CN103021572A - Method for preparing conductive paste containing thermoplastic acrylic resin - Google Patents
Method for preparing conductive paste containing thermoplastic acrylic resin Download PDFInfo
- Publication number
- CN103021572A CN103021572A CN2012105508641A CN201210550864A CN103021572A CN 103021572 A CN103021572 A CN 103021572A CN 2012105508641 A CN2012105508641 A CN 2012105508641A CN 201210550864 A CN201210550864 A CN 201210550864A CN 103021572 A CN103021572 A CN 103021572A
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- CN
- China
- Prior art keywords
- raw material
- acrylic resin
- thermoplastic acrylic
- preparation
- organic carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004925 Acrylic resin Substances 0.000 title claims abstract description 31
- 229920000178 Acrylic resin Polymers 0.000 title claims abstract description 31
- 229920001169 thermoplastic Polymers 0.000 title claims abstract description 31
- 239000004416 thermosoftening plastic Substances 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- JNXDCMUUZNIWPQ-UHFFFAOYSA-N trioctyl benzene-1,2,4-tricarboxylate Chemical compound CCCCCCCCOC(=O)C1=CC=C(C(=O)OCCCCCCCC)C(C(=O)OCCCCCCCC)=C1 JNXDCMUUZNIWPQ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 claims abstract description 4
- 238000002360 preparation method Methods 0.000 claims description 28
- 239000002002 slurry Substances 0.000 claims description 26
- 239000011521 glass Substances 0.000 claims description 19
- 239000000428 dust Substances 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- 238000005303 weighing Methods 0.000 claims description 18
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000000498 ball milling Methods 0.000 claims description 6
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 3
- 239000001293 FEMA 3089 Substances 0.000 claims description 3
- 239000002202 Polyethylene glycol Substances 0.000 claims description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 3
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 claims description 3
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 claims description 3
- JQCXWCOOWVGKMT-UHFFFAOYSA-N phthalic acid diheptyl ester Natural products CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 claims description 3
- 229920001223 polyethylene glycol Polymers 0.000 claims description 3
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 3
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 3
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 3
- 238000007873 sieving Methods 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 239000003921 oil Substances 0.000 abstract 1
- 210000004027 cell Anatomy 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a method for preparing conductive paste containing thermoplastic acrylic resin. The conductive paste is prepared from raw materials including, by weight, 76-79 parts of materials A, 18-21 parts of materials B, 1.4-2.3 parts of silane coupling agents KH560, 2-3 parts of organic silicon leveling agents, 0.3-0.5 part of organic silicon oil, 1-2 parts of zinc stearate and 0.4-0.8 part of trioctyl trimellitate. The conductive paste is lead-free, completely meets environmental protection requirements, and can form silver powder with large adhesive force, high cell photoelectric conversion efficiency and different particle sizes on the surface of a solar cell when applied to solar cell production. The contact area of particles is increased, so that conductivity of the paste is improved.
Description
Technical field
The present invention relates to the electrocondution slurry field, exactly is a kind of preparation method who contains the electrocondution slurry of thermoplastic acrylic resin.
Background technology
Electrocondution slurry is electronic devices and components encapsulation, electrode and interconnected critical material, mainly comprises burning infiltration type electrocondution slurry and curing type conducting resinl (electrically conductive ink) two large classes.
Burning infiltration type electrocondution slurry mainly is used in the industries such as solar cell, makes electrode behind the sintering and uses, and the curing type electrically conductive ink is widely used in the industries such as printed circuit and Electronic Packaging.
Electrocondution slurry is different according to filler wherein, can be divided into carbon slurry (graphite conductor), metal paste (bronze, silver powder, copper powder, yellow gold), and the ceramic size of modification.
The conductive silver slurry refers to be printed on the conduction stock, and the silver that makes it to have conduction current and get rid of the accumulate static charge ability is starched, and generally is to be imprinted on the non-conductive stocks such as plastics, glass, pottery or cardboard.
Summary of the invention
The object of the present invention is to provide a kind of preparation method who contains the electrocondution slurry of thermoplastic acrylic resin.
