CN102834431A - 自由基聚合性树脂、自由基聚合性树脂组合物、及其固化物 - Google Patents
自由基聚合性树脂、自由基聚合性树脂组合物、及其固化物 Download PDFInfo
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- CN102834431A CN102834431A CN2011800186448A CN201180018644A CN102834431A CN 102834431 A CN102834431 A CN 102834431A CN 2011800186448 A CN2011800186448 A CN 2011800186448A CN 201180018644 A CN201180018644 A CN 201180018644A CN 102834431 A CN102834431 A CN 102834431A
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- Prior art keywords
- radically polymerizable
- polymerizable resin
- meth
- group
- acrylate
- Prior art date
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- 229920005989 resin Polymers 0.000 title claims abstract description 57
- 239000011347 resin Substances 0.000 title claims abstract description 57
- 239000011342 resin composition Substances 0.000 title claims description 36
- 150000001875 compounds Chemical class 0.000 claims abstract description 70
- 125000003566 oxetanyl group Chemical group 0.000 claims abstract description 26
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 16
- 238000010538 cationic polymerization reaction Methods 0.000 claims abstract description 15
- 125000002091 cationic group Chemical group 0.000 claims abstract description 13
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 10
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 7
- -1 acrylate compound Chemical class 0.000 claims description 48
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 15
- 238000010526 radical polymerization reaction Methods 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 9
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 claims description 6
- 239000000835 fiber Substances 0.000 claims description 3
- 150000003254 radicals Chemical class 0.000 abstract description 21
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052799 carbon Inorganic materials 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 46
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 36
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- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 239000003505 polymerization initiator Substances 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 239000011259 mixed solution Substances 0.000 description 15
- 239000000126 substance Substances 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 12
- 239000002585 base Substances 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- QWMJEUJXWVZSAG-UHFFFAOYSA-N (4-ethenylphenyl)boronic acid Chemical compound OB(O)C1=CC=C(C=C)C=C1 QWMJEUJXWVZSAG-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
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- 230000001070 adhesive effect Effects 0.000 description 7
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- 239000002904 solvent Substances 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical group C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 6
