CN102821570A - Electronic apparatus and housing thereof - Google Patents
Electronic apparatus and housing thereof Download PDFInfo
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- CN102821570A CN102821570A CN2012102688002A CN201210268800A CN102821570A CN 102821570 A CN102821570 A CN 102821570A CN 2012102688002 A CN2012102688002 A CN 2012102688002A CN 201210268800 A CN201210268800 A CN 201210268800A CN 102821570 A CN102821570 A CN 102821570A
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- 239000003822 epoxy resin Substances 0.000 claims description 32
- 229920000647 polyepoxide Polymers 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 18
- 238000003860 storage Methods 0.000 claims description 18
- 239000004744 fabric Substances 0.000 claims description 17
- 239000011521 glass Substances 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 15
- 238000004132 cross linking Methods 0.000 claims description 15
- 238000005266 casting Methods 0.000 claims description 11
- 239000012528 membrane Substances 0.000 claims description 8
- 210000004907 gland Anatomy 0.000 claims description 5
- 230000008054 signal transmission Effects 0.000 claims description 4
- 238000013461 design Methods 0.000 abstract description 8
- 238000005457 optimization Methods 0.000 abstract description 2
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 23
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 23
- 239000000203 mixture Substances 0.000 description 20
- 239000000126 substance Substances 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- 230000008595 infiltration Effects 0.000 description 10
- 238000001764 infiltration Methods 0.000 description 10
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
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- 238000003825 pressing Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
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- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
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- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
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Abstract
The invention provides a housing of an electronic apparatus, comprising a containing slot arranged in the outer side of the housing and an antenna fixed in the containing slot. The invention also provides an electronic apparatus with the housing. The housing of the electronic apparatus solves the problem of external arrangement of the antenna due to the fact that the antenna is embedded; and meanwhile, in the antenna design, electromagnetic interference generated by a circuit board in the electronic apparatus can be ignored, and therefore, the design and the optimization of the antenna are facilitated and the property of the antenna can be favorably improved; the electronic apparatus can hold the original appearance, avoid the external arrangement of the antenna and particularly avoid using the telescopic antenna; meanwhile, the electronic apparatus has the property in transmitting and receiving wireless signals and is capable of performing mobile multimedia broadcast.
Description
Technical field
The invention belongs to the transmission of wireless signals field, be specifically related to a kind of electronic equipment that is built-in with the shell structure of antenna and uses this housing.
Background technology
Development along with wireless communication technique; Wireless telecommunications system has had increasingly high requirement; In order to satisfy the requirement of communication, existing various communication apparatus adopt external antenna basically, greatly the surplus energy of the industrial design of limits product and mechanism design performance; And external antenna also need design impedance matching connector and mechanism's module of adaptation, and these connectors and mechanism's module have almost accounted for the cost of entire antenna more than 90 percent.
Antenna is as the radiating element and the receiving device of final radiofrequency signal, and its operating characteristic will directly influence the service behaviour of whole electronic system.The installation of antenna not only need be considered the shape of antenna itself; The electromagnetic radiation that produces when also needing the more device busy of considering the antenna place; Particularly the high-frequency work of central processing unit has produced electromagnetic radiation, and this can receive and send signal to antenna cause bad influence, even can therefore cause the antenna can't operate as normal; Therefore, the placement of antenna is to need the expensive time to consider and checking in electronic system.
At present, the demand of cell phone TV is increasing with application, and China Mobile multimedia broadcasting (CMMB) is since starting broadcasting, and various product and service are constantly released.In these portable radiovisors, its reception antenna is extension type telescopic antenna (CMMB frequency range 474MHz-794MHz) normally.Reception antenna is extension type telescopic antenna and adjustable CMMB built-in aerial normally.Extension type telescopic antenna normally quarter-wave is about 120～160mm.But the external antenna influence is attractive in appearance, also damages easily.Sixty-four dollar question is not for when telescopic antenna is pulled out, and the mobile phone of this moment can't receive the digital data content that comes out from the CMMB channel radio, causes a large amount of users to fail to receive the information content and misses the real time information broadcast receiving function.Be provided with like this and can take bigger space, also can have influence on the aesthetics of electronic equipment, therefore, need a kind of electronic equipment of design, can be with the built-in requirement of satisfying its communication simultaneously of antenna.
