CN102856229A - Wafer position detecting device and method in treatment cavity - Google Patents
Wafer position detecting device and method in treatment cavity Download PDFInfo
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- CN102856229A CN102856229A CN2012103668665A CN201210366866A CN102856229A CN 102856229 A CN102856229 A CN 102856229A CN 2012103668665 A CN2012103668665 A CN 2012103668665A CN 201210366866 A CN201210366866 A CN 201210366866A CN 102856229 A CN102856229 A CN 102856229A
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- 238000000034 method Methods 0.000 title claims abstract description 95
- 230000003760 hair shine Effects 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 7
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 89
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The invention provides a wafer position detecting device and method in a treatment cavity. The wafer position detecting device comprises a camera, a light source and a monitor, wherein the light source is arranged inside the wafer treatment cavity or outside the wafer treatment cavity to enable the light source to irradiate the inner part of the wafer treatment cavity; the camera is distributed in the wafer treatment cavity or on the side wall of the wafer treatment cavity to shoot the position of a wafer to be treated in the wafer treatment cavity; the monitor is arranged outside the wafer treatment cavity; the monitor is connected to the camera by a cable, so that the monitor can display the image shot by the camera in real time. According to the invention, an engineer can know the real-time position of the wafer to be treated by conveniently viewing the monitor, so that even though the position of the wafer in the treatment cavity is offset, the problem that the wafer is damaged when being moved can not occur, and the wafer treatment time also can not be prolonged.
Description
Technical field
The present invention relates to semiconductor fabrication process, more particularly, the present invention relates in a kind of process chamber wafer position checkout gear method in wafer position checkout gear and the process chamber.
Background technology
When wafer is processed in process chamber when processing since the problem of transmission or pallet may so that the position of wafer be offset.When wafer position was offset, equipment gave the alarm, in order to the situation of wafer position skew is informed engineer or operating personnel.
But even equipment has sent alarm when skew occurs wafer position, engineer or operating personnel still can't be known the physical location of wafer in process chamber.
Simultaneously, when when the wafer position skew equipment being given the alarm, need to come wafer in the mobile process chamber with manipulator, and because engineer or operating personnel can't be known the physical location of wafer in process chamber, so manipulator can not accurately pick up wafer when the contact wafer, thereby can produce the danger that makes wafer breakage.But, take out the wafer that skew occurs if open process chamber, although can avoid the danger of wafer breakage, prolonged the wafer-process time.
Therefore, in the prior art, when skew occurs wafer position in process chamber, or damage the problem of wafer can be moved wafer the time, or can prolong the wafer-process time.
Therefore, hope can provide the solution that a kind of problem of damaging wafer neither can be moved wafer when skew occurs wafer position in process chamber the time also can not prolong the wafer-process time.
Summary of the invention
Technical problem to be solved by this invention is for there being defects in the prior art, and wafer position checkout gear and method in the process chamber that a kind of problem of damaging wafer neither can be moved wafer when skew occurs wafer position in process chamber the time also can not prolong the wafer-process time is provided.
In order to realize above-mentioned technical purpose, according to a first aspect of the invention, provide wafer position checkout gear in a kind of process chamber, it comprises: video camera, light source and monitor; Wherein, described light source arrangement in described wafer-process chamber or be arranged in outside the wafer-process chamber so that described light source can to shine described wafer-process chamber inner; And wherein, described camera arrangements is in described wafer-process chamber or be arranged in wafer-process chamber sidewall in order to can take the position of the pending wafer of arranging in the described wafer-process chamber; And it is outside that described monitor is arranged in described wafer-process chamber; And described monitor is connected to described video camera by cable, thereby described monitor can show the image of described shot by camera in real time.
Preferably, when in described wafer-process chamber, having held pending wafer, described light source shines inside, described wafer-process chamber, and described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera in real time.
Preferably, when making equipment send wafer position skew alarm when the wafer position skew, when sending wafer position skew alarm, equipment starts described video camera, described light source and described monitor; After the startup, described light source shines inside, described wafer-process chamber, and described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera.
According to a second aspect of the invention, provide wafer position detection method in the process chamber, it is characterized in that comprising: utilized light source that inside, wafer-process chamber is shone; Utilize video camera that the position of pending wafer is taken; Utilize monitor to show the image of described shot by camera.
Preferably, when in described wafer-process chamber, having held pending wafer, described light source shines inside, described wafer-process chamber, and described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera in real time.
Preferably, when making equipment send wafer position skew alarm when the wafer position skew, when sending wafer position skew alarm, equipment starts described video camera, described light source and described monitor; After the startup, described light source shines inside, described wafer-process chamber, and described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera.
According to the present invention, engineer or operating personnel can be known the real time position of described pending wafer by checking easily described monitor.Thereby, even when skew occurs wafer position in process chamber, damage the problem of wafer in the time of also can not being moved wafer, and also can not prolong the wafer-process time.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows according to wafer position checkout gear in the process chamber of the embodiment of the invention.