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- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 5
- KZMGYPLQYOPHEL-UHFFFAOYSA-N Boron trifluoride etherate Chemical compound FB(F)F.CCOCC KZMGYPLQYOPHEL-UHFFFAOYSA-N 0.000 description 5
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
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- 238000004519 manufacturing process Methods 0.000 description 5
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- 238000006116 polymerization reaction Methods 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 238000000746 purification Methods 0.000 description 5
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- 229910052783 alkali metal Inorganic materials 0.000 description 4
- 150000001340 alkali metals Chemical class 0.000 description 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 3
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 244000028419 Styrax benzoin Species 0.000 description 3
- 235000000126 Styrax benzoin Nutrition 0.000 description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 229960002130 benzoin Drugs 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002170 ethers Chemical class 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 3
- 235000019382 gum benzoic Nutrition 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
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- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 238000012719 thermal polymerization Methods 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 2
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- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 2
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- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- LAYPWKMPTSNIRX-UHFFFAOYSA-N 3-ethyl-3-(hexoxymethyl)oxetane Chemical compound CCCCCCOCC1(CC)COC1 LAYPWKMPTSNIRX-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 description 2
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- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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- INRGAWUQFOBNKL-UHFFFAOYSA-N {4-[(Vinyloxy)methyl]cyclohexyl}methanol Chemical compound OCC1CCC(COC=C)CC1 INRGAWUQFOBNKL-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明的目的在于提供低粘度下加工性优异、可在加热和/或光照下迅速固化而形成柔软性及耐热性优异的固化物的自由基聚合性树脂。本发明的自由基聚合性树脂是由下述式(1)(式(1)中,R1代表氢原子或甲基,R2代表氢原子或烷基,A代表碳原子数为4~20的直链状或支链状亚烷基)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物单独经阳离子聚合、或是与具有阳离子聚合性的其它化合物共同进行阳离子聚合而得到的。
Description
技术领域
本发明涉及在波导(光波导、混载基板等)、光纤、应力缓和型粘接剂、密封剂、底部填充剂(underfill)、喷墨用油墨、滤色器、纳米压印、柔性基板等领域、尤其是柔性光波导、柔软粘接剂、底部填充剂等领域有用的自由基聚合性树脂、自由基聚合性树脂组合物及其固化物。
背景技术
随着利用互联网的在线视频(動画配信)的普及,用于服务器、路由器的配电盘(board)内的通信容量增加,将部分高速信号线由电布线替换为光布线的研究得到了发展。与石英类光波导相比,聚合物光波导因成本较低等,被期待用作光电混载基板用光布线。作为光布线所要求的特性之一,可列举回流焊耐热性,所述回流焊耐热性是防止在光电混载基板的回流焊工序中由回流焊时的高温引起在基板上制作的波导发生光损耗增加或裂纹等热劣化的特性。另外,近年来,为了应对熔解时需要260℃左右的高温加热的无铅焊锡,要提高回流温度,因此,需要更高的回流焊耐热性。
