CN103085278A - Gluing module and manufacturing method thereof - Google Patents

Abstract

A gluing module and a manufacturing method thereof are provided, wherein the gluing module comprises a first plate body, a plurality of protruding structure arrays and a second plate body. Each protruding structure is arranged on the first plate body along a first direction, and a flow channel is formed between two adjacent protruding structure arrangements. Each protruding structure array comprises a plurality of supporting units arranged along a second direction, a gap is formed between two adjacent supporting units, and the first direction is different from the second direction. The second plate body is glued on the first plate body and arranged with the protruding structure and is abutted against the supporting unit. The gluing module is provided with the flow passages and the notches so as to uniformly distribute the glue, and the glue between the first plate body and the second plate body has a certain thickness by utilizing the supporting unit, so that the first plate body and the second plate body have enough gluing strength.

Description

Adhesive module and manufacturing method thereof

technical field

The invention relates to a gluing module and a manufacturing method thereof, in particular to a gluing module suitable for housings of electronic devices and a manufacturing method thereof.

Background technique

With the advancement of technology, notebook computers have been widely used by modern people. The notebook computer has the advantages of light weight and small volume, which is convenient for users to carry around. In addition, since the appearance design of the notebook computer is quite diverse, it can meet the requirements of consumers on the appearance of the product.

At present, the appearance of the notebook computer is often made of metal to enhance the texture. Usually, the aluminum-magnesium sheet is glued to the plastic parts, so that the notebook computer can increase the appearance texture under the premise of light weight. However, when the aluminum-magnesium sheet is glued to the plastic part, the liquid glue is usually poured on the plastic part by using a glue dispenser, and then the aluminum-magnesium sheet is pressed onto the plastic part. Due to the large bonding area, the liquid glue inside is not easy Curing to form a colloid, therefore, making the bonding quality unstable, and the aluminum-magnesium sheet and plastic parts are easily pulled out.

In addition, if the aluminum-magnesium sheet and the plastic part need to have a pull-out resistance that meets the specifications, the colloid between the aluminum-magnesium sheet and the plastic part needs to have a certain thickness, but due to the influence of temperature and other related parameters during the manufacturing process, The amount of glue poured by the glue dispenser is not easy to control, which may lead to uneven distribution of liquid glue, and then the problem of uneven thickness of the glue after the liquid glue is cured.

Contents of the invention

The invention provides a gluing module with better gluing quality and gluing strength.

The invention provides a method for manufacturing a glued module, which can manufacture the above glued module.

The invention provides a glued module, which includes a first plate body, a plurality of protruding structure arrangements and a second plate body. Each protruding structure arrangement is arranged on the first plate body along a first direction, and a flow channel is formed between two adjacent protruding structure arrangements. Each protruding structure arrangement includes a plurality of support units arranged along a second direction, the first direction and the second direction are different, and there is a gap between two adjacent support units. The second plate body is glued to the first plate body, arranged with the protruding structure and leaning against the supporting unit.

In an embodiment of the present invention, it further includes a plurality of air gaps located between the first board and the second board.

The present invention also proposes a method for manufacturing a glued module, which includes providing a first plate body, a plurality of protruding structures arranged on the first plate body along a first direction, and forming a stream between two adjacent protruding structure arrays. Each protruding structure arrangement includes a plurality of support units arranged along a second direction, the first direction and the second direction are different, and there is a gap between two adjacent support units. A liquid glue is injected onto the first board body, and the liquid glue flows in the runner and the gap. A second board is leaned against the supporting unit, so that there is a gap between the first board and the second board, and the liquid glue is distributed between the first board and the second board. The liquid glue is cured to form a colloid, the second board is glued to the first board and arranged with the protruding structure through the colloid, and the thickness of the colloid is substantially equal to the height of the supporting unit.

