[go: up one dir, main page]

CN102928893B - Manufacturing method for optical planar substrate - Google Patents

Manufacturing method for optical planar substrate Download PDF

Info

Publication number
CN102928893B
CN102928893B CN201110181189.5A CN201110181189A CN102928893B CN 102928893 B CN102928893 B CN 102928893B CN 201110181189 A CN201110181189 A CN 201110181189A CN 102928893 B CN102928893 B CN 102928893B
Authority
CN
China
Prior art keywords
polishing
substrate
sheet
grinding
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110181189.5A
Other languages
Chinese (zh)
Other versions
CN102928893A (en
Inventor
丁萍刚
谢宾
方励云
王捷
邵文晋
徐达元
鲍华晖
杨跃平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STATE GRID ZHEJIANG NINGHAI COUNTY POWER SUPPLY Co
STATE GRID ZHEJIANG YUEQING POWER SUPPLY Co Ltd
Yueqing Electric Power Industrial Co Ltd
Yueqing Power Repair Manufacture Factory
State Grid Zhejiang Electric Power Co Ltd
Wenzhou Power Supply Co of State Grid Zhejiang Electric Power Co Ltd
Original Assignee
STATE GRID ZHEJIANG NINGHAI COUNTY POWER SUPPLY Co
STATE GRID ZHEJIANG YUEQING POWER SUPPLY Co Ltd
Yueqing Electric Power Industrial Co Ltd
Yueqing Power Repair Manufacture Factory
State Grid Zhejiang Electric Power Co Ltd
Wenzhou Power Supply Co of State Grid Zhejiang Electric Power Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STATE GRID ZHEJIANG NINGHAI COUNTY POWER SUPPLY Co, STATE GRID ZHEJIANG YUEQING POWER SUPPLY Co Ltd, Yueqing Electric Power Industrial Co Ltd, Yueqing Power Repair Manufacture Factory, State Grid Zhejiang Electric Power Co Ltd, Wenzhou Power Supply Co of State Grid Zhejiang Electric Power Co Ltd filed Critical STATE GRID ZHEJIANG NINGHAI COUNTY POWER SUPPLY Co
Priority to CN201110181189.5A priority Critical patent/CN102928893B/en
Publication of CN102928893A publication Critical patent/CN102928893A/en
Application granted granted Critical
Publication of CN102928893B publication Critical patent/CN102928893B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Surface Treatment Of Glass (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

本发明属于光学仪器及配件技术领域,尤其是涉及一种光学平面基片的制作方法;其特征在于它包含有依次进行的以下步骤:选取原材料、预成型、仿形、研磨、抛光、清洗、检验。本发明采用物理与化学结合的方式制作光学平面基片,工序大部分采用机器进行,人工参与的很少;因此,本发明具有以下有益效果:光学平面基片制作时间短、产品间的差异小、适合于工业大规模应用、效率高,所制作的平面基片平面度、平行度、粗糙度参数好。

The invention belongs to the technical field of optical instruments and accessories, and in particular relates to a method for manufacturing an optical flat substrate; it is characterized in that it includes the following steps in sequence: selecting raw materials, preforming, profiling, grinding, polishing, cleaning, test. The present invention adopts the combination of physics and chemistry to make the optical flat substrate, and most of the processes are carried out by machines, with little manual participation; therefore, the present invention has the following beneficial effects: the production time of the optical flat substrate is short, and the difference between products is small , Suitable for industrial large-scale application, high efficiency, and the flatness, parallelism, and roughness parameters of the flat substrate produced are good.

Description

一种光学平面基片的制作方法A kind of manufacturing method of optical planar substrate

技术领域 technical field

本发明属于光学仪器及配件技术领域,尤其是涉及一种光学平面基片的制作方法。The invention belongs to the technical field of optical instruments and accessories, in particular to a method for manufacturing an optical flat substrate.

