CN102954391A - Backlight module - Google Patents

Abstract

A backlight module includes: a light guide plate and at least one light emitting element. The light guide plate has a light emitting surface, a back surface located on the opposite side of the light emitting surface, and a peripheral surface connecting the periphery of the light emitting surface and the periphery of the back surface. The light emitting element is arranged toward the peripheral surface, and the light emitting element is a high-power light emitting diode or a light emitting diode lamp board with a polycrystalline package. In addition, a microstructure is also arranged on the peripheral surface of the light guide plate at the position corresponding to the light emitting element, and the light emitted by the light emitting element enters the light guide plate through the microstructure and then is emitted from the light emitting surface.

Description

Backlight module

technical field

The invention relates to a backlight module, in particular to a backlight module using a high-power light-emitting diode or a polycrystalline packaged light-emitting diode lamp board.

Background technique

Commonly used light sources for backlight modules are Cold Cathode Florescent Lamp (CCFL) and Light Emitting Diode (LED).

Since cold cathode ray tubes consume more energy and do not meet environmental protection requirements, most of the light sources used in backlight modules are developed towards light-emitting diodes in recent years. However, because most of the existing backlight modules using light-emitting diodes as light sources are arranged in a straight line with a plurality of single-crystal packaged light-emitting diodes on the same circuit board to form a light-bar (light-bar), and multiple LEDs are used in a backlight module. A light bar is used to provide the brightness required by the backlight module. Since the use of LED light bars is more cumbersome in the manufacturing and assembly process, it must be improved.

Contents of the invention

The purpose of the present invention is to provide a backlight module that is easy to manufacture and assemble.

The backlight module of the present invention includes: a light guide plate and at least one light emitting element. The light guide plate has a light-emitting surface, a back surface opposite to the light-emitting surface, and a peripheral surface connecting the periphery of the light-emitting surface and the periphery of the back surface. The light-emitting element is arranged toward the peripheral surface, and the light-emitting element is a high-power light-emitting diode or a light-emitting diode lamp board packaged with polycrystals. In addition, microstructures are provided on the peripheral surface of the light guide plate corresponding to where the light-emitting elements are arranged, and the light emitted by the light-emitting elements passes through the microstructures and then enters the light guide plate, and then exits from the light-emitting surface.

Preferably, the light guide plate is substantially rectangular, and its peripheral surface includes four symmetrical sides, and the light-emitting element is arranged at a middle position relative to at least one side.

Preferably, the light guide plate is substantially rectangular, and the four corners are chamfered, and the peripheral surface includes four symmetrical sides and four chamfered parts respectively formed by the chamfers. The element is arranged relative to at least one chamfer.

Preferably, the light guide plate is approximately rectangular, and its four corners are chamfered. set relative to the middle position of at least one side and at least one chamfer.

Preferably, the microstructure is a U-shaped groove, a V-shaped groove or a roughened surface.

Another embodiment of the backlight module of the present invention includes: a light guide plate and at least one light emitting element. The light guide plate has a light-emitting surface, a back surface opposite to the light-emitting surface, and a peripheral surface connecting the periphery of the light-emitting surface and the periphery of the back surface. The light-emitting element is arranged towards the back surface, and the light-emitting element is a high-power light-emitting diode or a polycrystalline packaged light-emitting diode lamp board. Moreover, microstructures are provided on the back of the light guide plate corresponding to where the light-emitting elements are arranged, and the light emitted by the light-emitting elements enters the light guide plate through the microstructures, and then exits from the light-emitting surface.

Preferably, there are a plurality of light-emitting elements, which are scattered and arranged at intervals.

The beneficial effect of the present invention is that: the light-emitting element of the backlight module of the present invention is a polycrystalline packaged light-emitting diode light board or a high-power light-emitting diode. Microstructure, can achieve better optical effect.