另外,近年来,已针对将多个半导体元件、晶片等沿纵向堆积的技术进行了研究。该技术在由半导体元件、晶片等贴合而成的材料上设置贯通孔,制成贯通电极,以使电极之间在垂直方向上接合,由此来提高垂直方向上的集成度。但是,在利用由热膨胀系数与用于半导体元件、晶片、贯通电极等的材料不同的材料构成的粘接剂对上述半导体元件、晶片、贯通电极等进行粘接的情况下,经过加热或冷却,会在材料间产生热膨胀系数差,进而由该应力引起在粘接界面处发生剥离。此外,半导体元件、晶片、贯通电极等壁薄且脆,因此,在加热或冷却时,容易因施加外力而发生破损。因此,要求将能够缓和由于和被粘物的热膨胀系数之差所引起的应力的柔软材料用于粘接剂。
即,作为在上述领域中使用的聚合物所要求的特性,从与元件、基板结合的容易程度,布局的自由度,应力缓和,操作容易程度方面考虑,可列举加工性及柔软性。此外,还要求兼具超过260℃的高耐热性。
专利文献1、2中公开了每1分子内具有氧杂环丁烷环和(甲基)丙烯酰基的3-乙基-3-(甲基)丙烯酰氧基甲基氧杂环丁烷等。但是,由这些化合物聚合得到的固化物虽然在耐热性方面优异,但存在柔软性不足方面的问题。另外,专利文献3中也公开了每1分子内具有氧杂环丁烷环和(甲基)丙烯酰基的化合物,但由这些化合物聚合得到的固化物在耐热性及柔软性方面并不能充分满足要求。
此外,专利文献4、5中公开了(甲基)丙烯酸缩水甘油酯、(甲基)丙烯酸3,4-环氧环己基甲酯等每1分子内具有环氧基和(甲基)丙烯酰基的环氧类化合物,但环氧类化合物由于固化性低、具有皮肤刺激性、毒性,因此存在加工性方面的问题。另外,从柔软性方面考虑,由这些化合物聚合得到的固化物也不能充分满足要求。因此,目前的情况是,尚未发现加工性优异、可形成柔软性及耐热性优异的固化物的树脂。
现有技术文献
专利文献
专利文献1:日本特开平11-315181号公报
专利文献2:日本特开2001-40205号公报
专利文献3:日本特开2001-81182号公报
专利文献4:日本特开2005-97515号公报
专利文献5:日本特开2009-242242号公报
发明内容
发明要解决的问题
因此,本发明的目的在于提供低粘度下加工性优异、可在加热和/或光照下迅速固化而形成柔软性及耐热性优异的固化物的自由基聚合性树脂、自由基聚合性树脂组合物及其固化物。
解决问题的方法
本发明人为解决上述问题而进行了深入研究,结果发现,由下述单体单独经阳离子聚合、或是与具有能够和氧杂环丁烷环反应的官能团的其它单体共同进行阳离子聚合而得到的树脂在低粘度下具有优异的操作性,所述单体的每1分子内含有具有自由基聚合性的(甲基)丙烯酰基和具有阳离子聚合性的氧杂环丁烷环,其是利用具有特定结构的亚烷基将这两种官能团连结而得到的。另外还发现,使该树脂进一步发生自由基聚合时,可形成耐热性及柔软性优异的固化物。本发明基于上述见解而完成。
即,本发明提供自由基聚合性树脂,其是由下述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物单独经阳离子聚合、或是与具有阳离子聚合性的其它化合物共同进行阳离子聚合而得到的,
[化学式1]
(式中,R1代表氢原子或甲基,R2代表氢原子或烷基。A代表碳原子数为4~20的直链状或支链状亚烷基)。
作为具有阳离子聚合性的其它化合物,优选每1分子内仅具有1个选自氧杂环丁烷环、环氧环、乙烯基醚基、乙烯基芳基中的官能团的化合物。
另外,本发明还提供包含上述自由基聚合性树脂作为自由基聚合性化合物的自由基聚合性树脂组合物。
自由基聚合性树脂组合物优选进一步包含上述自由基聚合性树脂以外的其它自由基聚合性化合物,作为上述自由基聚合性树脂以外的自由基聚合性化合物,优选为每1分子内具有1个以上选自(甲基)丙烯酰基、(甲基)丙烯酰氧基、(甲基)丙烯酰氨基、乙烯基芳基、乙烯基醚基、乙烯氧基羰基中的官能团的化合物。
进一步,本发明还提供固化物,其是由上述自由基聚合性树脂组合物经自由基聚合而得到的。
上述固化物优选为膜状或纤维状。
发明的效果
本发明的自由基聚合性树脂是由具有特定结构的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物单独经阳离子聚合、或是与具有阳离子聚合性的其它化合物共同进行阳离子聚合而得到的树脂,因此,其在低粘度下加工性优异。另外,本发明的包含自由基聚合性树脂的自由基聚合性树脂组合物可以通过加热和/或光照而迅速形成固化物。由此得到的固化物具有优异的柔软性,因此可以自由弯曲使用,能够发挥出应力缓和作用。在此基础上,其具有可应对回流焊安装(尤其是无铅焊锡安装)的耐热性,能够防止由回流焊引起的热劣化。因此,本发明的自由基聚合性树脂适宜应用于波导(光波导、混载基板等)、光纤、应力缓和型粘接剂、密封剂、底部填充剂、喷墨用油墨、滤色器、纳米压印、柔性基板等领域、特别是柔性光波导、柔软粘接剂、底部填充剂等领域。
附图说明
[图1]示出固化物耐热性的评价方法的说明图(热重分析结果的模式图)。
具体实施方式
[含有氧杂环丁烷环的(甲基)丙烯酸酯化合物]
本发明的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物以式(1)表示。式中,R1代表氢原子或甲基,R2代表氢原子或烷基。A代表碳原子数为4~20的直链状或支链状亚烷基。
式(1)中,作为R2涉及的烷基,优选碳原子数为1~6的烷基(其中更优选碳原子数为1~3的烷基),可列举例如:甲基、乙基、丙基、丁基、戊基、己基等直链状烷基;异丙基、异丁基、仲丁基、叔丁基、异戊基、仲戊基、叔戊基、异己基、仲己基、叔己基等支链状烷基等。其中,本发明中优选甲基或乙基。
式(1)中,A代表碳原子数为4~20的直链状或支链状亚烷基。其中,在本发明中,从能够形成兼具优异耐热性和柔软性的固化物的观点考虑,优选下述式(a1)所示的直链状亚烷基、或下述式(a2)所示的支链状亚烷基。需要说明的是,式(a2)的右端与构成酯键的氧原子键合。
[化学式2]
[式(a1)中,n1代表4以上的整数。式(a2)中,R3、R4、R7、R8相同或不同,代表氢原子或烷基,R5、R6相同或不同,代表烷基。n2代表0以上的整数,n2为2以上的整数时,两个以上的R7、R8分别可以相同也可以不同]。
式(a1)中的n1代表4以上的整数、优选为4~20的整数、特别优选为4~10的整数。n1为3以下时,聚合得到的固化物的柔软性倾向于降低。
作为式(a2)中的R3、R4、R5、R6、R7、R8所涉及的烷基,优选碳原子数为1~4的烷基(其中更优选碳原子数为1~3的烷基),可列举例如:甲基、乙基、丙基、丁基等直链状烷基;异丙基、异丁基、仲丁基、叔丁基等支链状烷基等。作为本发明中的R3、R4,优选氢原子,作为R5、R6,优选甲基、乙基。
式(a2)中的n2代表0以上的整数,优选为1~20的整数、特别优选为1~10的整数。