Summary of the invention
In order to solve the problem that exists in the existing antenna; The invention provides a kind of housing and use the electronic equipment of this housing; Realize antenna built-in in electronic equipment through in housing, placing antenna; And then realize the transmitting-receiving of electronic equipment to wireless signal, to achieve these goals, the present invention adopts following technical scheme:
A kind of casting of electronic device, said housing comprises: storage tank is arranged at said hull outside face; Antenna is fixed in the said storage tank.
Further, the bottom of said storage tank is provided with the line hole, the transmission point signal of the corresponding said antenna in said line hole.
Further, said transmission point signal comprises distributing point and earth point.
Further, said housing is back of the body lid, frame or the face frame of electronic equipment.
Further, said antenna comprise a medium substrate, attached to radiating element, ground unit, distributing point and the earth point on said medium substrate surface; Said radiating element in the form of sheets, for attached to sheet metal on the said medium substrate or metal tape, the electromagnetic frequency range of the response of said antenna is 474MHz-794MHz.
Further, fit in the inner surface of said antenna and the bottom surface of said storage tank, and the outer surface of said antenna and said housing outer surface link into an integrated entity.
Further, said antenna outer surface is provided with a membrane structure, and the outer surface of said membrane structure and said housing outer surface link into an integrated entity.
Further, the component of said housing comprises glass cloth, epoxy resin and comprises the compound with said epoxy resin generation cross-linking reaction.
A kind of electronic equipment comprises housing, places the circuit board in the said housing, and said housing comprises: storage tank is arranged at said hull outside face; Antenna is fixed in the said storage tank.
Further, said housing is back of the body lid, frame or the face frame of electronic equipment.
Further, the bottom of said storage tank is provided with the line hole, the transmission point signal of the corresponding said antenna in said line hole.
Further, said circuit board is electrically connected through contact, contact mode with the transmission point signal of said antenna.
Further, said circuit board is equipped with the contact of passing said line hole, the corresponding and electrical connection of contact that said contact and said transmission point signal form.
Further, said transmission point signal protrudes said line hole and forms the contact, is electrically connected with signal contacts on the said circuit board.
Further, the transmission point signal of said antenna is electrically connected with said circuit board signal contact through signal transmssion line.
Further, said signal transmssion line passes said gland or said gland and said housing joint and the electrical connection of said circuit board signal transmission contact.
Further, said electronic equipment comprises mobile phone, portable computer, panel computer, PDA, electric paper book and digital photo frame.
Casting of electronic device of the present invention is wherein built-in with antenna, has solved the external problem of antenna, when Antenna Design, can ignore the electromagnetic interference that circuit board produces in the electronic equipment simultaneously, has made things convenient for the design and optimization of antenna, is beneficial to the performance that improves antenna; Electronic equipment can keep original outward appearance, has avoided the external of antenna, has particularly avoided the use of telescopic antenna, and electronic equipment has the ability of transmitting/receiving wireless signal simultaneously, can carry out CMMB.
Description of drawings
Fig. 1 is an electronic devices structure sketch map of the present invention;
Fig. 2 is the exploded view of electronic equipment shown in Figure 1;
Fig. 3 is the structural representation of a kind of execution mode of antenna of electronic equipment use shown in Figure 1;
Fig. 4 is the structural representation of the another kind of execution mode of antenna of electronic equipment use shown in Figure 1.
Embodiment
Now in detail with reference to the embodiment that describes in the accompanying drawing.For complete understanding the present invention, numerous details in following detailed description, have been mentioned.But it should be appreciated by those skilled in the art that the present invention can need not these details and realize.In its execution mode, be not described in detail known method, process, assembly and circuit, in order to avoid unnecessarily make embodiment fuzzy.