Fig. 2 schematically shows the flow chart according to wafer position detection method in the process chamber of the embodiment of the invention.
Need to prove that accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Notice that the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
The＜the first embodiment 〉
Fig. 1 schematically shows according to wafer position checkout gear in the process chamber of the embodiment of the invention.
As shown in Figure 1, comprise according to wafer position checkout gear in the process chamber of the embodiment of the invention: video camera 4, light source 6 and monitor 7.Wherein, for example, energy source 2 provides energy for wafer-process.
Wherein, described light source 6 is arranged in the described wafer-process chamber 1 or is arranged in outside the wafer-process chamber 1 so that described light source 6 can shine 1 inside, described wafer-process chamber.
Specifically, for example, in specific embodiment, described light source 6 is arranged in the described wafer-process chamber 1, thereby obviously can shine 1 inside, described wafer-process chamber.Perhaps, in another specific embodiment, described light source 6 is arranged in outside the described wafer-process chamber 1, but can shine in described wafer-process chamber 1 by the window in described wafer-process chamber 1.
And wherein, described video camera 4 is arranged in the described wafer-process chamber 1 or is arranged in wafer-process chamber 1 sidewall in order to can take the position of the pending wafer 3 of described wafer-process chamber 1 interior layout.
And described monitor 7 is arranged in 1 outside, described wafer-process chamber, and more particularly, described wafer-process chamber 1 is arranged in the position that engineer or operating personnel conveniently check; And described monitor 7 is connected to described video camera 4 by cable 5, thereby described monitor 7 can show the image that described video camera 4 is captured in real time.
Thus, for example, in specific embodiment, when in described wafer-process chamber 1, having held pending wafer 3,1 inside, described light source 6 pairs of described wafer-process chamber is shone, the position of 4 pairs of described pending wafers 3 of described video camera is taken, and described monitor 7 shows the image that described video camera 4 is captured in real time.Thereby engineer or operating personnel can be known the real time position of described pending wafer 3 by checking easily described monitor 7.Thereby, even when skew occurs wafer position in process chamber, damage the problem of wafer in the time of also can not being moved wafer, and also can not prolong the wafer-process time.
Further preferably, in concrete preferred embodiment, when making equipment send wafer position skew alarm when the wafer position skew, when sending wafer position skew alarm, equipment starts described video camera 4, described light source 6 and described monitor 7.After the startup, 1 inside, described light source 6 pairs of described wafer-process chamber is shone, and the position of 4 pairs of described pending wafers 3 of described video camera is taken, and described monitor 7 shows the image that described video camera 4 is captured.Thereby, only when wafer skew alarm occurs, start light source, video camera and monitor, thereby save energy; And, when engineer or operating personnel can make in wafer position skew equipment send wafer position skew alarm by checking that easily described monitor 7 knows the real time position of described pending wafer 3.Thereby, even when skew occurs wafer position in process chamber, damage the problem of wafer in the time of also can not being moved wafer, and also can not prolong the wafer-process time.
The＜the second embodiment 〉
Fig. 2 schematically shows the flow chart according to wafer position detection method in the process chamber of the embodiment of the invention.
As shown in Figure 2, comprise according to wafer position detection method in the process chamber of the embodiment of the invention:
Utilize 1 inside, 6 pairs of wafer-process chambeies of light source to shine (step S1);
Utilize the position of 4 pairs of pending wafers 3 of video camera to take (step S2);
Utilize monitor 7 to show the image (step S3) that described video camera 4 is captured.
Thus, for example, in specific embodiment, when in described wafer-process chamber 1, having held pending wafer 3,1 inside, described light source 6 pairs of described wafer-process chamber is shone, the position of 4 pairs of described pending wafers 3 of described video camera is taken, and described monitor 7 shows the image that described video camera 4 is captured in real time.Thereby engineer or operating personnel can be known the real time position of described pending wafer 3 by checking easily described monitor 7.Thereby, even when skew occurs wafer position in process chamber, damage the problem of wafer in the time of also can not being moved wafer, and also can not prolong the wafer-process time.
Further preferably, in concrete preferred embodiment, when making equipment send wafer position skew alarm when the wafer position skew, when sending wafer position skew alarm, equipment starts described video camera 4, described light source 6 and described monitor 7.After the startup, 1 inside, described light source 6 pairs of described wafer-process chamber is shone, and the position of 4 pairs of described pending wafers 3 of described video camera is taken, and described monitor 7 shows the image that described video camera 4 is captured.Thereby, only when wafer skew alarm occurs, start light source, video camera and monitor, thereby save energy; And, when engineer or operating personnel can make in wafer position skew equipment send wafer position skew alarm by checking that easily described monitor 7 knows the real time position of described pending wafer 3.Thereby, even when skew occurs wafer position in process chamber, damage the problem of wafer in the time of also can not being moved wafer, and also can not prolong the wafer-process time.
