CN102991750B - Laminating machine and laminating method - Google Patents
Laminating machine and laminating method Download PDFInfo
- Publication number
- CN102991750B CN102991750B CN201110289590.0A CN201110289590A CN102991750B CN 102991750 B CN102991750 B CN 102991750B CN 201110289590 A CN201110289590 A CN 201110289590A CN 102991750 B CN102991750 B CN 102991750B
- Authority
- CN
- China
- Prior art keywords
- film
- substrate
- pad pasting
- overlay film
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000010030 laminating Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 112
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 230000007246 mechanism Effects 0.000 claims description 60
- 239000002390 adhesive tape Substances 0.000 claims description 53
- 230000008878 coupling Effects 0.000 claims description 22
- 238000010168 coupling process Methods 0.000 claims description 22
- 238000005859 coupling reaction Methods 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- 238000012360 testing method Methods 0.000 claims description 17
- 238000001125 extrusion Methods 0.000 claims description 8
- 239000000428 dust Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 3
- 239000010419 fine particle Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000013307 optical fiber Substances 0.000 description 9
- 230000033228 biological regulation Effects 0.000 description 8
- 238000001514 detection method Methods 0.000 description 8
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000011084 recovery Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229940085805 fiberall Drugs 0.000 description 2
- -1 acryl Chemical group 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
- G01B11/005—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates coordinate measuring machines
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
- B32B2041/06—Starting the lamination machine or method
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a laminating machine and a laminating method, which are used for laminating on substrates. The laminating machine is characterized by comprising an optical detector, wherein before and after lamination on substrates, the optical detector is used for detecting fine particles on the substrates and air bubbles on the laminated substrates respectively. The situation of the attachment of dust fall to the substrates before lamination and the situation of the generation of the air bubbles on the laminated substrates are detected by using the optical detector, so that poorly-laminated substrates can be found in time, and the effect of increasing the total yield of substrate lamination is achieved.
Description
[technical field]
The present invention has about a kind of film layer and film covering method, is particularly to the film layer and the film covering method that carry out overlay film for the substrate of contact panel.
[background technology]
Due to the progress of science and technology, the intelligent device that such as computing machine, PDA, intelligent mobile phone or tablet PC etc. have power is come out of the stove one after another.Many intelligent device are provided with contact panel, carry out operative intelligence type device for user with touch control manner.
In the product of contact panel, topmost assembly is glass; therefore before this product turnout (as with after laser glass-cutting or in the glass gluing stage); need to paste layer protecting film on the glass surface, cause glass dirty to prevent the surface of glass because of scratch or dust fall particulate etc.This layer of protective film is covered in glass needs to reach and can not produces bubble between pad pasting and glass after overlay film.
Known in overlay film processing procedure, be all to check whether the quality before and after glass film reaches standard (namely whether having dust fall or bubble) by operating personal mode with the naked eye.But, known artificial test mode easily causes criterion inconsistent because of the factor such as different operating personnel, different time, work time-histories be long and more not objective, therefore be a disadvantageous factor for the quality of overlay film and stability, and then reduce the yield of glass film.
[summary of the invention]
The invention provides a kind of film layer and film covering method, utilize the detecting device of film layer with same standard to detect the situation that the dust fall of substrate before overlay film is attached to substrate, and detect the situation that the bubble of substrate after overlay film produce, promote the quality of overlay film and stability by this to improve the overlay film yield of substrate further.
The invention provides a kind of film layer, comprise:
One overlay film platform, is used for carrying at least one substrate for overlay film;
One Juan Mo mechanism, is used for carrying and carry the adhesive tape that posts pad pasting;
One roller indenter device, is used for peeling off the pad pasting in this Juan Mo mechanism, so that this pad pasting roll extrusion is conformed to this substrate;
One header system, controls the movement of this Juan Mo mechanism and this roller indenter device;
One alignment sensor, detect in this Juan Mo mechanism this post the position of the adhesive tape of pad pasting;
One fluorescence detector, is used for the quality of this substrate detected before and after overlay film on this overlay film platform.And
One can program logic controller, control the running of this overlay film platform and this header system, and control this header system according to the detecting result of this alignment sensor further and carry out a locating procedure, and produce a prompting message according to the testing result of this fluorescence detector.
Further, according to film layer of the present invention, wherein, this fluorescence detector comprises a plurality of optical coupling assembly.
Further, according to film layer of the present invention, wherein, this overlay film platform comprises further:
One rotating mechanism; And
A plurality of bearing fixture, is arranged on this rotating mechanism, is used for respectively carrying this substrate.
Further, according to film layer of the present invention, comprise further:
One Juan Mo mechanism, loads the adhesive tape that posts pad pasting, and carries this adhesive tape posting pad pasting to this film carrier platform;
One inhales film tool, is used for adsorbing and peels off the pad pasting on this film carrier platform, and by the substrate of this attachment film on this bearing fixture.
Further, according to film layer of the present invention, wherein, this Juan Mo mechanism comprises:
One goes out film material tray, loads also scrolling and goes out the adhesive tape that this posts pad pasting;
At least one cylinder, is arranged at this and goes out film material tray downstream, is used for supporting and carrying this to post the adhesive tape of pad pasting; And
One reclaims charging tray, and scrolling reclaims the adhesive tape that this has peeled off pad pasting.
Further, according to film layer of the present invention, wherein, this Juan Mo mechanism comprises:
One goes out film material tray, loads also scrolling and goes out the adhesive tape that this posts pad pasting;
At least one cylinder, is arranged at this and goes out film material tray downstream, is used for carrying and carrying the adhesive tape that this posts pad pasting; And
One reclaims charging tray, and scrolling reclaims the adhesive tape that this has peeled off pad pasting.
