CN103031014B - A kind of preparation method of non-conductive substrate powder paint coating - Google Patents

Abstract

The present invention relates to a kind of preparation method of non-conductive substrate powder paint coating, described method comprises the steps: that (1) is to non-conductive substrate coating low-viscosity (mobile) liquid resin combination; (2) to the non-conductive substrate spray coating powder paint being coated with low-viscosity (mobile) liquid resin combination, be heating and curing, form powder coating.Gained paint coating thickness of the present invention is 5 ~ 200 μm and controlled, and coating surface is smooth, coating flatness≤3 μm.Compared to conventional electrostatic spraying, can be used for non-conductive substrate, and there is the advantages such as adhesive force is good, the saving energy, technique are simple.Described method is applicable to the non-conducting materials such as timber, paper, cement, glass, plastics, pottery, is particularly useful for timber.

Description

A kind of preparation method of non-conductive substrate powder paint coating

technical field

The invention relates to a preparation method of a non-conductive substrate powder paint coating, which belongs to the field of paint coatings.

Background technique

In recent years, powder coating has become the fastest-growing coating variety due to its resource-saving, energy-saving, pollution-free, high efficiency, and easy automation. Powder coatings are mainly used to apply decorative coatings on metal objects. The paint is applied in an electrostatic field by spraying dry colored particles from a friction or electrostatically excited special applicator onto the object, and the particles adhere to the object by electrostatic force. The advantage of powder coating is that it can modify a variety of structures and surfaces, the coating is very strong, wear-resistant, and the external grade is wind-resistant. In addition, the powder coating method does not use solvents, and since the powder can be recovered and reused, there is almost no waste. The thickness of the coating on the object can be precisely controlled. Furthermore, the method is particularly suitable for coating objects with complex shapes. Finally, powder coating has flexibility and adhesive properties, so objects such as flat panels can be coated to form curls and curls after powder coating.

At present, powder coatings have also begun to be applied in some heat-sensitive materials such as wood, paper, plastic, glass and other fields. For this reason, people have actively carried out research and development on powder coating technology and achieved certain results. However, due to the most commonly used powder coating It is an electrostatic spraying method, which requires the base material to have a certain conductivity. For non-conductive or poorly conductive substrates, a layer of conductive paint is usually applied to improve conductivity before painting.

CN101342526 discloses a method for solidifying powder coatings on the surface of wood parts, but it is difficult to attach the powder coatings to the surface only by heating the wood to 60-80 ° C, and it is difficult to shape; WO01/30927 discloses coating powder coatings on non-metallic The method on the base material, but this method needs to use soluble latent catalyst for pre-coating polymer; CN101186780 discloses a kind of ultraviolet curing powder coating and its production method, coating method to solve the coating of not resistant to high temperature and thick substrate problem, but the method is limited by photocurable resin preparation technology and equipment cost; CN1226301 discloses a method for coating powder coatings on lignocellulosic material segments, but the method will remove solvent after impregnation, and low temperature curing needs to use ultraviolet light Light curing, the process is relatively complicated.

Contents of the invention

The object of the present invention is to provide a method for preparing a non-conductive base material powder paint coating. The method has simple process and uniform coating, and the surface coating of the non-conductive base material after coating is uniform, has high hardness and excellent adhesion.

In order to achieve the above object, the present invention adopts following technical scheme:

A kind of preparation method of non-conductive substrate powder coating, described method comprises the steps:

(1) Applying a low-viscosity liquid resin composition to a non-conductive substrate;

(2) Spraying a powder coating on the non-conductive substrate coated with the low-viscosity liquid resin composition, heating and curing to form a powder coating.

The present invention first adopts the low-viscosity liquid resin to coat the non-conductive substrate, and utilizes the good fluidity of the resin to infiltrate into the surface layer of the non-conductive substrate to improve the surface hardness and adhesion; in addition, the adhesion of the resin is utilized Non-adhesive powder coating, which is beneficial to control the uniformity of the coating and improve the compatibility of the coating. Due to the good miscibility of the low-viscosity liquid resin, it can be mixed with the liquid powder coating and solidified uniformly at a higher temperature, so as to realize the powder coating coating on the non-conductive substrate. Due to the good penetration of the low-viscosity liquid resin, compared with the pre-coating conductive coating process, the product obtained by the process of the present invention has stronger adhesion.

Preferably, the surface of the non-conductive substrate is pretreated before step (1). The pretreatment includes cleaning dust and dirt on the surface of the non-conductive substrate, and smoothing the rough surface.

The non-conductive substrate of the present invention is selected from any one or a mixture of at least two of wood, paper, cement, glass, plastic or ceramics, preferably wood.

