CN103022680B - Phase-calibrated 3D-package surface antenna with embedded plated through holes - Google Patents

Abstract

The invention relates to a three-dimensional packaged surface antenna for phase alignment embedded with metallized vias, which relates to a horn antenna. The antenna includes a metallized vertical via hole feeder (1), a horn antenna (2) and a metallized via hole (3) integrated on a dielectric substrate (4). Above, one end of the metallized vertical via hole feeder (1) is connected to the internal circuit (8), and the horn antenna (2) consists of a bottom metal plane (6), a top metal plane (9) and a side wall of the metallized via hole (11) Composition, the via hole array (16) that is made of metallized via hole (3) forms a plurality of dielectric-filled waveguides (17) in the horn antenna (2), and a port of the dielectric-filled waveguide (17) is towards the narrow-section waveguide ( 13) in the direction of the short-circuit surface (15), another port (18) stretches to the aperture surface (12) of the horn antenna, but not on the antenna aperture surface (12). This antenna can increase the gain.

Description

Three-dimensional surface-on-package antenna for phase alignment with embedded metallized vias

technical field

The invention relates to a horn antenna, in particular to a three-dimensional packaged surface antenna embedded with metallized via holes for phase calibration.

Background technique

Using micro-assembly technology, a radio frequency system can be integrated in a package, for which the antenna also needs to be integrated on the surface of the package. It is a natural way to integrate a patch antenna on the surface of the package, but the main radiation direction of the patch antenna is the normal direction of the surface, and the main radiation direction we sometimes need is along the surface direction. If the horn antenna is integrated on the surface of the package, the radiation along the surface direction can be realized. However, horn antennas are usually non-planar, incompatible with planar circuit technology, and have large geometric dimensions, which limits their application in packaging structures. In recent years, the substrate-integrated waveguide horn antenna developed based on substrate-integrated waveguide technology has the characteristics of small size, light weight, and easy planar integration, but the gain of the traditional substrate-integrated waveguide horn antenna is relatively low. The reason is that the horn The continuous opening of the mouth causes the phase out of synchronization when the electromagnetic wave propagates to the horn's aperture surface, the phase distribution of the electric field intensity of the aperture is uneven, and the radiation directivity and gain decrease. At present, methods such as dielectric loading and dielectric prisms have been used to correct the phase of the horn aperture field, but these phase calibration structures increase the overall structural size of the antenna and are not suitable for integration into the package surface.

Contents of the invention

Technical problem: The purpose of this invention is to propose a three-dimensional packaged surface antenna with embedded metallized vias for phase calibration. The horn antenna is embedded with an array of metallized vias to correct the phase inconsistency of electromagnetic waves on the antenna aperture surface and reduce The number of zero field areas on the aperture surface improves the aperture efficiency and gain of the antenna.

Technical solution: The three-dimensional encapsulated surface antenna for phase alignment embedded with metallized vias of the present invention includes a metallized vertical via hole feeder, a substrate integrated waveguide horn antenna, and embedded metallized vias on a dielectric substrate. The top of the three-dimensional package; the metallized vertical via hole feeder is connected to the internal circuit of the three-dimensional package; the substrate integrated waveguide horn antenna consists of a bottom metal plane on one side of the dielectric substrate, a top metal plane on the other side of the dielectric substrate and a through-hole The metallized via hole horn side wall is connected to the bottom metal plane and the top metal plane through the dielectric substrate; the metallized via hole embedded in the substrate integrated waveguide horn antenna connects the bottom metal plane and the top metal plane, and constitutes the metallization process. Hole array; metallized via array and metallized via horn sidewalls form multiple dielectric-filled waveguides in the horn antenna.

One end of the metallized vertical via feeder passes through the round hole on the metal plane on the bottom surface of the dielectric substrate to connect with the internal circuit of the three-dimensional package, and the other end has a circular pad at the top, and the top circular pad of the metallized vertical via feeder 10 In the center of the circular hole on the top metal plane of the dielectric substrate, the circular pad at the top of the metallized vertical via feeder line has no direct electrical contact with the top metal plane of the dielectric substrate.

