CN102994994A - Lead-free electroless tin plating solution - Google Patents
Lead-free electroless tin plating solution Download PDFInfo
- Publication number
- CN102994994A CN102994994A CN201210420818XA CN201210420818A CN102994994A CN 102994994 A CN102994994 A CN 102994994A CN 201210420818X A CN201210420818X A CN 201210420818XA CN 201210420818 A CN201210420818 A CN 201210420818A CN 102994994 A CN102994994 A CN 102994994A
- Authority
- CN
- China
- Prior art keywords
- lead
- plating solution
- tin plating
- electroless tin
- free electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title abstract description 17
- 238000007747 plating Methods 0.000 title abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 28
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 18
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims abstract description 12
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 11
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 108010010803 Gelatin Proteins 0.000 claims abstract description 6
- 229920000159 gelatin Polymers 0.000 claims abstract description 6
- 239000008273 gelatin Substances 0.000 claims abstract description 6
- 235000019322 gelatine Nutrition 0.000 claims abstract description 6
- 235000011852 gelatine desserts Nutrition 0.000 claims abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 14
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 7
- -1 Polyoxyethylene Polymers 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims description 5
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
- 235000011150 stannous chloride Nutrition 0.000 claims description 3
- KHMOASUYFVRATF-UHFFFAOYSA-J tin(4+);tetrachloride;pentahydrate Chemical compound O.O.O.O.O.Cl[Sn](Cl)(Cl)Cl KHMOASUYFVRATF-UHFFFAOYSA-J 0.000 claims description 3
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims description 3
- 238000000576 coating method Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 231100000344 non-irritating Toxicity 0.000 abstract description 3
- 231100000252 nontoxic Toxicity 0.000 abstract description 3
- 230000003000 nontoxic effect Effects 0.000 abstract description 3
- 239000002202 Polyethylene glycol Substances 0.000 abstract 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 abstract 2
- 229920001223 polyethylene glycol Polymers 0.000 abstract 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 abstract 1
- 229960001484 edetic acid Drugs 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000012669 liquid formulation Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
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- Chemically Coating (AREA)
Abstract
The invention relates to a lead-free electroless tin plating solution. The lead-free electroless tin plating solution is characterized by comprising the following components: 20 to 30g/L of stannous mono-sulphate, 60 to 120g/L of thiourea, 15 to 25g/L of citric acid, 20 to 50g/L of sulfur dioxide, 3 to 5g/L of ethylene diamine tetraacetic acid, 0.01 to 0.05g/L of polyethylene glycol, 20 to 55m/L of 98% of concentrated sulfuric acid, 0.5 to 1.0g/L of gelatin, and the balance of regulator. The lead-free electroless tin plating solution has the advantages that few categories of chemical materials are used and cost is low; the tin can be continuously deposited at a high speed on copper and a copper alloy substrate, thus semi-bright chemical coatings with different thicknesses can be produced, and the flatness of the chemical coatings can be improved; and the lead-free electroless tin plating solution is remarkable in grain refinement, low in porosity, simple in formula of plating solution, easy to control, stable in plating solution, long in service life and high in stability in batch production; and polyethylene glycol is a nontoxic and nonirritating substance with high water solubility, and can be combined with other materials without producing harmful substances.
Description
Technical field
The present invention relates to a kind of lead-free chemical tinning solution.
Background technology
Along with miniaturization of electronic products, because tin coating is a kind of good weldability and has the coating of certain anti-corrosion capability, at electronic wire, be widely used in the printed-wiring board (PWB), tin coating can adopt plating, the method preparation of immersion plating and electroless plating, immersion tin is easy and simple to handle, cost is low, but thickness of coating is limited, generally only has 0.5 μ m, plating bath is easily poisoned, can't satisfy industrial requirements, eleetrotinplate can't the deep hole processing part, blind bored member, the Electroless tin coating even thickness, solution dispersibility is good, production efficiency is high, easily-controlled operation, and coating surface is bright and clean smooth, compact crystallization, porosity is low, and bonding force is better than immersion tin and eleetrotinplate, is a kind of desirable Small electronic component and the electroless plating technology of electronic wire, but because the hydrogen-evolution overpotential of tin is high, catalytic activity is low, if adopt separately formaldehyde, inferior sodium phosphate, the reductive agents such as hydroborate all can not be realized the continuously self-catalyzed deposition of tin, can't obtain thicker coating, therefore, for addressing the above problem, the spy provides a kind of new technical scheme.
