CN102856482A - A kind of LED packaging structure - Google Patents

Abstract

An LED packaging structure belongs to the technical field of LED packaging structures. The manufacturing process of the LED packaging structure in the prior art is relatively complicated. The present invention is composed of a sealing layer, a PCB board, a heat dissipation substrate and a bottom glue layer connected together in sequence from top to bottom. A large concave cup or multiple small concave cups are designed in the sealing layer. An LED chip is designed on the PCB board in the large concave cup or each small concave cup. The LED chip is wired on the PCB circuit to generate a light-emitting circuit. A phosphor layer is provided on the inner wall of the large concave cup or each small concave cup. The materials used to manufacture the large concave cup or multiple small concave cups with sealing shape and light collection function are aluminum, copper, ceramic or polymer materials, etc. The polymer materials are PVC, PMMA, PPA or ABS and other materials. As an LED packaging structure, the present invention has a simple manufacturing process, good light efficiency, high production efficiency, and very reliable product quality, and at the same time solves the problems of high thermal conductivity and high voltage exposure.

Description

A kind of LED packaging structure

technical field

The present invention relates to the technical field of LED packaging structures, in particular to an LED packaging structure for solving high heat conduction and high-voltage exposure of LEDs.

Background technique

LED is a semiconductor lighting device that can convert electrical energy into visible light. LED lighting is an emerging industry developed in recent years. In recent years, with the decline of manufacturing costs and breakthroughs in technical bottlenecks such as luminous efficiency and light decay, my country's LED lighting industry has entered a stage of rapid development, and the application market has grown rapidly, which has led to a huge market for LED packaging products. There are many kinds of traditional LED packaging structures. For example, a Chinese invention patent application with application number 200910018662.0 proposes a LED packaging structure. The principle is to use a metal frame body. Fixed threads, the top of the frame body is provided with a pit with a built-in chip, the pit wall of the pit forms a reflective surface, the inside of the frame body is fixed with an electrode with an insulating layer, the upper end of the electrode is connected to the chip, and the lower end is located outside the frame body as a lead. The package structure is all metal to complete the LED package. Then, the metal frame body is used as the lead wire, and fixing screws are installed around the outer circumference of the metal frame. Although it plays the role of installation and fixing, the manufacturing process of this traditional LED package is relatively complicated and the cost is high. Another example is the Chinese utility model patent No. 200820004069.1, which proposes an LED packaging structure. The key point of the technology is to set up multiple LED modules in the structure, and then set electrodes on the gaps of the LED modules filled with plastic, and the electrodes are connected to the LEDs. The PN poles of the chip are electrically connected by gold wires. There is a transparent shell above the LED module, and transparent colloid is filled between the transparent shell and the LED module. Although this structure is compact and the heat dissipation effect is good, there are many The production process of each LED module is cumbersome, not suitable for mass production, and it is difficult to improve production efficiency. With the development of society and the continuous updating of science and technology, the LED packaging structure is also constantly being updated. People urgently hope that an LED packaging structure with simple manufacturing process, good light effect, high production efficiency and very reliable product quality will be available.

Contents of the invention

The technical problem to be solved by the present invention is to overcome the disadvantages of the LED package structure of the prior art that the manufacturing process is complex, not suitable for mass production and difficult to improve production efficiency, and to provide a LED package with simple production process, good light effect and high production efficiency. , LED packaging structure with very reliable product quality, and at the same time solve the problems of high thermal conductivity and high voltage exposure.

The technical solution adopted by the present invention to solve the technical problem is: an LED packaging structure, which is composed of a sealant layer, a PCB board, a heat dissipation substrate and a primer layer that are sequentially connected together from top to bottom. It is designed with a large concave cup or multiple small concave cups, an LED chip is designed on the PCB board in the large concave cup or each small concave cup, and a fluorescent lamp is arranged on the inner wall of the large concave cup or each small concave cup. powder layer.

In the above technical solution, the sealant layer, PCB board, heat dissipation substrate and primer layer are integrally formed with the external heat sink by pressing or pasting, or assembled with the external heat sink by screw connection together.

Materials selected for manufacturing heat dissipation substrates are materials such as aluminum, copper, iron or ceramics.

The PCB board is a single-sided circuit board or a double-sided circuit board. The PCB board can have high thermal conductivity or low thermal conductivity, and the LED chips are bonded on the PCB circuit to form a system of light-emitting circuits.

The material selected for making the primer layer is heat-conducting adhesive or pressure-sensitive adhesive.

Aluminum, copper, ceramics or polymer materials are used to manufacture large concave cups or multiple small concave cups with sealing molding and light-receiving functions. The polymer material is PVC, PMMA, PPA or ABS and other materials.