The substrate integrated waveguide horn antenna is composed of a narrow-section waveguide and a horn-shaped waveguide connected in series; one end of the narrow-section waveguide is a short-circuit surface, the other end of the narrow-section waveguide is connected to the horn-shaped waveguide, and one end of the horn-shaped waveguide is connected to the narrow-section waveguide. The other end of the horn waveguide is the antenna aperture face.

One port of the dielectric-filled waveguide faces the direction of the short-circuit surface of the narrow-section waveguide, and the other port of the dielectric-filled waveguide rises flat and extends toward the aperture surface of the horn antenna, but its position is not on the antenna aperture surface.

The width of the dielectric-filled waveguide should ensure that its main mode can be transmitted in the dielectric-filled waveguide (17) without being cut off.

In the metallized via line array, adjust the distance between two adjacent metallized via line arrays, or adjust the distance between a line of metallized via line array and the side wall metallized via hole of the substrate integrated waveguide horn antenna (2). The distance between them can change the width of the dielectric-filled waveguide, and then adjust the phase velocity of electromagnetic wave propagation in the dielectric-filled waveguide (17), so that the phase distribution of the electromagnetic wave reaching the port of the dielectric-filled waveguide is more uniform.

In the metallized via line array, changing the length of one or more rows of embedded metallized via line arrays can change the length of the corresponding dielectric-filled waveguide, thereby making the phase distribution of the electromagnetic wave reaching the port of the dielectric-filled waveguide more uniform.

The shape of the metallized via hole array can be a straight line, a broken line or other curves.

The distance between two adjacent metallized via holes in the metallized via hole line array is less than or equal to one-tenth of the working wavelength, so that the formed metallized via hole line array (16) can be equivalent to an electric wall.

In the metallized via hole horn side wall, the distance between two adjacent metallized via holes should be less than or equal to one-tenth of the working wavelength, so that the formed metallized via hole horn side wall (11) can be equivalent to an electrical wall.

In the dielectric-filled waveguide, the propagation phase velocity of the main mode of the electromagnetic wave (TE10 mode) is related to the width of the dielectric-filled waveguide. The wider the dielectric-filled waveguide is, the lower the phase velocity of the main mode propagation is; on the contrary, the wider the dielectric-filled waveguide is. Narrower, the higher the phase velocity of the main mode propagation. The electromagnetic wave signal from the internal circuit of the package enters the substrate integrated waveguide horn antenna from one end of the metallized vertical via feeder through the input and output ports of the antenna. The via hole array is divided into two or more paths, and enters the medium-filled waveguide to propagate, and then reaches the aperture surface of the antenna through the medium-filled waveguide close to the aperture surface of the substrate integrated waveguide horn antenna; different dielectric filling on the surface close to the antenna aperture The electromagnetic wave at the port of the waveguide arrives through the waveguide filled with different media, and the path lengths of each path are different. The electromagnetic wave that reaches the edge of the antenna aperture surface travels a long distance, but the width of the waveguide filled with the medium that passes through is narrow. , the phase velocity of the electromagnetic wave is faster; while the electromagnetic wave that reaches the center of the antenna aperture is relatively short, but the width of the medium-filled waveguide that passes through is wider, and the phase velocity of the electromagnetic wave is slower. In this way, the phases of the electromagnetic waves reaching each port close to the antenna aperture surface can be kept consistent, and then the phases of the antenna aperture surface are also kept consistent, thereby achieving the purpose of increasing the antenna gain. In addition, since there is no zero field area on the aperture surface except for the side wall of the horn, there is no zero field area on the aperture surface, so the field strength distribution on the aperture surface is relatively more uniform. Similarly, a specific phase distribution can also be realized near the aperture plane of the antenna as required.

Beneficial effect: the beneficial effect of the three-dimensional packaging surface antenna embedded with metallized via hole phase calibration of the present invention is that the phase inconsistency of electromagnetic waves on the antenna aperture surface is corrected on the surface of the three-dimensional packaging, and more waves appear on the antenna aperture surface. Zero field area, thus improving the aperture efficiency and gain of the antenna.