The low-viscosity liquid resin composition is selected from any one or a combination of at least two of low-viscosity liquid resins, mixtures of low-viscosity liquid resins and solvents, mixtures of low-viscosity liquid resins and curing agents. The mixture of the low-viscosity liquid resin and solvent, and the mixture of low-viscosity liquid resin and curing agent are the mixture formed by diluting the low-viscosity liquid resin with solvent or curing agent. The low-viscosity liquid resin composition can be either a low-viscosity liquid resin or a mixture formed after dilution by a curing agent or a solvent, or a combination of at least two of them, all of which can realize the present invention.

The above-mentioned curing agent can adopt the commonly used or general curing agent of this kind of resin in this field, such as Baxxodur ^TM EC301, Baxxodur ^TM EC110, Baxxodur ^TM EC331, HI190BS, HI-190 of BASF; Versamid100, Versamid115, Genamid151 of German Koning ; DesmodurN3390, DesmodurN75 of Bayer, Germany; TrigonoxV388, ButanoxM-50 of AkzoNobel, preferably Baxxodur ^TM EC301 of BASF, TrigonoxV388 of AkzoNobel.

The solvent, as specific examples, alcohols such as methanol, ethanol, butanol, ethers such as ethyl cellosolve, butyl cellosolve, ethylene glycol-methyl ether, carbitol, butyl carbitol, etc. , acetone, butanone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone and other ketones, toluene, xylene, mesitylene and other aromatic hydrocarbons, ethoxy ethyl acetate, acetic acid Esters such as ethyl ester, nitrogen-containing solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc. The above-mentioned solvents can be used alone or in combination of two or more, preferably aromatic hydrocarbon solvents such as toluene, xylene, mesitylene and acetone, butanone, methyl ethyl ketone, methyl iso Butyl ketone, cyclohexanone and other ketone solvents are used in combination.

The viscosity of the low-viscosity liquid resin in the present invention is 100-2000cps/25°C, preferably 200-1200cps/25°C, particularly preferably 300-800cps/25°C.

The low-viscosity liquid resin is selected from any one or a mixture of at least two of epoxy resins, acrylic resins, silicone resins, unsaturated polyester resins or polyurethane resins, such as the mixture of epoxy resins and acrylic resins Mixture, mixture of silicone resin and unsaturated polyester resin, mixture of unsaturated polyester resin and polyurethane resin, mixture of epoxy resin, acrylic resin and silicone resin, silicone resin, unsaturated polyester resin and polyurethane resin A mixture of epoxy resin, acrylic resin, silicone resin and unsaturated polyester resin, preferably epoxy resin and/or acrylic resin, more preferably epoxy resin and acrylic resin, most preferably epoxy resin.

Preferably, the epoxy resin is preferably glycidyl ether epoxy resin or/and glycidyl ester epoxy resin, further preferably bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, glycerol ring Oxygen resin, tetrahydrophthalic dimethyl ester epoxy resin or phthalic dimethyl ester epoxy resin, any one or a mixture of at least two, most preferably bisphenol A type epoxy resin.

Preferably, the epoxy equivalent of the bisphenol A epoxy resin is 180-280 g/eq, preferably 185-210 g/eq.

The powder coating is selected from any one or a mixture of at least two of epoxy powder coatings, epoxy-polyester powder coatings, polyester powder coatings, polyurethane powder coatings, acrylic powder coatings or fluororesin powder coatings, preferably low temperature Any one or at least two of curing epoxy powder coatings, low temperature curing epoxy-polyester powder coatings, low temperature curing polyester powder coatings, low temperature curing polyurethane powder coatings, low temperature curing acrylic powder coatings or low temperature curing fluororesin powder coatings A mixture of, further preferably any one or a mixture of at least two of low temperature curing epoxy powder coatings, low temperature curing epoxy-polyester powder coatings or low temperature curing polyester powder coatings. The "low temperature curing" means that the curing temperature is lower than 140°C. The above-mentioned low-temperature curing powder coatings are commercially available, and can also be prepared by referring to the preparation methods disclosed in the prior art.

Preferably, the epoxy resin in the epoxy powder coating, epoxy-polyester powder coating, low-temperature curing epoxy powder coating and low-temperature curing epoxy-polyester powder coating is a bisphenol A type epoxy resin, and the The epoxy equivalent of the bisphenol A epoxy resin is 600-2000g/eq, preferably 600-1200g/eq.

Preferably, the polyester resin in the epoxy-polyester powder coating, polyester powder coating, low-temperature curing epoxy-polyester powder coating and low-temperature curing polyester powder coating is carboxyl-terminated polyester, and the carboxyl-terminated polyester The number average molecular weight of the ester is 2000-9000, the acid value is 15-60, and the acid value is preferably 20-40.

