CN102892249B - Pcb board single-point grounding processing method - Google Patents

Abstract

The invention provides a single-point grounding processing method for a PCB board, which is used in circuit design, comprising the following steps: providing a PCB board, the PCB board includes at least one signal layer and a main ground plane layer; designing a PCB through-hole package , the PCB via hole is packaged as a metallized via hole, and the metallized via hole penetrates the signal layer and the main ground plane layer; the metallized via hole is set to conduct with the ground plane of the main ground plane layer, And a wiring-forbidden area is set on the signal layer to isolate the metallized via hole. The present invention isolates the metallized via hole from the signal area of the signal layer by prohibiting the wiring area, and the design efficiency is high; and the present invention realizes the single-point grounding design by setting a PCB via-hole package, and only needs to call the PCB for single-point grounding Through-hole packaging does not require layout engineers to artificially add vias and isolate the vias from the signal areas of each signal layer, effectively reducing design risks and improving design efficiency.

Description

Single-point grounding method of PCB board

technical field

The invention relates to hardware electronics, in particular to a single-point grounding method for a PCB board.

Background technique

With the development of thin, light and miniaturized electronic products, digital-analog hybrid and high-low frequency hybrid designs have become very common in electronic hardware circuit design. It is usually necessary to use single-point grounding for analog circuits and low-frequency circuits. Single-point grounding is to connect the ground wires of each circuit module to the main ground plane at a certain point.

When designing a PCB board (Printed Circuit Board, printed circuit board), for the single-point grounding circuit in the hardware circuit design, the layout (layout) engineer needs to deal with it specially. Cut off the ground near the analog ground on other wiring layers, and drill holes directly to the main ground plane layer, so that the single-point ground circuit is not connected to other surrounding ground networks, and only the connectivity with the main ground plane layer is retained to achieve single-point grounding deal with.

However, this artificial approach will inevitably bring design risks. When the layout engineer forgets to increase the routing keepout area (RoutingKeepoutArea) or ignores the single-point grounding requirement, there will be no single-point grounding circuit in the circuit design. Grounded, the signal interferes on the ground loop, causing signal integrity issues.

Therefore, there is an urgent need for a new single-point grounding method that can solve the above problems.

Contents of the invention

The object of the present invention is to provide a PCB single-point grounding processing method, which can reduce design risk and improve design efficiency.

In order to achieve the above object, the present invention provides a single-point grounding processing method for a PCB board, which is used for single-point grounding processing in circuit design, comprising the following steps: providing a PCB board, the PCB board includes at least one signal layer and a The main ground plane layer; design a PCB via hole package, the PCB via hole package is a metallized via hole, and the metallized via hole runs through the signal layer and the main ground plane layer; the metallized via hole and the main ground plane layer are set. The ground plane of the main ground plane layer is turned on, and a no-wiring area for isolating the metallized via holes is set on the signal layer.

Compared with the prior art, the present invention quickly isolates the metallized via hole from the signal area by setting a forbidden wiring area on the signal layer, and the design efficiency is high; on the other hand, the present invention directly designs a PCB via hole package , the single-point grounding design is realized through the PCB through-hole package. When necessary, only the PCB through-hole package is called, and the layout engineer does not need to artificially increase the via and isolate the via from the signal area of each signal layer, effectively reducing the design time. risk and improve design efficiency.

Preferably, the metallized vias are buried vias (BuriedVia), and the PCB board also includes an upper component surface and a lower component surface located on the upper and lower surfaces of the PCB board, and the upper component surface and the lower component surface cover all metallized vias.

Preferably, the metallized via hole is a through hole (ThroughVia), and the PCB board also includes an upper element surface and a lower element surface located on the lower surface of the PCB board, and the metallized via hole runs through the upper element surface and the lower element surface, and the upper element surface and the lower element surface are provided with forbidden wiring areas for isolating the metallized via holes.

Preferably, the PCB board is an N-layer board, and the N is an integer greater than or equal to 4. That is, the PCB board can be a 4-layer board, a 6-layer board, an 8-layer board or the like.

Description of drawings

FIG. 1 is a flow chart of the method for processing single-point grounding of a PCB board according to the present invention.

Fig. 2 is a structural diagram of the PCB through-hole package in the first embodiment of the present invention.

