CN102836998A - Preparation method for spot-welding electrode with high abrasion resistance, high strength and high conductivity - Google Patents
Preparation method for spot-welding electrode with high abrasion resistance, high strength and high conductivity Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 238000005299 abrasion Methods 0.000 title claims 5
- 238000003466 welding Methods 0.000 title abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 53
- 239000000843 powder Substances 0.000 claims abstract description 39
- 238000005245 sintering Methods 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910017767 Cu—Al Inorganic materials 0.000 claims abstract description 28
- 239000000956 alloy Substances 0.000 claims abstract description 25
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 22
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000000498 ball milling Methods 0.000 claims description 11
- 239000011812 mixed powder Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910002804 graphite Inorganic materials 0.000 claims description 7
- 239000010439 graphite Substances 0.000 claims description 7
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- 229910052760 oxygen Inorganic materials 0.000 description 12
- 229910052799 carbon Inorganic materials 0.000 description 9
- 238000003825 pressing Methods 0.000 description 9
- 229910052719 titanium Inorganic materials 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 239000007772 electrode material Substances 0.000 description 6
- 238000004377 microelectronic Methods 0.000 description 6
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 5
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 5
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- BERDEBHAJNAUOM-UHFFFAOYSA-N copper(I) oxide Inorganic materials [Cu]O[Cu] BERDEBHAJNAUOM-UHFFFAOYSA-N 0.000 description 2
- KRFJLUBVMFXRPN-UHFFFAOYSA-N cuprous oxide Chemical compound [O-2].[Cu+].[Cu+] KRFJLUBVMFXRPN-UHFFFAOYSA-N 0.000 description 2
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Abstract
一种高耐磨高强度高导电点焊电极的制备方法,采用低固溶Cu-Al合金,其铝含量不大于0.50wt%,TiC粉末,粒度20~60mm,含量在占总质量的12.14wt%~26.56wt%,氧化剂按质量百分比占Cu-Al粉的2.5%~5%;余量为Cu;其制备工艺包括:氧化剂、TiC粉末和Cu-Al合金粉的混合;内氧化;冷(热)挤压(轧制)变形;其中氧化剂为工业Cu2O,烧结内氧化同步进行,烧结温为900~1000℃,内氧化时间2~6h;本发明工艺方法制备的弥散铜点焊电极不仅具有高耐磨、高强度、高导电性、高抗软化温度,而且具有内氧化时间短、成本低、效率高的优点。A method for preparing a high-wear-resistant, high-strength, and high-conductivity spot welding electrode, using a low-solid-solution Cu-Al alloy with an aluminum content of no more than 0.50wt%, TiC powder with a particle size of 20-60mm, and a content of 12.14wt% of the total mass %~26.56wt%, the oxidant accounts for 2.5%~5% of the Cu-Al powder by mass percentage; the balance is Cu; its preparation process includes: mixing of oxidant, TiC powder and Cu-Al alloy powder; internal oxidation; cold ( hot) extrusion (rolling) deformation; wherein the oxidant is industrial Cu 2 O, the sintering internal oxidation is carried out simultaneously, the sintering temperature is 900~1000°C, and the internal oxidation time is 2~6h; the dispersed copper spot welding electrode prepared by the process of the present invention Not only has high wear resistance, high strength, high conductivity, high resistance to softening temperature, but also has the advantages of short internal oxidation time, low cost and high efficiency.
Description
技术领域 technical field
本发明涉及金属基复合材料科学技术领域,具体的说是涉及一种高耐磨高强度高导电点焊电极的制备方法。 The invention relates to the scientific and technical field of metal matrix composite materials, in particular to a preparation method of a spot welding electrode with high wear resistance, high strength and high conductivity.
背景技术 Background technique
高耐磨高强度高导电铜基复合材料是一类具有优良综合性能的新型功能材料,既具有优良的耐磨性、导电性,又具有高的强度和优越的高温性能。随着电子工业的发展,尤其是上世纪70年代末美国SCM公司开发了Glidcop系列Al2O3弥散强化Cu复合材料以后,高强度高导电铜基复合材料在美国、日本等发达国家开发研究异常活跃,并已进入实用化阶段。而我国对这类材料的研究起步较晚,到上世纪80年代末90年代初进行了这类材料的研究,但尚未进入实用化阶段。纯铜和现有牌号的铜合金材料的耐磨性、导电性、强度及高温性能往往难以兼顾,不能全面满足航空、航天、微电子等高技术迅速发展对其综合性能的要求,如微电子器件点焊电极材料要求:硬度大于等于110 HBS,电导率大于等于85%IACS,抗高温软化温度大于等于923 K。 High-wear-resistant, high-strength, and high-conductivity copper-based composite materials are a new type of functional material with excellent comprehensive properties. They not only have excellent wear resistance and electrical conductivity, but also have high strength and superior high-temperature performance. With the development of the electronics industry, especially after the American SCM company developed the Glidcop series Al 2 O 3 dispersion strengthened Cu composite materials in the late 1970s, the development and research of high-strength and high-conductivity copper-based composite materials in the United States, Japan and other developed countries is abnormal. Active, and has entered the practical stage. However, the research on this kind of material started relatively late in our country. The research on this kind of material was carried out in the late 1980s and early 1990s, but it has not yet entered the stage of practical application. It is often difficult to balance the wear resistance, electrical conductivity, strength and high temperature performance of pure copper and copper alloy materials of existing grades, and cannot fully meet the comprehensive performance requirements of the rapid development of aviation, aerospace, microelectronics and other high-tech, such as microelectronics Requirements for device spot welding electrode materials: hardness greater than or equal to 110 HBS, electrical conductivity greater than or equal to 85% IACS, high temperature resistance and softening temperature greater than or equal to 923 K.
