CN102983121B - Manufacturing method and structure of three-dimensional inductive carrier with metal core - Google Patents

Abstract

The invention relates to a method for manufacturing a three-dimensional inductor carrier with a metal core part and a structure thereof, wherein the method comprises the following steps: providing a substrate; forming a first metal layer, wherein the first metal layer is provided with a first conducting pad and a plurality of first inductance parts, and each first inductance part is provided with a first connection end point and a second connection end point; forming a first dielectric layer on the protective layer to form a second metal layer, wherein the second metal layer is provided with a second inductance part, a plurality of third inductance parts, a plurality of fourth inductance parts and a metal core part, the second inductance part is connected with the first conducting pad, each third inductance part is connected with each second connection end point, and each fourth inductance part is connected with each first connection end point; forming a second dielectric layer on the first dielectric layer; and forming a third metal layer to enable the third metal layer to be provided with a fifth inductance part and a plurality of sixth inductance parts, wherein the fifth inductance part is connected with the second inductance part and the third inductance part, and each sixth inductance part is connected with the third inductance part and the fourth inductance part.

Description

Manufacturing method and structure of three-dimensional inductive carrier with metal core

technical field

The invention relates to a method for manufacturing a carrier, in particular to a method for manufacturing a three-dimensional inductive carrier with a metal core and its structure.

Background technique

Most of the existing known inductors are planar inductors, which design the inductor pattern and circuit pattern on the same plane. Since the inductor and the circuit are on the same plane, the problem of parasitic capacitance must be overcome, so the size of the chip cannot be reduced, and Planar inductors cannot form several turns with the same radius, but can only form a turbine-shaped structure with a larger radius.

It can be seen that the structure and use of the above-mentioned existing inductive load cell obviously still have inconveniences and defects, and further improvement is urgently needed. In order to solve the above-mentioned existing problems, relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and manufacturing method for the general structure and manufacturing method to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve. Therefore, how to create a new manufacturing method and structure of a three-dimensional inductance carrier with a metal core is one of the current important research and development topics, and it has also become a goal that the industry needs to improve.

Contents of the invention

The purpose of the present invention is to provide a new manufacturing method and structure of a three-dimensional inductance carrier with a metal core, which can reduce the wiring area on the same plane and reduce the chip size, and has the effect of increasing coil density and magnetic flux. In addition, since the three-dimensional inductors are designed on different planes, the magnetic flux direction of the inductors also changes from vertical to horizontal, which is helpful for the design of electromagnetic coupling of flip-chip modules in the flip-chip process.

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. According to a method for manufacturing a three-dimensional inductance carrier with a metal core provided by the present invention, it at least includes the following steps: providing a substrate, the substrate has a surface, a first welding pad and a protective layer, the first welding pad It is arranged on the surface, the protection layer is formed on the surface, and the protection layer has a first welding pad opening, a first contact point setting area and a plurality of first inductor part setting areas, and the first welding pad opening exposes the the first welding pad and the opening of the first welding pad is located in the first contact point setting area; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a first opening and a plurality of first openings An inductance part slot, the first opening reveals the first contact point setting area, and the first inductance part slots expose the first inductance part setting area; a first metal layer is formed on the first opening and The slot holes of the first inductance parts make the first metal layer have a first conductive pad and a plurality of first inductance parts, each of the first inductance parts has a first connection terminal and a second connection terminal, And each of the first inductance parts has a first height; remove the first photoresist layer; form a first dielectric layer on the protective layer and cover the first metal layer, the first dielectric layer has a first A connection pad opening, a plurality of first connection terminal openings and a plurality of second connection terminal openings, the first connection pad opening reveals the first connection pad, each of the first connection terminal openings reveals each of the first connection terminals, each of the second connection terminal openings exposes each of the second connection terminals; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a second inductance portion setting hole, A plurality of third inductance part setting holes, a plurality of fourth inductance part setting holes and a slot, the second inductance part setting holes expose the first conductive pad, each of the third inductance part setting holes exposes each of the first Each of the fourth inductance part setting holes exposes each of the second connection terminals, the slot is located between each of the third inductance part setting holes and each of the fourth inductance part setting holes and the slot exposes the first The dielectric layer, wherein the second inductance part setting hole has a first top end, and the distance between the first top end and the first conductive pad has a first depth, and each of the third inductance part setting holes has a second top end , there is a second depth between each of the second tops and each of the first connection terminals, each of the fourth inductance part setting holes has a third top, and there is a distance between each of the third tops and each of the second connection terminals A third depth, the groove has a fourth top, and there is a fourth depth between the fourth top and the first dielectric layer, the first depth, the second depth and the third depth are greater than the first depth Four depths; forming a second metal layer in the second inductance portion setting holes, the third inductance portion setting holes, the fourth inductance portion setting holes and the slot, so that the second metal layer has a first Two inductance parts, a plurality of third inductance parts, a plurality of fourth inductance parts and a metal core part, the second inductance part is connected to the first conductive pad and the second inductance part has a first top surface and a first first surface Two heights, each of the third inductance parts is connected to each of the second connection terminals and each of the third inductance parts has a second top surface and a third height, each of the fourth inductance parts is connected to each of the first connection terminals and each of the fourth inductance parts is connected to each of the first connection terminals The fourth inductance part has a third top surface and a fourth height, the second height, the third height and the fourth height are greater than the first height, the metal core has a bottom surface, the first metal layer has a first upper surface, the bottom surface and There is a first distance between the first upper surfaces; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer and covering the second metal layer, the second dielectric layer It has a second inductance portion exposure hole, a plurality of third inductance portion exposure holes and a plurality of fourth inductance portion exposure holes, the second inductance portion exposure hole exposes the first top surface, each of the third inductance portion exposure holes exposes Each of the second top surfaces, each of the fourth inductor portion exposure holes expose each of the third top surfaces; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a first The fifth inductance part is provided with slots and a plurality of sixth inductance parts are provided with slots, the fifth inductance part is provided with slots to expose the first top surface and the second top surface, and each of the sixth inductance parts is provided with slots to expose each of the The second top surface and each of the third top surfaces; and forming a third metal layer to set the slot holes in the fifth inductance part and the sixth inductance parts, so that the third metal layer has a fifth an inductance part and a plurality of sixth inductance parts, the fifth inductance part is connected to the second inductance part and the third inductance part, each of the sixth inductance parts is connected to the third inductance part and the fourth inductance part, and the fifth The inductance part has a fifth height, each of the sixth inductance parts has a sixth height, and the second height, the third height and the fourth height are greater than the fifth height and the sixth height.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

