[go: up one dir, main page]

CN103017023A - Backlight module and display device using same - Google Patents

Backlight module and display device using same Download PDF

Info

Publication number
CN103017023A
CN103017023A CN2012105009041A CN201210500904A CN103017023A CN 103017023 A CN103017023 A CN 103017023A CN 2012105009041 A CN2012105009041 A CN 2012105009041A CN 201210500904 A CN201210500904 A CN 201210500904A CN 103017023 A CN103017023 A CN 103017023A
Authority
CN
China
Prior art keywords
backlight module
led chip
light
lampshade
guide plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2012105009041A
Other languages
Chinese (zh)
Other versions
CN103017023B (en
Inventor
王培娜
王鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Hefei BOE Display Lighting Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Hefei BOE Display Lighting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Hefei BOE Display Lighting Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN201210500904.1A priority Critical patent/CN103017023B/en
Publication of CN103017023A publication Critical patent/CN103017023A/en
Application granted granted Critical
Publication of CN103017023B publication Critical patent/CN103017023B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)

Abstract

本发明提供的背光模组及使用该背光模组的显示装置,其中,背光模组包括导光板以及光源装置,光源装置包括出光面直接朝向导光板的侧面的LED芯片。本发明的使用背光模组的显示装置包括本发明的背光模组。本发明的背光模组中的光源装置由于取消灯腔所以尺寸将会大大缩小,这样背光模组厚度也会相应缩小。取消灯腔还可以使光源装置的发光角度增加,LED芯片各个面的光线都会由侧面进入到导光板内,这样光线进入导光板的入光角度大大提升,由此避免入光光斑的出现,同时背光模组的亮度得到提升。本发明的使用背光模组的显示装置,因为采用本发明的背光模组,其整体厚度可以减小,成本可以进一步降低,其显示品质得到极大改善。

Figure 201210500904

The present invention provides a backlight module and a display device using the backlight module, wherein the backlight module includes a light guide plate and a light source device, and the light source device includes an LED chip whose light emitting surface directly faces the side of the light guide plate. The display device using the backlight module of the present invention includes the backlight module of the present invention. The size of the light source device in the backlight module of the present invention will be greatly reduced due to the omission of the lamp cavity, so that the thickness of the backlight module will also be reduced accordingly. Canceling the lamp cavity can also increase the light angle of the light source device, and the light from all sides of the LED chip will enter the light guide plate from the side, so that the light incident angle of the light entering the light guide plate is greatly improved, thereby avoiding the appearance of light spots, and at the same time The brightness of the backlight module is improved. The display device using the backlight module of the present invention, because of the backlight module of the present invention, its overall thickness can be reduced, the cost can be further reduced, and its display quality can be greatly improved.

Figure 201210500904

Description

背光模组及使用该背光模组的显示装置Backlight module and display device using the backlight module

技术领域technical field

本发明涉及显示技术领域,特别是涉及一种背光模组及使用该背光模组的显示装置。The invention relates to the field of display technology, in particular to a backlight module and a display device using the backlight module.

背景技术Background technique

背光模组为液晶显示器的重要组件之一,由于液晶本身不发光,背光模组的功能就是供应充足的亮度与分布均匀的光源,使液晶显示器能正常显示影像。目前,液晶显示器的显示技术已经趋于成熟,尤其在背光模组的设计方面也有了很大的发展。背光模组除了应用在液晶显示器、液晶电视机等液晶显示装置之外,还可以为数码相框、电子纸、手机等显示装置提供光源。The backlight module is one of the important components of the liquid crystal display. Since the liquid crystal itself does not emit light, the function of the backlight module is to supply sufficient brightness and evenly distributed light source, so that the liquid crystal display can display images normally. At present, the display technology of liquid crystal display has become mature, especially in the design of the backlight module. In addition to being used in liquid crystal display devices such as liquid crystal displays and liquid crystal televisions, backlight modules can also provide light sources for display devices such as digital photo frames, electronic paper, and mobile phones.

背光模组依据光源的位置不同分为侧光式背光模组和直下式背光模组。The backlight module is divided into an edge-type backlight module and a direct-type backlight module according to the position of the light source.