The acrylic resin in the acrylic powder coating and the low-temperature curing acrylic powder coating is an acrylic resin containing epoxy groups, and the epoxy equivalent is 500-2200.

The fluororesin in the fluororesin powder coating and the low-temperature curing fluororesin powder coating is a hydroxyl fluororesin with a fluorine content > 20% and a hydroxyl value of 40-50 mgKOH/g.

The composition and preparation method of the above-mentioned powder coatings are existing technologies, and those skilled in the art can obtain them from the market, or can be prepared according to the composition and methods of the powder coatings disclosed in the prior art.

The low-viscosity liquid resin composition is evenly coated on the surface of the non-conductive substrate to form a wet film, and the thickness of the wet film is controlled to be 1-100 μm, preferably 30-60 μm.

Spraying a powder coating on the non-conductive substrate coated with the low-viscosity liquid resin composition to form a dry film, controlling the thickness of the dry film to be 10-200 μm, preferably 20-50 μm.

The curing temperature is 100-200° C., preferably 100-140° C.; preferably, the curing time is 10-60 minutes, preferably 10-30 minutes.

A preparation method for a non-conductive substrate powder coating, comprising the steps of:

(1') First, pre-treat the surface of the non-conductive substrate, including cleaning the surface dust and dirt, smoothing the rough surface;

(2') Evenly coating the low-viscosity liquid resin composition on the surface of the non-conductive substrate treated in step (1') to form a wet film, controlling the thickness of the wet film to be 1-100 μm, preferably 30-60 μm;

(3') Spray powder coating on the non-conductive substrate coated with low-viscosity liquid resin composition to form a dry film, control the thickness of the dry film to be 10-200 μm, preferably 20-50 μm, and then heat and cure at a curing temperature of 100-200 μm 200°C, preferably 100~140°C; curing time is 10~60min, preferably 10~30min, to form a powder coating.

Compared with the prior art, the present invention has the following beneficial effects:

The coating thickness of the coating obtained in the invention is 5-200 μm and controllable, the coating surface is smooth and flat, and the coating flatness is ≤3 μm. Compared with the commonly used electrostatic spraying, it can be used on non-conductive substrates, and has the advantages of good adhesion, energy saving, and simple process.

Detailed ways

For better illustrating the present invention, facilitate understanding technical scheme of the present invention, typical but non-limiting embodiment of the present invention is as follows:

According to the method of the present invention, paint coatings are applied on materials such as wood, plastics, glass, ceramics, cement, etc., the adhesion test is measured according to GB/T9286-1998, the pencil hardness test is measured according to GB/T6739-1996, and the thickness test is measured according to GB/T9286-1996. /T1764-1989 determination.

Example 1:

Carry out surface pretreatment on 50cm×50cm medium density fiberboard, clean surface dust and dirt, smooth the rough surface with sandpaper; use bisphenol A type epoxy resin with a viscosity of 310cps and an epoxy equivalent of 190g/eq and 12 % Baxxodur ^TM EC301 mixture as the bottom primer, put the medium density fiberboard into the gluing machine, adjust the left and right hand wheels in the middle of the upper part of the gluing machine, adjust the feeding speed of the gluing machine to 15m/min, and control the film thickness to about 30μm. Make it evenly coated on the medium density fiberboard, check that there are no bubbles and no holes, put the coated board into the automatic spraying machine, adjust the spraying speed to 45m/min, and reciprocate spraying to make the powder coating evenly adhere to the bottom Paint, the thickness is about 50μm. The powder coating adopts low-temperature curing bisphenol A epoxy resin powder coating (see Table 1 for the dosage of each component), and then puts it into an oven at 110°C to cure for 30 minutes. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of 0 grade, a film thickness of about 80 μm, and a hardness of 2H.

Table 1 (parts by weight):

Epoxy resin E-12 35 Polyester resin CE1099 15 Dimethylimidazole 3 Leveling agent 701 4 Titanium dioxide 40 Benzoin 3

Example 2:

Carry out surface pretreatment on the 50cm×50cm glass plate, clean the surface dust and dirt, use the mixture of low-viscosity acrylic resin with a viscosity of 450cps and 15% TrigonoxV388 as the bottom primer, store it in the high-level tank, and pour it from above through the nozzle 30s, evenly on the glass plate, control the film thickness to 45μm, so that the primer is evenly coated on the glass plate, check that there are no bubbles and no holes, put the coated plate into the automatic spraying machine, and adjust the spraying speed to 30m/ Min, reciprocating spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 85 μm. The powder coating is made of acrylic powder coating (see Table 2 for the dosage of each component), and then placed in an oven at 140°C for 15 minutes to cure. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of 130 μm, and a hardness of 6H.

