CN102883584A - High-efficiency heat dissipation device - Google Patents
High-efficiency heat dissipation device Download PDFInfo
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- CN102883584A CN102883584A CN2012102175891A CN201210217589A CN102883584A CN 102883584 A CN102883584 A CN 102883584A CN 2012102175891 A CN2012102175891 A CN 2012102175891A CN 201210217589 A CN201210217589 A CN 201210217589A CN 102883584 A CN102883584 A CN 102883584A
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Abstract
The invention relates to a high-efficiency heat dissipation device. The device comprises a heat pipe dissipation main body and a spatial stereo heat dissipation unit, wherein the heat pipe dissipation body is provided with a heat cycle inner chamber; a heat dissipation liquid is filled in the heat cycle inner chamber in a sealed manner; the spatial stereo heat dissipation unit is provided with a spatial stereo heat dissipation inner chamber and fixedly connected to the heat pipe dissipation main body; the spatial stereo heat dissipation inner chamber of the spatial stereo heat dissipation unit is communicated with the heat cycle inner chamber of the heat pipe dissipation main body; the spatial stereo heat dissipation unit is located in stereo space outside the heat pipe dissipation body; and independent stereo heat dissipation space of the heat pipe dissipation body is additionally opened up by the spatial stereo heat dissipation unit.
Description
Technical field
The present invention relates to a kind of heat abstractor, refer to especially a kind of heat pipe heat radiation body and space multistory heat-sink unit of comprising, the intracavity inter-connection of the inner chamber of space multistory heat-sink unit and heat pipe heat radiation body is that the heat pipe heat radiation body additionally hews out the independently heat abstractor of three-dimensional heat-dissipating space by the space multistory heat-sink unit.
Background technology
As everyone knows, along with the lifting of social production force level more and more can promote people's quality of the life now, the very general life that has entered into people of the electronic apparatus product that promotes people's Working Life efficient, present large scale integrated circuit, digital camera, mobile phone, notebook computer, the electronic products such as LED light fixture are constantly to high-density packages and multifunction future development, heat dissipation problem just becomes very thorny problem like this, if the large scale integrated circuit electronic building brick has not been properly settled the processing of heat dissipation problem, not only can't bring into play the performance of its application, in the time of serious even the phenomenon that can cause the heat of machine intimate to explode to damage electronic component.
For the generation that overcomes above-mentioned situation especially all can arrange some radiators now to solve the problem of heat radiation on integrated circuit on various electronic products, the most widely radiator of using now is that the mode that metal is processed into fin is carried out, in concrete the use, fin is arranged on electronic product or the integrated circuit to reach the effect of heat radiation, but the radiating efficiency of this radiating mode low heat emission poor effect relatively.
Along with a kind of radiator that utilizes heat pipe principle to make has appearred again in the progress of technical merit, hot pipe technique is the mode of utilizing the heat transfer element of a kind of being called " heat pipe " to dispel the heat, it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, be delivered to rapidly outside the thermal source through the heat of heat pipe with thermal objects, its capacity of heat transmission surpasses the capacity of heat transmission of any known metal.General heat pipe is comprised of shell, liquid-sucking core and end cap now.Inside heat pipe is to be pumped into negative pressure state, is filled with suitable liquid, and this boiling point of liquid is low, easily volatilization.Tube wall has liquid-sucking core, and it is made of the capillary porous material.One section of heat pipe is evaporation ends, other one section is condensation end, when heat pipe one end is heated, liquid in the capillary evaporates rapidly, and steam flows to an other end under small pressure differential, and releases heat, regelation becomes liquid, liquid flows back to evaporation section along porous material by the effect of capillary force again, and so circulation is more than, and heat reaches an other end by heat pipe one end.This circulation is carried out fast, and heat can be come by continuously conduction.Heat pipe is a kind of heat transfer element with high heat conductivility, and it comes transferring heat by the evaporation and condensation of the liquid in the Totally enclosed vacuum pipe, and it utilizes the fluid principles such as capillarity, plays the effect of similar freezer compressor refrigeration.Drink the series of advantages such as invertibity remotely transferring, thermostatic characteristics (controlled heat pipe), thermal diode and thermal switch performance but have very high thermal conductivity, good isothermal, density of heat flow rate changeability, direction of heat flow, and have heat transfer efficiency height, compact conformation, fluid by the heat exchanger that heat pipe forms and hinder the advantages such as damage is little.
Because the defective of existing heat pipe structure design aspect its heat transmission and radiating effect in concrete the application often can't reach best, and this is the major defect for conventional art although hot pipe technique has above-mentioned plurality of advantages.
Summary of the invention
The invention provides a kind of efficient radiating apparatus, it mainly comprises heat pipe heat radiation body and space multistory heat-sink unit, be that the heat pipe heat radiation body additionally hews out independently three-dimensional heat-dissipating space by the space multistory heat-sink unit, can increase area of dissipation, the heat radiation volume of efficient radiating apparatus of the present invention by the space multistory heat-sink unit, improving radiating effect greatly, and this is to be main purpose of the present invention.