Description of drawings

FIG. 1 is a perspective view illustrating a first preferred embodiment of a backlight module of the present invention;

Figure 2 is a top view illustrating the first preferred embodiment;

Fig. 3 is a perspective view of a partial structure, illustrating the relationship between the light guide plate and the light emitting elements of the first preferred embodiment;

Fig. 4 is a perspective view illustrating the light-emitting element of the first preferred embodiment;

FIG. 5 is an exploded perspective view illustrating a second preferred embodiment of the backlight module of the present invention.

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

Before the present invention is described in detail, it should be noted that in all the following drawings, the same elements are denoted by the same numbers, and the elements in the drawings are not drawn according to the actual scale, and are only used to assist illustrate.

Referring to FIG. 1 and FIG. 2 , the first preferred embodiment of the backlight module of the present invention includes a light guide plate 1 and a plurality of light emitting elements 2 .

The light guide plate 1 has a light-emitting surface 11 , a back surface 12 opposite to the light-emitting surface 11 , and a peripheral surface 13 connecting the periphery of the light-emitting surface 11 and the periphery of the back surface 12 . In this embodiment, the light guide plate 1 is roughly rectangular, and the four corners are chamfered. The peripheral surface 13 includes four symmetrical side portions 131 and four chamfered portions 132 respectively formed by the chamfered corners.

The light-emitting elements 2 are respectively disposed relative to the middle positions of the side portions 131 and the chamfered portions 132 . Referring to Fig. 3 and Fig. 4, in this embodiment, each light-emitting element 2 is a polycrystalline packaged light-emitting diode lamp board (Chip-on-board, COB lamp board), and a plurality of light-emitting diode chips 21 are jointly packaged in the same On the substrate 22, a surface light source is formed. If a plurality of LED chips 21 are only arranged in a row, a line light source can be formed. Compared with a single crystal packaged LED, it can have higher brightness, and the LED lamp board is a surface light source or a line light source. The light source, compared with the single-crystal package light-emitting diode which is a point light source, has a larger light scattering angle, and the light is easier to disperse. Moreover, the locations where the light-emitting elements 2 are arranged are scattered and separated from each other by a relatively large distance, so it is easier to dissipate heat. Of course, the number and position of the light emitting elements 2 can be adjusted according to the area of the light guide plate 1 , for example, if the area of the light guide plate 1 is small, only one light emitting element 2 can be provided. When one light emitting element 2 is provided, it can be provided at the middle position of one side part 131 or one of the chamfered parts 132 .

In addition, the peripheral surface 13 of the light guide plate 1 is also provided with a microstructure 14 corresponding to the light-emitting element 2 to scatter the light. Show a representative description. When the light emitted by the light-emitting element 2 passes through the microstructure 14 , the light is diffused by the microstructure 14 and then enters the light guide plate 1 , so that the light entering the light guide plate 1 can be evenly dispersed, and then emitted from the light exit surface 11 . Except for the parts where the microstructure 14 is provided on the light-emitting surface 11 and the peripheral surface 13, the rest of the surface of the light guide plate 1 is provided with a reflective layer (not shown), that is, the back surface 12 and the peripheral surface 13 are not provided with the microstructure 14. Both have a reflective layer. The reflective layer is a film layer composed of a highly reflective material coated or pasted on the surface of the light guide plate 1 to reflect the light in the light guide plate 1, so that most of the light entering the light guide plate 1 can pass through the light exit surface. 11 shots. In this embodiment, the microstructure 14 is a V-shaped groove, but it may also be a U-shaped groove or a roughened surface (roughen the surface).

In this embodiment, the light-emitting element 2 is a polycrystalline packaged light-emitting diode light board, which can also be a high-power light-emitting diode with relatively high brightness. Compared with the existing light-emitting diode light bar, the assembly process can be simplified .