Referring to shown in Figure 1 be the structural representation of a kind of execution mode of electronic equipment; Electronic equipment is a kind of mobile phone in this execution mode; This electronic equipment comprises circuit board (not shown), housing (not marking among the figure), camera 8 and display screen 9; Its middle shell comprises that face frame 1, frame 2 and the back of the body cover (not shown), and face frame and frame or frame can be integrated with back of the body lid in other embodiments, can comprise display screen for some electronic equipment; Some electronic equipment is that audio plays just can not have display screen, uses that perhaps less display screen shows date etc.
Referring to shown in Figure 2 for electronic equipment shown in Figure 1 be a kind of decomposition texture sketch map of mobile phone; This electronic equipment 10 comprises circuit board (not shown), housing (not marking among the figure), battery 5, camera 8 and display screen 9, and housing comprises that face frame 1, frame 2 and the back of the body cover 3, in the present embodiment; Antenna is arranged at the back of the body and covers in 3; This back of the body lid 3 comprises storage tank 31, antenna 32, and storage tank 31 is arranged on the back of the body and covers 3 lateral surface, and antenna 32 fixed placement are in storage tank 31; The outer surface of antenna 32 covers 3 outer surface with the back of the body and links into an integrated entity, i.e. coplane.One membrane structure can also be set at the outer surface of medium substrate, and the outer surface of membrane structure links into an integrated entity with back of the body exterior surface.
Comprise medium substrate on the antenna 32 and attached to radiating element, ground unit, distributing point and the earth point (all not shown among the figure) on medium substrate surface; Radiating element, ground unit, distributing point and earth point are installed the back between medium substrate and storage tank bottom land at antenna; Distributing point and earth point close together when being provided with cover and is provided with line hole 311 on 31 at the back of the body, the position correspondence distributing point and the earth point in this line hole 311; On circuit board, be provided with signal contacts 41; Distributing point and earth point form the contact that protrudes from the line hole and are electrically connected with signal contacts 41, and wherein, signal contacts 41 corresponding distributing points and earth point are provided with two.
Antenna and circuit board have multiple about the signal transmission manner, in other execution mode, the equal nose line of the distributing point of antenna and earth point hole forms two contacts, are electrically connected with signal contacts corresponding on the circuit board, to carry out the transmission of signal; Also can use signal transmssion line to connect antenna and circuit board, signal transmssion line passes the preset hole on the gland.
In other embodiments, radiating element, ground unit, distributing point and earth point are positioned at the medium substrate outer surface after antenna is installed.In order to prevent the wearing and tearing of radiating element, ground unit, distributing point and earth point, at the outer surface of antenna one membrane structure is set, the outer surface of membrane structure links into an integrated entity with back of the body exterior surface, can play the effect of protection like this.When antenna was connected with circuit board, corresponding distributing point and earth point were provided with a through hole or plated-through hole on medium substrate, and the connecting circuit plate gets final product again.
About the electric connection mode of contact, contact, for the formedness and the stability that contact, contact or contact can adopt elastic, for example spring or shell fragment etc.
Electronic equipment includes, but are not limited to mobile phone, portable computer, panel computer, PDA, electric paper book and digital photo frame, and the antenna frequency range includes but not limited to 2.4GHz, 5.8GHz, 470-494MHz, 900MHz, 1.8GHz in its housing.
Execution mode about casting of electronic device among the present invention has been made statement in above-mentioned electronic equipment execution mode, contained the execution mode of its housing in the execution mode of electronic equipment, therefore, does not narrate as independent embodiment.
Be illustrated in figure 3 as a kind of execution mode of the antenna that electronic equipment among the present invention uses, this antenna 32 comprises medium substrate 321 and attached to the radiating element on the medium substrate 321 322, ground unit 323, distributing point 324 and earth point 325, wherein; Radiating element 322 is the circuitous metal tape of bending; In the present embodiment, this metal tape is through 16 bendings, in bending is circuitous; The width and the spacing of metal tape remain unchanged respectively; Ground unit 323 is rectangular-shaped sheet metal, the setting relative with radiating element 322, and distributing point 324 is arranged on the initiating terminal of the metal tape that forms radiating element 322; Earth point 325 is arranged on the ground unit 323, and is relative with the position of distributing point 324.
