CN102867764B - Cartesian robot cluster tool architecture - Google Patents

Abstract

The present invention provides a method and apparatus for processing substrates using a multi-chamber processing system with increased throughput, enhanced system reliability, improved device yield performance, more repeatable wafer process history, And a smaller footprint. Various embodiments of the cluster tool may use two or more robotic arms configured in a parallel processing configuration to transfer substrates between various process chambers that reside within the process rack so that desired processes can be performed program. In one aspect, the parallel processing configuration includes two or more robotic arm assemblies adapted to move vertically and horizontally to access individual process chambers residing within the processing rack. In one embodiment, the robot blade is adapted to restrain the substrate such that the acceleration experienced by the substrate during the transfer process does not change the position of the substrate on the robot blade.

Description

Cartesian Arm Cluster Tool Architecture

The patent application of this invention is an invention patent with the international application number PCT/US2006/013164, the international application date is April 7, 2006, and the application number entering the Chinese national phase is 200680013355.8, and the name is "Cartesian manipulator cluster tool architecture". Divisional application of the application.

technical field

Embodiments of the present invention generally relate to an integrated processing system that includes multiple processing stations and robotic arms capable of simultaneously processing multiple substrates.

Background technique

The process of forming electronic devices is typically performed in a multi-chamber process system (eg, a cluster tool) capable of sequentially processing substrates (eg, semiconductor wafers) under a controlled process environment. Cluster tools typically used to deposit (ie, coat) and develop photoresist materials are generally referred to as automated photoresist coating and development tools (track lithography tools), or to perform semiconductor cleaning processes, generally referred to as wet/clean tools, A typical cluster tool includes a main frame housing at least one substrate transfer robot that transfers substrates between a cassette/cassette mounter and a plurality of process chambers coupled to the main frame. Cluster tools are typically used so that substrates can be processed in a repeatable manner under a controlled process environment. A controlled process environment has many benefits, including minimizing contamination of the substrate surface during transfer and during completion of the various substrate processing steps. Processing in a controlled environment thus reduces defect generation and improves component yield.

The effectiveness of the substrate manufacturing process is usually weighed by two related and important factors, device yield and cost of ownership (CoO). These factors are important because they directly affect the production cost of electronic devices and thus the market competitiveness of device manufacturers. Although CoO is affected by many factors, CoO is greatly affected by system and chamber throughput. In short, it is the number of substrates processed by the expected process program per hour. A process program is generally defined as a program of device manufacturing steps or process recipe steps that are completed in one or more process chambers in the cluster tool. A process sequence may generally contain several substrate (or wafer) electronic device fabrication process steps. In an effort to reduce CoO, electronics manufacturers typically spend a lot of time trying to optimize process sequences and chamber processing times to achieve the maximum possible substrate throughput given cluster tool architecture constraints and chamber processing times . In automated photoresist coating and developing cluster tools, because the chamber process time is often short (for example, the process can be completed in about 1 minute), but the number of process steps required to complete a typical process sequence is large, it is used to complete Most of the process sequence time is spent transferring the substrate between the various process chambers. A typical automated photoresist coating and development process procedure generally includes the following steps: depositing one or more uniform photoresist (or resist) layers on the substrate surface, and then transferring the substrate out of the cluster tool to a separate step A machine or scanning tool is used to pattern the surface of the substrate by exposing the photoresist layer to photoresist-modulating electromagnetic radiation, followed by developing the patterned photoresist layer. If substrate throughput within a cluster tool is not limited by robotic arms, then the longest recipe step typically limits the throughput of that process. This typically does not occur in an automated photoresist coating and development process because of the short process times and large number of process steps. Typical system throughput for conventional manufacturing processes, such as automated photoresist coating and development tools performing typical processes, is typically between 100-120 substrates per hour.

Other important factors in the CoO calculation are system reliability and system operating time. These factors are important to the profitability and/or effectiveness of the cluster tool because the longer the system is unable to process the substrate, the more money the user loses due to the opportunity to process the substrate in the cluster tool loss. Consequently, cluster tool users and manufacturers spend a lot of time trying to develop reliable processes, reliable hardware and reliable systems with increased operating time.

Industry efforts to shrink semiconductor device dimensions to improve device processing speed and reduce device heat generation have reduced the industry's tolerance for process variation. To minimize process variation, an important element of automating photoresist coating and development process procedures is the issue of ensuring that each substrate passing through the cluster tool has the same "wafer history". The wafer history of the substrates is typically monitored and controlled by process engineers to ensure that all device fabrication process variables that may later affect device performance are controlled so that all substrates within the same batch are always processed in the same manner. To ensure that each substrate has the same "wafer history", each substrate needs to be subjected to the same repeatable substrate processing steps (e.g. consistent coating process, consistent hard bake process, consistent cooling process, etc. etc.), and the time between each process step is the same for each substrate. Lithographic device fabrication processes can be very sensitive to variations in process recipe variables and timing between recipe steps, which directly affect process variation and ultimately device performance. Therefore, there is a need for a cluster tool and supporting equipment capable of executing a process sequence that minimizes process variation and time variation between process steps. In addition, there is a need for cluster tools and supporting equipment capable of performing device fabrication processes that give uniform and repeatable process results while achieving desired substrate throughput.

Therefore, there is a need for a system, a method and an apparatus that can process a substrate to meet the required device performance targets and increase system throughput, thereby reducing process flow CoO.

Contents of the invention

The present invention generally provides a cluster tool for processing a substrate comprising a first process rack containing a first set of process chambers having two or more substrate process chambers stacked vertically chamber, and a second group of processing chambers, the second group of processing chambers has two or more substrate processing chambers stacked vertically, wherein the first and second groups of two or more substrate processing chambers The chamber has a first side aligned along a first direction, a first robotic arm assembly adapted to transfer a substrate to a substrate processing chamber in the first processing rack, wherein the first robotic arm assembly The arm assembly includes a first robot arm having a robot blade having a substrate-receiving surface, wherein the first robot arm is one or more robot arms adapted to place the substrate generally contained in a first plane. At a point, wherein the first plane is parallel to the first direction and a second direction perpendicular to the first direction, a first moving assembly having a direction adapted to arrange the first mechanical arm generally perpendicular to the first plane an actuator assembly in a third direction, and a second movement assembly having an actuator assembly adapted to position the first robotic arm in a direction generally parallel to the first direction, and a transfer area in the transfer area accommodating the first robot arm, wherein when the substrate is disposed on the substrate receiving surface of the robot blade, the width of the transfer area is parallel to the second direction and about 5 times larger than the substrate dimension in the second direction % to about 50%.

Embodiments of the present invention further provide a cluster tool for processing a substrate comprising a first processing rack containing two or more groups of two or more substrate processing chambers having vertical stacks , wherein the two or more groups of two or more substrate processing chambers have a first side aligned along a first direction for accessing the substrate processing chamber through the first side, a second A processing rack having two or more groups of two or more substrate processing chambers stacked vertically, wherein the two or more groups of two or more substrate processing chambers a chamber having a first side aligned along a first direction for accessing the substrate processing chamber through the first side, a first robotic arm assembly disposed between the first processing rack and the second processing rack, The first robot assembly is adapted to transfer the substrate from the first side to a substrate processing chamber in the first processing rack, wherein the first robot assembly includes a robot arm adapted to transfer the substrate Arranged at one or more points generally accommodated in a horizontal plane, a vertical movement assembly having a motor adapted to orient the arm in an orientation generally parallel to the vertical direction, and a horizontal movement assembly having a motor adapted to place the arm in a direction generally parallel to the vertical a motor with a mechanical arm disposed in a direction generally parallel to the first direction, a second mechanical arm assembly disposed between the first process frame and the second process frame, and the second mechanical arm assembly is adapted to move the substrate from The first side is transferred to a substrate processing chamber in the second processing rack, wherein the second robotic arm assembly includes a robotic arm adapted to position the substrate in one or more In point, a vertical movement assembly having a motor adapted to position the arm in a direction generally parallel to the vertical direction, and a horizontal movement assembly having a motor adapted to position the arm in a direction generally parallel to the first direction a motor in the direction, and a third robot arm assembly disposed between the first process frame and the second process frame, the third robot arm assembly is adapted to transfer the substrate from the first side to the first process frame The substrate processing chamber in or transferred from the first side to the substrate processing chamber in the second processing rack, wherein the third robotic arm assembly includes a robotic arm adapted to place the substrate in a generally Received at one or more points in the horizontal plane, a vertical movement assembly having a motor adapted to position the arm in a direction generally parallel to the vertical direction, and a horizontal movement assembly having a motor adapted to position the arm A motor in a direction generally parallel to the first direction.

Embodiments of the present invention further provide a cluster tool for processing a substrate comprising a first processing rack containing two or more clusters of two or more vertically stacked substrate processing chambers , wherein the two or more groups of two or more vertically stacked substrate processing chambers have a first side aligned along a first direction for accessing the substrate processing chamber through the first side chamber, and a second side arranged along a second direction for accessing the substrate processing chamber through the second side, a first robotic arm assembly adapted to transfer a substrate from the first side to the second side A substrate processing chamber in a processing rack, wherein the first robot arm assembly includes a first robot arm adapted to position a substrate at one or more points generally accommodated in a horizontal plane, a vertical a movement assembly having a motor adapted to position the first robotic arm in a direction generally parallel to the vertical direction, and a horizontal movement assembly having a motor adapted to position the first robotic arm in a direction generally parallel to the first direction a motor in direction, and a second robotic arm assembly adapted to transfer a substrate from the second side to a substrate processing chamber in the first processing rack, wherein the second robotic arm assembly includes a second robotic arm, The second robotic arm is adapted to position the substrate at one or more points generally accommodated in a horizontal plane, move the assembly vertically, and has an orientation adapted to position the second robotic arm in a direction generally parallel to the vertical direction A motor, and a horizontal movement assembly, having a motor adapted to position the second robotic arm in an orientation generally parallel to the second orientation.

Embodiments of the present invention further provide a cluster tool for processing substrates, including two or more substrate processing chambers disposed in the cluster tool, and a first robotic arm assembly, the first robotic arm assembly is adapted to process the substrate The material is transferred to the two or more substrate processing chambers, wherein the first robotic arm assembly includes a first robotic arm adapted to place the substrate in a first orientation, wherein the first robotic arm The arm includes a robotic arm blade having a first end and a substrate receiving surface adapted to receive and transport a substrate, a first connecting member having a first pivot point and a second pivot point pivot point, motor, is rotationally connected with the first connecting member at the second pivot point, and a first gear (gear), is connected with the first end of the blade of the robotic arm and is connected with the first pivot point at the first pivot point. A first link member is rotatably connected, and a second gear is rotatably connected to the first gear and concentrically aligned with a second pivot point of the first link member, wherein the second gear has a gear ratio to the first gear between Between about 3:1 and about 4:3, a first movement assembly adapted to position the first robotic arm in a second direction generally perpendicular to the first direction, and a second movement assembly adapted to position the The motor of the first mechanical arm is disposed in a third direction generally perpendicular to the second direction.

Embodiments of the present invention further provide a cluster tool for processing a substrate comprising a first processing rack containing two or more clusters of two or more vertically stacked substrate processing chambers , wherein the two or more groups of two or more vertically stacked substrate processing chambers have a first side aligned along a first direction for accessing the substrate processing chamber through the first side chamber, and a second side arranged along a second direction for accessing the substrate processing chamber through the second side, a first robotic arm assembly adapted to transfer a substrate from the first side to the second side A substrate processing chamber in a processing rack, wherein the first robot arm assembly includes a first robot arm adapted to position a substrate at one or more points generally accommodated in a horizontal plane, a vertical a movement assembly having a motor adapted to position the first robotic arm in a direction generally parallel to the vertical direction, and a horizontal movement assembly having a motor adapted to position the first robotic arm in a direction generally parallel to the first direction a motor in direction, and a second robotic arm assembly adapted to transfer a substrate from the second side to a substrate processing chamber in the first processing rack, wherein the second robotic arm assembly includes a second robotic arm, The second robotic arm is adapted to position the substrate at one or more points generally accommodated in a horizontal plane, move the assembly vertically, and has an orientation adapted to position the second robotic arm in a direction generally parallel to the vertical direction A motor, and a horizontal movement assembly, having a motor adapted to position the second robotic arm in an orientation generally parallel to the second orientation.

Embodiments of the present invention further provide a cluster tool for processing substrates, including two or more substrate processing chambers disposed in the cluster tool, and a first robotic arm assembly, the first robotic arm assembly is adapted to process the substrate The material is transferred to the two or more substrate processing chambers, wherein the first robotic arm assembly includes a first robotic arm adapted to place the substrate in a first orientation, wherein the first robotic arm The arm includes a robotic arm blade having a first end and a substrate receiving surface adapted to receive and transport a substrate, a first connecting member having a first pivot point and a second pivot point A pivot point, a motor, is rotationally connected to the first connecting member at the second pivot point, a first gear, is connected to the first end of the arm blade and is connected to the first pivot point at the first pivot point A member is rotationally connected, and a second gear is rotationally connected to the first gear and is concentrically aligned with a second pivot point of the first connecting member, wherein the gear ratio of the second gear to the first gear is between about 3: Between 1 and about 4:3, a first moving assembly adapted to position the first robotic arm in a second direction generally perpendicular to the first direction, and a second moving assembly having a A motor is disposed on the first robotic arm in a third orientation generally perpendicular to the second orientation.

Embodiments of the present invention further provide an apparatus for transferring a substrate within a cluster tool comprising a first robotic arm adapted to position the substrate at one or more points generally accommodated in a first plane Above, a vertical movement assembly comprising a slide rail assembly containing a block connected to a vertically positioned linear track, a support plate connected to the block and the first robotic arm, and actuating an actuator adapted to vertically place the support plate in a vertical position along the linear track, and a horizontal movement assembly connected to the vertical movement assembly and having a horizontal actuator, the horizontal movement assembly The actuator is suitable for disposing the first mechanical arm and the vertical movement assembly in the horizontal direction.

Embodiments of the present invention further provide an apparatus for transferring a substrate within a cluster tool comprising a first robotic arm adapted to position the substrate at one or more points generally accommodated in a first plane On, the vertical movement assembly includes an actuator assembly, the actuator assembly is suitable for vertically setting the first mechanical arm, wherein the actuator assembly further includes a vertical actuator, and the vertical actuator is suitable for vertically setting the first mechanical arm a first robotic arm, and a vertical slide adapted to guide the first robotic arm as the vertical actuator mobilizes the first robotic arm, an enclosure having one or more walls forming an interior region, the interior region surrounds at least one component selected from the group consisting of a vertical actuator and the vertical slide rail, and a fan in fluid communication with the interior region, the fan adapted to generate a negative pressure within the enclosure, and a horizontal movement component, There is a horizontal actuator and a horizontal guide member adapted to position the first robotic arm in a direction generally parallel to the first side of the first processing rack.

Embodiments of the present invention further provide an apparatus for transferring a substrate within a cluster tool comprising a first robotic arm assembly adapted to position a substrate in a first orientation, wherein the first robotic arm The assembly includes a robot blade having a first end and a substrate receiving surface, a first connecting member having a first pivot point and a second pivot point, a first gear, and a second connecting member of the robot blade. connected at one end and rotatably connected to the first connecting member at the first pivot point, a second gear rotatably connected to the first gear and aligned with a second pivot point of the first connecting member, and a first a motor rotatably connected to the first link member, wherein the first motor is adapted to set the substrate receiving surface by rotating the first link member and first gear relative to the second gear, a first moving assembly, the A first movement assembly adapted to position the first robotic arm in a second direction generally perpendicular to the first direction, and a second movement assembly adapted to position the first robotic arm in a direction generally perpendicular to the first direction The second direction is perpendicular to the third direction.

Embodiments of the present invention further provide an apparatus for transferring a substrate within a cluster tool comprising a first robotic arm assembly adapted to position a substrate along an arc generally contained within a first plane At one or more points of the shape, wherein the first robotic arm assembly includes a robotic arm blade having a first end and a substrate receiving surface, and a motor rotatably connected to the first end of the robotic arm blade, the first a movement assembly, the first movement assembly being adapted to position the first robotic arm in a second direction generally perpendicular to the first plane, wherein the first movement assembly comprises an actuator assembly adapted to setting the first mechanical arm vertically, wherein the actuator assembly further includes a vertical actuator adapted to vertically set the first mechanical arm, and a vertical slide rail adapted to move between the vertical The actuator guides the first robotic arm when mobilizing the first robotic arm, enclosed, having one or more walls forming an interior region surrounding at least one vertical actuator and the vertical slide rail. components, and a fan, in fluid communication with the interior region, and adapted to generate a negative pressure within the enclosure, and a second movement assembly, having a second actuator adapted to place the first The robotic arm is disposed in a third direction generally perpendicular to the second direction.

Embodiments of the present invention further provide an apparatus for transferring a substrate within a cluster tool comprising a first robotic arm assembly adapted to position a substrate in a first orientation, wherein the first robotic arm The assembly includes a robotic blade having a first end and a substrate receiving surface, a first gear coupled to the first end of the robotic blade, a second gear rotationally coupled to the first gear, and a first motor coupled to the A first gear is rotatably connected, and a second motor is rotatably connected to the second gear, wherein the second motor is adapted to rotate the second gear relative to the first gear to create a variable gear ratio, and the first movement Assemblies, the first movement assembly is adapted to dispose the first robotic arm in a second direction generally perpendicular to the first direction.

Embodiments of the present invention further provide an apparatus for transferring a substrate, comprising a base having a substrate supporting surface, a reaction member disposed on the base, a contact member, and a device adapted to push the substrate toward the reaction member. An actuator is connected, and a detent member adapted to generally inhibit movement of the contact member when the contact member is arranged to urge the substrate towards the reaction member.

Embodiments of the present invention further provide an apparatus for transferring substrates, comprising a base having a support surface, a reaction member disposed on the base, an actuator connected to the base, a contact member, and the actuating The actuator is connected, wherein the actuator is adapted to place the contact member towards the support surface and is pushed by the edge of the substrate supporting the edge of the reaction member, the brake member assembly includes the brake member, and the brake actuator An actuating member, wherein the brake actuating member is adapted to push the brake member toward the contact member to create a limiting force that generally inhibits movement of the contact member during substrate transfer.