Description of drawings

Figure 1 is a schematic diagram of the overall package structure of a three-dimensional packaged surface antenna embedded with metallized vias for phase calibration.

Fig. 2 is a schematic diagram of the front structure of a three-dimensional packaged surface antenna embedded with metallized vias for phase calibration.

Fig. 3 is a schematic diagram of the reverse structure of a three-dimensional packaged surface antenna embedded with metallized vias for phase calibration.

In the figure, there are: metallized vertical via hole feeder 1, substrate integrated waveguide horn antenna 2, embedded metallized via hole 3, dielectric substrate 4, three-dimensional packaging 5, bottom metal plane 6, bottom metal plane round hole 7, internal circuit 8. Top metal plane 9, metallized vertical via feeder top circular pad 10, metallized via horn sidewall 11, antenna aperture surface 12, antenna narrow section waveguide 13, antenna horn waveguide 14, The short-circuit surface 15 of the narrow-section waveguide, the metallized via hole array 16, the dielectric-filled waveguide 17 and the port 18 of the dielectric-filled waveguide.

Detailed ways

The present invention will be further described below in conjunction with drawings and embodiments.

The implementation scheme adopted by the present invention is: the three-dimensional package surface antenna embedded with metallized vias for phase calibration is composed of three parts: metallized vertical via hole feeder 1, substrate integrated waveguide horn antenna 2 and embedded metallized vias 3. These three parts are all integrated on the same dielectric substrate 4, and the dielectric substrate 4 is on the top of the three-dimensional package 5; the metallized vertical via hole feeder 1 vertically penetrates the dielectric substrate 4, and one end of the metallized vertical via hole feeder 1 passes through the dielectric substrate 4. The round hole 7 on the bottom metal plane 6 is connected to the internal circuit 8 of the three-dimensional package 5, and is the input and output port of the antenna. There is a round pad 10 on the top of the other end of the metallized vertical via feeder 6, and the round pad 10 is connected to the round hole. The disk 10 is in the center of the round hole on the top metal plane 9 of the dielectric substrate 4, so the round pad 10 at the top of the metallized vertical via feeder line does not have direct electrical contact with the top metal plane 9 of the dielectric substrate; the substrate integrates a waveguide horn The antenna 2 is composed of a bottom metal plane 6, a top metal plane 9 and a horn side wall 11 with a metallized via hole. Bottom surface metal plane 6 and top surface metal plane 9; Horn antenna 2 is divided into narrow section waveguide 13 and horn-shaped waveguide 14 two parts from the input and output ports of antenna to antenna aperture surface 14; One end of narrow section waveguide 13 is metallized The hole side wall 11 is short-circuited to form the short-circuit surface 15 of the narrow-section waveguide, and the other end is connected to the horn-shaped waveguide 14, and the metallized vertical via hole feeder 1 is on the center line of the wide side of the narrow-section waveguide 13; the waveguide horn antenna is integrated on the substrate The embedded metallized vias 3 in 2 connect the bottom metal plane 6 and the top metal plane 9, and these embedded metallized vias 3 form a row or series of metallized via arrays 16; two adjacent rows of metallized vias The hole line array 16, or a line of metallized via hole line array 16 and a side wall 11 of the substrate-integrated waveguide horn, together with the bottom metal plane 6 and the top metal plane 9 form a dielectric-filled waveguide 17 with a constant or variable width. One port of the dielectric-filled waveguide 17 is in the direction of the short-circuit surface 15 of the narrow-section waveguide 13 of the horn antenna in the substrate-integrated waveguide horn antenna 2, and the other port 18 extends to the aperture surface 12 of the substrate-integrated waveguide horn antenna, but Up to the antenna aperture surface 12, all the ports 18 of the dielectric-filled waveguides 17 close to the antenna aperture surface 12 are flush, and the widths of these ports 18 are equal or unequal.