Above-mentioned purpose realizes by following scheme:
A kind of preparation method who contains the electrocondution slurry of thermoplastic acrylic resin is characterized in that, may further comprise the steps:
(1) takes by weighing each raw material for preparing glass dust: K by following weight portion
2O 2-4, AS
2O
36.5-8.2, Co
2O
33-5, SnO
23.5-5.8, V
2O
58-12, B
2O
35-7, ZrO
26-8, SiO
212-15, Sb
2O
33-4, Na
2O 7-9, MgO 1-2, CuO 4-6;
(2) will prepare required each raw material blending of glass dust, afterwards in 1100-1200 ℃ of lower sintering 1.5-3h, again the gained melting charge is poured in the cold water and quenched, ball milling, sieving, obtain the glass dust of 10-15 μ m, is that the hydrochloric acid solution of 10-12% soaked 2-4 hour with concentration again, then be washed till neutrality with deionized water, dry to such an extent that 10-15 μ m glass dust is for subsequent use;
(3) take by weighing each raw material for preparing C5 Petropols organic carrier by following weight portion: C5 Petropols 8-10, polyvinylpyrrolidone 2.9-4.5, polyethylene glycol 1-2, butyl carbitol 18-19, diethylene glycol ether acetate 15-18, dioctyl phthalate 1.3-1.8;
(4) will prepare each raw material blending of C5 Petropols organic carrier after, in 50-65 ℃ of lower stirring and dissolving, cross 300-500 order filter cloth, it is for subsequent use namely to get C5 Petropols organic carrier;
(5) take by weighing each raw material for preparing the thermoplastic acrylic resin organic carrier by following weight portion: thermoplastic acrylic resin 8-10, tricresyl phosphate 0.5-0.7,2-octanol 8-12, ethyl acetate 16-18, turpentine oil 8-10;
(6) will prepare each raw material blending of thermoplastic acrylic resin organic carrier after, in 63-68 ℃ of lower stirring and dissolving, cross 300-500 order filter cloth, it is for subsequent use namely to get the thermoplastic acrylic resin organic carrier;
(7) take by weighing each raw material that preparation A expects by following weight portion: 10-15 μ m glass dust 10-12, C5 Petropols organic carrier 20-23, di-n-octyl phthalate 1.5-2.8, chlorinated paraffin wax 0.2-0.3 that 1-5 μ m silver powder 25-28,61-90nm silver powder 25-28,16-25 μ m silver powder 20-25, step (2) make;
With each raw material blending of preparation A material, obtain the A material;
(8) take by weighing each raw material that preparation B expects by following weight portion: 10-15 μ m glass dust 10-12, thermoplastic acrylic resin organic carrier 22-25, castor oil 2-3 that 1-5 μ m aluminium powder 32-34,61-90nm aluminium powder 10-15,11-15 μ m copper powder 24-28, step (2) make;
With each raw material blending of preparation B material, obtain the B material;
(9) take by weighing each raw material that preparation contains the electrocondution slurry of thermoplastic acrylic resin by following weight portion:
A expects 76-79, and B expects 18-21, silane coupler KH560 1.4-2.3, organosilicon levelling agent 2-3, organic silicone oil 0.3-0.5, zinc stearate 1-2, trioctyl trimellitate (TOTM) 0.4-0.8;
Preparation is contained each raw material mixing by weight of the electrocondution slurry of thermoplastic acrylic resin, ball milling is ground to the slurry fineness less than 10 μ m, transfers after the viscosity and get final product;
Described a kind of preparation method who contains the electrocondution slurry of thermoplastic acrylic resin is characterized in that: transfer viscosity to 150-200Pas in the step (9).
Beneficial effect of the present invention is: the electrocondution slurry of gained of the present invention is not leaded, meet environmental requirement fully, when the production that is applied to solar cell, can form strong adhesion, cell photoelectric conversion efficiency height in solar cell surface, selected simultaneously the silver powder of different-grain diameter, increase interparticle contact area, thereby improved the conductive capability of slurry.