Fig. 3 is a structural diagram of the PCB through-hole package in the second embodiment of the present invention.

detailed description

In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

Referring to Fig. 1, the present invention provides a single-point grounding processing method 100 for a PCB board, which is used for single-point grounding processing in circuit design, comprising the following steps: (11) providing a PCB board, the PCB board includes at least one signal layer and a main ground plane layer; design a PCB via package, the PCB via package is a metallized via hole, and the metallized via hole runs through the signal layer and the main ground plane layer; (12) set the The metallized via hole is connected to the ground plane of the main ground plane layer, and a no-wiring area is provided on the signal layer to isolate the metallized via hole.

Referring to FIG. 2 , it is a structural diagram of the PCB through-hole package in the first embodiment of the present invention, and its PCB board 20 is an eight-layer board, including five signal layers S1, S2, S3, S4, and S5, and a main ground plane Layer MG, an upper component surface TS, a lower component surface BS, the main ground plane layer MG is located on the third layer, the PCB through-hole package 200 includes a metallized via 21, and the metallized via 21 is a buried hole (BuriedVia), the metallized via hole 21 runs through the five signal layers S1, S2, S3, S4, S5, and the main ground plane layer MG, and the upper element surface TS and the lower element surface BS cover the metallized via hole 21, And the metallized via hole 21 is connected to the ground plane 22 of the main ground plane layer MG, and the signal layers S1, S2, S3, S4, and S5 are respectively provided with forbidden wiring areas 23 to isolate the metallized via hole. The holes 21 are connected to the signal areas of the signal layers S1 , S2 , S3 , S4 , S5 .

Of course, the PCB board 20 can also be other multilayer boards, such as 4-layer boards, 6-layer boards, etc., and the main ground plane layer MG can be set as the multilayer board except the upper component surface TS and the lower component surface BS. Any inner layer, not limited to the third layer.

Referring to FIG. 3 , it is a structural diagram of the PCB through-hole package in the second embodiment of the present invention, which is different from the first embodiment: the metallized via 21 ′ of the PCB through-hole package 200 ′ is a through hole (ThroughVia), The metallized via hole 21' runs through the signal layers S1, S2, S3, S4, S5, the main ground plane layer MG, the upper element surface TS and the lower element surface BS, and the metallized via hole 21' is connected to the main ground plane The ground plane 22 of the layer MG is turned on, and the signal layers S1, S2, S3, S4, S5 are respectively provided with forbidden wiring regions 23 to isolate the metallized via hole 21' from the signal layers S1, S2, S3, In the signal areas of S4 and S5, the upper element surface TS and the lower element surface BS are respectively provided with a wiring prohibition area 23 to isolate the metallized via hole 21' from the upper element surface TS and the lower element surface BS.

To sum up, the present invention quickly isolates the metallized vias 21, 21' from other layers except the ground plane 22 by prohibiting the wiring area 23 to improve design efficiency; on the other hand, the present invention directly designs a PCB via Hole package 200, 200', through the PCB through-hole package 200, 200' to achieve single-point grounding design, only need to call the PCB through-hole package 200, 200' when using, no need for layout engineers to artificially increase via holes and isolate The via hole and the signal area and component surface of each signal layer effectively reduce the design risk and improve the design efficiency.

What is disclosed above is only a preferred embodiment of the present invention, and of course it cannot limit the scope of rights of the present invention. Therefore, equivalent changes made according to the patent scope of the present invention still fall within the scope of the present invention.

Claims (4)

1. A PCB board single-point grounding processing method is used in circuit design, it is characterized in that: comprise the following steps: A PCB board is provided, and the PCB board includes at least one signal layer and a main ground plane layer; Design a PCB via hole package, the PCB via hole package includes a metallized via hole, the metallized via hole runs through the signal layer and the main ground plane layer, and the metallized via hole is connected to the ground of the main ground plane layer Planar conduction, the signal layer is provided with a forbidden wiring area to isolate the metallized via hole and the signal area of the signal layer; When a single-point grounding design is required, this PCB through-hole package is called. 2. The PCB single-point grounding method according to claim 1, wherein the metallized via hole is a buried hole, and the PCB board also includes an upper component surface and a lower surface located on the upper and lower surfaces of the PCB board. On the component surface, the upper component surface and the lower component surface cover the metallized via hole. 3. The PCB single-point grounding method according to claim 1, wherein the metallized via is a through hole, and the PCB also includes an upper component surface and a lower surface positioned on the upper and lower surfaces of the PCB. On the component surface, the metallized via holes run through the upper component surface and the lower component surface, and the upper component surface and the lower component surface are provided with forbidden wiring areas for isolating the metallized via holes. 4. The method for processing single-point grounding of a PCB board according to claim 1, wherein the PCB board is an N-layer board, and the N is an integer greater than or equal to 4.