CN102999459A - Communication method of silicon wafer testing machine and built-in self test (BIST) module - Google Patents
Communication method of silicon wafer testing machine and built-in self test (BIST) module Download PDFInfo
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- CN102999459A CN102999459A CN2011102671007A CN201110267100A CN102999459A CN 102999459 A CN102999459 A CN 102999459A CN 2011102671007 A CN2011102671007 A CN 2011102671007A CN 201110267100 A CN201110267100 A CN 201110267100A CN 102999459 A CN102999459 A CN 102999459A
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- 238000012360 testing method Methods 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 25
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 25
- 239000010703 silicon Substances 0.000 title claims abstract description 25
- 238000004891 communication Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000012812 general test Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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Priority Applications (1)
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CN2011102671007A CN102999459A (en) | 2011-09-09 | 2011-09-09 | Communication method of silicon wafer testing machine and built-in self test (BIST) module |
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CN2011102671007A CN102999459A (en) | 2011-09-09 | 2011-09-09 | Communication method of silicon wafer testing machine and built-in self test (BIST) module |
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CN102999459A true CN102999459A (en) | 2013-03-27 |
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CN2011102671007A Pending CN102999459A (en) | 2011-09-09 | 2011-09-09 | Communication method of silicon wafer testing machine and built-in self test (BIST) module |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212554A (en) * | 1990-12-31 | 1993-05-18 | Thomson Consumer Electronics, Inc. | Digital method and apparatus for evaluating a frequency parameter of an if signal |
CN1828553A (en) * | 2005-04-13 | 2006-09-06 | 威盛电子股份有限公司 | System on Chip and Test/Debugging Method Applied thereto |
CN101382915A (en) * | 2008-10-23 | 2009-03-11 | 北京中星微电子有限公司 | Software debugging system and debugging method |
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- 2011-09-09 CN CN2011102671007A patent/CN102999459A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212554A (en) * | 1990-12-31 | 1993-05-18 | Thomson Consumer Electronics, Inc. | Digital method and apparatus for evaluating a frequency parameter of an if signal |
CN1828553A (en) * | 2005-04-13 | 2006-09-06 | 威盛电子股份有限公司 | System on Chip and Test/Debugging Method Applied thereto |
CN101382915A (en) * | 2008-10-23 | 2009-03-11 | 北京中星微电子有限公司 | Software debugging system and debugging method |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140103 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20140103 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Applicant before: Shanghai Huahong NEC Electronics Co., Ltd. |
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130327 |