Embodiments of the present invention further provide an apparatus for transferring a substrate comprising a base having a support surface, a reaction member disposed on the base, a contact member assembly including an actuator, and a contact member having a substrate contact a surface and a compliant member disposed between the contact surface and the actuator, wherein the actuator is adapted to push the contact surface toward a substrate disposed against the reaction member surface, and brake a member assembly comprising a brake member, and a brake actuation member adapted to urge the brake member toward the contact member to inhibit movement of the contact member during substrate transfer, and an inductor connected to the contact member, Wherein the sensor is suitable for sensing the position of the contact surface.

An embodiment of the present invention further provides an apparatus for conveying a substrate, comprising a robotic arm assembly, including a first robotic arm, the first robotic arm is adapted to convey a substrate disposed on a blade of the robotic arm in a first direction, the first a movement assembly having an actuator adapted to position the first robotic arm in a second orientation, and a second movement assembly connected to the first movement assembly and having a second actuator, the A second actuator is adapted to dispose the first robot arm and the first moving assembly in a third direction generally perpendicular to the second direction, and a substrate grabbing device connected to the blade of the robot arm, wherein the base The material grabbing device is suitable for supporting the substrate, and contains a reaction member, which is arranged on the blade of the robot arm, an actuator, which is connected with the blade of the robot arm, and a contact member, which is connected with the actuator, wherein the actuator is suitable for Constraining the substrate by pushing the contact member toward an edge of the substrate disposed between the contact member and the reaction member, and a brake member assembly, comprising a brake member, and a brake actuation member, adapted to The brake member is urged toward the contact member to inhibit movement of the contact member during transfer of the substrate.

An embodiment of the present invention further provides a method for transporting a substrate, comprising placing the substrate on a substrate supporting device, interposed between a substrate contacting member and a reaction member disposed on the substrate supporting device, using a and an actuator to generate a substrate gripping force that urges the substrate contacting member toward the substrate and the substrate toward the reaction member, and a restraining force suitable for transporting the substrate The movement of the substrate contacting member is restrained by a brake assembly during substrate removal.

Embodiments of the present invention further provide a method for transporting a substrate, comprising placing the substrate on a substrate supporting device, and interposing a substrate contacting member and a reaction member disposed on the substrate supporting device, with The actuator of the connector is connected to the substrate contact member, and the connector connects the actuator to the substrate contact member, and the actuator applies a gripping force to the substrate, and the actuator will The substrate contacting member pushes toward the substrate and pushes the substrate toward the reactive member, storing energy in a compliant member disposed between the substrate contacting member and the connector, upon application of the The gripping force then inhibits movement of the connector to minimize the amount of variation in the gripping force during transfer of the substrate, and senses by sensing movement of the substrate contact surface due to reduced energy stored in the compliant member. There should be movement of the substrate.

Embodiments of the present invention further provide a method for transferring a substrate, comprising receiving a substrate disposed in a first process chamber on a robotic arm substrate support, wherein the step of receiving the substrate comprises disposing the substrate on On the substrate support of the robotic arm, between a substrate contact member and a reaction member disposed on the substrate support of the robotic arm, a substrate gripping force is generated using an actuator that contacts the substrate a member pushes toward the substrate and pushes the substrate toward the reaction member, and a brake assembly is provided to generate a restraining force that inhibits movement of the substrate contact member during transfer of the substrate, and the first robotic arm assembly moves The substrate and the robotic arm substrate support are transported from a position within the first process chamber to a position within a second process chamber disposed along a first direction relative to the first process chamber at a distance, the first robotic arm assembly is adapted to position the substrate in a desired position in the first direction, and in a desired position in a second direction, wherein the second direction is generally aligned with the first direction vertical.

Embodiments of the present invention further provide a method of transferring a substrate in a cluster tool, comprising transferring the substrate to a first array of process chambers disposed along a first direction using a first robotic arm assembly, the first robotic arm assembly The assembly is adapted to place the substrate in a desired position in the first direction and in a desired position in a second direction, wherein the second direction is generally perpendicular to the first direction, using a second robotic arm assembly to place the substrate in a desired position. The material is transported to a second processing chamber array arranged along the first direction, the second robotic arm assembly is adapted to place the substrate at a desired position in the first direction, and set it at a desired position in the second direction position, and transfer the substrate to the first and second arrays of processing chambers disposed along the first direction using a third robotic arm assembly adapted to place the substrate in the first direction, and is set at the expected position of the second direction.

Embodiments of the present invention further provide a method for transferring a substrate in a cluster tool, comprising using a first robotic arm assembly to transfer a substrate from a first through chamber to a first process chamber disposed along a first direction array, the first robotic arm assembly is adapted to place the substrate at a desired location in the first direction and in a desired location in a second direction, wherein the second direction is generally perpendicular to the first direction, using a second robotic arm assembly for transferring the substrate from the first flow-through chamber to the first array of process chambers, the second robotic arm assembly being adapted to place the substrate in a desired position in the first direction, and disposed at a desired position in a second direction, and transferring substrates from a substrate magazine to the first through-chamber using a front-end robotic arm disposed within a front-end assembly, wherein the front-end assembly is substantially the same as containing the first process The transfer area of the array of chambers, the first robot assembly, and the second robot assembly are contiguous.

Description of drawings

So that the manner in which the above-described features of the invention can be seen in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the Examples, some of which are illustrated in the accompanying drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.

Figure 1A is an isometric view illustrating one embodiment of the cluster tool of the present invention;

Figure 1B is a plan view of the process system shown in Figure 1A according to the present invention;

FIG. 1C is a side view illustrating an embodiment of a first process frame 60 according to the present invention;

FIG. 1D is a side view illustrating an embodiment of a second process rack 80 according to the present invention;

Figure 1E is a plan view of the process system shown in Figure 1B according to the present invention;

FIG. 1F illustrates one embodiment of a process sequence containing several process recipe steps that may be used with various embodiments of the cluster tools described herein;

FIG. 1G is a plan view illustrating the process system shown in FIG. 1B and showing a substrate transport path through the cluster tool following the process sequence shown in FIG. 1F ;

Figure 2A is a plan view of a process system according to the present invention;

Figure 2B is a plan view of the process system according to the present invention shown in Figure 2A;

FIG. 2C is a plan view of the processing system shown in FIG. 2B and illustrates a substrate transport path through the cluster tool following the process sequence shown in FIG. 1F ;

3A is a plan view of a process system according to the present invention;

FIG. 3B is a plan view of the processing system shown in FIG. 3A and illustrates a substrate transport path through the cluster tool following the process sequence shown in FIG. 1F ;

Figure 4A is a plan view of a process system according to the present invention;

FIG. 4B is a plan view of the processing system shown in FIG. 4A and illustrates a substrate transport path through the cluster tool following the process sequence shown in FIG. 1F ;

Figure 5A is a plan view of a process system according to the present invention;

FIG. 5B is a plan view of the processing system shown in FIG. 5A and illustrates a substrate transport path through the cluster tool following the process sequence shown in FIG. 1F ;

Figure 6A is a plan view of a process system according to the present invention;

6B is a plan view of the process system shown in FIG. 6A and shows two possible substrate transfer paths through the cluster tool following the process sequence shown in FIG. 1F ;

6C is a plan view of a process system according to the present invention;

6D is a plan view of the process system shown in FIG. 6C and shows two possible substrate transfer paths through the cluster tool following the process sequence shown in FIG. 1F ;

Figure 7A is a side view of one embodiment of an exchange chamber according to the present invention;

7B is a plan view of the process system shown in FIG. 1B according to the present invention;

FIG. 8A is an isometric view showing another embodiment of the cluster tool shown in FIG. 1A with an attached protective cover in accordance with the present invention; FIG.

8B is a cross-sectional view of the cluster tool shown in FIG. 8A in accordance with the present invention;

Figure 8C is a cross-sectional view of one configuration in accordance with the present invention;

Figure 9A is an isometric view illustrating one embodiment of a robotic arm that may be adapted to transfer substrates in various embodiments of the cluster tool;

Figure 10A is an isometric view illustrating one embodiment of a robotic arm hardware assembly having a single robotic arm assembly in accordance with the present invention;

Figure 10B is an isometric view illustrating one embodiment of a robotic arm hardware assembly having a dual robotic arm assembly in accordance with the present invention;

10C is a cross-sectional view of one embodiment of the robotic arm hardware assembly shown in FIG. 10A in accordance with the present invention;

Figure 10D is a cross-sectional view of one embodiment of a robotic arm hardware assembly in accordance with the present invention;

Figure 10E is a cross-sectional view of one embodiment of the robotic arm hardware assembly shown in Figure 10A in accordance with the present invention;

11A is a plan view of one embodiment of a robotic arm assembly according to the present invention, showing several positions of the robotic arm blades as they transport substrates into a process chamber;

Figure 11B shows several possible paths of the center point of the substrate as it is transported into the process chamber according to the present invention;

11C is a plan view of one embodiment of a robotic arm assembly according to the present invention, showing several positions of the robotic arm blades as they transport substrates into a process chamber;

11D is a plan view of one embodiment of a robot assembly according to the present invention, showing several positions of the robot blade as it transfers a substrate into a process chamber;

11E is a plan view of one embodiment of a robotic arm assembly according to the present invention, showing several positions of the robotic arm blades as they transport substrates into a process chamber;

11F is a plan view of one embodiment of a robotic arm assembly according to the present invention, showing several positions of the robotic arm blades as they transfer substrates into a process chamber;

11G is a plan view of one embodiment of a robotic arm assembly according to the present invention, showing several positions of the robotic arm blades as they transport substrates into a process chamber;

11H is a plan view of one embodiment of a robot assembly according to the present invention, showing several positions of the robot blade as it transfers a substrate into a process chamber;

11I is a plan view of one embodiment of a robotic arm assembly according to the present invention, showing several positions of the robotic arm blades as they transport substrates into a process chamber;

Figure 11J is a plan view of one embodiment of a robotic arm assembly according to the present invention;

FIG. 11K is a plan view of a conventional SCARA manipulator disposed near a manipulator assembly of a process rack;

12A is a cross-sectional view of the horizontal movement assembly shown in FIG. 9A according to the present invention;

12B is a cross-sectional view of the horizontal movement assembly shown in FIG. 9A according to the present invention;

12C is a cross-sectional view of the horizontal movement assembly shown in FIG. 9A according to the present invention;

13A is a cross-sectional view of the vertical movement assembly shown in FIG. 9A according to the present invention;

13B is an isometric view illustrating one embodiment of the robotic arm shown in FIG. 13A that may be adapted to transfer substrates in various embodiments of the cluster tool;

Figure 14A is an isometric view illustrating one embodiment of a robotic arm that may be adapted to transfer substrates in various embodiments of the cluster tool;

Figure 15A is an isometric view illustrating one embodiment of a robotic arm that may be adapted to transfer substrates in various embodiments of the cluster tool;

Figure 16A illustrates a plan view of one embodiment of a robot blade assembly that may be adapted to transfer substrates in various embodiments of the cluster tool;

16B illustrates a side cross-sectional view of one embodiment of the robot blade assembly shown in FIG. 16A that may be adapted to transfer substrates in various embodiments of the cluster tool;

Figure 16C illustrates a plan view of one embodiment of a robot blade assembly that may be adapted to transfer substrates in various embodiments of the cluster tool;

Figure 16D shows a plan view of one embodiment of a robot blade assembly that may be adapted to transfer substrates in various embodiments of the cluster tool.

Detailed ways

The present invention generally provides an apparatus and method for processing substrates using a multi-chamber processing system, such as a cluster tool, that has increased system throughput, enhanced system reliability, improved device yield performance, and Higher repeatability of wafer process history (or wafer history), and smaller footprint. In one embodiment, the cluster tool is adapted to perform an automated photoresist coating and development process in which a substrate is coated with a photosensitive material and then conveyed to a stepper/scanner that A sighting device exposes the photosensitive material to some type of radiation to form a pattern on the photosensitive material, followed by removal of portions of the photosensitive material in a development process performed within the cluster tool. In another embodiment, the cluster tool is adapted to perform a wet/clean process sequence, wherein a number of substrate cleaning processes are performed on a substrate in the cluster tool.

Figures 1-6 illustrate some of several robotic arm and process chamber configurations that may be used with various embodiments of the present invention. Various embodiments of the cluster tool 10 typically use two or more robotic arms configured in a parallel process configuration to transfer between various process chambers that reside within the process rack (eg, components 60, 80, etc.) The substrate on which the intended process sequence can thus be performed. In one embodiment, the parallel process configuration comprises two or more robotic arm assemblies 11 (elements 11A, 11B and 11C of FIGS. direction, the horizontal direction is the conveying direction (x-direction) and the direction perpendicular to the conveying direction (y-direction), and thus can be left in the process rack (such as components 60 and 80) along the conveying direction. The substrates are processed in individual process chambers arranged in a single direction. An advantage of the parallel process configuration is that if one of the robotic arms becomes inoperable or removed for maintenance, the system can continue to process substrates using the other robotic arms remaining in the system. In general, the various embodiments described herein are advantageous in that each row or group of substrate processing chambers has two or more service robots to provide increased throughput and enhanced system reliability. In addition, embodiments described herein are generally configured to minimize and control particulate generation by the substrate transport mechanism to avoid device yield and substrate debris issues that can affect the CoO of the cluster tool. Another advantage of this configuration method is that the flexible and modular architecture allows the user to configure the number of process chambers, process racks, and process manipulators required to meet the user's desired throughput. While FIGS. 1-6 illustrate one embodiment of a robotic arm assembly 11 that may be used to perform aspects of the present invention, other types of robotic arm assemblies 11 may be adapted to perform the same substrate transfer and setup functions without departure from the essential scope of the invention.

First cluster tool configuration

A. System configuration

FIG. 1A is an isometric view of one embodiment of a cluster tool 10 and illustrates several aspects of the invention that may be used to benefit. FIG. 1A shows an embodiment of the cluster tool 10 comprising three robotic arms and an external module 5 adapted to access individual process chambers vertically stacked within a first process rack 60 and a second process rack 80. . In one aspect, when the cluster tool 10 is used to complete the lithography process sequence, the external module 5 connected to the rear area 45 (not shown in FIG. 1A ), may be a stepper/scanner, Some additional exposed process steps are performed. One embodiment of the cluster tool 10 , as shown in FIG. 1A , includes a front-end module 24 and a central module 25 .

FIG. 1B is a plan view of the embodiment of the cluster tool 10 shown in FIG. 1A . The front-end module 24 generally contains one or more wafer cassette assemblies 105 (eg, items 105A-D) and a front-end robot assembly 15 (FIG. 1B). The one or more wafer pod assemblies 105, or front opening wafer pods (FOUPs), are generally adapted to house one or more wafer cassette assemblies that may contain one or more substrates "W" or wafers to be processed within the cluster tool 10. Wafer cassette 106 for wafers. In one aspect, the front-end module 24 also contains one or more delivery locations 9 (eg, elements 9A-C of FIG. 1B ).

In one aspect, the central module 25 has a first robotic arm assembly 11A, a second robotic arm assembly 11B, a third robotic arm assembly 11C, a rear robotic arm assembly 40 , a first process rack 60 and a second process rack 80 . The first process rack 60 and the second process rack 80 contain various process chambers (such as coater/developer chambers, bake chambers, cooling chambers, wet clean chambers, etc., which will be discussed below ( 1C-D)), the chambers are adapted to perform various process steps in a substrate process sequence.

FIGS. 1C and 1D show the side of one embodiment of the first process rack 60 and the second process rack 80 when viewed from the side closest to side 60A facing the first process rack 60 and the second process rack 80. view, and thus would conform to the diagram shown in Figure 1-6. The first process rack 60 and the second process rack 80 generally contain one or more sets of vertically stacked process chambers, which are suitable for performing some expected semiconductor or flat panel display device manufacturing process steps on the substrate. For example, in FIG. 1C , the first process rack 60 has five groups, or five columns, of process chambers stacked vertically. Generally, these device fabrication process steps may include depositing material on the substrate surface, cleaning the substrate surface, etching the substrate surface, or exposing the substrate to some type of radiation to induce Physical or chemical changes in one or more areas on the body. In one embodiment, the first process rack 60 and the second process rack 80 contain one or more process chambers adapted to perform one or more photolithography process steps. In one aspect, process racks 60 and 80 may contain one or more coater/developer chambers 160, one or more cooling chambers 180, one or more bake chambers 190, one or more wafer edge exposure bulb removal (OEBR) chamber 162, one or more post-exposure bake (PEB) chambers 130, one or more support chambers 165, an integrated bake/cool chamber 800, and/or one or more A plurality of hexamethyldisilazane (HMDS) process chambers 170 . Exemplary coater/developer chambers, cooling chambers, bake chambers, OEBR chambers, PEB chambers, support chambers, integrated bake/developer chambers that may be adapted to benefit from one or more aspects of the present invention Cooling chambers and/or HMDS process chambers are further described in commonly-assigned U.S. patent application Ser. No. 11/112,281, filed April 22, 2005, which is hereby incorporated by reference in its entirety to the extent not disclosed herein. To the extent inconsistent, the claimed invention is incorporated herein. Examples of integrated baking/cooling chambers that may be adapted to benefit from one or more aspects of the present invention are further co-assigned U.S. patent application Ser. No. 11/111,154, filed April 11, 2005 and Described in US Patent Application Serial No. 11/111,353, which is hereby incorporated by reference in its entirety to the extent not inconsistent with the claimed invention. Examples of process chambers and/or systems that may be adapted to perform one or more cleaning processes on a substrate and that may be adapted to benefit from one or more aspects of the present invention are further co-applied on June 25, 2001 Assigned U.S. Special Application No. 09/891,849 and U.S. Patent Application No. 09/945,454 filed August 31, 2001, which are hereby incorporated by reference in their entirety to the extent that incorporated herein to the extent inconsistent with the present invention.