The invention provides a kind of film covering method, be applied to film layer overlay film one substrate, the step of this film covering method comprises:
Perform a pan feeding program; This pan feeding program comprises:
Scrolling one Juan Mo mechanism, posts the adhesive tape of pad pasting with pan feeding one;
Control a roller indenter device, be used for peeling off the pad pasting in this Juan Mo mechanism, so that this pad pasting roll extrusion is conformed to a substrate;
Run a header system, to control the movement of this Juan Mo mechanism and this roller indenter device;
Run an alignment sensor, post the position of the adhesive tape of pad pasting with this detecting in this Juan Mo mechanism;
Through a fluorescence detector, with rear before carrying out overlay film to a substrate, automatically detect the quality of this substrate; And
Running one can program logic controller, to control the running of this overlay film platform and this header system, and control this header system according to the detecting result of this alignment sensor further and carry out a locating procedure, and produce a prompting message according to the testing result of this fluorescence detector.
Further, according to film covering method of the present invention, wherein, the step of this execution pan feeding program comprises further:
Rotate an overlay film platform, with this substrate of pan feeding, wherein this overlay film platform comprises a plurality of bearing fixture being used for carrying this substrate.
Further, according to film covering method of the present invention, wherein, whether after the step performing this pan feeding substrate, automatically detecting this substrate through this fluorescence detector further has dirty.
Further, according to film covering method of the present invention, comprise further:
Adsorb and peel off this pad pasting;
Locate the position of the pad pasting that this adsorbs; And
Paste this pad pasting in this substrate.
Further, according to film covering method of the present invention, wherein, at this pad pasting of laminating after this substrate, whether the substrate automatically detecting this overlay film through this fluorescence detector further has bubble.
Further, according to film covering method of the present invention, comprise further: the testing result according to this fluorescence detector produces a prompting message.
[accompanying drawing explanation]
Fig. 1 is the first embodiment block diagram of film layer of the present invention;
Fig. 2 is the first embodiment lateral plan of film layer of the present invention;
Fig. 3 is the first embodiment back view of film layer of the present invention;
Fig. 4 is the first embodiment birds-eye view of film layer of the present invention;
Fig. 5 is the first embodiment diagram of circuit of film covering method of the present invention;
Fig. 6 is the second embodiment block diagram of film layer of the present invention;
Fig. 7 is the second embodiment lateral plan of film layer of the present invention;
Fig. 8 is the second embodiment back view of film layer of the present invention;
Fig. 9 is the second embodiment birds-eye view of film layer of the present invention; And
Figure 10 is the second embodiment diagram of circuit of film covering method of the present invention.
[detailed description of the invention]
With reference to following examples, so that the enforcement aspect of film layer of the present invention and film covering method to be described.Wherein, film layer is broadly divided into undersized film layer and large-sized film layer, and so-called undersized film layer is applicable to the overlay film of the substrate of below such as 5 inch, and large-sized film layer is applicable to the overlay film of the substrate of such as 5 to 15 inch.In addition, described substrate can be such as adopt the materials such as glass, plastics, acryl, there is no limited at this.
Please refer to Fig. 1 to Fig. 4, be respectively the first embodiment block diagram of film layer of the present invention, lateral plan, back view and birds-eye view.Wherein, the first embodiment is the actual enforcement aspect being such as used for illustrating undersized film layer.
In Fig. 1 to Fig. 4, film layer 20 includes overlay film platform 22, Juan Mo mechanism 24, film carrier platform 26, suction film tool 28, alignment sensor 30, fluorescence detector 32 and can program logic controller 34.Wherein, can be used for controlling overlay film platform 22, Juan Mo mechanism 24 and inhale the running of film tool 28 by program logic controller 34.
Overlay film platform 22 comprises a rotating mechanism 23 and several bearing fixture 36 (the present embodiment is four bearing fixtures 36).Wherein, these bearing fixtures 36 are arranged on rotating mechanism 23, are used for carrying one piece of substrate 38 respectively.Can operate in the mode of each 90-degree rotation by program logic controller 34 rotating mechanism 23 that controls overlay film platform 22, make the substrate 38 be seated in individually on each bearing fixture 36 sequentially be carried out detecting or overlay film.
Juan Mo mechanism 24 includes one and goes out film material tray 40, cylinder 42 and a recovery charging tray 44.Go out film material tray 40 to load and scrolling goes out to post the position of adhesive tape to film carrier platform 26 of pad pasting (such as release film).Cylinder 42 is arranged at out the downstream of film material tray 40, is used for supporting and carrying the adhesive tape posting pad pasting.Reclaim charging tray 44 scrolling and reclaim the adhesive tape having peeled off pad pasting.Specifically, the adhesive tape that film material tray 40 scrolling goes out to post pad pasting can be controlled out by program logic controller 34, and be delivered to the position of film carrier platform 26 via cylinder 42 scrolling, and control to reclaim charging tray 44 has peeled off pad pasting adhesive tape via the recovery of cylinder 42 scrolling.Wherein, when can program logic controller 34 judge to make the test adhesive tape that film mechanism 24 loads be finished time, will can send a prompting message (as warned sound, flash of light etc.), to notify that operating personal carries out the replacing of adhesive tape by program logic controller 34.
Can control to inhale the position that film tool 28 moves to film carrier platform 26 by program logic controller 34, to adsorb further and to peel off pad pasting, then control to inhale film tool 28 move to bearing fixture 36 with by attachment film on substrate 38.
In addition, the alignment sensor 30 designed by the present embodiment, it is used to detect the position of inhaling the pad pasting that film tool 28 adsorbs.And can control to inhale film tool 28 further according to the detecting result of alignment sensor 30 and carry out a locating procedure by program logic controller 34.Wherein, the alignment sensor 30 of the present embodiment can such as be made up of a groove limit switch and an optical fiber.
Moreover, fluorescence detector 32 is by several optical coupling assembly (as: charge coupled device (CCD) (Charge CoupledDevice, CCD)) 46 compositions, the present embodiment citing is made up of two optical coupling assemblies 46, dirty to be detected surface scratches on the substrate 38 being seated in non-overlay film on bearing fixture 36 or dust fall particulate etc. by one of them optical coupling assembly 46 of fluorescence detector 32, and detect by another optical coupling assembly 46 of fluorescence detector 32 bubble on the substrate 38 of overlay film be seated on bearing fixture 36.After treating that arbitrary optical coupling assembly 46 has detected, namely can produce a prompting message according to the testing result of fluorescence detector 32 by program logic controller 34.Thus, the present embodiment can program logic controller 34 just can according to the testing result of fluorescence detector 32 (two optical coupling assemblies 46) judge substrate 38 before overlay film with after situation.