作为式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物的代表例,可列举下述化合物。
[化学式3]
式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物可通过下述方法合成:例如,在碱性物质存在下,使下述式(2)所示的化合物和下述式(3)所示的化合物以单相液相体系反应,得到下述式(4)所示的含有氧杂环丁烷环的醇,并对所得含有氧杂环丁烷环的醇进行(甲基)丙烯酸化,由此来合成式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物。
[化学式4]
(式中,R2同上。X代表离去性基团)
HO-A-OH (3)
(式中,A同上)
[化学式5]
(式中,R2、A同上)。
式(2)中,X代表离去性基团,可列举例如:氯、溴、碘等卤原子(其中优选溴原子、碘原子);对甲苯磺酰氧基、甲磺酰氧基、三氟甲磺酰氧基等磺酰氧基;乙酰氧基等羰氧基等离去性高的基团。
作为上述碱性物质,可列举例如:氢氧化钠、氢氧化钾、氢氧化钙、氢氧化镁等碱金属或碱土金属的氢氧化物;氢化钠、氢化镁、氢化钙等碱金属或碱土金属的氢化物;碳酸钠、碳酸钾等碱金属或碱土金属的碳酸盐;碳酸氢钠、碳酸氢钾等碱金属或碱土金属的碳酸氢盐;有机锂试剂(例如,甲基锂、乙基锂、正丁基锂、仲丁基锂、叔丁基锂等)、有机镁试剂(格利雅试剂:例如,CH3MgBr、C2H5MgBr等)等有机金属化合物等。这些碱性物质可以单独使用,也可以将2种以上混合使用。
上述“单相液相体系”是指,液相仅一相、而非两相以上的情况,液相为一相时,也可以包含固体。作为上述溶剂,只要是能够溶解式(2)所示化合物和式(3)所示化合物这两者的溶剂即可,可列举例如:苯、甲苯、二甲苯、乙基苯等芳香族烃;THF(四氢呋喃)、IPE(异丙醚)等醚;DMSO(二甲亚砜)等含硫类溶剂;DMF(二甲基甲酰胺)等含氮类溶剂等。
[自由基聚合性树脂]
本发明的自由基聚合性树脂是由上述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物单独经阳离子聚合、或是与具有阳离子聚合性的其它化合物[具有阳离子聚合性,与上述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物不同的化合物。以下也称为“其它阳离子聚合性化合物”]共同进行阳离子聚合而得到的。
上述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物由于在每1分子内具有作为阳离子聚合部位的氧杂环丁烷环和作为自由基聚合部位的(甲基)丙烯酰基,因此通过单独进行阳离子聚合、或是与其它阳离子聚合性化合物共同进行阳离子共聚,可合成出下式所示的自由基聚合性树脂。需要说明的是,阳离子共聚包括嵌段共聚、无规共聚等。
[化学式6]
(式中,R1、R2、A同上)
作为本发明的自由基聚合性树脂,其中,从能够形成柔软性更为优异的固化物的观点出发,优选由上述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物和其它阳离子聚合性化合物经阳离子共聚而得到的树脂,在构成自由基聚合性树脂的全部单体中,来自上述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物的单体所占的比例优选为0.1重量%以上(优选为1~99重量%、特别优选为10~80重量%)。
作为其它阳离子聚合性化合物,可列举例如:每1分子内具有1个以上氧杂环丁烷环、环氧环、乙烯基醚基、乙烯基芳基等阳离子聚合性基团的化合物等。
作为每1分子内具有1个以上氧杂环丁烷环的化合物,可列举例如:氧杂环丁烷、3,3-双(乙烯氧基甲基)氧杂环丁烷、3-乙基-3-羟基甲基氧杂环丁烷、3-乙基-3-(2-乙基己氧基甲基)氧杂环丁烷、3-乙基-3-[(苯氧基)甲基]氧杂环丁烷、3-乙基-3-(己氧基甲基)氧杂环丁烷、3-乙基-3-(氯甲基)氧杂环丁烷、3,3-双(氯甲基)氧杂环丁烷、1,4-双[(3-乙基-3-氧杂环丁基甲氧基)甲基]苯、双{[1-乙基(3-氧杂环丁基)]甲基}醚、4,4’-双[(3-乙基-3-氧杂环丁基)甲氧基甲基]二环己烷、1,4-双[(3-乙基-3-氧杂环丁基)甲氧基甲基]环己烷、3-乙基-3-{[(3-乙基氧杂环丁烷-3-基)甲氧基]甲基}氧杂环丁烷等、以及它们的衍生物等。
作为每1分子内具有1个以上环氧环的化合物,可列举例如:缩水甘油基甲基醚、双酚A二缩水甘油醚、双酚F二缩水甘油醚、双酚S二缩水甘油醚、溴化双酚A二缩水甘油醚、溴化双酚F二缩水甘油醚、溴化双酚S二缩水甘油醚、环氧-酚醛清漆树脂、氢化双酚A二缩水甘油醚、氢化双酚F二缩水甘油醚、氢化双酚S二缩水甘油醚、3,4-环氧环己基甲基-3’,4’-环氧环己烷羧酸酯、2-(3,4-环氧环己基-5,5-螺-3,4-环氧基)环己烷-间二烷、双(3,4-环氧环己基甲基)己二酸酯、双(3,4-环氧-6-甲基环己基甲基)己二酸酯、3,4-环氧-6-甲基环己基-3’,4’-环氧-6’-甲基环己烷羧酸酯、亚甲基双(3,4-环氧环己烷)、二氧化二聚环戊二烯、乙二醇的二(3,4-环氧环己基甲基)醚、亚乙基双(3,4-环氧环己烷羧酸酯)、环氧六氢苯二甲酸二辛酯、环氧六氢苯二甲酸二-2-乙基己酯、1,4-丁二醇二缩水甘油醚、1,6-己二醇二缩水甘油醚、甘油三缩水甘油醚、三羟甲基丙烷三缩水甘油醚、聚乙二醇二缩水甘油醚、聚丙二醇二缩水甘油醚等醚类;通过在乙二醇、丙二醇、甘油等脂肪族多元醇上加成1种或2种以上环氧化物而得到的聚醚多元醇的聚缩水甘油醚类;脂肪族长链二元酸的二缩水甘油基酯类;脂肪族高级醇的单缩水甘油醚类;苯酚、甲酚、丁基酚或在这些酚上加成环氧化物而得到的聚醚醇的单缩水甘油醚类;丁酸(R)缩水甘油酯等脂肪酸的缩水甘油基酯类等、以及它们的衍生物等。
作为每1分子内具有1个以上乙烯基醚基的化合物,可列举例如:2-羟基乙基乙烯基醚、3-羟基丙基乙烯基醚、2-羟基丙基乙烯基醚、2-羟基异丙基乙烯基醚、4-羟基丁基乙烯基醚、3-羟基丁基乙烯基醚、2-羟基丁基乙烯基醚、3-羟基异丁基乙烯基醚、2-羟基异丁基乙烯基醚、1-甲基-3-羟基丙基乙烯基醚、1-甲基-2-羟基丙基乙烯基醚、1-羟基甲基丙基乙烯基醚、4-羟基环己基乙烯基醚、1,6-己二醇单乙烯基醚、1,4-环己烷二甲醇单乙烯基醚、1,3-环己烷二甲醇单乙烯基醚、1,2-环己烷二甲醇单乙烯基醚、对苯二甲醇单乙烯基醚、间苯二甲醇单乙烯基醚、邻苯二甲醇单乙烯基醚、二乙二醇单乙烯基醚、三乙二醇单乙烯基醚、四乙二醇单乙烯基醚、五乙二醇单乙烯基醚、低聚乙二醇单乙烯基醚、聚乙二醇单乙烯基醚、二丙二醇单乙烯基醚、三丙二醇单乙烯基醚、四丙二醇单乙烯基醚、五丙二醇单乙烯基醚、低聚丙二醇单乙烯基醚、聚丙二醇单乙烯基醚等、以及它们的衍生物等。