Based on the above, the gluing module and its manufacturing method of the present invention use the support unit to maintain the distance between the first plate and the second plate, not only can make the thickness of the glue close to the height of the support unit, so that the first plate and the second plate The second plate body has sufficient glue strength. In addition, since the liquid glue can flow in the flow channels and gaps during the manufacture of the glued module, in addition to avoiding the problem of uneven glue distribution, there is also an air gap between the liquid glue and the second plate for air to pass through. Accelerate the solidification of the liquid glue inside the glued module.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1A is a schematic cross-sectional view of a gluing module according to an embodiment of the present invention.

FIG. 1B is a schematic top view of the first plate body and the supporting unit of the glued module of FIG. 1A .

FIG. 2 is a schematic top view of a first plate body and a supporting unit of a glue module according to another embodiment of the present invention.

FIG. 3A is a schematic cross-sectional view of a gluing module according to yet another embodiment of the present invention.

FIG. 3B is a schematic top view of the first plate body and the supporting unit of the glued module of FIG. 3A .

FIG. 4 is a schematic top view of a first plate body and a supporting unit of a glued module according to another embodiment of the present invention.

FIG. 5 is a schematic flowchart of a method for manufacturing a glued module according to an embodiment of the present invention.

Reference signs:

D1: first direction

D2: Second direction

100: glued module

110: The first board body

120: Protruding Structure Arrangement

122: Runner

124: Support unit

126: Gap

130: colloid

140: second plate

150: air gap

210: The first plate body

220: Protruding Structure Arrangement

224: Support unit

300: glued module

310: The first plate body

320: Protrusion Structure Arrangement

322: Runner

324: Support unit

326: Gap

328: Bump

330: colloid

340: second plate body

350: air gap

410: The first plate body

420: Protrusion Structure Arrangement

424: Support unit

428: bump

500: Manufacturing method of glued module

510～540: steps

Detailed ways

FIG. 1A is a schematic cross-sectional view of a gluing module according to an embodiment of the present invention. FIG. 1B is a schematic top view of the arrangement of the first plate body and the protruding structure of the glued module in FIG. 1A . Please refer to FIG. 1A , the gluing module 100 of this embodiment includes a first board 110 , a plurality of protruding structures 120 , a glue 130 , a second board 140 and a plurality of air gaps 150 . In this embodiment, the first board 110 is a plastic part, and the second board 140 is an aluminum-magnesium sheet, but the materials of the first board 110 and the second board 140 are not limited thereto.

As shown in FIG. 1A , the second plate body 140 is glued to the first plate body 110 by a glue 130 , and the glue 130 is located on the first plate body 110 and on the protruding structure arrangement 120 . The second plate body 140 leans against the support unit 124 such that the thickness of the glue body 130 is substantially equal to the height of the support unit 124 . Furthermore, sufficient adhesive strength is provided between the first plate body 110 and the second plate body 140 . The distance between the first board 110 and the second board 140 can be determined according to the requirements of the manufacturer. Taking the aluminum-magnesium sheet and plastic parts of a notebook computer as an example, the distance is about 0.1 mm.

The protruding structure arrangement 120 is disposed on the first plate body 110 , please refer to FIG. 1B to understand the distribution of the protruding structure arrangement 120 on the first plate body 110 . As shown in FIG. 1B , each protruding structure array 120 is disposed on the first plate body 110 along a first direction D1 , and a flow channel 122 is formed between two adjacent protruding structure arrays 120 . Each protruding structure arrangement 120 includes a plurality of supporting units 124 arranged along a second direction D2. The first direction D1 is different from the second direction D2. In this embodiment, the first direction D1 is perpendicular to the second direction D2. A gap 126 exists between two adjacent supporting units 124 .

In this embodiment, the glue 130 is located between the first plate body 110 and the second plate body 140 , and is accommodated in the channel 122 and the notch 126 . Moreover, two adjacent protruding structure arrays 120 are arranged in a dislocation, so that the notches 126 correspond to the supporting units 124 of the adjacent protruding structure arrays 120 . In addition, the supporting unit 124 in this embodiment is integrally formed on the first board body 110 , but the manner in which the supporting unit 124 is disposed on the first board body 110 is not limited thereto.