Framework from the above, carry out further casehistory with the birds-eye view of Fig. 4, four bearing fixtures 36 of the present embodiment be such as be placed in respectively rotating mechanism 23 0 ° (on), 90 ° (right side), 180 ° (under) and the position on 270 ° (left sides); Two optical coupling assemblies 46 are then designs respectively above the position of 0 ° and 180 °.Thus, suppose that rotating mechanism 23 is each 90-degree rotations in a clockwise direction, then operating personal can rotate the substrate 38 substrate 38 putting non-overlay film again that to the bearing fixture 36 of the position of 90 °, take out overlay film regularly; Relative, optical coupling assembly 46 above the position being positioned at 180 ° is used to detect the substrate 38 rotated to the non-overlay film on the bearing fixture 36 of the position of 180 °, and the optical coupling assembly 46 above the position being positioned at 0 ° is then used to detect the substrate 38 rotated to the overlay film on the bearing fixture 36 of the position of 0 °; Rotation is then carry out pad pasting for inhaling film tool 28 to the substrate 38 of the non-overlay film on the bearing fixture 36 of the position of 270 °.
So when can program logic controller 34 judge that the quality of substrate 38 before or after overlay film is bad according to testing result time (there is the particulate being greater than more than 1mm on the surface before such as substrate 38 overlay film; Or produce bubble after substrate 38 overlay film), can will send a prompting message (as warning sound, flash of light etc.) by program logic controller 34.
Fig. 5 is the first embodiment diagram of circuit of film covering method of the present invention.When the operating process of instruction diagram 5, simultaneously referring to figs. 1 to every assembly of the film layer 20 of Fig. 4.
First, the program of opening initialization can be carried out by program logic controller 34, with to can the parameters of program logic controller 34 internal preset set (step S50).If opening initialization can cannot be completed by program logic controller 34, then can send prompting message (such as sending warning sound) to notify operating personal (step S52) by program logic controller 34, by operating personal to can check and keep in repair by program logic controller 34, and after completing repeated execution of steps S50.
Can after program logic controller 34 completes opening initialization, film tool 28 can be inhaled according to default state modulator and get back to reference position (step S54) by program logic controller 34.
Can judge whether inhale film tool 28 gets back to reference position (step S58) by program logic controller 34, if can judge that inhaling film tool 28 does not get back to reference position by program logic controller 34, then carry out control in a manual manner by operating personal and inhale film tool 28 (step S56), and carry out step S54 and step S58 again.
If can judge that inhaling film tool 28 gets back to reference position by program logic controller 34, then can control to inhale the top (step S60) that film tool 28 moves to film carrier platform 26 by program logic controller 34, that is control to inhale the position that film tool 28 moves to suction film.In addition, can program logic controller 34 also simultaneously the scrolling of control Juan Mo mechanism 24 post a pan feeding program of the adhesive tape of pad pasting, to carry this adhesive tape posting pad pasting to film carrier platform 26.
Move to after above film carrier platform 26 at suction film tool 28, can control to inhale film tool 28 and decline towards film carrier platform 26 by program logic controller 34, make suction film tool 28 touch pad pasting (step S62) on adhesive tape.And then control to inhale film tool 28 to inhale vacuum mode absorption pad pasting (step S64).
After suction film tool 28 adsorbs pad pasting, can move toward bearing fixture 36 direction (that is moving toward overlay film locality) by program logic controller 34 control suction film tool 28, and the another control Juan Mo mechanism 24 of program logic controller 34 can carry out scrolling adhesive tape, pad pasting can be peeled off on the one hand, namely so-called demoulding flow process; On the other hand, also can reclaim the adhesive tape of peeling off pad pasting in recovery charging tray 44 (step S66) simultaneously.
Additionally be, if can judge that the adhesive tape that film material tray 40 is loaded uses by program logic controller 34, then can will send prompting message by program logic controller 34, and suspend the current work of film layer 20, in time rejudging out the adhesive tape in film material tray 40, recover the running of film layer 20.
Overlay film position (step S68) can be moved to by program logic controller 34 control suction film tool 28.During movement, program logic controller 34 can preset and can control to inhale film tool 28 through alignment sensor 30, carry out a locating procedure with the detecting result according to alignment sensor 30, so to guarantee follow-uply accurately pad pasting to be covered on substrate 38.In the present embodiment, alignment sensor 30 is such as used for detecting an orientation angle of inhaling the pad pasting that film tool 28 adsorbs, whether to confirm whether location completes by what detect orientation angle.And located when inhaling film tool 28, and when moving to overlay film position, can judge whether bearing fixture 36 puts (step S69) in place further by program logic controller 34.
If the judged result of step S69 is no, then represent that bearing fixture 36 not yet puts in place, therefore repeated execution of steps S69, to wait for that bearing fixture 36 puts in place.But the steps flow chart before wait bearing fixture 36 puts in place can be such as the program of execution one pan feeding substrate 38.Specifically, by operating personal, the substrate 38 of non-overlay film is seated in bearing fixture 36 (step S70).And then, rotating mechanism 23 90-degree rotation can be controlled by program logic controller 34, below one of them optical coupling assembly 46 bearing fixture 36 of the substrate 38 carrying non-overlay film being moved to fluorescence detector 32 (step S72).So, can program logic controller 34 just control both optical coupling assembly 46 automatically detect the particulate put on the substrate 38 of non-overlay film, and judge whether the size of the particulate on the substrate 38 of non-overlay film and quantity conform with the regulations (step S74) according to the testing result of optical coupling assembly 46.
If the judged result of step S74 is no, then can send prompting message (such as send warning sound) and, to notify operating personal (step S76), by operating personal, substrate 38 against regulation taken out from bearing fixture 36 by program logic controller 34.Then step S70 and step thereafter thereof is repeated, again to perform the flow process of pan feeding substrate 38.Otherwise, if the judged result of step S74 is yes, then can controlling rotating mechanism 23 90-degree rotation again by program logic controller 34, having the bearing fixture 36 detecting qualified substrate 38 to move to the position preparing overlay film by putting.Now, can program logic controller 34 in the judgement of step S69, can judge that bearing fixture 36 puts in place.And then, overlay film can be carried out, pad pasting to be covered on the substrate 38 (step S80) of non-overlay film qualified after testing by program logic controller 34 control suction film tool 28.