Referring to FIG. 5 , the second preferred embodiment of the backlight module of the present invention includes a light guide plate 1 and a plurality of light emitting elements 2 . The light guide plate 1 has a light-emitting surface 11 , a back surface 12 opposite to the light-emitting surface 11 , and a peripheral surface 13 connecting the periphery of the light-emitting surface 11 and the periphery of the back surface 12 . The light-emitting elements 2 are scattered and arranged at intervals toward the back surface 12 of the light guide plate 11. The back surface 12 of the light guide plate 11 is the light-incident surface, and a microstructure 14 is also provided at the place corresponding to the light-emitting element 2. In this embodiment, the light guide plate 11 Microstructures 14 are provided on the entire area of the back surface 12, and the microstructures 14 are roughened (roughened) surfaces, and of course microstructures in the form of U-shaped grooves, V-shaped grooves, etc. can also be replaced. The peripheral surface 13 of the light guide plate 11 is provided with a reflective layer.

Same as the first preferred embodiment, each light-emitting element 2 is a polycrystalline encapsulated light-emitting diode lamp board, and can also be replaced by a high-power light-emitting diode. When the light emitted by the light-emitting element 2 passes through the microstructure 14, the microstructure 14 is used to The light diverges and then enters the light guide plate 1 , so that the light entering the light guide plate 1 can be dispersed evenly, and then emitted from the light exit surface 11 .

To sum up, the light-emitting element 2 of the backlight module of the present invention is a polycrystalline packaged light-emitting diode light board or a high-power light-emitting diode. Compared with the light-emitting diode light bar, the assembly process can be simplified, and it is equipped with a The microstructure 14 can achieve better optical effects, so it can indeed achieve the purpose of the present invention.

Claims (8)

1. backlight module comprises: a LGP and at least one light-emitting component, and this LGP has the back side that an exiting surface, is positioned at this exiting surface opposition side, and a side face that connects this exiting surface periphery and this back side periphery; Described light-emitting component arranges towards this side face, it is characterized in that: described light-emitting component is High Power LED or is the light-emitting diode lamp-plate of polycrystalline encapsulation, and the side face correspondence of described LGP arranges this light-emitting component place and also is provided with micro-structural, the light of this light-emitting component emission enters this LGP again by described micro-structural, is penetrated by this exiting surface again.

2. backlight module according to claim 1, it is characterized in that: described LGP is generally rectangular, and described side face comprises four in twos symmetrical limit sections; Described light-emitting component is with respect at least centre position setting of one side section.

3. backlight module according to claim 1, it is characterized in that: described LGP is generally rectangular, and four angles are chamfering, and described side face comprises four in twos symmetrical limit sections, and four chamfered section that formed by each chamfering respectively; This light-emitting component is with respect at least one chamfered section setting.

4. backlight module according to claim 1, it is characterized in that: described LGP is generally rectangular, and four angles are chamfering, and described side face comprises four in twos symmetrical limit sections, and four chamfered section that formed by each chamfering respectively; Described light-emitting component is a plurality of, and with respect at least centre position and at least one chamfered section setting of one side section.

5. backlight module according to claim 1 is characterized in that: described micro-structural is U-shaped ditch, V-arrangement ditch or is coarse surface.

6. backlight module comprises: a LGP and at least one light-emitting component, and described LGP has the back side that an exiting surface, is positioned at this exiting surface opposition side, and a side face that connects this exiting surface periphery and this back side periphery; Described light-emitting component arranges towards this back side, it is characterized in that: described light-emitting component is High Power LED or is the light-emitting diode lamp-plate of polycrystalline encapsulation, and the back side correspondence of described LGP arranges this light-emitting component place and also is provided with micro-structural, the light of described light-emitting component emission enters this LGP again by described micro-structural, is penetrated by this exiting surface again.

7. backlight module according to claim 6, it is characterized in that: described light-emitting component is a plurality of, and disperses the interval to arrange.

8. backlight module according to claim 6 is characterized in that: described micro-structural is U-shaped ditch, V-arrangement ditch or is coarse surface.

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