Table 2 (parts by weight):

Acrylic resin FB9870 70 blocked polyisocyanate 6

Dibutyltin dilaurate 1.5 Leveling agent 701 1 Titanium dioxide 20 Zinc oxide 4 Degassed wax powder 5 Benzoin 0.5

Example 3:

Carry out surface pretreatment on the 50cm×50cm plastic board, clean the surface dust and dirt, use low viscosity bisphenol A type epoxy resin with a viscosity of 600cps and an epoxy equivalent of 210g/eq as the bottom primer, and put the ABS board into the After dipping in the dipping tank for 5s, take it out, so that the primer is evenly coated on the plastic plate, with a thickness of 65 μm. After checking that there are no bubbles and holes, put the coated plate into the automatic spraying machine, and adjust the spraying speed to 25m/min. Spray back and forth to make the powder coating evenly adhere to the primer, with a thickness of about 105 μm. The powder coating is made of epoxy powder coating (see Table 3 for the dosage of each component), and then placed in an oven at 110°C for 30 minutes to cure. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of 170 μm, and a hardness of 3H.

Table 3 (parts by weight):

Epoxy resin E-06 55 sebacic acid dihydrazide 1 2-Phenylimidazoline 1.5 Leveling agent 701 3 calcium carbonate 20 Zinc oxide 20

Degassed wax powder 1 Benzoin 2

Example 4:

Carry out surface pretreatment on the 50cm×50cm ceramic plate, clean the surface dust and dirt, use low viscosity unsaturated polyester resin with a viscosity of 800cps as the bottom primer, put the ceramic plate into the roller gluer, and adjust the upper part of the roller gluer machine The left and right handwheels in the middle, adjust the speed of the rubber roller of the rubber machine to 9m/min, and control the film thickness to 95μm, so that the primer is evenly coated on the zirconia ceramic plate. After checking that there are no bubbles and no holes, put the coated plate Put it into the automatic spraying machine, adjust the spraying speed to 10m/min, and reciprocate spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 200μm. The upper powder coating is made of low-temperature curing polyester powder coating (see Table 4 for the dosage of each component), and then placed in an oven at 120°C for 25 minutes to cure. The obtained coating is flat and smooth, with a coating flatness of 2 μm, no pores and pinhole shrinkage, a coating film adhesion of 0 grade, a film thickness of 395 μm, and a hardness of 3H.

Table 4 (parts by weight):

Polyester resin XB1968-A 60 Hydroxyalkylamides 5 Cellulose acetate butyrate 3 Barium sulfate 15 Zinc oxide 15 Degassed wax powder 1 Benzoin 1

Example 5:

Carry out surface pretreatment on the 50cm×50cm thick cardboard, clean the surface dust and dirt, use glycidyl ether epoxy resin with a viscosity of 560cps as the bottom primer, put the thick cardboard into the gluing machine, and adjust the middle of the upper part of the gluing machine Left and right handwheels, adjust the feeding speed of the coating machine to 7m/min, control the film thickness to 100μm, so that the primer is evenly coated on the thick cardboard, check that there are no bubbles and no holes, and then put the coated board into the automatic spraying machine Inside, adjust the spraying speed to 15m/min, reciprocating spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 200μm. The upper layer powder coating is low-temperature curing epoxy-polyester powder coating (see Table 5 for the dosage of each component), and then placed in an oven at 100 ° C for 20 minutes to cure. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of 0 grade, a film thickness of 340 μm, and a hardness of 2H.

Table 5 (parts by weight):

Polyester resin XB1968-C 40 Epoxy resin E-03 34 2-Methylimidazoline 2 Leveling agent 503 2 Barium sulfate 15 Zinc oxide 5 Degassed wax powder 1 Benzoin 1

Example 6

Perform surface pretreatment on the 50cm×50cm ceramic plate, clean the surface dust and dirt, smooth the rough surface with sandpaper; use bisphenol A epoxy resin with a viscosity of 100cps and an epoxy equivalent of 180g/eq as the bottom layer Put the ceramic plate into the gluing machine, adjust the left and right hand wheels in the middle of the upper part of the gluing machine, adjust the feeding speed of the gluing machine to 15m/min, and control the film thickness to about 5μm, so that it can be evenly coated on the ceramic plate. After checking that there are no bubbles and no holes, put the coated board into the automatic spraying machine, adjust the spraying speed to 45m/min, and reciprocate spraying to make the powder coating evenly adhere to the primer, with a thickness of about 20μm. The powder coating adopts low-temperature curing bisphenol A epoxy resin powder coating (see Table 6 for the dosage of each component), and then puts it into an oven to cure at 100°C for 30 minutes. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of about 80 μm, and a hardness of 2H.

