CN102903647A - Chip soldering apparatus - Google Patents
Chip soldering apparatus Download PDFInfo
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- CN102903647A CN102903647A CN2012102617990A CN201210261799A CN102903647A CN 102903647 A CN102903647 A CN 102903647A CN 2012102617990 A CN2012102617990 A CN 2012102617990A CN 201210261799 A CN201210261799 A CN 201210261799A CN 102903647 A CN102903647 A CN 102903647A
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- 238000005476 soldering Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 claims abstract description 90
- 239000011796 hollow space material Substances 0.000 claims description 4
- 230000001133 acceleration Effects 0.000 description 31
- 238000000034 method Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 9
- 210000001503 joint Anatomy 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000008093 supporting effect Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000639 Spring steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A chip soldering apparatus is provided to properly pick up thin or crisp semiconductor chips for soldering by using a simple structure. The chip soldering apparatus comprises a shaft (12), wherein a soldering tool (11) for picking up the semiconductor chips for soldering is disposed on a front end of the shaft; a soldering point (50) passes through a mounting shaft (12) of a plurality of parallelly disposed flat link rods (20, 30) and rectilinearly moves along an extension direction of the shaft (12); a rod (40) disposed on the soldering tip (50) in a free rotation manner, wherein a front end (41) of the rod is connected with the shaft (12), and a rear end (43) is provided with a banlance weight (48) set to be a weight enabling a torque of a rotating shaft of the rod (40) to be balanced; and a spring (58) disposed between the soldering tip (50) and the rod (40) and provided with a push load for pressing the soldering tool to be connected with the semiconductor chips.
Description
Technical field
The present invention relates to the structure of die-bonding device (die bonding).
Background technology
Being used for semiconductor chip is bonded on the die-bonding device of substrate etc., is the wafer picking up semiconductor chip from being cut, and the semiconductor chip that picks up is welded on substrate or the pin engage.The plumb joint of this die-bonding device is installed the anchor clamps (collet) as absorption semiconductor chip pick tool, this die-bonding device so that described plumb joint move towards vertical direction relative to semiconductor chip surface.When picking up semiconductor chip or with semiconductor chip, be welded on substrate etc. when upper, anchor clamps need to be pressed against on the semiconductor chip with to a certain degree racking, therefore, proposed for example to depress anchor clamps by voice coil motor (voice coil motor), semiconductor chip has been applied the method (for example with reference to patent documentation 1) of suitable racking.
But voice coil motor weight is large, and the high-speed mobile difficulty of plumb joint is added the control device that needs to be used for adjusting small racking, has the complex structure problem.So, also use following straightforward procedure: between anchor clamps and plumb joint, installation can be adjusted the anchor clamps load spring such to the pushing force of semiconductor chip according to the dropping distance of plumb joint, by control plumb joint height, when picking up semiconductor chip or with semiconductor chip, be welded on substrate etc. when upper, so that suitable racking is applied on the semiconductor chip.
But, in the method for maneuvering load spring, anchor clamps, the axle of sectional fixture, and the load spring consists of the vibrational system of so-called spring mass system, because of the responsiveness of die-bonding device or the size of racking etc., sometimes large vibration occurs up and down in anchor clamps and axle, when pick-up chip or with semiconductor chip, be welded on substrate etc. when upper, for so that anchor clamps do not float from semiconductor chip surface, need to apply slightly large racking.
[patent documentation 1] TOHKEMY 2005-340411 communique
On the other hand, in recent years, semiconductor chip thickness is very thin, its intensity step-down.Also use the semiconductor chips that adopt the fragile materials such as GaAs again, more.Therefore, when picking up semiconductor chip or with semiconductor chip, be welded on substrate etc. when upper, need to reduce as far as possible to be applied to the racking of thin or crisp like this semiconductor chip.But, in the method for maneuvering load spring, in order to prevent floating because of vibration, have the problem that is difficult to reduce racking.Furtherly, when occasion occurs in vibration, because of the reaction of load spring, semiconductor chip moment is applied large racking, damaged problem occurs in semiconductor chip when having.Therefore, in the die-bonding device of in the past maneuvering load spring, there is following problem: can not apply for the little racking of picking up thin or crisp semiconductor chip necessity, be difficult to pick up suitably thin or crisp semiconductor chip and be welded on substrate etc.
Summary of the invention
The object of the invention is to, in die-bonding device, pick up suitably thin or crisp semiconductor chip with simple structure and weld.
In order to solve above-mentioned problem, die-bonding device of the present invention is characterized in that:
Described die-bonding device comprises:
Axle is installed the soldering appliance that picking up semiconductor chip welds at front end;
Plumb joint is by the dull and stereotyped link rod installation shaft of a plurality of configured in parallel, along the bearing of trend traveling priority of axle;
Bar is installed in plumb joint with freely rotating, and an end is connected with axle, at the other end balance weight is installed; And
Spring is installed between the other end of plumb joint and bar, invests the racking that soldering appliance is crimped on semiconductor chip;
Balance weight has so that the weight of the torque balance of the wraparound rotating shaft of bar.