Summary of the invention
The purpose of this invention is to provide a kind of lead-free chemical tinning solution.
The technical solution used in the present invention is:
A kind of lead-free chemical tinning solution, this lead-free chemical tinning solution consists of the following composition:
Stannous sulfate 20 ~ 30g/L;
Thiocarbamide 60 ~ 120g/L;
Citric acid 15 ~ 25g/L;
Sulfurous gas 20-50g/L;
Ethylenediamine tetraacetic acid (EDTA) 3 ~ 5g/L;
Polyoxyethylene glycol 0.01-0.05 g/L;
The vitriol oil 20 ~ 55m/L of 98%;
Gelatin 0.5 ~ 1.0g/L;
All the other are adjusting agent.
Described adjusting agent is sulfuric acid or ammoniacal liquor a kind of or two kinds of combinations wherein.
Described stannous sulfate replaces with tin protochloride or tin tetrachloride pentahydrate.
Advantage of the present invention is: tin plating solution chemical material kind is few, cost is low, realized the continuously self-catalyzed deposition of tin at copper and copper alloy matrix, sedimentation velocity is fast, can obtain half bright chemical plating of different thickness, improved the chemical plating planeness, grain refining is obvious, and porosity is low, and electroplate liquid formulation is simple, be easy to control, bath stability, long service life, batch production stability height, polyoxyethylene glycol is a kind of nontoxic, non-irritating material, have good water-solublely, so there is not the generation of objectionable impurities during with other combinations of substances, technique is simple, obtain easily, have use value.
Embodiment
Embodiment 1
A kind of lead-free chemical tinning solution, this lead-free chemical tinning solution consists of the following composition: stannous sulfate 20g/L; Thiocarbamide 60g/L; Citric acid 15g/L; Sulfurous gas 20g/L; Ethylenediamine tetraacetic acid (EDTA) 3g/L; Polyoxyethylene glycol 0.01g/L; 98% vitriol oil 20m/L; Gelatin 0.5g/L; All the other are sulfuric acid.
Embodiment 2
A kind of lead-free chemical tinning solution, this lead-free chemical tinning solution consists of the following composition: tin protochloride 25g/L; Thiocarbamide 90g/L; Citric acid 20g/L; Sulfurous gas 30g/L; Ethylenediamine tetraacetic acid (EDTA) 4g/L; Polyoxyethylene glycol 0.03g/L; 98% vitriol oil 35m/L; Gelatin 0.7g/L; All the other are the combination of sulfuric acid and ammoniacal liquor.
Embodiment 3
A kind of lead-free chemical tinning solution, this lead-free chemical tinning solution consists of the following composition: tin tetrachloride pentahydrate 30g/L; Thiocarbamide 120g/L; Citric acid 25g/L; Sulfurous gas 50g/L; Ethylenediamine tetraacetic acid (EDTA) 5g/L; Polyoxyethylene glycol 0.05 g/L; 98% vitriol oil 55m/L; Gelatin 1.0g/L; All the other are ammoniacal liquor.
Tin plating solution chemical material kind is few, cost is low, realized the continuously self-catalyzed deposition of tin at copper and copper alloy matrix, sedimentation velocity is fast, can obtain half bright chemical plating of different thickness, improved the chemical plating planeness, grain refining is obvious, and porosity is low, and electroplate liquid formulation is simple, be easy to control, bath stability, long service life, batch production stability height, polyoxyethylene glycol is a kind of nontoxic, non-irritating material, have good water-solublely, so there is not the generation of objectionable impurities during with other combinations of substances, technique is simple, obtain easily, have use value.
Claims (3)
1. lead-free chemical tinning solution, it is characterized in that: this lead-free chemical tinning solution consists of the following composition:
Stannous sulfate 20 ~ 30g/L;
Thiocarbamide 60 ~ 120g/L;
Citric acid 15 ~ 25g/L;
Sulfurous gas 20-50g/L;
Ethylenediamine tetraacetic acid (EDTA) 3 ~ 5g/L;
Polyoxyethylene glycol 0.01-0.05 g/L;
The vitriol oil 20 ~ 55m/L of 98%;
Gelatin 0.5 ~ 1.0g/L;
All the other are adjusting agent.