弥散铜是一种具有高耐磨、高导电、高强度、高抗软化温度的优良电子结构功能材料,广泛应用于大功率电真空管、微电子器件管脚、集成电路引线框架、微波通信、电力输送等领域,在国防工业和电子信息产业具有广泛应用。 Dispersed copper is an excellent electronic structural functional material with high wear resistance, high conductivity, high strength, and high resistance to softening temperature. It is widely used in high-power electric vacuum tubes, microelectronic device pins, integrated circuit lead frames, microwave communications, electric power Transportation and other fields are widely used in the defense industry and electronic information industry.
传统弥散铜的制造技术多采用粉末冶金法,其中以粉末内氧化粉末冶金法应用最为广泛,其常用技术流程为:合金熔炼→制粉→内氧化→还原→压制→烧结→热加工→冷加工。由于这种制造技术工艺流程复杂,造成材料质量控制困难,成本非常高,极大地限制了其推广应用。我国市场上的弥散铜大多为美国、日本公司产品,国产规模非常小,难以满足国防和社会发展需求。 The traditional manufacturing technology of dispersed copper mostly adopts powder metallurgy method, among which powder internal oxidation powder metallurgy method is the most widely used, and its common technical process is: alloy smelting → powder making → internal oxidation → reduction → pressing → sintering → thermal processing → cold processing. Due to the complex process of this manufacturing technology, it is difficult to control the quality of materials and the cost is very high, which greatly limits its popularization and application. Most of the dispersed copper in the Chinese market is the product of American and Japanese companies, and the domestic scale is very small, which is difficult to meet the needs of national defense and social development.
发明内容 Contents of the invention
本发明为了解决上述耐磨性差、强度低、导电性差、材料质量控制困难以及成本高的不足,提供一种高耐磨高强度高导电点焊电极的制备方法,该工艺方法制备的弥散铜点焊电极不仅具有高耐磨、高强度、高导电性、高抗软化温度,而且具有内氧化时间短、成本低、效率高的优点。 In order to solve the above-mentioned shortcomings of poor wear resistance, low strength, poor conductivity, difficult material quality control and high cost, the present invention provides a method for preparing a high-wear-resistant, high-strength, and high-conductivity spot welding electrode. The dispersed copper spot prepared by the process method The welding electrode not only has high wear resistance, high strength, high conductivity, and high resistance to softening temperature, but also has the advantages of short internal oxidation time, low cost, and high efficiency.
本发明为了解决上述技术问题的不足,所采用的技术方案是:一种高耐磨高强度高导电点焊电极的制备方法,其特征在于,其制备工艺方法包括以下步骤: In order to solve the deficiencies of the above-mentioned technical problems, the technical solution adopted by the present invention is: a preparation method of a high-wear-resistant, high-strength, high-conductivity spot welding electrode, which is characterized in that the preparation process comprises the following steps:
(1)分别称取粒度为-200目的工业级Cu2O、粒度为-200目的低固溶度Cu-Al合金和粒度为20~60μm的TiC粉末,其中,Cu2O作为氧化剂,其用量为Cu-Al合金质量的2.5%~5%,TiC粉末的用量为氧化剂、Cu-Al合金和TiC粉末三者总质量的12.14%~26.56%,所述的Cu-Al合金中的铝含量不大于0.50wt%,将氧化剂、Cu-Al合金和TiC粉末混合后置于球磨机内进行球磨,采用的转速为30rpm,球磨时间为12~16h; (1) Weigh industrial-grade Cu 2 O with a particle size of -200 mesh, low solid-solubility Cu-Al alloy with a particle size of -200 mesh, and TiC powder with a particle size of 20-60 μm. Among them, Cu 2 O is used as an oxidant. 2.5%~5% of the Cu-Al alloy mass, the amount of TiC powder is 12.14%~26.56% of the total mass of the oxidant, Cu-Al alloy and TiC powder, the aluminum content in the Cu-Al alloy is not More than 0.50wt%, the oxidant, Cu-Al alloy and TiC powder are mixed and placed in a ball mill for ball milling, the adopted speed is 30rpm, and the ball milling time is 12~16h;
(2)将球磨好的混合粉末装入石墨模具内,在30MPa的条件下预压5min,取出备用; (2) Put the ball-milled mixed powder into a graphite mold, pre-press for 5 minutes under the condition of 30MPa, and take it out for later use;
(3)将步骤(2)中装有混合粉末,并经过预压的模具整体置于真空热压烧结炉中,在烧结温度为900~1000℃、真空度为1.5×10-2 MPa、压制压强为20~40MPa的条件下热压烧结1~2h,然后撤去压力烧结1~4h,所述的烧结与内氧化同步进行,获得完全内氧化的弥散铜,备用; (3) Put the mixed powder in step (2) and the pre-pressed mold as a whole in a vacuum hot - press sintering furnace. Hot pressing and sintering for 1 to 2 hours under the condition of a pressure of 20 to 40 MPa, and then removing the pressure and sintering for 1 to 4 hours. The sintering and internal oxidation are carried out simultaneously to obtain fully internally oxidized dispersed copper, which is ready for use;
(4)取步骤(3)制取的弥散铜加工为所需要的尺寸即得到产品。 (4) Process the dispersed copper produced in step (3) to the required size to obtain the product.
