CN102856215B - Column set-up device and method of ceramic column grid array device - Google Patents

Abstract

The invention relates to a column planting device and method for ceramic column grid array components, and belongs to the technical field of packaging of ceramic electronic components. The device includes base, welding post leveling mechanism, welding post positioning mechanism, ceramic shell positioning mechanism and upper cover from bottom to top; welding post leveling mechanism, welding post positioning mechanism, ceramic shell positioning mechanism and upper cover are fixed with screws Connection, the base and the welding post leveling mechanism are fixedly connected with screws; after connection, the post planting holes of the ceramic shell positioning mechanism and the welding post positioning mechanism are all located in the hollow part of the upper cover. The position degree and coplanarity of the welding posts of the column grid array components prepared by the invention are better.

Description

Pillar planting device and method for ceramic post grid array components

technical field

The invention relates to a column planting device and method for ceramic column grid array components, and belongs to the technical field of packaging of ceramic electronic components.

Background technique

With the rapid development of modern integrated circuit technology, the miniaturization, high speed and high reliability of integrated circuits require electronic components to be miniaturized and integrated, and at the same time, new packaging technologies are also emerging and developing. As the main packaging form of large-scale integrated circuits today, ball grid array packaging has been widely used in different fields. As a packaging form of ball grid array packaging, ceramic ball grid array packaging has the advantages of good electrothermal performance, strong air tightness, good moisture resistance and high reliability. The ceramic column grid array package is the development and improvement of the ceramic ball grid array package. The column grid is used to replace the ball grid, which greatly reduces the thermal fatigue caused by the mismatch of the thermal expansion system between the alumina ceramic shell and the epoxy resin printed circuit board. problem, thereby improving the reliability of the assembly. The ceramic pillar grid array package can realize many logic and microprocessor functions, and its package form determines its high temperature resistance, high pressure resistance and high reliability characteristics, and is suitable for large size and multiple I/O situations. Therefore, it occupies an important position in the field of electronic product manufacturing. Compared with the ball grid array, the pillar grid array has a small diameter, a high height, and is not easy to fix, which makes the process technology of the ceramic pillar grid array package difficult. The coplanarity and position degree of soldering pillars are the two main evaluation indicators of the quality of pillar planting process, which are directly related to the quality and reliability of the surface mount process of ceramic pillar grid array devices. Whether a high-precision ceramic column grid array component planting device and method can be developed to ensure the position and coplanarity of the welding column is a major bottleneck restricting the application of ceramic column grid array components in the field of electronic product manufacturing in my country one.

Contents of the invention

The object of the present invention is to propose a device and method for planting pillars of ceramic pillar grid array components. The device and method can make the welding pillars of ceramic pillar grid array components have good position and coplanarity, and effectively control It ensures the void rate at the solder joints, ensures the quality of the surface mount process when the ceramic column grid array components are assembled to the board level, and is easy to operate.

The purpose of the present invention is achieved through the following technical solutions.

The present invention proposes a pillar planting device for ceramic pillar grid array components, which sequentially includes a base, a welding pillar leveling mechanism, a welding pillar positioning mechanism, a ceramic shell positioning mechanism and an upper cover from bottom to top;

The base is a flat plate with a boss in the center, and the height of the boss is determined by the flattened thickness of the welding column;

The welding column leveling mechanism is a hollow plate; one side of the plate is a cutting edge, that is, the thickness of the side from the edge to the center gradually becomes smaller; the hollow part of the welding column leveling mechanism matches the boss of the base;

The welding column positioning mechanism is a flat plate, which is composed of several mesh plates of the same thickness. Its center has a post planting hole adapted to the diameter of the welding post to be welded;

The positioning mechanism of the ceramic shell is a hollow plate, and each side of the positioning mechanism of the ceramic shell has a limit platform, and the space composed of four limit platforms matches the ceramic shell; the hollow part between every two limit platforms Used for flux volatilization and heat conduction during reflow soldering;

The upper cover is a hollow flat plate, which is used to connect with the welding post leveling mechanism and combine the welding post positioning mechanism and the ceramic shell positioning mechanism through screws;

The welding post leveling mechanism, the welding post positioning mechanism, the ceramic shell positioning mechanism and the upper cover are fixedly connected with screws, and the base and the welding post leveling mechanism are fixedly connected with screws; The holes are all located in the hollow part of the upper cover.

