CN103029035A - Polishing pad and loss detecting method during polishing by using same - Google Patents
Polishing pad and loss detecting method during polishing by using same Download PDFInfo
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- CN103029035A CN103029035A CN2012104939787A CN201210493978A CN103029035A CN 103029035 A CN103029035 A CN 103029035A CN 2012104939787 A CN2012104939787 A CN 2012104939787A CN 201210493978 A CN201210493978 A CN 201210493978A CN 103029035 A CN103029035 A CN 103029035A
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Abstract
The invention relates to the field of semiconductor manufacture, and in particular relates to a polishing pad and a loss detecting method during polishing by using the same. According to the invention, a plurality of detection inclined holes are preset in the polishing pad provided with a polishing groove, when the loss of the polishing pad is needed to be detected in a polishing process, through measuring the distance between one detection inclined hole in the polishing pad subjected to the polishing process and the groove and using a preset numerical value and a formula aiming at the groove, the abrasion condition of the polishing pad in the detection inclined hole is figured out, and same process steps are continuously carried out on other detection inclined holes, therefore, the abrasion condition of all the surface of the polishing pad in the polishing process can be detected in real time, and further the purpose of fully utilizing the polishing pad is achieved so that the cost of the polishing process is lowered.
Description
Technical field
The present invention relates to field of semiconductor manufacture, the loss detection method when relating in particular to a kind of grinding pad and utilizing this grinding pad to grind.
Background technology
In wafer is made, along with dwindling of upgrading, wire and the grid size of process technique, photoetching (Lithography) technology is more and more higher to the requirement of the smooth degree (Non-uniformity) of crystal column surface, cmp (Chemical Mechanical Polishing is called for short CMP) technique is widely used; CMP be one by chemical reaction process and the coefficient technique of mechanical lapping process, in process of lapping, apply certain pressure by grinding head at wafer rear, cause wafer frontside to be close to grinding pad, and the simultaneous grinding head drives wafer and the equidirectional rotation of grinding pad, so that wafer frontside and grinding pad produce mechanical friction, by lapping liquid wafer is ground simultaneously, namely remove the film of crystal column surface by machinery and the chemical action of series of complex, thereby reach the purpose of wafer planarization.
Fig. 1 is the top view of traditional grinding pad in the background technology of the present invention; As shown in Figure 1, in order to increase the frictional force of wafer and grinding pad, and improve simultaneously the distributing homogeneity of lapping liquid in the prior art, at grinding pad 1 groove 2 that a plurality of one-tenth concentric circles distribute is set; When carrying out grinding technics, because the mechanical friction between wafer and the grinding pad 1, the lip-deep material of grinding pad 1 is inevitably lossy, and along with the increase of milling time, loss also increases, and the degree of depth of the groove 2 on the grinding pad 1 can shoal gradually.
Fig. 2 is the grinding pad thickness schematic diagram of traditional grinding pad diverse location near its practical life-span time the in the background technology of the present invention, and transverse axis represents grinding pad from the distance (unit is inch) at its center, and the longitudinal axis represents the thickness (unit is mils) of grinding pad; Because when carrying out grinding technics, the diverse location effect of wafer and the pressure of grinding pad are inhomogeneous, and has the motion of rotating and sliding relative to grinding pad, diverse location to grinding pad when causing grinding wafer technique produces different losses, along with the increase of process time, the thinner thickness in the zone that the meeting specific loss of loss zone how is few; As shown in Figure 2, at grinding pad during near its service life, its apart near the grinding pad thickness the grinding pad centre distance all about 70mils, and the thickness of grinding pad fringe region (distance center point is more than or equal to the zone of 15inch) is more than 75mils, even can reach 80mils, namely obviously the thin thickness compared with fringe region is a lot of for the zone line of grinding pad.