图1示出了一种现有技术的侧光式背光模组的结构,这种背光模组包括导光板1'以及设置于导光板1’的侧面的外侧的光源装置2’,光源装置2’包括设置于灯腔10内的LED芯片3’。LED芯片3’与用于封装LED芯片3’的灯腔10组成LED灯。LED芯片3’的出光面不是直接朝向导光板1’的侧面,LED芯片3’的出光面和导光板1’还存在有玻璃或塑料材质的灯腔10。这种结构的背光模组的厚度很大程度上是由LED灯的厚度决定的,由于灯腔10的存在,这种结构的背光模组的厚度较大;同时灯腔10的存在限制了LED灯的发光角度,导光板1’的入光角度较小,导光板1’上容易出现光斑。Fig. 1 shows the structure of an edge-lit backlight module in the prior art. This backlight module includes a light guide plate 1' and a light source device 2' arranged outside the side of the light guide plate 1'. The light source device 2 'includes the LED chips 3' arranged in the lamp cavity 10'. The LED chip 3' and the lamp chamber 10 for encapsulating the LED chip 3' form an LED lamp. The light emitting surface of the LED chip 3' is not directly facing the side of the light guide plate 1', and the light emitting surface of the LED chip 3' and the light guide plate 1' also have a lamp chamber 10 made of glass or plastic. The thickness of the backlight module with this structure is largely determined by the thickness of the LED lamp. Due to the existence of the lamp cavity 10, the thickness of the backlight module with this structure is relatively large; at the same time, the existence of the lamp cavity 10 limits the LED lamp The light emitting angle of the lamp and the light incident angle of the light guide plate 1 ′ are small, and light spots are likely to appear on the light guide plate 1 ′.

发明内容Contents of the invention

本发明的目的是提供一种既可以降低背光模组的厚度,又可以避免导光板1’上出现光斑的背光模组及使用该背光模组的显示装置。The object of the present invention is to provide a backlight module which can reduce the thickness of the backlight module and avoid light spots on the light guide plate 1' and a display device using the backlight module.

本发明的背光模组,包括导光板以及设置于所述导光板的侧面的外侧的光源装置,所述光源装置包括出光面直接朝向所述导光板的侧面的LED芯片。The backlight module of the present invention includes a light guide plate and a light source device disposed outside the side of the light guide plate, and the light source device includes an LED chip whose light emitting surface directly faces the side of the light guide plate.

本发明的背光模组,其中,所述光源装置还包括从所述LED芯片的外侧笼罩所述LED芯片的灯罩,所述灯罩将所述LED芯片发出的光线反射至所述导光板的侧面。In the backlight module of the present invention, the light source device further includes a lampshade covering the LED chip from the outside of the LED chip, and the lampshade reflects the light emitted by the LED chip to the side of the light guide plate.

本发明的背光模组,其中,所述灯罩包括与所述导光板垂直且位于所述LED芯片的外侧的第一面体以及分别连接所述第一面体的两端的第二面体、第三面体,所述第二面体、所述第三面体均与所述导光板平行,所述第二面体、所述第三面体分别从所述第一面体的两端向所述导光板延伸,以构成一个包围所述LED芯片并将所述LED芯片发出的光线反射至所述导光板的侧面的腔体。In the backlight module of the present invention, the lampshade includes a first plane perpendicular to the light guide plate and located outside the LED chip, a second plane, a third plane respectively connected to two ends of the first plane. A plane body, the second plane body and the third plane body are parallel to the light guide plate, the second plane body and the third plane body respectively extend from both ends of the first plane body to the light guide plate, To form a cavity surrounding the LED chip and reflecting the light emitted by the LED chip to the side of the light guide plate.

本发明的背光模组,其中,所述灯罩的第一面体的面向所述LED芯片的表面上、所述灯罩的第二面体的面向所述LED芯片的表面上、所述灯罩的第三面体的面向所述LED芯片的表面上均设置荧光粉层。The backlight module of the present invention, wherein, on the surface of the first surface of the lampshade facing the LED chip, on the surface of the second surface of the lampshade facing the LED chip, on the third surface of the lampshade Phosphor powder layers are arranged on the surface of the face body facing the LED chip.

本发明的背光模组,其中,所述导光板的面向所述LED芯片的侧面上设置黄色荧光粉层。In the backlight module of the present invention, a yellow phosphor layer is provided on the side of the light guide plate facing the LED chip.