作为每1分子内具有1个以上乙烯基芳基的化合物,可列举例如:苯乙烯、二乙烯基苯、甲氧基苯乙烯、乙氧基苯乙烯、羟基苯乙烯、乙烯基萘、乙烯基蒽、乙酸4-乙烯基苯酯、(4-乙烯基苯基)二羟基硼烷、(4-乙烯基苯基)硼酸、(4-乙烯基苯基)硼酸、4-乙烯基苯基硼酸、4-乙烯基苯基硼酸、4-乙烯基苯基硼酸、对乙烯基苯基硼酸、对乙烯基苯基硼酸、N-(4-乙烯基苯基)马来酰亚胺、N-(对乙烯基苯基)马来酰亚胺、N-(对乙烯基苯基)马来酰亚胺等、以及它们的衍生物等。
作为本发明中的其它阳离子聚合性化合物,其中,从能够形成柔软性及耐热性优异的固化物的观点出发,优选每1分子内仅具有1个选自氧杂环丁烷环、环氧环、乙烯基醚基、乙烯基芳基中的官能团的化合物,特别优选氧杂环丁烷、3-乙基-3-(2-乙基己氧基甲基)氧杂环丁烷、3-乙基-3-[(苯氧基)甲基]氧杂环丁烷、3-乙基-3-(己氧基甲基)氧杂环丁烷等每1分子内仅具有1个氧杂环丁烷环的化合物、缩水甘油基甲基醚、丁酸(R)缩水甘油酯等每1分子内仅具有1个环氧基的化合物等。这些化合物可以单独使用,也可以将2种以上混合使用。
阳离子聚合反应在溶剂的存在下进行。作为溶剂,可列举例如苯、甲苯、二甲苯等。
另外,阳离子聚合反应还可以使用聚合引发剂。作为聚合引发剂,只要是能够引起阳离子聚合的引发剂即可,并无特殊限制,可使用公知惯用的阳离子聚合引发剂、产酸剂等,可使用例如:高氯酸、硫酸、磷酸、对甲苯磺酸、三氯乙酸、三氟乙酸等质子酸;三氟化硼、溴化铝、氯化铝、五氯化锑、氯化铁、四氯化锡、四氯化钛、氯化汞、氯化锌等路易斯酸等。除此之外,还可以使用碘、三苯基氯甲烷等。这些聚合引发剂可以单独使用,也可以将2种以上混合使用。
作为阳离子聚合反应中聚合引发剂的使用量,例如,相对于阳离子聚合性化合物(式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物和其它阳离子聚合性化合物的总重量),例如为0.01~50重量%左右、优选为0.1~20重量%左右。
另外,阳离子聚合反应可以在阻聚剂的存在下进行。作为阻聚剂,可列举例如:4-甲氧基苯酚、对苯二酚、甲基对苯二酚、二甲基对苯二酚、三甲基对苯二酚、对苯二酚单甲基醚、2,5-二叔丁基对苯二酚、对叔丁基邻苯二酚、单叔丁基对苯二酚、对苯醌、萘醌、2,5-二叔丁基对甲苯酚、α-萘酚、硝基苯酚等醌-酚类阻聚剂、硫醚类阻聚剂、亚磷酸酯类阻聚剂等。
自由基聚合性树脂的重均分子量例如为500以上(例如,500~100万左右)、优选为3000~50万。自由基聚合性树脂的重均分子量低于上述范围时,可能导致经自由基聚合而得到的固化物的柔软性降低。
[自由基聚合性树脂组合物]
本发明的自由基聚合性树脂组合物包含上述自由基聚合性树脂作为自由基聚合性化合物。
作为上述自由基聚合性树脂在自由基聚合性树脂组合物中所占的比例,例如为5重量%以上,也可以实质上仅由上述自由基聚合性树脂构成自由基聚合性树脂组合物。其中,在本发明中,从能够形成柔软性更为优异的固化物的方面考虑,上述自由基聚合性树脂在自由基聚合性树脂组合物中所占的比例优选为10重量%以上、特别优选为60~90重量%。上述自由基聚合性树脂在自由基聚合性树脂组合物中所占的比例低于5重量%时,可能导致经自由基聚合而固化得到的固化物的柔软性降低。
本发明的自由基聚合性树脂组合物中,除了上述自由基聚合性树脂以外,还可以含有其它具有自由基聚合性的化合物、即与上述式(1)所示的含有氧杂环丁烷环的(甲基)丙烯酸酯化合物不同的化合物(以下也称为“其它自由基聚合性化合物”)。
作为其它自由基聚合性化合物,可列举例如:每1分子内具有1个以上(甲基)丙烯酰基、(甲基)丙烯酰氧基、(甲基)丙烯酰氨基、乙烯基芳基、乙烯基醚基、乙烯氧基羰基等自由基聚合性基团的化合物等。
作为每1分子内具有1个以上(甲基)丙烯酰基的化合物,可列举例如:1-丁烯-3-酮、1-戊烯-3-酮、1-己烯-3-酮、4-苯基-1-丁烯-3-酮、5-苯基-1-戊烯-3-酮等、以及它们的衍生物等。
作为每1分子内具有1个以上(甲基)丙烯酰氧基的化合物,可列举例如:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸异丁酯、甲基丙烯酸叔丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸异癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十八烷基酯、(甲基)丙烯酸正丁氧基乙酯、丁氧基二乙二醇(甲基)丙烯酸酯、甲氧基三乙二醇(甲基)丙烯酸酯、甲氧基聚乙二醇(甲基)丙烯酸酯、(甲基)丙烯酸环己酯、(甲基)丙烯酸正己酯、(甲基)丙烯酸四氢糠酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸异冰片酯、(甲基)丙烯酸2-羟基乙酯、(甲基)丙烯酸2-羟基丙酯、(甲基)丙烯酸2-羟基丁酯、(甲基)丙烯酸二甲基氨基乙酯、(甲基)丙烯酸二乙基氨基乙酯、甲基丙烯酸、2-甲基丙烯酰氧基乙基琥珀酸、2-甲基丙烯酰氧基乙基六氢苯二甲酸、2-甲基丙烯酰氧基乙基-2-羟基丙基苯二甲酸酯、(甲基)丙烯酸缩水甘油酯、2-甲基-2-丙烯酸-2-(膦酰基氧基)乙酯(2-methacryloyloxyethyl acid phosphate)、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯、2-羟基3-丙烯酰氧基丙基(甲基)丙烯酸酯、二羟甲基三环癸烷二(甲基)丙烯酸酯、(甲基)丙烯酸三氟乙酯、(甲基)丙烯酸全氟辛基乙酯、(甲基)丙烯酸异戊酯、(甲基)丙烯酸异十四烷基酯、γ-(甲基)丙烯酰氧基丙基三甲氧基硅烷、异氰酸2-(甲基)丙烯酰氧基乙酯、异氰酸1,1-双(丙烯酰氧基)乙酯、异氰酸2-(2-甲基丙烯酰氧基乙氧基)乙酯、乙烯基三甲氧基硅烷、乙烯基三乙氧基硅烷、3-(甲基)丙烯酰氧基丙基三乙氧基硅烷等、以及它们的衍生物等。
作为每1分子内具有1个以上(甲基)丙烯酰氨基的化合物,可列举例如:丙烯酸吗啉-4-基、丙烯酰吗啉、N,N-二甲基丙烯酰胺、N,N-二乙基丙烯酰胺、N-甲基丙烯酰胺、N-乙基丙烯酰胺、N-丙基丙烯酰胺、N-异丙基丙烯酰胺、N-丁基丙烯酰胺、N-正丁氧基甲基丙烯酰胺、N-己基丙烯酰胺、N-辛基丙烯酰胺等、以及它们的衍生物等。
作为每1分子内具有1个以上乙烯基芳基的化合物、每1分子内具有1个以上乙烯基醚基的化合物,可列举在上述其它阳离子聚合性化合物中列举的相同的例子。