本发明,步骤(4)中,所述的加工操作为冷挤压、热挤压或轧制变形。 In the present invention, in step (4), the processing operation is cold extrusion, hot extrusion or rolling deformation.
本发明,所述的挤压变形采用一次挤压成形,所述的轧制采用多道次轧制成形。 In the present invention, the extrusion deformation adopts one-time extrusion forming, and the rolling adopts multi-pass rolling forming.
本发明,步骤(3)中,所述的真空热压烧结炉为VDBF-250真空热压烧结炉。 In the present invention, in step (3), the vacuum hot pressing sintering furnace is a VDBF-250 vacuum hot pressing sintering furnace.
点焊电极材料中主要包括Cu、Al、Ti、C和O元素,其中Al和O以氧化铝第二相的形式存在。 Spot welding electrode materials mainly include Cu, Al, Ti, C and O elements, among which Al and O exist in the form of the second phase of alumina.
本发明的有益效果: Beneficial effects of the present invention:
1、本发明使用低固溶度Cu-Al合金材料,不仅强度高,导电性和纯铜相近,而且还具有良好的抗电弧侵蚀、抗电磨损能力及较高的常温强度和高温强度,在Cu-Al合金材料材料中加入TiC粉末,不仅可以使材料的强度、导电率明显提高,而且可以提高铜的强度、耐磨及耐高温性能,对弥散铜进行冷热挤压或轧制变形,在满足尺寸要求的同时,通过冷变形可以进一步提高弥散铜的强度,并且由于纳米氧化铝颗粒和微粒碳化钛的弥散分布,可以将这种形变强化效果保留到较高温度。本发明采用真空热压烧结炉使烧结内氧化同时进行,在真空条件下由氧化亚铜提供氧源从而使内氧化时间明显缩短; 1. The present invention uses low solid-solubility Cu-Al alloy material, which not only has high strength, similar electrical conductivity to pure copper, but also has good arc erosion resistance, electrical wear resistance and higher normal temperature strength and high temperature strength. Adding TiC powder to the Cu-Al alloy material can not only significantly improve the strength and electrical conductivity of the material, but also improve the strength, wear resistance and high temperature resistance of copper, and hot and cold extrusion or rolling deformation of dispersed copper, While meeting the size requirements, the strength of dispersed copper can be further improved by cold deformation, and this deformation strengthening effect can be retained to a higher temperature due to the dispersed distribution of nano-alumina particles and particulate titanium carbide. The present invention uses a vacuum hot-pressed sintering furnace to simultaneously carry out the sintering internal oxidation, and the oxygen source is provided by cuprous oxide under vacuum conditions, so that the internal oxidation time is obviously shortened;
2、为了解决材料在高温下直接加压会导致的以下不足点:(1)、增加凸模的压缩行程、对凹模侧壁压力增加,由于铜的熔点是1083℃,在高温时颗粒受热膨胀会使颗粒堆轴向、径向增加;(2)、增加模具之间的摩擦力,从而不能使压力完全作用于颗粒;(3)增加了颗粒间的空隙率,不利于材料致密化;(4)影响内氧化反应,颗粒在高温膨胀使颗粒之间中心距增加,颗粒中的氧化亚铜释放氧源与铝结合的行程将增加,这将影响材料的整体性能,本发明采用预压操作,本发明的预压采用真空预压,在室温、真空的条件下,由于颗粒处于真空、未加热的环境中使颗粒之间润滑流动性好,能够使颗粒接近于最紧密堆积,颗粒之间更为紧密,有效的减小颗粒之间的空隙率,能够更加有效的提高材料的致密度; 2. In order to solve the following disadvantages caused by direct pressurization of materials at high temperatures: (1) Increase the compression stroke of the punch and increase the pressure on the side wall of the die. Since the melting point of copper is 1083°C, the particles are affected by the pressure at high temperatures. Thermal expansion will increase the particle stack axially and radially; (2) increase the friction between the molds, so that the pressure cannot fully act on the particles; (3) increase the void ratio between particles, which is not conducive to material densification; (4) Influence the internal oxidation reaction, the expansion of the particles at high temperature will increase the center distance between the particles, and the distance of the cuprous oxide in the particles to release the oxygen source and combine with aluminum will increase, which will affect the overall performance of the material. The present invention adopts pre-compression Operation, the preloading of the present invention adopts vacuum preloading. Under the condition of room temperature and vacuum, since the particles are in a vacuum and an unheated environment, the lubricating fluidity between the particles is good, and the particles can be close to the most closely packed, and the particles between the particles The space is closer, effectively reducing the void ratio between particles, and can more effectively improve the density of the material;