Be understandable that although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. wafer position checkout gear in the process chamber is characterized in that comprising: video camera, light source and monitor; Wherein, described light source arrangement in described wafer-process chamber or be arranged in outside the wafer-process chamber so that described light source can to shine described wafer-process chamber inner; And wherein, described camera arrangements is in described wafer-process chamber or be arranged in wafer-process chamber sidewall in order to can take the position of the pending wafer of arranging in the described wafer-process chamber; And it is outside that described monitor is arranged in described wafer-process chamber; And described monitor is connected to described video camera by cable, thereby described monitor can show the image of described shot by camera in real time.
2. wafer position checkout gear in the process chamber according to claim 1, it is characterized in that, when in described wafer-process chamber, having held pending wafer, described light source shines inside, described wafer-process chamber, described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera in real time.
3. wafer position checkout gear in the process chamber according to claim 1, it is characterized in that, when making equipment send wafer position skew alarm when the wafer position skew, when sending wafer position skew alarm, equipment starts described video camera, described light source and described monitor; After the startup, described light source shines inside, described wafer-process chamber, and described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera.
4. wafer position detection method in the process chamber is characterized in that comprising:
Utilize light source that inside, wafer-process chamber is shone;
Utilize video camera that the position of pending wafer is taken;
Utilize monitor to show the image of described shot by camera.
5. wafer position detection method in the process chamber according to claim 4, it is characterized in that, when in described wafer-process chamber, having held pending wafer, described light source shines inside, described wafer-process chamber, described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera in real time.
6. wafer position detection method in the process chamber according to claim 4, it is characterized in that, when making equipment send wafer position skew alarm when the wafer position skew, when sending wafer position skew alarm, equipment starts described video camera, described light source and described monitor; After the startup, described light source shines inside, described wafer-process chamber, and described video camera is taken the position of described pending wafer, and described monitor shows the image of described shot by camera.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103668665A CN102856229A (en) | 2012-09-27 | 2012-09-27 | Wafer position detecting device and method in treatment cavity |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103668665A CN102856229A (en) | 2012-09-27 | 2012-09-27 | Wafer position detecting device and method in treatment cavity |
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| CN102856229A true CN102856229A (en) | 2013-01-02 |
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| CN2012103668665A Pending CN102856229A (en) | 2012-09-27 | 2012-09-27 | Wafer position detecting device and method in treatment cavity |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186521A (en) * | 2002-12-05 | 2004-07-02 | Sony Corp | Aligner |
| JP2006196833A (en) * | 2005-01-17 | 2006-07-27 | Toshiba Corp | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
| KR100783072B1 (en) * | 2006-12-27 | 2007-12-07 | 세메스 주식회사 | Substrate processing equipment |
| US20090249880A1 (en) * | 2008-04-07 | 2009-10-08 | Tech Semiconductor Singapore Pte Ltd | Real-time detection of wafer shift/slide in a chamber |
| JP4357619B2 (en) * | 1999-02-09 | 2009-11-04 | キヤノンアネルバ株式会社 | Multi-chamber system |
| CN101719462A (en) * | 2008-10-09 | 2010-06-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process chamber, plasma device and chamber state detecting method |
| KR20100077241A (en) * | 2008-12-29 | 2010-07-08 | 주식회사 동부하이텍 | Chemical vapor depostion device and method for using the same |
-
2012
- 2012-09-27 CN CN2012103668665A patent/CN102856229A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4357619B2 (en) * | 1999-02-09 | 2009-11-04 | キヤノンアネルバ株式会社 | Multi-chamber system |
| JP2004186521A (en) * | 2002-12-05 | 2004-07-02 | Sony Corp | Aligner |
| JP2006196833A (en) * | 2005-01-17 | 2006-07-27 | Toshiba Corp | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
| KR100783072B1 (en) * | 2006-12-27 | 2007-12-07 | 세메스 주식회사 | Substrate processing equipment |
| US20090249880A1 (en) * | 2008-04-07 | 2009-10-08 | Tech Semiconductor Singapore Pte Ltd | Real-time detection of wafer shift/slide in a chamber |
| CN101719462A (en) * | 2008-10-09 | 2010-06-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Process chamber, plasma device and chamber state detecting method |
| KR20100077241A (en) * | 2008-12-29 | 2010-07-08 | 주식회사 동부하이텍 | Chemical vapor depostion device and method for using the same |
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| PB01 | Publication | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140428 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20140428 Address after: 201203 Shanghai Zhangjiang hi tech park Zuchongzhi Road No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130102 |
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| WD01 | Invention patent application deemed withdrawn after publication |