The technical solution adopted in the present invention is: a kind of efficient radiating apparatus; comprise heat radiator body; this heat radiator body is made by the high radiation plastic material of high heat conduction; the high radiation plastic material of this high heat conduction can be converted to heat electromagnetic form and energy emission is distributed; the high radiation plastic material of this high heat conduction is mixed by plastics and infrared radiant material particle; the percentage by weight of these plastics and this infrared radiant material particle is between 1000:2 to 1000:10; this infrared radiant material is evengranular to be distributed in these plastics; the thickness of this heat radiator body is between 2 millimeters to 10 millimeters; the object that need to be dispelled the heat directly is connected on this heat radiator body; the heat that object produced that need to be dispelled the heat conducts in this heat radiator body, by this heat radiator body heat mainly is converted to electromagnetic form radiation and distributes.
This infrared radiant material particle is that in the powder such as carborundum, cobalt oxide, zirconia, magnesium oxide, zinc oxide, nickel oxide, carbon dust one or several mix, and the diameter of this infrared radiant material particle is less than 40 microns.
Be provided with some projections to overhanging on this heat radiator body, increase the heat loss through radiation area of this heat radiator body by this projection, this projection and this heat radiator body are connected to form an integral body, this protruding material consists of identical with this heat radiator body, this projection is hollow body, and sealing is filled with radiator liquid in this hollow body, and this radiator liquid is sealed in the annular seal space, around forming, the object that need to be dispelled the heat directly is connected on this bottom by the inwall of this hollow body and bottom in the sealing chamber.
Be provided with some projections to overhanging on this heat radiator body, increase the heat loss through radiation area of this heat radiator body by this projection, this projection and this heat radiator body are connected to form an integral body, this protruding material consists of identical with this heat radiator body, this projection is hollow body, convex is provided with some fins from the outer surface of this hollow body, being combined between 2 millimeters to 10 millimeters of the thickness of the tube wall of this hollow body and the transverse gage of this fin, extend upwardly at bottom and to be provided with some thermal columns, each this thermal column corresponding inserted in the inner chamber of this hollow body, the inwall close contact of this thermal column and this hollow body.
This bottom comprises temperature-uniforming plate loam cake and temperature-uniforming plate lower cover, this temperature-uniforming plate loam cake seal cover is located under this temperature-uniforming plate and covers, between this temperature-uniforming plate loam cake and this temperature-uniforming plate lower cover, form a temperature-uniforming plate inner chamber, sealing is filled with radiator liquid in this temperature-uniforming plate inner chamber, some these thermal columns are arranged on the end face of this temperature-uniforming plate loam cake, and the object that need to be dispelled the heat directly is connected on the bottom surface of this temperature-uniforming plate lower cover.
A kind of efficient radiating apparatus comprises heat pipe heat radiation body and space multistory heat-sink unit, and wherein, this heat pipe heat radiation body has the thermal cycle inner chamber, and sealing is filled with radiator liquid in this thermal cycle inner chamber.
This space multistory heat-sink unit has space multistory heat radiation inner chamber, this space multistory heat-sink unit is fixedly connected on this heat pipe heat radiation body, and this space multistory heat radiation inner chamber of this space multistory heat-sink unit and this thermal cycle intracavity inter-connection of this heat pipe heat radiation body, this space multistory heat-sink unit is arranged in the solid space of this heat pipe heat radiation body exterior, additionally hews out independently three-dimensional heat-dissipating space by this space multistory heat-sink unit for this heat pipe heat radiation body.
The object that need to be dispelled the heat directly is connected on this heat pipe heat radiation body, the heat that object produced that need to be dispelled the heat at first is delivered on this heat pipe heat radiation body, the mode of then transmitting by the evaporation of this radiator liquid in this thermal cycle inner chamber, the reciprocal heat of condensation cycle with this dissipation of heat in space outerpace.
In the process of evaporate in this radiator liquid, the reciprocal heat of condensation cycle transmitting, at first this radiator liquid is subjected to thermal evaporation in this thermal cycle inner chamber, then vaporized this radiator liquid rises gradually and enters into this space multistory heat radiation inner chamber, be back in this thermal cycle inner chamber after vaporized this radiator liquid is met cold condensation liquefaction in this space multistory heat radiation inner chamber, so move in circles and finish the process of integral heat sink.
This heat pipe heat radiation body comprises end box and loam cake, and this loam cake lid is located on this end box, centers on this thermal cycle inner chamber of formation by this end box and this loam cake.
This space multistory heat-sink unit comprises some space heat elimination bodies, some these space heat elimination bodies arrangements are connected on being somebody's turn to do of this heat pipe heat radiation body and cover, this space heat elimination body extends to this heat pipe heat radiation body top from this loam cake, each this space heat elimination body has inner chamber, each this inner chamber and this thermal cycle intracavity inter-connection, some these combination of lumens form this space multistory heat radiation inner chamber, and this object that need to be dispelled the heat is connected on the lower surface of this end box of this heat pipe heat radiation body.
This space heat elimination body is hollow fin structure.This heat pipe heat radiation body and this space multistory heat-sink unit are made by metal material.