本发明的背光模组,其中,所述灯罩的第一面体的面向所述LED芯片的表面上、所述灯罩的第二面体的面向所述LED芯片的表面上、所述灯罩的第三面体的面向所述LED芯片的表面上均设置有荧光粉层。The backlight module of the present invention, wherein, on the surface of the first surface of the lampshade facing the LED chip, on the surface of the second surface of the lampshade facing the LED chip, on the third surface of the lampshade Phosphor powder layers are arranged on the surface of the surface facing the LED chip.

本发明的背光模组,其中,所述光源装置还包括位于所述灯罩的内部的柔性线路板,所述柔性线路板位于所述灯罩与所述LED芯片之间,所述LED芯片与所述柔性线路板电连接。In the backlight module of the present invention, the light source device further includes a flexible circuit board located inside the lampshade, the flexible circuit board is located between the lampshade and the LED chip, and the LED chip and the The flexible circuit board is electrically connected.

本发明的背光模组,其中,所述柔性线路板与所述导光板垂直,所述LED芯片为多个,所述多个LED芯片沿所述导光板的侧面的延伸方向排列于所述灯罩内的所述柔性线路板上。In the backlight module of the present invention, wherein the flexible circuit board is perpendicular to the light guide plate, there are multiple LED chips, and the multiple LED chips are arranged on the lampshade along the extension direction of the side surface of the light guide plate within the flexible circuit board.

本发明的背光模组,其中,所述LED芯片包括N结以及与所述N结电连接的P结,所述P结直接朝向所述导光板的侧面,所述N结位于所述P结与所述柔性线路板之间,所述N结与所述柔性线路板电连接。In the backlight module of the present invention, wherein the LED chip includes an N junction and a P junction electrically connected to the N junction, the P junction directly faces the side of the light guide plate, and the N junction is located at the P junction. Between the flexible circuit board and the flexible circuit board, the N junction is electrically connected to the flexible circuit board.

本发明的使用背光模组的显示装置,包括本发明的背光模组。The display device using the backlight module of the present invention includes the backlight module of the present invention.

本发明的背光模组中的光源装置由于取消灯腔所以尺寸将会大大缩小,这样背光模组厚度也会相应缩小。取消灯腔还可以使光源装置的发光角度增加,没有灯腔限制,LED芯片各个面的光线都会由侧面进入到导光板内,这样光线进入导光板的入光角度大大提升,由此避免入光光斑的出现,同时背光模组的亮度得到提升。The size of the light source device in the backlight module of the present invention will be greatly reduced due to the omission of the lamp cavity, so that the thickness of the backlight module will also be reduced accordingly. Canceling the lamp cavity can also increase the light-emitting angle of the light source device. Without the limitation of the lamp cavity, the light from all sides of the LED chip will enter the light guide plate from the side, so that the light incident angle of the light entering the light guide plate is greatly improved, thereby avoiding the light incident Spots appear, and the brightness of the backlight module is improved at the same time.

本发明的使用背光模组的显示装置,因为采用本发明的背光模组,其整体厚度可以减小,成本可以进一步降低,其显示品质得到极大改善。In the display device using the backlight module of the present invention, because the backlight module of the present invention is used, the overall thickness can be reduced, the cost can be further reduced, and the display quality can be greatly improved.

附图说明Description of drawings

图1为现有技术的背光模组的结构示意图;FIG. 1 is a schematic structural view of a backlight module in the prior art;

图2为本发明的背光模组的结构示意图的主视图;Fig. 2 is the front view of the structural representation of the backlight module of the present invention;

图3为图2的俯剖视图,示出了本发明的背光模组去除灯罩后的结构。FIG. 3 is a top sectional view of FIG. 2 , showing the structure of the backlight module of the present invention after removing the lampshade.

具体实施方式Detailed ways

如图2、图3所示,本发明背光模组的实施例,包括导光板以及设置于导光板1的侧面的外侧的光源装置2,光源装置2包括出光面直接朝向导光板1的侧面的LED芯片3,光源装置2不设置用于封装LED芯片3的灯腔。As shown in Fig. 2 and Fig. 3, the embodiment of the backlight module of the present invention includes a light guide plate and a light source device 2 arranged on the outside of the side of the light guide plate 1, and the light source device 2 includes a light emitting surface directly facing the side of the light guide plate 1. The LED chip 3 and the light source device 2 are not provided with a lamp chamber for encapsulating the LED chip 3 .