Radiating element and ground unit all are that metal material is processed; Can select gold, silver, copper, aluminium etc. for use; Consider that from economy and effect can preferentially select for use copper as raw material preparing, radiating element and ground unit be attached to the Copper Foil with definite shape on the medium substrate.
The spacing that the width of metal tape and metal tape are adjacent equates that respectively adjacent spacing is the spacing that metal tape once bends this part formation in making a circulation, and the width of metal tape is about 2-5 times of this spacing, is preferably 3 times, 4 times.
First kind execution mode is following:
In such execution mode, be used for the infiltration solution of some low dielectric constant and low loss of production and processing the present invention's medium substrate.Said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.Wherein first component and second component dispose mixing according to a certain percentage.Above-mentioned first component, second component and said one or more solvents are made into said infiltration solution.Said infiltration solution is through stirring the back, will a said glass cloth soaking into first component and second component are adsorbed in the glass cloth perhaps on the surface; Baking is copied said glass cloth and is made said one or more solvent evaporates then, and makes first component and the mutual chemical combination of second component be cross-linked to form semi-solid preparation thing or solidfied material.The semi-solid preparation thing is meant to be copied the glass cloth of absorption first component and second component in the relatively low environment of temperature in baking, and first component comprises the soft mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Solidfied material be meant with the glass cloth of absorption first component and second component baking copy temperature relatively than high ambient in, first component comprises the relative harder mixture that the chemical combination cross-linking reaction partly takes place for epoxy resin and the second component inclusion compound.Wherein said semi-solid preparation or solidfied material are worked under the 1GHz frequency, have≤4.0 nominal dielectric constant and≤0.01 electrical loss tangent amount.
In this execution mode; The glass cloth of said infiltration forms semi-solid preparation thing (in the form of sheets) through low-temperature bake; Said then semi-solid preparation thing is cut into cuts out sheet, and it is superimposed and be hot pressed into this and implement described multilayer dielectricity substrate (being multilayer layer pressing plate or sheet) according to the thickness needs said multi-disc to be cut out sheet.Wherein the hot pressing process purpose makes the component of winning comprise epoxy resin and the chemical combination cross-linking reaction all takes place the second component inclusion compound exactly.
Can certainly understand, the glass cloth of said infiltration directly forms solidfied material, single-layer medium substrate promptly of the present invention (being individual layer laminated sheet or sheet) through high-temperature baking.
In concrete embodiment, the compound of said second component can be selected the copolymer that comprises by polarity macromolecule and non-polar high polymer chemical combination for use, like styrene maleic anhydride copolymer.It is understandable that, can all can be used for the prescription composition of this execution mode with the copolymer of epoxy resin generation chemical combination cross-linking reaction.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6,8 styrene or any number in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, said epoxy resin and styrene maleic anhydride copolymer are prepared according to the ratio of sense value, add the certain amount of solvent wiring solution-forming then.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process; Like common agitator and agitated reactor epoxy resin is evenly mixed with styrene maleic anhydride copolymer, thus make in the said solution epoxy resin with promptly be infiltration solution according to the invention after styrene maleic anhydride copolymer evenly mixes.
In concrete embodiment; Impel above-mentioned infiltration solution 200-400 gel in second (selecting 171 ℃ of gel ambient temperatures for use) through adding certain promoter, promote wherein about the above-mentioned 260 seconds infiltration solution gelatinizing time that (like 258-260 second or 250-270 second etc.) effect is better.Said promoter can be selected for use and included but not limited to tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, mix the mixed solvent that forms in dinethylformamide, EGME, the toluene between any one or the above-mentioned two or more solvent.
In another embodiment, said infiltration solution comprises: first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction; And one or more solvents.The mixture that the compound of said second component selects for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.Wherein said cyanate performed polymer concentration 75%.Promoter is selected methylimidazole for use; Said solvent is selected butanone for use.This execution mode soaks into solution specifically fills a prescription like following table:
In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, the chemical combination cross-linking reaction all can take place with epoxy resin in both.