背景技术 Background technique

随着科学技术的进步,光学仪器使用日益增多,而光学仪器中通常会使用到平面基片,平面基片在我们的四周处处可以看到,如:CD、HD、LD、VCD、DVD、CD-ROM和CVD等光盘基片;手机面板、MP3面板、摄像头玻片、精密仪表面板等等,都属于平面基片;现有技术中,平面基片的制作采用手工的较多,因此,制作时间长、产品间的差异大、效率低下,所制作的平面基片平面度、平行度、粗糙度相对较差;然而,社会对于这类产品的需求增长是相当惊人的,因此,现有技术已不能满足要求。With the advancement of science and technology, the use of optical instruments is increasing, and optical instruments usually use flat substrates, which can be seen everywhere around us, such as: CD, HD, LD, VCD, DVD, CD -CD substrates such as ROM and CVD; mobile phone panels, MP3 panels, camera slides, precision instrument panels, etc., all belong to planar substrates; in the prior art, the production of planar substrates is more manual, so the production The time is long, the difference between products is large, the efficiency is low, and the flatness, parallelism, and roughness of the flat substrate produced are relatively poor; however, the society's demand growth for this type of product is quite amazing. Therefore, the existing technology can no longer meet the requirements.

发明内容 Contents of the invention

为了解决上述问题,本发明的目的是提供一种光学平面基片的制作方法,它可大大提高生产效率,它是采用以下技术方案来实现的:In order to solve the above problems, the purpose of this invention is to provide a kind of preparation method of optical planar substrate, and it can improve production efficiency greatly, and it adopts following technical scheme to realize:

一种光学平面基片的制作方法,其特征在于它包含有依次进行的以下步骤:A method for making an optical planar substrate is characterized in that it comprises the following steps carried out in sequence:

第1步:选取原材料:选取厚度为0.1mm~1.0mm的基片母板;Step 1: Select raw materials: select the substrate motherboard with a thickness of 0.1mm to 1.0mm;

第2步:预成型:采用划片机在基片母板上划下所需大小的基片毛坯;Step 2: Preforming: Use a dicing machine to draw the substrate blank of the required size on the substrate master;

第3步:仿形:采用芯取机,对基片毛坯进行芯取达到预期轮廓的芯取片;Step 3: Profiling: use a core taking machine to core the substrate blank to achieve the expected contour;

第4步:研磨:采用球面研磨机或双面研磨机将芯取片进行研磨,研磨是在百级洁净室内进行的,温度为20℃~28℃;研磨是在研磨油中进行的,研磨完成形成研磨片;Step 4: Grinding: Use a spherical grinder or a double-sided grinder to grind the core slices. The grinding is carried out in a class 100 clean room at a temperature of 20°C to 28°C; the grinding is carried out in grinding oil. Complete the formation of abrasive sheets;

第5步:抛光:采用环抛机对研磨片的表面进行抛光;抛光是在抛光液中进行的,抛光时间为3分钟到10分钟,抛光温度为32℃~40℃,抛光压力150~250g/cm2;抛光完成形成抛光片;Step 5: Polishing: Use a ring polishing machine to polish the surface of the abrasive sheet; polishing is carried out in a polishing solution, the polishing time is 3 minutes to 10 minutes, the polishing temperature is 32°C-40°C, and the polishing pressure is 150-250g /cm 2 ; Polishing is completed to form a polishing sheet;

第6步:清洗:采用超声波清洗机对抛光片进行清洗,清洗并干燥完成得到清洗片;Step 6: Cleaning: Use an ultrasonic cleaning machine to clean the polished sheet, clean and dry to obtain a cleaned sheet;

第7步:检验:对清洗片进行粗糙度、平行度、平面度、厚度、表面裂纹、透光度检验,挑选出全部合格的即形成了光学平面基片。Step 7: Inspection: Carry out roughness, parallelism, flatness, thickness, surface cracks, and light transmittance inspections on the cleaning sheet, and select all qualified ones to form an optical flat substrate.