本发明的背光模组中的光源装置取消了现有技术中的灯腔,以使光源装置的尺寸缩小,这样背光模组厚度也会相应缩小。取消灯腔还可以使光源装置的发光角度增加,没有灯腔限制,LED芯片各个面的光线都会由侧面进入到导光板内,这样光线进入导光板的入光角度大大提升,由此避免入光光斑的出现,同时背光模组的亮度得到提升。The light source device in the backlight module of the present invention cancels the lamp cavity in the prior art, so that the size of the light source device is reduced, so the thickness of the backlight module is also reduced accordingly. Canceling the lamp cavity can also increase the light-emitting angle of the light source device. Without the limitation of the lamp cavity, the light from all sides of the LED chip will enter the light guide plate from the side, so that the light incident angle of the light entering the light guide plate is greatly improved, thereby avoiding the light incident Spots appear, and the brightness of the backlight module is improved at the same time.

本发明背光模组的实施例中,光源装置2有两个,分别位于导光板1的两相对侧面的外侧。In the embodiment of the backlight module of the present invention, there are two light source devices 2 , which are respectively located outside the two opposite sides of the light guide plate 1 .

在本发明的背光模组的其它实施例中,光源装置还可以只位于导光板的一侧,或者根据需要进行其他不同的位置设置,例如角落设置。光源装置位于导光板的两相对侧面是为了光线通过导光板之后得到更加均匀的面光源。In other embodiments of the backlight module of the present invention, the light source device can also be located only on one side of the light guide plate, or be set in other different positions as required, such as a corner setting. The purpose of the light source devices being located on two opposite sides of the light guide plate is to obtain a more uniform surface light source after the light passes through the light guide plate.

为提高LED芯片3的发光的利用率,避免光损失,本发明的背光模组,其中,光源装置2还包括从LED芯片3的外侧笼罩LED芯片3的灯罩4,灯罩4将LED芯片3发出的光线反射至导光板1的侧面。In order to improve the utilization rate of the light emission of the LED chip 3 and avoid light loss, in the backlight module of the present invention, the light source device 2 further includes a lampshade 4 covering the LED chip 3 from the outside of the LED chip 3, and the lampshade 4 emits light from the LED chip 3. The light is reflected to the side of the light guide plate 1.

本发明的背光模组的实施例,其中,灯罩4包括与导光板1垂直且位于LED芯片3的外侧的第一面体11以及分别连接第一面体11的两端的第二面体12、第三面体13,第二面体12、第三面体13均与导光板1平行,第二面体12、第三面体13分别从第一面体11的两端向导光板1延伸,以构成一个包围LED芯片3并将LED芯片3发出的光线反射至导光板1的侧面的腔体。In an embodiment of the backlight module of the present invention, the lampshade 4 includes a first surface body 11 perpendicular to the light guide plate 1 and located outside the LED chip 3 , and a second surface body 12 respectively connected to two ends of the first surface body 11 , a second surface body 11 Trihedral body 13, the second body 12 and the third body 13 are all parallel to the light guide plate 1, the second body 12 and the third body 13 respectively extend from the two ends of the first body 11 to the light guide plate 1 to form a surrounding LED chip 3 and reflect the light emitted by the LED chip 3 to the cavity on the side of the light guide plate 1.

本发明的背光模组的实施例,其中,第二面体12、第三面体13分别垂直于第一面体11。In the embodiment of the backlight module of the present invention, the second plane body 12 and the third plane body 13 are respectively perpendicular to the first plane body 11 .

为使灯罩4更效率地将LED芯片3发出的光线反射至导光板1的侧面,本发明的背光模组的实施例,其中,灯罩4的第一面体11的面向LED芯片3的表面上、灯罩4的第二面体12的面向LED芯片3的表面上、灯罩4的第三面体13的面向LED芯片3的表面上均设置黄色荧光粉层7。In order to make the lampshade 4 reflect the light emitted by the LED chip 3 to the side of the light guide plate 1 more efficiently, in the embodiment of the backlight module of the present invention, wherein, the surface of the first surface body 11 of the lampshade 4 facing the LED chip 3 The yellow phosphor layer 7 is provided on the surface of the second surface 12 of the lampshade 4 facing the LED chip 3 and on the surface of the third surface 13 of the lampshade 4 facing the LED chip 3 .

本发明的背光模组的实施例,其中,导光板1的面向LED芯片3的侧面上设置黄色荧光粉层7。In an embodiment of the backlight module of the present invention, a yellow phosphor layer 7 is provided on the side of the light guide plate 1 facing the LED chips 3 .

