CN102869208A - Method for controlling depth of two-sided inserting blind hole of printed circuit board - Google Patents
Method for controlling depth of two-sided inserting blind hole of printed circuit board Download PDFInfo
- Publication number
- CN102869208A CN102869208A CN201210363055XA CN201210363055A CN102869208A CN 102869208 A CN102869208 A CN 102869208A CN 201210363055X A CN201210363055X A CN 201210363055XA CN 201210363055 A CN201210363055 A CN 201210363055A CN 102869208 A CN102869208 A CN 102869208A
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- Prior art keywords
- blind hole
- depth
- pseudobed
- daughter board
- layer
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Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000003475 lamination Methods 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 11
- 238000005336 cracking Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for controlling depth of a two-sided inserting blind hole of a printed circuit board. The method comprises the following steps of: (1) adding a fake layer which is designed on an original board at the inner layer of a sub-board; (2) completely etching the copper at the plane of the fake layer while manufacturing circuits of the inner layer, and ensuring that etching depth of the hole wall does not achieve an objective layer; (3) overlapping sub-boards by using prepregs, so that the fake layer copper-free plane is bonded with the prepregs; and (4) laminating after the overlapping, so that the sub-boards are bonded together, and at this moment a main board is manufactured successfully. By adding a fake layer at the inner layer and through a lamination control process mode, requirements on controlling the depth of a blind hole are achieved, and quality requirements on the trust to products are met.
Description
Technical field
The present invention relates to a kind of printed substrate double-side plug-in blind hole depth control method, belong to the technical flow design field.
Background technology
Multilayer board double-side plug-in technology, at present industry is generally made flow process for to make respectively two independently daughter boards according to two sides different plug connector position and quantity, again the mode of two daughter boards by lamination is bonded into a motherboard.Because the length restriction of plug-in unit pin, so the degree of depth of the blind hole of corresponding daughter board also has strict control requirement, when printed wiring board blind hole number 〉=1, during residue depth requirements after material is filled in the blind hole＞0 mm, the selection of the jointing material that the daughter board lamination is used just seems especially important.The method of the interior material depth of cracking closure of control blind hole has following several in the prior art:
1. directly control material depth of cracking closure in the blind hole by the common semi-solid preparation adhesive sheet of pressing, its shortcoming is that the gummosis amount is large, and material is filled too much in the blind hole, and the residue blind hole depth can't reach requirement.
2. control material depth of cracking closure in the blind hole by solder-mask printing, its shortcoming is that material is filled too much in the blind hole, and the difficult control of technique, less stable.
3. directly control material depth of cracking closure in the blind hole by pressing lazy flow semi-solid preparation adhesive sheet, its shortcoming is that material itself is mobile and fillibility is poor, between the inner figure without the copper zone difficulty fill up, easily produce the defectives such as bubble, cavity in the lamination process, and then affect the quality problem such as bonding strength between the daughter board and reliability.
Summary of the invention
In order effectively to solve the control of circuit board double grafting blind hole depth, the angle that the present invention designs from the folded method of optimizing daughter board, increase the design of " pseudobed " by internal layer, successfully realized the quality assurances such as adhesion, reliability of motherboard behind the severity control of daughter board blind hole and the lamination.
For solving the problems of the technologies described above, the technical solution used in the present invention is: printed substrate double-side plug-in blind hole depth control method, it is characterized in that, and comprise following step:
(1) increases the pseudobed that a raw sheet designs at the daughter board internal layer;
When (2) making internal layer circuit, the copper of pseudobed face is all etched away, and guarantee that the hole wall etch depth does not etch into destination layer;
(3) use prepreg superimposed between the daughter board, pseudobed is combined with prepreg without copper face;
(4) superimposed rear lamination is bonded together daughter board, and so far motherboard successfully completes.
Aforesaid printed substrate double-side plug-in blind hole depth control method is characterized in that, the surface of described pseudobed all is resin.
Aforesaid printed substrate double-side plug-in blind hole depth control method is characterized in that described prepreg is the lazy flow prepreg.