Table 6 (parts by weight):

Epoxy resin E-12 35 Polyester resin CE1099 15 Dimethylimidazole 3 Leveling agent 701 4 Titanium dioxide 40 Benzoin 3

Example 7

Carry out surface pretreatment on the 50cm×50cm glass plate, clean the surface dust and dirt, and smooth the rough surface with sandpaper; use bisphenol A epoxy resin with a viscosity of 2000cps and an epoxy equivalent of 280g/eq as the bottom layer Put the glass plate into the glue coating machine, adjust the left and right hand wheels in the middle of the upper part of the glue coating machine, adjust the feeding speed of the glue coating machine to 15m/min, and control the film thickness to about 100μm, so that it can be evenly coated on the glass plate. After checking that there are no bubbles and no holes, put the coated board into the automatic spraying machine, adjust the spraying speed to 45m/min, and reciprocate spraying to make the powder coating evenly adhere to the primer, with a thickness of about 150μm. Bisphenol A type epoxy resin powder coating is selected as the powder coating. The epoxy equivalent of the bisphenol A type epoxy resin is 600g/eq. The dosage of each component is shown in Table 7, and then put into an oven and cured at 200°C for 60min. The obtained coating is flat and smooth, with a coating flatness of 5 μm, no pores and pinhole shrinkage, a coating adhesion of grade 0, a film thickness of about 80 μm, and a hardness of 2H.

Table 7 (parts by weight):

Bisphenol A type epoxy resin 55 sebacic acid dihydrazide 1 2-Phenylimidazoline 1.5 Leveling agent 701 3 calcium carbonate 20 Zinc oxide 20 Degassed wax powder 1 Benzoin 2

Example 8

Carry out surface pretreatment on the 50cm×50cm ceramic plate, clean the surface dust and dirt, and smooth the rough surface with sandpaper; use bisphenol A epoxy resin with a viscosity of 1200cps and an epoxy equivalent of 230g/eq as the bottom layer Put the ceramic plate into the gluing machine, adjust the left and right hand wheels in the middle of the upper part of the gluing machine, adjust the feeding speed of the gluing machine to 15m/min, and control the film thickness to about 50μm, so that it can be evenly coated on the ceramic plate. After checking that there are no bubbles and no holes, put the coated board into the automatic spraying machine, adjust the spraying speed to 45m/min, and reciprocate spraying to make the powder coating evenly adhere to the primer, with a thickness of about 200μm. Bisphenol A type epoxy resin powder coating is selected as the powder coating. The epoxy equivalent of the bisphenol A type epoxy resin is 2000g/eq. The dosage of each component is shown in Table 8, and then put into an oven and cured at 150°C for 40min. The obtained coating is flat and smooth, with a coating flatness of 5 μm, no pores and pinhole shrinkage, a coating adhesion of grade 0, a film thickness of about 80 μm, and a hardness of 2H.

Table 8 (parts by weight):

Bisphenol A type epoxy resin 55 sebacic acid dihydrazide 1

2-Phenylimidazoline 1.5 Leveling agent 701 3 calcium carbonate 20 Zinc oxide 20 Degassed wax powder 1 Benzoin 2

Example 9

Perform surface pretreatment on the 50cm×50cm ABS plate, clean the surface dust and dirt, use bisphenol F epoxy resin with a viscosity of 560cps as the bottom primer, put the ABS plate into the gluing machine, and adjust the gluing machine The left and right hand wheels in the middle of the upper part, adjust the feeding speed of the glue applicator to 7m/min, and control the film thickness to 100μm, so that the primer is evenly coated on the cardboard. After checking that there are no bubbles and holes, put the coated ABS board into the In the automatic spraying machine, adjust the spraying speed to 15m/min, and reciprocate spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 140μm. The upper layer powder coating adopts low-temperature curing polyester powder coating. The number average molecular weight of the carboxyl-terminated polyester is 2000~9000, and the acid value is 15. The dosage of each component is shown in Table 9, and then placed in an oven at 120 ° C for 40 minutes to cure. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of 0 grade, a film thickness of 340 μm, and a hardness of 2H.