2. a kind of lead-free chemical tinning solution according to claim 1, it is characterized in that: described adjusting agent is sulfuric acid or ammoniacal liquor a kind of or two kinds of combinations wherein.
3. a kind of lead-free chemical tinning solution according to claim 1 is characterized in that: described stannous sulfate replaces with tin protochloride or tin tetrachloride pentahydrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210420818XA CN102994994A (en) | 2012-10-30 | 2012-10-30 | Lead-free electroless tin plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210420818XA CN102994994A (en) | 2012-10-30 | 2012-10-30 | Lead-free electroless tin plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102994994A true CN102994994A (en) | 2013-03-27 |
Family
ID=47924087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210420818XA Pending CN102994994A (en) | 2012-10-30 | 2012-10-30 | Lead-free electroless tin plating solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102994994A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104178755A (en) * | 2014-09-16 | 2014-12-03 | 朱忠良 | Coating method for metal coating |
| CN107460455A (en) * | 2017-07-25 | 2017-12-12 | 东莞聚顺环保科技有限公司 | The tin plating water-based process material of copper ecology and its tin plating method |
| CN107557764A (en) * | 2017-07-25 | 2018-01-09 | 东莞聚顺环保科技有限公司 | The tin plating water-based process material of iron ecology and its tin plating method |
| CN108024457A (en) * | 2017-12-01 | 2018-05-11 | 湖南文理学院 | A kind of preparation method of macromolecule flexible conductive film |
| CN111733406A (en) * | 2020-07-15 | 2020-10-02 | 赤壁市聚茂新材料科技有限公司 | Long-acting chemical tin plating solution for thick plating layer and tin plating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101705482A (en) * | 2009-11-19 | 2010-05-12 | 广州电器科学研究院 | Alkyl sulfonic acid chemical tin plating solution and tin plating process based on same |
| CN101717929A (en) * | 2009-12-14 | 2010-06-02 | 昆明理工大学 | Semi-bright lead-free chemical tinning liquid and using method thereof |
| CN101724834A (en) * | 2009-12-14 | 2010-06-09 | 昆明理工大学 | Continuously self-catalyzed deposition chemical plating solution of tin and using method thereof |
-
2012
- 2012-10-30 CN CN201210420818XA patent/CN102994994A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101705482A (en) * | 2009-11-19 | 2010-05-12 | 广州电器科学研究院 | Alkyl sulfonic acid chemical tin plating solution and tin plating process based on same |
| CN101717929A (en) * | 2009-12-14 | 2010-06-02 | 昆明理工大学 | Semi-bright lead-free chemical tinning liquid and using method thereof |
| CN101724834A (en) * | 2009-12-14 | 2010-06-09 | 昆明理工大学 | Continuously self-catalyzed deposition chemical plating solution of tin and using method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104178755A (en) * | 2014-09-16 | 2014-12-03 | 朱忠良 | Coating method for metal coating |
| CN107460455A (en) * | 2017-07-25 | 2017-12-12 | 东莞聚顺环保科技有限公司 | The tin plating water-based process material of copper ecology and its tin plating method |
| CN107557764A (en) * | 2017-07-25 | 2018-01-09 | 东莞聚顺环保科技有限公司 | The tin plating water-based process material of iron ecology and its tin plating method |
| CN108024457A (en) * | 2017-12-01 | 2018-05-11 | 湖南文理学院 | A kind of preparation method of macromolecule flexible conductive film |
| CN108024457B (en) * | 2017-12-01 | 2020-02-14 | 湖南文理学院 | A kind of preparation method of polymer flexible conductive film |
| CN111733406A (en) * | 2020-07-15 | 2020-10-02 | 赤壁市聚茂新材料科技有限公司 | Long-acting chemical tin plating solution for thick plating layer and tin plating method |
| CN111733406B (en) * | 2020-07-15 | 2022-09-20 | 赤壁市聚茂新材料科技有限公司 | Tin plating method of long-acting chemical tin plating solution for thick plating layer |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130327 |