This heat pipe heat radiation body and this space multistory heat-sink unit are made by the highly heat-conductive material with electromagnetic infrared wave heat dissipation characteristics; highly heat-conductive material with electromagnetic infrared wave heat dissipation characteristics is mixed by metallic aluminium and infrared radiant material particle; the percentage by weight of metallic aluminium and infrared radiant material particle is between the 1000:2 to 1000:10; this infrared radiant material particle is carborundum; cobalt oxide; zirconia; magnesium oxide; zinc oxide; nickel oxide; in the powder such as carbon dust one or several mix, and the diameter of this infrared radiant material particle is less than 40 microns.
Inner surface at this thermal cycle inner chamber and this space multistory heat radiation inner chamber is attached with capillary layer respectively, and this capillary layer is formed by metal powder sintered, forms the diameter of particle of this metal dust of this capillary layer less than 40 microns.
This capillary layer is attached on the inner surface of this thermal cycle inner chamber and this space multistory heat radiation inner chamber, when this radiator liquid is in this capillary layer top or flows through this capillary layer, by the metal heat conduction characteristic of this metal powder granulates the heat of each this radiator liquid of position is carried out simultaneously by the capillary structure of this capillary layer self that heat is conducted, thermal balance.
On the outer surface of this heat pipe heat radiation body and this space multistory heat-sink unit, also be attached with the high radiation plastic layer of high heat conduction, the high radiation plastic layer of this high heat conduction can be converted to heat electromagnetic form and energy emission is distributed, the high radiation plastic layer of this high heat conduction is made by ceramic powders or plastics powder, adopt spraying, the mode of plastic-blasting or sintering is attached to the high radiation plastic layer of this high heat conduction on the outer surface of this heat pipe heat radiation body and this space multistory heat-sink unit, the high radiation plastic layer of this high heat conduction is outer shelly at the outer surface of this heat pipe heat radiation body and this space multistory heat-sink unit, when this space multistory heat-sink unit comprises some this space heat elimination bodies, the high radiation plastic layer of this high heat conduction is the fin state on the surface of this space heat elimination body, and the thickness of the high radiation plastic layer of this high heat conduction is less than or equal to 5 millimeters.
The some heat radiation lamellas of socket on some these space heat elimination bodies of this space multistory heat-sink unit, the highly heat-conductive material fin that some these heat radiation lamellas comprise metal fin and have the electromagnetic infrared wave heat dissipation characteristics, this metal fin and this have the highly heat-conductive material fin of electromagnetic infrared wave heat dissipation characteristics, are disposed on from top to bottom on some these space heat elimination bodies.
This object that need to be dispelled the heat is the LED light-emitting device, this LED light-emitting device comprises LED lamp and LED shell, this LED lamp directly is attached on the lower surface of this end box of this heat pipe heat radiation body, this LED shell is located therein with this LED lampshade, the optical lens cover is fixedly connected on this end box of this heat pipe heat radiation body with respect to this LED lamp, this LED lamp is arranged in this optical lens cover, this LED shell comprises the plastic support frame, gland and face glass, wherein, this plastic support frame is fixedly connected on this end box of this heat pipe heat radiation body, this plastic support frame and this end box between be provided with sealing ring, this gland lid is located on this plastic support frame, this face glass is pressed between this plastic support frame and this gland, be equipped with the glass capsulation circle around this face glass, be inserted with the plug wire nut in this LED shell side, be arranged with the nut seal circle on this plug wire nut, be provided with connecting hole in this plug wire nut, external wire is located in this connecting hole, external wire one end is connected with external circuit, and its other end is connected with this LED lamp.
Beneficial effect of the present invention is: owing to the present invention includes heat pipe heat radiation body and space multistory heat-sink unit, this heat pipe heat radiation body has the thermal cycle inner chamber, sealing is filled with radiator liquid in this thermal cycle inner chamber, this space multistory heat-sink unit has space multistory heat radiation inner chamber, this space multistory heat radiation inner chamber of this space multistory heat-sink unit and this thermal cycle intracavity inter-connection of this heat pipe heat radiation body, this space multistory heat-sink unit is arranged in the solid space of this heat pipe heat radiation body exterior, additionally hew out independently three-dimensional heat-dissipating space by this space multistory heat-sink unit for this heat pipe heat radiation body, can increase the area of dissipation of efficient radiating apparatus of the present invention by this space multistory heat-sink unit, heat radiation volume, greatly improving radiating effect.
Description of drawings
Fig. 1 is schematic perspective view of the present invention.
Fig. 2 is cross-sectional view of the present invention.
Fig. 3 is cross-sectional view of the present invention.
Fig. 4 is the upward view of loam cake of the present invention.
Fig. 5 is the vertical view of the end of the present invention box.
Fig. 6 is the structural representation of capillary layer of the present invention.
Fig. 7 is the perspective view that the present invention is equipped with the heat radiation lamella.
Fig. 8 is the structural representation of the high radiation plastic layer of high heat conduction of the present invention.
Fig. 9 is that the object that need to be dispelled the heat of the present invention is the perspective view of LED light-emitting device.
Figure 10 is the horizontal section structural representation that the object that need to be dispelled the heat of the present invention is the LED light-emitting device.