作为每1分子内具有1个以上乙烯氧基羰基的化合物,可列举例如:甲酸异丙烯酯、乙酸异丙烯酯、丙酸异丙烯酯、丁酸异丙烯酯、异丁酸异丙烯酯、己酸异丙烯酯、戊酸异丙烯酯、异戊酸异丙烯酯、乳酸异丙烯酯、乙酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、己酸乙烯酯、辛酸乙烯酯、月桂酸乙烯酯、肉豆蔻酸乙烯酯、棕榈酸乙烯酯、硬脂酸乙烯酯、环己烷羧酸乙烯酯、三甲基乙酸乙烯酯、辛酸乙烯酯、单氯乙酸乙烯酯、己二酸二乙烯酯、甲基丙烯酸乙烯酯、巴豆酸乙烯酯、山梨酸乙烯酯、苯甲酸乙烯酯、肉桂酸乙烯酯等、以及它们的衍生物等。
作为本发明中的其它自由基聚合性化合物,其中,从能够形成具有更为优异的耐热性的固化物的观点出发,优选乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、三乙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、甘油二(甲基)丙烯酸酯等具有2个以上(特别是2个)(甲基)丙烯酰氧基的化合物。这些化合物可以单独使用,也可以将2种以上混合使用。
作为本发明的自由基聚合性树脂组合物,从能够形成具有更为优异的耐热性的固化物的观点出发,优选在包含自由基聚合性树脂的同时还包含其它自由基聚合性化合物。作为自由基聚合性树脂与其它自由基聚合性化合物的配合比(前者/后者:重量比),例如为95/5~5/95、优选为95/5~20/80、特别优选为95/5~60/40。自由基聚合性树脂的配合比例不在上述范围内时,可能导致所得固化物的柔软性降低。
另外,本发明的自由基聚合性树脂组合物中可以添加聚合引发剂,也可以不添加聚合引发剂。作为聚合引发剂,可以无特殊限定地使用公知惯用的热聚合引发剂、光自由基聚合引发剂等能够引起自由基聚合的引发剂。
作为热聚合引发剂,可列举例如:过氧化苯甲酰、偶氮二异丁腈(AIBN)、偶氮双(2,4-二甲基戊腈)、2,2’-偶氮二异丁酸二甲酯等。这些热聚合引发剂可以单独使用,也可以将2种以上混合使用。
作为光自由基聚合引发剂,可列举例如:二苯甲酮、苄基乙酰苯、安息香双甲醚、苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻异丙基醚、二甲氧基苯乙酮、二甲氧基苯基苯乙酮、二乙氧基苯乙酮、二苯基二硫化物等。这些光自由基聚合引发剂可以单独使用,也可以将2种以上混合使用。
聚合引发剂中还可以添加用于加强光吸收能向聚合引发游离基转换的协同剂(相乗剤)。作为协同剂,可列举例如:三乙胺、二乙胺、二乙醇胺、乙醇胺、二甲基氨基苯甲酸、二甲基氨基苯甲酸甲酯等胺;噻吨酮、2-异丙基噻吨酮、2,4-二乙基噻吨酮、乙酰丙酮等酮等。
在自由基聚合性树脂组合物中添加聚合引发剂的情况下,相对于自由基聚合性树脂组合物中的自由基聚合性化合物(自由基聚合性树脂与其它自由基聚合性化合物的总重量),聚合引发剂的添加量为0.01~50重量%左右、优选为0.1~20重量%左右。
另外,在不破坏本发明的效果的范围内,还可以根据需要向本发明的自由基聚合性树脂组合物中添加其它添加物。作为其它添加物,可列举例如:固化膨胀性单体、光敏剂(蒽类增敏剂等)、树脂、密合性提高剂、增强剂、软化剂、增塑剂、粘度调节剂、溶剂、无机或有机粒子(纳米级粒子等)、氟代硅烷等公知惯用的各种添加剂。
对于本发明的自由基聚合性树脂组合物,通过进行加热处理和/或光照,可促进自由基聚合反应,进而形成固化物。进行加热处理的情况下,作为其温度,可根据用于反应的成分、催化剂的种类等进行适当调整,例如为20~200℃、优选为50~150℃、进一步优选为70~120℃左右。进行光照的情况下,作为其光源,可使用例如:水银灯、氙气灯、碳弧灯、金属卤化物灯、太阳光、电子束、激光等。另外,也可以在进行光照后于例如50~180℃左右的温度下实施加热处理来进行固化。
自由基聚合反应可以在常压下进行,也可以在减压下或加压下进行。就反应的气体氛围而言,在不对反应造成阻碍的情况下并无特殊限定,可以是例如空气氛围、氮气氛围、氩气氛围等中的任意气体氛围。
作为由本发明的自由基聚合性树脂组合物经自由基聚合而得到的固化物的形状,并无特殊限制,可列举例如膜状、纤维状等。膜状固化物可以如下地制造:例如,使用涂布器等将上述自由基聚合性树脂组合物涂布在基体材料等上,并使其达到均匀的厚度,并通过进行加热处理和/或光照来促进自由基聚合反应。纤维状固化物可以如下地制造:例如,使用注射器等将上述自由基聚合性树脂组合物定量地挤出,并对挤出的自由基聚合性树脂组合物进行加热处理和/或光照,由此来促进自由基聚合反应。
由此得到的固化物具有优异的柔软性及耐热性。因此,本发明的自由基聚合性树脂组合物在波导(光波导、混载基板等)、光纤、应力缓和型粘接剂、密封剂、底部填充剂、喷墨用油墨、滤色器、纳米压印、柔性基板等领域、尤其是柔性光波导、柔软粘接剂、底部填充剂等领域特别有用。
实施例
以下,结合实施例对本发明进行更为详细的说明,但本发明并不限定于这些实施例。
实施例1(自由基聚合性树脂的制造)
向安装有引发剂滴加线路、氮气线路、温度计的三颈烧瓶中加入甲苯3.78g、下式表示的3-乙基-3-(3-丙烯酰氧基-2,2-二甲基丙氧基甲基)氧杂环丁烷(EOXTM-NPAL)8.82g(34.67mmol)、4-甲氧基苯酚0.039g的混合液(单体混合液),并将温度调节至25℃。接着,利用送液泵经2小时定量地滴加甲苯0.093g与三氟化硼二乙基醚络合物0.016g(0.11mmol)的混合液。滴加结束后,保持4小时,然后利用5倍量的甲醇(含有0.1%的4-甲氧基苯酚)对该混合液进行沉淀纯化,并在真空干燥机中(40℃、全真空)保持20小时,由此得到了无色透明的液态树脂(1)。
该液态树脂(1)的聚苯乙烯换算重均分子量为24800。
[化学式7]
实施例2(自由基聚合性树脂的制造)
向安装有引发剂滴加线路、氮气线路、温度计的三颈烧瓶中加入甲苯19.98g、EOXTM-NPAL 8.82g(34.67mmol)、3-乙基-3-(2-乙基己氧基甲基)氧杂环丁烷(商品名“OXT-212”、东亚合成(株)制造)23.56g(0.10mol)、4-甲氧基苯酚0.039g的混合液(单体混合液),并将温度调节至25℃。接着,利用送液泵经2小时定量地滴加甲苯5.60g与三氟化硼二乙基醚络合物0.95g(6.60mmol)的混合液。滴加结束后,保持4小时,然后利用5倍量的甲醇(含有0.1%的4-甲氧基苯酚)对该混合液进行沉淀纯化,并在真空干燥机中(40℃、全真空)保持20小时,由此得到了无色透明的液态树脂(2)。
该液态树脂(2)的聚苯乙烯换算重均分子量为8200。
实施例3(自由基聚合性树脂的制造)
向安装有引发剂滴加线路、氮气线路、温度计的三颈烧瓶中加入甲苯20.40g、EOXTM-NPAL 8.82g(34.67mmol)、OXT-212 39.26g(0.17mol)、4-甲氧基苯酚0.039g的混合液(单体混合液),并将温度调节至25℃。接着,利用送液泵经2小时定量地滴加甲苯5.60g与三氟化硼二乙基醚络合物0.95g(6.60mmol)的混合液。滴加结束后,保持4小时,然后利用5倍量的甲醇(含有0.1%的4-甲氧基苯酚)对该混合液进行沉淀纯化,并在真空干燥机中(40℃、全真空)保持20小时,由此得到了无色透明的液态树脂(3)。
