CN102882777A - Full-crossover network interconnection assembly structure and full-crossover network interconnection assembly method - Google Patents
Full-crossover network interconnection assembly structure and full-crossover network interconnection assembly method Download PDFInfo
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Abstract
The invention provides a full-crossover network interconnection assembly structure and a full-crossover network interconnection assembly method. The full-crossover network interconnection assembly structure comprises a plurality of node boards, a plurality of network boards and a passive middle board, wherein the node boards are parallelly mounted on the first side of the passive middle board, the network boards are parallelly mounted on a second side of the passive middle board, the passive middle board is used as a full-crossover network cabling and power current feed path among the node boards and the network boards, and no active device is placed on the passive middle board. The node boards are used for mounting computing units, and the network boards are used for mounting network exchange chips.
Description
Technical field
The present invention relates to field of computer technology, more particularly, the present invention relates to a kind of crossover network network interconnected set assembling structure that adopts passive middle plate to realize the assemble method that the crossover network network interconnects and adopt passive middle plate to realize.
Background technology
Along with the fast development of high-performance calculation machine technology, the performance of high-performance computer is more and more higher, and when each computing node disposal ability strengthened, the nodes in the high-performance computer also constantly increased, and the scale of internodal network connection is also increasing.
Network connection between traditional the node of high performance computer, a kind of assemble method is the method that adopts plug-in unit-base plate, per 1 ~ 4 computing node is installed in one and calculates on the plug-in unit, per 2 ~ 4 blocks of calculating plug-in units are inserted on the base plate again, place network exchanging chip on the base plate, the connection of calculating between plug-in unit realizes by linking base plate.
Another kind of assemble method is to realize more massive network connection by cable, and per 1 ~ 4 computing node is installed in one and calculates on the mainboard, calculates mainboard and is connected on the network switch by cable.
On the one hand, if adopt the assemble method of backboard-plug-in unit to realize the connection of crossover network network, the interference networks small scale of the general full intersection that realizes, for example full cross bonding network size is generally 4/8/16 node, and maximum-norm is not seen and is surpassed 16 nodes.This assemble method has the shortcoming of the low and crossover network network small scale of packaging density.On the other hand, if adopt the method for cable to enlarge the scale of crossover network network, then can bring again more than the cable and the high shortcoming of cost.
Therefore, hope can provide a kind of solution that can realize with plain mode the network connection of extensive internodal full intersection in the high-performance computer.
Summary of the invention
Technical problem to be solved by this invention is for having defects in the prior art, a kind of assemble method that can realize with plain mode the passive middle plate realization crossover network network of the employing interconnection of the network connection of extensive internodal full intersection in the high-performance computer being provided.
According to a first aspect of the invention, provide a kind of crossover network network interconnected set assembling structure, it comprises: a plurality of gusset plates, a plurality of network board and passive middle plate; Wherein, described a plurality of gusset plates are installed in the first side of described passive middle plate, and described a plurality of network boards are installed in the second side of described passive middle plate; And described passive middle plate is presented flow path as the wiring of the crossover network network between described a plurality of gusset plates and the described a plurality of network board and power supply, and does not place any active device on the described passive middle plate.
Preferably, described gusset plate is used for installing computing unit, and described network board is used for installing network exchanging chip.
Preferably, described a plurality of gusset plates are installed in the first side of described passive middle plate in the mode that is parallel to each other, and/or described a plurality of network boards are installed in the second side of described passive middle plate in the mode that is parallel to each other.
Preferably, described a plurality of gusset plate and described a plurality of network board are installed in respectively the first side and second side of described passive middle plate in the mode that is parallel to each other.
Preferably, the wiring of crossover network network and the power supply feedback flow path between the described passive middle plate all-network exchange chip having realized installing on all computing nodes of installing on described a plurality of gusset plate and the described a plurality of network board.
According to a second aspect of the invention, provide a kind of crossover network network interconnection assemble method, it comprises: first step: the first side that a plurality of gusset plates is installed in passive middle plate; Second step: the second side that a plurality of network boards is installed in described passive middle plate; Third step: described passive middle plate is presented flow path as the wiring of the crossover network network between described a plurality of gusset plates and the described a plurality of network board and power supply; And, in described crossover network network interconnection assemble method, do not place any active device on the described passive middle plate.
Preferably, described gusset plate is used for installing computing unit, and described network board is used for installing network exchanging chip.