The present invention proposes a method for planting pillars of ceramic pillar grid array components, the steps of which are:

1) Fix and connect the welding post leveling mechanism, welding post positioning mechanism, ceramic shell positioning mechanism and the upper cover with screws, and then use screws to fix the base with the welding post leveling mechanism;

2) Place the welding post to be welded in the post planting hole of the post positioning mechanism according to the distribution requirements of the ceramic shell pads, and pass through the post planting hole to the boss of the base;

3) Print solder paste on the solder pad of the ceramic shell, place the ceramic shell on the welding post, make the solder paste fully contact with the welding post to be welded, and position the ceramic shell through the limit platform on the positioning mechanism of the ceramic shell;

4) Put the pillar-planting device with the ceramic shell in the reflow furnace for reflow soldering of the solder joints. After the pillar-planting device cools down, remove the base, and use a cutting tool to pass the cutting edge of the welding pillar leveling mechanism to the surface of the welding pillar Carry out planarization treatment, and finally take out the ceramic shell with the solder post planted, that is, the component, from the post planting device.

Beneficial effect

The invention precisely limits the position of the welding post through the positioning mechanism of the welding post, so that the position of the welding post after the ceramic column grid array component is planted is good;

The invention effectively dissipates the gas generated by the flux during the reflow soldering process through the hollow part between the limiting bosses of the positioning mechanism of the ceramic shell, and conducts the heat effectively, so that the void rate at the solder joint after the reflow soldering is obtained. control;

The invention uses a welding post leveling mechanism combined with a cutting tool to make the surface of the welding post smooth after the ceramic column grid array component is planted, and the coplanarity of the welding post surface is better;

In the present invention, the welding post leveling mechanism, the welding post positioning mechanism, the ceramic shell positioning mechanism and the upper cover are first fixedly connected with screws, and then the base and the welding post leveling mechanism are fixedly connected with screws to facilitate the removal of the base;

The welding column positioning mechanism and the ceramic shell positioning mechanism in the present invention are composed of 0.1-0.6mm thick stencils precisely processed by laser; The precision of the overall device is also high, which meets the requirements of the ceramic column grid array components for the precision of welding post planting.

Description of drawings

Fig. 1 is the structural representation of column planting device of the present invention;

Fig. 2 is the structural representation of base;

Fig. 3 is a structural schematic diagram of a welding column leveling mechanism;

Fig. 4 is a structural schematic diagram of a welding post positioning mechanism;

Fig. 5 is a structural schematic diagram of a ceramic housing positioning mechanism;

Figure 6 is a structural schematic diagram of the upper cover;

Among them, 1-base, 2-welding column leveling mechanism, 3-welding column positioning mechanism, 4-ceramic shell positioning mechanism, 5-top cover.

Detailed ways

The present invention will be further described below in conjunction with drawings and embodiments.

Example 1

Require:

The pillar planting process is carried out on the LGA560 ceramic shell. The size of the ceramic shell pad is Φ0.89mm, the pitch is 1.27mm; the size of the welding pillar is Φ0.89mm, and the height is 2.2mm.

Implementation steps:

A column planting device suitable for CCGA560 ceramic column grid array components, the device sequentially includes a base 1, a welding column leveling mechanism 2, a welding column positioning mechanism 3, a ceramic shell positioning mechanism 4 and an upper cover 5 from bottom to top, As shown in Figure 1;

The base 1 is a flat plate with a boss in the center. The size of the flat plate is: 85mm×85mm×3mm, and the boss is 60mm×60mm×2mm, as shown in Figure 2;

The welding column leveling mechanism 2 is a hollow flat plate, the size of which is: 85mm × 85mm × 3mm, and the size of the hollow part is 60mm × 60mm, as shown in Figure 3; one side of the welding column leveling mechanism 2 is Cutting edge, that is, the thickness of the edge gradually decreases from the edge to the center, and the inclination is less than 10°. The hollow part of the welding post leveling mechanism 2 matches the boss of the base 1 . As shown in Figure 3;

The welding post positioning mechanism 3 is a flat plate, and the size of the flat plate is: 85mm×85mm×3mm. There is a post-planting hole in the center; it is composed of 5 stencils with a thickness of 0.5mm and precision laser processing. The diameter of the post-planting hole is 0.65-0.75mm and the pitch is 1.27mm. As shown in Figure 4;

The positioning mechanism 4 of the ceramic shell is a hollow flat plate, and the size of the flat plate is: 85mm×85mm×3mm. Each side of the positioning mechanism 4 of the ceramic shell has a limiting platform, and the size of the limiting is 20mm×2mm; the space formed by the four limiting platforms matches the ceramic shell; the hollow space between every two limiting platforms Some are used for the diffusion of gas or heat. As shown in Figure 5;

The upper cover 5 is a hollow flat plate, the size of which is: 85mm×85mm×3mm. It is used for connecting with the welding post flattening mechanism 2 and combining the welding post positioning mechanism 3 and the ceramic shell positioning mechanism 4 through screws. As shown in Figure 6;

The welding post leveling mechanism 2, the welding post positioning mechanism 3, the ceramic shell positioning mechanism 4 and the upper cover 5 are fixedly connected with screws, and the base 1 and the welding post leveling mechanism 2 are fixedly connected with screws; after the connection, the ceramic shell positioning mechanism 4 and the The post-planting holes of the welding post positioning mechanism 3 are all located in the hollow part of the upper cover 5 .