Table 9 (parts by weight):

Carboxy-terminated polyester 120 HAA curing agent 15 Leveling agent 503 2 Barium sulfate 15 Zinc oxide 5 Degassed wax powder 1

Benzoin 1

Example 10

Carry out surface pretreatment on the 50cm×50cm cement board, clean the surface dust and dirt, use the silicone resin with a viscosity of 700cps as the bottom primer, put the cement board into the glue applicator, adjust the left and right handwheels in the middle of the upper part of the glue applicator , adjust the feeding speed of the coating machine to 7m/min, control the film thickness to 600μm, so that the primer is evenly coated on the cardboard, check that there are no bubbles and no holes, and then put the coated cement board into the automatic spraying machine , adjust the spraying speed to 15m/min, reciprocating spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 150μm. The upper layer powder coating is made of low-temperature curing polyester powder coating. The number average molecular weight of the carboxyl-terminated polyester is 2000~9000, and the acid value is 60. The dosage of each component is shown in Table 10, and then placed in an oven at 120 ° C for 40 minutes to cure. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of 0 grade, a film thickness of 340 μm, and a hardness of 2H.

Table 10 (parts by weight):

Carboxy-terminated polyester 120 HAA curing agent 15 Leveling agent 503 2 Barium sulfate 15 Zinc oxide 5 Degassed wax powder 1 Benzoin 1

Example 11

Carry out surface pretreatment on the 50cm×50cm ceramic plate, clean the dust and dirt on the surface, use low-viscosity polyurethane resin with a viscosity of 200cps as the bottom primer, put the ceramic plate into the roller gluer, and adjust the left and right handwheels in the upper middle of the roller gluer machine , adjust the speed of the rubber roller of the roller rubber machine to 9m/min, and control the film thickness to 95μm, so that the primer is evenly coated on the ceramic plate, and after checking that there are no bubbles and holes, put the coated plate into the automatic spraying machine , adjust the spraying speed to 10m/min, reciprocating spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 160μm. The upper powder coating is made of acrylic powder coating. The acrylic resin in the acrylic powder coating is an acrylic resin containing epoxy groups, and the epoxy equivalent is 500g/eq (see Table 11 for the dosage of each component). Cured in the oven for 25 minutes. The obtained coating was flat and smooth, with a coating flatness of 2 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of 395 μm, and a hardness of 3H.

Table 11 (parts by weight):

Acrylic 85 Adipic acid 10 Leveling agent 701 1 Epoxy resin E-16 3.5 Benzoin 0.5

Example 12

Carry out surface pretreatment on the 50cm×50cm ceramic plate, clean the dust and dirt on the surface, use low-viscosity polyurethane resin with a viscosity of 200cps as the bottom primer, put the ceramic plate into the roller gluer, and adjust the left and right handwheels in the upper middle of the roller gluer machine , adjust the speed of the rubber roller of the roller rubber machine to 9m/min, and control the film thickness to 95μm, so that the primer is evenly coated on the ceramic plate, and after checking that there are no bubbles and holes, put the coated plate into the automatic spraying machine , adjust the spraying speed to 10m/min, reciprocating spraying, so that the powder coating is evenly adhered to the primer, and the thickness is about 180μm. The upper layer powder coating is made of acrylic powder coating. The acrylic resin in the acrylic powder coating is an acrylic resin containing epoxy groups, and the epoxy equivalent is 2200g/eq (see Table 11 for the dosage of each component). Cured in the oven for 25 minutes. The obtained coating was flat and smooth, with a coating flatness of 2 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of 395 μm, and a hardness of 3H.

Table 12 (parts by weight):

Acrylic 85 dodecanedicarboxylic acid 10 Leveling agent 503 1 Epoxy resin E-16 3.5 Benzoin 0.5

Example 13

Perform surface pretreatment on the 50cm×50cm ABS board, clean the surface dust and dirt, use low viscosity bisphenol A epoxy resin with a viscosity of 600cps and an epoxy equivalent of 210g/eq as the bottom primer, and put the ABS board into the dipping Take it out after dipping in the pool for 5s, so that the primer is evenly coated on the plastic plate with a thickness of 65 μm. After checking that there are no bubbles and no holes, put the coated ABS plate into the automatic spraying machine, and adjust the spraying speed to 25m/min. Spray back and forth to make the powder coating evenly adhere to the primer, with a thickness of about 105 μm. The powder coating is made of fluororesin powder coating. The fluororesin in the fluororesin powder coating is hydroxyl fluororesin, the fluorine content is greater than 20%, and the hydroxyl value is 40mgKOH/g. Cured in the oven for 30 minutes. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of 170 μm, and a hardness of 3H.