Figure 11 is the longitudinal profile structural representation that the object that need to be dispelled the heat of the present invention is the LED light-emitting device.
Figure 12 is the internal structure schematic diagram of heat radiator body of the present invention.
Figure 13 is that the present invention's projection is hollow body, and sealing is filled with the cross-sectional view of radiator liquid in the hollow body.
Figure 14 stretches the cross-sectional view that is provided with some thermal columns on the bottom of the present invention.
Figure 15 is the cross-sectional view that bottom of the present invention comprises temperature-uniforming plate loam cake and temperature-uniforming plate lower cover.
Embodiment
Shown in Fig. 1 to 7, a kind of efficient radiating apparatus, it comprises heat pipe heat radiation body 10 and space multistory heat-sink unit 20, and wherein, this heat pipe heat radiation body 10 has thermal cycle inner chamber 11, and sealing is filled with radiator liquid 12 in this thermal cycle inner chamber 11.
This radiator liquid 12 is by the filling liquid of meeting hot high volatility, such as water, ethanol etc. in implementation.
This space multistory heat-sink unit 20 has space multistory heat radiation inner chamber 30.
This space multistory heat-sink unit 20 is fixedly connected on this heat pipe heat radiation body 10, and this space multistory heat radiation inner chamber 30 of this space multistory heat-sink unit 20 is connected with this thermal cycle inner chamber 11 of this heat pipe heat radiation body 10.
This space multistory heat-sink unit 20 is arranged in the solid space of these heat pipe heat radiation body 10 outsides, that is to say by this space multistory heat-sink unit 20 additionally to hew out independently three-dimensional heat-dissipating space for this heat pipe heat radiation body 10.
Can increase area of dissipation, heat radiation volume, the greatly improving radiating effect of efficient radiating apparatus of the present invention by this space multistory heat-sink unit 20.
In implementation, the object A that need to be dispelled the heat directly is connected on this heat pipe heat radiation body 10, can not form thermal resistance thereby make between the object A that need to be dispelled the heat and this heat pipe heat radiation body 10.
The heat that the object A that need to be dispelled the heat is produced at first is delivered on this heat pipe heat radiation body 10, then by this radiator liquid 12 evaporations in this thermal cycle inner chamber 11, mode that the reciprocal heat of condensation cycle transmits with this dissipation of heat in space outerpace.
In the process of evaporate in this radiator liquid 12, the reciprocal heat of condensation cycle transmitting, at first this radiator liquid 12 is subjected to thermal evaporation in this thermal cycle inner chamber 11, then vaporized this radiator liquid 12 rises gradually and enters into this space multistory heat radiation inner chamber 30, be back in this thermal cycle inner chamber 11 after vaporized this radiator liquid 12 is met cold condensation liquefaction in this space multistory heat radiation inner chamber 30, so move in circles and finish the process of integral heat sink.
As mentioned above, thus can greatly expand the area of dissipation of this heat pipe heat radiation body 10, the radiating effect that the heat radiation volume promotes single unit system by the setting of this space multistory heat-sink unit 20.
This heat pipe heat radiation body 10 comprises end box 13 and loam cake 14, and these loam cake 14 lids are located on this end box 13, center on this thermal cycle inner chamber 11 of formation by this end box 13 and this loam cake 14.
This space multistory heat-sink unit 20 comprises some space heat elimination bodies 21, and some these space heat elimination bodies 21 are arranged and are connected on this loam cake 14 of this heat pipe heat radiation body 10, and this space heat elimination body 21 extends to these heat pipe heat radiation body 10 tops from this loam cake 14.
Each this space heat elimination body 21 has inner chamber 22, and each this inner chamber 22 is connected with this thermal cycle inner chamber 11.
Some these inner chambers 22 are combined to form this space multistory heat radiation inner chamber 30.
In implementation, this object A that need to be dispelled the heat is connected on the lower surface of this end box 13 of this heat pipe heat radiation body 10.
In implementation, this space heat elimination body 21 can be open column shape structure or hollow fin structure or other hollow body structures.
In implementation, this heat pipe heat radiation body 10 and this space multistory heat-sink unit 20 are made by the good metal material of heat dispersion, such as metallic aluminium.
This heat pipe heat radiation body 10 and this space multistory heat-sink unit 20 can also be made by the highly heat-conductive material with electromagnetic infrared wave heat dissipation characteristics.
Highly heat-conductive material with electromagnetic infrared wave heat dissipation characteristics is mixed by metallic aluminium and infrared radiant material particle.
The percentage by weight of metallic aluminium and infrared radiant material particle is between the 1000:2 to 1000:10.
The infrared radiant material particle is that in the powder such as carborundum, cobalt oxide, zirconia, magnesium oxide, zinc oxide, nickel oxide, carbon dust one or several mix.
The diameter of this infrared radiant material particle is less than 40 microns.
More efficient smooth in order to make this radiator liquid 12 carry out the process that heat transmits, in this thermal cycle inner chamber 11, be provided with capillary piece 15.
The lower end of this capillary piece 15 contacts with the bottom surface of this thermal cycle inner chamber 11, and the top of this capillary piece 15 contacts with the end face of this thermal cycle inner chamber 11.