一种光学平面基片的制作方法,其特征在于它包含有依次进行的以下步骤:A method for making an optical planar substrate is characterized in that it comprises the following steps carried out in sequence:

第1步:选取原材料:选取厚度为0.1mm~1.0mm的基片母板;Step 1: Select raw materials: select the substrate motherboard with a thickness of 0.1mm to 1.0mm;

第2步:预成型:采用划片机在基片母板上划下所需大小的基片毛坯;Step 2: Preforming: Use a dicing machine to draw the substrate blank of the required size on the substrate master;

第3步:仿形:采用芯取机,对基片毛坯进行芯取达到预期轮廓的芯取片;Step 3: Profiling: use a core taking machine to core the substrate blank to achieve the expected contour;

第4步:研磨:采用球面研磨机或双面研磨机将芯取片进行研磨,研磨是在百级洁净室内进行的,温度为20℃~28℃;研磨是在研磨油中进行的,研磨完成形成研磨片;Step 4: Grinding: Use a spherical grinder or a double-sided grinder to grind the core slices. The grinding is carried out in a class 100 clean room at a temperature of 20°C to 28°C; the grinding is carried out in grinding oil. Complete the formation of abrasive sheets;

第5步:抛光:采用环抛机对研磨片的表面进行抛光;抛光是在抛光液中进行的,抛光时间为3分钟到10分钟,抛光温度为32℃~40℃,抛光压力150~250g/cm2;抛光完成形成抛光片;Step 5: Polishing: Use a ring polishing machine to polish the surface of the abrasive sheet; polishing is carried out in a polishing solution, the polishing time is 3 minutes to 10 minutes, the polishing temperature is 32°C-40°C, and the polishing pressure is 150-250g /cm 2 ; Polishing is completed to form a polishing sheet;

第6步:清洗:采用超声波清洗机对抛光片进行清洗,清洗并干燥完成得到清洗片;Step 6: Cleaning: Use an ultrasonic cleaning machine to clean the polished sheet, clean and dry to obtain a cleaned sheet;

第7步:贴膜:在清洗片表面贴上透光薄膜形成了贴膜基片;Step 7: Sticking film: Paste a light-transmitting film on the surface of the cleaning sheet to form a sticking film substrate;

第8步:检验:对贴膜基片进行粗糙度、平行度、平面度、厚度、表面裂纹、透光度检验,挑选出全部合格的即形成了光学平面基片。Step 8: Inspection: Check the roughness, parallelism, flatness, thickness, surface cracks, and light transmittance of the film substrate, and select all qualified ones to form an optical flat substrate.

上述所述的光学平面基片的制作方法,其特征在于所述抛光液具有以下成份:二氧化硅15%~40%(重量);氧化钠≤0.3%(重量);重金属及杂质≤40ppb;纯净水:二氧化硅、氧化钠、重金属及杂质三者重量之和的1~20倍;所述抛光液的密度为1.1g/ml~1.2g/ml。The above-mentioned method for making an optical flat substrate is characterized in that the polishing liquid has the following components: 15% to 40% (weight) of silicon dioxide; ≤0.3% (weight) of sodium oxide; ≤40ppb of heavy metals and impurities; Pure water: 1 to 20 times the weight of silicon dioxide, sodium oxide, heavy metals and impurities; the density of the polishing solution is 1.1 g/ml to 1.2 g/ml.

上述所述的光学平面基片的制作方法,其特征在于所述抛光液中的重金属为铜。The manufacturing method of the above-mentioned optical planar substrate is characterized in that the heavy metal in the polishing solution is copper.

上述所述的光学平面基片的制作方法,其特征在于所述研磨油中按重量计包含有以下成份:硼酸盐10%~30%、多元醇5%~20%、阴离子表面活性剂5%~15%、润滑剂5%~10%、防锈剂5%~10%、去离子水或纯净水15~60%、氧化钠5%~10%。The preparation method of the above-mentioned optical flat substrate is characterized in that the grinding oil contains the following components by weight: 10% to 30% of borate, 5% to 20% of polyol, 5% of anionic surfactant %~15%, lubricant 5%~10%, rust inhibitor 5%~10%, deionized water or purified water 15%~60%, sodium oxide 5%~10%.