3、目前,国内弥散铜-Mo(30%)导电率48.6%IACS,显微硬度146HV,致密度96.90%,国内弥散铜-WC(30%)导电率49.1%IACS,显微硬度153HV,致密度95.52%,国内弥散铜-W(50%)导电率46%IACS,显微硬度135HV,致密度95.52%,传统CrZrCu制备的点焊电极使用总寿命(焊点)为1.5-1.8万次,软化温度500℃,0.6Al2O3/Cu制备的点焊电极使用总寿命(焊点)为5-5.5万次; 3. At present, the conductivity of domestic dispersed copper-Mo (30%) is 48.6%IACS, the microhardness is 146HV, and the density is 96.90%. The density is 95.52%, the conductivity of domestic dispersed copper-W (50%) is 46%IACS, the microhardness is 135HV, and the density is 95.52%. The softening temperature is 500°C, and the total service life (solder spot) of spot welding electrodes made of 0.6Al2O3/Cu is 50,000-55,000 times;
本方法制备的弥散铜-TiC(30%)导电率82.6%IACS,显微硬度175 HV,致密度99.15%,导热系数90.14W×m-1×K-1,约为纯铜的3倍,本发明制备点焊电极寿命(焊点)为6.8-7.2万次,软化温度高于650℃; The dispersed copper-TiC (30%) prepared by this method has a conductivity of 82.6%IACS, a microhardness of 175 HV, a density of 99.15%, and a thermal conductivity of 90.14W×m -1 ×K -1 , which is about three times that of pure copper. The service life (solder spot) of the spot welding electrode prepared by the present invention is 68,000-72,000 times, and the softening temperature is higher than 650°C;
实验表明,利用本发明工艺方法制备的弥散铜点焊电极与现有技术相比不仅具有高耐磨、高强度、高导电性、高抗软化温度,而且具有内氧化时间短、成本低、效率高的优点。 Experiments have shown that compared with the prior art, the dispersed copper spot welding electrode prepared by the process of the present invention not only has high wear resistance, high strength, high conductivity, and high softening temperature resistance, but also has short internal oxidation time, low cost, and high efficiency. high merit.
具体实施方式 Detailed ways
一种高耐磨高强度高导电点焊电极的制备方法,其制备方法包括以下步骤: A preparation method of a high wear-resistant, high-strength, high-conductivity spot welding electrode, the preparation method comprising the following steps:
(1)分别称取粒度为-200目的工业级Cu2O、粒度为-200目的低固溶度Cu-Al合金和粒度为20~60μm的TiC粉末,其中,Cu2O作为氧化剂,其用量为Cu-Al合金质量的2.5%~5%,TiC粉末的用量为氧化剂、Cu-Al合金和TiC粉末三者总质量的12.14%~26.56%,所述的Cu-Al合金中的铝含量不大于0.50wt%,将氧化剂、Cu-Al合金和TiC粉末混合后置于球磨机内进行球磨,采用的转速为30rpm,球磨时间为12~16h; (1) Weigh industrial-grade Cu 2 O with a particle size of -200 mesh, low solid-solubility Cu-Al alloy with a particle size of -200 mesh, and TiC powder with a particle size of 20-60 μm. Among them, Cu 2 O is used as an oxidant. 2.5%~5% of the Cu-Al alloy mass, the amount of TiC powder is 12.14%~26.56% of the total mass of the oxidant, Cu-Al alloy and TiC powder, the aluminum content in the Cu-Al alloy is not More than 0.50wt%, the oxidant, Cu-Al alloy and TiC powder are mixed and placed in a ball mill for ball milling, the adopted speed is 30rpm, and the ball milling time is 12~16h;
(2)将球磨好的混合粉末装入石墨模具内,在30MPa的条件下预压5min,取出备用; (2) Put the ball-milled mixed powder into a graphite mold, pre-press for 5 minutes under the condition of 30MPa, and take it out for later use;
(3)将步骤(2)中装有混合粉末,并经过预压的模具整体置于真空热压烧结炉中,在烧结温度为900~1000℃、真空度为1.5×10-2 MPa、压制压强为20~40MPa的条件下热压烧结1~2h,然后撤去压力烧结1~4h,所述的烧结与内氧化同步进行,获得完全内氧化的弥散铜,备用; (3) Put the mixed powder in step (2) and the pre-pressed mold as a whole in a vacuum hot - press sintering furnace. Hot pressing and sintering for 1 to 2 hours under the condition of a pressure of 20 to 40 MPa, and then removing the pressure and sintering for 1 to 4 hours. The sintering and internal oxidation are carried out simultaneously to obtain fully internally oxidized dispersed copper, which is ready for use;
(4)取步骤(3)制取的弥散铜加工为所需要的尺寸即得到产品。 (4) Process the dispersed copper produced in step (3) to the required size to obtain the product.
