CN102842670B - Light emitting device module - Google Patents

Abstract

A light emitting device module is disclosed. The light emitting device module includes: a first lead frame and a second lead frame electrically separated from each other; a light emitting device electrically connected to the first lead frame and the second lead frame, the light emitting device includes a first conductive type semiconductor layer, an active layer and A light emitting structure of the second conductive type semiconductor layer; a bank provided at a peripheral region of the light emitting device; a resin layer surrounding the light emitting device and provided at a region inside the bank; and a reflection member provided at the bank and include a slope formed on at least one side surface of the reflective member.

Description

Light emitting device module

technical field

Embodiments relate to light emitting device modules.

Background technique

Due to the development of thin film growth technology and device materials, light-emitting devices such as light-emitting diodes or laser diodes using Group III-V or Group II-VI compound semiconductor materials have realized various colors of light, such as red light, green light, blue light and ultraviolet light, and achieve white light with high efficiency by using fluorescent materials or by color mixing.

Due to the development of this technology, light-emitting devices are increasingly being used not only in display devices but also in transmission modules for optical communication units, replacements for cold cathode fluorescent lamps (CCFLs) that constitute backlights for liquid crystal display (LCD) devices LED backlights, lighting fixtures using white light-emitting diodes to replace fluorescent or incandescent lamps, vehicle headlights, and traffic lights.

The light emitting device is mounted on the package body, thereby forming a light emitting device package. In the light emitting device package, a pair of lead frames are mounted on a package body formed of silicon or PPA resin, and the light emitting device is electrically connected to the lead frames.

Contents of the invention

The embodiment provides a light emitting device module.

In one embodiment, the light emitting device module includes: a first lead frame and a second lead frame electrically separated from each other; a light emitting device electrically connected to the first lead frame and the second lead frame, the light emitting device includes a semiconductor having a first conductivity type a light emitting structure of layers, an active layer, and a second conductive type semiconductor layer; a bank provided at a peripheral region of the light emitting device; a resin layer surrounding the light emitting device and provided at a region inside the bank; and a reflective member, The reflective member is disposed at a peripheral region of the bank and includes a slope formed on at least one side surface of the reflective member.

A bank may be disposed between the reflective member and the light emitting device.

The inner surface of the reflective member may be inclined.

The light emitting device module may further include first and second electrode pads disposed on at least partial regions of the first and second lead frames, respectively.

At least one of the first electrode pad and the second electrode pad may include silver Ag.

The banks may be arranged in a circular or oval shape around the light emitting device.

The horizontal cross-section of the slope may form a curved shape around the light emitting device.

The height of the banks may be 40 μm to 60 μm.

At least one stepped structure may be formed on the upper surface of the bank.

Edges of the resin layer may be set to a stepped structure.

A groove may be formed on an upper surface of the bank, and an edge of the resin layer is provided to the groove.

The light emitting device module may further include a Photo Solder Resist (PSR) layer disposed between the first lead frame and the second lead frame.

A reflective member may be disposed on the PSR layer.

The reflective member and the PSR layer may be connected by a fixing member.

The fixing member may be double-sided adhesive or double-sided tape.

Banks can be formed on top of the PSR layer by printing.

At least one lead frame of the first lead frame and the second lead frame may contact the heat dissipation layer through an insulating layer disposed between the at least one lead frame and the heat dissipation layer.

An insulating layer may be disposed between the heat dissipation layer and the PSR layer.

The width of the uppermost end of the slope of the reflection member may be 1.5 times to 2 times the width of the resin layer provided to the bank.

In another embodiment, the light emitting device module includes: a first lead frame and a second lead frame disposed on the package body and electrically separated from each other; a light emitting device electrically connected to the first lead frame and the second lead frame, the light emitting device It includes a light emitting structure having a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; and a resin layer surrounding the light emitting device and disposed on the package body, wherein the edge of the connection area between the package body and the resin layer Set with sealant.

The resin layer may include a first resin layer and a second resin layer, the first resin layer being configured to convert light having a wavelength within a first wavelength range emitted from the light emitting device into light having a wavelength within a second wavelength range , the second resin layer is disposed around the first resin layer and configured to change a path of light emitted from the first resin layer.

The height of the first resin layer may be equal to the height of the package.

An encapsulant may be disposed on the package.

The sealant may include a primer composition.

Banks may be provided on the package.

The width of the lower portion of the bank may be greater than the width of the upper portion of the bank.

The vertical cross-section of the bank may have a trapezoidal shape.

The vertical cross section of the bank may have a V shape or a bottle shape.

The cross-sectional area of the upper portion of the bank may be smaller than the cross-sectional area of the lower portion of the bank.

The banks may be covered with a primer composition.

The edge of the resin layer may be inserted into the bank.

The banks may be provided at least three positions near the edge of the resin layer.

The bank may be provided in a ring shape along the edge of the resin layer.