Because when manufacturing the gluing module 100 of this embodiment, the liquid glue can flow in the flow channel 122 and the gap 126 after being poured on the first plate body 110, so the height of the liquid glue is slightly lowered, so that the first plate body 110 An air gap 150 exists between the second plate body 140 . Since the air can enter the inside of the gluing module 100 through the air gap 150, the curing of the liquid glue inside the gluing module 100 is accelerated, thereby shortening the curing time and improving the gluing quality inside the gluing module 100, and avoiding the uneven distribution of the amount of glue. question.

Fig. 2 is a schematic top view of the arrangement of the first board and the protruding structure of a glue module according to another embodiment of the present invention. Please refer to Fig. 2, the difference between the embodiment of Fig. 2 and the embodiment of Fig. 1B is that, in Fig. 2, the supporting units 224 are arranged in the first plate body 210 in an array, that is, each supporting unit 224 corresponds to other The supporting unit 224 of the protruding structure array 220 . In FIG. 1B , two adjacent protruding structure arrays 120 are arranged in a dislocation, and the supporting unit 124 is a gap 126 corresponding to the adjacent row of protruding structure arrays 120 . Of course, the arrangement of the support units 124 , 224 on the first board body 110 , 210 is not limited to the above. As long as there is a distance between the first plate body and the second plate body, and there are flow channels and gaps, the colloid can be evenly distributed.

FIG. 3A is a schematic cross-sectional view of a gluing module according to yet another embodiment of the present invention. FIG. 3B is a schematic top view of the arrangement of the first plate body and the protruding structure of the glued module of FIG. 3A . Please refer to FIG. 3A and FIG. 3B , the second plate body 340 is glued to the first plate body 310 by a glue 330 , wherein the glue 330 is located in the channel 322 and the notch 326 .

The difference between the embodiment of FIG. 3A and FIG. 3B and the embodiment of FIG. 1A and FIG. 1B is that, in the embodiment of FIG. 3A and FIG. D2 is disposed on the first plate body 310 , the height of the protrusions 328 is lower than that of the supporting units 324 , and the protrusions 328 and the supporting units 324 are arranged in a staggered manner. In this embodiment, the supporting unit 324 and the protrusion 328 are integrally formed on the first plate body 310 . As shown in FIG. 3A , the glue 330 covers the top surface and the side surface of the protrusion 328 . In this embodiment, the first board 310 uses the protrusion 328 to increase the bonding area with the second board 340 .

In addition, in this embodiment, two adjacent protruding structure arrays 320 are arranged in a dislocation, and the supporting unit 324 and the protrusion 328 correspond to the gaps 326 of the protruding structure arrays 320 in adjacent rows.

Fig. 4 is a schematic top view of the arrangement of the first board and the protruding structure of a glue module according to another embodiment of the present invention. Please refer to FIG. 4 , the protruding structure arrangement 420 includes a plurality of supporting units 424 and a plurality of protrusions 428 . The difference between the embodiment of FIG. 4 and the embodiment of FIG. 3A is that, in FIG. 4 , the supporting units 424 and the bumps 428 are arranged on the first board 410 in an array, that is, each supporting unit 424 and the bumps 428 The supporting unit 424 and the bump 428 correspond to the arrangement 420 of other protruding structures. Of course, the arrangement of the supporting unit 424 and the bump 428 on the first board 410 is not limited to the above.

FIG. 5 is a schematic flowchart of a method for manufacturing a glued module according to an embodiment of the present invention. Please refer to FIG. 5 , the manufacturing method of the glued module of this embodiment is as follows. Firstly, a first plate body is provided, wherein a plurality of protruding structure arrays are arranged on the first plate body along a first direction, a flow channel is formed between two adjacent protruding structure arrays, and each protruding structure array includes a plurality of supports The units are arranged along a second direction, the first direction is different from the second direction, and there is a gap between two adjacent supporting units (step 510).