Then, can judge whether overlay film completes (step S82) by program logic controller 34.If the judged result of step S82 is no, then repeat step S82, to continue to carry out overlay film.If the judged result of step S82 is yes, then can controls to inhale film tool 28 stopping absorption pad pasting by program logic controller 34, and control to inhale the substrate 38 (step S84) that film tool 28 leaves overlay film.
After completing overlay film, can program logic controller 34 except controlling to inhale film tool 28 and get back to reference position and except repeated execution of steps S60 and steps flow chart thereafter thereof, also synchro control rotating mechanism 23 90-degree rotation again, in order to by put have the bearing fixture 36 of the substrate 38 of overlay film to move to fluorescence detector 32 another optical coupling assembly 46 below (step S86).And then control this another optical coupling assembly 46 again and automatically detect bubble on the substrate 38 of overlay film, to judge according to the testing result of this another optical coupling assembly 46 whether the size of the bubble on the substrate 38 of overlay film and quantity conform with the regulations (step S88).
If the judged result of step S88 is no, represent that the bubble on the substrate 38 of overlay film exceeds regulation, so prompting message (such as sending warning sound) can be sent to notify operating personal (step S90) by program logic controller 34.If the judged result of step S88 is yes, or after step S90 sends prompting message, rotating mechanism 23 90-degree rotation (step S92) can be controlled by program logic controller 34, take out the substrate 38 (detection acceptance or rejection) having completed overlay film for operating personal.And then re-execute step S70 again again to put the substrate 38 of another non-overlay film.
After implementing above-mentioned every step, carry out the work such as detection of particulates, overlay film and bubble detection to complete undersized film layer of the present invention 20 pairs of substrates 38.Wherein, the present embodiment is arranged in pairs or groups through overlay film platform 22 and is inhaled the design of film tool 28 and fluorescence detector 32, except can reaching the automatic detection before and after substrate 38 overlay film, when repeating and continue to perform above-mentioned every step, detect after the front detection of the pan feeding of substrate 38, overlay film, overlay film and overlay film and synchronously carried out, use and effectively promote prouctiveness.
Please refer to Fig. 6 to Fig. 9, be respectively the block diagram of the second embodiment of film layer of the present invention, lateral plan, back view and birds-eye view.Wherein, the second embodiment is the actual enforcement aspect being such as used for illustrating large-sized film layer.
In Fig. 6 to 9, large-sized film layer 100 includes overlay film platform 102, Juan Mo mechanism 104, roller indenter device 106, header system 108, alignment sensor 110, one fluorescence detector 112 and can program logic controller (not shown, to be installed in the below of film layer 100).Can be used for controlling the running of overlay film platform 102 and header system 108 by program logic controller, overlay film platform 102 is wherein used to carrying one substrate (not shown), and can be mobile in the outside of Juan Mo mechanism 104 and lower horizontal.
The mode that header system 108 is through mechanism's interlock is further to the running of control Juan Mo mechanism 104 and roller indenter device 106.Wherein, Juan Mo mechanism 104 includes that one goes out film material tray 114, cylinder 116 and reclaims charging tray 118.Go out film material tray 114 to load and scrolling goes out to post the adhesive tape of pad pasting (such as release film).Cylinder 116 is arranged at out the downstream of film material tray 114, is used for carrying and carrying adhesive tape to the overlay film position of posting pad pasting.Reclaim charging tray 118 scrolling and reclaim the adhesive tape having peeled off pad pasting.More specifically, header system 108 control Juan Mo mechanism 104 carries and carries adhesive tape to the overlay film position that posts pad pasting, and control roller indenter device 106 to move to one and treat the original position that roll extrusion is fitted, to control the mode that roller indenter device 106 utilizes roll extrusion to fit further, the pad pasting in Juan Mo mechanism 104 is peeled off, and pad pasting is pasted on the substrate that carries to overlay film platform 102.
In addition, the alignment sensor 110 of the present embodiment design, its be used to detect in Juan Mo mechanism 104 this post the position of the adhesive tape of pad pasting.And header system 108 can be controlled further according to the detecting result of alignment sensor 110 and carry out a locating procedure, to guarantee the particularity of follow-up overlay film by program logic controller.Wherein, alignment sensor 110 is made up of (the present embodiment is two optical fiber) several optical fiber.
Moreover fluorescence detector 112 is made up of several optical coupling assembly (as: charge coupled device (CCD) (ChargeCoupled Device, CCD)) 120, the present embodiment is that citing comprises two optical coupling assemblies 120.Fluorescence detector 112 is used for detecting the bubble on the substrate that is dirty and overlay film such as surface scratches or dust fall particulate on the substrate of the non-overlay film be seated on overlay film platform 102.And a prompting message (as warning sound, flash of light etc.) can be produced according to the testing result of fluorescence detector 112 by program logic controller.
In actual operation; when can program logic controller judge substrate before overlay film with after quality bad (surface before such as substrate overlay film produces bubble after having the particulate or substrate overlay film being greater than more than 1mm) time, can will send a prompting message by program logic controller.By this, to reach before and after overlay film the demand of substrate situation can automatically be detected time.
Figure 10 is the second embodiment diagram of circuit of film covering method of the present invention.When the operating process of Figure 10 is described, simultaneously with reference to every assembly of the film layer 100 of figure 6 to Fig. 9.
First, the program of opening initialization can be carried out by program logic controller, with to can the parameters of program logic controller internal preset set (step S130).If opening initialization can cannot be completed by program logic controller, then can send prompting message (such as sending warning sound) to notify operating personal (step S132) by program logic controller, by operating personal to carrying out removal of obstacle by program logic controller, and by re-executing step S130 by program logic controller after completing.
Can after program logic controller completes opening initialization, reference position (step S134) can be got back to by program logic controller according to default state modulator header system 108, wherein because header system 108 is through mode control Juan Mo mechanism 104 and the roller indenter device 106 of mechanism's interlock, therefore, when header system 108 gets back to reference position, Juan Mo mechanism 104 and roller indenter device 106 can get back to reference position equally.