Preferably, described a plurality of gusset plates are installed in the first side of described passive middle plate in the mode that is parallel to each other, and/or described a plurality of network boards are installed in the second side of described passive middle plate in the mode that is parallel to each other.
Preferably, described a plurality of gusset plate and described a plurality of network board are installed in respectively the first side and second side of described passive middle plate in the mode that is parallel to each other.
Preferably, the wiring of crossover network network and the power supply feedback flow path between the described passive middle plate all-network exchange chip having realized installing on all computing nodes of installing on described a plurality of gusset plate and the described a plurality of network board.
The invention provides a kind of three-dimensional assembling scheme that adopts passive middle plate, it can realize with plain mode the network connection of extensive internodal full intersection in the high-performance computer.The present invention has the following advantages at least: 1. the density of assembling is high, can realize the network connection of 64 above nodes on the passive middle plate of monolithic; 2. be to connect without cable, close coupling owing to what take, have advantages of that cost is low.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows 16 nodes and realizes the full network topology structure of intersecting of 16X16 by 4 network exchanging chip.
Fig. 2 schematically shows the schematic diagram of realizing the package assembly of crossover network network interconnection according to the passive middle plate of the employing of the embodiment of the invention.
Fig. 3 schematically shows the flow chart according to the crossover network network interconnection assemble method of the embodiment of the invention.
Need to prove, accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Note, the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
The＜the first embodiment 〉
In the assembling scheme of the passive middle plate realization crossover network network interconnection according to the employing of the embodiment of the invention, can place computing unit at gusset plate, gusset plate is pegged graft in a side level of passive middle plate, places network exchanging chip on the network board, and network board is pegged graft in the opposite side level of passive middle plate; Thus, the connection between gusset plate and the network board realizes by passive middle plate.Do not place any active device on the passive middle plate, be used for just realizing that crossover network network at a high speed connects up and power supply feedback flow path.
The below will take 16 nodes by 4 network exchanging chip realize the full network topology structures of intersecting of 16X16 as example illustrates principle of the present invention.
Specifically, Fig. 1 schematically shows 16 nodes and realizes the full network topology structure of intersecting of 16X16 by 4 network exchanging chip.As shown in Figure 1, computing node C0, C1, C2, C3 are connected on the network exchanging chip SW0, computing node C4, C5, C6, C7 are connected on the network exchanging chip SW1, computing node C8, C9, C10, C11 are connected on the network exchanging chip SW2, and computing node C12, C13, C14, C15 are connected on the network exchanging chip SW3; Thus, computing node C0 to C15 realizes the full cross bonding of 16X16 by network exchanging chip SW0, network exchanging chip SW1, network exchanging chip SW2, network exchanging chip SW3, network exchanging chip SW4, network exchanging chip SW5, network exchanging chip SW6, network exchanging chip SW7.
And, further, network exchanging chip SW0, network exchanging chip SW1, network exchanging chip SW2, network exchanging chip SW3, network exchanging chip SW4, network exchanging chip SW5, network exchanging chip SW6 and network exchanging chip SW7 are by each other interconnection of wiring in the middle plate; Wherein, although not shown,, network exchanging chip SW4, network exchanging chip SW5, network exchanging chip SW6 and network exchanging chip SW7 can further be connected to upper layer network to link to each other with other computing node by cable.
Fig. 2 schematically shows the schematic diagram of realizing the package assembly of crossover network network interconnection according to the passive middle plate of the employing of first embodiment of the invention.
As shown in Figure 2, the crossover network network interconnected set assembling structure according to the embodiment of the invention comprises: a plurality of gusset plates, a plurality of network board and passive middle plate 1.Wherein, described a plurality of gusset plates are installed in the first side of described passive middle plate 1, and described a plurality of network boards are installed in the second side of described passive middle plate 1.
And the connection that gusset plate is connected with network board realizes by passive middle plate.More particularly, described passive middle plate is presented flow path as the wiring of the crossover network network between described a plurality of gusset plates and the described a plurality of network board and power supply, and does not place any active device on the described passive middle plate.
For example, in example shown in Figure 2, a plurality of gusset plates are first node plate 21, Section Point plate 22, the 3rd gusset plate 23 and the 4th gusset plate 24; A plurality of network boards are first network plate 31, second network plate 32, the 3rd network board 33 and the 4th network board 34.
Wherein, gusset plate is used for installing computing unit, and network board is used for installing network exchanging chip.