In one embodiment, as shown in FIG. 1C , where the cluster tool 10 is adapted to perform lithography-type processes, the first process rack 60 may have eight coater/developer chambers 160 (labeled CD1- 8), eighteen cooling chambers 180 (designated as C1-18), eight baking chambers 190 (designated as B1-8), six PEB chambers 130 (designated as PEB1-6), two OEBR chamber 162 (designated 162) and/or six HMDS process chambers 170 (designated DP1-6). In one embodiment, as shown in FIG. 1D , where the cluster tool 10 is adapted to perform photolithography-type processes, the second process rack 80 may have eight coater/developer chambers 160 (labeled CD1- 8), six integrated bake/cool chambers 800 (designated BC1-6), six HMDS process chambers 170 (designated DP1-6) and/or six support chambers 165 (designated S1-6) 6). The orientation, location, type and number of process chambers shown in Figures 1C-D are not intended to limit the scope of the invention, but are only intended to illustrate one embodiment of the invention.

Referring to FIG. 1B, in one embodiment, the front end manipulator assembly 15 is adapted to operate between a wafer cassette 106 housed within a wafer cassette assembly 105 (see devices 105A-D) and the one or more transfer locations 9 (see FIG. 1B transfers substrates between transfer positions 9A-C). In another embodiment, the front-end manipulator assembly 15 is adapted to be adjacent to the front-end module 24 in the wafer cassette 106 installed in the wafer cassette assembly 105 and in the first process rack 60 or a second process rack 80 The substrate is transferred between one or more process chambers. The front-end robot assembly 15 generally includes a horizontal movement assembly 15A and a robot arm 15B that combine to place substrates in desired horizontal and/or vertical positions within the front-end module 24, or in the central module 25 within the adjacent position. The front end robot assembly 15 is adapted to transfer one or more substrates using one or more robot blades 15C by using commands from the system controller 101 (discussed below). In one procedure, the front end robot assembly 15 is adapted to transfer substrates from the cassette 106 to one of the transfer locations 9 (eg, devices 9A-C of FIG. 1B ). Typically, the transfer location is a substrate staging area, which may contain a transfer processing chamber that has similar features to the exchange chamber 533 (see FIG. 7A ) or conventional substrate cassettes 106, And it is possible to receive substrates from a first robot arm so that the substrate can be removed and rearranged by a second robot arm. In one aspect, a transfer process chamber installed in a transfer location may be adapted to perform one or more process steps within an intended process sequence, for example, an HMDS process step or a cooling/decreasing process step or substrate notch alignment ( notch align). In one aspect, each transfer location (elements 9A-C of FIG. 1B ) can be controlled by the central manipulator assembly (ie, first manipulator assembly 11A, second manipulator assembly 11B, and third manipulator assembly 11C). of each access.

1A-B, the first robotic arm assembly 11A, the second robotic arm assembly 11B, and the third robotic arm assembly 11C are adapted to transfer substrates to be accommodated in the first process rack 60 and the second process rack Each process chamber in 80. In one embodiment, for transferring substrates in the cluster tool 10, the first robot assembly 11A, the second robot assembly 11B, and the third robot assembly 11C have similarly configured robot assemblies 11, Each of these has at least one horizontal movement assembly 90 , vertical movement assembly 95 , and robotic arm hardware assembly 85 that communicate with the system controller 101 . In one aspect, the side 60B of the first processing rack 60 and the side 80A of the second processing rack 80 are all along the respective manipulator assemblies (ie, the first manipulator assembly 11A, the second manipulator assembly 11B, and The horizontal movement assemblies 90 (described below) of each of the third robot arm assemblies 11C) are aligned in parallel directions.

The system controller 101 is adapted to control the position and movement of various components used to complete the transfer process. The system controller 101 is generally designed to facilitate the control and automation of the overall system, and typically contains a central processing unit (CPU) (not shown), memory (not shown), and support circuitry (or input/output) (not shown). Shows). The CPU may be used in an industrial setting to control various system functions, chamber processes and support hardware (e.g., detectors, robotic arms, motors, gas source hardware, etc.) and to monitor the system and chamber processes (e.g., chamber temperature, process program throughput, chamber process time, input/output signals, etc.) of any type of computer processor. The memory is connected to the CPU and can be one or more types of readily accessible memory such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other type of digital storage, local or remotely. Software instructions and data can be encoded and stored in the memory to instruct the CPU. The support circuitry is also coupled to the CPU to support the processor in a conventional manner. The support circuits may include cache memory, power supplies, clock circuits, input/output circuits, subsystems, and the like. Programs (or computer instructions) readable by the system controller 101 determine what tasks can be performed on a substrate. Preferably, the program is software readable by the system controller 101, and the software includes codes used to execute codes related to monitoring and executing the process program work and each chamber process recipe step.

Referring to FIG. 1B , in one aspect of the present invention, the first robotic arm assembly 11A is adapted to access and transfer between the process chambers in the first process rack 60 from at least one side, such as the side 60B. Substrate. In one aspect, the third robot assembly 11C is adapted to access and transfer substrates between the process chambers within the second process rack 80 from at least one side, such as the side 80A. In one aspect, the second robotic arm assembly 11B is adapted to access and transfer substrates between the process chambers within the first process rack 60 from side 60B, and from side 80A in the second process rack 80 Substrates are transferred between the process chambers within the process chamber. FIG. 1E shows a plan view of the embodiment of the cluster tool 10 shown in FIG. 1B , where the robot blade 87 of the second robot assembly 11B extends through side 60B into a process chamber within the first process rack 60 . The ability to extend the robotic blade 87 into and retract the robotic blade 87 from the process chamber is typically provided by components housed within the horizontal movement assembly 90, vertical movement assembly 95, and robotic arm hardware assembly 85. Cooperative movement of components is accomplished by using commands from the system controller 101 . The ability to "overlay" two or more robotic arms on each other is advantageous, such as the first robotic arm assembly 11A and the second robotic arm assembly 11B, or the second robotic arm assembly 11B and the third robotic arm assembly 11B. arm assembly 11C, as this capability allows for substrate transfer redundancy which can improve the cluster reliability, uptime, and also increase substrate throughput. Robot "overlap" is generally the ability of two or more robots to access and/or independently transfer substrates between the same process chambers of the rack. The ability for two or more robots to redundantly access a process chamber can be an important aspect to prevent system robot transfer bottlenecks, since this capability allows an underutilized robot to assist a robot that is limiting the system's throughput. As a result, substrate throughput can be increased, wafer history of substrates can be made more repeatable, and system reliability can be improved by balancing the workload of each robotic arm during a process sequence.

In one aspect of the invention, individual overlapping manipulator assemblies (such as elements 11A, 11B, 11C, 11D, 11E, etc. in FIGS. Adjacent (z-direction) process chambers. For example, when using the cluster tool configuration method shown in FIGS. 1B and 1C , the first robotic arm assembly 11A can access the process chamber CD6 in the first process rack 60, while the second robotic arm assembly 11B can simultaneously Access process chambers CD5 without bumping into or interfering with each other. In another example, when using the cluster tool configuration shown in FIGS. Components 11B can access process chamber DP6 simultaneously without colliding or interfering with each other.

In one aspect, the system controller 101 is adapted to adjust the transfer of the substrate through the cluster tool based on the calculated optimal throughput, or to work around a process chamber that is not functioning. The feature of the system controller 101 that allows for optimized throughput is called the logical scheduler. The logical scheduler prioritizes job and substrate movement based on input from the user and various sensors throughout the cluster tool. The logical scheduler may be adapted to view a list of future jobs requested by each robot (e.g., front robot assembly 15, first robot assembly 11A, second robot assembly 11B, third robot assembly 11C, etc.) , the future work list is stored in the memory of the system controller 101 to help balance the load assigned to each robotic arm. Using the system controller 101 to maximize the use of the cluster tool improves the CoO of the cluster tool, makes wafer history more repeatable, and improves the reliability of the cluster tool.

In one aspect, the system controller 101 is also adapted to avoid collisions between the individual overlapping robotic arms and optimize substrate throughput. In one aspect, the system controller 101 is further programmed to monitor and control the movement of the horizontal movement assembly 90, vertical movement assembly 95, and robotic arm hardware assembly 85 of all robotic arms within the cluster tool to avoid Collisions between them, and improve system throughput by allowing all robotic arms to move simultaneously. This so-called "collision avoidance system" can be implemented in many ways, but generally the system controller 101 monitors each Position of a robotic arm to avoid collisions. In one aspect, the system controller is adapted to actively vary the movement and/or route of each robotic arm during the transfer process to avoid collisions and minimize transfer path length.

B. Transmission program example

FIG. 1F shows an example of a substrate processing sequence 500 through the cluster tool 10 in which some process steps (eg, components 501 - 520 ) may be performed after each of transfer steps A ₁ -A ₁₀ has been completed. One or more of the process steps 501-520 may entail performing vacuum and/or fluid processing steps on the substrate to deposit material on the substrate surface, clean the substrate surface, etch the substrate surface, or otherwise A substrate is exposed to some type of radiation to induce physical or chemical changes in one or more areas on the substrate. Examples of typical processes that can be performed are photolithography process steps, substrate cleaning process steps, CVD deposition steps, ALD deposition steps, electroplating process steps, or electroless plating process steps. FIG. 1G illustrates an example of transfer steps that a substrate may follow as it is transferred through a cluster tool configured like the cluster tool shown in FIG. 1B following the process sequence 500 described in FIG. 1F . In this embodiment, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the chamber located at the transfer position 9C along the transfer path _A1 , so that The transferring step 502 is performed on the substrate. In one embodiment, the transfer step 502 must place or leave the substrate so that another robotic arm can pick up the substrate from the transfer location 9C. Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 along the transfer path _A2 by the third robotic arm assembly 11C, where the process step 504 is completed on the substrate. After the processing step 504 is completed, the substrate is then transferred to the second processing chamber 532 by the third robotic arm assembly 11C along the transfer path _A3 . After performing the process step 506, the substrate is then transported by the second robotic arm assembly 11B, following the transport path _A4 , to the exchange chamber 533 (FIG. 7A). After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 , following the transfer path A ₆ , to the exchange chamber 533 , where the processing step 512 is performed. In one embodiment, the process steps 508 and 512 must set or leave the substrate so that another robotic arm can pick up the substrate from the exchange chamber 533 . After performing the processing step 512 , the second robotic arm assembly 11B is then used to transfer the substrate along the transfer path A ₇ to the processing chamber 534 , where the processing step 514 is performed. The substrate is then transported along the transport path A ₈ by the first robotic arm assembly 11A. After the process step 516 is completed, the first robotic arm assembly _11A transfers the substrate to the transfer chamber disposed at the transfer position 9A along the transfer path A9. In one embodiment, the transfer step 518 must place or leave the substrate so that another robotic arm can pick up the substrate from the transfer location 9A. After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

In one embodiment, process steps 504, 506, 510, 514, and 516 are a photoresist coating step, a bake/cool step, an exposure step performed in a stepper/scanner module, a post-exposure bake, respectively. /cooling step, and development step, which are further described in commonly assigned U.S. Patent Application No. 11/112,281, filed April 22, 2005, which is hereby incorporated by reference herein . The bake/cool step and the post-exposure bake/cool step can be performed within a single process chamber, or an internal robotic arm (not shown) can be used in an integrated bake/cool chamber in the bake and cool chamber. Interval transmission. While FIGS. 1F-G illustrate examples of process sequences that may be used to process substrates within the cluster tool 10, more or less complex process sequences and/or transfer sequences may be implemented without departing from the basic principles of the present invention. scope.

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed between locations or process chambers within the cluster tool 10 .

Second cluster tool configuration

A. System configuration

2A is a plan view of one embodiment of a cluster tool 10 having a front end robot assembly 15, a back end robot assembly 40, a system controller 101, and four process racks (devices 60 and 80) positioned between two process racks (devices 60 and 80). robotic arm assemblies 11 (FIGS. 9-11; elements 11A, 11B, 11C, and 11D of FIG. 2A), all adapted to perform at least one of the intended substrate processing procedures utilizing the respective process chambers within the processing rack. aspect. The embodiment shown in Figure 2A is identical to the configuration shown in Figures 1A-F, with the exception of the addition of a fourth robotic arm assembly 11D and transfer location 9D, and thus the same reference numerals are used where appropriate. The cluster tool configuration shown in FIG. 2A is advantageous when substrate throughput is limited by the manipulator, since the addition of a fourth manipulator assembly 11D can assist in unburdening the other manipulators and also create some redundancy, This redundancy allows the system to process substrates if one or more of the central robotic arms is not operational. In one aspect, the side 60B of the first processing rack 60, and the side 80A of the second processing rack 80 are all along with each manipulator assembly (such as the first manipulator assembly 11A, the second manipulator assembly 11B, etc. ) of the horizontal movement assembly 90 (FIGS. 9A and 12A-C) are aligned in a parallel direction.

In one aspect, the first robot assembly 11A is adapted to access and transfer substrates between the process chambers within the first process rack 60 from side 60B. In one aspect, the third robot assembly 11C is adapted to access from side 80A and transfer substrates between the process chambers within the second process rack 80 . In one aspect, the second robotic arm assembly 11B is adapted to access and transfer substrates between the process chambers within the first process rack 60 from side 60B. In one aspect, the fourth robotic arm assembly 11D is adapted to access from side 80A and transfer substrates between the process chambers within the second process rack 80 . In one aspect, the second robot assembly 11B and the fourth robot assembly 11D are further adapted to access the process chambers in the first processing rack 60 from side 60B and access the second processing rack 80 from side 80A. process chamber.

FIG. 2B shows a plan view of the embodiment of the cluster tool 10 shown in FIG. 2A with the robot blade 87 of the second robot assembly 11B extending through side 60B into a process chamber within the first process rack 60 . The ability to extend the manipulator blade 87 into and/or retract the manipulator blade 87 from the process chamber is typically moved in concert with the components of the manipulator assembly 11 housed at the level Movement component 90 , vertical movement component 95 , and robotic arm hardware component 85 are implemented by using commands from the system controller 101 . As noted above, the second robotic arm assembly 11B and the fourth robotic arm assembly 11D together with the system controller 101 can be adapted to allow for "overlap" between each of the robotic arms in the cluster tool, allowing for the system control The controller's logic scheduler prioritizes job and substrate movement based on input from the user and various sensors throughout the cluster tool, and an anti-collision system is also available to allow the robotic arm to optimally way to convey the substrate through the system. Using the system controller 101 to maximize the use of the cluster tool improves the CoO of the cluster tool, makes wafer history more repeatable, and improves system reliability.

B. Transmission program example

FIG. 2C shows an example of a transfer step sequence configured by the cluster tool shown in FIG. 2A that may be used to accomplish the process sequence described in FIG. 1F . In this embodiment, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the chamber located at the transfer position 9C along the transfer path _A1 , so that The transferring step 502 is performed on the substrate. Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 along the transfer path _A2 by the third robotic arm assembly 11C, where the process step 504 is completed on the substrate. After the process step 504 is completed, the substrate is then transported to the second process chamber 532 by the fourth robotic arm assembly 11D following the transport path _A3 . After performing the process step 506 , the substrate is then transferred to the exchange chamber 533 by the fourth robotic arm assembly 11D along the transfer path A ₄ . After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 along the transfer path A ₆ to the exchange chamber 533 ( FIG. 7A ), where the processing step 512 is performed. After performing the processing step 512 , the fourth robot arm assembly 11D is used to transfer the substrate along the transfer path A ₇ to the processing chamber 534 , where the processing step 514 is performed. The substrate is then transported along the transport path A ₈ by the second robotic arm assembly 11B. After the process step 516 is completed, the first robotic arm assembly _11A transfers the substrate to the transfer chamber disposed at the transfer position 9A along the transfer path A9. After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

In one aspect, the transfer path _A7 can be split into two transfer steps that may require the fourth robotic arm assembly 11D to pick up the substrate from the exchange chamber 533 and transfer the substrate to the The fourth transfer position 9D, where the substrate is then picked up by the second robotic arm assembly 11B and transferred to the process chamber 534 . In one aspect, each transfer chamber is accessible by any one of the central manipulator assemblies (i.e., first manipulator assembly 11A, second manipulator assembly 11B, third manipulator assembly 11C, and fourth manipulator assembly 11D). . In another aspect, the second robotic arm assembly 11B is capable of picking up the substrate from the exchange chamber 533 and transferring the substrate to the process chamber 534 .

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed within the cluster tool 10 .

Third Cluster Tool Configuration

A. System configuration

FIG. 3A is a plan view of one embodiment of a cluster tool 10 having a front end robot assembly 15, a back end robot assembly 40, a system controller 101, and three manipulators disposed around two process racks (elements 60 and 80). Robotic arm assemblies 11 (FIGS. 9-11; elements 11A, 11B, and 11C of FIG. 3A), all adapted to perform at least one aspect of a desired substrate processing sequence utilizing each process chamber within the processing rack. The embodiment shown in FIG. 3A is identical to the configuration shown in FIGS. 1A-F , except that the first robotic arm assembly 11A and transfer location 9A are positioned on side 60A of the first process rack 60 and the third robotic arm Assembly 11C and transfer location 9C are provided on side 80B of this second process rack 80 outboard, and therefore the same reference numerals are used where appropriate. An advantage of this cluster tool configuration is that if one of the robotic arms of the central module 25 fails, the system can still use the other two robotic arms to continue processing substrates. This configuration also eliminates, or minimizes, the need for collision avoidance-type control features for the robotic arm to transport the substrate between process chambers mounted within each process rack, since the immediately adjacent placement of the robotic arm is eliminated. entities overlap. Another advantage of this configuration method is that the flexible and modular architecture allows the user to configure the number of process chambers, process racks, and process manipulators required to meet the user's desired throughput.

In this configuration, the first robot assembly 11A is adapted to access the process chambers within the first process rack 60 from side 60A, and the third robot assembly 11C is adapted to access the second chamber from side 80B. The process chamber in the process rack 80, and the second robotic arm assembly 11B is adapted to access the process chamber in the first process rack 60 from side 60B, and access the second process chamber from side 80A The process chamber within rack 80. In one aspect, the side 60B of the first process rack 60 and the side 80A of the second process rack 80 are all along the sides of each robotic arm assembly (ie, the first robotic arm assembly 11A, the second robotic arm assembly 11B, the second robotic arm assembly The horizontal movement assemblies 90 (described below) of the three robotic arm assemblies 11C) are aligned in parallel directions.