该液态树脂(3)的聚苯乙烯换算重均分子量为8300。
实施例4(自由基聚合性树脂的制造)
向安装有引发剂滴加线路、氮气线路、温度计的三颈烧瓶中加入甲苯20.40g、下式表示的3-乙基-3-(4-丙烯酰氧基丁氧基甲基)氧杂环丁烷(EOXTM-BAL)8.33g(34.44mmol)、OXT-212 39.26g(0.17mol)、4-甲氧基苯酚0.039g的混合液(单体混合液),并将温度调节至25℃。接着,利用送液泵经2小时定量地滴加甲苯5.60g与三氟化硼二乙基醚络合物0.95g(6.60mmol)的混合液。滴加结束后,保持4小时,然后利用5倍量的甲醇(含有0.1%的4-甲氧基苯酚)对该混合液进行沉淀纯化,并在真空干燥机中(40℃、全真空)保持20小时,由此得到了无色透明的液态树脂(4)。
该液态树脂(4)的聚苯乙烯换算重均分子量为34800。
[化学式8]
比较例1(自由基聚合性树脂的制造)
向安装有引发剂滴加线路、氮气线路、温度计的三颈烧瓶中加入甲苯3.78g、3-乙基-3-丙烯酰氧基甲基氧杂环丁烷(商品名“OXT-10”、大阪有机化学工业(株)制)5.85g(34.77mmol)、4-甲氧基苯酚0.039g的混合液(单体混合液),并将温度调节至25℃。接着,利用送液泵经2小时定量地滴加甲苯0.093g与三氟化硼二乙基醚络合物0.016g(0.11mmol)的混合液。滴加结束后,保持4小时,然后利用5倍量的甲醇(含有0.1%的4-甲氧基苯酚)对该混合液进行沉淀纯化,并在真空干燥机中(40℃、全真空)保持20小时,由此得到了无色透明的液态树脂(5)。
该液态树脂(5)的聚苯乙烯换算重均分子量为11900。
实施例5~50、比较例2~4
按照下述表1~3所示的组成及配合比例进行配合,得到了自由基聚合性树脂组合物。需要说明的是,表中的数值代表重量份。
评价
对于实施例5~50及比较例2~4中得到的自由基聚合性树脂组合物,利用下述方法聚合得到固化物,并针对所得固化物进行了柔软性及耐热性的评价。
[膜状固化物的形成(1)]
将上述实施例5~27及比较例2~4中得到的自由基聚合性树脂组合物涂布在非有机硅类脱模型膜基体材料(商品名“T789”、Daicel Value Coating(株)制造)上,然后,放入隔垫使得厚度约达到100μm,利用另一片非有机硅类脱模型膜基体材料(商品名“T789”、Daicel Value Coating(株)制造)进行压合,并于85℃下实施1小时加热处理,得到了厚度约为100μm的膜状固化物。
[膜状固化物的形成(2)]
将上述实施例28~50中得到的自由基聚合性树脂组合物涂布在非有机硅类脱模型膜(“T789”、Daicel Value Coating(株)制造)基体材料上,使其厚度约为100μm,然后,放入隔垫使得厚度约达到100μm,利用另一片非有机硅类脱模型膜基体材料(商品名“T789”、Daicel Value Coating(株)制造)进行压合,并使用传送带式紫外线照射装置(商品名“UVC-02516S1AA02”、USHIO电机(株)制造)照射紫外线(照射能:约2J、波长:320-390nm),由此得到了厚度约为100μm的膜状固化物。
[纤维状固化物的形成]
将上述实施例28~50中得到的自由基聚合性树脂组合物注入注射器并定量地(3mL/秒)挤出,对挤出的自由基聚合性树脂组合物照射紫外线(照射能:每个方向为1.5W/cm2、波长:365nm),由此得到了直径为50~2000μm的纤维状固化物。
[柔软性评价]
将由上述实施例5~50及比较例2~4中得到的自由基聚合性树脂组合物经固化而得到的厚度约为100μm的膜状固化物卷绕在棒上,肉眼观察是否有裂纹(裂痕)产生,并按照下述标准进行了评价。
评价标准
卷绕在半径为1mm的棒上后未观察到裂纹(裂痕)时:◎
卷绕在半径为2mm的棒上后未观察到裂纹(裂痕)时:○
卷绕在半径为2mm的棒上后观察到裂纹(裂痕)时:×
[耐热性评价]
对于由上述实施例5~50及比较例2~4中得到的自由基聚合性树脂组合物经固化而得到的厚度约为100μm的膜状固化物,利用热分析装置(商品名“TG-DTA6300”、精工电子工业(株)制造)进行了热重分析。如图1所示,将初期无重量减少或缓慢减少部分的切线与重量发生急剧减少处拐点的切线相交处的温度作为热分解温度T(℃),并按照下述标准进行了评价。
评价标准
热分解温度T(℃)在260℃以上:○
热分解温度T(℃)低于260℃:×
[表1]
[表2]
[表3]
需要说明的是,表中的符号等代表下述化合物。
B1:1,10-双(丙烯酰氧基)癸烷[=1,10-癸二醇二丙烯酸酯](和光纯药工业(株)制造)
B2:丙烯酸十二烷基酯[=丙烯酸月桂酯](和光纯药工业(株)制造)
无机微粒:表面处理二氧化硅(商品名“SC2500-SVJ”、(株)Admatechs制造)
PS:聚苯乙烯
PMMA:聚甲基丙烯酸甲酯
V601:2,2'-偶氮二异丁酸二甲酯(商品名“V601”、和光纯药工业(株)制造)
Claims (8)
2.根据权利要求1所述的自由基聚合性树脂,其中,具有阳离子聚合性的其它化合物是每1分子内仅具有1个选自氧杂环丁烷环、环氧环、乙烯基醚基、乙烯基芳基中的官能团的化合物。
3.自由基聚合性树脂组合物,其包含权利要求1或2所述的自由基聚合性树脂作为自由基聚合性化合物。
4.根据权利要求3所述的自由基聚合性树脂组合物,其还包含权利要求1或2所述的自由基聚合性树脂以外的自由基聚合性化合物。
5.根据权利要求4所述的自由基聚合性树脂组合物,其中,权利要求1或2所述的自由基聚合性树脂以外的自由基聚合性化合物是每1分子内具有1个以上选自(甲基)丙烯酰基、(甲基)丙烯酰氧基、(甲基)丙烯酰氨基、乙烯基芳基、乙烯基醚基、乙烯氧基羰基中的官能团的化合物。
6.固化物,其由权利要求3~5中任一项所述的自由基聚合性树脂组合物经自由基聚合而得到。
7.根据权利要求6所述的固化物,其为膜状。
8.根据权利要求6所述的固化物,其为纤维状。
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105590905A (zh) * | 2014-11-07 | 2016-05-18 | 日东电工株式会社 | 电子器件密封用片和电子器件封装件的制造方法 |
CN107621752A (zh) * | 2016-07-13 | 2018-01-23 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