Next, can judge whether header system 108 gets back to reference position (step S138) by program logic controller, if the judged result of step S138 is no, then repeat step S134, until header system 108 gets back to reference position.If the judged result of step S138 is yes, then can start membrane through header system 108 control Juan Mo mechanism 104 by program logic controller, to carry out a pan feeding program (step S146) of the adhesive tape posting pad pasting.Specifically, header system 108 controls out the adhesive tape that film material tray 114 scrolling goes out to post pad pasting, and control to reclaim the scrolling of charging tray 118 and pull the adhesive tape posting pad pasting, and the adhesive tape making full wafer post pad pasting supports by cylinder 116 and scrolling and carrying.In addition, reclaim charging tray 118 after pad pasting is peeled off, be namely used for reclaiming the adhesive tape peeling off pad pasting.
Additionally, when header system 108 control out film material tray 114 scrolling go out adhesive tape time, can judge whether the adhesive tape that film material tray 114 is loaded uses further by program logic controller.If adhesive tape uses, then can will send prompting message by program logic controller, and suspend the current work of film layer 100.Thus, operating personal can carry out Non-follow control header system 108 (step S136) after replacing adhesive tape, gets back to reference position to allow header system 108 perform step S134.
When step S146 carries full wafer to post the adhesive tape of pad pasting, can program logic controller be carry out a locating procedure (step S148) according to the detecting result of alignment sensor 110 further.
The concrete locating procedure of the present embodiment can utilize shown in Fig. 9 angle is set and direction illustrates to carry out following running: first, can program logic controller mobile towards the direction (from left to right) of alignment sensor 110 through header system 108 control Juan Mo mechanism 104.Wherein, the alignment sensor 110 of the present embodiment such as adopts two positions to design at the optical fiber of same level line, this horizon is the right edge being parallel to overlay film platform 102, makes two optical fiber be used for the same side of the pad pasting detected on the adhesive tape that carries of Juan Mo mechanism 104.
Thus, when only having arbitrary optical fiber to detect pad pasting, namely pad pasting is represented relative to overlay film platform 102 in crooked, now can stop moving on through header system 108 control Juan Mo mechanism 104 and carry out the adjustment of horizontal direction rotation based on vertical axis by program logic controller, making two optical fiber all can detect pad pasting; And when two optical fiber all detect pad pasting, namely a predeterminable range also can be moved towards the direction (from right to left) away from alignment sensor 110 through the adjustment of the horizontal rotation of header system 108 control Juan Mo mechanism 104 stopping by program logic controller; Afterwards, can move towards the direction (from left to right) of alignment sensor 110 through header system 108 control Juan Mo mechanism 104 again by program logic controller, and when two optical fiber detect the pad pasting that Juan Mo mechanism 104 carries, control Juan Mo mechanism 104 halts.By this, namely Juan Mo mechanism 104 is that conveying posts the adhesive tape of pad pasting to overlay film position, and pad pasting is also in accurate position.
From the above, after step S148 completes locating procedure, can judge whether overlay film platform 102 puts (step S163) in place further by program logic controller.If the judged result of step S163 is no, then represents overlay film platform 102 and not yet put in place, therefore repeated execution of steps S163, to wait for that overlay film platform 102 puts in place.But the steps flow chart before wait overlay film platform 102 puts in place can be such as the program of execution one pan feeding substrate.Specifically, by operating personal, the substrate of non-overlay film is seated in overlay film platform 102 (step S156), the overlay film platform 102 of the present embodiment can be such as inhale vacuum mode to fix substrate.And then, several optical coupling assemblies 120 of program logic controller control both optical detector 112 can automatically detect the particulate put on the substrate of non-overlay film, and judge whether the size of the particulate on the substrate of non-overlay film and quantity conform with the regulations (step S160) according to the testing result of fluorescence detector 112.
If the judged result of step S160 is no, then can send prompting message (such as send warning sound) and, to notify operating personal (step S162), by operating personal, substrate against regulation taken out from overlay film platform 102 by program logic controller.Then step S156 and step thereafter thereof is repeated, again to perform the flow process of pan feeding substrate.Otherwise, if the judged result of step S160 is yes, then can move to overlay film position by program logic controller control overlay film platform 102.Now can program logic controller in the judgement of step S163, can judge that overlay film platform 102 puts in place.And then, roller indenter device 106 ground roll of being taken advantage of a situation by pad pasting can be controlled through header system 108 and is pressed on the substrate (step S164) of non-overlay film qualified after testing by program logic controller.
Then, can judge whether overlay film completes (step S166) by program logic controller.In simple terms, can judge whether the roll extrusion distance of roller indenter device 106 reaches the length of a substrate to judge whether that overlay film completes by program logic controller.If the judged result of step S166 is no, then repeated execution of steps S164, to continue to carry out overlay film.If the judged result of step S166 is yes, then can controls roller indenter device 106 through header system 108 and stop roll extrusion pad pasting by program logic controller, and control the substrate (step S168) that roller indenter device 106 leaves overlay film.
After completing overlay film, can program logic controller except repeated execution of steps S134 control header system 108 get back to reference position and and then perform except step S134 steps flow chart thereafter, also synchro control overlay film platform 102 shifts out overlay film position, below several optical coupling assemblies 120 that the substrate being also about to overlay film moves to fluorescence detector 112 (step S170).And then these optical coupling assemblies 120 can be controlled again automatically detect bubble on the substrate of overlay film, to judge according to the testing result of fluorescence detector 112 whether the size of the bubble on the substrate of overlay film and quantity conform with the regulations (step S172) by program logic controller.
If the judged result of step S172 is no, represent that the bubble on the substrate of overlay film exceeds regulation, so prompting message (such as sending warning sound) can be sent to notify operating personal (step S176) by program logic controller.If the judged result of step S172 is yes, or after step S176 sends prompting message, then operating personal takes out the substrate (detection acceptance or rejection) having completed overlay film, and and then make to re-execute step S156 by program logic controller, with the substrate of another non-overlay film of pan feeding again.