Preferably, in specific embodiment, described a plurality of gusset plates are installed in the first side of described passive middle plate 1 in the mode that is parallel to each other.Thus, can make things convenient for the wiring of the first side of described passive middle plate 1, so that the wiring of the first side of described passive middle plate 1 becomes simple.
Similarly, preferably, in specific embodiment, described a plurality of network boards are installed in the second side of described passive middle plate 1 in the mode that is parallel to each other.Thus, can make things convenient for the wiring of the second side of described passive middle plate 1, so that the wiring of the second side of described passive middle plate 1 becomes simple.
Further preferably, in specific embodiment, described a plurality of gusset plates and described a plurality of network board are installed in respectively the first side and second side of described passive middle plate 1 in the mode that is parallel to each other.Thus, can make things convenient for the loose routing of described passive middle plate 1, so that the loose routing of described passive middle plate 1 becomes simple.
As the concrete example of embodiment shown in Figure 2, for example, can realize the assembling mode of 16 full cross bondings of computing node by adopting passive middle plate; Specifically, for example, realize in the package assembly of crossover network network interconnection at the passive middle plate of the employing according to the embodiment of the invention shown in Figure 2, per 4 computing nodes (computing unit) are installed on the gusset plate (having 4 * 4=16 computing node on four gusset plates thus), 2 network exchanging chip are installed on the every network board, and the connection that gusset plate is connected with network board realizes by passive middle plate.
More particularly, for topological structure shown in Figure 1, in above-mentioned concrete example, can utilize embodiment shown in Figure 2 to realize.Specifically, for example, computing node C0, C1, C2, C3 can be installed on the first node plate 21, computing node C4, C5, C6, C7 are installed on the Section Point plate 22, computing node C8, C9, C10, C11 are installed on the 3rd gusset plate 23, computing node C12, C13, C14, C15 are installed on the 4th gusset plate 24; And, network exchanging chip SW0 and network exchanging chip SW4 are installed on the first network plate 31, network exchanging chip SW1 and network exchanging chip SW5 are installed on the second network plate 32, network exchanging chip SW2 and network exchanging chip SW6 are installed on the 3rd network board 33, network exchanging chip SW3 and network exchanging chip SW7 are installed on the 4th network board 34.Simultaneously, the annexation that realizes between all elements shown in Figure 1 of passive middle plate 1.That is, preferably, the crossover network network wiring between the all-network exchange chip that passive middle plate 1 has been realized installing on all computing nodes of installing on described a plurality of gusset plate and the described a plurality of network board and power supply feedback flow path.
Thus, the above embodiment of the present invention provides a kind of three-dimensional assemble method that adopts passive middle plate, and it can realize with plain mode the network connection of extensive internodal full intersection in the high-performance computer.
Can find out, the above embodiment of the present invention has the following advantages at least:
1. the density of assembling is high, can realize the network connection of 64 above nodes on the passive middle plate of monolithic;
2. be to connect without cable, close coupling owing to what take, have advantages of that cost is low.
The＜the second embodiment 〉
Fig. 3 schematically shows the flow chart according to the crossover network network interconnection assemble method of second embodiment of the invention.
As shown in Figure 3, the crossover network network interconnection assemble method according to the embodiment of the invention comprises:
First step S1: the first side that a plurality of gusset plates is installed in passive middle plate;
Second step S2: the second side that a plurality of network boards is installed in described passive middle plate;
Third step S3: described passive middle plate is presented flow path as the wiring of the crossover network network between described a plurality of gusset plates and the described a plurality of network board and power supply;
And, in the crossover network network interconnection assemble method according to the embodiment of the invention, do not place any active device on the described passive middle plate.
Realize that according to the passive middle plate of the employing of first embodiment of the invention the additional favorable characteristics of the package assembly of crossover network network interconnection is equally applicable to the crossover network network interconnection assemble method according to second embodiment of the invention, does not repeat them here.
In addition, need to prove, term in the specification " first ", " second ", " the 3rd " etc. describe each assembly of only being used for distinguishing specification, element, step etc., rather than are used for logical relation between each assembly of expression, element, the step or ordinal relation etc.
Be understandable that, although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (10)
1. a crossover network network interconnected set assembling structure is characterized in that comprising: a plurality of gusset plates, a plurality of network board and passive middle plate; Wherein, described a plurality of gusset plates are installed in the first side of described passive middle plate, and described a plurality of network boards are installed in the second side of described passive middle plate; And described passive middle plate is presented flow path as the wiring of the crossover network network between described a plurality of gusset plates and the described a plurality of network board and power supply, and does not place any active device on the described passive middle plate.