步骤(4)中,所述的加工操作为冷挤压、热挤压或轧制变形; In step (4), the processing operation is cold extrusion, hot extrusion or rolling deformation;
所述的挤压变形采用一次挤压成形,所述的轧制采用多道次轧制成形; The extrusion deformation adopts one-time extrusion forming, and the rolling adopts multi-pass rolling forming;
步骤(3)中,所述的真空热压烧结炉为VDBF-250真空热压烧结炉。 In step (3), the vacuum hot pressing sintering furnace is a VDBF-250 vacuum hot pressing sintering furnace.
下面结合实施例对本发明做详细说明。 The present invention will be described in detail below in conjunction with the embodiments.
实施例1 Example 1
本实施例整体点焊电极材料主要包含有Cu、Al、Ti、C和O元素,其中Al和O以氧化铝第二相的形式存在,其含量:Al2O3,0.84wt%;Ti和C以碳化钛增强相的形式存在,其含量:TiC,12.14wt%;余量为Cu。 The overall spot welding electrode material in this embodiment mainly contains Cu, Al, Ti, C and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content is: Al 2 O 3 , 0.84wt%; Ti and C exists in the form of titanium carbide reinforcement phase, its content: TiC, 12.14wt%; the balance is Cu.
制备工艺方法包括以下几个步骤: The preparation process comprises the following steps:
(1)分别称取粒度为-200目的工业级Cu2O作为氧化剂、粒度为-200目的低固溶度Cu-Al合金和粒度为20μm的TiC粉末,氧化剂按Cu-Al粉质量百分数为2.5%进行称重,TiC粉末按照总质量的12.14wt%称重,将三种粉末混合后置于QQM/B球磨机内进行球磨,采用的转速为30rpm,充分混合14h,使之混合均匀; (1) Weigh industrial-grade Cu 2 O with a particle size of -200 mesh as the oxidant, Cu-Al alloy with a particle size of -200 mesh and TiC powder with a particle size of 20 μm, and the oxidant is 2.5% by mass of Cu-Al powder % is weighed, the TiC powder is weighed according to 12.14wt% of the total mass, and the three kinds of powders are mixed and placed in a QQM/B ball mill for ball milling. The adopted rotating speed is 30rpm, fully mixed for 14h, and mixed evenly;
(2)将混合好的粉体装入石墨模具内,在30MPa的条件下预压5min; (2) Put the mixed powder into the graphite mold and pre-press for 5 minutes under the condition of 30MPa;
(3)将装入粉末的模具整体置于VDBF-250真空热压烧结炉中,在烧结温度为900℃、压制压强为40MPa、总加压时间为2h、真空度为1.5×10-2 MPa、内氧化时间为6h的条件下进行真空热压烧结内氧化,获得完全内氧化的弥散铜; (3) Place the powder-filled mold as a whole in a VDBF-250 vacuum hot-pressing sintering furnace at a sintering temperature of 900°C, a pressing pressure of 40 MPa, a total pressing time of 2 hours, and a vacuum degree of 1.5×10 -2 MPa , Under the condition that the internal oxidation time is 6h, the internal oxidation is carried out by vacuum hot-pressing sintering, and the fully internally oxidized dispersed copper is obtained;
(4)取步骤(3)制取的弥散铜进行热挤压变形:将上述弥散铜-TiC块用锯床切割成长为直径5mm、40 mm长的小段,在箱式电阻炉RX3-15-9型箱式电阻炉中加热至850 ℃,保温20 min,在YB32-100B型四柱液压机上热挤压成直径3mm的微电子器件点焊电极。 (4) Take the dispersed copper produced in step (3) for hot extrusion deformation: cut the above dispersed copper-TiC block with a sawing machine into small sections with a diameter of 5 mm and a length of 40 mm, and heat them in a box-type resistance furnace RX3-15-9 Heat to 850 ℃ in a small box-type resistance furnace, hold for 20 minutes, and hot-extrude on a YB32-100B four-column hydraulic press to form spot welding electrodes for microelectronic devices with a diameter of 3 mm.