Second type of execution mode is following:
In second type of execution mode of the present invention; The composition (also can be referred to as compound or composite material) of some low dielectric constant and low loss of the medium substrate among production the present invention (comprising single or multiple lift lamination plate, copper-clad base plate, pcb board, chip carrier spare or similar application part etc.); Said composition comprises glass cloth, first component and second component, and first component comprises epoxy resin; Second component comprises the compound with said epoxy resin generation cross-linking reaction.Wherein said composition is worked under the 1GHz frequency, has≤4.0 nominal dielectric constant and≤0.01 electrical loss tangent amount.Wherein in this execution mode, said composition is worked under the 1GHz frequency, has≤0.005 electrical loss tangent amount.
Said composition fabrication processes also comprises following technology:
At first, second component is comprised the compound and the said epoxy resin that crosslinked reaction take place with said epoxy resin prepare, add the certain amount of solvent wiring solution-forming then according to the ratio of sense value.In concrete embodiment, said compound comprises the copolymer of polarity macromolecule and non-polar high polymer chemical combination, and wherein the copolymer of preferred embodiment can be selected styrene maleic anhydride copolymer for use.Said epoxy resin and styrene maleic anhydride copolymer hybrid technique adopt conventional equipment to process, and like common agitator and agitated reactor epoxy resin are evenly mixed with styrene maleic anhydride copolymer.The styrene maleic anhydride copolymer of this execution mode wherein, its molecular formula is following:
In above-mentioned styrene maleic anhydride copolymer molecular formula, comprise 4 styrene.In other embodiments, can select corresponding molecular weight, as comprising 6 or 8 styrene in the styrene maleic anhydride copolymer molecular formula.Epoxy resin is the organic high molecular compound that contains two or more epoxide groups in the general reference molecule.
In other embodiment, the mixture that the compound of said second component can also be selected the cyanate performed polymer for use or select for use styrene maleic anhydride copolymer and cyanate performed polymer to mix according to arbitrary proportion.
In concrete embodiment, make epoxy resin and styrene maleic anhydride copolymer in the said solution can carry out the chemical combination cross-linking reaction under certain condition, take place to depend on said glass cloth after the chemical combination cross-linking reaction, thereby form medium substrate of the present invention.
Said one or more solvents can be selected for use and include but not limited to acetone, butanone, N, in dinethylformamide, EGME, the toluene any one or above-mentioned between mixed solvent.
Said various component ratios of solution one specific embodiment such as following table:
Above-mentioned solution formula comprises epoxy resin, styrene maleic anhydride copolymer, cyanate performed polymer, promoter methylimidazole and a kind of solvent butanone.In above-mentioned prescription, added styrene maleic anhydride copolymer and cyanate performed polymer simultaneously, both are all crosslinked with epoxy resin ability chemical combination.
Then, from above-mentioned solution, extract said a small amount of test sample book,, regulate said solution at this fixed temperature environment gel time through adding promoter in a certain specified temp environmental testing said solution gelatinizing time.Can impel above-mentioned solution in 200-400 gel in time second through adding one or more promoter; Wherein said a certain specified temp environment is a single temperature value or a selected specific range of temperatures; At this execution mode; Carry out gel time through being set in 171 degrees centigrade of environment, make above-mentioned solution preferable in gel time about 260 seconds (like 258-260 second or 250-270 second etc.) effect.Said promoter can be selected for use and included but not limited to select for use tertiary amines, any one type or mixture between them in imidazoles and the boron trifluoride mono aminoethane.
The 3rd step is when above-mentioned test sample book during gel, is soaked into the back with glass cloth and taken out oven dry in 200-400 time range second, the formation composition in said solution.In these concrete steps; Glass cloth immersed fully to soak in the solution guarantee that said epoxy resin and styrene maleic anhydride copolymer are adsorbed in the glass cloth perhaps on the surface; The glass cloth that immerses solution then is through hanging on air dry oven 180 ℃ of bakings about 5 minutes; Purpose is fully volatilized the solvent butanone exactly, and makes said epoxy resin and styrene maleic anhydride copolymer chemical combination cross-linking reaction, and the product of glass cloth and said chemical combination cross-linking reaction makes the semi-solid preparation composition.It is understandable that, prolong stoving time with or improve baking temperature, can form hardening composition.General a large amount of commercial production adopts in the vertical gluing machine and accomplishes in the impregnation subsystem and baking oven subsystem.