上述所述的光学平面基片的制作方法,其特征在于所述多元醇为乙二醇或甘油或山梨醇;所述阴离子表面活性剂为羧酸盐或硫酸酯盐或磺酸盐或磷酸酯盐;所述润滑剂为如硅油或硅酸酯或磷酸酯或氟油;所述防锈剂为市售的YG-901型防锈剂。The preparation method of the above-mentioned optical planar substrate is characterized in that the polyhydric alcohol is ethylene glycol or glycerol or sorbitol; the anionic surfactant is carboxylate or sulfate ester salt or sulfonate or phosphoric acid ester salt; the lubricant is such as silicone oil or silicate ester or phosphoric acid ester or fluorine oil; the rust inhibitor is a commercially available YG-901 type rust inhibitor.

本发明采用物理与化学结合的方式制作光学平面基片,工序大部分采用机器进行,人工参与的很少;因此,本发明具有以下有益效果:光学平面基片制作时间短、产品间的差异小、适合于工业大规模应用、效率高,所制作的平面基片平面度、平行度、粗糙度参数好。The present invention adopts the combination of physics and chemistry to make the optical flat substrate, and most of the processes are carried out by machines, with little manual participation; therefore, the present invention has the following beneficial effects: the production time of the optical flat substrate is short, and the difference between products is small , Suitable for large-scale industrial applications, high efficiency, and the flatness, parallelism, and roughness parameters of the flat substrate produced are good.

附图说明 Description of drawings

图1是本发明实施实例1的原理框图;Fig. 1 is the functional block diagram of embodiment example 1 of the present invention;

图2是本发明实施实例2的原理框图。Fig. 2 is a functional block diagram of Embodiment 2 of the present invention.

具体实施方式 Detailed ways

下面结合附图对本发明作进一步详细的描述。The present invention will be described in further detail below in conjunction with the accompanying drawings.

实施实例1Implementation example 1

请见图1,一种光学平面基片的制作方法,其特征在于它包含有依次进行的以下步骤:Please see Fig. 1, a kind of preparation method of optical planar substrate is characterized in that it comprises the following steps of carrying out successively:

第10步:选取原材料:选取厚度为0.1mm~1.0mm的基片母板;Step 10: Select raw materials: select the substrate motherboard with a thickness of 0.1mm to 1.0mm;

第20步:预成型:采用划片机在基片母板上划下所需大小的基片毛坯;Step 20: Preforming: use a dicing machine to draw a substrate blank of the required size on the substrate motherboard;

第30步:仿形:采用芯取机,对基片毛坯进行芯取达到预期轮廓的芯取片;Step 30: profiling: using a coring machine to core the substrate blank to achieve the desired contour;

第40步:研磨:采用球面研磨机或双面研磨机将芯取片进行研磨,研磨是在百级洁净室内进行的,温度为20℃~28℃;研磨是在研磨油中进行的,研磨完成形成研磨片;Step 40: Grinding: Use a spherical grinder or a double-sided grinder to grind the core pieces. The grinding is carried out in a class 100 clean room at a temperature of 20°C to 28°C; the grinding is carried out in grinding oil. Complete the formation of abrasive sheets;

第50步:抛光:采用环抛机对研磨片的表面进行抛光;抛光是在抛光液中进行的,抛光时间为3分钟到10分钟,抛光温度为32℃~40℃,抛光压力150~250g/cm2;抛光完成形成抛光片;Step 50: Polishing: Use a ring polishing machine to polish the surface of the abrasive sheet; polishing is carried out in a polishing solution, the polishing time is 3 minutes to 10 minutes, the polishing temperature is 32 ° C ~ 40 ° C, and the polishing pressure is 150 ~ 250 g /cm 2 ; Polishing is completed to form a polishing sheet;

第60步:清洗:采用超声波清洗机对抛光片进行清洗,清洗并干燥完成得到清洗片;Step 60: Cleaning: Use an ultrasonic cleaning machine to clean the polished sheet, clean and dry to obtain a cleaned sheet;

第70步:检验:对清洗片进行粗糙度、平行度、平面度、厚度、表面裂纹、透光度检验,挑选出全部合格的即形成了光学平面基片。Step 70: Inspection: Carry out roughness, parallelism, flatness, thickness, surface cracks, and light transmittance inspections on the cleaning sheet, and select all qualified ones to form an optical flat substrate.