In die-bonding device of the present invention, be preferably, bar is by so that two cross crossing cross leaf springs of leaf spring are installed in plumb joint with freely rotating, and the gyroaxis of bar is the axle of the line that intersects along two leaf springs.
In die-bonding device of the present invention, be preferably, each dull and stereotyped link rod comprises annular plate and cab apron, described annular plate extends along the face that intersects with the axle bearing of trend, be installed in plumb joint, described cab apron is configured in and the annular plate the same face, crosses over the inboard hollow space that is positioned at of annular plate, and axle is installed in cab apron.
In die-bonding device of the present invention, be preferably, the annular plate of each dull and stereotyped link rod is four square ring shapes roughly, is fixed on plumb joint at each fixing points of the central authorities on two limits of subtend.
In die-bonding device of the present invention, be preferably, cab apron extends along the direction of intersecting with the direction of each fixing point that is connected annular plate, and from central authorities that axle connects towards the two ends that are connected with annular plate, width diminishes.
In die-bonding device of the present invention, be preferably, annular plate is from each fixing point towards the two ends that are connected with cab apron, and width diminishes.
Below, effect of the present invention is described:
The present invention has in die-bonding device can pick up the effect that thin or crisp semiconductor chip welds suitably with simple structure.
Description of drawings
Fig. 1 is the stereogram of structure of the die-bonding device of expression the invention process form.
Fig. 2 is the stereogram of dull and stereotyped link rod of the die-bonding device of expression the invention process form.
Fig. 3 is the sectional drawing of the state before the picking up semiconductor chip of die-bonding device of expression the invention process form.
Fig. 4 is the sectional drawing of picking up semiconductor chip state of the die-bonding device of expression the invention process form.
Fig. 5 is the stereogram of deformation state of dull and stereotyped link rod of the die-bonding device of expression the invention process form.
Fig. 6 is the side view of deformation state of dull and stereotyped link rod of the die-bonding device of expression the invention process form.
Fig. 7 is the figure line of variation of the racking phase butt joint amount of sinking to of the die-bonding device of expression the invention process form.
Fig. 8 is the figure line that torque changes and racking changes of wraparound rotating shaft of decrease speed, bar of plumb joint of the die-bonding device of expression the invention process form.
Fig. 9 is the figure line of plumb joint and racking variation after semiconductor chip contacts of the die-bonding device of expression the invention process form.
Symbolic significance is as follows among the figure:
The 11-soldering appliance
The 12-axle
The 13-end block
The 14-ring
Dull and stereotyped link rod under the 20-
30-upper flat plate link rod
21,31-annular plate
The 31a-first side
The 31b-Second Edge
22,32-cab apron
33-fixing point
24,34-hollow space
The 40-bar
The 40c-gyroaxis
The 41-leading section
The 42-bolt
The 43-rearward end
The 44-central block
45-cross leaf spring
46-horizontal spring plate
47-uprighting spring plate
The 48-balance weight
The 49-web
The 50-plumb joint
The 51-body
The 52-underarm
The 53-upper arm
The 54-bolt
The 55-sleeve
The 56-block
The 57-hole
The 58-spring
The 61-slide block
The 62-linear guide
71,72-center line
The 73-straight line
The 81-pick-up table
83-cuts band
The 90-semiconductor chip
The 100-die-bonding device
Embodiment
Below, Yi Bian with reference to accompanying drawing example of the present invention is described on one side.As shown in Figure 1, the die-bonding device 100 of this example comprises and is installed in the linear guide 62 that does not have the illustrated mobile device that moves to X, Y-direction, the slide block 61 that moves along linear guide 62 towards the Z direction, and the plumb joint 50 that is fixed on slide block 61, moves towards the Z direction with slide block 61.Plumb joint 50 comprises the body 51 that is fixed on slide block 61, the a pair of underarm 52 and a pair of upper arm 53 that extend from body 51 towards Y-direction, be fixed on the lower dull and stereotyped link rod (link) 20 of underarm 52 by bolt 54 by sleeve (bush) 55, be fixed on the upper flat plate link rod 30 of upper arm 53 by bolt 54 by sleeve 55, be separately fixed at the axle 12 of lower dull and stereotyped link rod 20 and upper flat plate link rod 30, be installed in the soldering appliance 11 of absorption semiconductor chip of the downside front end of axle 12.Lower dull and stereotyped link rod 20 and upper flat plate link rod 30 configured in parallel.In the upper end of axle 12, the large end block 13 of outer diameter ratio shaft 12 is installed, constitute below body 51 sides of end block 13 and collide above the block 56 of the inverted u-shaped that is fixed on upper arm 53 with bolt 54.In Fig. 1, the Z direction is vertical direction, and X, Y-direction represent mutually orthogonal horizontal plane.In other figure of following explanation too.