At last, change composition and the conductive foil with oven dry carries out pressing.In these concrete steps, with change composition (prepreg or prepreg) and conductive foil pressing in the vacuum hotpressing machine of oven dry.Said conductive foil is selected for use and is comprised the electric conducting material that copper, silver, gold, aluminium or above-mentioned material alloy material etc. make.Because the price of copper product is relatively low, the conductive foil of therefore selecting for use copper to become is suitable for industrialization.
In order to be suitable for antenna system or some performance parameter requirements of electronic equipment, multi-disc prepreg or prepreg are carried out lamination formation multilayer layer pressing plate simultaneously.Use these laminated sheets and can effectively reduce the antenna recombination loss, and then guarantee the aerial radiation yield value.
Utilize above-mentioned composition, single-layer sheet prepreg or prepreg, multilayer layer pressing plate to be processed into antenna substrate; Form through introducing polarity and non-polar high polymer copolymer reduces the dielectric constant and the dielectric loss of antenna substrate, thereby satisfies its demands of applications in electronic equipment.
Be illustrated in figure 4 as the another kind of execution mode of the antenna that electronic equipment uses among the present invention; This antenna 32 comprises medium substrate 321 and is arranged on radiating element 322, ground unit 323, distributing point 324 and the earth point 325 on the medium substrate 321; Radiating element 322 comprises 5 patch antenna elements 3221, is electrically connected in order through connecting portion 3222 between the patch antenna element 3221, wherein; 5 patch antenna elements 3221 are approximate rectangular shape, and equal and opposite in direction; Distributing point 324 is arranged at an end of radiating element 322, links to each other with an end of a junction 3222 at this end of radiating element 322, and distributing point 324 is electrically connected with the other end of this connecting portion 3222; Earth point 325 on ground unit 323, the setting relative with distributing point 324.
The medium substrate of antenna shown in Fig. 4 32 is of a size of 107mm * 60mm; Each patch antenna element is of a size of 24mm * 16mm; The length of connecting portion is 4mm; 5 patch antenna elements link together through 4 connecting portions in order, and 5 patch antenna elements are linear array arranges, and the resonant electromagnetic wave frequency of this antenna is 470MHz-800MHz.
The radiation field of forming some patch antenna elements of radiating element forms the radiating element field, can increase or reduce the quantity of patch antenna element as required, and the size that also can regulate each patch antenna element is to draw the radiation pattern that needs.
Combine accompanying drawing that preferred embodiment of the present invention is described above; But the present invention is not limited to above-mentioned embodiment, and above-mentioned embodiment only is schematically, rather than restrictive; Those of ordinary skill in the art is under enlightenment of the present invention; Not breaking away under the scope situation that aim of the present invention and claim protect, also can make a lot of forms, these all belong within the protection of the present invention.
Claims (17)
1. a casting of electronic device is characterized in that, said housing comprises:
Storage tank is arranged at said hull outside face;
Antenna is fixed in the said storage tank.
2. casting of electronic device according to claim 1 is characterized in that the bottom of said storage tank is provided with the line hole, the transmission point signal of the corresponding said antenna in said line hole.
3. casting of electronic device according to claim 2 is characterized in that said transmission point signal comprises distributing point and earth point.
4. casting of electronic device according to claim 1 is characterized in that, said housing is back of the body lid, frame or the face frame of electronic equipment.
5. casting of electronic device according to claim 1 is characterized in that, said antenna comprises a medium substrate, attached to radiating element, ground unit, distributing point and the earth point on said medium substrate surface.
6. casting of electronic device according to claim 5 is characterized in that, fits in the inner surface of said antenna and the bottom surface of said storage tank, and the outer surface of said antenna and said housing outer surface link into an integrated entity.
7. casting of electronic device according to claim 6 is characterized in that, said antenna outer surface is provided with a membrane structure, and the outer surface of said membrane structure and said housing outer surface link into an integrated entity.
8. according to each described casting of electronic device of claim 1-7, it is characterized in that the component of said housing comprises glass cloth, epoxy resin and comprises the compound with said epoxy resin generation cross-linking reaction.