The aforementioned three-dimensional inductive load bearing method with a metal core, wherein the third metal layer has a first lower surface, the metal core has a fourth top surface, the fourth top surface and the first lower surface There is a second distance between the surfaces.

The aforementioned method of manufacturing a three-dimensional inductance carrier with a metal core, wherein the metal core has a fourth top surface, the first top surface of each of the second inductance parts, the first top surface of each of the third inductance parts The two top surfaces and the third top surface of each fourth inductor part are higher than the fourth top surface of the metal core part.

In the aforementioned manufacturing method of a three-dimensional inductance carrier with a metal core, the material of the fifth inductance part and each of the sixth inductance parts is selected from one of copper, silver or a combination thereof.

The aforementioned three-dimensional inductance carrier with a metal core is manufactured, wherein the material of the second inductance, each of the third inductance, each of the fourth inductance and the metal core is selected from nickel, iron or one of its combinations.

The aforementioned method for manufacturing a three-dimensional inductance carrier with a metal core further includes a second conductive pad formed on the protection layer, and the substrate further has a second solder pad, and the second conductive pad is formed on the protective layer. The pad is electrically connected to the second pad.

The aforementioned manufacturing method of the three-dimensional inductance carrier with the metal core further includes a third conductive pad formed on the second dielectric layer and electrically connected to the fifth inductive part.

In the aforementioned manufacturing method of a three-dimensional inductance carrier with a metal core, the second metal layer has a seventh inductance part, and the second conductive pad is connected to the seventh inductance part.

In the aforementioned manufacturing method of a three-dimensional inductance carrier with a metal core, the third metal layer has an eighth inductance part, and the eighth inductance part is connected to the seventh inductance part and the fourth inductance part.

The aforementioned method for manufacturing a three-dimensional inductive carrier with a metal core further includes: a step of removing the third photoresist layer.

The aforementioned manufacturing method of a three-dimensional inductance carrier with a metal core further includes a second conductive pad formed on the second dielectric layer, the third metal layer has an eighth inductance part, and the eighth inductance part connecting the second conductive pad and the fourth inductance part.

The aforementioned method for manufacturing a three-dimensional inductance carrier with a metal core further includes: a step of forming a third dielectric layer on the second dielectric layer, and the third dielectric layer covers the third metal layer.

The aforementioned manufacturing method of the three-dimensional inductance carrier with the metal core further includes: a step of forming a nickel-gold protection layer on the third metal layer.

The purpose of the present invention and the solution to its technical problem also adopt the following technical solutions to achieve. According to the present invention, a three-dimensional inductance carrier structure with a metal core comprises at least: a substrate having a surface, a first welding pad and a protective layer, the first welding pad is arranged on the surface, The protection layer is formed on the surface, the protection layer has a first pad opening and the first pad opening exposes the first pad; a first metal layer is formed on the protection layer, the first metal layer It has a first conductive pad and a plurality of first inductance parts, each of the first inductance parts has a first connection terminal and a second connection terminal, and each of the first inductance parts has a first height; a first a dielectric layer formed on the protection layer and covering the first metal layer, the first dielectric layer has a first contact pad opening, a plurality of first connection terminal openings and a plurality of second connection terminal openings, the The first connection pad opening exposes the first connection pad, each of the first connection terminal openings exposes each of the first connection terminals, and each of the second connection terminal openings exposes each of the second connection terminals; a second metal layer, It is formed on the first dielectric layer, the second metal layer has a second inductance part, a plurality of third inductance parts and a plurality of fourth inductance parts, the second inductance part is connected to the first conductive pad and the The second inductance part has a first top surface and a second height, each of the third inductance parts is connected to each of the first connection terminals and each of the third inductance parts has a second top surface and a third height, and each of the third inductance parts has a second top surface and a third height. The fourth inductance part is connected to each of the second connection terminals and each of the fourth inductance parts has a third top surface and a fourth height, and the second height, the third height and the fourth height are greater than the first height; A second dielectric layer, which is formed on the first dielectric layer and covers the second metal layer, the second dielectric layer has a second inductance part exposure hole, a plurality of third inductance part exposure holes and a plurality of The fourth inductance part exposes holes, the second inductance part exposes the first top surface, each of the third inductance part exposes the second top surface, and each of the fourth inductance part exposes the third top surface; a metal core formed on the first dielectric layer and located between each of the third inductance parts and each of the fourth inductance parts of the second metal layer, the metal core has a bottom surface and a a fourth top surface, the first metal layer has a first upper surface, there is a first distance between the bottom surface and the first upper surface; and a third metal layer is formed on the second dielectric layer, The third metal layer has a first lower surface, a fifth inductance part and a plurality of sixth inductance parts, there is a second distance between the fourth top surface and the first lower surface, and the fifth inductance part is connected to The second inductance part and the third inductance part, each of the sixth inductance part is connected to the third inductance part and the fourth inductance part, the fifth inductance part has a fifth height, and each of the sixth inductance parts has a The sixth height, the second height, the third height and the fourth height are greater than the fifth height and the sixth height.

