CN102854954A - Water cooler for graphic cards - Google Patents
Water cooler for graphic cards Download PDFInfo
- Publication number
- CN102854954A CN102854954A CN2012103072888A CN201210307288A CN102854954A CN 102854954 A CN102854954 A CN 102854954A CN 2012103072888 A CN2012103072888 A CN 2012103072888A CN 201210307288 A CN201210307288 A CN 201210307288A CN 102854954 A CN102854954 A CN 102854954A
- Authority
- CN
- China
- Prior art keywords
- top cover
- cover plate
- water
- heat
- water cooler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 239000006185 dispersion Substances 0.000 abstract description 4
- 230000005855 radiation Effects 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Abstract
The invention provides a water cooler for graphic cards. The water cooler can ensure that the heat at each position of a graphic card can be uniformly dispersed, so that the heat dispersion of the graphic card is good, and the water cooler can guarantee the performance of the graphic card in operation, and can ensure that the graphic card cannot fail due to the problem in heat dispersion. The water cooler comprises a top cover plate and a microcut cooling plate, the top end surface of the top cover plate is provided with a water outlet and a water inlet, and the microcut cooling plate is covered by the top cover plate. The water cooler is characterized in that: the heat-dispersing area of the microcut cooling plate is packaged in the cavity defined by the top cover plate and the microcut cooling plate assembled together, the cavity respectively communicates with the water outlet and the water inlet, and heat-dispersing posts in a rectangular array are arranged in the heat-dispersing area of the microcut cooling plate.
Description
Technical field
The present invention relates to the cooling technology field of computer display card, be specially the water cooling plant of video card.
Background technology
Present computer display card cooling, air-cooled and this dual mode of water-cooled of general employing, be accompanied by the development of video card process chip, its thermal value that produces in the course of the work constantly promotes, in order to guarantee the normal operation of good heat dispersion and video card, its air-cooled necessary high rotating speed fan cooled that adopts, high rotating speed fan brings huge noise and vibrations, makes the people vexed.And existing cooling by water mode, its water cooling module cooling is that chilled water is at the mobile heat of taking away of parallel groove, because the groove both sides are the evagination thin plate, itself so that the heat of evagination thin plate correspondence below be difficult for being absorbed, inhomogeneous so that absorb heat, and then so that the local location heat dispersion of video card is not good, easily cause video card because heat dissipation problem breaks down or performance reduces.
Summary of the invention
For the problems referred to above, the invention provides the water cooling plant of video card, it is so that each position heat radiation of video card is even, thermal diffusivity is good, and the performance when guaranteeing video card work can not break down because of heat dissipation problem video card.
The water cooling plant of video card, its technical scheme is such: it comprises top cover plate, little cutting coldplate, the upper surface of described top cover plate is provided with water delivering orifice, water inlet, described top cover plate mounts cover in described little cutting coldplate, it is characterized in that: the heat dissipation region of described little cutting coldplate is packaged in described top cover plate, little cutting coldplate, and both mount cover in the formed cavity, described cavity is communicated with respectively described water delivering orifice, water inlet, and the heat dissipation region of described little cutting coldplate is placed with the thermal column of rectangular array.
After using structure of the present invention, after chilled water passes into water inlet, gap between thermal column covers the heat dissipation region of whole little cutting coldplate, it has increased the contact area of chilled water and heat dissipation region, and then the heat of taking away is many, and the heat dissipation region of little cutting coldplate because the heating region of video card is fitted is so that each position heat radiation of video card is even, thermal diffusivity is good, performance when guaranteeing video card work can not break down because of heat dissipation problem video card.
Description of drawings
Fig. 1 is structural representation assembling stereogram of the present invention.
Embodiment
See Fig. 1, it comprises top cover plate 1, little cutting coldplate 2, the upper surface of top cover plate 1 is provided with water delivering orifice 3, water inlet 4, top cover plate lid 1 is loaded on little cutting coldplate 2, the heat dissipation region 5 of little cutting coldplate 2 is packaged in top cover plate 1, little cutting coldplate 2, and both mount cover in the formed cavity, cavity is communicated with respectively, water delivering orifice 3, water inlet 4, the heat dissipation region 5 of little cutting coldplate 1 is placed with the thermal column 6 of rectangular array, and video card 7 is equipped with in heat dissipation region 5 belows of little cutting coldplate 1.
Claims (1)
1. the water cooling plant of video card, it comprises top cover plate, little cutting coldplate, the upper surface of described top cover plate is provided with water delivering orifice, water inlet, described top cover plate mounts cover in described little cutting coldplate, it is characterized in that: the heat dissipation region of described little cutting coldplate is packaged in described top cover plate, little cutting coldplate, and both mount cover in the formed cavity, described cavity is communicated with respectively described water delivering orifice, water inlet, and the heat dissipation region of described little cutting coldplate is placed with the thermal column of rectangular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103072888A CN102854954A (en) | 2012-08-27 | 2012-08-27 | Water cooler for graphic cards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103072888A CN102854954A (en) | 2012-08-27 | 2012-08-27 | Water cooler for graphic cards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102854954A true CN102854954A (en) | 2013-01-02 |
Family
ID=47401598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103072888A Pending CN102854954A (en) | 2012-08-27 | 2012-08-27 | Water cooler for graphic cards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102854954A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1588267A (en) * | 2004-09-08 | 2005-03-02 | 西安交通大学 | Water cooling type CPU radiator |
| GB2449951A (en) * | 2007-11-07 | 2008-12-10 | Vadim Chobanu | Cooling device for a graphics card |
| CN201417421Y (en) * | 2009-05-07 | 2010-03-03 | 无锡市福曼科技有限公司 | Micro-channel highly-effective water cooling exchanger |
| CN202008995U (en) * | 2010-11-19 | 2011-10-12 | 武汉热诺金属科技有限公司 | Upright-array type water-cooled radiator |
| CN202335187U (en) * | 2011-11-15 | 2012-07-11 | 昆山谷捷金属制品有限公司 | Water-cooled cylindrical needle-type pure copper radiator |
-
2012
- 2012-08-27 CN CN2012103072888A patent/CN102854954A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1588267A (en) * | 2004-09-08 | 2005-03-02 | 西安交通大学 | Water cooling type CPU radiator |
| GB2449951A (en) * | 2007-11-07 | 2008-12-10 | Vadim Chobanu | Cooling device for a graphics card |
| CN201417421Y (en) * | 2009-05-07 | 2010-03-03 | 无锡市福曼科技有限公司 | Micro-channel highly-effective water cooling exchanger |
| CN202008995U (en) * | 2010-11-19 | 2011-10-12 | 武汉热诺金属科技有限公司 | Upright-array type water-cooled radiator |
| CN202335187U (en) * | 2011-11-15 | 2012-07-11 | 昆山谷捷金属制品有限公司 | Water-cooled cylindrical needle-type pure copper radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130102 |
|
| RJ01 | Rejection of invention patent application after publication |