实施例2 Example 2
本实施例整体点焊电极材料主要包含有Cu、Al、Ti、C和O元素,其中Al和O以氧化铝第二相的形式存在,其含量:Al2O3,0.95wt%;Ti和C以碳化钛增强相的形式存在,其含量:TiC,19.22wt%;余量为Cu。 The overall spot welding electrode material in this embodiment mainly contains Cu, Al, Ti, C and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content is: Al 2 O 3 , 0.95wt%; Ti and C exists in the form of titanium carbide reinforcement phase, its content: TiC, 19.22wt%; the balance is Cu.
制备工艺方法包括以下几个步骤: The preparation process comprises the following steps:
(1)分别称取粒度为-200目的工业级Cu2O作为氧化剂、粒度为-200目的低固溶度Cu-Al合金和粒度为40μm的TiC粉末,氧化剂按Cu-Al粉质量百分数为3.7%进行称重,TiC粉末按照总质量的19.22wt%称重,将三种粉末混合后置于QQM/B球磨机内进行球磨,采用的转速为30rpm,充分混合12h,使之混合均匀; (1) Weigh industrial-grade Cu 2 O with a particle size of -200 mesh as the oxidant, Cu-Al alloy with a particle size of -200 mesh and TiC powder with a particle size of 40 μm, and the oxidant is 3.7% by mass of Cu-Al powder % is weighed, the TiC powder is weighed according to 19.22wt% of the total mass, and the three kinds of powders are mixed and placed in a QQM/B ball mill for ball milling. The rotating speed used is 30rpm, and the mixture is fully mixed for 12h to make it evenly mixed;
(2)将混合好的粉体装入石墨模具内,在30MPa的条件下预压5min; (2) Put the mixed powder into the graphite mold and pre-press for 5 minutes under the condition of 30MPa;
(3)将装入粉末的模具整体置于VDBF-250真空热压烧结炉中,在烧结温度为950℃、压制压强为20MPa、总加压时间为1.5h、真空度为1.5×10-2 MPa、内氧化时间为4h的条件下进行真空热压烧结内氧化,获得完全内氧化的弥散铜; (3) Place the powder-filled mold as a whole in a VDBF-250 vacuum hot-pressing sintering furnace at a sintering temperature of 950°C, a pressing pressure of 20MPa, a total pressing time of 1.5h, and a vacuum degree of 1.5×10 -2 Under the conditions of MPa and internal oxidation time of 4h, vacuum hot-pressing sintering internal oxidation is carried out to obtain completely internally oxidized dispersed copper;
(4)取步骤(3)制取的弥散铜冷却至室温进行轧制变形:将步骤(3)制取的弥散铜板用小型四辊冷轧机轧制成宽50mm×厚2mm的板材。 (4) Cool the dispersed copper produced in step (3) to room temperature for rolling deformation: roll the dispersed copper plate produced in step (3) into a plate with a width of 50mm×thickness of 2mm with a small four-roll cold rolling mill.
实施例3 Example 3
本实施例整体点焊电极材料主要包含有Cu、Al、Ti、C和O元素,其中Al和O以氧化铝第二相的形式存在,其含量:Al2O3,0.79wt%;Ti和C以碳化钛增强相的形式存在,其含量:TiC,26.56wt%;余量为Cu。 The overall spot welding electrode material in this embodiment mainly contains Cu, Al, Ti, C and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content is: Al 2 O 3 , 0.79wt%; Ti and C exists in the form of titanium carbide reinforcement phase, its content: TiC, 26.56wt%; the balance is Cu.