2. crossover network network interconnected set assembling structure according to claim 1 is characterized in that, described gusset plate is used for installing computing unit, and described network board is used for installing network exchanging chip.
3. crossover network network interconnected set assembling structure according to claim 1 and 2, it is characterized in that, described a plurality of gusset plate is installed in the first side of described passive middle plate in the mode that is parallel to each other, and/or described a plurality of network boards are installed in the second side of described passive middle plate in the mode that is parallel to each other.
4. according to claim 1 to one of 3 described crossover network network interconnected set assembling structures, it is characterized in that, described a plurality of gusset plates and described a plurality of network board are installed in respectively the first side and second side of described passive middle plate in the mode that is parallel to each other.
5. according to claim 1 to one of 4 described crossover network network interconnected set assembling structures, it is characterized in that the crossover network network wiring between the all-network exchange chip that described passive middle plate has been realized installing on all computing nodes of installing on described a plurality of gusset plate and the described a plurality of network board and power supply feedback flow path.
6. crossover network network interconnection assemble method is characterized in that comprising:
First step: the first side that a plurality of gusset plates is installed in passive middle plate;
Second step: the second side that a plurality of network boards is installed in described passive middle plate;
Third step: described passive middle plate is presented flow path as the wiring of the crossover network network between described a plurality of gusset plates and the described a plurality of network board and power supply;
And, in described crossover network network interconnection assemble method, do not place any active device on the described passive middle plate.
7. crossover network network interconnection assemble method according to claim 6 is characterized in that, described gusset plate is used for installing computing unit, and described network board is used for installing network exchanging chip.
8. according to claim 6 or 7 described crossover network networks interconnection assemble methods, it is characterized in that, described a plurality of gusset plate is installed in the first side of described passive middle plate in the mode that is parallel to each other, and/or described a plurality of network boards are installed in the second side of described passive middle plate in the mode that is parallel to each other.
9. according to claim 6 to one of 8 described crossover network network interconnection assemble methods, it is characterized in that, described a plurality of gusset plates and described a plurality of network board are installed in respectively the first side and second side of described passive middle plate in the mode that is parallel to each other.
10. according to claim 6 to one of 9 described crossover network network interconnection assemble methods, it is characterized in that the crossover network network wiring between the all-network exchange chip that described passive middle plate has been realized installing on all computing nodes of installing on described a plurality of gusset plate and the described a plurality of network board and power supply feedback flow path.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110727631A (en) * | 2019-09-12 | 2020-01-24 | 无锡江南计算技术研究所 | H-shaped assembling method based on orthogonal and non-orthogonal heterogeneous interconnection of double middle plates |
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| US5887158A (en) * | 1992-06-08 | 1999-03-23 | Quickturn Design Systems, Inc. | Switching midplane and interconnecting system for interconnecting large numbers of signals |
| US20020046878A1 (en) * | 1998-04-28 | 2002-04-25 | Yoshinori Uzuka | Printed wiring board mounting structure |
| US20020181217A1 (en) * | 2001-06-01 | 2002-12-05 | Dorinel Patriche | Midplane for data processing apparatus |
| US20030002541A1 (en) * | 2001-06-07 | 2003-01-02 | Fowler Michael L. | Mid-connect architecture with point-to-point connections for high speed data transfer |
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- 2012-09-28 CN CN2012103694890A patent/CN102882777A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5887158A (en) * | 1992-06-08 | 1999-03-23 | Quickturn Design Systems, Inc. | Switching midplane and interconnecting system for interconnecting large numbers of signals |
| US20020046878A1 (en) * | 1998-04-28 | 2002-04-25 | Yoshinori Uzuka | Printed wiring board mounting structure |
| US20020181217A1 (en) * | 2001-06-01 | 2002-12-05 | Dorinel Patriche | Midplane for data processing apparatus |
| US20030002541A1 (en) * | 2001-06-07 | 2003-01-02 | Fowler Michael L. | Mid-connect architecture with point-to-point connections for high speed data transfer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110727631A (en) * | 2019-09-12 | 2020-01-24 | 无锡江南计算技术研究所 | H-shaped assembling method based on orthogonal and non-orthogonal heterogeneous interconnection of double middle plates |
| CN110727631B (en) * | 2019-09-12 | 2023-08-08 | 无锡江南计算技术研究所 | H-shaped assembling method based on orthogonal and non-orthogonal heterogeneous interconnection of double middle plates |
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Application publication date: 20130116 |