Aforesaid printed substrate double-side plug-in blind hole depth control method is characterized in that, residue depth requirements＞0 mm after material is filled in the blind hole number of described daughter board 〉=1, blind hole.
With respect to prior art, advantage of the present invention is:
1. without pressing cavity (bubble), avoided because the pressing bubble causes the rear adjacent or close hole cavity conducting of boring, thereby caused electroplating the problem of rear short circuit.
2. the material depth of cracking closure can reach specification in the blind hole, has avoided increasing pressing pressure because solving the pressing bubble, thereby has caused the excessively dark problem of material depth of cracking closure in the blind hole.
Description of drawings
Fig. 1 is the flow chart of printed substrate double-side plug-in blind hole depth control method of the present invention;
Fig. 2 is the structural representation that internal layer of the present invention increases the pseudobed of a raw sheet design.
The implication of each main Reference numeral is among the figure:
1. daughter board; 2. blind hole; 3. pseudobed; 4. lazy flow prepreg.
Embodiment
As depicted in figs. 1 and 2, printed substrate double-side plug-in blind hole depth control method comprises following step:
(1) when blind hole 2 numbers of daughter board 1 〉=1, during residue depth requirements after blind hole 1 interior material is filled＞0 mm, increases the pseudobed 3 of a raw sheet design at daughter board 1 internal layer.
When (2) making internal layer circuit, the copper of 3 of pseudobeds is all etched away, and guarantee that the hole wall etch depth does not etch into destination layer; The surface of pseudobed 3 is resin all, does not have figure, does not have difference in height, so when being pressed into motherboard, can there be cavity (bubble) in two daughter boards after the pressing.
(3) use lazy flow prepreg 4 superimposed between the daughter board 1, make pseudobed 3 without copper face and 4 combinations of lazy flow prepreg.
(4) superimposed rear lamination is bonded together daughter board 1, and so far motherboard successfully completes.
Folder method with original process is compared, and the design replaces to raw sheet (thickness of insulating layer need be consistent between two daughter boards) with part prepreg between two daughter boards, has respectively increased by 1 layer so that two daughter boards are compared former design.When making the daughter board outer graphics, the Copper Foil of this layer of increasing all can be etched away, the whole structure that two daughter boards are pressed into behind the motherboard is consistent with traditional folder method, so claim that this layer is " pseudobed ".
With respect to prior art, advantage of the present invention is:
1. without pressing cavity (bubble), avoided because the pressing bubble causes the rear adjacent or close hole cavity conducting of boring, thereby caused electroplating the problem of rear short circuit.
2. the material depth of cracking closure can reach specification in the blind hole, has avoided increasing pressing pressure because solving the pressing bubble, thereby has caused the excessively dark problem of material depth of cracking closure in the blind hole.
More than by description of listed embodiment, the basic ideas and basic principles of the present invention have been set forth.But the present invention never is limited to above-mentioned listed execution mode, and every equivalent variations, improvement and deliberately of inferior quality behavior of change of doing based on technical scheme of the present invention all should belong to protection scope of the present invention.
Claims (4)
1. printed substrate double-side plug-in blind hole depth control method is characterized in that, comprises following step:
(1) increases the pseudobed that a raw sheet designs at the daughter board internal layer;
When (2) making internal layer circuit, the copper of pseudobed face is all etched away, and guarantee that the hole wall etch depth does not etch into destination layer;
(3) use prepreg superimposed between the daughter board, pseudobed is combined with prepreg without copper face;
(4) superimposed rear lamination is bonded together daughter board, and so far motherboard successfully completes.
2. printed substrate double-side plug-in blind hole depth control method according to claim 1 is characterized in that, the surface of described pseudobed all is resin.
3. printed substrate double-side plug-in blind hole depth control method according to claim 1 is characterized in that described prepreg is the lazy flow prepreg.