黄色荧光粉用来吸收LED芯片所发出的部分激发光线,并据以激发出波长异于所述LED芯片所发出的激发光线的波长的发射光线,例如LED芯片所发出的激发光线为蓝光,LED芯片发出的蓝光与黄色荧光粉发出的黄光互补形成白光。当然,上述举例只是为了说明,且均以发出白光的背光光源进行说明,其亦可以借由荧光粉层的设置混合出其他颜色的光线,只要将黄色荧光粉层设置在导光板上均在本发明的保护范围之内,在导光板上的设置方式不仅仅限于入光面,可以为其他任何位置,本发明中的实施例优选为设置在导光板的入光面即本发明实施例中导光板1的面向LED芯片3的侧面上。The yellow fluorescent powder is used to absorb part of the excitation light emitted by the LED chip, and thereby excites emission light with a wavelength different from that of the excitation light emitted by the LED chip. For example, the excitation light emitted by the LED chip is blue light, and the LED The blue light emitted by the chip complements the yellow light emitted by the yellow phosphor to form white light. Of course, the above-mentioned examples are just for illustration, and they are all described with a backlight emitting white light. It can also mix light of other colors through the arrangement of the phosphor layer. As long as the yellow phosphor layer is arranged on the light guide plate, the Within the scope of protection of the invention, the arrangement on the light guide plate is not limited to the light incident surface, and can be any other position. The embodiment of the present invention is preferably set on the light incident surface of the light guide plate, that is, the light guide in the embodiment of the present invention. On the side of the light board 1 facing the LED chip 3 .

设置上述黄色荧光粉层的方式可以为由黄色荧光粉胶体均匀涂敷而成,黄色荧光粉层7的厚度在0.05mm-1mm之间,上述设置方式还可以为将黄色荧光粉胶体先加工成膜层之后直接贴附于需要设置的位置,或直接将荧光粉掺杂于需要设置的位置,或将荧光粉与需要贴附的结构一体成型设置,或将荧光粉混入化学溶剂中并以喷涂方式形成在所需设置的位置处,在此对具体的制作方法不作限制,只要可以实现本发明所保护的结构即可。The method of setting the above-mentioned yellow phosphor layer can be formed by uniform coating of the yellow phosphor colloid, the thickness of the yellow phosphor layer 7 is between 0.05 mm and 1 mm, and the above-mentioned setting method can also be that the yellow phosphor colloid is first processed into The film layer is directly attached to the position to be set, or the phosphor powder is directly doped to the position to be set, or the phosphor powder is integrally formed with the structure to be attached, or the phosphor powder is mixed into a chemical solvent and sprayed The method is formed at the desired location, and the specific manufacturing method is not limited here, as long as the structure protected by the present invention can be realized.

在本发明的背光模组的其他实施例中,灯罩4的第一面体11的面向LED芯片3的表面上、灯罩4的第二面体12的面向LED芯片3的表面上、灯罩4的第三面体13的面向LED芯片3的表面上均设置有荧光粉层。荧光粉用来吸收LED芯片所发出的部分激发光线,并据以激发出波长异于LED芯片所发出的激发光线的波长的发射光线,例如LED芯片所发出的激发光线为蓝光,荧光粉为黄色荧光粉,LED芯片发出的蓝光与黄色荧光粉发出的黄光互补形成白光,或,LED芯片所发出的激发光线为绿光,所述荧光粉包括红色荧光粉和蓝色荧光粉,所述LED芯片发出的绿光和红色荧光粉发出的红光与蓝色荧光粉发出的蓝光互补形成白光,或,所述LED芯片所发出的激发光线为紫外光,所述荧光粉为蓝色荧光粉,LED芯片发出的紫外光与蓝色荧光粉发出的蓝光互补形成白光,当然,上述举例只是为了说明,且均以发出白光的背光光源进行说明,其亦可以借由荧光粉层的设置混合出其他颜色的光线,只要将荧光粉层设置在灯罩上,均在本发明的保护范围之内。In other embodiments of the backlight module of the present invention, on the surface of the first surface body 11 of the lampshade 4 facing the LED chip 3, on the surface of the second surface body 12 of the lampshade 4 facing the LED chip 3, on the second surface of the lampshade 4 Phosphor powder layers are provided on the surfaces of the trihedron 13 facing the LED chip 3 . Phosphor powder is used to absorb part of the excitation light emitted by the LED chip, and to excite emission light with a wavelength different from that of the excitation light emitted by the LED chip. For example, the excitation light emitted by the LED chip is blue light, and the phosphor powder is yellow. Phosphor, the blue light emitted by the LED chip is complementary to the yellow light emitted by the yellow phosphor to form white light, or the excitation light emitted by the LED chip is green light, the phosphor includes red phosphor and blue phosphor, the LED The green light emitted by the chip and the red light emitted by the red phosphor are complementary to the blue light emitted by the blue phosphor to form white light, or the excitation light emitted by the LED chip is ultraviolet light, and the phosphor is blue phosphor, The ultraviolet light emitted by the LED chip and the blue light emitted by the blue phosphor complement each other to form white light. Of course, the above examples are for illustration only, and they are all described with a backlight emitting white light. It can also be mixed with other phosphors by setting the phosphor layer. As long as the fluorescent powder layer is arranged on the lampshade for the light of different colors, it is within the protection scope of the present invention.