The purpose of the present invention and its technical problems can also be further realized by adopting the following technical measures.

The aforementioned three-dimensional inductance carrier structure with a metal core, wherein the metal core has a fourth top surface, the first top surface of each of the second inductance parts, the second top surface of each of the third inductance parts The top surface and the third top surface of each of the fourth inductor parts are higher than the fourth top surface of the metal core part.

The aforementioned three-dimensional inductance carrier structure with a metal core, wherein the fifth inductance part and the aforementioned three-dimensional inductance carrier structure with a metal core, wherein the second inductance part, the third inductance part , the material of each of the fourth inductance part and the metal core part is selected from one of nickel, iron or a combination thereof.

The aforementioned three-dimensional inductance carrier structure with a metal core further includes a second conductive pad formed on the protective layer, and the substrate further has a second solder pad, and the second conductive pad is electrically connected to the first Two solder pads.

In the aforementioned three-dimensional inductance carrier structure with a metal core, the second metal layer has a seventh inductance part, and the second conductive pad is connected to the seventh inductance part.

In the aforementioned three-dimensional inductance carrier structure with a metal core, the third metal layer has an eighth inductance part, and the eighth inductance part is connected to the seventh inductance part and the fourth inductance part.

The aforementioned three-dimensional inductance carrier structure with a metal core further includes a second conductive pad formed on the second dielectric layer, the third metal layer has an eighth inductance part, and the eighth inductance part is connected to The second conductive pad and the fourth inductance part.

The aforementioned three-dimensional inductance carrier structure with a metal core further includes a third dielectric layer, the third dielectric layer is formed on the second dielectric layer, and the third dielectric layer covers the third metal layer.

The aforementioned three-dimensional inductance load bearing structure with a metal core further includes a nickel-gold protection layer formed on the third metal layer.

The aforementioned three-dimensional inductance carrier structure with a metal core further includes a third conductive pad formed on the second dielectric layer and electrically connected to the fifth inductive part.

Compared with the prior art, the present invention has obvious advantages and beneficial effects. By means of the above-mentioned technical scheme, the manufacturing method and the structure of the three-dimensional inductive carrier with metal core of the present invention have at least the following advantages and beneficial effects: Since the three-dimensional inductive carrier structure obtained by the present invention has not only the three-dimensional inductive structure, but also With the metal core, the wiring area on the same plane can be reduced and the chip size can be reduced, and the coil density and magnetic flux can be increased. In addition, since the three-dimensional inductors are designed on different planes, the magnetic flux direction of the inductors also changes from vertical to horizontal, which is helpful for the design of electromagnetic coupling of flip-chip modules in the flip-chip process.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

1A-1P are perspective views of a manufacturing method of a three-dimensional inductive load bearing with a metal core according to a first preferred embodiment of the present invention.

2A-2P are schematic cross-sectional views of the manufacturing method of the three-dimensional inductive load bearing with a metal core according to the first preferred embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of another three-dimensional inductor load bearing structure with a metal core according to the second preferred embodiment of the present invention.

FIG. 4 is a cross-sectional schematic diagram of another three-dimensional inductor load bearing with a metal core according to the third preferred embodiment of the present invention.

FIG. 5 is a perspective view of yet another three-dimensional inductor load bearing structure with a metal core according to the fourth preferred embodiment of the present invention.

FIG. 6 is a perspective view of another three-dimensional inductor load bearing structure with a metal core according to the fifth preferred embodiment of the present invention.

100: Three-dimensional inductive carrier structure with metal core

110: Substrate 111 surface 112 first welding pad 113: protective layer

113a: The first welding pad opening 113b: The first contact point setting area

113c: First inductance part setting area 114: Second welding pad

120: The first photoresist layer 121: The first opening

122: Slot hole of the first inductance part

130: The first metal layer 131: The first conductive pad

132: The first inductance part 132a: The first connection terminal

132b: the second connection end point 133: the first upper surface

140: The first dielectric layer 141: The opening of the first conductive pad

142: Opening of the first connection terminal 143: Opening of the second connection terminal

150: The second photoresist layer 151: The hole for setting the second inductance part

151a: The first top 152: The third inductance part setting hole

152a: The second top 153: The fourth inductance part setting hole

153a: the third top 154: slotting

154a: Fourth Top

160: Second metal layer 161: Second inductance part

161a: the first top surface 162: the third inductance part

162a: the second top surface 163: the fourth inductance part

163a: third top surface 164: metal core

164a: bottom surface 164b: fourth top surface

165: Seventh inductance part

170: Second dielectric layer 171: Exposure hole of the second inductance part

172: Exposure hole of the third inductance part 173: Exposure hole of the fourth inductance part