Description of drawings

Arrangements and embodiments may be described in detail with reference to the following drawings, in which like reference numerals refer to like elements, in which:

1 is a longitudinal sectional view of a light emitting device module according to a first embodiment;

2 to 7 are longitudinal sectional views illustrating a manufacturing process of the light emitting device module of FIG. 1;

8 to 11 are longitudinal sectional views of light emitting device modules according to second to fifth embodiments, respectively;

FIG. 12 is a view showing one example of a wiring structure of the light emitting device of part 'A' of FIG. 1;

13 is a longitudinal sectional view of a light emitting device module according to a sixth embodiment;

14 is a view showing an arrangement of a light emitting device module array and a light guide plate;

15 and 16 are views showing a light emitting device module array;

17 is a longitudinal sectional view of a light emitting device module according to a seventh embodiment;

18 to 23 are views illustrating various examples of part "A" of FIG. 17 in detail;

24 is a longitudinal sectional view of a light emitting device module according to an eighth embodiment;

25 is an exploded perspective view of a lighting device including a light emitting device module according to one embodiment;

26 is an exploded perspective view of an image display device including a light emitting device module according to an embodiment; and

FIG. 27 is a view illustrating one example of driving of the light emitting device module of the image display apparatus of FIG. 26 .

detailed description

Hereinafter, embodiments will be described with reference to the drawings.

It will be understood that when an element is referred to as being "on" or "under" another element, it can be directly on/under the other element, but one or more intervening elements may also be present. When referring to an element being "on" or "under", "on the element" and "under the element" may be included based on the element.

Fig. 1 is a longitudinal sectional view of a light emitting device module according to a first embodiment.

The light emitting device module 100 according to the present embodiment includes: a pair of first and second lead frames 140a and 140b electrically separated from each other; and the light emitting device 10 electrically connected to the first and second lead frames 140a and 140b. The first lead frame 140 a and the second lead frame 140 b contact the heat dissipation layer 120 through the insulating layer 130 .

The heat dissipation layer 120 may be formed of a material having excellent thermal conductivity such as aluminum (Al), and the insulating layer 130 may be formed of a material having excellent thermal conductivity to transfer heat released from the first and second lead frames 140a and 140b to heat dissipation layer 120 .

The thickness t ₁ of the heat dissipation layer 120 may be 0.6 mm, and the thickness t ₂ of the insulating layer 130 may be 0.1 mm. Individual values may have a tolerance of 10%.

A printed Photo Solder Resist (PSR) layer 160 may be disposed on the insulating layer 130 between the first lead frame 140a and the second lead frame 140b. The PSR layer 160 may improve brightness of the light emitting device module. The PSR layer 160 may be formed of an insulating layer to prevent an electrical short between the first lead frame 140a and the second lead frame 140b.

Electrode pads 150a and 150b may be disposed on the upper surface of the first lead frame 140a and the upper surface of the second lead frame 140b, respectively. The electrode pads 150a and 150b may be formed of silver (Ag). Although FIG. 1 shows that the electrode pads 150a and 150b are disposed at the same area as the first lead frame 140a and the second lead frame 140b, the electrode pads 150a and 150b may also be disposed at the first lead frame 140a and the second lead frame 140b. at least part of the area. The electrode pads 150a and 150b may include first and second electrode pads.

The first lead frame 140a and the second lead frame 140b may have a thickness of 0.05mm, and the electrode pads 150a and 150b may have a thickness of 0.01mm. The thickness of the first lead frame 140a and the second lead frame 140b may be 5 times the thickness of the electrode pads 150a and 150b, and these data may have a tolerance of 10%.

The first lead frame 140a and the second lead frame 140b may reflect light emitted from the light emitting device 10 to increase light efficiency. Here, the electrode pads 150a and 150b formed of silver (Ag) may increase light reflection.

The light emitting device 10 may be electrically connected to the first lead frame 140a and the second lead frame 140b, and may be one of a vertical type light emitting device, a horizontal type light emitting device, and a flip chip type light emitting device. In this embodiment, the light emitting device 10 electrically contacts one lead frame 140 a through the conductive adhesive layer 110 , and electrically contacts the other lead frame 140 b through the wire 105 .

In these or other embodiments, light emitting device 10 may be a semiconductor light emitting device, such as a light emitting diode.

The resin layer 180 may surround the light emitting device 10 to protect the light emitting device 10 . In addition, the resin layer 180 may include a phosphor 185 to change the wavelength of light emitted from the light emitting device 10 . The resin layer 180 may cover at least the light emitting device 10 and the wire 105 .

Light having a wavelength within the first wavelength range emitted from the light emitting device 10 can be excited by the phosphor 185, and converted into light having a wavelength within the second wavelength range, and, after passing through an optical path changing unit such as a lens ( not shown), the optical path of light having a wavelength within the second wavelength range may be changed.

The lens may change an optical path of light emitted from the light emitting device 10 and having a wavelength changed by the phosphor 185 by refraction, and particularly, the lens may adjust an orientation angle when the light emitting device module is used in a backlight unit.

The lens may be formed of a material having excellent light transmittance such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or a resin injection-molded product.