Again, on the top of body 51, by the cross leaf spring 45 as the revolution guide, bar 40 phase butt joints 50 are installed with freely rotating.The end block 13 of the leading section 41 of bar 40 (axle 12 sides or the positive side of Y-direction) and axle 12 is linked by web 49.Again, balance weight 48 is fixed on the rearward end (slide block 61 sides or Y-direction minus side) of bar 40 by bolt 42.The spring 58 that invests the racking of crimping semiconductor chip is installed in the hole 57 of the body 51 that is located at balance weight 48 downsides.The upper end of spring 58 contacts with balance weight 48.
Cross leaf spring 45 is cross combined horizontal latch plate 46 and uprighting spring plate 47, the rear end of horizontal spring plate 46 (slide block 61 sides or Y-direction minus side) is fixed on the body 51 of plumb joint 50 by bolt 42, front end (axle 12 sides or the positive side of Y-direction) be fixed on by bolt 42 bar 40 central block 44 below.Again, the lower end of uprighting spring plate 47 is fixed on the top of the body 51 of plumb joint 50 by bolt 42, and its upper end is fixed on the vertical plane of the central block 44 of bar 40 by bolt 42.Like this, cross leaf spring 45 has four ends in upper end and lower end of the front end of horizontal spring plate 46 and rear end, uprighting spring plate 47, the rear end of the horizontal spring plate 46 of adjacency and the lower end of uprighting spring plate are fixed on the body 51 of plumb joint 50, and the upper end of the front end of horizontal spring plate 46 and uprighting spring plate 47 is fixed on the central block 44 of bar 40.And the line that the directions Xs that intersect along horizontal spring plate 46 and uprighting spring plate 47 extend becomes the gyroaxis 40c of bar 40, and cross leaf spring 45 cramp bars 40 make its wraparound rotating shaft 40c revolution freely.
Describe the structure of upper flat plate link rod 30 on one side on one side in detail with reference to Fig. 2.As shown in Figure 2, upper flat plate link rod 30 is the thin stainless steel of processing or spring steel etc., extends in the X of the Z perpendicular direction that extends with axle 12, Y face.Upper flat plate link rod 30 comprises annular plate 31 and the cab apron 32 of crossing over the hollow space 34 of annular plate 31 inboards along Y-direction.Annular plate 31 and cab apron 32 are configured in the same plane.Annular plate 31 roughly becomes cubic ring-type, and extend towards directions X or Y-direction on each limit.And, the central authorities of the length direction of a pair of first side 31a that extends towards Y-direction, by sleeve 55 by bolt 54 be fixed on upper arm 53 above.The part that is fixed on the first side 31a of upper arm 53 by this bolt 54 is respectively the fixing point 33 of upper flat plate link rod 30.Again, the central separately of a pair of Second Edge 31b of extending along directions X of annular plate 31 connected towards Y-direction by cab apron 32.And, at the central fixed axis 12 of cab apron 32.As shown in Figure 2, the center line 72 of cab apron 32 is the lines by the center line 71 of axle 12.Axle 12 is installed in the part of cab apron 32 and is strengthened by ring 14.As shown in Figure 2, cab apron 32 extends towards Y-direction by the center line 71 of axle 12, and the middle body width that axle 12 is fixed is wide, and the end towards being connected with annular plate 31 becomes the cone-shaped that its width diminishes.Again, a pair of first side 31a that extends towards Y-direction, wide by the partial width of the fixing fixing point 33 of bolt 54, along with towards Second Edge 31b, the width of first side 31a diminishes.And two fixing points 33 and axle 12 are configured on the straight line 73, form a line towards directions X.The above has illustrated the structure of upper flat plate link rod 30, and the structure of lower dull and stereotyped link rod 20 is also identical with upper flat plate link rod 30.
Action during die-bonding device 100 picking up semiconductor chip of this example that explanation is made of like that above-mentioned explanation.For reference Fig. 1, the part of Fig. 2 explanation is marked with same-sign, and omission is described.
As shown in Figure 3, the semiconductor chip 90 of wanting to pick up is bonded with overleaf and cuts with under 83 the state, is absorbed and fixed on the pick-up table 81.Cut and be with 83 under extended state on every side, produce minim gap between each semiconductor chip 90.Die-bonding device 100 is not by having illustrated X, Y mobile device so that plumb joint 50 moves so that be installed in the position of the soldering appliance 11 of axle 12 lower ends come the semiconductor chip 90 wanting to pick up directly over.