9. an electronic equipment comprises housing, places the circuit board in the said housing, and it is characterized in that said housing comprises: storage tank is arranged at said hull outside face; Antenna is fixed in the said storage tank.
10. electronic equipment according to claim 9 is characterized in that, said housing is back of the body lid, frame or the face frame of electronic equipment.
11. electronic equipment according to claim 10 is characterized in that, the bottom of said storage tank is provided with the line hole, the transmission point signal of the corresponding said antenna in said line hole.
12., it is characterized in that said circuit board is electrically connected through contact, contact mode with the transmission point signal of said antenna according to claim 10 or 11 described electronic equipments.
13. electronic equipment according to claim 12 is characterized in that, said circuit board is equipped with the contact of passing said line hole, the corresponding and electrical connection of contact that said contact and said transmission point signal form.
14. electronic equipment according to claim 12 is characterized in that, said transmission point signal protrudes said line hole and forms the contact, is electrically connected with signal contacts on the said circuit board.
15., it is characterized in that the transmission point signal of said antenna is electrically connected with said circuit board signal contact through signal transmssion line according to claim 9 or 10 described electronic equipments.
16. electronic equipment according to claim 12 is characterized in that, said signal transmssion line passes said gland or said gland and said housing joint and the electrical connection of said circuit board signal transmission contact.
17. electronic equipment according to claim 7 is characterized in that, said electronic equipment comprises mobile phone, portable computer, panel computer, PDA, electric paper book and digital photo frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102688002A CN102821570A (en) | 2012-07-31 | 2012-07-31 | Electronic apparatus and housing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102688002A CN102821570A (en) | 2012-07-31 | 2012-07-31 | Electronic apparatus and housing thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102821570A true CN102821570A (en) | 2012-12-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102688002A Pending CN102821570A (en) | 2012-07-31 | 2012-07-31 | Electronic apparatus and housing thereof |
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| Country | Link |
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| CN (1) | CN102821570A (en) |
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| WO2015154500A1 (en) * | 2014-09-03 | 2015-10-15 | 中兴通讯股份有限公司 | Antenna of data card, and data card |
| WO2016155275A1 (en) * | 2015-04-03 | 2016-10-06 | 京东方科技集团股份有限公司 | Mobile display terminal |
| CN106129620A (en) * | 2015-05-08 | 2016-11-16 | 深圳富泰宏精密工业有限公司 | Housing, the electronic installation applying this housing and preparation method thereof |
| CN106550177A (en) * | 2016-09-06 | 2017-03-29 | 华为机器有限公司 | A kind of camera and its manufacturing method and terminal |
| CN107204507A (en) * | 2017-05-24 | 2017-09-26 | 宇龙计算机通信科技(深圳)有限公司 | Antenna system and apply its electronic installation |
| CN107871929A (en) * | 2016-09-26 | 2018-04-03 | 陶格拉斯集团控股有限公司 | Patch Antenna Construction |
| CN109066068A (en) * | 2018-07-24 | 2018-12-21 | Oppo广东移动通信有限公司 | Antenna components and electronics |
| CN111541026A (en) * | 2020-04-22 | 2020-08-14 | 上海安费诺永亿通讯电子有限公司 | Ultra-wideband antenna and electronic equipment shell and electronic equipment integrating ultra-wideband antenna |
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Owner name: SHENZHEN GUANGQI INTELLIGENT PHOTONICS TECHNOLOGY Free format text: FORMER OWNER: SHENZHEN KUANG-CHI INNOVATION TECHNOLOGY CO., LTD. Effective date: 20150819 |
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Effective date of registration: 20150819 Address after: 518000 Guangdong city of Shenzhen province Futian District Shennan Road and CaiTian Road intersection East Xintiandi Plaza C block 2007-27 Applicant after: Shenzhen Guang Qi intelligent photonic Technology Co., Ltd. Address before: 518034 A international business center, No. 1061, Xiang Mei Road, Guangdong, Shenzhen, Futian District, China 18B Applicant before: Shenzhen Kuang-Chi Innovation Technology Co., Ltd. |
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Application publication date: 20121212 |