上述设置方式还可以为将荧光粉胶体先加工成膜层之后直接贴附于需要设置的位置,或直接将荧光粉掺杂于需要设置的位置,或将荧光粉与需要贴附的结构一体成型设置,或将荧光粉混入化学溶剂中并以喷涂方式形成在所需设置的位置处,在此对具体的制作方法不作限制,只要可以实现本发明所保护的结构即可。The above-mentioned setting method can also be processed into a film layer of the phosphor colloid and then directly attached to the position to be set, or directly doped with the phosphor powder at the position to be set, or integrally formed with the phosphor powder and the structure to be attached setting, or mixing the fluorescent powder into a chemical solvent and spraying it on the desired setting position. There is no limitation to the specific manufacturing method here, as long as the structure protected by the present invention can be realized.

本发明的背光模组的实施例,其中,光源装置2还包括位于灯罩4的内部的柔性线路板5。柔性线路板5位于灯罩4与LED芯片3之间,LED芯片3与柔性线路板5电连接。In the embodiment of the backlight module of the present invention, the light source device 2 further includes a flexible circuit board 5 inside the lampshade 4 . The flexible circuit board 5 is located between the lampshade 4 and the LED chip 3 , and the LED chip 3 is electrically connected to the flexible circuit board 5 .

本发明的背光模组的实施例,其中,柔性线路板5与导光板1垂直,LED芯片3为多个,多个LED芯片3沿导光板1的侧面的延伸方向排列于灯罩4内的柔性线路板5上。In the embodiment of the backlight module of the present invention, the flexible circuit board 5 is perpendicular to the light guide plate 1, there are multiple LED chips 3, and the plurality of LED chips 3 are arranged in the flexible circuit board 4 inside the lampshade 4 along the extending direction of the side of the light guide plate 1. on circuit board 5.

本发明的背光模组的实施例,其中,LED芯片3包括N结31以及与N结电连接的P结32,P结32直接朝向导光板1的侧面,N结31位于P结32与柔性线路板55之间,N结31与柔性线路板5电连接。In an embodiment of the backlight module of the present invention, wherein the LED chip 3 includes an N junction 31 and a P junction 32 electrically connected to the N junction, the P junction 32 directly faces the side of the light guide plate 1, and the N junction 31 is located between the P junction 32 and the flexible Between the circuit boards 55 , the N junction 31 is electrically connected to the flexible circuit board 5 .

本发明实施例的使用背光模组的显示装置中的背光模组是上述实施例中的背光模组。所述显示装置可以为:液晶面板、电子纸、OLED面板、液晶电视、液晶显示器、数码相框、手机、平板电脑等任何具有显示功能的产品或部件。The backlight module in the display device using the backlight module in the embodiment of the present invention is the backlight module in the above embodiment. The display device may be any product or component with a display function such as a liquid crystal panel, an electronic paper, an OLED panel, a liquid crystal TV, a liquid crystal display, a digital photo frame, a mobile phone, and a tablet computer.