Table 13 (parts by weight):

Hydroxy Fluorine Resin 68 Blocked isophorone isocyanate 15

Leveling agent 701 1 Titanium dioxide 15 Benzoin 1

Example 14

Perform surface pretreatment on 50cm×50cmABS, clean surface dust and dirt, use low-viscosity bisphenol A epoxy resin with a viscosity of 600cps and an epoxy equivalent of 210g/eq as the bottom primer, and put the ABS board into the dipping tank Take it out after dipping for 5s, so that the primer is evenly coated on the plastic plate with a thickness of 65 μm. After checking that there are no bubbles and no holes, put the coated ABS plate into the automatic spraying machine, adjust the spraying speed to 25m/min, reciprocate Spray to make the powder coating evenly adhere to the primer, the thickness is about 105μm. The powder coating is made of fluororesin powder coating. The fluororesin in the fluororesin powder coating is hydroxyl fluororesin, the fluorine content is greater than 20%, and the hydroxyl value is 50mgKOH/g. Cured in the oven for 30 minutes. The obtained coating is flat and smooth, with a coating flatness of 3 μm, no pores and pinhole shrinkage, a coating film adhesion of grade 0, a film thickness of 170 μm, and a hardness of 3H.

Table 14 (parts by weight):

Hydroxy Fluorine Resin 63 Blocked isophorone isocyanate 15 Leveling agent 503 1 Titanium dioxide 20 Benzoin 1

It should be noted and understood that various modifications and improvements can be made to the invention described in detail above without departing from the spirit and scope of the invention as claimed in the appended claims. Accordingly, the scope of the claimed technical solution is not limited by any particular exemplary teaching given.

The applicant declares that the present invention illustrates the detailed methods of the present invention through the above-mentioned examples, but the present invention is not limited to the above-mentioned detailed methods, that is, it does not mean that the present invention can only be implemented depending on the above-mentioned detailed methods. Those skilled in the art should understand that any improvement of the present invention, the equivalent replacement of each raw material of the product of the present invention, the addition of auxiliary components, the selection of specific methods, etc., all fall within the scope of protection and disclosure of the present invention.

Claims (31)

1. a preparation method for non-conductive substrate powder paint coating, is characterized in that, described method comprises the steps:

(1) to non-conductive substrate coating low-viscosity (mobile) liquid resin combination, described low-viscosity (mobile) liquid resin combination is selected from the combination of any one or at least two kinds in the mixture of the mixture of low-viscosity (mobile) liquid resin, low-viscosity (mobile) liquid resin and solvent, low-viscosity (mobile) liquid resin and curing agent, and the viscosity of described low-viscosity (mobile) liquid resin is 100 ~ 2000cps/25 DEG C;

(2) to the non-conductive substrate spray coating powder paint being coated with low-viscosity (mobile) liquid resin combination, be heating and curing, form powder coating;

Wherein, by low-viscosity (mobile) liquid resin combination even application on non-conductive substrate surface, wet film is formed, the thickness controlling wet film is 1 ~ 100 μm, to the non-conductive substrate spray coating powder paint being coated with low-viscosity (mobile) liquid resin combination, form dry film, controlling build is 10 ~ 200 μm.

2. the method for claim 1, is characterized in that, step (1) is front carries out pretreatment to non-conductive substrate surface, and described pretreatment comprises cleaning non-conductive substrate surface dirt and dirt, and rough surface is polished polishing.

3. method as claimed in claim 1 or 2, is characterized in that, described non-conductive substrate is selected from the mixture of any one or at least two kinds in timber, paper, cement, glass, plastics or pottery.

4. method as claimed in claim 3, it is characterized in that, described non-conductive substrate is selected from timber.

5. the method for claim 1, is characterized in that, the viscosity of described low-viscosity (mobile) liquid resin is 200 ~ 1200cps/25 DEG C.

6. method as claimed in claim 5, it is characterized in that, the viscosity of described low-viscosity (mobile) liquid resin is 300 ~ 800cps/25 DEG C.

7. the method for claim 1, is characterized in that, described low-viscosity (mobile) liquid resin is selected from the mixture of any one or at least two kinds in epoxy resin, acrylic resin, organic siliconresin, unsaturated polyester resin or polyurethane resin.

8. method as claimed in claim 7, it is characterized in that, described low-viscosity (mobile) liquid resin is selected from epoxy resin and/or acrylic resin.

9. method as claimed in claim 8, it is characterized in that, described low-viscosity (mobile) liquid resin is selected from epoxy resin and acrylic resin.

10. method as claimed in claim 7, it is characterized in that, described low-viscosity (mobile) liquid resin is selected from epoxy resin.

11. methods as claimed in claim 7, is characterized in that, described epoxy resin is that tetraglycidel ether epoxy resin is or/and ethylene oxidic ester epoxy resin.