After implementing above-mentioned every step, carry out the work such as detection of particulates, overlay film and bubble detection to complete large-sized film layer of the present invention 100 pairs of substrates.
Advantage of the present invention provides a kind of film layer and film covering method, utilize the fluorescence detector of film layer to detect the situation that the dust fall of substrate before overlay film is attached to substrate, and detect the situation of the bubble generation of substrate after overlay film, the substrate that Timeliness coverage overlay film is bad, to reach the effect of the overall yield improving substrate overlay film, and film layer realizes, and the precision of substrate overlay film is high, speed fast, bubble-free, reaches simple to operate, be convenient to management and the feature such as practical strong simultaneously.
Although the present invention describes as above, precisely because should not be regarded as restricted person with reference to preferred embodiment and illustrative accompanying drawing.Be familiar with the content of this those skilled in the art to its form and concrete example and make various amendment, omission and change, all do not leave the scope that claim of the present invention is advocated.
Claims (11)
1. a film layer, comprises:
One overlay film platform, is used for carrying at least one substrate for overlay film;
One Juan Mo mechanism, is used for carrying and carry the adhesive tape that posts pad pasting;
One roller indenter device, is used for peeling off the pad pasting in this Juan Mo mechanism, so that this pad pasting roll extrusion is conformed to this substrate;
One header system, controls the movement of this Juan Mo mechanism and this roller indenter device;
One alignment sensor, detect in this Juan Mo mechanism this post the position of the adhesive tape of pad pasting;
One fluorescence detector, is used for the quality of this substrate detected before and after overlay film on this overlay film platform; And
One can program logic controller, control the running of this overlay film platform and this header system, and control this header system according to the detecting result of this alignment sensor further and carry out a locating procedure, and produce a prompting message according to the testing result of this fluorescence detector.
2. film layer as claimed in claim 1, it is characterized in that, described fluorescence detector comprises a plurality of optical coupling assembly.
3. film layer as claimed in claim 1, it is characterized in that, described overlay film platform comprises further:
One rotating mechanism; And
A plurality of bearing fixture, is arranged on this rotating mechanism, is used for respectively carrying this substrate.
4. film layer as claimed in claim 3, is characterized in that, comprise further:
One film carrier platform;
One inhales film tool, is used for adsorbing and peels off the pad pasting on this film carrier platform, and by the substrate of this attachment film on this bearing fixture.
5. film layer as claimed in claim 4, it is characterized in that, described Juan Mo mechanism comprises:
One goes out film material tray, loads also scrolling and goes out the adhesive tape that this posts pad pasting;
At least one cylinder, is arranged at this and goes out film material tray downstream, is used for supporting and carrying this to post the adhesive tape of pad pasting; And
One reclaims charging tray, and scrolling reclaims the adhesive tape that this has peeled off pad pasting.
6. film layer as claimed in claim 1, it is characterized in that, described Juan Mo mechanism comprises:
One goes out film material tray, loads also scrolling and goes out the adhesive tape that this posts pad pasting;
At least one cylinder, is arranged at this and goes out film material tray downstream, is used for carrying and carrying the adhesive tape that this posts pad pasting; And
One reclaims charging tray, and scrolling reclaims the adhesive tape that this has peeled off pad pasting.
7. a film covering method, is characterized in that, step comprises:
Perform a pan feeding program; This pan feeding program comprises:
Scrolling one Juan Mo mechanism, posts the adhesive tape of pad pasting with pan feeding one;
Control a roller indenter device, be used for peeling off the pad pasting in this Juan Mo mechanism, so that this pad pasting roll extrusion is conformed to a substrate;
Run a header system, to control the movement of this Juan Mo mechanism and this roller indenter device;
Run an alignment sensor, post the position of the adhesive tape of pad pasting with this detecting in this Juan Mo mechanism;
Through a fluorescence detector, with rear before carrying out overlay film to a substrate, automatically detect the quality of this substrate; And
Running one can program logic controller, to control the running of this overlay film platform and this header system, and control this header system according to the detecting result of this alignment sensor further and carry out a locating procedure, and produce a prompting message according to the testing result of this fluorescence detector.
8. film covering method as claimed in claim 7, it is characterized in that, the step of this execution pan feeding program comprises further:
Rotate an overlay film platform, with this substrate of pan feeding, wherein this overlay film platform comprises a plurality of bearing fixture being used for carrying this substrate.
9. film covering method as claimed in claim 7, is characterized in that, whether after the step performing this pan feeding substrate, automatically detecting this substrate through this fluorescence detector further has dirty.
10. film covering method as claimed in claim 8, is characterized in that, comprise further:
Adsorb and peel off this pad pasting;
Locate the position of the pad pasting that this adsorbs; And
Paste this pad pasting in this substrate.