Next, inject a liquid glue on the first board, and the liquid glue flows in the channel and the notch (step 520 ). Next, a second board is leaned against the support unit so that there is a gap between the first board and the second board, and the liquid glue is distributed between the first board and the second board (step 530 ). Finally, the liquid glue is cured to form a colloid, the second plate is glued to the first plate and arranged with the protruding structure, and the thickness of the colloid is substantially equal to the height of the supporting unit (step 540 ). At this time, there are multiple air gaps between the first plate body and the second plate body.

In other embodiments, the protruding structure arrangement further includes a plurality of protruding blocks arranged on the first board along the second direction, the height of the protruding blocks is lower than the height of the support unit, and the protruding blocks and the support unit are arranged alternately and integrally formed on the first board. Of course, the supporting units and the bumps can also be arranged in an array on the first board. The second board is connected to the first board, the support unit and the bump by glue to complete the glued module.

To sum up, the gluing module and its manufacturing method of the present invention distribute the glue evenly through the channels between the protruding structures and the gaps between the supporting units, so as to avoid the problem of uneven distribution of glue. Moreover, a plurality of support units are used to maintain the distance between the first board and the second board, so that the glue between the first board and the second board has a certain thickness, that is, the first board and the second board have a certain thickness. There is sufficient bonding strength between the two boards. In addition, when the liquid glue flows, an air gap is formed between the first board and the second board, and air can flow through the air gap to speed up the curing of the liquid glue inside the gluing module.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention, and any person of ordinary skill in the art may make some changes and modifications without departing from the spirit and scope of the present invention.

Claims (9)

1. A glued module, comprising: a first board; A plurality of protruding structure arrays are arranged on the first plate body along a first direction, flow channels are formed between two adjacent protruding structure arrays, each of the protruding structure arrays includes a plurality of protruding structure arrays arranged along a second direction a support unit, the first direction is different from the second direction, and there is a gap between two adjacent support units; and A second plate body is glued to the first plate body and arranged with the protruding structures, and leans against the supporting units. 2. The bonding module according to claim 1, wherein the second board is glued to the first board and the protruding structure by a glue, and the glue is located between the first board and the second board between the bodies, and the thickness of the colloid is equal to the height of the supporting unit. 3. The adhesive module according to claim 1, wherein two adjacent protruding structures are arranged in a dislocation, so that each of the supporting units corresponds to the gap in the adjacent protruding structure arrays. 4. The glued module according to claim 1, wherein each of the protruding structures further comprises a plurality of protrusions disposed on the first board along the second direction, and the height of the protrusions is lower than the height of the protrusions The height of the supporting unit, and the protrusions and the supporting units are arranged in a staggered manner. 5. The gluing module according to claim 1, further comprising: A plurality of air gaps are located between the first board and the second board. 6. A method of manufacturing a glued module, comprising: A first plate body is provided, wherein a plurality of protruding structure arrays are arranged on the first plate body along a first direction, a flow channel is formed between two adjacent protruding structure arrays, and each protruding structure array includes A plurality of support units arranged in a second direction, the first direction is different from the second direction, and there is a gap between two adjacent support units; Injecting a liquid glue onto the first plate body, the liquid glue flows through the channels and the notches; A second board is leaned against the support units so that there is a gap between the first board and the second board, and the liquid glue is distributed between the first board and the second board ;as well as The liquid glue is cured to form a colloid, the second plate is glued to the first plate and arranged with the protruding structures by the colloid, and the thickness of the colloid is equal to the height of the supporting unit. 7 . The manufacturing method of the glued module according to claim 6 , wherein two adjacent protruding structures are arranged in a misaligned manner, so that the supporting unit corresponds to the gap in the adjacent protruding structure arrays. 8. The manufacturing method of the glued mold assembly according to claim 6, wherein each of the protruding structure arrays further comprises a plurality of bumps arranged on the first board along the second direction, and the height of the bumps is The height is lower than the supporting units, and the protrusions and the supporting units are arranged in a staggered manner. 9. The manufacturing method of the glued module according to claim 6, wherein there are a plurality of air gaps between the first board and the second board.

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