In addition, a bank 170 may be provided at a peripheral region of the light emitting device 10 , and the bank 170 may fix an edge of the resin layer 180 . That is, after forming the resin layer 180 surrounding the light emitting device 10 , the resin layer 180 is disposed at a region inside the bank 170 with the edge of the resin layer 180 fixed by the bank 170 . The bank 170 may be provided in a circular or oval shape. Also, the bank 170 may fix the edge of the resin layer 180 .

The height of the bank 170 may be 40 μm to 60 μm. If the height of the bank 170 is too low, the bank 170 may not be able to fix the resin layer 180 sufficiently, and if the height of the bank 170 is too high, the bank 170 may affect the light emitted from the light emitting device 10 along the Go horizontally.

In addition, the reflective member 190 may be disposed at a predetermined interval from the bank 170 . In this embodiment, since no cavity is provided around the light emitting device 10, and thus the light emitted from the light emitting device 10 can be largely released toward the side surface of the light emitting device module 100, the reflective member 190 can reflect light emitted toward the side surface. light to adjust the orientation angle of the light emitting device module 100.

The reflective member 190 may be formed of a material having high reflectivity, and may include a slope on an inner surface a thereof as shown in FIG. 1 to increase reflection efficiency of light emitted from the light emitting device 10 . As the fixing member 195 fixing the reflective member 190 to the PSR layer 160, a double-sided adhesive or a double-sided tape may be used.

The width W _R of the uppermost end of the slope of the reflective member 190 becomes an opening through which light emitted from the light emitting device module 100 is released. The width W _R of the opening may be 1.5 to 2 times the width W _v of the resin layer 180 fixed to the bank 170 , and may have a large range because the reflective member 190 has an elliptical shape.

Although this embodiment shows that one light emitting device is disposed in one light emitting device module, multiple light emitting devices may be disposed in one light emitting device module. If three light emitting devices are arranged in one light emitting device module, light emitting devices emitting red light, green light and blue light can be arranged in the light emitting device module.

2 to 7 are longitudinal sectional views illustrating a manufacturing process of the light emitting device module of FIG. 1 .

First, as shown in FIG. 2 , an insulating layer 130 is prepared on the heat dissipation layer 120 . The heat dissipation layer 120 may be formed of aluminum, and the insulating layer 130 may be formed of an insulating material having excellent thermal conductivity.

After that, as shown in FIG. 3 , the first lead frame 140 a and the second lead frame 140 b and the electrode pads 150 a and 150 b are disposed on the insulating layer 130 . The first lead frame 140a and the second lead frame 140b may be formed by preparing a material having excellent conductivity, such as copper (Cu), on the surface of the insulating layer 130 and then patterning the material using a mask.

The electrode pads 150a and 150b may be patterned to have an area equal to or smaller than that of the first lead frame 140a and the second lead frame 140b. The electrode pads 150a and 150b may prevent discoloration of the first and second lead frames 140a and 140b and may increase reflectivity of the first and second lead frames 140a and 140b. The electrode pads 150a and 150b may be formed by coating, and may be provided in multiple layers using SiO ₂ or TiO ₂ .

Next, as shown in FIG. 4, the portion between the first lead frame 140a and the second lead frame 140b is filled with the PSR layer 160, thereby preparing a region where a reflection member or a resin layer is to be formed, and preventing the first lead frame 140a from contacting with the second lead frame 140b. An electrical short between the second lead frames 140b.

Afterwards, as shown in FIG. 5 , the light emitting device 10 is provided to one lead frame 140a and the electrode pad 150a provided thereon through the conductive adhesive layer 110, and the light emitting device 10 is electrically connected to the other lead frame 140b through the wire 105 And the electrode pad 150b provided thereon.

Afterwards, the bank 170 is provided at the peripheral area of the light emitting device 10 . Banks 170 for fixing the resin layer may be disposed on the PSR layer 160 by printing such as screen printing.

Thereafter, as shown in FIG. 6, the resin layer 180 may be disposed around the light emitting device 10 by applying or hardening the resin. The resin layer 180 may include a phosphor 185 and may be provided in a circular or elliptical shape by fixing the bank 170 at the edge of the resin layer 180 .

After that, as shown in FIG. 7 , the reflective member 190 may be fixed to the upper surface of the PSR layer 160 by the fixing member 195 . A cavity formed by the PSR layer 160 and the reflective member 190 may serve as a reflective cup. The inner surface of the reflective member 190 may be inclined, and the reflective member 190 may prevent foreign substances from the outside from penetrating through the moisture-proof coating.

8 to 11 are longitudinal sectional views of light emitting device modules according to second to fifth embodiments, respectively.

In the embodiment shown in FIG. 8, a V-shaped groove or a U-shaped groove is provided on the upper surface of the bank 170, and the edge of the resin layer 180 is fixed to the groove. Here, fixing the edge of the resin layer 180 may be facilitated by the groove.