In implementation, this capillary piece 15 can be formed by metal powder sintered, also can be formed by woven wire or cellulose or carbon nano pipe array.
In order to promote the working effect of this capillary piece 15, several these capillary pieces 15 can be set simultaneously in this thermal cycle inner chamber 11.
Upper end face at this end box 13 is concaved with holddown groove 131, and the lower end of this capillary piece 15 is arranged in this holddown groove 131, thereby reaches the effect in this thermal cycle inner chamber 11 of being arranged on that this capillary piece 15 is stable.
In order to make each the locational heat conduction in this thermal cycle inner chamber 11 and this space multistory heat radiation inner chamber 30 of this radiator liquid 12 more on average more efficient smooth.
Inner surface at this thermal cycle inner chamber 11 and this space multistory heat radiation inner chamber 30 is attached with capillary layer 16 respectively.
This capillary layer 16 is formed by metal powder sintered, such as being formed by aluminium or copper powders may sintering.
Form the diameter of particle of this metal dust of this capillary layer 16 less than 40 microns.
As shown in Figure 6, this capillary layer 16 is attached on the inner surface of this thermal cycle inner chamber 11 and this space multistory heat radiation inner chamber 30, when this radiator liquid 12 is in these capillary layer 16 tops or flow through this capillary layer 16 (as shown by arrows in FIG.), by the metal heat conduction characteristic of this metal powder granulates the heat of this radiator liquid 12 of each position is carried out simultaneously by the capillary structure of this capillary layer 16 self that heat is conducted, thermal balance, thus improving radiating effect.
When this capillary layer 16 was attached on these thermal cycle inner chamber 11 inner surfaces, this heat pipe heat radiation body 10 was similar to a soaking plate.
In implementation, this capillary layer 16 that is attached on these thermal cycle inner chamber 11 inner surfaces also can be formed by woven wire or cellulose or carbon nano pipe array.
As shown in Figure 8, at last, on the outer surface of this heat pipe heat radiation body 10 and this space multistory heat-sink unit 20, can also adhere to the high radiation plastic layer 100 of high heat conduction, the high radiation plastic layer 100 of this high heat conduction can be converted to heat electromagnetic form and energy emission is distributed, further improving radiating effect.
The high radiation plastic layer 100 of this high heat conduction is made by ceramic powders or plastics powder.
Can adopt the modes such as spraying, plastic-blasting, sintering that the high radiation plastic layer 100 of this high heat conduction is attached on the outer surface of this heat pipe heat radiation body 10 and this space multistory heat-sink unit 20 in implementation, the high radiation plastic layer 100 of this high heat conduction is outer shelly at the outer surface of this heat pipe heat radiation body 10 and this space multistory heat-sink unit 20.
When this space multistory heat-sink unit 20 comprised some this space heat elimination body 21, the high radiation plastic layer 100 of this high heat conduction was the fin state on the surface of this space heat elimination body 21, with further improving radiating effect,
The thickness of the high radiation plastic layer 100 of this high heat conduction is less than or equal to 5 millimeters.
As shown in Figure 7, in implementation, can be socketed some heat radiation lamellas 40 on some these space heat elimination bodies 21 of this space multistory heat-sink unit 20.
By these heat radiation lamella 40 further improving radiating effects.
This heat radiation lamella 40 is fixedly connected on some these space heat elimination bodies 21 simultaneously by the mode of welding.
The highly heat-conductive material fin that some these heat radiation lamellas 40 comprise metal fin and have the electromagnetic infrared wave heat dissipation characteristics.
This metal fin is traditional fin, such as aluminium radiator fin.
Have to have had to describe above the concrete making material of highly heat-conductive material fin of electromagnetic infrared wave heat dissipation characteristics and be not repeated here.
This metal fin and this have the highly heat-conductive material fin of electromagnetic infrared wave heat dissipation characteristics, are disposed on from top to bottom on some these space heat elimination bodies 21 with improving radiating effect.
Shown in Figs. 9 to 11, technology of the present invention can be applied in practical application on the various objects that need to be dispelled the heat, and specifically describes a kind of embodiment of the LED of being applied to field of radiating here.
This object A that need to be dispelled the heat is LED light-emitting device 50 as mentioned above, and this LED light-emitting device 50 comprises LED lamp 51 and LED shell 52.
This LED lamp 51 directly is attached on the lower surface of this end box 13 of this heat pipe heat radiation body 10, thereby make between this LED lamp 51 and this heat pipe heat radiation body 10 and can not form thermal resistance, thereby can this LED light-emitting device 50 be dispelled the heat by radiator structure maximal efficiency of the present invention.
This LED shell 52 covers at this LED lamp 51 wherein.
This LED lamp 51 is arranged in this optical lens cover 53, improves the optical effect of this LED lamp 51 by this optical lens cover 53.
This LED shell 52 comprises plastic support frame 61, gland 62 and face glass 63, and wherein, this plastic support frame 61 is fixedly connected on this end box 13 of this heat pipe heat radiation body 10, this plastic support frame 61 and this end box 13 between be provided with sealing ring 611.