11. film covering methods as claimed in claim 10, is characterized in that, at this pad pasting of laminating after this substrate, whether the substrate automatically detecting this overlay film through this fluorescence detector further has bubble.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110289590.0A CN102991750B (en) | 2011-09-18 | 2011-09-18 | Laminating machine and laminating method |
| TW101117184A TWI565645B (en) | 2011-09-18 | 2012-05-15 | Film laminating machine and film laminating method |
| TW101209137U TWM440936U (en) | 2011-09-18 | 2012-05-15 | Film laminating machine |
| JP2012202753A JP5731457B2 (en) | 2011-09-18 | 2012-09-14 | Film laminating apparatus and film laminating method |
| KR1020120102649A KR101553359B1 (en) | 2011-09-18 | 2012-09-17 | Film lamination method and an apparatus for carrying out the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110289590.0A CN102991750B (en) | 2011-09-18 | 2011-09-18 | Laminating machine and laminating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102991750A CN102991750A (en) | 2013-03-27 |
| CN102991750B true CN102991750B (en) | 2015-06-24 |
Family
ID=47717309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110289590.0A Expired - Fee Related CN102991750B (en) | 2011-09-18 | 2011-09-18 | Laminating machine and laminating method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5731457B2 (en) |
| KR (1) | KR101553359B1 (en) |
| CN (1) | CN102991750B (en) |
| TW (2) | TWI565645B (en) |
Families Citing this family (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103318451B (en) * | 2013-07-02 | 2015-08-05 | 江苏科瑞恩自动化科技有限公司 | A kind of automatic film coating |
| CN104340406A (en) * | 2013-07-29 | 2015-02-11 | 昌硕科技(上海)有限公司 | Film sticking device |
| CN104340392A (en) * | 2013-07-29 | 2015-02-11 | 昌硕科技(上海)有限公司 | Envelope device |
| CN103723300B (en) * | 2013-12-10 | 2016-01-20 | 周俊雄 | Ventilated membrane chip mounter |
| CN103879587B (en) * | 2014-03-14 | 2016-04-20 | 东莞市上川自动化设备有限公司 | A kind of Full-automatic film sticking machine |
| CN103950602B (en) * | 2014-04-22 | 2016-05-25 | 苏州博智电子科技有限公司 | A kind of CD-ROM drive surface automatic film-laminating device |
| CN104176309A (en) * | 2014-08-19 | 2014-12-03 | 苏州赛腾精密电子有限公司 | Three-axis linkage turnover film sticking mechanism |
| CN104150011A (en) * | 2014-08-25 | 2014-11-19 | 昆山迈致治具科技有限公司 | Automatic sticking film machine |
| CN104308889B (en) * | 2014-09-16 | 2016-09-21 | 傅潍 | A kind of pad pasting cutting machine |
| CN104386510A (en) * | 2014-10-30 | 2015-03-04 | 昆山迈致治具科技有限公司 | Transport unit for Mylar paper |
| CN104724312A (en) * | 2015-03-23 | 2015-06-24 | 惠州Tcl移动通信有限公司 | Film pasting device |
| CN105151385B (en) * | 2015-07-09 | 2016-05-18 | 濠玮电子科技（惠州）有限公司 | A kind of chain transmission type automatic film applicator and film coating process thereof |
| CN104944202B (en) * | 2015-07-22 | 2017-03-08 | 苏州市万祥电器成套有限公司 | Electronic component automatic detection envelope material device |
| CN105292657B (en) * | 2015-11-12 | 2017-07-18 | 东莞市领恒智能自动化有限公司 | Visual positioning mobile phone accessory mounting system |
| CN105314154A (en) * | 2015-11-16 | 2016-02-10 | 太原风华信息装备股份有限公司 | Turnover device for large-size laminating machine |
| CN105485546B (en) * | 2015-12-31 | 2019-03-05 | 广东长天精密设备科技有限公司 | Adhesive tape feeding device |
| CN105786248A (en) * | 2016-02-25 | 2016-07-20 | 成都亨通兆业精密机械有限公司 | Automatic assembling device for touch screen production |
| DE102016221527A1 (en) * | 2016-11-03 | 2018-05-03 | Koenig & Bauer Ag | Retractable lamination machine and method for laminating a material |
| WO2018119645A1 (en) * | 2016-12-27 | 2018-07-05 | 深圳市柔宇科技有限公司 | Lamination device for curved surface, and lamination method |
| CN106628343A (en) * | 2016-12-30 | 2017-05-10 | 大连益盛达智能科技有限公司 | Automatic adhesion mechanism for pull tape of full-automatic backlight machine |
| TWI668158B (en) * | 2017-03-14 | 2019-08-11 | 萬潤科技股份有限公司 | Component bonding method and device |
| CN106966208B (en) * | 2017-03-15 | 2019-01-22 | 广东天机工业智能系统有限公司 | The orderly distribution equipment of production line |
| CN107031893B (en) * | 2017-05-31 | 2020-02-21 | 深圳市宝尔威精密机械有限公司 | General material machine that connects of SMD carrier band |
| CN109656419B (en) * | 2019-02-15 | 2021-01-26 | 广州视源电子科技股份有限公司 | Rolling manufacturing method of touch panel |
| CN110001132B (en) * | 2019-04-19 | 2021-06-01 | 百丽特包装有限公司 | Paper product molding equipment |
| CN110143480B (en) * | 2019-05-22 | 2024-05-07 | 东莞市源绮数控机械有限公司 | Material mechanism is shelled to tectorial membrane |
| CN110526023B (en) * | 2019-08-08 | 2021-09-17 | 潍坊路加精工有限公司 | Adhesive tape attaching device |
| CN110901036A (en) * | 2019-11-29 | 2020-03-24 | 无锡职业技术学院 | A positioning mechanism in a CNC laminating machine |
| CN111731555A (en) * | 2020-07-17 | 2020-10-02 | 宁波峰梅新能源汽车科技有限公司 | Automatic plane pad pasting equipment |
| CN112090771B (en) * | 2020-08-28 | 2021-11-26 | 苏州天立达精密科技股份有限公司 | Assembly line AOI visual inspection machine |
| CN113997505A (en) * | 2021-12-03 | 2022-02-01 | 惠州市宏琪瑞电子科技有限公司 | An integrated device for injection molding |
| CN114359155A (en) * | 2021-12-07 | 2022-04-15 | 中国科学院深圳先进技术研究院 | Film laminating method and system |
| TWI810114B (en) * | 2022-11-22 | 2023-07-21 | 鼎燿機械股份有限公司 | Packaging film cutting method, cutting die and cutting equipment thereof |
| CN117645030A (en) * | 2024-01-29 | 2024-03-05 | 歌尔股份有限公司 | Film pasting device and processing equipment |
| CN118382209B (en) * | 2024-05-20 | 2025-03-18 | 杭州亿生德科技有限公司 | Circuit board flattening device |
| CN119450942A (en) * | 2024-11-26 | 2025-02-14 | 丰顺县和生电子有限公司 | A flattening device for circuit board production and processing |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1310432A1 (en) * | 2001-11-07 | 2003-05-14 | LINTEC Corporation | Laminating apparatus for optical disc |
| CN1640661A (en) * | 2004-01-06 | 2005-07-20 | 升达科技股份有限公司 | Film sticking/testing equipment and its film sticking device and testing device |