Fig. 3 is the schematic diagram that concerns between the coefficient of friction of grinding pad in the background technology of the present invention and the milling time, and transverse axis represents milling time (unit is H), and the longitudinal axis represents coefficient of friction; Known, the grinding pad degree of wear can have a strong impact on grinding rate, and namely along with the increase of the grinding pad degree of wear, the coefficient of friction of grinding pad presents the trend that reduces; As shown in Figure 3, proceed to 2 hours at grinding technics (H) afterwards, grind coefficient and sharply drop to below 0.85 from 0.95, and the decline that reduces to cause grinding rate of grinding coefficient, and then increase the grinding technics time.
Concern schematic diagram in Fig. 4 background technology of the present invention between the grinding rate of grinding pad and the milling time, transverse axis represents milling time (pad age), and unit is H, and the longitudinal axis represents grinding rate (removal rate), and unit is A/min; As shown in Figure 4, along with the increase grinding rate of milling time also presents downward trend, especially after milling time was more than or equal to 2 hours, grinding rate also is rapid from dropping near 5400A/min near the 5200A/min.
Because grinding rate, grinding pad coefficient of friction and milling time are identical variation tendency, all are reductions rapid along with the increase of milling time, therefore the loss of grinding pad are monitored timely and effectively just very necessary.
Under the prior art condition, the service life of grinding pad is in such a way definition mainly: the milling time that 1. defines grinding pad; 2. define the wafer number that the applied abrasive pad grinds; 1. and 2. 3. simultaneously definition and is defined as service life with the first comer.But, above-mentioned monitoring mode has certain limitation, when different wafers is carried out grinding technics, because it membranously can cause the loss different to grinding pad with the different of grinding pressure the wafer of different product, therefore the loss meeting is very different under identical milling time, and is same, under the prerequisite of identical grinding crystal wafer number, if what grind is the wafer of different product, its loss meeting to grinding pad is different; Be present grinding pad monitoring method for different wafers when same grinding pad carries out grinding technics, can not detect in real time the abrasion condition of grinding pad, and then cause grinding pad not to be fully utilized, increase production cost.
Summary of the invention
For the problem of above-mentioned existence, the present invention has disclosed a kind of grinding pad, mainly is by a plurality of detection inclined holes are set to be used for detecting in real time grinding pad in the technique of the loss situation at each position of grinding technics at grinding pad.
The objective of the invention is to be achieved through the following technical solutions:
A kind of grinding pad is provided with the grinding groove on the described grinding pad, wherein, described grinding is paid somebody's debt and expected repayment later and is provided with a plurality of detection inclined holes.
Above-mentioned grinding pad, wherein, described detection inclined hole extends to its inner blind hole for the upper surface from described grinding pad.
Above-mentioned grinding pad, wherein, the distance between the described groove that the openend of described detection inclined hole is adjacent is 1-20mm.
Above-mentioned grinding pad, wherein, the angle on described detection inclined hole and described grinding pad surface is 20 °-80 °.
Above-mentioned grinding pad, wherein, the number of described detection inclined hole is 3-50.
Above-mentioned grinding pad wherein, does not contact between described detection inclined hole and the described grinding groove.
Above-mentioned grinding pad, wherein, described detection inclined hole is perpendicular to the degree of depth on the described grinding pad surface degree of depth less than described grinding groove, and grinds the default degree of depth of groove when arriving service life greater than described grinding pad.
Above-mentioned grinding pad, wherein, the diameter of the openend of described detection inclined hole is less than the diameter of described grinding groove.
Above-mentioned grinding pad, wherein, a plurality of described detection inclined holes are arranged on described grinding falls uniformly.
A kind of method of grinding pad being carried out the loss detection is applied in the grinding technics, comprises the described grinding pad of above-mentioned any one, may further comprise the steps:
When in carrying out grinding technics, needing grinding pad carried out loss and detect, the upper surface distance one of measuring described detection inclined hole grind between the groove apart from x1;
According to the wearing and tearing computing formula
△ h detects inclined hole place grinding pad wear-thickness for this, X is that the openend of this default detection inclined hole of grinding pad is apart from the distance between this grinding groove, θ is angle between this surface of detecting inclined hole and grinding pad, and x1 is that the openend of this detection inclined hole behind the grinding pad grinding technics is apart from the distance between this grinding groove.