The beneficial effects of the present invention are: 1. Since the materials selected for manufacturing the heat dissipation substrate are aluminum, copper, iron or ceramics, which are common heat dissipation materials, the packaging cost is low, and the manufacturing process is very mature and stable. 2. A large concave cup or multiple small concave cups are set above the light-emitting area of the LED chip, which solves the problem of high voltage exposure; 3. This packaging structure also has the function of installation, and makes the light emitted by the LED chip undisturbed, improving 4. This packaging structure also has the functions of waterproof, moisture-proof, and high-voltage resistance; 5. When making this packaging structure, you only need to place the LED chip directly on the PCB for packaging, which is low in cost and simple in manufacturing process. 6. Since a phosphor layer is arranged on the inner wall of the large concave cup or each small concave cup, the light emitted by the LED chip is very soft and will not hurt the eyes. Therefore, this LED packaging structure has simple process, good luminous efficiency, high production efficiency, very reliable product quality, and solves the problems of high heat conduction and high voltage exposure at the same time.

Description of drawings

The present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

Fig. 1 is a schematic sectional view of the structure of the present invention.

In the figure, 1. Sealant layer; 2. LED chip; 3. Small concave cup; 4. Heat dissipation substrate; 5. PCB board; 6. Primer layer; 7. Phosphor layer.

Detailed ways

Referring to Fig. 1, Fig. 1 is a schematic cross-sectional view of a LED packaging structure described in this embodiment. This LED packaging structure is composed of a sealing layer 1, a PCB board 5, and a heat dissipation substrate sequentially connected together from top to bottom. 4 and primer layer 6, a plurality of small concave cups 3 are designed in the sealing layer 1, and an LED chip 2 is designed on the PCB board 5 in each small concave cup 3, and each small concave cup The inner wall of 3 is provided with a fluorescent powder layer 7 . The sealant layer 1, PCB board 5, heat dissipation substrate 4, and primer layer 6 are integrally formed with the external heat sink by pressing or pasting, or assembled with the external heat sink by screw connection . The materials selected for manufacturing the heat dissipation substrate 4 are materials such as aluminum, copper, iron or ceramics. The PCB board 5 is a single-sided circuit board or a double-sided circuit board. The PCB board 5 can have high thermal conductivity or low thermal conductivity, and the LED chip 2 is bonded on the PCB circuit to form a system light-emitting circuit. The material used to manufacture the primer layer 6 is thermally conductive adhesive or pressure sensitive adhesive. The primer layer 6 (heat-conducting adhesive or pressure-sensitive adhesive) is bonded together with the external heat sink. Aluminum, copper, pottery or macromolecular materials etc. are used for manufacturing a plurality of small concave cups 3 with sealing molding and light-receiving functions. The polymer material is PVC, PMMA, PPA or ABS and other materials.

When processing the LED package structure, first make a heat dissipation substrate 4 with materials such as aluminum, copper, or ceramics, attach a traditional PCB board 5 to the heat dissipation substrate 4, and bond the LED chip 2 on the PCB board 5, and place the LED chip 2. Place it directly on the PCB board 5 for packaging. The LED chip 2 is wired on the PCB circuit. Then, set a large concave cup or multiple small concave cups 3 above the LED light-emitting area. The bottom of the heat dissipation substrate 4 is a primer layer 6. The primer layer 6 can be heat-conducting adhesive or pressure-sensitive adhesive. This layer is bonded to the external heat sink. The LED packaging structure is fixed and molded together with the external heat sink by pressing or bonding or connecting with screws. .

A specific embodiment of the present invention has been described in detail above. However, it should be understood that the embodiments of the present invention are not limited to the above-mentioned embodiments, and the description of the embodiments is only used to help understand the spirit of the present invention. Under the spirit disclosed in the present invention, various changes made to the present invention shall be included in the protection scope of the present invention.

Claims (7)

1. An LED packaging structure, characterized in that: it consists of a sealant layer, a PCB board, a heat dissipation substrate and a primer layer that are sequentially connected together from top to bottom, and a large concave cup or a large concave cup is designed in the sealant layer A plurality of small concave cups, an LED chip is designed on the PCB board in the large concave cup or each small concave cup, and a phosphor layer is arranged on the inner wall of the large concave cup or each small concave cup. 2. A LED packaging structure according to claim 1, characterized in that: the sealant layer, PCB board, heat dissipation substrate and primer layer are integrally formed with an external heat sink by pressing or pasting , or assembled with an external heat sink by means of screw connection. 3. The LED packaging structure according to claim 1, wherein the material selected for manufacturing the heat dissipation substrate is aluminum, copper, iron or ceramic materials. 4. A LED packaging structure according to claim 1, characterized in that: the PCB board is a single-sided circuit board or a double-sided circuit board, the PCB board can have high thermal conductivity or low thermal conductivity, and the LED chip is wired on the PCB circuit A system light emitting circuit is formed on it. 5 . The LED packaging structure according to claim 1 , wherein the material selected for making the primer layer is heat-conducting adhesive or pressure-sensitive adhesive. 6 . 6. A LED packaging structure according to claim 1, characterized in that: aluminum, copper, ceramics or polymers are used to manufacture large concave cups or multiple small concave cups with sealing molding and light-receiving functions Material. 7. The LED package structure according to claim 6, wherein the polymer material is PVC, PMMA, PPA or ABS material.