The first manipulator assembly 11A, the second manipulator assembly 11B, and the third manipulator assembly 11C together with the system controller 101 may be adapted to allow for "overlap" between the respective manipulators and to allow for the system controller's A logical scheduler prioritizes job and substrate movement based on input from the user and various sensors throughout the cluster tool. Improving CoO using the cluster tool framework and the cooperation of the system controller 101 to maximize the use of the cluster tool can make wafer history more repeatable and improve system reliability.

B. Transmission program example

FIG. 3B shows an example of a sequence of transfer steps through the cluster tool shown in FIG. 3A that may be used to accomplish the process sequence described in FIG. 1F . In this embodiment, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the chamber located at the transfer position 9C along the transfer path _A1 , so that The transferring step 502 is performed on the substrate. Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 along the transfer path _A2 by the third robotic arm assembly 11C, where the process step 504 is completed on the substrate. After the processing step 504 is completed, the substrate is then transferred to the second processing chamber 532 by the third robotic arm assembly 11C along the transfer path _A3 . After performing the process step 506, the substrate is then transported by the second robotic arm assembly 11B, following the transport path _A4 , to the exchange chamber 533 (FIG. 7A). After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 along the transfer path A ₆ to the exchange chamber 533 ( FIG. 7A ), where the processing step 512 is performed. After performing the processing step 512 , the second robotic arm assembly 11B is then used to transfer the substrate along the transfer path A ₇ to the processing chamber 534 , where the processing step 514 is performed. The substrate is then transported along the transport path A ₈ by the second robotic arm assembly 11B. After the process step 516 is completed, the first robotic arm assembly _11A transfers the substrate to the transfer chamber disposed at the transfer position 9A along the transfer path A9. After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed within the cluster tool 10 .

Fourth cluster tool configuration

A. System configuration

FIG. 4A is a plan view of one embodiment of a cluster tool 10 having a front end robot assembly 15, a back end robot assembly 40, a system controller 101, and two process racks (elements 60 and 80) disposed around them. Robotic arm assemblies 11 (FIGS. 9-11; elements 11B, and 11C of FIG. 4A), all adapted to perform at least one aspect of a desired substrate processing sequence utilizing each of the processing chambers within the processing rack. The embodiment shown in FIG. 4A is identical to the configuration shown in FIG. 3A , except that the first robotic arm assembly 11A and transfer location 9A on side 60A of the first process rack 60 are excluded, so the same configurations are used where appropriate. component symbol. One advantage of this system configuration method is to provide easy access to the chambers installed in the first process rack 60, thus enabling one or more process chambers installed in the first process rack 60 to Go offline and come online while the cluster tool is still processing the substrate. Another advantage is that the third robotic arm assembly 11C and/or the second process rack 80 can be brought online while the second robotic arm assembly 11B is being used to process substrates. This configuration also allows process chambers with short chamber process times, which are frequently used in process sequences, to be placed in the second process rack 80, so that these chambers can be controlled by the two central robots (i.e. element 11B and 11c) service, while reducing the robotic arm transfer limiting bottleneck, and thus improving system throughput. This configuration also eliminates or minimizes the need for collision avoidance type control features for the robotic arms to transport the substrate between process chambers mounted in a process rack, since each robotic arm is eliminated from accessing other robotic arms. Physical violation of space. Another advantage of this configuration method is that the flexible and modular architecture allows the user to configure the number of process chambers, process racks, and process manipulators required to meet the user's desired throughput.

In this configuration, the third robot assembly 11C is adapted to access and transfer substrates between the process chambers within the second process rack 80 from side 80A, while the second robot assembly 11B is adapted to access from side 80A Side 60B accesses and transfers substrates between the process chambers in the first process rack 60 , and transfers substrates between the process chambers in the second process rack 80 from side 80A. In one aspect, the side 60B of the first process rack 60 and the side 80A of the second process rack 80 are all along the intersection with each mechanical arm assembly (ie, the second mechanical arm assembly 11B and the third mechanical arm assembly 11C). Horizontal movement assemblies 90 (described below) are aligned in parallel directions.

As discussed above, the second manipulator assembly 11B and the third manipulator assembly 11C together with the system controller 101 may be adapted to allow the system controller's logical scheduler to Inputs from various sensors within the system prioritize work and substrate movement. Improving CoO using the cluster tool framework and the cooperation of the system controller 101 to maximize the use of the cluster tool can make wafer history more repeatable and improve system reliability.

B. Transmission program example

FIG. 4B shows an example of a sequence of transfer steps through the cluster tool shown in FIG. 4A that may be used to accomplish the process sequence described in FIG. 1F . In this embodiment, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the chamber located at the transfer position 9B along the transfer path _A1 , so that The transferring step 502 is performed on the substrate. Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 along the transfer path _A2 by the third robotic arm assembly 11C, where the process step 504 is completed on the substrate. After the processing step 504 is completed, the substrate is then transferred to the second processing chamber 532 by the third robotic arm assembly 11C along the transfer path _A3 . After performing the process step 506, the substrate is then transported by the third robotic arm assembly 11C, following the transport path _A4 , to the exchange chamber 533 (FIG. 7A). After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 along the transfer path A ₆ to the exchange chamber 533 ( FIG. 7A ), where the processing step 512 is performed. After performing the processing step 512 , the second robotic arm assembly 11B is then used to transfer the substrate along the transfer path A ₇ to the processing chamber 534 , where the processing step 514 is performed. The substrate is then transported along the transport path A ₈ by the second robotic arm assembly 11B. After the process step 516 is completed, the second robotic arm assembly 11B transfers the substrate to the transfer chamber disposed at the transfer position 9A along the transfer path A ₉ . After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed within the cluster tool 10 .

Fifth cluster tool configuration

A. System configuration

5A is a plan view of one embodiment of a cluster tool 10 having a front end robot assembly 15, a back end robot assembly 40, a system controller 101, and four robots disposed around a single process rack (element 60). Assemblies 11 ( FIGS. 9-11 ; elements 11A, 11B, 11C, and 11D of FIG. 5A ), all adapted to perform at least one aspect of a desired substrate processing sequence utilizing various process chambers within processing rack 60 . The embodiment shown in Figure 5A is similar to the configuration shown above, and thus the same reference numerals are used where appropriate. This configuration reduces substrate transfer bottlenecks experienced by systems with three or fewer robotic arms, since four robotics that can redundantly access the process chambers mounted within the process rack 60 are used. arm. This configuration is particularly useful in removing robot-limited bottlenecks that typically occur when a process sequence has a high number of process steps and a short chamber process time.

In this configuration, the first robot assembly 11A and the second robot assembly 11B are adapted to access and transfer substrates between the process chambers within the process rack 60 from side 60A, while the third The robot assembly 11C and the fourth robot assembly 11D are adapted to access from side 60B and transfer substrates between the process chambers within the process rack 60 .

The first robotic arm assembly 11A and the second robotic arm assembly 11B, and the third robotic arm assembly 11C and the fourth robotic arm assembly 11D together with the system controller 101 may be adapted to allow "overlap" between the respective robotic arms. ", may allow the system controller's logic scheduler to prioritize jobs and substrate movement based on input from the user and various sensors throughout the cluster tool, and may also employ a collision avoidance system, To allow the robotic arm to optimally transport the substrate through the system. Improving CoO using the cluster tool framework and the cooperation of the system controller 101 to maximize the use of the cluster tool can make wafer history more repeatable and improve system reliability.

B. Transmission program example

FIG. 5B shows an example of a sequence of transfer steps through the cluster tool shown in FIG. 5A that may be used to accomplish the process sequence described in FIG. 1F . In this embodiment, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the chamber located at the transfer position 9C along the transfer path _A1 , so that The transferring step 502 is performed on the substrate. Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 along the transfer path _A2 by the third robotic arm assembly 11C, where the process step 504 is completed on the substrate. After the process step 504 is completed, the substrate is then transported to the second process chamber 532 by the fourth robotic arm assembly 11D following the transport path _A3 . After performing the process step 506, the substrate is then transported by the fourth robotic arm assembly 11D, following the transport path _A4 , to the exchange chamber 533 (FIG. 7A). After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 along the transfer path A ₆ to the exchange chamber 533 ( FIG. 7A ), where the processing step 512 is performed. After the processing step 512 is performed, the substrate is then transported by the first robotic arm assembly 11A, following the transport path A ₇ , to the processing chamber 534 , where the processing step 514 is performed. The substrate is then transported along the transport path A ₈ by the first robotic arm assembly 11A. After the process step 516 is completed, the second robotic arm assembly 11B transfers the substrate to the transfer chamber disposed at the transfer position 9B along the transfer path A ₉ . After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed within the cluster tool 10 .

Sixth cluster tool configuration

A. System configuration

6A is a plan view of one embodiment of a cluster tool 10 having a front end manipulator assembly 15, a back end manipulator assembly 40, a system controller 101, and two processing racks (elements 60 and 80) disposed around them. Eight robotic arm assemblies 11 (FIGS. 9-11; elements 11A, 11B, 11C, and 11D-11H of FIG. 6A), all adapted to perform at least one of the intended substrate processing procedures utilizing the respective process chambers within the processing rack aspect. The embodiment shown in FIG. 6A is similar to the configuration shown above, and thus the same reference numerals are used where appropriate. This configuration reduces substrate transfer bottlenecks experienced by systems with fewer robotic arms by using eight robotic arms that can redundantly access the process chambers housed within the process racks 60 and 80 . This configuration is particularly useful in removing robot-limited bottlenecks that typically occur when a process sequence has a high number of process steps and a short chamber process time.

In this configuration, the first robotic arm assembly 11A and the second robotic arm assembly 11B are adapted to access the process chambers in the first processing rack 60 from side 60A, while the seventh robotic arm assembly 11G and the eighth robotic arm assembly 11H is adapted to access the process chambers in the second process rack 80 from side 80A. In one aspect, the third robot assembly 11C and the fourth robot assembly 11D are capable of accessing the process chambers within the first processing rack 60 from side 60B. In one aspect, the fifth robotic arm assembly 11E and the sixth robotic arm assembly 11F are adapted to access the process chambers within the second processing rack 80 from side 80B. In one aspect, the fourth robot assembly 11D is further adapted to access the process chambers within the second processing rack 80 from side 80B, and the fifth robot assembly 11E is further adapted to access from side 60B. The process chamber in the first process rack 60 .

The manipulator assemblies 11A-H together with the system controller 101 can be adapted to allow for "overlap" between the individual manipulators, which can allow the system controller's logical scheduler to Inputs from various sensors within the robot prioritize work and substrate movement, and an anti-collision system can also be used to allow the robotic arm to optimally transport substrates through the system. Improving CoO using the cluster tool framework and the cooperation of the system controller 101 to maximize the use of the cluster tool can make wafer history more repeatable and improve system reliability.

B. Transmission program example

6B illustrates an example of a first process sequence that may be used to complete the process sequence described in FIG. 1F through the transfer step of the cluster tool shown in FIG. 6A. In this example, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the transfer chamber 9F following transfer path _A1 so that completion can be performed on the substrate The transfer step 502 . Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 by the sixth robotic arm assembly 11F following the transfer path _A2 , where the process step 504 is completed on the substrate. After the processing step 504 is completed, the substrate is then transferred to the second processing chamber 532 by the sixth robotic arm assembly 11F following the transfer path _A3 . After performing the process step 506, the substrate is then transported by the sixth robotic arm assembly 11F, following the transport path _A4 , to the exchange chamber 533 (FIG. 7A). After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 along the transfer path A ₆ to the exchange chamber 533 ( FIG. 7A ), where the processing step 512 is performed. After performing the processing step 512 , the fifth robotic arm assembly 11E is then used to transfer the substrate along the transfer path A ₇ to the processing chamber 534 , where the processing step 514 is performed. The substrate is then transported along the transport path A ₈ by the fifth robotic arm assembly 11E. After the process step 516 is completed, the fifth robotic arm assembly 11E transfers the substrate to the transfer chamber disposed at the transfer position 9E along the transfer path A ₉ . After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

FIG. 6B also shows an example of a second process sequence that uses a different process chamber within the second process rack 80 having a transfer step performed concurrently with the first sequence. As shown in Figures 1C-D, the first process rack and the second process rack generally contain process chambers (eg, CD1-8 of Figure 1C, Figure 1D BC1-6). Therefore, in this configuration method, each process sequence can be executed by using any process chamber installed in the process rack. In one example, the second process sequence is the same process sequence as the first process sequence (discussed above), the second process sequence contains the same transfer steps A ₁ -A ₁₀ , depicted here as A ₁ ' -A ₁₀ ', using the seventh and eighth central manipulators respectively (ie elements 11G-11H) instead of the fifth and sixth central manipulator assemblies (ie elements 11E-11F), as described above.

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed within the cluster tool 10 .

Seventh cluster tool configuration

A. System configuration

6C is a plan view of one embodiment of a cluster tool 10 similar to the configuration shown in FIG. 6A, except that one of the manipulator assemblies (i.e., manipulator assembly 11D) has been removed to reduce system width while still providing a tall System capacity. Thus, in this configuration the cluster tool 10 has a front end robot assembly 15, a back end robot assembly 40, a system controller 101 and seven robot assemblies 11 ( FIGS. 9-11; elements 11A-11C, and 11E-11H) of FIG. 6C, all adapted to perform at least one aspect of a desired substrate processing sequence utilizing various process chambers within a processing rack. The embodiment shown in FIG. 6C is similar to the configuration shown above, and thus the same reference numerals are used where appropriate. This configuration reduces substrate transfer bottlenecks experienced by systems with fewer robotic arms by using seven robotic arms that can redundantly access the process chambers housed within the process racks 60 and 80 . This configuration is particularly useful in removing robot-limited bottlenecks that typically occur when a process sequence has a high number of process steps and a short chamber process time.

In this configuration, the first robotic arm assembly 11A and the second robotic arm assembly 11B are adapted to access the process chambers in the first processing rack 60 from side 60A, while the seventh robotic arm assembly 11G and the eighth robotic arm assembly 11H is adapted to access the process chambers in the second process rack 80 from side 80A. In one aspect, the third robot assembly 11C and the fifth robot assembly 11E are adapted to access the process chambers within the first processing rack 60 from side 60B. In one aspect, the fifth robotic arm assembly 11E and the sixth robotic arm assembly 11F are adapted to access the process chambers within the second processing rack 80 from side 80B.

The manipulator assemblies 11A-11C and 11E-11H together with the system controller 101 can be adapted to allow for "overlapping" between the individual manipulators, allowing the system controller's logical scheduler to Inputs from various sensors within the cluster tool prioritize work and substrate movement, and an anti-collision system may also be used to allow robotic arms to optimally transport substrates through the system. Improving CoO using the cluster tool framework and the cooperation of the system controller 101 to maximize the use of the cluster tool can make wafer history more repeatable and improve system reliability.

B. Transmission program example

6D illustrates an example of a first process sequence that may be used to complete the process sequence described in FIG. 1F through the transfer step of the cluster tool shown in FIG. 6C. In this example, the substrate is removed from the wafer cassette assembly 105 (item #105D) by the front end robot assembly 15 and transferred to the transfer chamber 9F following transfer path _A1 so that completion can be performed on the substrate The transfer step 502 . Once the transfer step 502 is completed, the substrate is then transferred to the first process chamber 531 by the sixth robotic arm assembly 11F following the transfer path _A2 , where the process step 504 is completed on the substrate. After the processing step 504 is completed, the substrate is then transferred to the second processing chamber 532 by the sixth robotic arm assembly 11F following the transfer path _A3 . After performing the process step 506, the substrate is then transported by the sixth robotic arm assembly 11F, following the transport path _A4 , to the exchange chamber 533 (FIG. 7A). After performing the process step 508 , the substrate is then transported by the back-end robotic arm assembly 40 , following the transport path A ₅ , to the external process system 536 , where a process step 510 is performed. After the processing step 510 is performed, the substrate is then transferred by the back-end robotic arm assembly 40 along the transfer path A ₆ to the exchange chamber 533 ( FIG. 7A ), where the processing step 512 is performed. After performing the processing step 512 , the fifth robotic arm assembly 11E is then used to transfer the substrate along the transfer path A ₇ to the processing chamber 534 , where the processing step 514 is performed. Then, the substrate is conveyed along the conveying path AX by the fifth robotic arm assembly 11E. After the process step 516 is completed, the fifth robotic arm assembly 11E transfers the substrate to the transfer chamber disposed at the transfer position 9E along the transfer path A ₉ . After performing the transfer step 518 , the substrate is then transferred to the wafer cassette assembly 105D along the transfer path A ₁₀ by using the front end robot assembly 15 .

FIG. 6D also shows an example of a second process sequence that uses a different process chamber within the second process rack 80 having a transfer step performed concurrently with the first sequence. As shown in Figures 1C-D, the first process rack and the second process rack generally contain process chambers (eg, CD1-8 of Figure 1C, Figure 1D BC1-6). Therefore, in this configuration method, each process sequence can be executed by using any process chamber installed in the process rack. In one example, the second process sequence is the same process sequence as the first process sequence (discussed above), the second process sequence contains the same transfer steps A ₁ -A ₁₀ , depicted here as A ₁ ' -A ₁₀ ', using the seventh and eighth central manipulators respectively (ie elements 11G-11H) instead of the fifth and sixth central manipulator assemblies (ie elements 11E-11F), as described above.

Furthermore, in one embodiment, the cluster tool 10 is not connected or communicated with an external process system 536, so the backend robotic arm assembly 40 is not part of the cluster tool configuration, and the transfer steps A5-A6 and process step 510 Will not perform on this substrate. In this configuration, all process steps and transfer steps are performed within the cluster tool 10 .

Rear Arm Assembly

In one embodiment, as shown in FIGS. 1-6 , the central module 25 contains a rear manipulator assembly 40 adapted to reside in the second Substrates are transferred between the process chambers within the process rack 80 . Referring to FIG. 1E , in one aspect, the rear end robotic arm assembly 40 generally comprises a Selectively Compliant Assembly Robotic Arm (SCARA) having a single arm/blade 40E. In another embodiment, the rear end robotic arm assembly 40 may be a SCARA type robotic arm having two independently controllable arms/blades (not shown) for exchanging bases in groups of two. materials and/or transfer substrates. The two independently controllable arm/blade type robots can be advantageous, for example, when the robot has to remove a substrate from a desired location before placing a substrate down at the same location. An exemplary two independently controllable arm/blade type robotic arm is available from Asyst Technologies, Vermont, CA. One embodiment of the cluster tool 10 does not include a rear robot assembly 40, although FIGS.