In the embodiment shown in FIG. 9 , the upper surface of the bank 170 is rounded, and the edge of the resin layer 180 is secured to the rounded upper surface of the bank 170 .

In the embodiment shown in FIG. 10 and the embodiment shown in FIG. 11 , stepped structures or grooves are formed on the upper surface of the bank 170 to help fix the edges of the resin layer 180 . In the embodiment shown in FIG. 10 , a stepped structure is formed on the upper surface of the bank 170 such that the edge of the bank 170 is positioned higher than the rest of the bank 170 . Furthermore, in the embodiment shown in FIG. 11 , a stepped structure or a groove is formed on the upper surface of the bank 170 to fix the edge of the resin layer 180 .

FIG. 12 is a view showing one example of a wiring structure of the light emitting device of part 'A' of FIG. 1 .

The horizontal type light emitting device of FIG. 1 is provided, the first electrode 10 a is connected to the first lead frame 140 a through the wire 105 , and the second electrode 10 b is connected to the second lead frame 140 b through the wire 105 . Here, electrode pads may be disposed on surfaces of the first lead frame 140a and the second lead frame 140b, respectively.

In this embodiment, the first lead frame 140a and the second lead frame 140b are arranged in a diagonal manner around the horizontal light emitting device 10, and thus it is possible to reduce the gap between the first lead frame 140a and the second lead frame 140b in the light emitting device. The setup area within the module.

Fig. 13 is a longitudinal sectional view of a light emitting device module according to a sixth embodiment.

Unlike the above-described embodiment, in this embodiment, the bank 170 is omitted, and the reflective member 190 fixes the edge of the resin layer 180 . Although the present embodiment shows that the height of the resin layer 180 is lower than that of the reflective member 190 , the height of the resin layer 180 may be higher than that of the reflective member 190 .

FIG. 14 is a view showing an arrangement of a light emitting device module array and a light guide plate. If in the embodiment shown in FIG. 14, the height of the resin layer is higher than the height of the reflective member, or the resin layer is provided with a lens so that the height of the lens is higher than the height of the reflective member, then when the light emitting device is used in the backlight unit In the case of a module, the light guide plate can be provided in the manner described below.

In FIG. 14 , a plurality of recesses are formed at one edge of the light guide plate, and the light emitting device modules 100 are disposed in the recesses, respectively. That is, if the light emitting device module 100 directly contacts the light guide plate when the height of the lens or the resin layer in the light emitting device module 100 is maximum, the resin layer or the lens may be damaged. Therefore, a concave portion is formed on the light guide plate to prevent the resin layer or the lens from directly contacting the light guide plate, which will be described below.

In the above embodiments and the embodiments to be described below, both the resin layer and the lens can change the path of light emitted from the light emitting device, the resin layer can be referred to as a first resin layer, and the lens can be referred to as a second resin layer .

In addition, an inner surface of the recess formed on the light guide plate may be coated with a phosphor layer. In this case, the phosphor in the resin layer of the light emitting device may be omitted.

15 and 16 are views illustrating a light emitting device module array.

The first lead frame 140a may provide a driving signal to the light emitting device, and thus may be commonly used in each light emitting device and may be an anode. The second lead frame 140b may be respectively connected to the light emitting devices, and may be a cathode.

In FIG. 15, the area B where the bank is to be provided is provided at the edge of the area where the light emitting device is to be provided, the electrode pad 150a may be provided on the first lead frame 140a at the area where the light emitting device is to be provided, and another electrode The pad 150b may be disposed at a region where the second lead frame 140b is to be connected to the light emitting device. Such an arrangement of the electrode pads 150a and 150b may be applied to a vertical type light emitting device. In addition, the first lead frame 140a and the second lead frame 140b are disposed, and the PSR layer 160 may be exposed at other regions.

In FIG. 16, the light emitting device 10 is arranged on the electrode pad 150a of the first lead frame 140a of FIG. at the edge of B.

The shape of the reflective member 190 greatly affects the projected area of light emitted from the light emitting device. In this embodiment, the reflective member 190 is provided in an oval shape, and the horizontal cross section of the reflective member 190, that is, when the reflective member 190 is cut in a direction parallel to the arrangement direction of the first lead frame and the second lead frame, A cross-section of the slope on the inner surface of the reflective member 190 forms an elliptical shape. Here, the elliptical shape of the slope of the inner surface of the reflective member 190 may be configured such that a major radius of the elliptical shape of the slope is 180% to 220% of a short radius of the elliptical shape of the slope.

Fig. 17 is a longitudinal sectional view of a light emitting device module according to a seventh embodiment.

In this embodiment, the light emitting device module 200 includes a body 202, a first lead frame 240a and a second lead frame 240b mounted on the body 202, mounted on the body 202 and electrically connected to the first lead frame 240a and the second lead The light emitting device 10 of frame 240 b and the resin layer 280 surrounding the side surface and/or the upper surface of the light emitting device 10 .