实施实例2Implementation Example 2

请见图2,一种光学平面基片的制作方法,其特征在于它包含有依次进行的以下步骤:Please see Fig. 2, a kind of preparation method of optical planar substrate is characterized in that it comprises the following steps of carrying out successively:

第10步:选取原材料:选取厚度为0.1mm~1.0mm的基片母板;Step 10: Select raw materials: select the substrate motherboard with a thickness of 0.1mm to 1.0mm;

第20步:预成型:采用划片机在基片母板上划下所需大小的基片毛坯;Step 20: Preforming: use a dicing machine to draw a substrate blank of the required size on the substrate motherboard;

第30步:仿形:采用芯取机,对基片毛坯进行芯取达到预期轮廓的芯取片;Step 30: profiling: using a coring machine to core the substrate blank to achieve the desired contour;

第40步:研磨:采用球面研磨机或双面研磨机将芯取片进行研磨,研磨是在百级洁净室内进行的,温度为20℃~28℃;研磨是在研磨油中进行的,研磨完成形成研磨片;Step 40: Grinding: Use a spherical grinder or a double-sided grinder to grind the core pieces. The grinding is carried out in a class 100 clean room at a temperature of 20°C to 28°C; the grinding is carried out in grinding oil. Complete the formation of abrasive sheets;

第50步:抛光:采用环抛机对研磨片的表面进行抛光;抛光是在抛光液中进行的,抛光时间为3分钟到10分钟,抛光温度为32℃~40℃,抛光压力150~250g/cm2;抛光完成形成抛光片;Step 50: Polishing: Use a ring polishing machine to polish the surface of the abrasive sheet; polishing is carried out in a polishing solution, the polishing time is 3 minutes to 10 minutes, the polishing temperature is 32 ° C ~ 40 ° C, and the polishing pressure is 150 ~ 250 g /cm 2 ; Polishing is completed to form a polishing sheet;

第60步:清洗:采用超声波清洗机对抛光片进行清洗,清洗并干燥完成得到清洗片;Step 60: Cleaning: Use an ultrasonic cleaning machine to clean the polished sheet, clean and dry to obtain a cleaned sheet;

第70步:贴膜:在清洗片表面贴上透光薄膜形成了贴膜基片;Step 70: Sticking the film: Paste a light-transmitting film on the surface of the cleaning sheet to form a film base;

第80步:检验:对贴膜基片进行粗糙度、平行度、平面度、厚度、表面裂纹、透光度检验,挑选出全部合格的即形成了光学平面基片。Step 80: Inspection: Check the roughness, parallelism, flatness, thickness, surface cracks, and light transmittance of the film substrate, and select all qualified ones to form an optical flat substrate.

当然,上述所述的任一种光学平面基片的制作方法,其特征在于所述抛光液具有以下成份:二氧化硅15%~40%(重量);氧化钠≤0.3%(重量);重金属及杂质≤40ppb;纯净水:二氧化硅、氧化钠、重金属及杂质三者重量之和的1~20倍;所述抛光液的密度为1.1g/ml~1.2g/ml。Certainly, the preparation method of any one of the above-mentioned optical planar substrates is characterized in that the polishing liquid has the following components: silicon dioxide 15% to 40% (weight); sodium oxide≤0.3% (weight); heavy metal and impurities≤40ppb; pure water: 1-20 times the sum of the weight of silicon dioxide, sodium oxide, heavy metals and impurities; the density of the polishing liquid is 1.1g/ml-1.2g/ml.

进一步地,上述所述的光学平面基片的制作方法,其特征在于所述抛光液中的重金属为铜。Furthermore, the above-mentioned method for manufacturing an optical flat substrate is characterized in that the heavy metal in the polishing solution is copper.

当然,上述所述的任一种光学平面基片的制作方法,其特征在于所述研磨油中按重量计包含有以下成份:硼酸盐10%~30%、多元醇5%~20%、阴离子表面活性剂5%~15%、润滑剂5%~10%、防锈剂5%~10%、去离子水或纯净水15~60%、氧化钠5%~10%。Certainly, the preparation method of any one of the above-mentioned optical plane substrates is characterized in that the grinding oil contains the following components by weight: 10% to 30% of borate, 5% to 20% of polyhydric alcohol, Anionic surfactant 5% to 15%, lubricant 5% to 10%, rust inhibitor 5% to 10%, deionized water or purified water 15% to 60%, sodium oxide 5% to 10%.