In sum, a kind of grinding pad of the present invention and the loss detection method when utilizing this grinding pad to grind, by being provided with the default a plurality of detection inclined holes of the grinding pad that grinds groove, when needing in carrying out grinding technics to grinding pad that loss detects, carry out detecting on the grinding pad behind the grinding technics distance between inclined hole and the groove by measurement, and preset numerical value and formula for this groove utilization, calculate this grinding pad at the abrasion condition at this detection inclined hole place, and continue to detect inclined hole to other each and carry out identical processing step, with this grinding pad of detection surperficial all abrasion conditions of position in grinding technics that can be real-time, and then reach the purpose that takes full advantage of this grinding pad, to reduce the grinding technics cost.
Description of drawings
Fig. 1 is the top view of traditional grinding pad in the background technology of the present invention;
Fig. 2 is the grinding pad thickness schematic diagram of traditional grinding pad diverse location near its practical life-span time the in the background technology of the present invention, and transverse axis represents grinding pad from the distance (unit is inch) at its center, and the longitudinal axis represents the thickness (unit is mils) of grinding pad;
Fig. 3 is the schematic diagram that concerns between the coefficient of friction of grinding pad in the background technology of the present invention and the milling time, and transverse axis represents milling time (unit is H), and the longitudinal axis represents coefficient of friction;
Concern schematic diagram in Fig. 4 background technology of the present invention between the grinding rate of grinding pad and the milling time, transverse axis represents milling time (pad age), and unit is H, and the longitudinal axis represents grinding rate (removal rate), and unit is A/min;
Fig. 5 is the default structural representation of grinding pad of the present invention;
Fig. 6 is the structural representation that carried out in the grinding pad of the present invention behind the grinding technics.
The specific embodiment
Below in conjunction with accompanying drawing the specific embodiment of the present invention is further described:
Fig. 5 is the default structural representation of grinding pad of the present invention, and Fig. 6 is the structural representation that carried out in the grinding pad of the present invention behind the grinding technics; As shown in Figure 5, a kind of grinding pad 1 of the present invention, be mainly used in wafer planarization metallization processes such as chemical mechanical milling tech (Chemical Mechanical Polishing, be called for short CMP) etc., be provided with a plurality of grinding grooves 2 on this grinding pad 1, relatively more commonly used is to be set to a plurality of concentric circles by a plurality of grinding grooves 2; Between upper a plurality of grinding grooves 2 of this grinding pad 1, also offer a plurality of detection inclined holes 3, to be used for when this grinding pad 1 carries out grinding technics the loss situation of real-time measurement grinding pad surface each several part.
Further, 3-50 is detected inclined hole 3 and is arranged on uniformly on the grinding pad 1, so that when grinding technics, each several part on the surface of grinding pad 1 is carried out real-time detection, the preferred number that detects inclined hole 3 can be set to 3,15,25,35,40 or 50, and these a plurality of detection inclined holes 3 are from the upper surface of grinding pad 1 and extend to its inner blind hole, and the surface plane of grinding pad 1 is the angle theta between 20 °-80 °, could measure comparatively accurately like this and carry out the grinding technics front and back, detect inclined hole 3 with respect to the variable in distance between the same grinding groove 2, preferably 20 ° of angle theta, 40 °, 60 ° or 80 °; Wherein, the scope of the distance X between the grinding groove 2 that the openend of each detection inclined hole 3 is adjacent is between 1-20mm, and with the detection inclined hole 3 and 2 break-through of grinding groove that prevent from arranging, the value of X is 1mm, 10mm or 20mm preferably.