本发明的背光模组中的光源装置由于取消了灯腔,所以尺寸将会大大缩小,这样背光模组厚度也会相应缩小:例如3806型号的容纳LED芯片的灯腔的厚度是0.6mm,这样只能选取0.6mm以上厚度的导光板,如导光板厚度小于或等于0.6mm,则有很大程度上的亮度损失;如果取消灯腔后光源装置的厚度会由0.6mm缩小到0.3mm,这样就可以选取厚度为0.3mm的导光板,这样背光模组厚度就相应缩小了。Because the light source device in the backlight module of the present invention cancels the lamp chamber, the size will be greatly reduced, and the thickness of the backlight module will also be reduced accordingly: for example, the thickness of the lamp chamber of the 3806 model that accommodates the LED chip is 0.6mm, like this Only the light guide plate with a thickness of 0.6mm or more can be selected. If the thickness of the light guide plate is less than or equal to 0.6mm, there will be a large loss of brightness; if the lamp cavity is canceled, the thickness of the light source device will be reduced from 0.6mm to 0.3mm. A light guide plate with a thickness of 0.3 mm can be selected, so that the thickness of the backlight module is reduced accordingly.

取消灯腔还可以使光源装置的发光角度增加。因为灯腔的限制,现有的光源装置的发光角度一般是120度左右,取消灯腔后,光源装置的发光角度增加至180度左右,没有灯腔限制,LED芯片各个面的光线都会由侧面进入到导光板内,这样光线进入导光板的入光角度大大提升,由此避免入光光斑的出现,同时背光模组的亮度得到提升。Canceling the lamp cavity can also increase the light emitting angle of the light source device. Due to the limitation of the lamp cavity, the light emitting angle of the existing light source device is generally about 120 degrees. After the lamp cavity is removed, the light emitting angle of the light source device increases to about 180 degrees. Entering into the light guide plate, the incident angle of the light entering the light guide plate is greatly improved, thereby avoiding the occurrence of incident light spots, and at the same time, the brightness of the backlight module is improved.

以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。The above is only a preferred embodiment of the present invention, it should be pointed out that, for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, and these improvements and modifications can also be made. It should be regarded as the protection scope of the present invention.

Claims (10)

1. backlight module, the light supply apparatus in the outside that comprises LGP and be arranged at the side of described LGP is characterized in that, described light supply apparatus comprises that exiting surface is directly towards the led chip of the side of described LGP.
2. backlight module according to claim 1 is characterized in that, described light supply apparatus also comprises the lampshade that shrouds described led chip from the outside of described led chip, and the light reflection that described lampshade sends described led chip is to the side of described LGP.
3. backlight module according to claim 2, it is characterized in that, described lampshade comprises vertical with described LGP and is positioned at the first surface body in the outside of described led chip and dihedron, the trihedral that is connected respectively the two ends of described first surface body, described dihedron, described trihedral are all parallel with described LGP, described dihedron, described trihedral extend to described LGP from the two ends of described first surface body respectively, to consist of a light reflection that surrounds described led chip and described led chip is sent to the cavity of the side of described LGP.
4. backlight module according to claim 3, it is characterized in that, the first surface body of described lampshade on the surface of described led chip, the dihedron of described lampshade on the surface of described led chip, the trihedral of described lampshade on the surface of described led chip, all scribble the yellow fluorescence bisque.
5. backlight module according to claim 4 is characterized in that, described LGP on the side of described led chip, scribble the yellow fluorescence bisque.
6. backlight module according to claim 3, it is characterized in that, the first surface body of described lampshade on the surface of described led chip, the dihedron of described lampshade on the surface of described led chip, the trihedral of described lampshade on the surface of described led chip, all be covered with the fluorescent powder membrane material.
7. backlight module according to claim 2, it is characterized in that, described light supply apparatus also comprises the FPC of the inside that is positioned at described lampshade, and described FPC is between described lampshade and described led chip, and described led chip is electrically connected with described FPC.
8. backlight module according to claim 7, it is characterized in that, described FPC is vertical with described LGP, and described led chip is a plurality of, on described a plurality of led chips are arranged in described FPC in the described lampshade along the bearing of trend of the side of described LGP.
9. backlight module according to claim 1, it is characterized in that, described led chip comprises N knot and the P knot that is electrically connected with described N knot, the direct side towards described LGP of described P knot, described N knot is between described P knot and described FPC, and described N knot is electrically connected with described FPC.
10. a display unit of using backlight module is characterized in that, comprises each described backlight module such as claim 1-9.
CN201210500904.1A 2012-11-29 2012-11-29 Backlight module and use the display device of this backlight module Expired - Fee Related CN103017023B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210500904.1A CN103017023B (en) 2012-11-29 2012-11-29 Backlight module and use the display device of this backlight module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210500904.1A CN103017023B (en) 2012-11-29 2012-11-29 Backlight module and use the display device of this backlight module