进一步地,上述所述的光学平面基片的制作方法,其特征在于所述多元醇为乙二醇或甘油或山梨醇;所述阴离子表面活性剂为羧酸盐或硫酸酯盐或磺酸盐或磷酸酯盐;所述润滑剂为如硅油或硅酸酯或磷酸酯或氟油;所述防锈剂为市售的YG-901型防锈剂。Further, the above-mentioned method for making an optical planar substrate is characterized in that the polyhydric alcohol is ethylene glycol or glycerin or sorbitol; the anionic surfactant is a carboxylate or sulfate ester salt or sulfonate Or phosphate ester salt; Described lubricant is as silicone oil or silicate or phosphoric acid ester or fluorine oil; Described antirust agent is commercially available YG-901 type antirust agent.

本发明采用物理与化学结合的方式制作光学平面基片,工序大部分采用机器进行,人工参与的很少;因此,本发明具有以下有益效果:光学平面基片制作时间短、产品间的差异小、适合于工业大规模应用、效率高,所制作的平面基片平面度、平行度、粗糙度参数好。The present invention adopts the combination of physics and chemistry to make the optical flat substrate, and most of the processes are carried out by machines, with little manual participation; therefore, the present invention has the following beneficial effects: the production time of the optical flat substrate is short, and the difference between products is small , Suitable for large-scale industrial applications, high efficiency, and the flatness, parallelism, and roughness parameters of the flat substrate produced are good.

本发明不局限于上述最佳实施方式,应当理解,本发明的构思可以按其他种种形式实施运用,它们同样落在本发明的保护范围内。The present invention is not limited to the best implementation mode above, it should be understood that the concept of the present invention can be implemented in other forms, and they also fall within the protection scope of the present invention.

Claims (4)

1. a method for making for optical flat substrate, is characterized in that it includes the following steps of carrying out successively:
The first step: choose starting material: choosing thickness is the substrate motherboard of 0.1mm~1.0mm;
Second step: preformed: adopt scribing machine to draw the substrate blank of lower required size on substrate motherboard;
The 3rd step: profiling: adopt core to get machine, substrate blank is carried out to core and get the core that reaches expection profile and get sheet;
The 4th step: grind: adopt sphere grinding machine or twin grinder that core is got to sheet and grind, carry out in grinding Shi Baiji toilet, temperature is 20 ℃~28 ℃; Grinding is carried out in grinding oil, has ground formation abrasive sheet;
The 5th step: polishing: adopt glass polishing machine to carry out polishing to the surface of abrasive sheet; Polishing is carried out in polishing fluid, and polishing time is 3 minutes to 10 minutes, and polish temperature is 32 ℃~40 ℃, polish pressure 150~250 g/cm 2; Polishing completes formation polished silicon wafer;
The 6th step: clean: adopt supersonic wave cleaning machine to clean polished silicon wafer, clean and be dried and obtain cleaning sheet;
The 7th step: check: cleaning sheet is carried out to roughness, the depth of parallelism, flatness, thickness, surface crack, penetrability check, pick out all qualified optical flat substrates that formed.
2. a method for making for optical flat substrate, is characterized in that it includes the following steps of carrying out successively:
The first step: choose starting material: choosing thickness is the substrate motherboard of 0.1mm~1.0mm;
Second step: preformed: adopt scribing machine to draw the substrate blank of lower required size on substrate motherboard;
The 3rd step: profiling: adopt core to get machine, substrate blank is carried out to core and get the core that reaches expection profile and get sheet;
The 4th step: grind: adopt sphere grinding machine or twin grinder that core is got to sheet and grind, carry out in grinding Shi Baiji toilet, temperature is 20 ℃~28 ℃; Grinding is carried out in grinding oil, has ground formation abrasive sheet;
The 5th step: polishing: adopt glass polishing machine to carry out polishing to the surface of abrasive sheet; Polishing is carried out in polishing fluid, and polishing time is 3 minutes to 10 minutes, and polish temperature is 32 ℃~40 ℃, polish pressure 150~250 g/cm 2; Polishing completes formation polished silicon wafer;
The 6th step: clean: adopt supersonic wave cleaning machine to clean polished silicon wafer, clean and be dried and obtain cleaning sheet;
The 7th step: pad pasting: light transmission film has formed pad pasting substrate on cleaning sheet surface label;
The 8th step: check: pad pasting substrate is carried out to roughness, the depth of parallelism, flatness, thickness, surface crack, penetrability check, pick out all qualified optical flat substrates that formed.
3. according to the method for making of claim 1 or a kind of optical flat substrate claimed in claim 2, it is characterized in that including by weight in described grinding oil following composition: borate 10%~30%, polyvalent alcohol 5%~20%, anionic surfactant 5%~15%, lubricant 5%~10%, rust preventive 5%~10%, deionized water or pure water 15~60%, sodium oxide molybdena 5%~10%.
4. the method for making of a kind of optical flat substrate according to claim 3, is characterized in that described polyvalent alcohol is ethylene glycol or glycerine or sorbierite; Described anionic surfactant is carboxylate or sulfuric acid or sulfonate or phosphate ester salt; Described lubricant is as silicone oil or esters of silicon acis or phosphate or fluorocarbon oil; Described rust preventive is commercially available YG-901 type rust preventive.
CN201110181189.5A 2011-06-29 2011-06-29 Manufacturing method for optical planar substrate Expired - Fee Related CN102928893B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110181189.5A CN102928893B (en) 2011-06-29 2011-06-29 Manufacturing method for optical planar substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110181189.5A CN102928893B (en) 2011-06-29 2011-06-29 Manufacturing method for optical planar substrate