In the dielectric-filled waveguide 17, the propagation phase velocity of the main mode of the electromagnetic wave is related to the width of the dielectric-filled waveguide 13, the wider the width of the dielectric-filled waveguide 17, the lower the phase velocity of the main mode propagation; on the contrary, the wider the width of the dielectric-filled waveguide 17 Narrower, the higher the phase velocity of the main mode propagation. The electromagnetic wave signal from the internal circuit 8 enters the substrate integrated waveguide horn antenna 2 from one end of the metallized vertical via feeder 1 through the input and output ports of the antenna. 16, it is divided into two or more paths, enters the dielectric filled waveguide 17 to propagate, and then passes through the dielectric filled waveguide 17 close to the port 18 of the substrate integrated waveguide horn antenna aperture surface 12 to reach the antenna aperture surface 12; on the antenna aperture surface 12 The electromagnetic wave that fills the port 18 of the waveguide 17 with different media arrives through the waveguide 17 filled with different media, and the path lengths passed by each path are different. The distance passed by the electromagnetic wave near the center of the antenna aperture surface 12 is relatively short, but the width of the dielectric-filled waveguide 17 passed by the electromagnetic wave near the center of the antenna aperture surface 12 is smaller than the width of the dielectric-filled waveguide 17 passed by the electromagnetic wave reaching the edge of the aperture surface 12 It is wide, and its phase velocity is relatively slow, so that the average phase velocity of the electromagnetic waves at the edge of the aperture surface 12 is faster than the average phase velocity of the electromagnetic waves near the center of the aperture surface 12, so that the electromagnetic waves arriving near each port 18 of the antenna aperture surface 12 The phases can then be kept consistent, and furthermore, the phases on the antenna aperture surface 12 can also be kept consistent, so that the purpose of increasing the antenna gain can be achieved. In addition, since the antenna aperture surface 12 has no zero field area except the side wall of the horn, other areas of the antenna aperture surface 12 have no zero field area, so the field strength distribution of the antenna aperture surface 12 is relatively more uniform. Similarly, a specific phase distribution can also be realized near the aperture plane 12 of the antenna as required.

In terms of technology, the three-dimensional packaging surface antenna embedded with metallized vias for phase alignment can be realized by either a three-dimensional resin packaging process or a low-temperature co-fired ceramic (LTCC) process. Wherein the metallized via hole 3 and the side wall 11 of the metallized via hole can be a hollow metal via hole or a solid metal hole, or a continuous metallized wall, and the shape of the metal via hole can be circular or square. or other shapes.

In terms of structure, according to the same principle, the number of metallized via hole arrays 16 can be increased to divide the antenna 2 into more dielectric-filled waveguides 17, and the electromagnetic waves passing through these dielectric-filled waveguides 17 can reach the port 18 of the dielectric-filled waveguide in the same phase. reach the antenna aperture surface 12, so that the phase distribution on the antenna aperture surface 12 is more uniform, and increasing the number of dielectric-filled waveguides 17 does not necessarily require increasing the width of the antenna aperture surface 12 at the same time, as long as the dielectric-filled waveguide 17 can transmit the main mode can. Since the closer to the metallized via sidewall 11 of the antenna, the farther the distance for the electromagnetic wave to reach the antenna aperture surface 12, therefore, compared to the dielectric filled waveguide 17 farther away from the metallized via sidewall 11, the distance from the metallized via sidewall 11 The width of the nearer dielectric filled waveguide 17 is relatively narrow to obtain a higher phase velocity of electromagnetic wave transmission. The line shape in which the metallized via hole array 16 is arranged may be a straight line, a zigzag line, an exponential line or other curves.

According to the above, the present invention can be realized.