Then, as shown in Figure 4, die-bonding device 100 descends along the Z direction so that the slide block 61 of plumb joint 50 is installed down according to there not being the instruction of illustrated control part.Then, control part is so that after the surface of the front end of soldering appliance 11 and semiconductor chip 90 joins, further so that slide block 61 and plumb joint 50 falling head Δ Zo.So as shown in Figure 4, axle 12 is subjected to two dull and stereotyped link rod 20,30 guiding, phase butt joint 50 only moves height Δ Zo towards the top, and the end block 13 of axle 12 upper ends also only moves height Δ Zo towards the top.And the leading section 41 of the bar 40 that is connected with end block 13 by web 49 also only moves height Δ Zo towards the top.Bar 40 turns round around X-axis along horizontal spring plate 46 and the uprighting spring plate 47 crossing gyroaxis 40c of cross leaf spring 45, and the rearward end 43 of bar 40 only moves height Δ Z down
5So spring 58 only shortens length Δ Z in Z direction length
5, because the rearward end 43 of its reaction force push strut 40 rises, apply power Fo down for the end block 13, the axle 12 that are connected with the leading section 41 of bar 40 by web 49.The inside of soldering appliance 11 is not by there being illustrated vacuum plant to become vacuum, and therefore, if because of this power Fo, soldering appliance 11 is pushed to the surface of semiconductor chip 90, then soldering appliance 11 absorption semiconductor chips 90.After this, if by there not being illustrated control part, slide block 61 rises, then soldering appliance 11 picking up semiconductor chip 90.
With reference to Fig. 5, Fig. 6, after the surface of detailed description soldering appliance 11 and semiconductor chip 90 joins, the distortion of the upper flat plate link rod 30 during plumb joint 50 further falling head Δ Zo and the movement of axle 12.After the surface of soldering appliance 11 and semiconductor chip 90 joins, if plumb joint 50 further falling head Δ Zo, then as shown in Figure 5, height falling head Δ Zo when fixedly the upper arm 53 of upper flat plate link rod 30 also joins than the surface of soldering appliance 11 and semiconductor chip 90, height falling head Δ Zo when therefore, the fixing point 33 of upper flat plate link rod 30 also joins than the surface of soldering appliance 11 and semiconductor chip 90.On the other hand, the soldering appliance of axle 12 front ends 11 joins with the surface of semiconductor chip 90, therefore, can not descend again, and between the central authorities of the fixing cab apron 32 of the axle 12 of upper flat plate link rod 30 and two fixing points 33, generation Δ Zo difference in height.Because of the fixing point 33 of upper flat plate link rod 30, each first side 31a that central authorities and upper arm 53 are fixed is shown in Fig. 5 and Fig. 6 (a), and is crooked towards Second Edge 31b towards the top from fixing point 33.Again, shown in Fig. 5 and Fig. 6 (b), the cab apron 32 that is between the Second Edge 31b is out of shape towards the top from Second Edge 31b, so that the central portion of installation shaft 12 protuberance.And then shown in Fig. 5 and Fig. 6 (b), Second Edge 31b connects the middle body of cab apron 32, from the two ends protuberance that is connected with first side 31a, upward distortion.Shown in Fig. 6 (a), because of the bending of first side 31a towards the top, between the two ends or Second Edge 31b of fixing point 33 and first side 31a, produce Δ Z
1Difference in height.Shown in Fig. 6 (b), because of the distortion of the protuberance of Second Edge 31b, between the central portion of the two ends of first side 31a and Second Edge 31b, produce Δ Z again,
2Difference in height.And then, shown in Fig. 6 (b), because of the distortion of the protuberance of cab apron 32, between the central authorities of the installation cab apron 32 of the central authorities of Second Edge 31b and axle 12, produce Δ Z
3Difference in height.And, this difference in height Δ Z
1, Δ Z
2, Δ Z
3Adding up to becomes height Δ Zo.That is, Δ Z
1+ Δ Z
2+ Δ Z
3=Δ Zo.
Like this, upper flat plate link rod 30 is because of the flexural deformation of the first side 31a that extends from fixing point 33, and the protuberance distortion of Second Edge 31b, and the protuberance distortion that is in the cab apron 32 between the Second Edge 31b are so that axle 12 phase butt joints 50 move height Δ Zo along the Z direction.Again, the end that is connected with Second Edge 31b of first side 31a and cab apron 32, its width diminishes, and therefore, forms respectively connecting rod at the two ends of Second Edge 31b and the two ends of cab apron 32, because of the revolution of each connecting rod, so that axle 12 moves towards the Z direction.Therefore, axle 12 occurs hardly for the resistance that the Z direction moves.Again, dull and stereotyped link rod 20 and 30 2 dull and stereotyped link rods of upper flat plate link rod under die-bonding device 100 configured in parallel of this example, thus, axle 12 supportings are for moving along the Z direction, therefore, axle 12 moves along vertical direction smoothly relative to the surface energy of semiconductor chip 90.Have, as shown in Figure 4, therefore bar 40, does not have such frictional resistance such as floating bearing by cross leaf spring 45 wraparound rotating shaft 40c pivoting supports, can occur for rotating resistance hardly again.