These gland 62 lids are located on this plastic support frame 61, and this face glass 63 is pressed between this plastic support frame 61 and this gland 62, is equipped with glass capsulation circle 631 around this face glass 63.
Be inserted with plug wire nut 64 in these LED shell 52 sides, be arranged with the nut seal circle on this plug wire nut 64.
Be provided with connecting hole 641 in this plug wire nut 64, external wire is located in this connecting hole 641, and external wire one end is connected with external circuit, and its other end is connected with this LED lamp 51.
The present invention is in concrete production and processing, and its production stage is:
The first step, with this capillary layer 16 of sintering on the inner surface of this thermal cycle inner chamber 11 and this space multistory heat radiation inner chamber 30 respectively, the thickness of this capillary layer 16 is less than or equal to 5 millimeters,
Second step is connected to this object A that need to be dispelled the heat on the lower surface of this end box 13 of this heat pipe heat radiation body 10, should weld together with this loam cake 14 by end box 13,
The 3rd step, the high radiation plastic layer 100 of this high heat conduction of plastic-blasting or sintering on the outer surface of this heat pipe heat radiation body 10 and this space multistory heat-sink unit 20,
The 4th step, select this space heat elimination body 21, from its top drilling, at first this space multistory heat radiation inner chamber 30 and this thermal cycle inner chamber 11 are vacuumized, this radiator liquid 12 of can in this space multistory heat radiation inner chamber 30 and this thermal cycle inner chamber 11 then, sealing of hole then is to finish whole production process.
Shown in Figure 12 to 15, a kind of efficient radiating apparatus, it comprises heat radiator body 100, and this heat radiator body 100 is made by the high radiation plastic material of high heat conduction, and the high radiation plastic material of this high heat conduction can be converted to heat electromagnetic form and energy emission is distributed.
As shown in figure 12, the high radiation plastic material of this high heat conduction is mixed by plastics 110 and infrared radiant material particle 120.
The percentage by weight of these plastics 110 and this infrared radiant material particle 120 is between the 1000:2 to 1000:10, and this infrared radiant material is evengranular to be distributed in these plastics.
This infrared radiant material particle is that in the powder such as carborundum, cobalt oxide, zirconia, magnesium oxide, zinc oxide, nickel oxide, carbon dust one or several mix, and the diameter of this infrared radiant material particle is less than 40 microns.
This infrared radiant material particle can also be made by other materials with infrared signature in implementation.
The thickness of this heat radiator body 100 is between 2 millimeters to 10 millimeters.
The thickness of this heat radiator body 100 radiating effect between 2 millimeters to 5 millimeters is best in implementation.
In implementation, the object A that need to be dispelled the heat directly is connected on this heat radiator body 100, the heat that the object A that need to be dispelled the heat is produced conducts in this heat radiator body 100, by this heat radiator body 100 heat mainly is converted to electromagnetic form radiation and distributes, to reach the purpose of heat radiation.
This heat radiator body 100 is converted to electromagnetic concrete ratio according to the mixing ratio concrete decision of plastics and infrared radiant material particle with heat.
For improving radiating effect, on this heat radiator body 100, be provided with some protruding 200 to overhanging.
Increase the heat loss through radiation area of this heat radiator body 100 by this projection 200.
This projection 200 is connected to form an integral body with this heat radiator body 100, and the material of this projection 200 consists of identical with this heat radiator body 100.
This heat radiator body 100 and vertical whole height that should projection 200 are between 2 millimeters to 10 millimeters.
As shown in figure 13, in implementation, this projection 200 is hollow body 300, and sealing is filled with radiator liquid 12 in this hollow body 300.
This radiator liquid 12 is by the filling liquid of meeting hot high volatility, such as water, ethanol etc. in implementation.
This radiator liquid 12 is sealed in the annular seal space.
The sealing chamber by the inwall of this hollow body 300 and bottom 400 around forming.
The object A that need to be dispelled the heat directly is connected on this bottom 400.
In order to promote the radiating effect of this hollow body 300, convex is provided with some fins 500 from the outer surface of this hollow body 300.
Being combined between 2 millimeters to 10 millimeters of the transverse gage of the thickness of the tube wall of this hollow body 300 and this fin 500.
As shown in figure 14, in implementation, for further improving radiating effect, extend upwardly at this bottom 400 and to be provided with some thermal columns 410.
Each these thermal column 410 corresponding inserted in the inner chamber of this hollow body 300, the inwall close contact of this thermal column 410 and this hollow body 300.
As shown in figure 15, in implementation, this bottom 400 comprises temperature-uniforming plate loam cake 420 and temperature-uniforming plate lower cover 430.
These temperature-uniforming plate loam cake 420 seal covers are located on this temperature-uniforming plate lower cover 430, form a temperature-uniforming plate inner chamber between this temperature-uniforming plate loam cake 420 and this temperature-uniforming plate lower cover 430.
Sealing is filled with radiator liquid 12 in this temperature-uniforming plate inner chamber.
Some these thermal columns 410 are arranged on the end face of this temperature-uniforming plate loam cake 420.
The object A that need to be dispelled the heat directly is connected on the bottom surface of this temperature-uniforming plate lower cover 430.