制备工艺方法包括以下几个步骤: The preparation process comprises the following steps:
(1)分别称取粒度为-200目的工业级Cu2O作为氧化剂、粒度为-200目的低固溶度Cu-Al合金和粒度为60μm的TiC粉末,氧化剂按Cu-Al粉质量百分数为5%进行称重,TiC粉末按照总质量的26.56wt%称重,将三种粉末混合后置于QQM/B球磨机内进行球磨,采用的转速为30rpm,充分混合16h,使之混合均匀; (1) Take industrial-grade Cu 2 O with a particle size of -200 mesh as the oxidant, Cu-Al alloy with a particle size of -200 mesh and TiC powder with a particle size of 60 μm, and the oxidant is 5% by mass of the Cu-Al powder. % is weighed, the TiC powder is weighed according to 26.56wt% of the total mass, and the three kinds of powders are mixed and then placed in a QQM/B ball mill for ball milling at a rotating speed of 30rpm, fully mixed for 16h to make it evenly mixed;
(2)将混合好的粉体装入石墨模具内,在30MPa的条件下预压5min; (2) Put the mixed powder into the graphite mold and pre-press for 5 minutes under the condition of 30MPa;
(3)将装入粉末的模具整体置于VDBF-250真空热压烧结炉中,在烧结温度为1000℃、压制压强为30MPa、总加压时间为1h、真空度为1.5×10-2 MPa、内氧化时间为2h的条件下进行真空热压烧结内氧化,获得完全内氧化的弥散铜; (3) Place the powder-filled mold as a whole in a VDBF-250 vacuum hot-pressing sintering furnace at a sintering temperature of 1000°C, a pressing pressure of 30 MPa, a total pressing time of 1 h, and a vacuum degree of 1.5×10 -2 MPa , Under the condition that the internal oxidation time is 2h, the internal oxidation is carried out by vacuum hot-pressing sintering, and the dispersed copper that is completely internally oxidized is obtained;
(4)取步骤(3)制取的弥散铜进行热挤压变形:将上述弥散铜-TiC块用锯床切割成长为直径5mm、40 mm长的小段,在箱式电阻炉RX3-15-9型箱式电阻炉中加热至850 ℃,保温20 min,在YB32-100B型四柱液压机上热挤压成直径3mm的微电子器件点焊电极。 (4) Take the dispersed copper produced in step (3) for hot extrusion deformation: cut the above dispersed copper-TiC block with a sawing machine into small sections with a diameter of 5 mm and a length of 40 mm, and heat them in a box-type resistance furnace RX3-15-9 Heat to 850 ℃ in a small box-type resistance furnace, hold for 20 minutes, and hot-extrude on a YB32-100B four-column hydraulic press to form spot welding electrodes for microelectronic devices with a diameter of 3 mm.
实施例4 Example 4
本实施例整体点焊电极材料主要包含有Cu、Al、Ti、C和O元素,其中Al和O以氧化铝第二相的形式存在,其含量:Al2O3,0.84wt%;Ti和C以碳化钛增强相的形式存在,其含量:TiC,19.22wt%;余量为Cu。 The overall spot welding electrode material in this embodiment mainly contains Cu, Al, Ti, C and O elements, wherein Al and O exist in the form of the second phase of alumina, and its content is: Al 2 O 3 , 0.84wt%; Ti and C exists in the form of titanium carbide reinforcement phase, its content: TiC, 19.22wt%; the balance is Cu.
制备工艺方法包括以下几个步骤: The preparation process comprises the following steps:
(1)分别称取粒度为-200目的工业级Cu2O作为氧化剂、粒度为-200目的低固溶度Cu-Al合金和粒度为48μm的TiC粉末,氧化剂按Cu-Al粉质量百分数为3.7%进行称重,TiC粉末按照总质量的19.22wt%称重,将三种粉末混合后置于QQM/B球磨机内进行球磨,采用的转速为30rpm,充分混合14h,使之混合均匀; (1) Weigh industrial-grade Cu 2 O with a particle size of -200 mesh as the oxidant, Cu-Al alloy with a particle size of -200 mesh and TiC powder with a particle size of 48 μm, and the oxidant is 3.7% by mass of Cu-Al powder % is weighed, the TiC powder is weighed according to 19.22wt% of the total mass, and the three kinds of powders are mixed and placed in a QQM/B ball mill for ball milling at a speed of 30 rpm, fully mixed for 14 hours, and mixed evenly;
(2)将混合好的粉体装入石墨模具内,在30MPa的条件下预压5min; (2) Put the mixed powder into the graphite mold and pre-press for 5 minutes under the condition of 30MPa;
(3)将装入粉末的模具整体置于VDBF-250真空热压烧结炉中,在烧结温度为1000℃、压制压强为30MPa、总加压时间为1h、真空度为1.5×10-2 MPa、内氧化时间为2h的条件下进行真空热压烧结内氧化,获得完全内氧化的弥散铜; (3) Place the powder-filled mold as a whole in a VDBF-250 vacuum hot-pressing sintering furnace at a sintering temperature of 1000°C, a pressing pressure of 30 MPa, a total pressing time of 1 h, and a vacuum degree of 1.5×10 -2 MPa , Under the condition that the internal oxidation time is 2h, the internal oxidation is carried out by vacuum hot-pressing sintering, and the dispersed copper that is completely internally oxidized is obtained;