180: the third photoresist layer

181: Slot hole for setting the fifth inductance part

182: Slot hole for the sixth inductance part

190: The third metal layer 191 The fifth inductance part

192: The sixth inductance part 193: The first lower surface

194: Eighth inductance part

A1: First depth A2: Second depth

A3: Third depth A4: Fourth depth

B1: the first distance B2: the second distance

C: UBM

D: The third dielectric layer

H1: First height H2: Second height

H3: third height H4: fourth height

H5: fifth height H6: sixth height

M: Nickel-gold protective layer S: Solder protective layer

P1: The second conductive pad P2: The third conductive pad

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, below in conjunction with the accompanying drawings and preferred embodiments, the method for manufacturing the three-dimensional inductive carrier with a metal core and its structure according to the present invention are discussed. The specific embodiment, manufacturing method, steps, features and effects thereof are described in detail below.

Please refer to Fig. 1A to Fig. 1P and Fig. 2A to Fig. 2P, it is a first preferred embodiment of the present invention, a kind of manufacturing method of three-dimensional inductance carrier with metal core comprises the following steps: first, please refer to Fig. 1A And Fig. 2A, provide a substrate 110, this substrate 110 has a surface 111, a first welding pad 112, a protection layer 113 and a second welding pad 114, this first welding pad 112 is arranged on this surface 111, this protection A layer 113 is formed on the surface 111, and the protection layer 113 has a first pad opening 113a, a first contact point setting area 113b and a plurality of first inductor part setting areas 113c, the first pad opening 113a exposes the The first welding pad 112 and the first welding pad opening 113a are located in the first contact point setting area 113b. The material of the substrate 110 can be selected from an alumina substrate, an aluminum nitride substrate, a gallium arsenide substrate or a glass substrate. One, the protective layer 113 can be a protective layer (passivation layer) or a repeated protective layer (repassivation layer); then, referring to FIG. 1B and FIG. 2B, a first photoresist layer 120 is formed on the protective layer 113; then, please Referring to FIG. 1C and FIG. 2C, the first photoresist layer 120 is patterned to form a first opening 121 and a plurality of first inductor part slots 122, the first opening 121 reveals the first contact point setting region 113b, the The first inductance portion slots 122 expose the first inductance portion setting regions 113c; then, referring to FIG. 1D and FIG. 2D, a first metal layer 130 is formed in the first opening 121 and the first inductance portion grooves Holes 122, so that the first metal layer 130 has a first conductive pad 131 and a plurality of first inductance parts 132, each of the first inductance parts 132 has a first connection terminal 132a and a second connection terminal 132b, And the first inductance part 132 has a first height H1.

Next, please refer to FIG. 1E and FIG. 2E, remove the first photoresist layer 120; then, please refer to FIG. 1F and FIG. 2F, form a first dielectric layer 140 on the protection layer 113 and cover the first metal layer 130, the first dielectric layer 140 has a first conductive pad opening 141, a plurality of first connection terminal openings 142 and a plurality of second connection terminal openings 143, the first conductive pad opening 141 exposes the first conductive The pad 131, each of the first connection terminal openings 142 reveals each of the first connection terminal 132a, and each of the second connection terminal openings 143 exposes each of the second connection terminal 132b; then, please refer to FIG. 1G and FIG. 2G to form a The second photoresist layer 150 is on the first dielectric layer 140; then, referring to FIG. 1H and FIG. part setting hole 152, a plurality of fourth inductance part setting holes 153 and a slot 154, the second inductance part setting hole 151 reveals the first conductive pad 131, each of the third inductance part setting holes 152 exposes each of the first A connection terminal 132a, each of the fourth inductance part setting holes 153 exposes each of the second connection terminal points 132b, the slot 154 is located between each of the third inductance part setting holes 152 and each of the fourth inductance part setting holes 153 and The slot 154 exposes the first dielectric layer 140, wherein the second inductor part setting hole 151 has a first top 151a, and a first depth A1 is between the first top 151a and the first contact pad 131. , the third inductance portion setting hole 152 has a second top 152a, and there is a second depth A2 between the second top end 152a and the first connection terminal 132a, and the fourth inductance portion setting hole 153 has a third top end 153a, there is a third depth A3 between the third top 153a and the second connection terminal 132b, the slot 154 has a fourth top 154a, and there is a distance between the fourth top 154a and the first dielectric layer 140 A fourth depth A4, the first depth A1, the second depth A2 and the third depth A3 are greater than the fourth depth A4.