Place the combined welding post positioning mechanism, ceramic shell positioning mechanism and welding post leveling mechanism between the upper cover and the lower cover, and then fix the upper cover, welding post positioning mechanism, ceramic shell positioning mechanism, welding The column leveling mechanism and the lower cover are fixed to ensure that the relative positions of each component remain unchanged, see Figure 1.

Place the welding posts in the positioning holes of the corresponding welding posts according to the array arrangement of the LGA560 pads, and ensure that the bottom surface of the welding posts touches the bottom platform. Evenly print a certain amount of solder paste on the pads of the LGA560 case, and place the LGA560 case upside down in the positioning mechanism of the ceramic case through the alignment device to ensure that the solder on each pad is in full contact with the corresponding solder post. Place the post-planting device with the components placed in the reflow furnace stably for reflow soldering. The peak temperature of reflow soldering is 250-275°C, and the reflow time is 30-60s. The solder is melted during the reflow process, and the pad and the solder post are fully connected together. After the pillar planting device is cooled to room temperature, the lower cover is removed by unscrewing the screws, the surface of the welding pillar is smoothed by a cutting tool, and the cut off welding pillar end is cleaned. Finally, the pick-up device is used to remove the components from the post-planting device without damage.

Claims (6)

1. Ceramic column grid array components and parts plant a column device, it is characterized in that: this device comprises base (1), welding column leveling mechanism (2), welding column detent mechanism (3), ceramic package detent mechanism (4) and upper cover (5) from the bottom up successively;

   Centered by base (1) with the flat board of boss;

   The flat board that welding column leveling mechanism (2) is hollow; A dull and stereotyped side is cutting edge, and the boss of the hollow part of welding column leveling mechanism (2) and base (1) matches;

   Welding column detent mechanism (3) is a flat board, is combined by web plate; Post hole is planted with what adapt with welding column diameter to be welded in its center;

   The flat board that ceramic package detent mechanism (4) is hollow, each side of ceramic package detent mechanism (4) is respectively with a limiting stand, and space and the ceramic package of four limiting stand compositions match; Between every two limiting stands, be hollow;

   The flat board that upper cover (5) is hollow;

   Welding column leveling mechanism (2), welding column detent mechanism (3), ceramic package detent mechanism (4) and upper cover (5) are fixedly connected with, and base (1) is fixedly connected with welding column leveling mechanism (2); After connection, the hollow part of planting post hole and be all positioned at upper cover (5) of ceramic package detent mechanism (4) and welding column detent mechanism (3).
2. A kind of Ceramic column grid array components and parts according to claim 1 plant column device, it is characterized in that: web plate is to carry out precision machinedly with laser, and the web plate that welding column detent mechanism (3) is 0.5mm precise laser processing by 5 thickness combines.
3. A kind of Ceramic column grid array components and parts according to claim 1 plant column device, it is characterized in that: cutting edge diminishes to the thickness at center gradually from the edge of welding column leveling mechanism (2), the gradient of cutting edge is less than 10 °.
4. Ceramic column grid array components and parts plant a column method, it is characterized in that steps of the method are:

   1) welding column leveling mechanism (2), welding column detent mechanism (3), ceramic package detent mechanism (4) and upper cover (5) are fixedly connected with, then base (1) are fixedly connected with welding column leveling mechanism (2);

   2) requirement welding column to be welded being distributed according to ceramic package pad is placed on planting in post hole of welding column detent mechanism (3), and through planting post hole to the boss of base (1);

   3) printed solder paste on the pad of ceramic package, is positioned over ceramic package on welding column, solder(ing) paste is fully contacted with welding column to be welded, and by the limiting stand on ceramic package detent mechanism (4), ceramic package is positioned;

   4) planting column device and carrying out the Reflow Soldering of solder joint of ceramic package will be placed with, base (1) is taken off after cooling wait planting column device, by the cutting edge of welding column leveling mechanism (2), planarizing process is carried out in welding column surface with cutting tools, finally the ceramic package of having planted welding column is taken out from plant column device.
5. A kind of Ceramic column grid array components and parts according to claim 4 plant column method, it is characterized in that: step 4) in Reflow Soldering in reflow ovens, carry out.
6. 6. according to the column method of planting of a kind of Ceramic column grid array components and parts described in claim 4 or 5, it is characterized in that: the peak temperature of Reflow Soldering is 250～275 DEG C, return time is 30～60s.