Publications (2)

Publication Number Publication Date
CN102928893A CN102928893A (en) 2013-02-13
CN102928893B true CN102928893B (en) 2014-10-08

Family

ID=47643733

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110181189.5A Expired - Fee Related CN102928893B (en) 2011-06-29 2011-06-29 Manufacturing method for optical planar substrate

Country Status (1)

Country Link
CN (1) CN102928893B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106346317A (en) * 2016-09-12 2017-01-25 天津华海清科机电科技有限公司 Method for processing and preparing sapphire wafer
CN106903559A (en) * 2017-04-18 2017-06-30 山西中聚晶科半导体有限公司 A kind of sapphire substrate preparation method
CN107598715A (en) * 2017-09-08 2018-01-19 中国科学院光电技术研究所 Large-caliber special-shaped plane machining method
CN119175650A (en) * 2024-11-26 2024-12-24 浙江罗克光电科技股份有限公司 Single-side processing and grinding device and process for PPG glass

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715358A (en) * 2004-06-14 2006-01-04 花王株式会社 Polishing composition
CN1734575A (en) * 2004-08-09 2006-02-15 天津日恒科技发展有限公司 Method for making novel glass substrate of hard disk
CN1947944A (en) * 2006-08-11 2007-04-18 周海 Technique for nanometer grade super smooth processing gallium phosphide wafer
CN101281349A (en) * 2007-06-06 2008-10-08 浙江水晶光电科技股份有限公司 Projection machine heat radiation board and manufacturing process thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715358A (en) * 2004-06-14 2006-01-04 花王株式会社 Polishing composition
CN1734575A (en) * 2004-08-09 2006-02-15 天津日恒科技发展有限公司 Method for making novel glass substrate of hard disk
CN1947944A (en) * 2006-08-11 2007-04-18 周海 Technique for nanometer grade super smooth processing gallium phosphide wafer
CN101281349A (en) * 2007-06-06 2008-10-08 浙江水晶光电科技股份有限公司 Projection machine heat radiation board and manufacturing process thereof