Therefore, after the surface of soldering appliance 11 and semiconductor chip 90 joins, when plumb joint 50 sinks to height Δ Z, be applied to semiconductor chip 90 the surface power as shown in Figure 7, relatively sink to height Δ Z, in direct ratio.That is, become F=K * Δ Z.And, if the amount of sinking to becomes height Δ Zo, then semiconductor chip 90 is applied the racking of Fo=K * Δ Zo.And, as mentioned above, if because of this power Fo, soldering appliance 11 and semiconductor chip 90 surperficial crimping, then soldering appliance absorption semiconductor chip 90.After this, if by there not being illustrated control part, slide block 61 rises, then soldering appliance 11 picking up semiconductor chip 90.
The above has illustrated the elemental motion of the die-bonding device 100 of this example, below, illustrate so that plumb joint 50 drops to the front end that makes soldering appliance 11 to be connected on mutually action on the semiconductor chip 90, and the inertia force that at this moment produces.
As shown in Figure 3, if so that soldering appliance 11 come the semiconductor chip 90 that picks up directly over, then do not have illustrated control part to drive slide block 61, so that plumb joint 50 begins to descend towards semiconductor chip 90.
If at time t shown in Figure 8
20, plumb joint 50 begins to descend, and then the decrease speed v of plumb joint 50 accelerates gradually from zero.Then, from time t shown in Figure 8
21To time t
22Between, acceleration (positive acceleration) is certain, and the decrease speed v straight line of plumb joint 50 increases.Then, from time t shown in Figure 8
22To time t
23Between, acceleration becomes negative value, and the climbing of the decrease speed of plumb joint 50 reduces gradually, and the decrease speed v of plumb joint 50 moves closer to certain decrease speed V
1After this, from time t shown in Figure 8
23To time t
24Between, plumb joint 50 is with certain decrease speed V
1Descend.Between plumb joint 50 decrement phases, control part according to this testing result, calculates the front end of soldering appliance 11 and the distance on semiconductor chip 90 surfaces by there not being illustrated height sensor to detect plumb joint 50 height.
Then, if the Distance Shortened on the front end of soldering appliance 11 and semiconductor chip 90 surfaces is to institute's set a distance, then such as Fig. 8 time t
24Shown in, the decrease speed v of plumb joint 50 is from certain decrease speed V
1Reduce gradually.From time t shown in Figure 8
24To time t
25Between, acceleration becomes negative value, and the decrease speed v of plumb joint 50 is along with the time diminishes.Then, from time t shown in Figure 8
25To time t
26Between, acceleration (negative acceleration) is certain, and the decrease speed v straight line of plumb joint 50 reduces.Then, from time t shown in Figure 8
26To time t
27Between, acceleration become on the occasion of, the slip of the decrease speed of plumb joint 50 diminishes gradually, at time t shown in Figure 8
27Become for the certain small decrease speed V that joins with semiconductor chip 90 surfaces
0Control part so that plumb joint 50 descend lentamente with certain small decrease speed V0.
If at time t shown in Figure 8
1, the front end of soldering appliance 11 and semiconductor chip 90 surfaces join, and then as shown in Figure 4, pushing soldering appliance 11 and axle 12 rise, bar 40 wraparound rotating shaft 40c revolution, dead spring 58.And if further depress pressure welding joint 50, then because of the reaction force of spring 58, the front end of soldering appliance 11 is because of racking F and semiconductor chip 90 surperficial crimping.As shown in Figure 8, the racking F time t that joins from soldering appliance 11 front ends and semiconductor chip 90 surfaces
1, along with plumb joint 50 descends, increase gradually.
As above illustrated between plumb joint 50 decrement phases, its decrease speed changes like that, and at this moment, plumb joint 50 has up direction or the down acceleration of direction.For the axle 12 that at this moment is installed in plumb joint 50, soldering appliance 11, bar 40, balance weight 48, because of the acceleration that applies, effect has up direction or the down inertia force of direction.Such as the time t from Fig. 8
20To time t
21Like that, during the decrease speed v of plumb joint 50 increased, plumb joint 50 had acceleration down.So, phase butt joint 50 can move like that towards the Z direction, to each arm 52 that is installed in plumb joint 50 by each dull and stereotyped link rod 20,30,53 axle 12, end block 13 and the soldering appliance 11 that is installed in axle 12 front ends, apply acceleration alpha, its, opposite direction identical with the acceleration magnitude that is applied to plumb joint 50 is because this acceleration alpha, as shown in Figure 3, to the plumb joint 50 that is fixed on slide block 61, apply inertia force G1 (in Fig. 3, representing with hollow arrow 82) upwards.