Embodiment
A kind of preparation method who contains the electrocondution slurry of thermoplastic acrylic resin may further comprise the steps:
(1) by following weight portion (kg) take by weighing the preparation glass dust each raw material: K
2O 4, AS
2O
36.5, Co
2O
33, SnO
25.8, V
2O
512, B
2O
37, ZrO
28, SiO
215, Sb
2O
34, Na
2O 9, MgO2, and CuO 6;
(2) will prepare required each raw material blending of glass dust, afterwards in 1200 ℃ of lower sintering 3h, again the gained melting charge is poured in the cold water and quenched, ball milling, sieving, obtain the glass dust of 10-15 μ m, is that 10% hydrochloric acid solution soaked 4 hours with concentration again, then be washed till neutrality with deionized water, dry to such an extent that 10-15 μ m glass dust is for subsequent use;
(3) take by weighing each raw material for preparing C5 Petropols organic carrier by following weight portion: C5 Petropols 10, polyvinylpyrrolidone 4.5, polyethylene glycol 2, butyl carbitol 19, diethylene glycol ether acetate 15, dioctyl phthalate 1.8;
(4) will prepare each raw material blending of C5 Petropols organic carrier after, in 50 ℃ of lower stirring and dissolving, cross 300 order filter clothes, it is for subsequent use namely to get C5 Petropols organic carrier;
(5) take by weighing each raw material for preparing the thermoplastic acrylic resin organic carrier by following weight portion: thermoplastic acrylic resin 8, tricresyl phosphate 0.7,2-octanol 12, ethyl acetate 18, turpentine oil 10;
(6) will prepare each raw material blending of thermoplastic acrylic resin organic carrier after, in 63 ℃ of lower stirring and dissolving, cross 300 order filter clothes, it is for subsequent use namely to get the thermoplastic acrylic resin organic carrier;
(7) take by weighing each raw material that preparation A expects by following weight portion: 10-15 μ m glass dust 12, C5 Petropols organic carrier 23, di-n-octyl phthalate 2.8, chlorinated paraffin wax 0.3 that 1-5 μ m silver powder 28,61-90nm silver powder 25,16-25 μ m silver powder 25, step (2) make;
With each raw material blending of preparation A material, obtain the A material;
(8) take by weighing each raw material that preparation B expects by following weight portion: 10-15 μ m glass dust 12, thermoplastic acrylic resin organic carrier 23, castor oil 3 that 1-5 μ m aluminium powder 32,61-90nm aluminium powder 15,11-15 μ m copper powder 28, step (2) make;
With each raw material blending of preparation B material, obtain the B material;
(9) by each raw material of electrocondution slurry that preparation contains thermoplastic acrylic resin that takes by weighing of following weight portion (kg):
A material 76, B material 18, silane coupler KH560 2.1, organosilicon levelling agent 3, organic silicone oil 0.5, zinc stearate 2, trioctyl trimellitate (TOTM) 0.8;
Preparation is contained each raw material mixing by weight of the electrocondution slurry of thermoplastic acrylic resin, ball milling is ground to the slurry fineness less than 10 μ m, transfers after the viscosity and get final product;
Adopt screen process press that the silver slurry is printed on 125mm * 125mm Si substrate, then 180 ℃ of dryings, carry out quick fired electrodes lead-in wire at 880 ℃ again, the contact conductor surface silvery white of making behind the high temperature sintering, smooth zero defect, peel strength 13 N/cm, soldering is functional, sheet resistance＜10 Siements/sq, the solar cell photoelectric transformation efficiency of preparation is 18.8%, the tensile test result is adhesive force〉14N/mm
2
Claims (2)
1. a preparation method who contains the electrocondution slurry of thermoplastic acrylic resin is characterized in that, may further comprise the steps:
(1) takes by weighing each raw material for preparing glass dust: K by following weight portion
2O 2-4, AS
2O
36.5-8.2, Co
2O
33-5, SnO
23.5-5.8, V
2O
58-12, B
2O
35-7, ZrO
26-8, SiO
212-15, Sb
2O
33-4, Na
2O 7-9, MgO 1-2, CuO 4-6;
(2) will prepare required each raw material blending of glass dust, afterwards in 1100-1200 ℃ of lower sintering 1.5-3h, again the gained melting charge is poured in the cold water and quenched, ball milling, sieving, obtain the glass dust of 10-15 μ m, is that the hydrochloric acid solution of 10-12% soaked 2-4 hour with concentration again, then be washed till neutrality with deionized water, dry to such an extent that 10-15 μ m glass dust is for subsequent use;
(3) take by weighing each raw material for preparing C5 Petropols organic carrier by following weight portion: C5 Petropols 8-10, polyvinylpyrrolidone 2.9-4.5, polyethylene glycol 1-2, butyl carbitol 18-19, diethylene glycol ether acetate 15-18, dioctyl phthalate 1.3-1.8;
(4) will prepare each raw material blending of C5 Petropols organic carrier after, in 50-65 ℃ of lower stirring and dissolving, cross 300-500 order filter cloth, it is for subsequent use namely to get C5 Petropols organic carrier;
(5) take by weighing each raw material for preparing the thermoplastic acrylic resin organic carrier by following weight portion: thermoplastic acrylic resin 8-10, tricresyl phosphate 0.5-0.7,2-octanol 8-12, ethyl acetate 16-18, turpentine oil 8-10;
(6) will prepare each raw material blending of thermoplastic acrylic resin organic carrier after, in 63-68 ℃ of lower stirring and dissolving, cross 300-500 order filter cloth, it is for subsequent use namely to get the thermoplastic acrylic resin organic carrier;
(7) take by weighing each raw material that preparation A expects by following weight portion: 10-15 μ m glass dust 10-12, C5 Petropols organic carrier 20-23, di-n-octyl phthalate 1.5-2.8, chlorinated paraffin wax 0.2-0.3 that 1-5 μ m silver powder 25-28,61-90nm silver powder 25-28,16-25 μ m silver powder 20-25, step (2) make;
With each raw material blending of preparation A material, obtain the A material;
(8) take by weighing each raw material that preparation B expects by following weight portion: 10-15 μ m glass dust 10-12, thermoplastic acrylic resin organic carrier 22-25, castor oil 2-3 that 1-5 μ m aluminium powder 32-34,61-90nm aluminium powder 10-15,11-15 μ m copper powder 24-28, step (2) make;
With each raw material blending of preparation B material, obtain the B material;
(9) take by weighing each raw material that preparation contains the electrocondution slurry of thermoplastic acrylic resin by following weight portion:
A expects 76-79, and B expects 18-21, silane coupler KH560 1.4-2.3, organosilicon levelling agent 2-3, organic silicone oil 0.3-0.5, zinc stearate 1-2, trioctyl trimellitate (TOTM) 0.4-0.8;
Preparation is contained each raw material mixing by weight of the electrocondution slurry of thermoplastic acrylic resin, ball milling is ground to the slurry fineness less than 10 μ m, transfers after the viscosity and get final product.