Next, referring to FIG. 1I and FIG. 2I , a second metal layer 160 is formed on the second inductance part setting holes 151, the third inductance part setting holes 152, the fourth inductance part setting holes 153 and the slot 154, so that the second metal layer 160 has a second inductance part 161, a plurality of third inductance parts 162, a plurality of fourth inductance parts 163 and a metal core part 164, the second inductance part 161 is connected to the first Conducting pad 131 and the second inductance part 161 has a first top surface 161a and a second height H2, each of the third inductance parts 162 is connected to each of the second connection terminals 132b and each of the third inductance parts 162 has a The second top surface 162a and a third height H3, each of the fourth inductance parts 163 is connected to each of the first connection terminals 132a and each of the fourth inductance parts 163 has a third top surface 163a and a fourth height H4, the The second height H2, the third height H3 and the fourth height H4 are greater than the first height H1, the metal core 164 has a bottom surface 164a and a fourth top surface 164b, and the first metal layer 130 has a first There is a first distance B1 between the upper surface 133, the bottom surface 164a, and the first upper surface 133. In this embodiment, the first top surface 161a of each of the second inductance parts 161, each of the third inductance parts The second top surface 162a of 162 and the third top surface 163a of each of the fourth inductor parts 163 are higher than the fourth top surface 164b of the metal core part 164, the second inductor part 161, the third inductor part 162 . The material of the fourth inductor part 163 and the metal core part 164 is selected from one of nickel, iron or a combination thereof; then, referring to FIGS. 1J and 2J , remove the second photoresist layer 150 .

Next, referring to FIG. 1K and FIG. 2K, a second dielectric layer 170 is formed on the first dielectric layer 140 and covers the second metal layer 160, and the second dielectric layer 170 has a second inductance part exposure hole. 171. A plurality of third inductance part exposure holes 172 and a plurality of fourth inductance part exposure holes 173, the second inductance part exposure holes 171 expose the first top surface 161a, each of the third inductance part exposure holes 172 exposes the The second top surface 162a, each of the fourth inductor portion exposure holes 173 exposes each of the third top surface 163a; then, referring to FIG. 1L and FIG. 2L, a third photoresist layer 180 is formed on the second dielectric layer 170 ; Next, referring to FIG. 1M and FIG. 2M, the third photoresist layer 180 is patterned to form a fifth inductance part setting slot hole 181 and a plurality of sixth inductance part setting slot holes 182, the fifth inductance part setting slot The hole 181 exposes the first top surface 161a and the second top surface 162a, and each of the sixth inductance part is provided with slot holes 182 to expose each of the second top surface 162a and each of the third top surface 163a; then, please refer to FIG. 1N And Fig. 2N, form a third metal layer 190 and set slot hole 181 and these sixth inductor parts in this fifth inductance part and set slot hole 182, so that this third metal layer 190 has a fifth inductor part 191 and many a sixth inductance part 192, the fifth inductance part 191 is connected to the second inductance part 161 and the third inductance part 162, each of the sixth inductance parts 192 is connected to the third inductance part 162 and the fourth inductance part 163, In this embodiment, the material of the fifth inductance part 191 and the sixth inductance part 192 is selected from one of copper, silver or a combination thereof, the fifth inductance part 191 has a fifth height H5, each of the The sixth inductor part 192 has a sixth height H6, the second height H2, the third height H3 and the fourth height H4 are greater than the fifth height H5 and the sixth height H6, in this embodiment, the first height The three-metal layer 190 has a first lower surface 193 , and there is a second distance B2 between the fourth top surface 164 b of the metal core 164 and the first lower surface 193 .

Then, please refer to FIG. 1O and FIG. 2O, remove the third photoresist layer 180; finally, please refer to Figures 1P and 2P, form a third dielectric layer D on the second dielectric layer 170 and cover the first Three metal layers 190 to form a three-dimensional inductive load bearing structure 100 with a metal core. In addition, the three-dimensional inductive load bearing structure 100 with a metal core further includes a second conductive pad P1 formed on the protection layer 113 , the second conductive pad P1 is electrically connected to the second pad 114 of the substrate 110 , and the second metal layer 160 has a seventh inductor portion 165 , and the third metal layer 190 has an eighth inductor portion 194 , the second conductive pad P1 is connected to the seventh inductor part 165 , and the eighth inductor part 194 is connected to the seventh inductor part 165 and the fourth inductor part 163 .

Or, please refer to FIG. 3 , which is a second preferred embodiment of the present invention. The three-dimensional inductor load bearing structure 100 with a metal core can form a nickel-gold protection layer M on the third metal layer 190 to replace The step of forming the third dielectric layer D on the second dielectric layer 170, or, please refer to FIG. 4, which is a third preferred embodiment of the present invention, the three-dimensional inductor load structure with a metal core 100 can also form a solder protection layer S on the third metal layer 190 , and the material of the solder protection layer S can be one of solder or lead-free solder.

In addition, please refer to FIG. 5 , which is a fourth preferred embodiment of the present invention, the second conductive pad P1 is formed on the second dielectric layer 170 , and the eighth inductor part 194 of the third metal layer 190 The second conductive pad P1 is connected to the fourth inductor part 163 . In addition, please refer to FIG. 6 , which is a fifth preferred embodiment of the present invention. The three-dimensional inductance carrier structure 100 with a metal core further includes a third conductive pad P2, the second conductive pad P1 and The third conductive pad P2 is formed on the second dielectric layer 170, the second conductive pad P1 is connected to the eighth inductor portion 194 of the third metal layer 190, and the third conductive pad P2 is electrically connected to the eighth inductor portion 194 of the third metal layer 190. The fifth inductance part 191 . Since the three-dimensional inductance carrier structure 100 with metal core is a three-dimensional inductance structure and has the metal core 164, it not only reduces the wiring area on the same plane and reduces the size of the chip, but also has the effect of increasing coil density and magnetic flux. In addition, since the three-dimensional inductors are designed on different planes, the magnetic flux direction of the inductors also changes from vertical to horizontal, which is helpful for the design of electromagnetic coupling of flip-chip modules in the flip-chip process.