Preferably, each detect inclined hole 3 perpendicular to the depth d on the surface of grinding pad 1 less than the depth D of grinding groove 2, and d grinds the degree of depth L that groove 2 is preset when arriving service life greater than grinding pad 1, be D＞d＞L, penetrate grinding pad 1 with the detection inclined hole 3 that prevents from arranging, can prevent again to detect simultaneously inclined hole 3 and before grinding pad 1 arrives physical life, lose efficacy.
Further, each detects the diameter r of openend of inclined hole 3 all less than the diameter R that grinds groove 2, and affects the grinding effect of grinding pad 2 for the detection inclined hole 3 that prevents from arranging, all can not break-through between arbitrary detection inclined hole 3 and the arbitrary grinding groove 3.
Shown in Fig. 5-6, the present invention also provides a kind of and has utilized above-mentioned grinding pad in grinding technics this grinding pad to be carried out the method that real-time loss detects:
At first, as shown in Figure 5, before utilizing grinding pad 1 to carry out grinding technics such as CMP etc., on this grinding pad 1 each detected inclined hole 3 with respect to apart from the recording apart from x of the grinding groove 2 of its minimum distance, and the value that will detect simultaneously the angle theta between inclined hole 3 and grinding pad 1 top surface plane is recorded also; Wherein, the angle Y of above-mentioned detection inclined hole 3 and the grinding groove 2 corresponding with it formation during to grinding pad 1 inner the extension between 10 °-70 °, and θ and Y addition and be 90 °.
Secondly, as shown in Figure 6, after grinding pad 1 carries out grinding technics, in the time of need to carrying out loss to the grinding pad 1 after the wearing and tearing and detect, measure each detect between inclined hole 3 and the grinding groove 2 corresponding with it apart from x1.
At last, utilize formula trigonometric function formula
Calculate the wear-thickness that each detects inclined hole 3 place's grinding pads 1, because X, x1 and θ are all known, thus can obtain the value of the grinding pad wear-thickness △ h of this detection inclined hole place by calculating, and then determine that this detects the grinding pad wear-thickness at inclined hole place; Wherein, △ h detects inclined hole place grinding pad wear-thickness for this, X is that the openend of this default detection inclined hole of grinding pad is apart from the distance between this grinding groove, θ is angle between this surface of detecting inclined hole and grinding pad, and x1 is that the openend of this detection inclined hole behind the grinding pad grinding technics is apart from the distance between this grinding groove.
Wherein, above-mentioned formula
Derivation be:
①
1. and 2. can get △ h=h-h1=by formula
Wherein, h is the degree of depth of grinding groove to the inner extension of grinding pad infall to the grinding pad surface that this detection Kong Chu is corresponding with it before grinding technics, h is the degree of depth of grinding groove to the inner extension of grinding pad infall to the grinding pad surface that this detection Kong Chu is corresponding with it behind grinding technics, △ h detects inclined hole place grinding pad wear-thickness for this, X is that the openend of this default detection inclined hole of grinding pad is apart from the distance between this grinding groove, θ is angle between this surface of detecting inclined hole and grinding pad, and x1 is that the openend of this detection inclined hole behind the grinding pad grinding technics is apart from the distance between this grinding groove.
In sum, owing to having adopted technique scheme, loss detection method when the embodiment of the invention proposes a kind of grinding pad and utilizes this grinding pad to grind, by being provided with the default a plurality of detection inclined holes of the grinding pad that grinds groove, when needing in carrying out grinding technics to grinding pad that loss detects, carry out detecting on the grinding pad behind the grinding technics distance between inclined hole and the groove by measurement, and preset numerical value and formula for this groove utilization, calculate this grinding pad at the abrasion condition at this detection inclined hole place, and continue to detect inclined hole to other each and carry out identical processing step, with this grinding pad of detection surperficial all abrasion conditions of position in grinding technics that can be real-time, and then reach the purpose that takes full advantage of this grinding pad, to reduce the grinding technics cost.