Claims (5)

1. a three-dimensional packaging surface antenna with embedded metallized via hole phase calibration, characterized in that the antenna includes a metallized vertical via hole feeder (1) arranged on a dielectric substrate (4), a substrate integrated waveguide horn antenna ( 2) and embedded metallized via holes (3), the dielectric substrate (4) is on the top of the three-dimensional package (5); the metallized vertical via hole feeder (1) and the internal circuit (8) of the three-dimensional package (5) ) is connected; the substrate integrated waveguide horn antenna (2) consists of a bottom metal plane (6) located on one side of the dielectric substrate (4), a top metal plane (9) located on the other side of the dielectric substrate (4) and passing through the dielectric substrate ( 4) It is composed of a metallized through-hole horn side wall (11) connecting the bottom metal plane (6) and the top metal plane (9); the substrate integrated waveguide horn antenna (2) consists of a narrow-section waveguide (13) and a horn-shaped waveguide (14) are connected in series; one end of the narrow-section waveguide (13) is a short-circuit surface (15), the other end of the narrow-section waveguide (13) is connected with the horn-shaped waveguide (14), and one end of the horn-shaped waveguide (14) is connected with the narrow-section waveguide (14). The cross-sectional waveguide (13) is connected, and the other end of the horn-shaped waveguide (14) is the antenna aperture surface (12); the metallized via hole (3) is embedded in the substrate integrated waveguide horn antenna (2) to connect the metal plane (6) on the bottom surface and the top surface metal plane (9), and form a metallized via hole array (16); the metallized via hole array (16) and the metallized via hole horn sidewall (11) form a plurality of mediums in the horn antenna (2) filled waveguide (17); The shape of the metallized via hole array (16) is a curve; One port of the dielectric-filled waveguide (17) faces the direction of the short-circuit surface (15) of the narrow-section waveguide (13), and the other port (18) of the dielectric-filled waveguide (17) is flat and stretches toward the horn antenna The direction of the aperture surface (12), but its position is not on the antenna aperture surface (12); In the metallized via hole line array (16), the distance between two adjacent metallized via hole line arrays (16) is adjusted, or the distance between a line of metallized via hole line arrays (16) and the substrate integrated waveguide is adjusted. The distance between the metallized via holes (11) on the side wall of the horn antenna (2) can change the width of the medium-filled waveguide (17), thereby adjusting the phase velocity of electromagnetic wave propagation in the medium-filled waveguide (17), so that the waveguide reaches the medium The phase distribution of electromagnetic waves at the port (18) of the filled waveguide (17) is more uniform; In the metallized via hole line array (16), changing the length of one or more rows of embedded metallized via hole line arrays (16) can change the length of the corresponding dielectric filled waveguide (17), thereby making it possible to reach the dielectric filled waveguide (17) The phase distribution of the electromagnetic wave at the port (18) is more uniform. 2. A three-dimensional package surface antenna with embedded metallized via hole phase alignment according to claim 1, characterized in that one end of the metallized vertical via hole feeder (1) passes through the dielectric substrate (4) and The round hole (7) on the metal plane (6) on the bottom surface is connected to the internal circuit (8) of the three-dimensional package (5), and there is a round pad (10) at the top of the other end, and the top end of the metallized vertical via hole feeder is round The pad (10) is in the center of the circular hole on the top metal plane (9) of the dielectric substrate (4), so the round pad (10) at the top of the metallized vertical via feeder line is connected to the top metal plane of the dielectric substrate (4). (9) There is no direct electrical contact. 3. A kind of three-dimensional packaging surface antenna with embedded metallized via hole phase calibration according to claim 1, characterized in that the width of the dielectric filled waveguide (17) will ensure that its main mode can be in the dielectric filled waveguide ( 17) without being cut off. 4. A three-dimensional package surface antenna with embedded metallized vias for phase alignment according to claim 1, characterized in that two adjacent metallized vias in the metallized via line array (16) (3) The spacing is less than or equal to one-tenth of the working wavelength, so that the formed metallized via hole line array (16) can be equivalent to an electric wall. 5. A three-dimensional package surface antenna with embedded metallized vias for phase alignment according to claim 1, characterized in that in the sidewalls (11) of the horn with metallized vias, two adjacent metallized vias The pitch of the via holes should be less than or equal to one-tenth of the working wavelength, so that the formed metallized via hole horn side wall (11) can be equivalent to an electric wall.