| CN1908638A (en) * | 2006-08-24 | 2007-02-07 | 上海交通大学 | Optical detecting instrument of defects in glass |
| CN201222145Y (en) * | 2008-07-16 | 2009-04-15 | 上海索广电子有限公司 | Automatic gumming machine for touch screen |
| CN101870380A (en) * | 2009-04-24 | 2010-10-27 | 中茂电子(深圳)有限公司 | Protecting method and film sticking equipment of optical elements |
| CN201960799U (en) * | 2011-01-27 | 2011-09-07 | 深圳市东方亮彩精密技术有限公司 | Automatic sticking film machine for front and back of mobile phone shell |
| CN202271629U (en) * | 2011-09-18 | 2012-06-13 | 瑞世达科技(厦门)有限公司 | Film laminating machine |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001124660A (en) * | 1999-10-25 | 2001-05-11 | Horiba Ltd | Inspection method and inspection device of defect and foreign matter for flat panel flat display device |
| TWM241154U (en) * | 2003-07-09 | 2004-08-21 | Univ Nat Taiwan Science Tech | Appearance detecting equipment of components |
| TWI245731B (en) * | 2003-12-26 | 2005-12-21 | Sentelic Corp | Pasting-film/testing equipment |
| JP2007171622A (en) * | 2005-12-22 | 2007-07-05 | Sharp Corp | Method of manufacturing display device and display device |
| JP2009186497A (en) * | 2008-02-01 | 2009-08-20 | Sharp Corp | Apparatus for manufacturing liquid crystal display panel and method of manufacturing liquid crystal display panel |
| TW201002052A (en) * | 2008-06-30 | 2010-01-01 | Chung Shan Inst Of Science | Automatic detection system and method for dynamic image |
| TW201034913A (en) * | 2009-03-16 | 2010-10-01 | Chroma Ate Inc | Automated optical device protection method and optical device lamination facility |
| JP5468142B2 (en) * | 2009-12-08 | 2014-04-09 | ハン、ドン ヒ | Film adhesion apparatus and adhesion method |
-
2011
- 2011-09-18 CN CN201110289590.0A patent/CN102991750B/en not_active Expired - Fee Related
-
2012
- 2012-05-15 TW TW101117184A patent/TWI565645B/en not_active IP Right Cessation
- 2012-05-15 TW TW101209137U patent/TWM440936U/en not_active IP Right Cessation
- 2012-09-14 JP JP2012202753A patent/JP5731457B2/en not_active Expired - Fee Related
- 2012-09-17 KR KR1020120102649A patent/KR101553359B1/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1310432A1 (en) * | 2001-11-07 | 2003-05-14 | LINTEC Corporation | Laminating apparatus for optical disc |
| CN1640661A (en) * | 2004-01-06 | 2005-07-20 | 升达科技股份有限公司 | Film sticking/testing equipment and its film sticking device and testing device |
| CN1908638A (en) * | 2006-08-24 | 2007-02-07 | 上海交通大学 | Optical detecting instrument of defects in glass |
| CN201222145Y (en) * | 2008-07-16 | 2009-04-15 | 上海索广电子有限公司 | Automatic gumming machine for touch screen |
| CN101870380A (en) * | 2009-04-24 | 2010-10-27 | 中茂电子(深圳)有限公司 | Protecting method and film sticking equipment of optical elements |
| CN201960799U (en) * | 2011-01-27 | 2011-09-07 | 深圳市东方亮彩精密技术有限公司 | Automatic sticking film machine for front and back of mobile phone shell |
| CN202271629U (en) * | 2011-09-18 | 2012-06-13 | 瑞世达科技(厦门)有限公司 | Film laminating machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101553359B1 (en) | 2015-09-30 |
| JP2013063655A (en) | 2013-04-11 |
| KR20130030730A (en) | 2013-03-27 |
| CN102991750A (en) | 2013-03-27 |
| JP5731457B2 (en) | 2015-06-10 |
| TWM440936U (en) | 2012-11-11 |
| TW201313594A (en) | 2013-04-01 |
| TWI565645B (en) | 2017-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102991750B (en) | Laminating machine and laminating method | |
| CN111974708B (en) | Appearance detection mechanism and detection process for electronic equipment | |
| CN103529585B (en) | A kind of full-automatic backlight group erects standby | |
| CN105752393A (en) | Film laminating machine | |
| CN201769429U (en) | Laminating machine with automatic product detection | |
| CN107262380A (en) | A kind of cell phone back light source vision automatic checkout equipment and detection method | |
| CN105729472A (en) | A system and method for sorting and packing bulb lamps based on machine vision | |
| CN1909203A (en) | Clamping device, substrate transmitting device, and on-line fpd automatic optical detection device | |
| CN110624856A (en) | A kind of OCA detection equipment | |
| CN202271629U (en) | Film laminating machine | |
| CN111774323A (en) | CCD machine vision full-size detection equipment | |
| CN102621149B (en) | Substrate detection device and method | |
| CN206270256U (en) | A kind of commutator visual detection equipment | |
| CN205588749U (en) | It is soft to gluey laminating device of hard OCA | |
| CN213435767U (en) | Visual detection device of automobile central control screen | |
| CN204433133U (en) | A kind of Full-automatic film sticking machine | |
| CN205222049U (en) | Arrangement machine | |
| CN205139032U (en) | A image acquisition device for cell -phone glass panels hole limit defect detecting | |
| CN210148735U (en) | High accuracy pad pasting detects machine | |
| CN206485644U (en) | Safeguard film for cellular phone positioner | |
| CN108994594A (en) | High-precision mobile phone threaded lens screwing machine | |
| CN203185799U (en) | A kind of manipulator device suitable for lamination machine | |
| CN109675831A (en) | Battery core appearance delection device, battery core appearance detecting method and its round up- coiler | |
| KR101425622B1 (en) | Hard coating device for film and method thereof | |
| CN205105467U (en) | Automatic plug -in components equipment of PCB board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160512 Address after: 361009, No. 199, Sakamoto Road, information photoelectric Park, torch hi tech Zone, Fujian, Xiamen Patentee after: TPK Touch Solutions (Xiamen) Inc. Address before: 361009 Fujian Province, Xiamen torch hi tech Zone information photoelectric park is Sakamoto Road No. 199 Patentee before: Ray-Star Technology (Xiamen) Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20170918 |