The body 202 may be formed of silicon, synthetic resin, or metal. If the body 202 is formed of a conductive material such as metal, the surface of the body 202 is covered with an insulating layer (not shown) to prevent an electrical short between the first lead frame 240a and the second lead frame 240b.

The first lead frame 240 a and the second lead frame 240 b are electrically separated from each other, and supply current to the light emitting device 10 . In addition, the first and second lead frames 240a and 240b may reflect light emitted from the light emitting device 10 to increase light efficiency, and may discharge heat generated from the light emitting device 10 to the outside.

The light emitting device 10 may be one of a vertical type light emitting device, a horizontal type light emitting device and a flip type light emitting device, and may be mounted on the body 202 or on the first or second lead frame 240a or 240b. In this embodiment, the light emitting device 10 is electrically connected to the first lead frame 240 a through the conductive adhesive layer 210 , and is electrically connected to the second lead frame 240 b through the wire 205 . The light emitting device 10 may be connected to the lead frames 240a and 240b by a flip chip method or a chip bonding method instead of a wire bonding method.

The resin layer 280 may surround the light emitting device 10 to protect the light emitting device 10 . In addition, the resin layer 280 may include a phosphor 285 to change the wavelength of light emitted from the light emitting device 10 . The resin layer 280 may surround at least the light emitting device 10 and the wire 205 .

Light having a wavelength within the first wavelength range emitted from the light emitting device 10 can be excited by the phosphor 285 and converted into light having a wavelength within the second wavelength range, and, after passing through an optical path changing unit such as a lens 270 , the optical path of light having a wavelength within the second wavelength range may be changed.

The lens 270 may change an optical path of light emitted from the light emitting device 10 and having a wavelength changed by the phosphor 280 by refraction, and particularly, the lens 270 may adjust an orientation angle if the light emitting device module is used in a backlight unit.

The lens 270 may be formed of a material having excellent light transmittance, such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PE), or a resin injection-molded product.

The lens 270 may be fixed to the upper surface of the body 202 by an adhesive disposed between the lens 270 and the body 202 . Here, gaps may be generated on the interface between the body 202 and the lens 270 due to differences in material properties, and moisture or oxygen may penetrate into the light emitting device module through such gaps.

Therefore, the lens 270 and the body 202 need to be sealed at the edge shown by part 'D' in the interface between the body 202 and the lens 270 to prevent moisture or oxygen from infiltrating into the light emitting device module from the outside.

18 to 23 are views illustrating various examples of part 'D' of FIG. 17 in detail. Hereinafter, an example of part "D" of FIG. 17 will be described with reference to FIGS. 18 to 23 .

In the structure shown in FIG. 18 , a groove 281 is formed on the body 202 at the connection area between the lens 270 and the body 202 . The groove 281 may have a structure in which the lens 270 may be inserted in a fixed manner.

In the structure shown in FIG. 19 , a groove 282 is formed on the body 202 such that the width W _a of the lower portion of the groove 282 is greater than the width W _b of the upper portion of the groove 282 . Specifically, as shown in FIG. 19 , the vertical cross section of the groove 282 has a trapezoidal shape.

In the structure shown in FIG. 19, the edge of the lens 270 is inserted into the groove 282, and thus the connecting force between the edge of the lens 270 and the body 202 can be increased. In addition, the connection path between the edge of the lens 270 and the body 202 is extended, and thus the infiltration path of moisture or oxygen from the outside is extended, and the possibility of foreign substances infiltrating into the light emitting device module may be reduced.

In the structure shown in FIG. 20, a groove 283 is formed on the body 202 such that the cross-sectional area of the lower portion 283a of the groove 283 is larger than the cross-sectional area of the upper portion 283b of the groove 283, thereby preventing the Foreign substances penetrate into the light emitting device module.

The groove 283 may be formed in a bottle shape such that the cross-sectional area of the upper portion 283b is smaller than that of the lower portion 283a.

When the lens 270 is formed of an injection-molded product using resin, the lens 270 may be hardened with the lower portion 283a of the groove 283 formed on the body 202 of FIG. 20 completely filled with lens material. In this case, the connection force between the lens 270 and the formation 283 can be further increased.

In the structure of FIG. 21A , a bank 284 is provided at the edge of the body 202 where the lens 270 is attached. The bank 284 can prevent moisture or oxygen from the outside from penetrating into the gap between the edge of the lens 270 and the body 202 .

As shown in FIG. 21B , if the banks 284 are provided at three locations on the edge of the lens 270 , the banks 284 can fix the lens 270 . When the lens 270 is fixed, no gap is generated between the lens 270 and the body 202, and thus the infiltration of heterogeneous foreign substances can be prevented.

In addition, as shown in FIG. 21C , a bank 284 having a ring shape may be provided along the edge of the lens 270 to surround the lens 270 . Here, the bank 284 may serve as a blocking layer against external substances, and for fixing the lens 270 .

In the structure shown in FIG. 22 , a sealant 290 is provided on the body 202 at the connection area between the groove 281 of the body 202 and the lens 270 . The groove 281 can increase the connection path between the lens 270 and the body 202, and can increase the connection force between the lens 270 and the body 202, and the sealant 290 can completely prevent the infiltration of external substances.