By explanation and accompanying drawing, provided the exemplary embodiments of the ad hoc structure of the specific embodiment, based on the present invention's spirit, also can do other conversion.Although foregoing invention has proposed existing preferred embodiment, yet these contents are not as limitation.
For a person skilled in the art, read above-mentioned explanation after, various changes and modifications undoubtedly will be apparent.Therefore, appending claims should be regarded whole variations and the correction of containing true intention of the present invention and scope as.Any and all scope of equal value and contents all should be thought still to belong in the intent of the present invention and the scope in claims scope.
Claims (10)
1. a grinding pad is provided with the grinding groove on the described grinding pad, it is characterized in that, described grinding is paid somebody's debt and expected repayment later and is provided with a plurality of detection inclined holes.
2. grinding pad according to claim 1 is characterized in that, described detection inclined hole extends to its inner blind hole for the upper surface from described grinding pad.
3. grinding pad according to claim 1 is characterized in that, the distance between the described groove that the openend of described detection inclined hole is adjacent is 1-20mm.
4. grinding pad according to claim 1 is characterized in that, the angle on described detection inclined hole and described grinding pad surface is 20 °-80 °.
5. grinding pad according to claim 1 is characterized in that, the number of described detection inclined hole is 3-50.
6. grinding pad according to claim 1 is characterized in that, does not contact between described detection inclined hole and the described grinding groove.
7. grinding pad according to claim 1 is characterized in that, described detection inclined hole is perpendicular to the degree of depth on the described grinding pad surface degree of depth less than described grinding groove, and grinds the default degree of depth of groove when arriving service life greater than described grinding pad.
8. grinding pad according to claim 1 is characterized in that, the diameter of the openend of described detection inclined hole is less than the diameter of described grinding groove.
9. grinding pad according to claim 1 is characterized in that, a plurality of described detection inclined holes are arranged on described grinding falls uniformly.
10. a method of grinding pad being carried out the loss detection is applied in the grinding technics, comprises the described grinding pad of any one among the claim 1-9, it is characterized in that, may further comprise the steps:
When in carrying out grinding technics, needing grinding pad carried out loss and detect, the upper surface distance one of measuring described detection inclined hole grind between the groove apart from x1;
According to the wearing and tearing computing formula
△ h detects inclined hole place grinding pad wear-thickness for this, X is that the openend of this default detection inclined hole of grinding pad is apart from the distance between this grinding groove, x1 be the openend of this detection inclined hole behind the grinding pad grinding technics apart from the distance between this grinding groove, θ is that this detects angle between the surface of inclined hole and grinding pad.
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| CN201210493978.7A CN103029035B (en) | 2012-11-28 | 2012-11-28 | Polishing pad and loss detecting method during polishing by using same |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108692634A (en) * | 2017-03-29 | 2018-10-23 | 株式会社日立产机系统 | The wear detecting method of steel wire rope groove in electrical hoist and electrical hoist |
| CN109590893A (en) * | 2019-01-04 | 2019-04-09 | 京东方科技集团股份有限公司 | Utilize the grinding method of grinding system, grinding system |
| CN110774171A (en) * | 2018-07-27 | 2020-02-11 | 台湾积体电路制造股份有限公司 | Apparatus and method for chemical mechanical polishing |
| CN114700869A (en) * | 2022-04-14 | 2022-07-05 | 上海华力集成电路制造有限公司 | A system and using method for judging the wear degree and life of polishing pad |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108692634A (en) * | 2017-03-29 | 2018-10-23 | 株式会社日立产机系统 | The wear detecting method of steel wire rope groove in electrical hoist and electrical hoist |
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| CN109590893B (en) * | 2019-01-04 | 2021-01-26 | 京东方科技集团股份有限公司 | Grinding method using grinding system and grinding system |
| CN114700869A (en) * | 2022-04-14 | 2022-07-05 | 上海华力集成电路制造有限公司 | A system and using method for judging the wear degree and life of polishing pad |
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