FIG. 7A illustrates one embodiment of an exchange chamber 533 that may be disposed within a support chamber 165 ( FIG. ID ) of a process rack (eg, elements 60 , 80 ). In one embodiment, the exchange chamber 533 is adapted to receive and retain substrates so that at least two robotic arms within the cluster tool 10 can store or pick up substrates. In one aspect, the backend robot assembly 40 and at least one robot within the central module 25 are adapted to store and/or receive substrates from the exchange chamber 533 . The exchange chamber 533 generally contains a substrate support assembly 601 , an enclosure 602 , and at least one access port 603 formed on a wall of the enclosure 602 . The substrate support assembly 601 generally has a plurality of support fingers 610 (six shown in FIG. 7A ) having a substrate receiving surface 611 to support and retain a substrate disposed thereon. The enclosure 602 is generally a structure having one or more walls enclosing the substrate support assembly 601 to control the surrounding environment of the substrate while the substrate resides within the exchange chamber 533 . The access port 603 is typically an opening in the wall of the enclosure 602 that provides access to an external robotic arm to pick up or drop substrates onto the support fingers 610 . In one aspect, the substrate support assembly 601 is adapted to allow substrates to be placed on and removed from the substrate-receiving surface 611 by being adapted to store substrates at an angle of at least 90 degrees apart. Take two or more robotic arms of the enclosure 602 .

In one embodiment of the cluster tool 10, as shown in FIG. 7B, the base 40A of the rear end mechanical arm assembly 40 is installed on the support base 40C connected with the slide rail assembly 40B, so the base 40A can It is arranged at any point along the length direction of the slide rail assembly 40B. In this configuration, the backend robot assembly 40 may be adapted to transfer substrates from the first process rack 60 , the second process rack 80 and/or from process chambers within the external module 5 . The slide assembly 40B may generally contain linear ball bearing slides (not shown) and linear actuators (not shown), which are well known in the art, to set and retain the support base 40C. Back end robot arm assembly 40 on 40C. The linear actuator may be a drive linear brushless servo motor available from Danaher Motion, Inc. of Wood Dale, Illinois. As shown in FIG. 7B, the slide rail assembly 40B may be oriented in the y direction. In this configuration, in order to avoid collisions with the manipulator assemblies 11A, 11B or 11C, the controller would be adapted to move the slide rail assembly 40B without hitting other central manipulator assemblies (i.e. elements 11A, 11A, 11C). 11B, etc.) move only the rear robot arm assembly 40. In one embodiment, the rear manipulator assembly 40 is mounted on a slide rail assembly 40B, and the slide rail assembly is configured such that the rear manipulator assembly does not interfere with other central manipulator assemblies.

environmental control

Figure 8A illustrates one embodiment of a cluster tool 10 with an additional environmental control assembly 110 enclosed within the cluster tool 10 to provide a controlled process environment in which to perform the various substrate processing steps of a desired process sequence. FIG. 8A shows the configuration of the cluster tool 10 shown in FIG. 1A with an environmental enclosure placed over the process chamber. The environmental control assembly 110 generally contains one or more filtration units 112, one or more fans (not shown), and optionally the cluster tool base 10A. In one aspect, one or more walls 113 are added to the cluster tool 10 to enclose the cluster tool 10 and provide a controlled environment in which to perform the substrate processing steps. In general, the environmental control assembly 110 is adapted to control air velocity, flow regime (eg, laminar flow or turbulent flow), and the level of particulate contamination within the cluster tool 10 . In one aspect, the environmental control assembly 110 can also control air temperature, relative humidity, the amount of static electricity in the air, and other typical process parameters that can be controlled using ventilation and air conditioning (HVAC) systems compatible with conventional cleanrooms. In operation, the environmental control assembly 110 draws air from a source (not shown) or area located outside the cluster tool 10 using a fan (not shown), which then sends the air through the filter 111 and then through the cluster tool 10 , and leave the cluster tool 10 through the cluster tool base 10A. In one aspect, the filter 111 is a high efficiency particulate air (HEPA) filter. The cluster tool base 10A is generally the floor, or bottom area of the cluster tool, and the cluster tool base 10A contains slots 10B (FIG. 12A) or allows the air pushed through the cluster tool 10 by the fan(s) to exit. The other microwells of the cluster tool 10 .

FIG. 8A further illustrates an embodiment of the environmental control assembly 110 having a plurality of separate environmental control assemblies 110A-C that provide a controlled process environment in which to execute various components of a desired process sequence. Substrate handling steps. Each separate environmental control assembly 110A-C is provided on each manipulator assembly 11 in the central module 25 (such as elements 11A, 11B, etc. of FIGS. 1-6 ) to separately control each manipulator assembly 11 airflow. This configuration is particularly advantageous in the configuration shown in FIGS. 3A and 4A because the robotic arm assemblies are physically isolated from each other by the process rack. Each separate environmental control assembly 110A-C generally contains a filter unit 112, a fan (not shown), and optionally a cluster tool base 10A to exhaust controlled air.

Figure 8B shows a cross-sectional view of the environmental control assembly 110 with a single filter unit 112 mounted on the cluster tool 10 and viewed with a cross-sectional plane parallel to the y and z directions. In this configuration, the environmental control assembly 110 has a single filter unit 112, one or more fans (not shown), and cluster tool base 10A. In this configuration, air is delivered vertically from the environmental control assembly 110 into the cluster tool 10 (element A), around the process racks 60, 80 and robotic arm assemblies 11A-C, and out of the cluster tool base 10A . In one aspect, the wall 113 is adapted to enclose and form a process area within the cluster tool 10 so that the process environment surrounding the process chambers retained within the process racks 60 , 80 can be controlled by the environment control assembly 110 Conveying air control.

8C shows a cross-sectional view of the environmental control assembly 110 having a plurality of separate environmental control assemblies 110A-C mounted on the cluster tool 10 and viewed with a section plane parallel to the y and z directions (See Figure 1A). In this configuration, the environmental control assembly 110 includes a cluster tool base 10A, three environmental control assemblies 110A-C, a first process rack 60 that extends below the environmental control assemblies 110A-C Surface 114 or above the lower surface, and a second process rack 80 that extends to or above the lower surface 114 of the environmental control assemblies 110A-C. Generally, each of the three environmental control assemblies 110A-C contains one or more fans (not shown) and filters 111 . In this configuration, air is conveyed vertically from each of the environmental control assemblies 110A-C into the cluster tool 10 (see element A), between the process racks 60, 80 and the robotic arm assemblies 11A-C, and out of the cluster tool 10. The cluster tool base 10A. In one aspect, the wall 113 is adapted to enclose and form a process area within the cluster tool 10 so that the process environment surrounding the process chambers retained within the process racks 60 , 80 can be controlled by the environment control assembly 110 Conveying air control.

In another embodiment, the cluster tool 10 is placed in a clean room environment suitable for conveying air with low particulate content through the cluster tool 10 at a desired velocity and out of the cluster tool base 10A . In this configuration, the environmental control component 110 is generally not required and therefore not used. The ability to control the properties of the air and the environment surrounding the process chamber retained within the cluster tool 10 is an important factor in the control and/or minimization of particulate buildup that can contribute to device yield due to particulate contamination question.

Robotic Arm Components

In general, the various embodiments of the cluster tool 10 described herein are advantageous over prior art configurations because the reduced size of the robotic arm assembly (eg, element 11 of FIG. 9A ) results in a reduced cluster tool footprint, as well as minimized Manipulator design in which the manipulator enters the space occupied by other cluster tool components (eg manipulator, process chamber) physically encroaching during the substrate transfer process. Reduced entity violations avoid collisions between the robotic arm and other components. While reducing the cluster tool footprint, embodiments of the robotic arm described herein also have particular advantages in that the number of axes that need to be controlled to perform transfer actions is reduced. This aspect is important as it improves the reliability of the robotic arm assembly and thus the cluster tool. The importance of this aspect is clearer by noting that the reliability of a system is directly proportional to the product of the reliability of each component in the system. So a robotic arm with three 99% uptime actuators is always better than four 99% uptime actuators, because each has three 99% uptime actuators The system is up 97.03% of the time, while the four actuators each have 99% up time are 96.06%.

Embodiments of the cluster tool 10 described herein also have advantages over prior art configurations by reducing the number of transfer chambers (eg, elements 9A-C of FIG. 1B ) required to transfer substrates through the cluster tool. Prior art cluster tool configurations typically have two or more transfer chambers installed in the process sequence, or have temporary substrate retention stations, so that the cluster tool robot can be positioned at the one or more during the process sequence. A robot arm centrally located between two process chambers and another robot arm centrally located between one or more other process chambers transfers substrates. The process of sequentially placing substrates in multiple transfer chambers that do not perform subsequent process steps wastes time, reduces the availability of the robotic arm(s), wastes space within the cluster tool, and increases the ) loss of the mechanical arm. The increase in transfer steps also has a detrimental effect on component yield due to the increased number of substrate changes, which increases the amount of particulate contamination on the backside. Furthermore, substrate processing sequences that contain multiple transfer steps will naturally have different substrate wafer histories unless the time each substrate spends in the transfer chamber is controlled. Controlling the time within the transfer chamber adds system complexity by adding process variables and likely compromising the maximum achievable substrate throughput. Aspects of the present invention, as described herein, avoid the difficulties of these prior art configurations because the cluster tool configuration typically only has all the processing steps before performing the process on the substrate and after all process steps have been completed on the substrate. The transfer steps described above (such as steps 502 and 518 of FIG. transfer steps between the process steps described above.

In the case of system throughput limited by robotic arms, the maximum substrate throughput of the cluster tool is governed by the total number of robotic arms moved to complete the process sequence and the time required to move the robotic arms. The time required for the robotic arm to complete the desired movement is typically limited by the robotic arm hardware, distance between process chambers, substrate cleanliness considerations, and system control limitations. Generally, the movement time of the robot arm does not change greatly due to the different types of the robot arm, and it is quite consistent in the industry. Therefore, a cluster tool that can complete a process with fewer robot movements will have a higher system throughput than a cluster tool that requires more movement to complete a process, such as a cluster tool that includes multiple transfer steps.

Cartesian Arm Configuration

FIG. 9A illustrates one embodiment of a robotic arm assembly 11 that may be used as one or more robotic arm assemblies 11 such as elements 11A-H shown in FIGS. 1-6. The manipulator assembly 11 generally includes a manipulator hardware assembly 85 , one or more vertical manipulator assemblies 95 and one or more horizontal manipulator assemblies 90 . A substrate can thus be placed at any desired x within the cluster tool 10 by the coordinated movement of the robotic arm hardware assembly 85 , vertical robotic arm assembly 95 , and horizontal robotic arm assembly 90 using instructions communicated by the system controller 101 . , y and z positions.

The robot hardware assembly 85 generally includes one or more transfer robot assemblies 86 adapted to retain, transfer, and position one or more substrates using instructions communicated from the system controller 101 . In one embodiment, the transfer robot assembly 86 shown in FIGS. 9-11 is adapted to transfer substrates on a horizontal plane, such as a plane containing the X and Y directions shown in FIG. 11A , because each transfer robot assembly 86 component of the mobile. In one aspect, the transfer robot assembly 86 is adapted to transfer substrates in a plane generally parallel to the substrate support surface 87C ( FIG. 10C ) of the robot blade 87 . Figure 10A shows one embodiment of the robot hardware assembly 85 comprising a single transfer robot assembly 86 adapted to transfer substrates. FIG. 10B shows an embodiment of the robot hardware assembly 85 that includes two transfer robot assemblies 86 positioned in opposite directions from each other so that the robot blades 87A-B (and the first Connecting members 310A-310B) are placed a short distance apart. The configuration shown in FIG. 10B , or an "up/down" robot blade configuration, can be advantageous, for example, when it is desired to remove a substrate from a process chamber before placing the next substrate to be processed in the same process chamber. When a substrate is removed without moving the robotic arm hardware assembly 85 out of the base position to move the "removed" substrate to another chamber (ie, "swap" the substrate). In another aspect, the configuration may allow the robot to fill all of the robot blades and then transfer the substrates in groups of two or more to the desired location in the tool. The process of grouping substrates into groups of two or more can help improve the substrate throughput of the cluster tool by reducing the amount of robotic arm movement required to transport the substrates. Although the transfer robot assembly 86 depicted in FIGS. 10A-B is a two-bar linkage robot 305 type robot ( FIG. 10C ), this configuration is not intended to limit the number of devices that can be used with the embodiments discussed herein. The orientation and type of the arm component. In general, an embodiment of a robotic arm hardware assembly 85 with two transfer robot arm assemblies 86, as shown in FIG. 10B, would have two transfer robot arm assemblies 86 containing the same basic The discussion of the robotic arm assembly 86 is also intended to describe the components in this dual robotic arm assembly aspect(s).

One advantage of the cluster tool and robot arm configuration shown in FIGS. 9-11 is to minimize the size of the area surrounding the transfer robot assembly 86 where the robot parts and substrates are free to move without contact with the robot. Other cluster tool components outside the arm assembly 11 collide. The area in which the robot arm and substrate can move freely is called the "transfer area" (element 91 of Figure 11C). The transfer area 91 can generally be defined as the space (x, y and z directions) where the robot arm can move freely without colliding with other cluster tool components when the substrate is left on the blade of the robot arm. Although the transfer area can be described as a space, generally the most important aspect of the transfer area is the horizontal area (x and y directions) that the transfer area occupies, as this directly affects the footprint and CoO of the cluster tool. The horizontal area of the transfer area is an important factor in defining the footprint of the cluster tool, because the smaller the horizontal components of the transfer area, the smaller the individual robotic arm assemblies (e.g., elements 11A, 11B, 11C, etc. of FIGS. 1-6 ) ) can be closer to each other or the robot arm can be closer to the process frame. One factor defining the size of the transfer area is the need to ensure that the transfer area is large enough to reduce or avoid physical encroachment of the manipulator into the space occupied by other cluster tool components. The embodiment described herein is superior to the prior art in that it orients the robotic arm assembly 86 components retract along the direction of transport (x-direction) of the horizontal movement assembly 90 way in the transfer area.

Referring to FIG. 11J , the horizontal area can generally be divided into two parts, a width "W ₁ " (y-direction) and a length "L" (x-direction). Embodiments described herein have further advantages in that the reduced width "W ₁ " of the clearance area around the robot arm ensures that the robot arm can reliably place substrates within the process chamber. The reduced size can be understood by noting that a conventional SCARA manipulator (eg, item CR of FIG. 11K ) generally has an arm (eg, item A ₁ ) extending a distance from the center of the arm (eg, item C) when retracted. Width "W ₁ " benefits over conventional multi-bar linked Selectively Compliant Assembly Robotic Arm (SCARA) type manipulators, which increase the relative distance of said manipulators from each other (i.e., width "W ₂ "), because The area around the arm must be clear so that the arm component can be oriented rotationally without interfering with other cluster tool components (eg, other arms, process rack components). Conventional SCARA-style robotic arm configurations are also more complex than some of the embodiments described herein because they also have more axes to control to orient and place the substrate within the process chamber. Referring to FIG. 11J , in one aspect, the width W ₁ of the transfer region 91 is about 5% to about 50% larger than the substrate dimension (ie, substrate "S" of FIG. 11J ). In the example of a semiconductor wafer with a substrate of 300 mm, the width W ₁ of the transfer region would be between about 315 mm and about 450 mm, and preferably between about 320 mm and about 360 mm. Referring to FIG. 1B , in one example, for a 300 mm substrate processing tool, the distance between side 60B of the first process rack 60 and side 80A of the second process rack 80 may be about 945 mm (eg, 315% ). In another example, for a 300 mm substrate processing tool, the distance between side 60B of the first processing rack 60 and side 80A of the second processing rack 80 may be about 1350 mm (eg, 450%). It should be noted that the transfer area is generally intended to describe the area around the robot arm in which the robot arm can move until the robot arm moves once the robot arm blade has retracted after picking up a substrate in the desired position To the start position (SP) outside the next process chamber in the process sequence.

Double-rod linkage robotic arm assembly

Figures 10A and 10C illustrate one embodiment of a transfer robot assembly 86 of the type dual link robot 305, which generally includes a support plate 321, a first connecting member 310, a robot blade 87, a transmission system 312 ( FIG. 10C ), enclosure 313 and motor 320 . In this configuration, the transfer robot assembly 86 is connected to the vertical movement assembly 95 through the support plate 321 connected to the vertical actuator assembly 560 (FIG. 13A). FIG. 10C shows a side cross-sectional view of one embodiment of the transfer robot assembly 86 of the dual link robot 305 type. The transmission system 312 of the two-bar linkage robotic arm 305 generally includes one or more power transmitting elements (power transmitting elements), which are adapted to move the robotic arm blades 87 by movement of the power transmitting elements, for example by by the rotation of the motor 320 . In general, the transmission system 312 may contain conventional gears, pulleys, etc. adapted to transmit rotational or transfer motion from one element to the next. The term "gear" as used herein is generally intended to describe a component that is rotatably connected to a second component by belts, teeth, or other typical means, and is adapted to transfer movement from one component to another. Generally, a gear, as used herein, may be a conventional gear-type device or a pulley-type device, which may include, but is not limited to, spur gears, bevel gears, racks, for example And/or pinion, worm gear, timing pulley, and V-belt pulley and other components. In one aspect, the transmission system 312 , as shown in FIG. 10C , includes a first pulley system 355 and a second pulley system 361 . The first pulley system 355 has a first pulley 358 connected to the motor 320, a second pulley 356 connected to the first connecting member 310, and a belt 359 connecting the first pulley 358 and the second pulley 356, so The motor 320 can drive the first connecting member 310 . In one aspect, bearings 356A are adapted to allow rotation of the second pulley 356 about the axis V ₁ of the third pulley 354 .