At this, if acceleration identical with the acceleration magnitude that is applied to plumb joint 50, opposite direction is made as α, axle 12, end block 13 and the total quality that is installed in the soldering appliance 11 of axle 12 front ends are made as m
1, G then
1=m
1* α.And, because of this inertia force G
1, the leading section 41 of the bar 40 that axle 12 is connected by web 49 applies wraparound rotating shaft 40c towards clockwise torque M
1At this, if the distance at the center of the gyroaxis 40c of bar 40 and axle 12 is made as torque arm L
1, M then
1=G
1* L
1Again, as shown in Figure 3, if the quality of balance weight 48 is made as m
2, G then
2=m
2* α, be installed in bar 40 rearward end balance weight 48 also butt joint 50 apply upwards inertia force G
2(in Fig. 3, representing with hollow arrow 84).And, because of this inertia force G
2, the rearward end 43 to bar 40 that balance weight 48 is installed applies wraparound rotating shaft 40c towards anti-clockwise torque M
2At this, if the distance at the center of the gyroaxis 40c of bar 40 and balance weight 48 is made as torque arm L
2, M then
2=G
2* L
2
Be applied to the acceleration of axle 12, end block 13 and soldering appliance 11, with the acceleration that is applied to balance weight 48, all be acceleration alpha identical with the acceleration magnitude that is applied to plumb joint 50, opposite direction, therefore, at the total quality m of axle 12, end block 13 and soldering appliance 11
1Quality m with balance weight 48
2Equate respectively each torque arm L
1, L
2Equate respectively occasion, and the torque of the wraparound rotating shaft 40c of bar 40 is in circumferential balance occasion, each torque M
1, M
2Become opposite direction, equal and opposite in direction.Again, the torque of the wraparound rotating shaft 40c of bar 40 becomes uneven occasion, and by adjusting the weight of balance weight 48, this imbalance so that solution disappears can be so that each torque M
1, M
2Become opposite direction, equal and opposite in direction.
As mentioned above, acceleration alpha, opposite direction identical with the acceleration magnitude that is applied to plumb joint 50, each torque M
1, M
2In direct ratio with acceleration alpha, therefore, as from time t shown in Figure 8
20To time t
21Like that, acceleration alpha increases occasion, the torque M that represents with chain-dotted line at Fig. 8
1Also increase respectively with this, as from time t
21To t
22Like that, acceleration alpha is certain occasion, torque M
1For necessarily, as from time t
22To t
23Like that, acceleration alpha reduces occasion, torque M
1Reduce.Again, as from time t
23To time t
24Like that, speed does not change, and acceleration alpha is that null field closes torque M
1Become zero.
As from time t shown in Figure 8
24To t
25Like that, the decrease speed of plumb joint 50 is from certain speed V
1Reduce occasion, therefore acceleration alpha, becomes negative value, torque M from zero minimizing
1Also from time t
24Zero reduce, become negative value.Then, as from time t
25To time t
26Like that, acceleration alpha is certain occasion, torque M
1Necessarily, as from time t
26To t
27Like that, if the minimizing degree of the decrease speed of plumb joint 50 reduces, then acceleration alpha increases, torque M
1Increase to zero from negative value.Then, as from time t
27To time t
28Like that, speed does not change, and acceleration alpha is that null field closes torque M
1Be zero.The above has illustrated torque M
1Variation, shown in Fig. 8 dotted line like that, torque M
2With torque M
1Therefore identical, the opposite direction of size, in Fig. 8, becomes the transverse axis of Relative Zero, with torque M
1Change symmetrically up and down.
Like this, because acceleration magnitude, the direction that is applied to plumb joint 50 is different, each torque M
1, M
2Change, as mentioned above, in this example, by adjusting the weight of balance weight 48, each torque M
1, M
2Become opposite direction, equal and opposite in direction, therefore, in each time shown in Figure 8, each torque M
1, M
2Average out.Thus, even axle 12, balance weight 48 etc. consist of the spring-mass vibrational systems with spring 58, axle 12 up-down vibration in the time of also suppressing plumb joint 50 and descend.
If at time t shown in Figure 8
1, the front end of soldering appliance 11 and semiconductor chip 90 surfaces join, and then as mentioned above, spring 58 compressions are such as Fig. 8, time t shown in Figure 9
1Later on like that, the directly proportional racking F of the amount of sinking to Δ Z with plumb joint 50 is applied to semiconductor chip 90 surfaces.So, each torque M of the wraparound rotating shaft 40c of bar 40
1, M
2Balance collapse, as shown in Figure 9, the spring-mass vibrational system that reason axle 12, balance weight 48 etc. and spring 58 consist of, axle 12 vibrates towards above-below direction.Then, such shown in Fig. 9 solid line, at time t
2, the racking of semiconductor chip 90 is become maximum racking F
1, after this, at time t
3, become minimum racking F
2, its vibration decays along with the time process, at time t shown in Figure 9
4, become the roughly racking F of regulation
0, become certain.Then, from time t
4To t
5During this time, semiconductor chip 90 is applied fixed racking F
0, picking up semiconductor chip 90 is if plumb joint 50 rises, then at Fig. 9 time t
6, the racking of semiconductor chip 90 is become zero.