What be worth at last emphasizing is that high its application principle of radiation plastic material of high heat conduction in the technical solution of the present invention is owing to plastics itself are the relatively poor preferably a kind of materials that dispels the heat that conducts heat, among the present invention when some these space heat elimination bodies 21 are all made by metal material, because these space heat elimination body 21 mutual alignments are more close, these space heat elimination body 21 own infrared radiations of metal can interfere with each other and mutual absorbing heat, in this case the setting by the high radiation plastic layer 100 of this high heat conduction can with interfere with each other between this space heat elimination body 21 with heat mutually to repeat dropping to of situation about absorbing minimum, while is by the characteristics of plastic material rapid heat dissipation, make the overall structure radiating efficiency faster, add and strengthened area of dissipation, promoted greatly radiating effect.
Claims (10)
1. efficient radiating apparatus, it is characterized in that: comprise heat radiator body, this heat radiator body is made by the high radiation plastic material of high heat conduction, and the high radiation plastic material of this high heat conduction can be converted to heat electromagnetic form and energy emission is distributed,
The high radiation plastic material of this high heat conduction is mixed by plastics and infrared radiant material particle,
The percentage by weight of these plastics and this infrared radiant material particle is between 1000:2 to 1000:10, and this infrared radiant material is evengranular to be distributed in these plastics,
The thickness of this heat radiator body between 2 millimeters to 10 millimeters,
The object that need to be dispelled the heat directly is connected on this heat radiator body, and the heat that object produced that need to be dispelled the heat conducts in this heat radiator body, by this heat radiator body heat mainly is converted to electromagnetic form radiation and distributes.
2. a kind of efficient radiating apparatus as claimed in claim 1, it is characterized in that: this infrared radiant material particle is that in the powder such as carborundum, cobalt oxide, zirconia, magnesium oxide, zinc oxide, nickel oxide, carbon dust one or several mix, and the diameter of this infrared radiant material particle is less than 40 microns.
3. a kind of efficient radiating apparatus as claimed in claim 2, it is characterized in that: be provided with some projections to overhanging on this heat radiator body, increase the heat loss through radiation area of this heat radiator body by this projection, this projection and this heat radiator body are connected to form an integral body, this protruding material consists of identical with this heat radiator body, this projection is hollow body, sealing is filled with radiator liquid in this hollow body, this radiator liquid is sealed in the annular seal space, around forming, the object that need to be dispelled the heat directly is connected on this bottom by the inwall of this hollow body and bottom in the sealing chamber.
4. a kind of efficient radiating apparatus as claimed in claim 2, it is characterized in that: be provided with some projections to overhanging on this heat radiator body, increase the heat loss through radiation area of this heat radiator body by this projection, this projection and this heat radiator body are connected to form an integral body, this protruding material consists of identical with this heat radiator body, this projection is hollow body
Convex is provided with some fins from the outer surface of this hollow body, being combined between 2 millimeters to 10 millimeters of the thickness of the tube wall of this hollow body and the transverse gage of this fin,
Extend upwardly at bottom and to be provided with some thermal columns, each this thermal column corresponding inserted in the inner chamber of this hollow body, the inwall close contact of this thermal column and this hollow body.
5. a kind of efficient radiating apparatus as claimed in claim 4, it is characterized in that: this bottom comprises temperature-uniforming plate loam cake and temperature-uniforming plate lower cover, this temperature-uniforming plate loam cake seal cover is located under this temperature-uniforming plate and covers, between this temperature-uniforming plate loam cake and this temperature-uniforming plate lower cover, form a temperature-uniforming plate inner chamber, sealing is filled with radiator liquid in this temperature-uniforming plate inner chamber, some these thermal columns are arranged on the end face of this temperature-uniforming plate loam cake, and the object that need to be dispelled the heat directly is connected on the bottom surface of this temperature-uniforming plate lower cover.
6. efficient radiating apparatus, it is characterized in that: comprise heat pipe heat radiation body and space multistory heat-sink unit, wherein, this heat pipe heat radiation body has the thermal cycle inner chamber, and sealing is filled with radiator liquid in this thermal cycle inner chamber,
This space multistory heat-sink unit has space multistory heat radiation inner chamber, this space multistory heat-sink unit is fixedly connected on this heat pipe heat radiation body, and this space multistory heat radiation inner chamber of this space multistory heat-sink unit and this thermal cycle intracavity inter-connection of this heat pipe heat radiation body, this space multistory heat-sink unit is arranged in the solid space of this heat pipe heat radiation body exterior, additionally hew out independently three-dimensional heat-dissipating space by this space multistory heat-sink unit for this heat pipe heat radiation body
The object that need to be dispelled the heat directly is connected on this heat pipe heat radiation body, the heat that object produced that need to be dispelled the heat at first is delivered on this heat pipe heat radiation body, the mode of then transmitting by the evaporation of this radiator liquid in this thermal cycle inner chamber, the reciprocal heat of condensation cycle with this dissipation of heat in space outerpace
In the process of evaporate in this radiator liquid, the reciprocal heat of condensation cycle transmitting, at first this radiator liquid is subjected to thermal evaporation in this thermal cycle inner chamber, then vaporized this radiator liquid rises gradually and enters into this space multistory heat radiation inner chamber, be back in this thermal cycle inner chamber after vaporized this radiator liquid is met cold condensation liquefaction in this space multistory heat radiation inner chamber, so move in circles and finish the process of integral heat sink.