Also Published As

Publication number Publication date
CN102928893A (en) 2013-02-13

Similar Documents

Publication Publication Date Title
CN102928893B (en) Manufacturing method for optical planar substrate
CN104669106B (en) Large-size A-oriented sapphire mobile phone screen double-sided grinding and double-sided polishing efficient ultra-precision processing method
CN103252708A (en) Sapphire substrate ultraprecision machining method based on fixed abrasive pad
CN101462256B (en) Method for Polishing Component Surface Using Nano Colloid Jet
CN102528597B (en) Manufacturing process of large-diameter silicon wafer
CN102220645B (en) Method for texturing silicon wafer cut by diamond wire
CN109545680B (en) Rapid preparation method of high-flatness and low-damage monocrystalline silicon carbide substrate
CN105038605B (en) Sapphire roughly grinds liquid
TWI616940B (en) Method for the polishing of a semiconductor wafer
CN104088017A (en) Sapphire mobile phone panel processing method
MY166770A (en) Manufacturing method of magnetic disk substrate
CN104842225A (en) Wet processing method for large-dimension sapphire substrate surface
CN104827592A (en) Processing method of large-sized sapphire substrate slice
CN108972919A (en) The technique that silicon single crystal rod is processed into monocrystalline silicon buffing silicon wafer
CN104356950A (en) Sapphire wafer polishing solution
CN101481586B (en) Nonaqueous non-abrasive polishing solution for soft, crisp and deliquescent crystal
CN109676437B (en) Silicon carbide wafer and method for producing same
CN103983499B (en) A kind of observational technique to zirconium-base amorphous alloy internal shear band
CN103203681A (en) Environment-friendly II-VI class soft fragile crystal grinding and polishing method
CN108972159A (en) A kind of sapphire ball cover double-side grinding method
JP5585269B2 (en) Method for manufacturing glass substrate for magnetic recording medium
CN102977987A (en) Special grinding fluid for ductile regime lapping of optical glass and preparation method of special grinding fluid
CN104046319A (en) Physical polishing composition
CN101613885A (en) ZnGeP 2Crystal corrosive and caustic solution
WO2013118648A1 (en) Method for producing glass product and method for producing magnetic disk

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: STATE GRID ZHEJIANG ELECTRIC POWER COMPANY WENZHOU

Effective date: 20140820

Owner name: YUEQING ELECTRIC POWER MAINTENANCE AND REPAIR FACT

Free format text: FORMER OWNER: JIANG JUSHENG

Effective date: 20140820

C41 Transfer of patent application or patent right or utility model
C53 Correction of patent for invention or patent application
CB03 Change of inventor or designer information

Inventor after: Ding Pinggang

Inventor after: Xie Bin

Inventor after: Fang Liyun

Inventor after: Wang Jie

Inventor after: Shao Wenjin

Inventor after: Xu Dayuan

Inventor after: Bao Huahui

Inventor after: Yang Yueping

Inventor before: Fang Yaqin

Inventor before: Jiang Jusheng

COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: 215552 SUZHOU, JIANGSU PROVINCE TO: 315600 NINGBO, ZHEJIANG PROVINCE

Free format text: CORRECT: INVENTOR; FROM: FANG YAQIN JIANG JUSHENG TO: DING PINGGANG XIE BIN FANG LIYUN WANG JIE SHAO WENJIN XU DAYUAN BAO HUAHUI YANG YUEPING

TA01 Transfer of patent application right

Effective date of registration: 20140820

Address after: 315600 No. 161, Lane 1, Ning Xi Road, Le Town, Yueqing, Zhejiang

Applicant after: YUEQING POWER REPAIR MANUFACTURE FACTORY

Applicant after: State Grid Zhejiang Electric Power Company

Applicant after: Wenzhou Power Supply Company, State Grid Zhejiang Electric Power Company

Applicant after: STATE GRID ZHEJIANG YUEQING POWER SUPPLY CO., LTD.

Applicant after: YUEQING ELECTRIC POWER INDUSTRIAL CO., LTD.

Applicant after: State Grid Zhejiang Ninghai County Power Supply Company

Address before: 215552 Jiangsu Province, Changshou City Wang Ni Qiao Cun Xin Zhuang Zhen Luo Jia Bang (18) No. 75

Applicant before: Jiang Jusheng

C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141008

Termination date: 20150629

EXPY Termination of patent right or utility model