The second pulley system 361 has a third pulley 354 connected to the support plate 321, a fourth pulley 352 connected to the blade 87, and a belt 362 connecting the third pulley 354 and the fourth pulley 352, so the first Rotation of the connecting member 310 causes the blade 87 to rotate about the bearing axis 353 connected to the first connecting member 310 (pivot V ₂ in FIG. 11A ). When conveying substrate, this motor drives this first pulley 358, and this first pulley causes this second pulley 356 and first connecting member 310 to rotate, and this first connecting member 310 turns because this first connecting member 310 and belt Angular rotation 362 about the stationary third pulley 354 causes the fourth pulley 352 to rotate. In one embodiment, the motor 320 and system controller 101 are adapted to form a closed-loop control system that allows the angular position of the motor 320 and all components connected to the motor 320 to be controlled. In one aspect, the motor 320 is a stepper motor or a DC servo motor.

In one aspect, the gear ratios (e.g., diameter ratio, gear tooth ratio) of the first pulley system 355 and second pulley system 361 can be designed to achieve the desired path (element P ₁ in FIG. 11C or 11D ) shape and disintegration, the substrate will move along the path as it is positioned by the transfer robot assembly 86 . The transmission ratio will then be defined as the ratio of the size of the driving element to the size of the element being driven, or in this case, for example, the number of teeth of the third pulley 354 relative to the number of teeth of the fourth pulley 352 . Thus, for example, when the first connecting member 310 rotates 270 degrees, this causes the blade 87 to rotate 180 degrees, which equates to a 0.667 gear ratio or a 3:2 gear ratio. The term gear ratio is intended to mean that the _D1 revolution of the first gear results in the _D2 revolution of the second gear, or the _D1 : _D2 ratio. Thus, a 3:2 ratio means that three revolutions of the first gear will cause two revolutions of the second gear, so the size of the first gear must be approximately two-thirds the size of the second gear. In one aspect, the gear ratio of the third pulley 354 to the fourth pulley 352 is between about 3:1 and about 4:3, preferably between about 2:1 and about 3:2.

FIG. 10E shows another embodiment of a transfer robot arm assembly 86 of the type of a double-bar link robot arm 305, which generally includes a support plate 321, a first connecting member 310, a robot arm blade 87, a transmission system 312 (FIG. 10E), enclosure 313, motor 320 and second motor 371. The embodiment shown in FIG. 10E is similar to the embodiment shown in FIG. 10C, except that in this configuration the rotational position of the third pulley 354 can be adjusted using the second motor 371 and commands from the controller 101 . Since Figures 10C and 10E are similar, the same reference numerals will be used for clarity. In this configuration, the transfer robot assembly 86 is connected to the vertical movement assembly 95 via the support plate 321 connected to the vertical actuator assembly 560 (FIG. 13A). FIG. 10E shows a side cross-sectional view of one embodiment of the transfer robot assembly 86 of the dual link robot 305 type. The transmission system 312 of the biaxially linked robotic arm 305 generally includes two power transmission elements adapted to utilize movement of the motor 320 and/or the second motor 371 to move the robotic arm blade 87 . In general, the transmission system 312 may include gears, pulleys, etc. adapted to transmit rotational or transfer motion from one element to the next. In one aspect, the transmission system 312 includes a first pulley system 355 and a second pulley system 361 . The first pulley system 355 has a first pulley 358 connected to the motor 320, a second pulley 356 connected to the first connecting member 310, and a belt 359 connecting the first pulley 358 and the second pulley 356, so The motor 320 can drive the first connecting member 310 . In one aspect, bearings 356A are adapted to allow rotation of the second pulley 356 about the axis V ₁ of the third pulley 354 . In one aspect, not shown in FIG. 10E , the bearing 356A is mounted on a feature formed on the support plate 321 rather than on the third pulley 354 as shown in FIG. 10E .

The second pulley system 361 has a third pulley 354 connected to the second motor, a fourth pulley 352 connected to the blade 87, and a belt 362 connecting the third pulley 354 and the fourth pulley 352, so the first Rotation of the connecting member 310 causes the blade 87 to rotate about the bearing axis 353 connected to the first connecting member 310 (pivot V ₂ in FIG. 11A ). The second motor 371 is installed on the support plate 321 . As the substrate is conveyed, the motor 320 drives the first pulley 358, which causes the second pulley 356 and the first connecting member 310 to rotate, which in turn causes the first connecting member 310 and the belt to rotate. Angular rotation of 362 about the third pulley 354 rotates the fourth pulley 352 . In this configuration, relative to the configuration shown in FIG. 10C , the third pulley can rotate when the motor 320 rotates the first connecting member 310 , which makes the third pulley 354 and the fourth pulley 352 between The gear ratio can be changed by adjusting the relative movement between the third pulley 354 and the fourth pulley 352 . It will be noted that the gear ratio affects the movement of the manipulator blade 87 relative to the first connecting member 310 . In this configuration, the gear ratio is not fixed by the size of the gears and can be changed during different phases of the robot blade transfer motion to achieve the desired robot blade transfer path (see FIG. 11D ). In one embodiment, the motor 320, the second motor 371 and the system controller 101 are adapted to form a closed-loop control system that allows for the angular position of the motor 320, the angular position of the second motor 371 and the connections to these elements. All components can be controlled. In one aspect, the motor 320 and the second motor 371 are stepper motors or DC servo motors.

11A-D illustrate plan views of one embodiment of a robotic arm assembly 11 that uses a dual-bar linkage robotic arm 305 configuration to transfer and position substrates in a second process chamber that resides within the cluster tool 10. 532 in the expected position. The two-bar linked robotic arm 305 generally includes a motor 320 (FIGS. 10A-C), a first connecting member 310, and a robotic arm blade 87 that are connected such that rotational action of the motor 320 causes the first connecting member 310 to rotate, the The first connecting member in turn causes the robot blade 87 to rotate and/or translate along a desired path. The advantage of this configuration is that the robot arm delivers the substrate to the desired location within the cluster tool, and no component of the robot arm extends into what is currently occupied by another robot arm or system component, or will be Capabilities within the occupied space.

11A-C illustrate the movement of the transfer robot assembly 86 housed within the robot hardware assembly 85, by instantaneously (e.g. corresponding to _T0 of FIGS. 11A-C respectively) as the substrate is transferred into the process chamber 532 - T ₂ ) shows several successive images of the position of the various transfer robot arm assembly 86 components. Referring to FIG. 11A , at time T ₀ , the transfer manipulator assembly 86 is generally set in the expected vertical orientation (z direction) by using the vertical moving assembly 95 components, and is set in the vertical direction by using the horizontal moving assembly 90 components. The expected horizontal direction (x-direction). The position of the manipulator at T ₀ , shown in FIG. 11A , will be referred to herein as the starting position (item SP). Referring to FIG. 11B , at time _T1 , the first link member 310 in the two-bar linkage robot arm 305 rotates about pivot point _V1 , thereby causing the connected robot arm blade 87 to pivot about pivot point V1. ₂ transfer and rotation, while the position of the transfer robot arm assembly 86 in the x direction is adjusted using the components of the horizontal movement assembly 90 and the system controller 101. Referring to FIG. 11C , at time _T2 , the robot arm blade 87 extends in the y direction from the centerline C ₁ of the transfer area 91 by an expected distance (element Y ₁ ), and is set at an expected position in the x direction (element X ₁ ) to place the substrate in the desired final position (item FP), or in the handover position of the process chamber 532. Once the robot arm has positioned the substrate in the final position, the substrate can then be transferred to the process chamber substrate containment components, such as lift pins or other substrate support components (eg, FIG. 11A ). element 532A). After transferring the substrate onto the process chamber housing component, the robot blade can then be retracted following the steps described above but in reverse order.

FIG. 11C further illustrates an example of a possible path (item P ₁ ) of the substrate center point as the substrate moves from the initial position to the final position, as shown in FIGS. 11A-C above. In one aspect of the invention, the shape of the path can be changed by adjusting the rotational position of the first link member 310 relative to the position of the transfer robot arm assembly 86 along the x-direction using the horizontal movement assembly 90 . This feature is advantageous because the shape of the curve can be specifically adapted to allow robotic arm blades 87 to access the process chamber without colliding with or encroaching on other robotic arms with respective process chamber substrate containing components (e.g., element 532A). The delivery area 91. This advantage becomes particularly apparent when the process chamber is configured to be accessed from a number of different directions, or orientations, which thus limit the positions and orientations of the substrate containing components that can be used to reliably support the substrate. And avoid the collision between the blade 87 of the robot arm and the component contained in the base material.

FIG. 11D shows some examples of possible paths P ₁ -P ₃ that may be used to transport substrates into desired locations in the process chamber 532 . The paths P ₁ -P ₃ shown in FIGS. 11D-F are intended to illustrate the movement of the substrate center point, or the center point of the substrate support area of the robot arm blade 87, when the substrate or substrate support area is moved by the robot. When the arm assembly 11 components are set. The substrate transfer path _P2 shown in FIG. 11D shows the path of the substrate when the transfer ratio of the second pulley system 361 of the transfer robot arm assembly 86 is 2:1. Because the movement of the substrate is linear when using a 2:1 gear ratio, this configuration eliminates the need to translate the robot hardware assembly 85 in the X direction as the robot blade 87 extends in the Y direction. The reduced movement complexity benefits of this configuration can in some cases be designed so as not to interfere with the reliability of the robot blade 87 as the substrate is conveyed into the process chamber from various sides of the process chamber. The base material accommodates the components.

11E-11F illustrate the multi-stage transfer movement of substrates into the process chamber 532. In one embodiment, the multi-stage transfer movement is divided into three transfer paths (paths P ₁ -P ₃ ) that can be used to transfer the substrate into or out of the process chamber 532 ( FIG. 11E ). chamber (Fig. 11F). This configuration is particularly useful in reducing the high accelerations experienced by the substrate and robot assembly 11 during the transfer process, and also reduces the robot movement complexity by using as much as possible single axis control during the transfer process. Spend. The high accelerations experienced by the robot arm can generate vibrations in the robot arm assembly that can affect the positional accuracy of the transfer process, the reliability of the robot arm assembly, and the likelihood of the substrate on the robot arm blade. of the mobile. It is believed that one cause of the high acceleration experienced by the robotic arm assembly 11 arises when coordinated motions are used. The term "coordinated movement" as used herein is intended to describe the simultaneous movement of two or more axes (e.g., transfer robot assembly 86, horizontal movement assembly 90, vertical movement assembly 95) to move a substrate from one point to the next. a little.

FIG. 11E shows a multi-stage transfer movement of three transfer paths used to transfer a substrate onto a substrate receiving component 532A within the process chamber 532 . Before performing the multi-stage transfer movement process, the transfer manipulator assembly 86 is generally set at the initial position (SP of FIG. 11E ), which may require the basic The material is moved to a desired vertical orientation (z direction), and the components are moved to a desired horizontal position (x direction) using the horizontal movement assembly 90. In one aspect, once the substrate is at the starting position, the substrate is then moved along path _P1 to The final position (FP). In another aspect, the substrate is positioned along path _P1 with a reduced number of control axes, eg only one control axis. For example, a single axis of control may be achieved by controlling the transfer robot assembly 86 in communication with the controller 101 to move the robot blade and the substrate. In this configuration, the use of a single axis greatly simplifies the control of the movement of the substrate or robot blade and reduces the time required to move from the starting point to the intermediate position. The next step in this multi-stage transfer movement process is to move the component in the z direction using the vertical movement assembly 95, or vertically move the substrate containing component with a substrate containing component actuator (not shown) to transfer the substrate onto the process chamber substrate containment components, such as lift pins or other substrate support components (eg, element 532A of FIG. 11A ). In one aspect, as shown in FIGS. 11E and 11F , the transfer robot assembly 86 is adapted to transfer the substrate W in a plane parallel to the X and Y directions, as shown by paths P1 and P3 .

After delivering the substrate to the process chamber to accommodate components, the robot blades may then be retracted following paths _P2 and _P3 . The path P ₂ , in some cases, may require coordinated movement between the transfer robot assembly 86 and the horizontal translation assembly 90 to ensure that the robot blade 87 does not collide when retracting from the process chamber 532 to the substrate support component 532A. In one aspect, as shown in FIG. 11E , the path _P2 describing the movement of the center point of the substrate support area of the robot blade 87 is a linear path extending from the final position (FP) to the final position. and some intermediate points (IP) between this end point (EP) position. Generally, the intermediate point is the point at which the manipulator blade has retracted far enough that it does not come into contact with any chamber components when moving to the end position in a simplified or accelerated motion along path _P3 . In one aspect, once the robot blade is at the intermediate point position, the substrate is moved along path _P3 to the end. In one aspect, the substrate is positioned at the end point (EP) using only one axis of control, such as by movement of a transfer robot assembly 86 in communication with the controller 101 . In this configuration method, the use of a single axis greatly simplifies movement control and reduces the time required to move from the intermediate point (IP) to the end point (EP) position.

FIG. 11F shows a multi-stage transfer movement of three transfer paths used to remove substrates from substrate-containing components 532A within the process chamber 532 . Before performing the multi-stage transfer movement process, shown in FIG. 11F , the transfer robot arm assembly 86 is generally set at the initial position (SP of FIG. 11F ), which may require the use of the vertical movement assembly The 95 component moves the substrate to a desired vertical orientation (z direction) and the horizontal movement component 90 moves to a desired horizontal position (x direction). In one aspect, once the substrate is at the starting position, the substrate is then moved along path _P1 to The intermediate location (IP). Generally, the intermediate point is the point at which the arm blade has been extended far enough so that the point does not come into contact with any chamber components when moved to the intermediate point in a simplified or accelerated motion along path _P1 . In another aspect, the substrate is positioned along path _P1 with a reduced number of axes of control. For example, a single axis of control may be achieved by controlling the transfer robot assembly 86 in communication with the controller 101 to move the robot blade and the substrate. In this configuration, the use of a single axis greatly simplifies the control of the movement of the substrate or robotic arm and reduces the time required to move from the starting point to the intermediate position.

After transferring the substrate to the intermediate position, the robot blade can further extend into the chamber along the path _P2 . The path P ₂ , in some cases, may require coordinated movement between the transfer robot assembly 86 and the horizontal translation assembly 90 to ensure that the robot blades 87 do not collide as they extend into the process chamber 532 The substrate support component 532A. In one aspect, as shown in FIG. 11F , the path _P2 describing the movement of the center point of the substrate support area of the robot blade 87 is a linear path extending from the intermediate point (IP) to the final position. (FP). After the robot blade has been positioned in the final position, the transfer robot assembly 86 is then moved in the z direction using the vertical movement assembly 95, or vertically using a substrate containing component actuator (not shown) The substrate containment component 532A is used to remove the substrate from the process chamber substrate containment component 532A.

After removing the substrate from the process chamber containing components, the robotic arm blade can be retracted following path _P3 . The path P ₃ may, in some cases, require coordinated movement between the transfer robot assembly 86 and the horizontal translation assembly 90 . In one aspect, the substrate is positioned at the end point (EP) using only one axis of control, such as by movement of a transfer robot assembly 86 in communication with the controller 101 . In this configuration method, the use of a single axis greatly simplifies movement control and reduces the time required to move from the final position (FP) to the end point (EP) position. In one aspect, as shown in FIG. 11F , the path _P3 describing the movement of the center point of the substrate support area of the robot blade 87 is a non-linear path extending from the final position (FP) to some end point (EP).

Single-axis robotic arm assembly

FIGS. 10D and 11G-I illustrate another embodiment of the robot assembly 11 in which the transfer robot assembly 86A is in a single-axis linkage 306 ( FIG. 10D ) configuration to transfer and position substrates while indwelling within the cluster tool 10 On the expected position of the second process chamber 532 . The single-axis linkage 306 generally contains a motor 320 ( FIG. 10D ) and a robot blade 87 connected such that rotational movement of the motor 320 causes the robot blade 87 to rotate. An advantage of this configuration is the ability of the robotic arm to transport substrates to desired locations within the cluster tool with only a single axis that is less complex and more cost-effective to control the blade 87 while also reducing the mechanical The opportunity for an arm component to extend into a space that may be occupied by another robotic arm during this transfer process.

FIG. 10D shows a side cross-sectional view of a single-axis linkage 306 generally containing a motor 320 , a support plate 321 connected to the motor 320 and a robotic arm blade 87 . In one embodiment, the arm blade 87 is connected to the first pulley assembly 355 as shown in FIG. 10D . The first pulley assembly 355 has a first pulley 358 connected to the motor 320 , a second pulley 356 connected to the arm blade 87 , and a belt 359 connected to the first pulley 358 and the second pulley 356 . In this configuration, the second pulley 356 is mounted on the pivot 364 connected to the support plate 321 through the bearing 354A, so that the motor 320 can rotate the blade of the robot arm. In one embodiment of the single-axis link 306, the arm blade 87 is directly connected to the motor 320 to reduce the number of manipulator components, reduce the cost and complexity of the arm assembly, and reduce maintenance of the second arm. 355 components required in a pulley system. The single axis link 306 may be advantageous because of the simplified motion control system, and thus improved robotic arm and system reliability.

11G-J are plan views of the transfer robot assembly 86 of the single-axis link 306 type, and illustrate the movement of the single-axis link 306, by real-time (e.g., object T ₀ - T ₂ ) shows several successive images of the position of the various transfer robot arm assembly 86 components. Referring to FIG. 11G , at time T ₀ , the transfer manipulator assembly 86 is generally set on the expected vertical orientation (z direction) by using the vertical moving assembly 95 components, and is set on the expected vertical orientation by using the horizontal moving assembly 90 components. The expected horizontal direction (x-direction). The position of the manipulator at T ₀ , shown in FIG. 11C , will be referred to herein as the starting position (item SP discussed above). Referring to FIG. 11H , at time _T1 , the manipulator blade 87 rotates around the pivot point _V1 , thereby causing the manipulator blade 87 to rotate, while the position of the transfer manipulator assembly 86 in the x direction is determined using the system controller 101 to adjust. Referring to FIG. 11I , at time _T2 , the robotic arm blade 87 has rotated to the desired angle, and the robotic arm assembly has been set at the desired x-direction position, so the substrate is in the desired position in the processing chamber 532 On the final position (object FP), or on the handover position. FIG. 11D , discussed above, also shows some examples of possible paths P ₁ -P ₃ that may be used to transport substrates into desired locations in the process chamber 532 using the uniaxial link 306 . After transferring the substrate onto the process chamber housing component, the robot blade can then be retracted following the steps described above but in reverse order.