2. a kind of preparation method who contains the electrocondution slurry of thermoplastic acrylic resin according to claim 1 is characterized in that: transfer viscosity to 150-200Pas in the step (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550864.1A CN103021572B (en) | 2012-12-18 | 2012-12-18 | A kind of preparation method of the electrocondution slurry that contains thermoplastic acrylic resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210550864.1A CN103021572B (en) | 2012-12-18 | 2012-12-18 | A kind of preparation method of the electrocondution slurry that contains thermoplastic acrylic resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103021572A true CN103021572A (en) | 2013-04-03 |
| CN103021572B CN103021572B (en) | 2016-05-11 |
Family
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Family Applications (1)
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|---|---|---|---|
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143377A (en) * | 2014-06-30 | 2014-11-12 | 永利电子铜陵有限公司 | PCB conductive silver paste and preparing method thereof |
| CN104575675A (en) * | 2014-12-23 | 2015-04-29 | 合肥中南光电有限公司 | Conductive silver paste for flexible circuit board |
| CN104575683A (en) * | 2015-01-08 | 2015-04-29 | 安徽凤阳德诚科技有限公司 | Conductive silver paste long in service life |
| CN104575664A (en) * | 2014-12-23 | 2015-04-29 | 合肥中南光电有限公司 | Electric conduction silver paste with high adhesive force |
| CN110838383A (en) * | 2019-10-29 | 2020-02-25 | 深圳顺络电子股份有限公司 | Flexible outer electrode of chip component and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356731A (en) * | 2001-03-30 | 2002-12-13 | Nippon Tungsten Co Ltd | Semiconductor substrate material |
| JP2005123141A (en) * | 2003-10-20 | 2005-05-12 | Murata Mfg Co Ltd | Conductive paste and piezoelectric ceramic electronic component |
| CN101692410A (en) * | 2009-08-21 | 2010-04-07 | 广东风华高新科技股份有限公司 | Silver paste of MLCC terminal electrode |
| CN101728001A (en) * | 2009-11-12 | 2010-06-09 | 东南大学 | Lead-free and low-silver photosensitive silver paste and preparation method thereof |
-
2012
- 2012-12-18 CN CN201210550864.1A patent/CN103021572B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002356731A (en) * | 2001-03-30 | 2002-12-13 | Nippon Tungsten Co Ltd | Semiconductor substrate material |
| JP2005123141A (en) * | 2003-10-20 | 2005-05-12 | Murata Mfg Co Ltd | Conductive paste and piezoelectric ceramic electronic component |
| CN101692410A (en) * | 2009-08-21 | 2010-04-07 | 广东风华高新科技股份有限公司 | Silver paste of MLCC terminal electrode |
| CN101728001A (en) * | 2009-11-12 | 2010-06-09 | 东南大学 | Lead-free and low-silver photosensitive silver paste and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143377A (en) * | 2014-06-30 | 2014-11-12 | 永利电子铜陵有限公司 | PCB conductive silver paste and preparing method thereof |
| CN104575675A (en) * | 2014-12-23 | 2015-04-29 | 合肥中南光电有限公司 | Conductive silver paste for flexible circuit board |
| CN104575664A (en) * | 2014-12-23 | 2015-04-29 | 合肥中南光电有限公司 | Electric conduction silver paste with high adhesive force |
| CN104575683A (en) * | 2015-01-08 | 2015-04-29 | 安徽凤阳德诚科技有限公司 | Conductive silver paste long in service life |
| CN110838383A (en) * | 2019-10-29 | 2020-02-25 | 深圳顺络电子股份有限公司 | Flexible outer electrode of chip component and manufacturing method thereof |
| CN110838383B (en) * | 2019-10-29 | 2021-04-23 | 深圳顺络电子股份有限公司 | Flexible outer electrode of chip component and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103021572B (en) | 2016-05-11 |
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