate, and based on the relative positions of the two or more through holes, the through holes formed on the substrate position is detected. 4. The electronic component mounting apparatus according to claim 1 or 2, wherein: The control unit captures images of three through holes formed adjacently on the substrate, and detects positions of the through holes formed on the substrate based on relative positions of the three through holes. 5. The electronic component mounting apparatus according to claim 1, wherein: The electronic component mounting apparatus further includes a height sensor fixed to the mounting head support to detect the heights of the surface of the substrate and the electronic components mounted on the surface of the substrate, The control unit stores a reference height of the electronic component mounted on the substrate, After the leads of the electronic components are inserted into the through holes of the substrate, the height of the electronic components on the substrate is detected by the height sensor, and the detected height of the electronic components is determined to be Whether the base height is higher than that. 6. The electronic component mounting apparatus according to claim 5, wherein: The control unit notifies an error when determining that the detected height of the electronic component is higher than the reference height. 7. The electronic component mounting apparatus according to claim 5, wherein: When the control unit determines that the detected height of the electronic component is higher than the reference height, the mounting head main body executes a process of pressing the electronic component. 8. The electronic component mounting apparatus according to claim 7, wherein: The process of pressing the electronic component is a process of pressing the electronic component toward the substrate with the tip of the suction nozzle. 9. The electronic component mounting apparatus according to claim 7 or 8, wherein: The control unit determines a pressing amount in the pressing process based on the detected height of the electronic component. 10. The electronic component mounting apparatus according to claim 1, wherein: The electronic component supply device has: a housing bowl, wherein a plurality of said electronic components are placed; a guide rail that guides the electronic component discharged from the storage bowl to a suction position to be suctioned by the suction nozzle; a support mechanism that blocks a downstream side of the suction position of the guide rail, and supports the electronic component at the suction position of the guide rail; and The vibrating part vibrates the storage bowl. 11. The electronic component mounting apparatus according to claim 10, wherein: The support mechanism is movable along the extending direction of the guide rail, and can switch between a state of closing the downstream side of the guide rail with respect to the adsorption position, and a state of opening it, The receiving bowl is fixed on the vibrating part by a detachable fastening mechanism. 12. The electronic component mounting apparatus according to claim 10 or 11, wherein: The component supply unit has a plurality of the electronic component supply devices, The storage bowls of the plurality of electronic component supply devices are stacked in a vertical direction, The vibrating unit of the electronic component supply device vibrates the storage bowl by the same driving device as that of other vibrating units of other electronic component supply devices. 13. The electronic component mounting apparatus according to claim 12, wherein: A plurality of the support mechanisms are arranged side by side in the horizontal direction. 14. The electronic component mounting apparatus according to claim 12, wherein: The driving part is supported by a fixed part extending in a vertical direction, and vibrates the storage bowl from the fixed part as a starting point. 15. A method for mounting an electronic component, comprising mounting an electronic component on the substrate by using an electronic component mounting apparatus, wherein the electronic component mounting apparatus includes: a substrate transport unit that transports the substrate; and a component supply unit that includes at least 1 an electronic component supply device for supplying electronic components with leads; and a mounting head main body having suction nozzles for suctioning electronic components supplied from the component supply unit, suction nozzles for driving the suction nozzles a nozzle drive unit, and a mounting head support supporting the suction nozzle and the suction nozzle drive unit, The electronic component mounting method is characterized in that it has the following steps: A process of storing the coordinate design values of through-holes, reference mark coordinates, and electronic component mounting coordinates; a coordinate calculation step of calculating the coordinates of the through holes formed on the substrate and the coordinates of the reference marks formed on the surface of the substrate; a reference mark correction value calculation step, in which a reference mark correction value is obtained based on the coordinates of the reference mark calculated in the coordinate calculation step; a through hole correction value calculation step, in which the position of the through hole corrected by the calculated reference mark correction value and the coordinates of the through hole calculated in the coordinate calculation step are shifted , to obtain the via correction value; and A step of determining a position to mount an electronic component based on the reference mark correction value and the via hole correction value.

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