(4)取步骤(3)制取的弥散铜进行热挤压变形:将上述弥散铜-TiC块用锯床切割成长为直径5mm、40 mm长的小段,在箱式电阻炉RX3-15-9型箱式电阻炉中加热至850 ℃,保温20 min,在YB32-100B型四柱液压机上热挤压成直径3mm的微电子器件点焊电极。 (4) Take the dispersed copper prepared in step (3) for hot extrusion deformation: cut the above dispersed copper-TiC block with a sawing machine into small sections with a diameter of 5 mm and a length of 40 mm, and heat them in a box-type resistance furnace RX3-15-9 Heat to 850 ℃ in a small box-type resistance furnace, hold for 20 minutes, and hot-extrude on a YB32-100B four-column hydraulic press to form spot welding electrodes for microelectronic devices with a diameter of 3 mm.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103433595A (en) * | 2013-08-06 | 2013-12-11 | 苏州飞泰精工科技有限公司 | Electrode cap overlay welding device with automation function |
CN109967851A (en) * | 2017-12-28 | 2019-07-05 | 中核建中核燃料元件有限公司 | Spacer grid particle electrode |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1410568A (en) * | 2001-09-27 | 2003-04-16 | 中国科学院金属研究所 | Tin titanium carbide granule reinforced copper base composite material and its preparation method |
CN1804077A (en) * | 2005-01-12 | 2006-07-19 | 中国科学院金属研究所 | In-situ produced titanium carbide dispersion strengthening copper based composite material and method for preparing the same |
CN101178957A (en) * | 2007-12-04 | 2008-05-14 | 河南科技大学 | Copper alloy contact wire and its preparation method |
CN101290838A (en) * | 2008-06-19 | 2008-10-22 | 河南科技大学 | A preparation method of dispersed copper-based vacuum switch contact composite material |
CN101293279A (en) * | 2008-06-19 | 2008-10-29 | 河南科技大学 | Preparation process of high thermal strength and high conductivity spot welding electrode material |
CN101293317A (en) * | 2008-06-19 | 2008-10-29 | 河南科技大学 | A preparation method of a high-strength and high-conductivity integral dispersed copper spot welding electrode |
CN101613816A (en) * | 2009-07-20 | 2009-12-30 | 温州宏丰电工合金有限公司 | Multiple dispersion strengthening copper-base composite material prepared in situ and preparation method thereof |
CN101709397A (en) * | 2009-11-11 | 2010-05-19 | 昆明理工大学 | Method for preparing titanium carbide dispersion strengthening copper-based composite material |
-
2012
- 2012-09-26 CN CN2012103615352A patent/CN102836998A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1410568A (en) * | 2001-09-27 | 2003-04-16 | 中国科学院金属研究所 | Tin titanium carbide granule reinforced copper base composite material and its preparation method |
CN1804077A (en) * | 2005-01-12 | 2006-07-19 | 中国科学院金属研究所 | In-situ produced titanium carbide dispersion strengthening copper based composite material and method for preparing the same |
CN101178957A (en) * | 2007-12-04 | 2008-05-14 | 河南科技大学 | Copper alloy contact wire and its preparation method |
CN101290838A (en) * | 2008-06-19 | 2008-10-22 | 河南科技大学 | A preparation method of dispersed copper-based vacuum switch contact composite material |
CN101293279A (en) * | 2008-06-19 | 2008-10-29 | 河南科技大学 | Preparation process of high thermal strength and high conductivity spot welding electrode material |
CN101293317A (en) * | 2008-06-19 | 2008-10-29 | 河南科技大学 | A preparation method of a high-strength and high-conductivity integral dispersed copper spot welding electrode |
CN101613816A (en) * | 2009-07-20 | 2009-12-30 | 温州宏丰电工合金有限公司 | Multiple dispersion strengthening copper-base composite material prepared in situ and preparation method thereof |
CN101709397A (en) * | 2009-11-11 | 2010-05-19 | 昆明理工大学 | Method for preparing titanium carbide dispersion strengthening copper-based composite material |
Non-Patent Citations (5)
Title |
---|
冯江: "WC/Cu-Al2O3触头材料的组织与性能的研究", 《河南科技大学硕士论文》 * |
张晓伟: "真空热压烧结W/Cu - Al203复合材料的制备及热变形行为研究", 《中国优秀硕士论文数据库 工程科技Ⅰ辑》 * |
徐少春等: "陶瓷颗粒增强铜基复合材料研究进展", 《热加工工艺》 * |
谢春生等: "高强度高导电性铜合金强化理论的研究与应用发展", 《金属热处理》 * |
韩胜利等: "点焊电极用弥散强化铜基复合材料的进展", 《河南科技大学学报(自然科学版)》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103433595A (en) * | 2013-08-06 | 2013-12-11 | 苏州飞泰精工科技有限公司 | Electrode cap overlay welding device with automation function |
CN109967851A (en) * | 2017-12-28 | 2019-07-05 | 中核建中核燃料元件有限公司 | Spacer grid particle electrode |
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Application publication date: 20121226 |