Sealant 290 may be provided on trenches 282 , 283 , and 285 and bank 284 shown in FIGS. 18 to 21A and 23 , as well as on trench 281 in FIG. 22 . The grooves 282 , 283 and 285 described above may function in the same manner as the bank 284 . The sealant 290 may be formed of a material capable of increasing the connection force between the body 202 and the lens 270, and in particular, may be a primer composition.

That is, the sealant 290 may be formed by performing primer treatment on the surface of the body 202 . The primer treatment refers to a polymer treatment performed on a substrate such as a polymer film for strengthening the connection force between the polymer film, the body 202 and the sealant 290 .

A polymeric material such as acrylic, ester, or urethane may be used in the primer treatment, and the sealant 290 may be formed by applying or covering the polymeric material on a substrate. Here, the primer composition may be provided in multiple layers to increase the connection force between the sealant 290 , the body 202 and the lens 270 .

Fig. 24 is a longitudinal sectional view of a light emitting device module according to an eighth embodiment.

The light emitting device module in the present embodiment has the same structure as that of the light emitting device module shown in FIG. 17 except that the center of the upper surface of the lens 270 is depressed. This lens 270 shape is used to adjust the orientation angle of the light emitting device module, and can be transformed into other shapes.

In the light emitting device module described above, due to the increase in the connection force between the body 202 and the lens 270, the extension of the connection path between the body 202 and the lens 270, and the sealing with the primer composition, moisture from the outside is prevented. The infiltration of gas or oxygen, and thus the durability of the light emitting device is improved by preventing the infiltration of moisture or oxygen from the outside, thereby prolonging the life of the light emitting device module and preventing the reduction of color perception.

A plurality of arrays of light emitting device modules according to the embodiment may be disposed on a substrate, and optical members such as a light guide plate, a prism sheet, a diffusion sheet, and the like may be disposed on an optical path of the light emitting device modules. The light emitting device module, the substrate, and the optical member can be used as a light unit. According to another embodiment, the light emitting device module or the semiconductor light emitting device according to the above embodiments may constitute a display device, an indicating device, or a lighting system, and, for example, the lighting system may include a lamp or a street lamp. Hereinafter, a lighting device and an image display device will be described as examples of a lighting system including the above light emitting device module.

FIG. 25 is an exploded perspective view of a lighting device including a light emitting device module according to one embodiment.

The lighting device according to the present embodiment includes a light source 600 that emits light, a cover 400 for installing the light source 600 therein, a heat dissipation unit 500 that dissipates heat generated by the light source 600, and connecting the light source 600 and the heat dissipation unit 500 to the cover 400 The cage 700.

The cover 400 includes a socket connector 410 connected to an electrical socket (not shown), and a body 420 connected to the socket connector 410 and accommodating the light source 600 . An airflow hole 430 may be formed through the body 420 .

A plurality of airflow holes 430 may be provided on the body 420 of the cover 400 . One airflow hole 430 may be provided, or a plurality of airflow holes 430 may be provided in a radial shape (as shown in FIG. 25 ) or various other shapes.

The light source 600 includes a plurality of light emitting device packages 650 on a substrate 610 . Here, the substrate 610 may have a shape capable of being inserted into the opening of the cover 400, and may be formed of a material having high thermal conductivity to transmit heat to the heat dissipation unit 500, which will be described below.

The holder 700 is disposed under the light source 600 . The holder 700 may include a frame and airflow holes. In addition, although not shown in FIG. 25 , an optical member may be further disposed under the light source 600 to diffuse, scatter, or condense light emitted from the light emitting device package 650 of the light source 600 .

FIG. 26 is an exploded perspective view of an image display device including a light emitting device module according to an embodiment.

As shown in FIG. 26, an image display device 800 according to this embodiment includes a light source module, a reflective plate 820 disposed on a bottom cover 810, a light source module that emits light, and a light source module disposed in front of the reflective plate 820 to reflect light emitted from the light emitting module. The light guide plate 840 leading to the front of the display device, the first prism sheet 850 and the second prism sheet 860 arranged in front of the light guide plate 840, the panel 870 arranged in front of the second prism sheet 860, and the color filter arranged in front of the panel 870 device 880.

The light emitting module includes a substrate 830 and a light emitting device module 835 disposed on the substrate 830 . Here, the substrate 830 may be a PCB, and the light emitting device module 835 may be the above-mentioned light emitting device module.

The bottom cover 810 may accommodate components inside the display device 800 . In addition, the reflective plate 820 may be provided as a separate component as shown in FIG. 26 , or may be provided by covering the rear surface of the light guide plate 840 or the front surface of the bottom cover 810 with a material having high reflectivity.

Here, the reflective plate 820 may be formed of a material having high reflectivity, and may be used as an ultrathin film such as polyethylene terephthalate (PET).

