CN102950386A - Method for solving problem of pore-top suspending copper after direct pore forming with laser for circuit boards - Google Patents

Abstract

The invention discloses a method for solving the problem of pore-top suspending copper after direct pore forming with laser for circuit boards. The method includes the steps of firstly, reducing copper; secondly, browning a circuit board; thirdly, ablating copper with laser; fourthly, poring with laser; fifthly, using 6-8% sulfuric acid solution and hydrogen peroxide solution to perform micro-etching to surface copper of the circuit board, and controlling thickness of residual surface copper at 8 micrometers and solution temperature at 30+/-5 DEG C; sixthly, framing after the blind holes are finished. By adding process flow to overcome the defect of suspending copper, surface copper of the circuit board is thinned to a certain thickness prior to direct poring with laser, the copper reducing process is added after pore forming with laser, suspending copper can be attacked by copper reducing copper reducing potion at the blind hole position with the defect of suspending copper from three directions, and due to the fact that the circuit board is thinned to a certain thickness prior to direct poring with laser, the surface copper is thin and suspending copper can be removed fast, and quality of the circuit board is improved.

Description

A kind of wiring board laser straight is connected into the hole top-hung copper solution behind the hole

Technical field

The present invention relates to the solution that a kind of wiring board laser straight is connected into the hole top-hung copper behind the hole, particularly a kind of outstanding copper defective in blind hole top is processed and improved alignment plate laser straight is connected into the solution of the hole top-hung copper behind the hole belongs to the wiring board processing technique field.

Background technology

The method that wiring board adopts laser straight to be connected into the hole is: the copper that the first step adopts first high-octane isodiametric laser the plate face need to be beaten the position of blind hole punctures; Second step: use large diameter low-energy laser that blind hole position resin and glass cloth are knit in the zone of puncture table copper position, this part laser energy can not injure the copper layer, formation blind hole after above action is finished.There is the defective of the outstanding copper of blind hole in this process, laser refraction returned to wait cause influence that glass cloth and resin bed below blind hole top table copper covering regional are also injured when laser was got to blind hole bottom copper face when namely part position blind hole laser was beaten glass cloth and resin bed when using the second step operation, the reason of this part directly causes outstanding copper, this part is unusual deposits the direct quality that affects successive process, exists reliability unusual.

Summary of the invention

Technical problem for above-mentioned existence the objective of the invention is: proposed a kind of outstanding copper defective in blind hole top is processed and improved alignment plate laser straight is connected into the solution of the hole top-hung copper behind the hole.

Technical solution of the present invention is achieved in that a kind of wiring board laser straight is connected into the solution of the hole top-hung copper behind the hole, comprises following steps:

1., subtract the copper operation: use sulfuric acid+hydrogen peroxide solution of 6%-8% that wiring board table copper is carried out microetch, remaining THICKNESS CONTROL 12UM, 30 ± 5 ℃ of solution temperature controls;

2., brown plate face: use brown liquid medicine that the plate face is processed, the copper face color is become brown by brass, be beneficial to the absorption of laser;

3., laser burns copper; Laser drilling machine is adjusted into high-energy and copper face is carried out radium-shine, burns the copper window, and laser diameter is identical with the blind hole diameter of requirement;

4., laser drill: use low-yield, diameter greater than the laser of one times of copper window to leave copper window position resin and glass cloth carry out radium-shine, the degree of depth with reach see blind hole at the bottom of copper be as the criterion, the above making of namely finishing blind hole forms outstanding copper unusual simultaneously;

5., microetch is removed outstanding copper: use sulfuric acid+hydrogen peroxide solution of 6%-8% that wiring board table copper is carried out microetch, remaining THICKNESS CONTROL 8UM, 30 ± 5 ℃ of solution temperature controls;

6., frame up: blind hole completes, and carries out subsequent processing.

Because the utilization of technique scheme, the present invention compared with prior art has following advantages:

Wiring board laser straight of the present invention is connected into the solution of the hole top-hung copper behind the hole, increase technological process and then process outstanding copper defective, the first step subtracts book to certain thickness with the table copper of plate face before laser straight is connected into the hole, second step increases a process that subtracts copper after finishing laser punching, in the process of second step, the blind hole position that has outstanding copper defective subtracts copper liquid medicine and can attack outstanding copper from three directions, so moreover because the action schedule copper layer itself that has increased the first step can be got rid of hanging copper rapidly with regard to book very, improved the quality of wiring board.

The specific embodiment

A kind of wiring board laser straight of the present invention is connected into the solution of the hole top-hung copper behind the hole, comprises following steps:

1., subtract the copper operation: use sulfuric acid+hydrogen peroxide solution of 6%-8% that wiring board table copper is carried out microetch, remaining THICKNESS CONTROL 12UM, 30 ± 5 ℃ of solution temperature controls;

2., brown plate face: use brown liquid medicine that the plate face is processed, the copper face color is become brown by brass, be beneficial to the absorption of laser;

3., laser burns copper; Laser drilling machine is adjusted into high-energy and copper face is carried out radium-shine, burns the copper window, and laser diameter is identical with the blind hole diameter of requirement;

4., laser drill: use low-yield, diameter greater than the laser of one times of copper window to leave copper window position resin and glass cloth carry out radium-shine, the degree of depth with reach see blind hole at the bottom of copper be as the criterion, the above making of namely finishing blind hole forms outstanding copper unusual simultaneously;

5., microetch is removed outstanding copper: use sulfuric acid+hydrogen peroxide solution of 6%-8% that wiring board table copper is carried out microetch, remaining THICKNESS CONTROL 8UM, 30 ± 5 ℃ of solution temperature controls;

6., frame up: blind hole completes, and carries out subsequent processing.

Because the utilization of technique scheme, the present invention compared with prior art has following advantages:

Wiring board laser straight of the present invention is connected into the solution of the hole top-hung copper behind the hole, increase technological process and then process outstanding copper defective, the first step subtracts book to certain thickness with the table copper of plate face before laser straight is connected into the hole, second step increases a process that subtracts copper after finishing laser punching, in the process of second step, the blind hole position that has outstanding copper defective subtracts copper liquid medicine and can attack outstanding copper from three directions, so moreover because the action schedule copper layer itself that has increased the first step can be got rid of hanging copper rapidly with regard to book very, improved the quality of wiring board.

Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage that is familiar with technique can understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.

Claims (1)

1. a wiring board laser straight is connected into the solution of the hole top-hung copper behind the hole, comprises following steps:

1., subtract the copper operation: use sulfuric acid+hydrogen peroxide solution of 6%-8% that wiring board table copper is carried out microetch, remaining THICKNESS CONTROL 12UM, 30 ± 5 ℃ of solution temperature controls;

2., brown plate face: use brown liquid medicine that the plate face is processed, the copper face color is become brown by brass, be beneficial to the absorption of laser;

3., laser burns copper; Laser drilling machine is adjusted into high-energy and copper face is carried out radium-shine, burns the copper window, and laser diameter is identical with the blind hole diameter of requirement;

4., laser drill: use low-yield, diameter greater than the laser of one times of copper window to leave copper window position resin and glass cloth carry out radium-shine, the degree of depth with reach see blind hole at the bottom of copper be as the criterion, the above making of namely finishing blind hole forms outstanding copper unusual simultaneously;

5., microetch is removed outstanding copper: use sulfuric acid+hydrogen peroxide solution of 6%-8% that wiring board table copper is carried out microetch, remaining THICKNESS CONTROL 8UM, 30 ± 5 ℃ of solution temperature controls;

6., frame up: blind hole completes, and carries out subsequent processing.