4. printed substrate double-side plug-in blind hole depth control method according to claim 1 is characterized in that, residue depth requirements＞0 mm after material is filled in the blind hole number of described daughter board 〉=1, blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210363055.XA CN102869208B (en) | 2012-09-26 | 2012-09-26 | Printed substrate double-side plug-in blind hole depth control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210363055.XA CN102869208B (en) | 2012-09-26 | 2012-09-26 | Printed substrate double-side plug-in blind hole depth control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102869208A true CN102869208A (en) | 2013-01-09 |
| CN102869208B CN102869208B (en) | 2015-11-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210363055.XA Active CN102869208B (en) | 2012-09-26 | 2012-09-26 | Printed substrate double-side plug-in blind hole depth control method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260350A (en) * | 2013-05-07 | 2013-08-21 | 梅州市志浩电子科技有限公司 | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN105208802A (en) * | 2015-08-13 | 2015-12-30 | 恩达电路(深圳)有限公司 | Manufacture method for high multilayer thick copper buried-hole blind-slot zero-tolerance circuit board |
| CN108925042A (en) * | 2018-06-01 | 2018-11-30 | 珠海崇达电路技术有限公司 | A kind of printed circuit board and preparation method thereof replacing back drill hole with blind hole |
| CN110798995A (en) * | 2020-01-03 | 2020-02-14 | 惠州市大亚湾科翔科技电路板有限公司 | Preparation method of high-reliability photovoltaic inverter printed circuit board |
Citations (3)
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|---|---|---|---|---|
| KR20060047637A (en) * | 2004-04-30 | 2006-05-18 | 히다치 비아 메카닉스 가부시키가이샤 | Printed Circuit Board, Processing Method of Printed Circuit Board, and Manufacturing Method of Printed Circuit Board |
| CN101616541A (en) * | 2008-06-24 | 2009-12-30 | 华为技术有限公司 | Printed circuit board, manufacturing method thereof, and related equipment |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
-
2012
- 2012-09-26 CN CN201210363055.XA patent/CN102869208B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060047637A (en) * | 2004-04-30 | 2006-05-18 | 히다치 비아 메카닉스 가부시키가이샤 | Printed Circuit Board, Processing Method of Printed Circuit Board, and Manufacturing Method of Printed Circuit Board |
| CN101616541A (en) * | 2008-06-24 | 2009-12-30 | 华为技术有限公司 | Printed circuit board, manufacturing method thereof, and related equipment |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103260350A (en) * | 2013-05-07 | 2013-08-21 | 梅州市志浩电子科技有限公司 | Blind buried orifice plate laminating method and blind buried orifice plate manufactured with blind buried orifice plate laminating method |
| CN103260350B (en) * | 2013-05-07 | 2016-07-06 | 梅州市志浩电子科技有限公司 | Blind buried via hole plate compression method |
| CN105115415A (en) * | 2015-07-21 | 2015-12-02 | 胜宏科技（惠州）股份有限公司 | Circuit board blind hole depth test structure and test method thereof |
| CN105208802A (en) * | 2015-08-13 | 2015-12-30 | 恩达电路(深圳)有限公司 | Manufacture method for high multilayer thick copper buried-hole blind-slot zero-tolerance circuit board |
| CN105208802B (en) * | 2015-08-13 | 2018-06-26 | 恩达电路(深圳)有限公司 | High zero tolerance method of manufacturing circuit board of multi-layer thick copper buried via hole blind slot |
| CN108925042A (en) * | 2018-06-01 | 2018-11-30 | 珠海崇达电路技术有限公司 | A kind of printed circuit board and preparation method thereof replacing back drill hole with blind hole |
| CN110798995A (en) * | 2020-01-03 | 2020-02-14 | 惠州市大亚湾科翔科技电路板有限公司 | Preparation method of high-reliability photovoltaic inverter printed circuit board |
| CN110798995B (en) * | 2020-01-03 | 2020-07-07 | 惠州市大亚湾科翔科技电路板有限公司 | Preparation method of high-reliability photovoltaic inverter printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN102869208B (en) | 2015-11-11 |
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