WO2021159788A1 (zh) * | 2020-02-15 | 2021-08-19 | 苏州星烁纳米科技有限公司 | 一种封装墨水及发光器件 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001106779A (ja) * | 1999-10-08 | 2001-04-17 | Jsr Corp | 含フッ素オキセタン共重合体、その製造方法、その組成物、およびその硬化物 |
JP2003335854A (ja) * | 2002-05-17 | 2003-11-28 | Toagosei Co Ltd | 新規(メタ)アクリレート及びこれを含む硬化性組成物 |
CN102612513A (zh) * | 2009-11-17 | 2012-07-25 | 株式会社大赛璐 | 含有氧杂环丁烷环的(甲基)丙烯酸酯化合物 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69941954D1 (de) * | 1998-07-09 | 2010-03-11 | Jsr Corp | Oxetanderivate, oxetancopolymer, und verfahren zur herstellung von oxetanderivaten |
JP2003045225A (ja) * | 2001-07-26 | 2003-02-14 | Ube Ind Ltd | 高分子電解質及びその製造方法 |
JP4050752B2 (ja) * | 2005-02-24 | 2008-02-20 | 東芝テック株式会社 | インクジェットインク、および印字方法 |
JP4631595B2 (ja) * | 2005-08-17 | 2011-02-16 | Jsr株式会社 | 感光性樹脂組成物、表示パネル用スペーサーおよび表示パネル |
JP2008031248A (ja) * | 2006-07-27 | 2008-02-14 | Daicel Chem Ind Ltd | 硬化性樹脂組成物及び硬化塗膜の形成方法 |
JP5250208B2 (ja) * | 2007-04-03 | 2013-07-31 | 出光興産株式会社 | アダマンタン誘導体、それを用いた樹脂組成物および樹脂硬化物 |
DE102009021913A1 (de) * | 2009-05-19 | 2010-12-02 | Byk-Chemie Gmbh | Terminal ungesättigte, oxetan-basierte Makromonomere und Verfahren zu deren Herstellung |
JP5457078B2 (ja) * | 2009-06-05 | 2014-04-02 | 株式会社ダイセル | カチオン重合性樹脂組成物、及びその硬化物 |
JP2011001422A (ja) * | 2009-06-17 | 2011-01-06 | Asahi Kasei Chemicals Corp | 感光性樹脂組成物、それを用いた感光性インクジェットインク、感光性接着剤、感光性コーティング剤、及び半導体封止材 |
-
2011
- 2011-04-08 WO PCT/JP2011/058876 patent/WO2011129268A1/ja active Application Filing
- 2011-04-08 US US13/641,354 patent/US20130035465A1/en not_active Abandoned
- 2011-04-08 JP JP2012510640A patent/JP5770164B2/ja not_active Expired - Fee Related
- 2011-04-08 CN CN2011800186448A patent/CN102834431A/zh active Pending
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- 2011-04-13 TW TW100112752A patent/TWI507430B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001106779A (ja) * | 1999-10-08 | 2001-04-17 | Jsr Corp | 含フッ素オキセタン共重合体、その製造方法、その組成物、およびその硬化物 |
JP2003335854A (ja) * | 2002-05-17 | 2003-11-28 | Toagosei Co Ltd | 新規(メタ)アクリレート及びこれを含む硬化性組成物 |
CN102612513A (zh) * | 2009-11-17 | 2012-07-25 | 株式会社大赛璐 | 含有氧杂环丁烷环的(甲基)丙烯酸酯化合物 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105590905A (zh) * | 2014-11-07 | 2016-05-18 | 日东电工株式会社 | 电子器件密封用片和电子器件封装件的制造方法 |
CN105590905B (zh) * | 2014-11-07 | 2021-01-15 | 日东电工株式会社 | 电子器件密封用片和电子器件封装件的制造方法 |
CN107621752A (zh) * | 2016-07-13 | 2018-01-23 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
CN107621752B (zh) * | 2016-07-13 | 2019-11-12 | 常州强力先端电子材料有限公司 | 一种混杂型光敏树脂及其制备方法 |
US10642155B2 (en) | 2016-07-13 | 2020-05-05 | Changzhou Tronly Advanced Electronic Materials Co., Ltd. | Mixed-type photosensitive resin and preparation method therefor |
WO2021159788A1 (zh) * | 2020-02-15 | 2021-08-19 | 苏州星烁纳米科技有限公司 | 一种封装墨水及发光器件 |
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TWI507430B (zh) | 2015-11-11 |
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