Please refer to FIG. 1P and FIG. 2P again, which is a three-dimensional inductor load bearing structure 100 with a metal core according to a first preferred embodiment of the present invention, which at least includes a substrate 110, a first metal layer 130, A first dielectric layer 140, a second metal layer 160, a second dielectric layer 170, a metal core 164, a third metal layer 190, a second conductive pad P1 and a third dielectric layer D, the substrate 110 has a surface 111, a first welding pad 112, a protective layer 113 and a second welding pad 114, the first welding pad 112 is arranged on the surface 111, and the protective layer 113 is formed on the surface 111 , the protection layer 113 has a first pad opening 113a and the first pad opening 113a exposes the first pad 112. In this embodiment, the material of the substrate 110 can be selected from alumina substrate, nitrided One of the aluminum substrate, gallium arsenide substrate or glass substrate, the protective layer 113 can be a passivation layer or a repeated protective layer (repassivation layer), the first metal layer 130 is formed on the protective layer 113, the second A metal layer 130 has a first conductive pad 131 and a plurality of first inductance parts 132, each of the first inductance parts 132 has a first connection terminal 132a and a second connection terminal 132b, and the first inductance part 132 Having a first height H1, the first dielectric layer 140 is formed on the protection layer 113 and covers the first metal layer 130, the first dielectric layer 140 has a first contact pad opening 141, a plurality of first Connection terminal opening 142 and a plurality of second connection terminal openings 143, the first connection pad opening 141 reveals the first connection pad 131, each of the first connection terminal openings 142 exposes each of the first connection terminal 132a, each of the The second connection terminal opening 143 exposes each of the second connection terminals 132b. The second metal layer 160 is formed on the first dielectric layer 140. The second metal layer 160 has a second inductor part 161 and a plurality of third inductors. part 162 and a plurality of fourth inductance parts 163, the second inductance part 161 is connected to the first conductive pad 131 and the second inductance part 161 has a first top surface 161a and a second height H2, each of the third The inductance part 162 is connected to each of the first connection terminals 132a and each of the third inductance parts 162 has a second top surface 162a and a third height H3, and each of the fourth inductance parts 163 is connected to each of the second connection terminals 132b and each The fourth inductor part 163 has a third top surface 163a and a fourth height H4, the second height H2, the third height H3 and the fourth height H4 are greater than the first height H1, the second inductor part 161 , the material of the third inductance part 162 and the fourth inductance part 163 is selected from one of nickel, iron or a combination thereof, the second dielectric layer 170 is formed on the first dielectric layer 140 and covers the first dielectric layer Two metal layers 160, the second dielectric layer 170 has a second inductor part exposure hole 171, a plurality of The third inductance part revealing hole 172 and a plurality of fourth inductance part revealing holes 173, the second inductance part revealing hole 171 reveals the first top surface 161a, each of the third inductance part revealing holes 172 reveals each of the second top surface 162a, each of the fourth inductance portion exposure holes 173 exposes each of the third top surfaces 163a, the metal core portion 164 is formed on the first dielectric layer 140 and located on each of the third inductance portions 162 of the second metal layer 160 And between each of the fourth inductance parts 163, the material of the metal core part 164 is selected from one of nickel, iron or a combination thereof, the metal core part 164 has a bottom surface 164a and a fourth top surface 164b, the The first metal layer 130 has a first upper surface 133, and there is a first distance B1 between the bottom surface 164a and the first upper surface 133, and each of the first top surface 161a of the second inductor part 161, each of the The second top surface 162a of the third inductor part 162 and the third top surface 163a of each of the fourth inductor parts 163 are higher than the fourth top surface 164b of the metal core part 164, and the third metal layer 190 is formed on The second dielectric layer 170, the third metal layer 190 has a fifth inductance part 191, a plurality of sixth inductance parts 192 and a first lower surface 193, in this embodiment, the fifth inductance part 191 and The material of the sixth inductance part 192 is selected from one of copper, silver or a combination thereof. Connecting the third inductance part 162 and the fourth inductance part 163, the fifth inductance part 191 has a fifth height H5, each of the sixth inductance parts 192 has a sixth height H6, the second height H2, the first The third height H3 and the fourth height H4 are greater than the fifth height H5 and the sixth height H6, and the fourth top surface 164b of the metal core 164 and the first lower surface 193 of the third metal layer 190 There is a second distance B2 between them, the second conductive pad P1 is formed on the protection layer 113, the second conductive pad P1 is electrically connected to the second pad 114 of the substrate 110, and the second metal layer 160 is also There is a seventh inductance part 165, the second conductive pad P1 is connected to the seventh inductance part 165, and the third metal layer 190 has an eighth inductance part 194, and the eighth inductance part 194 is connected to the seventh inductance part 165 and the fourth inductor part 163 , the third dielectric layer D is formed on the second dielectric layer 170 , and the third dielectric layer D covers the third metal layer 190 .