Move components horizontally

Figure 12A shows a cross-sectional view of one embodiment of the horizontal movement assembly 90 taken along a plane parallel to the y-direction. FIG. 12B is a side sectional view of one embodiment of the robotic arm assembly 11 that has been centrally cut to length of the horizontal movement assembly 90 . The horizontal movement assembly 90 generally includes an enclosure 460 , an actuator assembly 443 and an elongated mount 451 . The actuator assembly 443 generally includes at least one horizontal linear slide assembly 468 and the movement assembly 442 . The vertical moving assembly 95 is connected with the horizontal moving assembly 90 through the elongated mounting base 451 . The elongated mounting base 451 is a structural member supporting various loads created when the horizontal moving assembly 90 sets the vertical moving assembly 95 . The horizontal movement assembly 90 generally includes two horizontal linear slide assemblies 468, each of which has a linear rail 455, a bearing block 458, and a support mount 452 that supports the elongated mount 451 and the vertical movement assembly 95 weight. This configuration thus provides for smooth and accurate transfer of the vertical movement assembly 95 along the length of the horizontal movement assembly 90 . The linear track 455 and the bearing blocks 458 may be linear ball bearing slides or conventional linear guides, which are well known in the art.

12A-B, the mobile assembly 442 generally includes an elongated mount 451, a horizontal arm actuator 367 (FIGS. 10A and 12A), a drive belt 440, and two or more drive belt pulleys 454A adapted to The position of the vertical movement assembly 95 is controlled along the length of the horizontal movement assembly 90 . Generally speaking, the drive belt 440 is connected (eg, glued, latched, or clamped) to the elongated mount 451 to form a continuous loop extending along the length of the horizontal movement assembly 90 , and The ends are supported by the two or more drive belt pulleys 454A. Figure 12B shows a configuration with four drive belt pulleys 454A. In one embodiment, the horizontal arm actuator 367 is connected to one of the drive belt pulleys 454A such that rotational movement of the pulley 454A causes the drive belt 440 and elongated mount connected to the vertical movement assembly 95 to 451 moves along the horizontal linear slide assembly 468. In one embodiment, the horizontal robotic arm actuator 367 is a direct drive linear brushless servo motor adapted to move the robotic arm relative to the horizontal linear slide assembly 468 .

The enclosure 460 generally includes a base 464 , one or more outer walls 463 and an enclosure roof 462 . The enclosure 460 is suitable for covering and supporting components in the horizontal moving assembly 90 for safety and pollution reduction. Because particles are generated by mechanical parts that rotate, slide, or come into contact with each other, it is important to ensure that the components within the horizontal movement assembly 90 do not contaminate the substrate surface as the substrate is conveyed through the cluster tool 10 . The enclosure 460 thus forms an enclosed area that minimizes the chances of particles generated within the enclosure 460 reaching the surface of the substrate. Particulate contamination has a direct impact on component yield and therefore the CoO of the cluster tool.

The enclosed top plate 462 has a plurality of slots 471 that allow the support mounts 452 of the horizontal linear slide assembly 468 to extend through the enclosed top plate 462 and connect with the elongated mounts 451 . In one aspect, the width of the slot 471 (the dimension of the opening in the y-direction) is tailored to minimize the chance of particles reaching the outside of the horizontal movement assembly 90 .

The base 464 of the enclosure 460 is a structural member designed to support the load created by the weight of the elongated mount 451 and vertical movement assembly 95, as well as the load created by the movement of the vertical movement assembly 95. load. In one aspect, the base 464 further includes base slots 464A disposed along the length of the horizontal movement assembly 90 to allow access to the slots 471 of the enclosure top plate 462. Air exits the enclosure via the base slot 464A, and then exits the slot 10B formed in the cluster tool base 10A. In one embodiment of the cluster tool 10, the cluster tool base 10A is not used, so the horizontal translation assembly 90 and process rack can be placed on the floor of the area where the cluster tool 10 is installed. In one aspect, the base 464 is positioned on the cluster tool base 10A or floor with the enclosure support 461 to provide an unrestricted and consistent flow path for air to flow through the horizontal movement assembly 90 . In one aspect, the enclosure support 461 may also be adapted to act as a conventional shock absorber. Airflow generated by the environmental control assembly 110 or clean room environment through the enclosure 460 in one direction (preferably downward) can help reduce the chances of particles generated within the enclosure 460 reaching substrate surfaces. In one aspect, the slot 471 and the base slot 464A formed in the enclosure roof 462 are designed to limit the amount of air flowing 462 outside and the inside area of the enclosure 460 to achieve a pressure drop of at least 0.1"wg. In one aspect, the central area of the enclosure 460 is formed to separate this area from the rest of the horizontal movement assembly using the inner wall 465 The addition of inner walls 465 can minimize air recirculation into the enclosure 460 and serve as an airflow directing feature.

Referring to FIGS. 12A and 13A , in one aspect of the enclosure 460 , the drive belt is configured to form a small gap between the drive belt 440 and the drive belt slot 472 formed in the enclosure top panel 462 . This configuration may be advantageous in order to avoid particles generated within the enclosure 40 from reaching outside the enclosure 460 .

12C, in another aspect of the enclosure 460, a fan unit 481 is connectable to the base 464 and adapted to draw from the interior of the enclosure 460 through a base slot 464A formed in the base 464. Air. In another aspect, the fan unit 481 forces particulate-laden air through a filter 482 to remove particulates before the air is exhausted through the cluster tool base 10A or floor (see item A). In this configuration, the fan 483, housed in the fan unit, is designed to create a negative pressure within the enclosure 460, so that air outside the enclosure is drawn into the enclosure, confining the enclosure. The possibility of leakage of particulates generated within the seal 460. In one embodiment, the filter 482 is a HEPA type filter or other type of filter that removes generated particulates from the air. In one aspect, the length and width of the slit 471 and the size of the fan 483 are selected to produce a pressure drop between a point outside the enclosure 460 and a point inside the enclosure 460 between about Between 0.02 inches of water (~5 Pa) and about 1 inch of water (~250 Pa).

In one embodiment of the horizontal moving assembly 90 , a protective belt 479 is provided to cover the slit 471 to prevent particles generated inside the horizontal moving assembly 90 from reaching the substrate. In this arrangement, the protective belt 479 forms a continuous loop extending along the length of the horizontal movement assembly 90 and is disposed within the slot 471 so that a gap is formed between the protective belt 479 and the enclosure top plate 462. The open area is as small as possible. Generally, the guard strap 479 is connected (eg, glued, latched, or clamped) to the support mount 452 to form a continuous loop extending along the length of the horizontal movement assembly 90 and The ends are supported by the two or more drive belt pulleys (not shown). In the configuration shown in FIG. 12C , the guard strap 479 can be attached to the support mount 452 (not shown) at the level of the slot 471 and passed through the channel 478 made in the base 464. The horizontal movement assembly 90 wraps around to form a continuous loop. The protective belt(s) 479 thus surround the inner area of the horizontal movement assembly 90 .

Move components vertically

One embodiment of the vertical movement assembly 95 is shown in FIGS. 13A-B . Figure 13A is a plan view of the vertical movement assembly 95 showing various aspects of the design. The vertical movement assembly 95 generally includes a vertical support 570 , a vertical actuator assembly 560 , a fan assembly 580 , a support plate 321 , and a vertical enclosure 590 . The vertical support 570 is generally a bolted, welded, or structural member mounted on the elongated mount 451 and is adapted to support various components within the vertical movement assembly 95 .

The fan assembly 580 generally includes a fan 582 and a tube 581 forming a solid region 584 in fluid communication with the fan 582 . The fan 582 is generally an element adapted to move air using some mechanical means, such as rotating fan blades, moving bellows, moving partitions, or moving high-precision mechanical gears. The fan 582 is adapted to create a negative pressure in the inner region 586 of the enclosure 590 relative to the outside of the enclosure 590 by creating a negative pressure in the enriched region 584, which is associated with a plurality of tubes formed on the tube 581. The slit 585 is in fluid communication with the interior region 586 . In one aspect, the number, size and distribution of the slots 585 , which may be circular, oval or rectangular, are designed to draw air evenly from all areas of the vertical movement assembly 95 . In one aspect, the interior area 586 can also be adapted to house a plurality of cables (not shown) used to transmit signals between the various robotic arm hardware assemblies 85 and components of the vertical movement assembly 95 and with the system controller 101. . In one aspect, the fan 582 is adapted to convey air exhausted from the interior region 586 into the central region 430 of the horizontal movement assembly 90 where the air exits the horizontal movement assembly 90 through the base slot 464A. discharge.

The vertical actuator assembly 560 generally includes a vertical motor 507 ( FIGS. 12A and 13B ), a pulley assembly 576 ( FIG. 13B ), and a vertical rail assembly 577 . The vertical slide assembly 577 generally includes a linear track 574 and a bearing block 573 that connects to the vertical support 570 and the moving block 572 of the pulley assembly 576 . The vertical slide rail assembly 577 is adapted to guide and provide smooth and accurate transfer of the manipulator hardware assembly 85 and also support the weight and loads created by movement of the manipulator hardware assembly 85 along the length of the vertical movement assembly 95 . The linear track 574 and the bearing blocks 573 may be linear ball bearing slides, precision shaft slide systems, or conventional linear slides, which are well known in the art. Typical linear roller bearing slides, precision shaft slide systems, or conventional linear slides are available from SKF USA or the Daedal Division of Parker Hannifin Corporation in Irwin, Pennsylvania.

13A and 13B, the pulley assembly 576 generally includes a drive belt 571, a moving block 572, and two or more pulleys 575 (eg, elements 575A and 575B) that are rotatably connected to the vertical support 570 and the vertical motor 507 to enable A support plate (eg, elements 321A-321B of FIG. 13B ), and thus robotic arm hardware assembly 85 , may be positioned along the length of the vertical movement assembly 95 . Generally, the drive belt 571 is connected (eg, glued, latched, or clamped) to the moving block 572 to form a continuous loop extending along the length of the vertical moving assembly 95 and at the end of the vertical moving assembly 95 is supported by the two or more drive belt pulleys 575 (eg elements 575A and 575B). Figure 13B shows a configuration with two drive belt pulleys 575A-B. In one aspect, the vertical motor 507 is connected to one of the drive belt pulleys 575B such that rotational movement of the pulley 575B causes the drive belt 571 and the support plate(s), and thus the arm hardware assembly 85, to move along the vertical axis. The linear slide assembly 577 moves. In one embodiment, the vertical motor 507 is a direct drive linear brushless servo motor adapted to move the robotic arm hardware assembly 85 relative to the vertical rail assembly 577, thus eliminating the need for the drive belt 571 and two or a plurality of pulleys 575.

The vertical enclosure 590 generally contains one or more outer walls 591 and enclosure top 592 (FIG. 9A) and slots 593 (FIGS. 9A, 12A and 13A). The vertical enclosure 590 is suitable for covering components in the vertical moving assembly 95 for safety and pollution reduction. In one aspect, the vertical enclosure 590 is connected to and supported by the vertical support 570 . Because particles are generated by mechanical parts that rotate, slide, or come into contact with each other, it is important to ensure that the components within the vertical movement assembly 95 do not contaminate the substrate surface as the substrate is conveyed through the cluster tool 10 . The enclosure 590 thus forms an enclosed region that minimizes the chances of particles generated within the enclosure 590 reaching the surface of the substrate. Particulate contamination has a direct impact on component yield and therefore the CoO of the cluster tool. Thus, in one aspect, the dimensions (ie, length and width) of the slot 593 and/or the dimensions (eg, flow rate) of the fan 582 are configured to minimize the amount of particles that can escape from the vertical movement assembly 95 . In one aspect, the length (Z-direction) and width (X-direction) of the slot 593 and the size of the fan 582 are selected such that the pressure generated between a point outside the outer wall 591 and the inner region 586 The drop is between about 0.02 inches of water (-5 Pa) and about 1 inch of water (-250 Pa). In one aspect, the slot 593 has a width between about 0.25 inches and about 6 inches.

The embodiments described herein are generally superior to prior art designs adapted to lift the manipulator arm components with components that must fold, nest, or retract within themselves to achieve a minimum vertical position . The issue arises because the lowest position of the robotic arm is limited by the size and orientation of the vertically moving components that must fold, nest, or retract within itself due to interference with the vertically moving components. When a prior art vertically moving component cannot be retracted any further, the position of the vertically moving component is often referred to as the "dead space" or "solid height" because the lowest arm The fact that the position is limited by the height of the retracted component. In general, the embodiments described herein avoid this problem because the bottom of the one or more transfer robot arm assemblies 86 is not supported below by the components in the vertical movement assembly 95, so the lowest position is only It is limited by the length of the linear track 574 and the size of the mechanical arm hardware assembly 85 components. In one embodiment, as shown in FIGS. 13A-13B , the mechanical arm assembly is supported by a support plate 321 installed on the vertical slide rail assembly 577 in a cantilever manner. It should be noted that the component configuration of the support plate 321 and the robotic arm hardware assembly 85 shown in FIGS. The orientation of assembly 85 may be adjusted to achieve a desired structural stiffness, and/or a desired vertical trajectory for vertical movement of assembly 95 .

The embodiment of the vertical movement assembly 95 described herein is also superior to prior art vertical movement designs, such as those that must fold, nest, or retract within themselves, due to movement of the robotic arm hardware assembly 85 due to movement along Improved precision and/or accuracy due to forced movement of the vertical slide rail assembly 577. Thus, in one aspect of the invention, movement of the robotic arm hardware assembly is always guided by a rigid member (e.g., vertical slide rail assembly 577) that provides structural rigidity and positional accuracy of the components, as these When components move along the length of the vertical movement assembly 95.

Dual horizontal moving component configuration method

FIG. 14A illustrates one embodiment of a robotic arm assembly 11 using two horizontal movement assemblies 90 that may be used as one or more of the robotic arm assemblies 11A-H shown in FIGS. 1-6 above. In this configuration, the robot assembly 11 generally includes a robot hardware assembly 85, a vertical movement assembly 95, and two horizontal robot assemblies 90 (eg, elements 90A and 90B). The coordinated movement of the robotic arm hardware assembly 85, vertical robotic arm assembly 95, and horizontal robotic arm assembly 90A-B and instructions from the system controller 101 can thus be used to place substrates at any desired x, y and z position. An advantage of this configuration is that during the dynamic movement of the vertical movement assembly 95 along the conveying direction (x-direction), the rigidity of the structure of the robotic arm assembly 11 can be increased, allowing for higher accelerations during movement and thus improved Substrate transfer time.

In one aspect, the components of the vertical movement assembly 95, the upper horizontal movement assembly 90B, and the lower horizontal movement assembly 90A contain the same basic components as discussed above, and thus the same reference numerals are used where appropriate. In one aspect, the vertical movement assembly 95 is connected to the lower elongated mount 451A and the upper elongated mount 451B along with the movement assembly 442 that resides within each of the horizontal movement assemblies 90A and 90B. x-direction settings. In another embodiment of the manipulator assembly 11, a single moving assembly 442 is mounted on one of the horizontal moving assemblies (such as element 90A), while the other horizontal moving assembly (such as element 90B) is only used as a support , to guide one end of the vertical movement assembly 95.

Substrate grouping

In an effort to be more competitive in the market and thus reduce cost of ownership (CoO), electronics manufacturers typically spend a great deal of time trying to optimize process schedules and chamber process times within cluster tool architecture constraints and Maximum possible substrate throughput for a given chamber process time. In process sequences with short chamber process times and a large number of process steps, a large portion of the time for processing a substrate is taken up by the process of transferring the substrate between the various process chambers of a cluster tool. In one embodiment of the cluster tool 10, the CoO is reduced by grouping substrates and transferring and processing the substrates in groups of two or more. Such parallel processing thus increases system throughput and reduces the number of movements that a robotic arm must make to transfer a batch of substrates between the process chambers, thus reducing wear on the robotic arm and increasing system reliability.

In one embodiment of the cluster tool 10, the front manipulator assembly 15, the manipulator assembly 11 (eg, elements 11A, 11B, etc. of FIGS. 1-6 ) and/or the rear manipulator assembly 40 may be adapted The substrates are conveyed in groups of two or more to improve system throughput by processing the substrates in parallel. For example, in one aspect, the robot hardware assembly 85 has a plurality of independently controllable transfer robot assemblies 86A and 86B (FIG. 10B) that are used to pick one or more A plurality of substrates are then transferred and placed within a plurality of subsequent processing chambers. In another aspect, each transfer robot assembly 86 (eg, 86A or 86B) is adapted to pick, transfer, and drop multiple substrates separately. In this case, for example, a robotic hardware assembly 85 having two transfer robotic arm assemblies 86 may be adapted to pick up a substrate "W" from a first process chamber using a first blade 87A and move it to a second process chamber The substrate can be picked up by the second blade 87B, so the two substrates can be transferred and put down in a group.

In one embodiment of the robotic arm assembly 11, as shown in FIG. 15A, the robotic arm hardware assembly 85 includes two robotic arm hardware assemblies 85 (e.g., elements 85A and 85B) having at least one transfer mechanism The arm assemblies 86 are spaced a desired distance or pitch (element "A") and are adapted to simultaneously pick up or drop down substrates from two different process chambers. The distance or pitch A between the two robotic arm hardware assemblies 85 can be configured to correspond to the spacing between two process chambers mounted within the process rack, thus allowing simultaneous access to the robotic arm assembly 11 at one time. The two process chambers. This configuration is particularly advantageous in improving substrate throughput and cluster tool reliability due to the ability to transfer two or more substrates in groups.

Robotic arm blade hardware configuration method

FIGS. 16A-16D illustrate one embodiment of a robot blade assembly 900 that may be used with certain embodiments described herein as the substrate "W" is conveyed by the robot assembly through the cluster tool 10. The substrate "W" is supported and left in place. In one embodiment, the manipulator blade assembly 900 may be adapted to replace the blade 87 and thus be compatible with the first blade shown in FIGS. 10A-10E at a connection point (element CP) formed on the blade base 901. A pulley system 355 or a second pulley system 361 are connected to the components. The robotic blade assembly 900 of the present invention is adapted to grip, "grab," or restrain the substrate "W" so that the acceleration experienced by the substrate during the transfer process does not dislodge the substrate position from the robotic blade assembly 900 Move away from a known location on . Movement of the substrate during the transfer process can generate particles that reduce the substrate positioning accuracy and repeatability of the robotic arm. In the worst case, the acceleration would cause the substrate to fall off the robot blade assembly 900 .