7. a kind of efficient radiating apparatus as claimed in claim 6, it is characterized in that: this heat pipe heat radiation body comprises end box and loam cake, this loam cake lid is located on this end box, by this end box and this loam cake around forming this thermal cycle inner chamber,
This space multistory heat-sink unit comprises some space heat elimination bodies, some these space heat elimination bodies arrangements are connected on being somebody's turn to do of this heat pipe heat radiation body and cover, this space heat elimination body extends to this heat pipe heat radiation body top from this loam cake, each this space heat elimination body has inner chamber, each this inner chamber and this thermal cycle intracavity inter-connection, some these combination of lumens form this space multistory heat radiation inner chamber, and this object that need to be dispelled the heat is connected on the lower surface of this end box of this heat pipe heat radiation body.
8. a kind of efficient radiating apparatus as claimed in claim 7; it is characterized in that: this heat pipe heat radiation body and this space multistory heat-sink unit are made by the highly heat-conductive material with electromagnetic infrared wave heat dissipation characteristics; highly heat-conductive material with electromagnetic infrared wave heat dissipation characteristics is mixed by metallic aluminium and infrared radiant material particle
The percentage by weight of metallic aluminium and infrared radiant material particle is between the 1000:2 to 1000:10,
This infrared radiant material particle is that in the powder such as carborundum, cobalt oxide, zirconia, magnesium oxide, zinc oxide, nickel oxide, carbon dust one or several have the infrared radiant material of enhancing particle and mix, and the diameter of this infrared radiant material particle is less than 40 microns.
9. a kind of efficient radiating apparatus as claimed in claim 7, it is characterized in that: the inner surface at this thermal cycle inner chamber and this space multistory heat radiation inner chamber is attached with capillary layer respectively, this capillary layer is formed by metal powder sintered, form the diameter of particle of this metal dust of this capillary layer less than 40 microns
This capillary layer is attached on the inner surface of this thermal cycle inner chamber and this space multistory heat radiation inner chamber, when this radiator liquid is in this capillary layer top or flows through this capillary layer, by the metal heat conduction characteristic of this metal powder granulates the heat of each this radiator liquid of position is carried out simultaneously by the capillary structure of this capillary layer self that heat is conducted, thermal balance.
10. such as the described a kind of efficient radiating apparatus of any one in the claim 7 to 9, it is characterized in that: on the outer surface of this heat pipe heat radiation body and this space multistory heat-sink unit, also be attached with the high radiation plastic layer of high heat conduction, the high radiation plastic layer of this high heat conduction can be converted to heat electromagnetic form and energy emission is distributed, the high radiation plastic layer of this high heat conduction is made by ceramic powders or plastics powder, adopt spraying, the mode of plastic-blasting or sintering is attached to the high radiation plastic layer of this high heat conduction on the outer surface of this heat pipe heat radiation body and this space multistory heat-sink unit, the high radiation plastic layer of this high heat conduction is outer shelly at the outer surface of this heat pipe heat radiation body and this space multistory heat-sink unit, when this space multistory heat-sink unit comprises some this space heat elimination bodies, the high radiation plastic layer of this high heat conduction is the fin state on the surface of this space heat elimination body, and the thickness of the high radiation plastic layer of this high heat conduction is less than or equal to 5 millimeters.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101017067A (en) * | 2006-02-11 | 2007-08-15 | 鸿富锦精密工业(深圳)有限公司 | Heat dissipation plate and manufacture method therefor |
CN101161721A (en) * | 2006-10-10 | 2008-04-16 | 聚鼎科技股份有限公司 | Heat-conducting and electrically insulating polymer materials and heat-dissipating substrates containing them |
CN101835365A (en) * | 2002-10-21 | 2010-09-15 | 莱尔德技术公司 | The electromagnetic interference shield of heat conduction |
-
2012
- 2012-06-28 CN CN201210217589.1A patent/CN102883584B/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101835365A (en) * | 2002-10-21 | 2010-09-15 | 莱尔德技术公司 | The electromagnetic interference shield of heat conduction |
CN101017067A (en) * | 2006-02-11 | 2007-08-15 | 鸿富锦精密工业(深圳)有限公司 | Heat dissipation plate and manufacture method therefor |
CN101161721A (en) * | 2006-10-10 | 2008-04-16 | 聚鼎科技股份有限公司 | Heat-conducting and electrically insulating polymer materials and heat-dissipating substrates containing them |
Cited By (14)
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CN108150977A (en) * | 2017-12-19 | 2018-06-12 | 苏州亿沃光电科技有限公司 | LED component soaking plate, preparation method and LED component based on porous carbon materials |
CN108668509A (en) * | 2018-06-14 | 2018-10-16 | 浙江大学山东工业技术研究院 | cabinet cooling |
CN108668509B (en) * | 2018-06-14 | 2024-03-26 | 浙江大学山东工业技术研究院 | Cooling device of cabinet |
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