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes, but as long as they do not depart from the technical solution of the present invention, the Technical Essence Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

Claims (24)

1. there is a three-dimensional inductance carrier manufacture method for steel core, it is characterized in that it at least comprises following steps:

One substrate is provided, this substrate has a surface, one first weld pad and an overcoat, this first weld pad is arranged at this surface, this overcoat is formed at this surface, and this overcoat has one first welding pad opening, one first connects a setting area and multiple first inductance department setting area, this first welding pad opening appears this first weld pad and this first welding pad opening is positioned at this first connects a setting area;

Form one first photoresist layer in this overcoat;

This first photoresist layer of patterning is to form one first opening and multiple first inductance department slotted eye, and this first opening appears this and first connects a setting area, and described first inductance department slotted eye appears described first inductance department setting area;

Form a first metal layer in this first opening and described first inductance department slotted eye, to make this first metal layer, there is one first connection pad and multiple first inductance department, respectively this first inductance department has one first connection end point and one second connection end point, and respectively this first inductance department has one first height;

Remove this first photoresist layer;

Forming one first dielectric layer in this overcoat covers this first metal layer, this first dielectric layer has one first connection pad opening, multiple first connection end point opening and multiple second connection end point opening, this the first connection pad opening appears this first connection pad, respectively this first connection end point opening appears respectively this first connection end point, and respectively this second connection end point opening appears respectively this second connection end point;

Form one second photoresist layer in this first dielectric layer;

This second photoresist layer of patterning is to form one second inductance department providing holes, multiple 3rd inductance department providing holes, multiple 4th inductance department providing holes and a fluting, this the second inductance department providing holes appears this first connection pad, respectively the 3rd inductance department providing holes appears respectively this first connection end point, respectively the 4th inductance department providing holes appears respectively this second connection end point, this fluting is in each the 3rd inductance department providing holes and respectively between the 4th inductance department providing holes and this fluting appears this first dielectric layer, wherein this second inductance department providing holes has one first top, between this first top to this first connection pad, there is one first degree of depth, respectively the 3rd inductance department providing holes has one second top, respectively this second top is to respectively having one second degree of depth between this first connection end point, respectively the 4th inductance department providing holes has one the 3rd top, respectively the 3rd top is to respectively having one the 3rd degree of depth between this second connection end point, this fluting has one the 4th top, there is between 4th top to this first dielectric layer one the 4th degree of depth, this first degree of depth, this second degree of depth and the 3rd degree of depth are greater than the 4th degree of depth,

Form one second metal level in this second inductance department providing holes, described 3rd inductance department providing holes, described 4th inductance department providing holes and this fluting, to make this second metal level, there is one second inductance department, multiple 3rd inductance department, multiple 4th inductance department and a steel core, this second inductance department connects this first connection pad and this second inductance department has one first end face and one second height, respectively the 3rd inductance department connect respectively this second connection end point and respectively the 3rd inductance department there is one second end face and a third high degree, respectively the 4th inductance department connect respectively this first connection end point and respectively the 4th inductance department have one the 3rd end face and one the 4th height, this second height, this third high degree and the 4th is highly greater than this first height, this steel core has a bottom surface, this the first metal layer has one first upper surface, between this bottom surface and this first upper surface, there is one first spacing,

Remove this second photoresist layer;

Forming one second dielectric layer in this first dielectric layer covers this second metal level, this second dielectric layer has that one second inductance department appears hole, multiple 3rd inductance department appears hole and multiple 4th inductance department appears hole, this second inductance department appears hole and appears this first end face, respectively the 3rd inductance department appears hole and appears respectively this second end face, and respectively the 4th inductance department appears hole and appears respectively the 3rd end face;

Form one the 3rd photoresist layer in this second dielectric layer;

Patterning the 3rd photoresist layer is to form one the 5th inductance department and arrange slotted eye and multiple 6th inductance department arranges slotted eye, 5th inductance department arranges slotted eye and appears this first end face and this second end face, and respectively the 6th inductance department arranges slotted eye and appears respectively this second end face and respectively the 3rd end face; And

Form one the 3rd metal level and in the 5th inductance department slotted eye is set and described 6th inductance department arranges slotted eye, to make the 3rd metal level, there is one the 5th inductance department and multiple 6th inductance department, 5th inductance department connects this second inductance department and the 3rd inductance department, respectively the 6th inductance department connects the 3rd inductance department and the 4th inductance department, 5th inductance department has one the 5th height, respectively the 6th inductance department has one the 6th height, and this second height, this third high degree and the 4th are highly greater than the 5th height and the 6th height.

2. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, it is characterized in that the 3rd wherein said metal level has one first lower surface, this steel core has one the 4th end face, has one second spacing between the 4th end face and this first lower surface.

3. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, it is characterized in that wherein said steel core has one the 4th end face, respectively this second end face of this first end face, respectively the 3rd inductance department of this second inductance department and the 3rd end face of each the 4th inductance department are higher than the 4th end face of this steel core.

4. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, it is characterized in that the material of the 5th wherein said inductance department and each the 6th inductance department be selected from copper, silver or its combination one of them.

5. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, it is characterized in that the second wherein said inductance department, respectively the 3rd inductance department, the respectively material of the 4th inductance department and this steel core be selected from nickel, iron or its combination one of them.

6. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, it is characterized in that it separately includes one second connection pad, this second connection pad is formed at this overcoat, and this substrate separately has one second weld pad, and this second connection pad is electrically connected this second weld pad.

7. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, it is characterized in that it separately includes one the 3rd connection pad, the 3rd connection pad is formed at this second dielectric layer and is electrically connected the 5th inductance department.

8. the three-dimensional inductance carrier manufacture method with steel core according to claim 6, it is characterized in that the second wherein said metal level has one the 7th inductance department, this second connection pad connects the 7th inductance department.