Publications (2)

Publication Number Publication Date
CN103017023A true CN103017023A (en) 2013-04-03
CN103017023B CN103017023B (en) 2015-09-02

Family

ID=47965932

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210500904.1A Expired - Fee Related CN103017023B (en) 2012-11-29 2012-11-29 Backlight module and use the display device of this backlight module

Country Status (1)

Country Link
CN (1) CN103017023B (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103697376A (en) * 2013-12-09 2014-04-02 京东方科技集团股份有限公司 Backlight source and display device
CN104376796A (en) * 2014-11-17 2015-02-25 深圳市华星光电技术有限公司 Transparent display device
CN105301840A (en) * 2015-11-18 2016-02-03 武汉华星光电技术有限公司 Backlight module and liquid crystal display device
CN110456560A (en) * 2019-07-29 2019-11-15 武汉华星光电技术有限公司 A display panel and display device thereof
CN112415813A (en) * 2020-11-30 2021-02-26 芜湖聚飞光电科技有限公司 Light source assembly, backlight module and display device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2828862Y (en) * 2005-05-31 2006-10-18 优佰利股份有限公司 Combination device of side light source module and liquid crystal panel
CN102032499A (en) * 2009-09-24 2011-04-27 友达光电股份有限公司 Light source and backlight module adopting same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2828862Y (en) * 2005-05-31 2006-10-18 优佰利股份有限公司 Combination device of side light source module and liquid crystal panel
CN102032499A (en) * 2009-09-24 2011-04-27 友达光电股份有限公司 Light source and backlight module adopting same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103697376A (en) * 2013-12-09 2014-04-02 京东方科技集团股份有限公司 Backlight source and display device
CN104376796A (en) * 2014-11-17 2015-02-25 深圳市华星光电技术有限公司 Transparent display device
CN105301840A (en) * 2015-11-18 2016-02-03 武汉华星光电技术有限公司 Backlight module and liquid crystal display device
CN110456560A (en) * 2019-07-29 2019-11-15 武汉华星光电技术有限公司 A display panel and display device thereof
CN112415813A (en) * 2020-11-30 2021-02-26 芜湖聚飞光电科技有限公司 Light source assembly, backlight module and display device

Also Published As

Publication number Publication date
CN103017023B (en) 2015-09-02

Similar Documents

Publication Publication Date Title
US9746710B2 (en) Quantum dot light source device, backlight module, and liquid crystal display device
CN104483778B (en) Light-emitting device, backlight module and liquid crystal display device
KR102395088B1 (en) Backlight unit and liquid crystal dispaly device including the same
KR101647490B1 (en) Curved liquid Crystal Display device
US9989696B2 (en) High color gamut backlight module and display device
US9156734B2 (en) Method for manufacturing fluorescent powder substrate and liquid crystal module using fluorescent powder substrate
US20140185316A1 (en) Display Device and Method of Manufacturing the Same
CN103017023B (en) Backlight module and use the display device of this backlight module
CN102954398A (en) Light emitting module and backlight unit having the same
KR102447240B1 (en) Light guide panel, back light unit and liquid crystal display device using the same
CN102297369A (en) Backlight module and display device using same
CN102147074A (en) Direct type ultrathin LED backlight module
KR20130130786A (en) Backlight module and display device
WO2022011780A1 (en) Display module and manufacturing method therefor, and led display module and led display screen
US8419258B2 (en) Light guide plate, and backlight unit
CN105446009A (en) Array substrate and preparation method thereof, and display device
CN104793397B (en) Liquid crystal display die set and liquid crystal display device
CN103712127B (en) A kind of light source assembly, backlight module and display unit
US20160349436A1 (en) Light source modules and the backlight modules with the light source module
WO2013077243A1 (en) Illumination device, display device and television receiver
TWI700523B (en) Backlight structure and display device
CN106907620A (en) Front located light source and the display device including the front located light source
JPWO2014046140A1 (en) Edge light type surface light source device
WO2016194666A1 (en) Fluorescent film for led, method for manufacturing fluorescent film for led, led surface light-emitting device, and image formation device
WO2019095421A1 (en) Liquid crystal display and backlight module thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150902