In this example, by balance weight 48, so that plumb joint 50 each torque M when descending
1, M
2Average out, therefore, compare with balance weight 48 occasions that do not arrange shown in Fig. 9 with dashed lines, after the front end of soldering appliance 11 and semiconductor chip 90 surfaces join, can be so that be applied to the maximum racking F of semiconductor chip 90
1With minimum racking F
2Difference than the maximum racking F that balance weight 48 occasions are not set
1With minimum racking F
2Difference little, and maximum racking F
1Size is than maximum racking F
11Little, minimum racking F
2Be made as more than zero.Therefore, as shown in Figure 9, even so that the set point F of racking
0Than the set point F that balance weight 48 occasions are not set
10Little, soldering appliance 11 can not float from semiconductor chip 90 yet, can not apply superfluous racking so that semiconductor chip 90 breakages to semiconductor chip 90.Thus, can with less racking as set point, can not damage thin or crisp semiconductor chip 90 ground and pick up suitably.
Again, in this example, by two dull and stereotyped link rods 20,30 supportings, by cross leaf spring 45 cramp bar 40 with freely rotating, do not have the such slipper of conventional art, therefore, also not can because of slipper tangle etc. cause at Fig. 9 time t
13The racking peak value that occurs can be stablized and applies little racking.Have, this example energy is so that the weight of axle 12, soldering appliance 11, end block 13 etc. again, therefore, and the time (t of picking up semiconductor chip 90 necessity of the die-bonding device of the conventional art that Fig. 9 can be dotted
17-t
1), shorten to time (t
6-t
1), can shorten pick-up time of semiconductor chip 90.
As mentioned above, this example can not make thin or crisp semiconductor chip damagedly pick up suitably with simple structure in die-bonding device.
Action when the above has illustrated by die-bonding device 100 picking up semiconductor chip 90 of this example, action when join to semiconductor chip 90 on the substrate or leadframe etc. gone up is also identical, can correctly control the little pushing force that is applied to semiconductor chip 90, therefore, can not damage the semiconductor chip thin, that intensity is low or crisp 90, can be welded to suitably on the substrate or leadframe etc. on.Again, too, can not damage semiconductor chip 90 when further being welded on semiconductor chip on the semiconductor chip again, can weld suitably.
The above is with reference to the accompanying drawings of example of the present invention, but the present invention is not limited to above-mentioned example.Can do all changes in the technology of the present invention thought range, they all belong to protection scope of the present invention.
Claims (6)
1. die-bonding device is characterized in that:
Described die-bonding device comprises:
Axle is installed the soldering appliance that picking up semiconductor chip welds at front end;
Plumb joint is installed above-mentioned axle by the dull and stereotyped link rod of a plurality of configured in parallel, along the bearing of trend traveling priority of above-mentioned axle;
Bar is installed in above-mentioned plumb joint with freely rotating, and an end is connected with above-mentioned axle, at the other end balance weight is installed; And
Spring is installed between the other end of above-mentioned plumb joint and above-mentioned bar, invests the racking that above-mentioned soldering appliance is crimped on above-mentioned semiconductor chip;
Above-mentioned balance weight has so that the weight of the torque balance of the wraparound rotating shaft of above-mentioned bar.
2. die-bonding device as claimed in claim 1 is characterized in that:
Above-mentioned bar is by so that two cross crossing cross leaf springs of leaf spring are installed in plumb joint with freely rotating, and the gyroaxis of above-mentioned bar is the axle of the line that intersects along above-mentioned two leaf springs.
3. die-bonding device as claimed in claim 1 or 2 is characterized in that:
Above-mentioned each dull and stereotyped link rod comprises annular plate and cab apron, described annular plate extends along the face that intersects with above-mentioned axle bearing of trend, be installed in above-mentioned plumb joint, described cab apron is configured in and above-mentioned annular plate the same face, cross over the inboard hollow space that is positioned at of above-mentioned annular plate, above-mentioned axle is installed in above-mentioned cab apron.
4. die-bonding device as claimed in claim 3 is characterized in that:
The above-mentioned annular plate of above-mentioned each dull and stereotyped link rod is four square ring shapes roughly, is fixed on above-mentioned plumb joint at each fixing points of the central authorities on two limits of subtend.
5. die-bonding device as claimed in claim 3 is characterized in that:
Above-mentioned cab apron extends along the direction of intersecting with the direction of above-mentioned each fixing point that is connected above-mentioned annular plate, and from central authorities that above-mentioned axle connects towards the two ends that are connected with above-mentioned annular plate, width diminishes.