In addition, the light guide plate 840 diffuses the light emitted from the light emitting device module 835 to uniformly distribute the light across the entire screen of the liquid crystal display. Accordingly, the light guide plate 840 may be formed of a material having a high refractive index and high transmittance, such as polymethyl methacrylate (PMMA), polycarbonate (PC), or polyethylene (PE).

The first prism sheet 850 may be formed on one surface of the support film from a polymer having light transmittance and elasticity, and the polymer may have a prism layer in which a plurality of 3D structures are repeated. Here, as shown in FIG. 26, a plurality of structures may be provided in a stripe pattern in which ridges and valleys are repeated.

An arrangement direction of ridges and valleys on one surface of the support film of the second prism sheet 860 may be perpendicular to an arrangement direction of ridges and valleys on one surface of the support film of the first prism sheet 850 . This serves to evenly distribute the light emitted from the light source module and the light from the reflective sheet over the entire surface of the panel 870 .

Although the present embodiment shows that the optical sheet includes a first prism sheet 850 and a second prism sheet 860, the optical sheet may also include other combinations, such as a microlens array, a combination of a diffusion sheet and a microlens array, or a prism sheet and a microlens Combination of arrays.

The panel 870 may adopt a liquid crystal display panel or other types of display devices that require a light source in addition to the liquid crystal display panel.

The panel 870 has a structure in which a liquid crystal layer is located between two glass substrates, and polarizing plates are respectively installed on the glass substrates to utilize polarization of light. Here, the liquid crystal layer has an intermediate property between a liquid and a solid, in which liquid crystals, organic molecules having fluidity like liquids, are regularly arranged, and the liquid crystal layer displays images by changing molecular arrangement with an external electric field.

A liquid crystal display panel used in a display device is an active matrix type, and uses transistors as switches that adjust voltage applied to individual pixels.

Also, the color filter 880 is disposed on the front surface of the panel 870, and transmits only red, green, and blue light projected by the panel 870 per pixel to display an image.

FIG. 27 is a view illustrating one example of driving of the light emitting device module of the image display apparatus of FIG. 26 .

The driver of the light emitting device module supplies a driving signal or current to each string 310 through the substrate 320 and the connector. Six to eight light emitting device modules 300 are arranged in each string 310 . Here, when different driving signals are supplied to the light emitting device modules 300 disposed in the respective strings 310 , light may be individually supplied to areas separated from each other by dotted lines on the light guide plate 840 .

Although embodiments have been described with reference to a number of illustrative embodiments thereof, it should be understood that numerous other modifications and embodiments can be devised by those skilled in the art that will fall within the spirit and scope of the principles of this disclosure. More particularly, various changes and modifications may be made in the components and/or arrangements of the subject combination arrangement within the scope of the disclosure, the drawings and the appended claims. Besides changes and modifications in parts and/or arrangements, alternative uses will be apparent to those skilled in the art.

Claims (39)

1. a light emitting device module, including:

First lead frame and the second lead frame, described first lead frame and described second lead frame are the most electric Separate；

Luminescent device, described luminescent device is electrically connected to described first lead frame and described second lead-in wire Frame, described luminescent device includes having the first conductive-type semiconductor layer, active layer and the second conductivity type half The ray structure of conductor layer；

Bank, described bank is arranged at the outer peripheral areas of described luminescent device；

Resin bed, described resin bed is around described luminescent device and within being arranged on described bank At region；With

Reflecting member, described reflecting member is arranged at the outer peripheral areas of described bank and includes shape Inclined-plane at least one side surface of Cheng Qi,

On the upper surface of described bank, wherein form at least one step structure；Or described Form groove on the upper surface of bank, and the edge of described resin bed is set to described groove.

Light emitting device module the most according to claim 1, wherein said bank be arranged on described instead Penetrate between component and described luminescent device.

Light emitting device module the most according to claim 1, the inner surface of wherein said reflecting member is Tilt.

Light emitting device module the most according to any one of claim 1 to 3, also includes the first electrode Pad and the second electronic pads, described first electronic pads and described second electronic pads are separately positioned on described first On at least part of region of lead frame and described second lead frame.

Light emitting device module the most according to claim 4, wherein said first electronic pads and described At least one in two electronic padses comprises silver Ag.

Light emitting device module the most according to any one of claim 1 to 3, wherein said bank It is arranged on around described luminescent device with circular or ellipse.

Light emitting device module the most according to any one of claim 1 to 3, wherein said inclined-plane Level cross-sectionn forms the shape of bending around described luminescent device.

Light emitting device module the most according to any one of claim 1 to 3, wherein said bank Height be that 40 μm are to 60 μm.

Light emitting device module the most according to claim 1, the edge of wherein said resin bed is set To described step structure.

Light emitting device module the most according to any one of claim 1 to 3, also includes being arranged on institute State the photosensitive solder resist oxidant layer between the first lead frame and described second lead frame.

11. light emitting device modules according to claim 10, wherein said reflecting member is arranged on institute State in photosensitive solder resist oxidant layer.