12. methods as claimed in claim 11, it is characterized in that, described epoxy resin is the mixture of any one or at least two kinds in bisphenol A type epoxy resin, bisphenol f type epoxy resin, novolac epoxy resin, glycerol epoxy resin, tetrahydrobenzene dimethyl ester epoxy resin or O-phthalic ester epoxy resin.

13. methods as claimed in claim 12, it is characterized in that, described epoxy resin is bisphenol A type epoxy resin.

14. methods as claimed in claim 13, is characterized in that, the epoxide equivalent of described bisphenol A type epoxy resin is 180 ~ 280g/eq.

15. methods as claimed in claim 14, is characterized in that, the epoxide equivalent of described bisphenol A type epoxy resin is 185 ~ 210g/eq.

16. the method for claim 1, it is characterized in that, described powdery paints is selected from the mixture of any one or at least two kinds in epoxide powder coating, epoxy-polyester powder coating, polyester powder coating, polyurethane powder coating, acrylic acid powder coatings or fluororesin powder coating.

17. methods as claimed in claim 16, it is characterized in that, described powdery paints is selected from the mixture of any one or at least two kinds in Low-Temperature Curable Epoxy Powder Paint, temperature curing epoxy low-polyester powder coating, low-temperature setting polyester powder coating, low-temperature setting polyurethane powder coating, low-temperature setting acrylic acid powder coatings or low-temperature setting fluororesin powder coating, and described low-temperature setting refers to that solidification temperature is lower than 140 DEG C.

18. methods as claimed in claim 17, is characterized in that, described powdery paints is selected from the mixture of any one or at least two kinds in Low-Temperature Curable Epoxy Powder Paint, temperature curing epoxy low-polyester powder coating or low-temperature setting polyester powder coating.

19. methods as claimed in claim 17, it is characterized in that, epoxy resin in Low-Temperature Curable Epoxy Powder Paint and temperature curing epoxy low-polyester powder coating is bisphenol A type epoxy resin, and the epoxide equivalent of described bisphenol A type epoxy resin is 600 ~ 2000g/eq.

20. methods as claimed in claim 19, is characterized in that, the epoxide equivalent of described bisphenol A type epoxy resin is 600 ~ 1200g/eq.

21. methods as claimed in claim 17, it is characterized in that, mylar in described temperature curing epoxy low-polyester powder coating and low-temperature setting polyester powder coating is terminal carboxyl polyester, and the number-average molecular weight of described terminal carboxyl polyester is 2000 ~ 9000, and acid number is 15 ~ 60.

22. methods as claimed in claim 21, it is characterized in that, acid number is 20 ~ 40.

23. methods as claimed in claim 17, is characterized in that, the acrylic resin in described low-temperature setting acrylic acid powder coatings is the acrylic resin containing epoxide group, and epoxide equivalent is 500 ~ 2200g/eq.

24. methods as claimed in claim 17, is characterized in that, the fluororesin in described low-temperature setting fluororesin powder coating is hydroxyl fluororesin, fluorinated volume > 20%, and hydroxyl value is 40 ~ 50mgKOH/g.

25. the method for claim 1, is characterized in that, by low-viscosity (mobile) liquid resin combination even application on non-conductive substrate surface, form wet film, the thickness controlling wet film is 30 ~ 60 μm.

26. the method for claim 1, is characterized in that, to the non-conductive substrate spray coating powder paint being coated with low-viscosity (mobile) liquid resin combination, form dry film, controlling build is 20 ~ 50 μm.

27. the method for claim 1, is characterized in that, the temperature of described solidification is 100 ~ 200 DEG C.

28. methods as claimed in claim 27, is characterized in that, the temperature of described solidification is 100 ~ 140 DEG C.

29. the method for claim 1, is characterized in that, described hardening time is 10 ~ 60min.

30. methods as claimed in claim 29, it is characterized in that, described hardening time is 10 ~ 30min.

31. the method for claim 1, is characterized in that, described method comprises the steps:

(1 ') first carries out pretreatment to non-conductive substrate surface, comprises cleaning surface dirt and dirt, rough surface is polished polishing;

Low-viscosity (mobile) liquid resin combination is evenly coated on the non-conductive substrate surface that step (1 ') processed by (2 '), and form wet film, controlling wet-film thickness is 1 ~ 100 μm;

(3 '), to the non-conductive substrate spray coating powder paint being coated with low-viscosity (mobile) liquid resin combination, forms dry film, and controlling build is 10 ~ 200 μm, and be then heating and curing, solidification temperature is 100 ~ 200 DEG C; Hardening time is 10 ~ 60min, forms powder coating.