9. the three-dimensional inductance carrier manufacture method with steel core according to claim 8, it is characterized in that the 3rd wherein said metal level has one the 8th inductance department, the 8th inductance department connects the 7th inductance department and the 4th inductance department.

10. the three-dimensional inductance carrier manufacture method with steel core according to claim 1, is characterized in that it separately includes: the step removing the 3rd photoresist layer.

The 11. three-dimensional inductance carrier manufacture methods with steel core according to claim 1, it is characterized in that it separately includes the second connection pad that is formed at this second dielectric layer, 3rd metal level has one the 8th inductance department, and the 8th inductance department connects this second connection pad and the 4th inductance department.

The 12. three-dimensional inductance carrier manufacture methods with steel core according to claim 1, is characterized in that it separately includes: form one the 3rd dielectric layer in the step of this second dielectric layer, and the 3rd dielectric layer covers the 3rd metal level.

The 13. three-dimensional inductance carrier manufacture methods with steel core according to claim 1, is characterized in that it separately includes: form a nickel gold overcoat in the step of the 3rd metal level.

14. 1 kinds of three-dimensional inductance carrier structures with steel core, is characterized in that it at least comprises:

One substrate, it has a surface, one first weld pad and an overcoat, and this first weld pad is arranged at this surface, and this overcoat is formed at this surface, and this overcoat has one first welding pad opening and this first welding pad opening appears this first weld pad;

One the first metal layer, it is formed at this overcoat, and this first metal layer has one first connection pad and multiple first inductance department, and respectively this first inductance department has one first connection end point and one second connection end point, and respectively this first inductance department has one first height;

One first dielectric layer, it is formed at this overcoat and covers this first metal layer, this first dielectric layer has one first connection pad opening, multiple first connection end point opening and multiple second connection end point opening, this the first connection pad opening appears this first connection pad, respectively this first connection end point opening appears respectively this first connection end point, and respectively this second connection end point opening appears respectively this second connection end point;

One second metal level, it is formed at this first dielectric layer, this second metal level has one second inductance department, multiple 3rd inductance department and multiple 4th inductance department, this second inductance department connects this first connection pad and this second inductance department has one first end face and one second height, respectively the 3rd inductance department connect respectively this first connection end point and respectively the 3rd inductance department there is one second end face and a third high degree, respectively the 4th inductance department connect respectively this second connection end point and respectively the 4th inductance department have one the 3rd end face and one the 4th height, this second height, this third high degree and the 4th is highly greater than this first height,

One second dielectric layer, it is formed at this first dielectric layer and covers this second metal level, this second dielectric layer has that one second inductance department appears hole, multiple 3rd inductance department appears hole and multiple 4th inductance department appears hole, this second inductance department appears hole and appears this first end face, respectively the 3rd inductance department appears hole and appears respectively this second end face, and respectively the 4th inductance department appears hole and appears respectively the 3rd end face;

One steel core, it is formed at this first dielectric layer and at respectively the 3rd inductance department of this second metal level and respectively between the 4th inductance department, this steel core has a bottom surface and one the 4th end face, this the first metal layer has one first upper surface, has one first spacing between this bottom surface and this first upper surface; And

One the 3rd metal level, it is formed at this second dielectric layer, 3rd metal level has one first lower surface, one the 5th inductance department and multiple 6th inductance department, between 4th end face and this first lower surface, there is one second spacing, 5th inductance department connects this second inductance department and the 3rd inductance department, respectively the 6th inductance department connects the 3rd inductance department and the 4th inductance department, 5th inductance department has one the 5th height, respectively the 6th inductance department has one the 6th height, this second height, this third high degree and the 4th is highly greater than the 5th height and the 6th height.

The 15. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that wherein said steel core has one the 4th end face, respectively this second end face of this first end face, respectively the 3rd inductance department of this second inductance department and the 3rd end face of each the 4th inductance department are higher than the 4th end face of this steel core.

The 16. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that the material of the 5th wherein said inductance department and each the 6th inductance department be selected from copper, silver or its combination one of them.

The 17. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that the second wherein said inductance department, respectively the 3rd inductance department, the respectively material of the 4th inductance department and this steel core be selected from nickel, iron or its combination one of them.

The 18. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that it separately includes the second connection pad that is formed at this overcoat, this substrate separately has one second weld pad, and this second connection pad is electrically connected this second weld pad.

The 19. three-dimensional inductance carrier structures with steel core according to claim 18, it is characterized in that the second wherein said metal level has one the 7th inductance department, this second connection pad connects the 7th inductance department.

The 20. three-dimensional inductance carrier structures with steel core according to claim 19, it is characterized in that the 3rd wherein said metal level has one the 8th inductance department, the 8th inductance department connects the 7th inductance department and the 4th inductance department.

The 21. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that it separately includes the second connection pad that is formed at this second dielectric layer, 3rd metal level has one the 8th inductance department, and the 8th inductance department connects this second connection pad and the 4th inductance department.

The 22. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that it separately includes one the 3rd dielectric layer, the 3rd dielectric layer is formed at this second dielectric layer, and the 3rd dielectric layer covers the 3rd metal level.

The 23. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that it separately includes a nickel gold overcoat, this nickel gold overcoat is formed at the 3rd metal level.

The 24. three-dimensional inductance carrier structures with steel core according to claim 14, it is characterized in that it separately includes one the 3rd connection pad, the 3rd connection pad is formed at this second dielectric layer and is electrically connected the 5th inductance department.