The acceleration experienced by the substrate can be divided into three parts: a horizontal radial acceleration part, a horizontal axial acceleration part and a vertical acceleration part. The acceleration experienced by the substrate occurs when the substrate is accelerated or decelerated in the X, Y and Z directions during the movement of the substrate through the cluster tool 10 . Referring to FIG. 16A, the horizontal radial acceleration component and the horizontal axial acceleration component are shown as forces FA and FR, respectively. The force experienced is related to the mass of the substrate times the substrate acceleration minus any friction created between the substrate and the manipulator blade assembly 900 components. In the embodiments described above, this radial acceleration typically occurs as the substrate is rotated into position by the transfer robot assembly 86, and can act in either direction (ie, +Y or -Y direction). The axial acceleration typically occurs when the substrate is positioned in the X direction by movement of the horizontal movement assembly 90 and/or the transfer robot assembly 86, and can act in either direction (i.e., +X or -X direction) . The vertical acceleration typically occurs when the substrate is positioned in the z direction by the vertical movement assembly 95, and can act in either direction (ie, +Z or -Z direction) or when the cantilever beam induces vibrations in the structure.

Figure 16A is a schematic plan view of one embodiment of the robot blade assembly 900 adapted to support the substrate "W". The robotic arm blade assembly 900 generally includes a blade base 901, an actuator 910, a braking mechanism 920, a position sensor 930, a clamp assembly 905, one or more reaction members 908 (one is shown for example), and one or more Multiple substrate support components 909 . The clamp assembly 905 generally includes a clamp plate 906 and one or more contact members 907 mounted on the clamp plate 906 (ie, the two contact members shown in FIG. 16A ). The clamping plate 906, contact member 907, reaction member 908, and blade base 901 can be made of metal (such as aluminum, nickel-coated aluminum, SST), ceramic materials (such as silicon carbide), or materials that can reliably withstand the mechanical arm. The blade assembly 900 is made of a plastic material that experiences an acceleration (eg, 10-30 m/s ² ) during the transfer process and does not generate or attract particles due to interaction with the substrate. FIG. 16B is a side schematic sectional view of the manipulator blade assembly 900 shown in FIG. 16A , the sectional view having been cut through the center of the manipulator blade assembly 900 . For simplicity, components disposed behind the sectional plane of FIG. 16B are omitted (eg, contact member 907 ), but the brake assembly 930 remains in this figure.

16A and 16B, in use the substrate "W" is pressed against the reaction member by the gripping force (F ₁ ) delivered to the substrate "W" by the actuator 910 through the contact member 907 of the clamp assembly 905 Indwelling surface 908B of 908 . In one aspect, the contact member 907 is adapted to contact and force the edge "E" of the substrate "W" against the retention surface 908B. In one aspect, the gripping force can be between about 0.01 and about 3 kilogram force (kgf). In one embodiment, as shown in FIG. 16A , the contact members 907 are intended to be spaced at an angular distance "A" to provide axial and Radial support.

The process of constraining the substrate so that the substrate can be reliably transported through the cluster tool 10 using the robot blade assembly 900 generally requires three steps to complete. It should be noted that one or more of the steps described below may be performed simultaneously or sequentially without departing from the basic scope of the invention as described herein. Before starting the process of picking up the substrate, the clamp assembly 905 is retracted in the +X direction (not shown). This first step begins when a substrate is picked up from a substrate support component (e.g., element 532A of FIGS. 11A-11I , transfer positions 9A-H of FIGS. Substrate support surfaces 908A and 909A on member 908 and substrate support component 909 . Next, the clamp assembly 905 is moved in the -X direction until the substrate is conveyed by the actuator 910 through the contact member 907 of the clamp assembly 905 and the reaction member 908 to the grip of the substrate "W". The force (F ₁ ) is limited so far on the manipulator blade assembly 900 . In a final step, the detent mechanism 920 holds, or "locks," the clamp assembly 905 in place to prevent acceleration of the substrate during the transfer process from significantly altering the gripping force (F ₁ ), thus allowing the substrate to move relative to the support surface. After the brake mechanism 920 restrains the clamp assembly 905 , the substrate can be transferred to another point of the cluster tool 10 . To place the substrate on the substrate support component, complete the above steps in reverse order.

In one aspect of the robot blade assembly 900, the braking mechanism 920 is adapted to limit movement of the clamp assembly 905 in at least one direction (eg, +X direction) during transfer. The ability to constrain movement of the jaw assembly 905 in a direction opposite to the gripping force (F ₁ ) supplied by the jaw assembly 905 prevents the horizontal axial acceleration(s) from significantly reducing the gripping force, thereby allowing the Substrates may move, which may generate particulates, or may avoid falling from the blade assembly 900 during transport. In another aspect, the braking mechanism 920 is adapted to limit movement of the clamp assembly 905 in at least two directions (eg, +X and -X directions). In this configuration, the ability to constrain movement of the jaw assembly in a direction parallel to the direction of the gripping force (F ₁ ) prevents the horizontal axial acceleration(s) from causing a significant increase in the gripping force, which could cause a substantial increase in the gripping force. The material is damaged or chipped, or significantly reduced, which may generate particles or allow the substrate to fall. In yet another embodiment, the braking mechanism 905 is adapted to constrain all six degrees of freedom of the clamp assembly 905 to avoid, or minimize, movement of the substrate. The ability to restrict movement of the jaw assembly 905 in a desired direction may be accomplished with components adapted to restrict movement of the jaw assembly 905 . Typical components that may be used to restrict movement of the clamp assembly 905 include conventional latch mechanisms (eg, latch-type mechanisms), or other similar devices. In one aspect, movement of the jaw assembly 905 is limited by a mechanism that supplies a limiting force (element _F2 of Figure 16A), such as the opposing brake assembly 920A discussed above.

In one embodiment, a position sensor 930 is used to sense the position of the clamping plate 906 so that the controller 101 can determine the status of the blade assembly 900 at any point during delivery. In one aspect, because of the distance between the position of the clamping plate 906 and the force transmitted by the actuator 910, the position sensor 930 detects that the clamping plate 906 has moved too far in the -X direction. Suitable for sensing that no substrate is disposed on the blade assembly 900, or that the substrate has been misplaced on the support surface (elements 908A and 909A). Likewise, the position sensor 930 and controller 101 may be adapted to sense the presence of a substrate by noting that the position of the clamping plate 906 is within a range of acceptable positions corresponding to the presence of a substrate. In one aspect, the position sensor 930 is provided by optical position sensors, linear variable differential transformers (LVDTs) or other sensors that can be used to identify acceptable and unacceptable positions of the clamping plate 906 at desired points. position of other comparable position sensing devices.

Figure 16C schematically illustrates a plan view of one embodiment of a blade assembly (element 900A) having an opposing brake assembly 920A in place of the schematic representation of brake mechanism 920 of Figure 16A. The opposing detent assembly 920A is adapted to restrain the clamping plate 906 in position during substrate transfer. The embodiment shown in FIG. 16C is similar to the configuration shown in FIGS. 16A-B , except for the addition of the opposing brake assembly 920A, actuator assembly 910A, and support components, so for simplicity, where appropriate, Use the same component symbols. Embodiments of the robot blade assembly 900A generally include a blade base 901 , an actuator assembly 910A, an opposing brake mechanism 920A, a position sensor 930 , a clamp assembly 905 , a reaction member 908 , and a substrate support component 909 . In one embodiment, the clamping plate 906 is mounted on a linear slide (not shown) connected to the blade base 901 to align and constrain the clamping plate 906 in a desired orientation ( For example, movement in the X direction).

In one embodiment, the actuator assembly 910A includes an actuator 911, an actuator connecting rod 911A, a connecting member 912, a slide rail assembly 914, a connecting member 915, and a The connecting member 915 is connected to the connecting plate 916 of the clamping plate 906 . The joining member 912 may be a conventional joining joint or "floating joint" commonly used to join the various motion control components together. In one embodiment, the connecting plate 916 is directly connected to the actuator connecting rod 911A of the actuator 911 . The slide assembly 914 , which may be a conventional linear slide assembly, or a ball bearing slide, is coupled to the link plate 916 to align and guide the movement of the link plate, and thus the clamping plate 906 . The actuator 911 is adapted to set the clamping plate 906 by moving the connecting rod 911A, connecting member 912 , connecting member 915 , and connecting plate 916 . In one aspect, the actuator 911 is an air cylinder, linear motor, or other comparable arrangement and force transmission device.

In one embodiment, the opposing brake assembly 920A includes an actuator 921 coupled to the blade base 901 and coupled to a brake contact member 922 . In this configuration, the opposing detent assembly 921A is adapted to "lock" or restrain the clamping plate 906 resulting from the restraining force _F2 produced by the opposing detent assembly 920A. In one embodiment, the limiting force F ₂ is formed on the connecting plate 916 and the braking contact when the actuator 921 forces (element F ₃ ) the braking contact member 922 against the connecting plate 916 . Friction between the members 922 is formed. In this configuration, the slide rail assembly 914 is designed to accept a side load generated by the braking force F ₃ delivered by the actuator 921 . The resulting restraining force F ₂ holding the clamping plate 906 in position is equal to the braking force F ₃ multiplied by the coefficient of static friction created between the braking contact member 922 and the connecting plate 916 . The size of the actuator 921, and the selection of brake contact member 922 and the web 916 material and surface treatment can be optimized to ensure that the resulting restraining force is always greater than that generated during the acceleration of the substrate during transport. Any strength. In one aspect, the resulting restraining force _F2 is in the range of about 0.5 and about 3.5 kilogram-force (kgf). In one aspect, the braking contact member 922 can be made of rubber or polymer type material, such as polyurethane (polyurethane), ethylene-propylene rubber (EPDM), natural rubber, butyl rubber or other suitable polymer materials, and The connecting plate 916 is made of aluminum alloy or stainless steel alloy. In one embodiment, not shown, the linkage rod 911A of the actuator 911 is directly coupled to the clamping plate 906, and the brake contact member 922 of the opposing brake assembly 920A is adapted to contact either the linkage rod 911A or the clamping plate 906. Clamp the plates to keep them from moving.

Figure 16D schematically illustrates a plan view of one embodiment of the blade assembly 900A having a different configuration of the reverse detent assembly 920A than that shown in Figure 16C. In this configuration, the reverse brake assembly 920A includes a lever arm 923 connected to the brake contact member 922 at one end, the actuator 921 at the other end of the lever arm, and Pivot point "P" somewhere in between. In one aspect, the pivot point is connected to the blade base 901 and is adapted to support the lever arm 923 and feed from the actuator 921 to the The force F4 of the lever arm 923 . In this configuration, by strategically placing the pivot point "P", a mechanical advantage can be created with the lever arm 923, which can be used to supply force generating components beyond direct contact with the actuator 921 Contact the braking force F ₃ of the attainable force, thus limiting the force F ₂ .

Figure 16D also shows an embodiment of the blade assembly 900A that includes a compliant member 917 disposed between the clamping plate 906 and connecting member 915 to aid in sensing the presence or absence of a substrate on the blade assembly 900A. Once the restraining force _F2 has been applied to the attachment plate 916, the compliant member generally adds an additional degree of freedom for use with the position sensor 930 and controller 101 to sense the presence or absence of the substrate on the blade assembly 900A. If no other degrees of freedom exist in the blade assembly 900A, the restraining force _F2 that prevents or inhibits the movement of the clamping plate 906 would thus render the position sensor 930 and controller 101 unable to move the substrate before or during substrate transfer. Movement or loss of substrate.

Thus, in one embodiment, the actuator assembly 910 generally includes an actuator 911, an actuator linkage 911A, a coupling member 912, a slide rail assembly 914, a coupling member 915, a compliance member 917, a clamp plate slide Rail assembly 918 , and connecting plate 916 connected to the connecting member 912 and connected to the clamping plate 906 through the connecting member 915 and compliant member 917 . The clamping plate slide assembly 918 is typically a conventional linear slide assembly, or ball bearing slide, and is connected to the clamping plate 906 to align and guide the clamping plate in its movement.

The compliant member 917 is typically an elastic component, such as a spring, flexure, or other similar device, which transmits sufficient force upon release of the potential energy generated by the flexing of the device during application of the gripping force F ₁ to When the substrate moves or "lost," moves the clamping plate 906 by an amount easily measurable by the position sensor 930 . In one aspect, the compliant member 917 is a spring with a spring rate low enough that the spring can reach a "compressed height" when the gripping force _F1 is applied to the substrate. In another aspect, the connecting member 915, compliant member 917, and clamping plate 906 are designed such that when the gripping force _F1 is applied, the connecting member 915 will be in contact with, or bottom contact with, the clamping plate 906. on the clamp plate. An advantage of these types of configurations is to avoid changes in the gripping force _F1 during transport, since the compliant member 917 cannot flex further due to the acceleration experienced by the substrate during transport, which would reduce the number of particles produced And avoid the loss of this substrate.

The following steps are intended to show an example of how the compliant member 917 may be used to sense the presence of the substrate on the blade assembly 900A after applying the restraining force F ₂ to the connection plate 916 . In the first step, the actuator 911 applies the gripping force _F1 to the substrate through the contact member 907 and the reaction member 908 within the clamp assembly 905, which deflects the compliant member 917 allowing the The amount by which the gap "G" between the connecting member 915 and the clamping plate 906 is reduced. The controller 101 then checks to confirm that the clamping plate 906 is in an acceptable position by monitoring and noting the information received from the position sensor 930 . Once the substrate is sensed, and therefore at the intended location on the blade assembly 900A, the restraining force _F2 is applied to the web 916 to constrain the web in a direction parallel to the direction of the gripping force ( _F1 ). direction of movement. Then if the substrate moves, and/or becomes "un-gripped", the potential energy generated within the compliant member 917, due to flexing during the application of the gripping force F ₁ , will cause the substrate to The clamping plate 906 is moved away from the restricted connection plate 916 , which is then sensed by the position sensor 930 and the controller 101 . Movement of the clamp plate 906 registered by the position sensor 930 will cause the controller 101 to stop the transfer process or prevent the transfer process from occurring, which can help avoid damage to the substrate and system.

While the foregoing is directed to embodiments of the invention, other and further embodiments of the invention can be devised without departing from the essential scope of the invention, which is defined by the appended claims.

Claims (11)

1. A device for conveying substrates, comprising: a base having a support surface; a reaction member disposed on the base; an actuator connected to the base; a contact member connected to the actuator, wherein the actuator is adapted to push the contact member towards an edge of a substrate disposed on the support surface and supported by the reaction member; and brake member assembly, consisting of: brake components; a brake actuation member, wherein the brake actuation member is adapted to push the brake member towards the contact member to create a limiting force that inhibits movement of the contact member during substrate transport; and a lever arm having a first end connected to the brake actuating member and a second end connected to the brake member, wherein the lever arm is connected to the pivot point and adapted to generate a braking force that inhibits movement of the contact member , and the braking force is greater than the force generated by the brake actuating member. 2. The device as claimed in claim 1, wherein said restricting force is generated by contact between the stop member and the contact member. 3. The apparatus as claimed in claim 1, wherein said restricting force is a frictional force generated between the surface of the contact member and the braking member. 4. The apparatus of claim 1, further comprising a sensor coupled to the contact member and adapted to sense the position of the contact member. 5. The apparatus of claim 4, further comprising a controller in communication with the actuator and the sensor to sense misalignment of a substrate on the support surface. 6. A device for conveying substrates, comprising: a base having a support surface; a reaction member disposed on the base; Contact component components, including: actuators; and a contact member having a substrate contact surface and a compliant member disposed between the contact surface and the actuator, wherein the actuator is a substrate adapted to place the contact surface toward a surface against the reaction member promote; brake member assembly, consisting of: brake member: a brake actuation member adapted to push the brake member toward the contact member to inhibit movement of the contact member during substrate transfer; and a lever arm having a first end connected to the brake actuating member and a second end connected to the brake member, wherein the lever arm is connected to the pivot point and adapted to generate a braking force that inhibits movement of the contact member , and the braking force is greater than the force generated by the brake actuating member; and A sensor is connected to the contact member, wherein the sensor is adapted to sense the position of the contact surface. 7. The apparatus of claim 6, wherein said compliant member is a spring. 8. An apparatus for conveying substrates, comprising: Arm assembly, containing: a first robotic arm adapted to convey a substrate disposed on a blade of the robotic arm in a first direction; a first movement assembly having an actuator adapted to position the first robotic arm in a second orientation; and The second moving component is connected with the first moving component and has a second actuator, and the second actuator is suitable for disposing the first mechanical arm and the first moving component in a first direction perpendicular to the second direction. in three directions; and a substrate grabbing device, connected to the robotic arm blade, wherein the substrate grabbing device is adapted to support a substrate, and includes: a reaction member arranged on the blade of the mechanical arm; an actuator connected to the blade of the robotic arm; a contact member connected to the actuator, wherein the actuator is adapted to constrain the substrate by pushing the contact member towards an edge of the substrate disposed between the contact member and the reaction member; and brake member assembly, consisting of: brake components; a brake actuation member adapted to push the brake member toward the contact member to inhibit movement of the contact member during substrate transfer; and a lever arm having a first end connected to the brake actuating member and a second end connected to the brake member, wherein the lever arm is connected to the pivot point and adapted to generate a braking force that inhibits movement of the contact member , and the braking force is greater than the force generated by the brake actuating member. 9. The apparatus as claimed in claim 8, wherein the substrate gripping device further comprises a sensor connected to the contact member and adapted to sense the position of the contact member. 10. The apparatus of claim 9, wherein the substrate gripping device further comprises a controller communicating with the actuator and the sensor to sense the misalignment of the substrate. 11. The apparatus as claimed in claim 8, wherein the above-mentioned substrate gripping device further comprises a compliance member, the compliance member is arranged between the contact member and the actuator, and is adapted to move between the actuator and the actuator. The contact member stores energy as it is pushed toward the substrate surface.