12. light emitting device modules according to claim 11, wherein said reflecting member and described sense Light solder mask layer is connected by fixing component.

13. light emitting device modules according to claim 12, wherein said fixing component is double-sided adhesive Mixture or two-sided tape.

14. light emitting device modules according to claim 10, wherein said bank is formed at described In photosensitive solder resist oxidant layer.

15. light emitting device modules according to any one of claim 1 to 3, wherein said first draws At least one in wire frame and described second lead frame by be arranged at least one lead frame described with Insulating barrier between heat dissipating layer and be arranged on described heat dissipating layer.

16. light emitting device modules according to claim 15, also include being arranged on described first lead-in wire Photosensitive solder resist oxidant layer between frame and described second lead frame, wherein photosensitive with described at described heat dissipating layer Insulating barrier is set between solder mask layer.

17. light emitting device modules according to any one of claim 1 to 3, wherein said reflection structure The width of the top on the described inclined-plane of part is the width of the described resin bed arranging described bank 1.5 times to 2 times.

18. light emitting device modules according to claim 4, wherein said luminescent device is by described first Electronic pads is electrically connected to described first lead frame, and is electrically connected to described second by described second electronic pads Lead frame.

19. light emitting device modules according to claim 10, wherein said photosensitive solder resist oxidant layer is at water Square upwards contact with described first lead frame and described second lead frame.

20. light emitting device modules according to claim 10, wherein said photosensitive solder resist oxidant layer is being hung down Nogata is upwards the most overlapping with described first lead frame and described second lead frame.

21. light emitting device modules according to claim 10, wherein said photosensitive solder resist oxidant layer, institute State the first lead frame and described second lead frame is the part of bottom in chamber.

22. light emitting device modules according to claim 21, wherein said inclined-plane is the side in described chamber Surface.

23. light emitting device modules according to claim 10, also include the first electronic pads and the second electricity Polar cushion, described first electronic pads and described second electronic pads are separately positioned on described first lead frame and institute Stating at least part of region of the second lead frame, the upper surface of wherein said photosensitive solder resist oxidant layer is with described The upper surface of the first electronic pads and described second electronic pads is the most flat.

24. light emitting device modules according to claim 1, wherein from the end of described light emitting device module Portion to the lower surface of described reflecting member height with from the bottom of described light emitting device module to described First lead frame is identical with the height of the upper surface of described second lead frame or is higher than from described luminous organ The bottom of part module is to described first lead frame and the height of the upper surface of described second lead frame.

25. light emitting device modules according to claim 1, wherein from the end of described light emitting device module Portion is higher than from described light emitting device module to described dike shape to the height of the lower surface of described reflecting member The height of the lower surface of thing.

26. 1 kinds of light emitting device modules, including:

First lead frame and the second lead frame, described first lead frame and described second lead frame are arranged on On packaging body and electrically separated from each other；

Luminescent device, described luminescent device is electrically connected to described first lead frame and described second lead-in wire Frame, described luminescent device includes having the first conductive-type semiconductor layer, active layer and the second conductivity type half The ray structure of conductor layer；With

Resin bed, described resin bed is around described luminescent device and is arranged on described packaging body,

Wherein the edge at described packaging body Yu the join domain of described resin bed arranges sealant.

27. light emitting device modules according to claim 26, wherein said resin bed includes the first tree Lipid layer and the second resin bed being arranged on around described first resin bed, described first resin bed is configured to The light with the wavelength in the range of first wave length sent from described luminescent device is converted into and has The light of the wavelength in the range of second wave length, and described second resin bed is configured to change from described the The path of the light that one resin bed sends.

28. light emitting device modules according to claim 27, the height of wherein said first resin bed Height equal to described packaging body.

29. according to the light emitting device module according to any one of claim 26 to 28, wherein said sealing Agent is arranged on described packaging body.

30. according to the light emitting device module according to any one of claim 26 to 28, wherein said sealing Agent includes primer composition.

31. according to the light emitting device module according to any one of claim 26 to 28, wherein in described envelope On dress body, bank is set.

32. light emitting device modules according to claim 31, the width of the bottom of wherein said bank Degree is more than the width on the top of described bank.

33. light emitting device modules according to claim 31, the vertical cross sectional of wherein said bank Mask has trapezoidal shape.

34. light emitting device modules according to claim 31, the vertical cross sectional of wherein said bank Mask has V-shape or ampuliform.

35. light emitting device modules according to claim 31, the horizontal stroke on the top of wherein said bank Area of section is less than the cross-sectional area of the bottom of described bank.

36. light emitting device modules according to claim 31, wherein said bank is coated with bottom Coating composition.

37. light emitting device modules according to claim 31, the edge of wherein said resin bed inserts In described bank.

38. are positioned close to according to the light emitting device module described in claim 37, wherein said bank At least three position at the described edge of described resin bed.

39. according to the light emitting device module described in claim 37, and wherein said bank is along described tree The described edge of lipid layer is arranged to annular.