6. die-bonding device as claimed in claim 3 is characterized in that:
Above-mentioned annular plate is from above-mentioned each fixing point towards the two ends that are connected with above-mentioned cab apron, and width diminishes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-162715 | 2011-07-26 | ||
| JP2011162715A JP5705052B2 (en) | 2011-07-26 | 2011-07-26 | Die bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102903647A true CN102903647A (en) | 2013-01-30 |
| CN102903647B CN102903647B (en) | 2014-12-24 |
Family
ID=47575829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210261799.0A Active CN102903647B (en) | 2011-07-26 | 2012-07-26 | Chip soldering apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5705052B2 (en) |
| KR (1) | KR101380816B1 (en) |
| CN (1) | CN102903647B (en) |
| TW (1) | TWI451515B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611070A (en) * | 2016-07-12 | 2018-01-19 | 株式会社迪思科 | Transport unit |
| CN108447803A (en) * | 2018-03-26 | 2018-08-24 | 童龙范 | A kind of novel slice type semiconductor ultra-thin packaging system |
| CN109817532A (en) * | 2019-03-28 | 2019-05-28 | 惠州市西文思实业有限公司 | A kind of process equipment for chip |
| CN113977028A (en) * | 2021-10-28 | 2022-01-28 | 恩纳基智能科技无锡有限公司 | Eutectic welding equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7128697B2 (en) * | 2018-09-19 | 2022-08-31 | ファスフォードテクノロジ株式会社 | Die bonding apparatus and semiconductor device manufacturing method |
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| JP2001127097A (en) * | 1999-10-29 | 2001-05-11 | Nec Corp | Bonding device and its control method |
| CN1513202A (en) * | 2001-06-08 | 2004-07-14 | 芝浦机械电子装置股份有限公司 | Electronic component crimping device and method thereof |
| CN1794439A (en) * | 2003-12-22 | 2006-06-28 | 优利讯国际贸易有限责任公司 | Method for calibrating a bondhead |
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| JPH01208837A (en) * | 1988-02-17 | 1989-08-22 | Hitachi Ltd | Arm device and bonding device using it |
| JP2635889B2 (en) * | 1992-06-24 | 1997-07-30 | 株式会社東芝 | Die bonding equipment |
| JP3206486B2 (en) * | 1997-04-08 | 2001-09-10 | 松下電器産業株式会社 | Bonding head in chip bonding equipment |
| JPH10308405A (en) * | 1997-05-08 | 1998-11-17 | Mitsubishi Electric Corp | Device and method for bonding, and manufacture of semiconductor device |
| JP2000269240A (en) * | 1999-03-16 | 2000-09-29 | Hitachi Cable Ltd | Optical module manufacturing method and optical element mounting device |
| KR20030046306A (en) * | 2001-12-05 | 2003-06-12 | 에섹 트레이딩 에스에이 | Apparatus for mounting semiconductor chips |
| WO2004008499A1 (en) * | 2002-07-17 | 2004-01-22 | Matsushita Electric Industrial Co. Ltd. | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
| US7306695B2 (en) * | 2003-04-10 | 2007-12-11 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for picking up semiconductor chip |
| JP2005340411A (en) * | 2004-05-26 | 2005-12-08 | Nidec Tosok Corp | Bonding device |
| JP2006324533A (en) | 2005-05-20 | 2006-11-30 | Nidec Tosok Corp | Bonding load control unit |
| JP4397349B2 (en) * | 2005-05-20 | 2010-01-13 | 株式会社新川 | Chip bonding equipment |
| KR100851567B1 (en) | 2007-04-03 | 2008-08-12 | 주식회사 탑 엔지니어링 | Chip Transfer Heads of Bonding Equipment |
-
2011
- 2011-07-26 JP JP2011162715A patent/JP5705052B2/en not_active Expired - Fee Related
-
2012
- 2012-06-12 TW TW101120965A patent/TWI451515B/en active
- 2012-07-05 KR KR1020120073274A patent/KR101380816B1/en not_active Expired - Fee Related
- 2012-07-26 CN CN201210261799.0A patent/CN102903647B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001127097A (en) * | 1999-10-29 | 2001-05-11 | Nec Corp | Bonding device and its control method |
| CN1513202A (en) * | 2001-06-08 | 2004-07-14 | 芝浦机械电子装置股份有限公司 | Electronic component crimping device and method thereof |
| CN1794439A (en) * | 2003-12-22 | 2006-06-28 | 优利讯国际贸易有限责任公司 | Method for calibrating a bondhead |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611070A (en) * | 2016-07-12 | 2018-01-19 | 株式会社迪思科 | Transport unit |
| CN107611070B (en) * | 2016-07-12 | 2023-03-28 | 株式会社迪思科 | Conveying unit |
| CN108447803A (en) * | 2018-03-26 | 2018-08-24 | 童龙范 | A kind of novel slice type semiconductor ultra-thin packaging system |
| CN109817532A (en) * | 2019-03-28 | 2019-05-28 | 惠州市西文思实业有限公司 | A kind of process equipment for chip |
| CN113977028A (en) * | 2021-10-28 | 2022-01-28 | 恩纳基智能科技无锡有限公司 | Eutectic welding equipment |
| CN113977028B (en) * | 2021-10-28 | 2023-04-25 | 恩纳基智能科技无锡有限公司 | Eutectic welding equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102903647B (en) | 2014-12-24 |
| KR101380816B1 (en) | 2014-04-04 |
| TWI451515B (en) | 2014-09-01 |
| KR20130012917A (en) | 2013-02-05 |
| JP2013026585A (en) | 2013-02-04 |
| TW201306154A (en) | 2013-02-01 |
| JP5705052B2 (en) | 2015-04-22 |
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